JP4822820B2 - Semiconductor element storage package and semiconductor device - Google Patents

Semiconductor element storage package and semiconductor device Download PDF

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JP4822820B2
JP4822820B2 JP2005343619A JP2005343619A JP4822820B2 JP 4822820 B2 JP4822820 B2 JP 4822820B2 JP 2005343619 A JP2005343619 A JP 2005343619A JP 2005343619 A JP2005343619 A JP 2005343619A JP 4822820 B2 JP4822820 B2 JP 4822820B2
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semiconductor element
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package
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JP2007150043A (en
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剛史 小川
信幸 田中
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Description

本発明は、半導体素子を収納する半導体素子収納用パッケージおよび半導体装置に関する。   The present invention relates to a semiconductor element housing package and a semiconductor device for housing semiconductor elements.

従来の半導体素子収納用パッケージ（以下、単にパッケージともいう）および半導体装置を図４（ａ），図４（ｂ）に示す。図４（ａ）は従来の半導体素子収納用パッケージおよび半導体装置を示す分解平面図、図４（ｂ）は図４（ａ）の半導体素子収納用パッケージおよび半導体装置の断面Ａ−Ａ’における断面図である。なお、図４は光半導体素子を用いた光半導体素子収納用パッケージおよび光半導体装置の例を示す。   A conventional semiconductor element housing package (hereinafter also simply referred to as a package) and a semiconductor device are shown in FIGS. 4 (a) and 4 (b). 4A is an exploded plan view showing a conventional semiconductor element housing package and a semiconductor device, and FIG. 4B is a cross section taken along a section AA ′ of the semiconductor element housing package and the semiconductor device of FIG. FIG. FIG. 4 shows an example of an optical semiconductor element housing package using an optical semiconductor element and an optical semiconductor device.

同図において、２１は上面に光半導体素子２５が載置される載置部２１ａを有する長方形の基体、２２は載置部２１ａを囲繞するように基体２１に接合され、基体２１の長辺側側部に光半導体素子２５と結合される光ファイバ２９を固定する光ファイバ固定部材２８および他の長辺側側部に光半導体素子２５に信号を入出力する入出力端子２３を設けた枠体である。   In the figure, reference numeral 21 denotes a rectangular base body having a mounting portion 21a on which an optical semiconductor element 25 is mounted, and 22 is joined to the base body 21 so as to surround the mounting portion 21a. A frame provided with an optical fiber fixing member 28 for fixing an optical fiber 29 coupled to the optical semiconductor element 25 on the side and an input / output terminal 23 for inputting / outputting a signal to / from the optical semiconductor element 25 on the other long side. It is.

また、２３は入出力端子であり、セラミックスから成りリード端子２７およびリード端子２７と光半導体素子２５との接続用の線路導体２３ａが設けられている。２５は半導体レーザ，フォトダイオード等の光半導体素子、２６は線路導体２３ａと光半導体素子２５の電極とを接続するボンディングワイヤ等の電気的接続手段、２８は円筒状の光ファイバ固定部材である。さらに、３０は光ファイバ１２の端部を挿入固定する貫通孔が形成された環状の光ファイバ支持部材、３１は基体２１の各短辺の中央部に外側に突出するように設けられたネジ止め部、３１ａはネジ止め部３１に形成されたネジ穴等の固定部である。   Reference numeral 23 denotes an input / output terminal, which is made of ceramics, and is provided with a lead terminal 27 and a line conductor 23 a for connecting the lead terminal 27 and the optical semiconductor element 25. Reference numeral 25 denotes an optical semiconductor element such as a semiconductor laser or a photodiode, 26 denotes an electrical connection means such as a bonding wire for connecting the line conductor 23a and the electrode of the optical semiconductor element 25, and 28 denotes a cylindrical optical fiber fixing member. Further, 30 is an annular optical fiber support member in which a through hole for inserting and fixing the end of the optical fiber 12 is formed, and 31 is a screw fixing provided so as to protrude outward at the center of each short side of the base 21 Reference numeral 31 a denotes a fixing part such as a screw hole formed in the screwing part 31.

そして、同図に示す形態のパッケージは、上面に光半導体素子２５が載置される載置部２１ａを有する長方形の基体２１と、基体２１に載置部２１ａを囲繞するように接合された長方形の枠体２２とを具備し、基体２１の両短辺にネジ止め部３１を設けるとともに、枠体２２の一方の長辺側側部に光半導体素子２５と光学的に結合される光ファイバ２９を固定する光ファイバ固定部材２８を、他方の長辺側側部に光半導体素子２５に駆動信号を入力する入出力端子２３をそれぞれ配設して成る。   And the package of the form shown in the figure has a rectangular base 21 having a mounting portion 21a on which the optical semiconductor element 25 is mounted, and a rectangle joined to the base 21 so as to surround the mounting portion 21a. And an optical fiber 29 optically coupled to the optical semiconductor element 25 on one long side of the frame body 22 and provided with screwing portions 31 on both short sides of the base body 21. And an input / output terminal 23 for inputting a drive signal to the optical semiconductor element 25 is disposed on the other long side.

基体２１は、例えば銅（Ｃｕ）−タングステン（Ｗ）等の熱伝導性が良好な材料からなり、光半導体素子２５の接地電極および放熱板となるものである。ネジ止め部３１は、光半導体装置を外部電気回路基板等の外部部材に固定するものであり、その一部には切り欠き，貫通孔，ネジ穴等の固定部３１ａが設けられ、固定部３１ａにネジを挿通してネジ止め部３１を外部部材にネジ止めして、光半導体装置を外部部材に固定する。   The base 21 is made of a material having good thermal conductivity, such as copper (Cu) -tungsten (W), and serves as a ground electrode and a heat radiating plate of the optical semiconductor element 25. The screwing portion 31 fixes the optical semiconductor device to an external member such as an external electric circuit board, and a fixing portion 31a such as a notch, a through hole, and a screw hole is provided in a part thereof, and the fixing portion 31a. The optical semiconductor device is fixed to the external member by inserting a screw into the external member and screwing the screwing portion 31 to the external member.

枠体２２は、鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等の金属からなる平面形状が四角枠状の部材であり、銀（Ａｇ）ロウ等のロウ材を用いて基体２１の上面に固定されている。   The frame body 22 is a member having a square frame shape made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and the base body 21 using a brazing material such as silver (Ag) brazing. It is fixed to the upper surface of the.

そして、載置部２１ａに光半導体素子２５をペルチェ素子等の基台２１ｃを介して載置させて接着固定し、光半導体素子２５の電極を入出力端子２３に形成された線路導体２３ａにボンディングワイヤ等の電気的接続手段２６を用いて接続する。さらに、光ファイバ固定部材２８のパッケージの外側端部に、光ファイバ２９の端部を貫通孔に挿入固定した光ファイバ支持部材３０を接着剤や溶接等により接合することにより、光半導体素子２５との光軸を合致させた状態で光ファイバ２９を光学的に結合させて固定する。   Then, the optical semiconductor element 25 is mounted on the mounting portion 21 a via a base 21 c such as a Peltier element and bonded and fixed, and the electrode of the optical semiconductor element 25 is bonded to the line conductor 23 a formed on the input / output terminal 23. The electrical connection means 26 such as a wire is used for connection. Further, an optical fiber support member 30 in which the end portion of the optical fiber 29 is inserted and fixed in the through hole is joined to the outer end portion of the package of the optical fiber fixing member 28 by an adhesive, welding, or the like. The optical fiber 29 is optically coupled and fixed in a state where the optical axes of the optical fibers are aligned.

しかる後、枠体２２上に蓋体２４をロウ付け法またはシーム溶接法等の溶接法により接合固定し、固定部３１ａにネジを挿通してネジ止め部３１を外部部材にネジ止めして、光半導体装置を外部部材に固定することにより、内部が気密に封止された光半導体装置が完成する。これにより、電気信号を光信号に変換、または光信号を電気信号に変換するための光半導体装置となる（下記の特許文献１参照）。
特許第３４５７９１６号公報 After that, the lid 24 is joined and fixed on the frame 22 by a welding method such as brazing or seam welding, a screw is inserted into the fixing portion 31a, and the screwing portion 31 is screwed to the external member, By fixing the optical semiconductor device to the external member, an optical semiconductor device whose inside is hermetically sealed is completed. Accordingly, an optical semiconductor device for converting an electrical signal into an optical signal or converting an optical signal into an electrical signal is obtained (see Patent Document 1 below).
Japanese Patent No. 3457916

しかしながら、図４に示した上記従来の構成においては、基体２１が平板状であるため、基体２１に枠体２２との熱膨張差によって反り変形が発生してしまい易かった。基体２１に反り変形が発生することにより、基体２１の下側主面を外部部材に密着させることができなくなり、光半導体素子２５の作動時に発生する熱を外部部材に効率良く熱放散させることができなくなって、光半導体素子２５の作動性が低下するという問題点が発生していた。   However, in the above-described conventional configuration shown in FIG. 4, since the base body 21 has a flat plate shape, the base body 21 is likely to be warped and deformed due to a difference in thermal expansion from the frame body 22. When warping deformation occurs in the base body 21, the lower main surface of the base body 21 cannot be brought into close contact with the external member, and heat generated during the operation of the optical semiconductor element 25 can be efficiently dissipated to the external member. As a result, the problem that the operability of the optical semiconductor element 25 deteriorates occurred.

また、固定部３１ａにネジを挿通してネジ止め部３１を外部部材にネジ止めすることにより、基体２１の反り変形が矯正されることとなるが、その時に発生する歪みにより、入出力端子２３にクラック等の破損が生じてしまう場合があった。その結果、入出力端子２３において気密が破れてパッケージ内部の気密性を保持できなくなるという問題点が発生したり、線路導体２３ａが断線し光半導体素子２５に電気信号を入出力させることができなくなって光半導体素子２５を作動させることができないという問題点が発生していた。   Further, the warping deformation of the base body 21 is corrected by inserting a screw through the fixing portion 31a and screwing the screwing portion 31 to the external member. However, due to the distortion generated at that time, the input / output terminal 23 is corrected. In some cases, damage such as cracks may occur. As a result, there arises a problem that the airtightness of the input / output terminal 23 is broken and the airtightness inside the package cannot be maintained, or the line conductor 23a is disconnected, and the optical semiconductor element 25 cannot input / output an electric signal. As a result, the optical semiconductor element 25 cannot be operated.

光ファイバ２９および光ファイバ支持部材３０が設けられていない半導体素子収納用パッケージにおいても、上記同様の問題点が発生していた。   The same problem as described above also occurs in the package for housing a semiconductor element in which the optical fiber 29 and the optical fiber support member 30 are not provided.

したがって、本発明は上記問題点に鑑み発案されたものであり、その目的は、半導体素子から発生する熱を外部に効率良く熱放散できるとともに、入出力端子の破損を防止でき、半導体素子を長期にわたって正常かつ安定に作動させ得る半導体素子収納用パッケージおよび半導体装置を提供することにある。   Therefore, the present invention has been devised in view of the above problems, and its purpose is to efficiently dissipate the heat generated from the semiconductor element to the outside and prevent damage to the input / output terminals. It is an object of the present invention to provide a semiconductor element housing package and a semiconductor device that can be operated normally and stably.

本発明の半導体素子収納用パッケージは、上側主面に半導体素子の載置部が形成された金属製の基体と、該基体の上側主面に前記載置部を多角形状に取り囲むように設けられ、内外を貫通するように隣接する２つの角部間の下端部が切り欠かれた切り欠き部を有する金属製の枠体と、前記切り欠き部に嵌着され、前記枠体の内外を電気的に導通する線路導体を有する入出力端子と、該入出力端子の直下に前記入出力端子を載置するように設けられた、前記基体の上側主面に突出した凸部とを備え、前記入出力端子と前記凸部の双方ともが前記切り欠き部の前記２つの角部間にわたって嵌着されていることを特徴とする。
The package for housing a semiconductor element of the present invention is provided so that a metal base having a semiconductor element mounting portion formed on the upper main surface and a polygonal shape surrounding the mounting portion on the upper main surface of the base. a metal frame having a cut-out portion lower end which all Ri switching between two corners adjacent to penetrate the inside and outside, is fitted in the notch, the inside and the outside of the frame with input and output terminals having a line conductor for electrically conducting, provided so as to place said input-output terminals directly under the said input and output ends child, and a convex portion protruding into the upper surface of the substrate also it is characterized that you have been fitted over between the two corners of the notch and both the input and output terminals and the protrusion.

また、本発明の半導体素子収納用パッケージにおいて、好ましくは、前記枠体の前記切り欠き部と対向する側面に設けられた前記枠体の内外を貫通する貫通孔とともに、該貫通孔に光ファイバが嵌着される取付部材を設けたことを特徴とする。   In the package for housing a semiconductor element of the present invention, preferably, an optical fiber is provided in the through-hole together with a through-hole penetrating the inside and outside of the frame provided on a side surface facing the notch of the frame. An attachment member to be fitted is provided.

また、本発明の半導体素子収納用パッケージにおいて、好ましくは、前記基体の前記凸部を鋏んだ両側にネジ止め部が設けられていることを特徴とする。   In the package for housing a semiconductor element of the present invention, it is preferable that screwing portions are provided on both sides of the convex portion of the base.

本発明の半導体装置は、上記本発明の半導体素子収納用パッケージと、前記載置部に基台を介して載置され、前記線路導体に電気的に接続された半導体素子と、前記枠体の上面に前記枠体の内側を塞ぐように取着された蓋体とを具備していることを特徴とする。   The semiconductor device of the present invention includes a semiconductor element storage package of the present invention, a semiconductor element mounted on the mounting portion via a base and electrically connected to the line conductor, and the frame body. And a lid attached on the upper surface so as to close the inside of the frame.

また、本発明の半導体装置は、上記本発明の半導体素子収納用パッケージと、前記載置部に基台を介して載置され、発光部または受光部が前記貫通孔に対向するように配置されるとともに前記線路導体に電気的に接続された光半導体素子と、前記光ファイバ取付部材に前記光半導体素子の発光部または受光部と光結合するように取り付けられた光ファイバと、前記枠体の上面に前記枠体の内側を塞ぐように取着された蓋体とを具備していることを特徴とする。   Further, the semiconductor device of the present invention is placed on the semiconductor element housing package of the present invention and the mounting portion via a base, and the light emitting portion or the light receiving portion is disposed so as to face the through hole. An optical semiconductor element electrically connected to the line conductor, an optical fiber attached to the optical fiber attachment member so as to be optically coupled to a light emitting part or a light receiving part of the optical semiconductor element, and the frame body And a lid attached on the upper surface so as to close the inside of the frame.

本発明の半導体素子収納用パッケージは、上側主面に半導体素子の載置部が形成された金属製の基体と、基体の上側主面に載置部を多角形状に取り囲むように設けられ、内外を貫通するように隣接する２つの角部間の下端部が切り欠かれた切り欠き部を有する金属製の枠体と、この切り欠き部に嵌着され、枠体の内外を電気的に導通する線路導体を有する入出力端子と、入出力端子の直下に入出力端子を載置するように設けられた、基体の上側主面に突出した凸部とを備え、入出力端子と凸部の双方ともが切り欠き部の２つの角部間にわたって嵌着されていることから、載置部の上面と凸部の上面との間で段差が生ずる構成となり、枠体を基体に接合させる際に基体に生ずる反り変形が小さくなる。そして、半導体素子収納用パッケージとして完成されても基体が平坦となり、基体の下側主面を外部部材に密着させて、半導体素子の作動時に発生する熱を外部部材に効率良く熱放散させることができる。
For housing a semiconductor element package of the present invention is provided to surround the metal substrate mounting portion of the semiconductor element is formed on an upper major surface, a mounting portion on an upper major surface of the substrate in a polygonal shape, the inner and outer a metal frame having a cut-out portion lower end which all Ri switching between two corners adjacent to penetrate, is fitted to the cutout portion, electrically and out of the frame with input and output terminals with conduction to the line conductor, provided so as to place the input and output terminals directly below the input and output ends child, and a convex portion protruding into the upper surface of the base, input and output terminals and the convex both from Rukoto been fitted over between two corners of even the cut-out of parts, will configure a step between the upper surface of the upper surface and the convex portion of the bearing member occurs, the frame body to the base body The warp deformation that occurs in the substrates during bonding is reduced. And even if it is completed as a package for housing a semiconductor element, the base becomes flat, the lower main surface of the base is brought into close contact with the external member, and the heat generated during operation of the semiconductor element can be efficiently dissipated to the external member. it can.

また、特に凸部においては基体の剛性が増し、凸部の反り変形を極めて小さく抑えることができる。従って、凸部の上面に載置される入出力端子にクラック等の破損が生ずるのを有効に防止することができる。   In particular, the rigidity of the base is increased in the convex portion, and the warp deformation of the convex portion can be suppressed to a very small level. Therefore, it is possible to effectively prevent breakage such as cracks from occurring in the input / output terminals placed on the upper surface of the convex portion.

以上の結果、内部に収納される半導体素子を長期にわたって正常かつ安定に作動させ得る半導体素子収納用パッケージとすることができる。   As a result, it is possible to provide a semiconductor element housing package that can operate the semiconductor elements housed therein normally and stably over a long period of time.

また、本発明の半導体素子収納用パッケージにおいて、好ましくは、枠体の切り欠き部と対向する側面に設けられた枠体の内外を貫通する貫通孔とともに、貫通孔に光ファイバが嵌着される取付部材を設けたことから、光半導体素子を搭載できる半導体素子収納用パッケージとすることができる。   In the package for housing a semiconductor element of the present invention, preferably, an optical fiber is fitted into the through-hole together with a through-hole penetrating the inside and outside of the frame provided on the side surface facing the notch of the frame. Since the attachment member is provided, a semiconductor element storage package in which the optical semiconductor element can be mounted can be obtained.

好ましくは、本発明の半導体素子収納用パッケージにおいて、基体の凸部を挟んだ両側にネジ止め部が設けられていることから、反り変形の小さい凸部の両側にネジ止め部が設けられる構成となり、ネジ止め時に基体に歪みが加わるのを抑制し、入出力端子がクラック等によって破損するのを確実に防止できる。その結果、半導体素子収納用パッケージの気密信頼性をさらに向上させることができるとともに、線路導体の断線を防止することができ、内部に収納される半導体素子の動作信頼性に優れた半導体素子収納用パッケージとすることができる。   Preferably, in the package for housing a semiconductor element of the present invention, since the screwing portions are provided on both sides of the convex portion of the base, the screwing portions are provided on both sides of the convex portion with small warpage deformation. Further, it is possible to suppress distortion of the base body when screwed, and to reliably prevent the input / output terminals from being damaged by cracks or the like. As a result, the airtight reliability of the semiconductor element storage package can be further improved, the line conductor can be prevented from being disconnected, and the semiconductor element stored inside has excellent operational reliability. It can be a package.

本発明の半導体装置は、上記本発明の半導体素子収納用パッケージと、載置部に基台を介して載置され、線路導体に電気的に接続された半導体素子と、枠体の上面に枠体の内側を塞ぐように取着された蓋体とを具備していることから、内部に収容する半導体素子を長期にわたって正常かつ安定に作動させ得る半導体装置となる。   The semiconductor device of the present invention includes a semiconductor element storage package of the present invention, a semiconductor element mounted on a mounting portion via a base, and electrically connected to a line conductor, and a frame on the upper surface of the frame. Since the lid is attached so as to close the inside of the body, the semiconductor device can be operated normally and stably over a long period of time.

また、本発明の半導体装置は、上記本発明の半導体素子収納用パッケージと、載置部に基台を介して載置され、発光部または受光部が貫通孔に対向するように配置されるとともに線路導体に電気的に接続された光半導体素子と、光ファイバ取付部材に光半導体素子の発光部または受光部と光結合するように取り付けられた光ファイバと、枠体の上面に枠体の内側を塞ぐように取着された蓋体とを具備していることから、上記本発明の半導体素子収納用パッケージを用いた、内部に収容する光半導体素子を長期にわたって常に正常かつ安定に作動させ得る半導体装置となる。   The semiconductor device of the present invention is placed on the mounting portion of the semiconductor element storage package of the present invention via a base, and the light emitting portion or the light receiving portion is disposed so as to face the through hole. An optical semiconductor element electrically connected to the line conductor, an optical fiber attached to the optical fiber attachment member so as to be optically coupled to the light emitting part or the light receiving part of the optical semiconductor element, and the inner side of the frame on the upper surface of the frame The optical semiconductor element accommodated in the interior using the semiconductor element accommodation package of the present invention can always be operated normally and stably over a long period of time. It becomes a semiconductor device.

本発明の半導体素子収納用パッケージについて以下に詳細に説明する。図１（ａ）は本発明の第１の実施の形態の半導体素子収納用パッケージおよび半導体装置の一例を示す断面図、図１（ｂ）は図１（ａ）の半導体素子収納用パッケージおよび半導体装置の斜視図、図２は本発明の第１の実施の形態の半導体素子収納用パッケージおよび半導体装置の他の例を示す断面図、図３（ａ）は本発明の第２の実施の形態の半導体素子収納用パッケージおよび半導体装置の一例を示す断面図、図３（ｂ）は図３（ａ）の半導体素子収納用パッケージおよび半導体装置の斜視図である。   The semiconductor element storage package of the present invention will be described in detail below. FIG. 1A is a cross-sectional view showing an example of a semiconductor element storage package and a semiconductor device according to the first embodiment of the present invention, and FIG. 1B is a semiconductor element storage package and a semiconductor of FIG. FIG. 2 is a perspective view of the device, FIG. 2 is a cross-sectional view showing another example of the semiconductor element housing package and the semiconductor device according to the first embodiment of the present invention, and FIG. 3A is the second embodiment of the present invention. FIG. 3B is a perspective view of the semiconductor element storage package and the semiconductor device of FIG. 3A. FIG.

これらの図において、１は基体、２は枠体、３は入出力端子を示し、これら基体１、枠体２および入出力端子３で、内部空間に半導体素子５を収納する半導体素子収納用パッケージが基本的に構成される。   In these drawings, reference numeral 1 denotes a base body, 2 denotes a frame body, 3 denotes an input / output terminal, and the base body 1, the frame body 2 and the input / output terminal 3 store a semiconductor element 5 in an internal space. Is basically constructed.

以下、半導体素子収納用パッケージおよび半導体装置は、内部に半導体レーザ、フォトダイオード、ＬＥＤ、その他、外部と光信号を入出力する光半導体素子を搭載するものを例に説明する。電気信号を処理する半導体素子を搭載する半導体素子収納用パッケージおよび半導体装置に、以下の光ファイバ９やこれに係る光ファイバ取付部材８、貫通孔２ｂが設けられたものである。以下、半導体素子を光半導体素子ともいう。また、半導体素子収納用パッケージを光半導体素子収納用パッケージ、半導体装置を光半導体装置ともいう。   Hereinafter, the semiconductor element storage package and the semiconductor device will be described by taking, as an example, a semiconductor laser, a photodiode, an LED, and other optical semiconductor elements for inputting / outputting optical signals to / from the outside. A semiconductor element housing package and a semiconductor device on which a semiconductor element for processing an electric signal is mounted are provided with the following optical fiber 9, an optical fiber attachment member 8 and a through hole 2b related thereto. Hereinafter, the semiconductor element is also referred to as an optical semiconductor element. Further, the semiconductor element storage package is also referred to as an optical semiconductor element storage package, and the semiconductor device is also referred to as an optical semiconductor device.

枠体２は、四角形状、多角形状等の枠状に形成された金属製の部材から成り、基体１の上側主面に載置部１ａを取り囲むように設けられる。以下、枠体２は、図に示すように四角枠状のものとして説明する。枠体２には、その一側面の下端部が枠体２の内外を貫通するように切り欠かれた切り欠き部２ａが形成される。また、切り欠き部２ａが形成された一側面に対向する他側面であって、この切り欠き部２ａに嵌着される入出力端子３の線路導体３ａの延長方向に一致する場所に、光ファイバ９の取付部材８が嵌着される貫通孔２ｂが形成される。貫通孔２ｂには、その外側面側の周囲または内周面に光ファイバ取付部材８が取り付けられる。光ファイバ取付部材８は、金属製の円筒状ものであり、その外側面から内部に光ファイバ９を挿通させ、光ファイバ９を枠体２の側部に保持固定するためのものである。 Frame 2, a rectangular shape, made of a metallic member formed in a frame shape of a polygonal shape or the like, is provided so as to surround the portion 1a placing on an upper major surface of the substrate 1. Hereinafter, the frame 2 will be described as a rectangular frame as shown in the figure. The frame body 2 is formed with a cutout portion 2 a that is cut out so that the lower end portion of one side surface penetrates the inside and outside of the frame body 2. Further, an optical fiber is provided on the other side opposite to the one side where the notch 2a is formed, at a position that coincides with the extending direction of the line conductor 3a of the input / output terminal 3 fitted into the notch 2a. A through-hole 2b into which the mounting member 8 of 9 is fitted is formed. The optical fiber attachment member 8 is attached to the periphery or the inner peripheral surface of the through hole 2b on the outer surface side. The optical fiber attachment member 8 is a metal cylindrical member, and is for inserting and holding the optical fiber 9 from the outer surface to the inside of the frame body 2.

枠体２は、四角形状、多角形状、円形状等の枠状に形成された金属製の部材から成り、基体１の上側主面に載置部１ａを取り囲むように設けられる。以下、枠体２は、図に示すように四角枠状のものとして説明する。枠体２には、その一側面の下端部が枠体２の内外を貫通するように切り欠かれた切り欠き部２ａが形成される。また、切り欠き部２ａが形成された一側面に対向する他側面であって、この切り欠き部２ａに嵌着される入出力端子３の線路導体３ａの延長方向に一致する場所に、光ファイバ９の取付部材８が嵌着される貫通孔２ｂが形成される。貫通孔２ｂには、その外側面側の周囲または内周面に光ファイバ取付部材８が取り付けられる。光ファイバ取付部材８は、金属製の円筒状ものであり、その外側面から内部に光ファイバ９を挿通させ、光ファイバ９を枠体２の側部に保持固定するためのものである。   The frame body 2 is made of a metal member formed in a frame shape such as a quadrilateral shape, a polygonal shape, or a circular shape, and is provided on the upper main surface of the base 1 so as to surround the mounting portion 1a. Hereinafter, the frame 2 will be described as a rectangular frame as shown in the figure. The frame body 2 is formed with a cutout portion 2 a that is cut out so that the lower end portion of one side surface penetrates the inside and outside of the frame body 2. Further, an optical fiber is provided on the other side opposite to the one side where the notch 2a is formed, at a position that coincides with the extending direction of the line conductor 3a of the input / output terminal 3 fitted into the notch 2a. A through-hole 2b into which the mounting member 8 of 9 is fitted is formed. The optical fiber attachment member 8 is attached to the periphery or the inner peripheral surface of the through hole 2b on the outer surface side. The optical fiber attachment member 8 is a metal cylindrical member, and is for inserting and holding the optical fiber 9 from the outer surface to the inside of the frame body 2.

入出力端子３は、絶縁体から成り、枠体２の内外を電気的に導通する線路導体３ａを有する。そして、入出力端子３と凸部１ｂの少なくとも一部とが枠体２の切り欠き部２ａに嵌着される。入出力端子３は、例えば、図に示すように四角形状の絶縁基板の上に棒状の絶縁基板が接合された側面が凸形状のものである。   The input / output terminal 3 is made of an insulator and has a line conductor 3 a that is electrically connected to the inside and outside of the frame 2. Then, the input / output terminal 3 and at least a part of the convex portion 1 b are fitted into the cutout portion 2 a of the frame body 2. For example, as shown in the figure, the input / output terminal 3 has a convex side surface in which a rod-shaped insulating substrate is bonded on a rectangular insulating substrate.

本発明のパッケージは、図１に示すように上側主面に光半導体素子５の載置部１ａが形成された長方形状の金属製の基体１と、基体１の上側主面に載置部１ａを取り囲むように設けられ、下端部が枠体２の内外を貫通するように切り欠かれた四角枠状の金属製の枠体２と、枠体２の切り欠き部２ａに嵌着され、枠体２の内外を電気的に導通する線路導体３ａを有する絶縁体から成る入出力端子３と、切り欠き部２ａが設けられた側面と対向する側面の上下中間部（入出力端子３の線路導体３ａの線路方向を延長した線が側面と交わる部分）に枠体２の内外を貫通するようにして設けられた光ファイバ取付部材８の取付用の貫通孔２ｂと、貫通孔２ｂの外側面側の周囲または貫通孔２ｂの内面に嵌着されて取り付けられた光ファイバ取付部材８とを具備し、入出力端子３は、その直下に設けられた、基体１の上側主面に突出した凸部１ｂの上面に載置された状態で取着され、入出力端子３と凸部１ｂとの少なくとも一部が切り欠き部２ａに嵌着されて成るものである。   As shown in FIG. 1, the package of the present invention has a rectangular metal base 1 in which a mounting portion 1 a of an optical semiconductor element 5 is formed on the upper main surface, and a mounting portion 1 a on the upper main surface of the base 1. Is attached to a rectangular frame-shaped metal frame 2 that is cut out so as to penetrate the inside and outside of the frame 2 and a notch 2a of the frame 2, An input / output terminal 3 made of an insulator having a line conductor 3a electrically conducting inside and outside of the body 2 and an upper and lower intermediate portion (a line conductor of the input / output terminal 3) facing the side surface provided with the notch 2a. A through hole 2b for mounting the optical fiber mounting member 8 provided so as to penetrate the inside and outside of the frame 2 at a portion where a line extending in the line direction of 3a intersects the side surface), and an outer surface side of the through hole 2b An optical fiber attachment member 8 that is fitted around and attached to the inner surface of the through hole 2b. The input / output terminal 3 is attached in a state of being placed on the upper surface of the convex portion 1b that is provided immediately below and protrudes from the upper main surface of the base 1, and the input / output terminal 3 and the convex portion 1b. And at least a part thereof is fitted into the notch 2a.

本発明のパッケージは、好ましくは、基体１の凸部１ｂを鋏んだ両側または凸部１ｂの延出部にネジ止め部１１が設けられている。   The package of the present invention is preferably provided with screwing portions 11 on both sides of the convex portion 1b of the base 1 or on the extending portion of the convex portion 1b.

なお、凸部１ｂは基体１の一部を厚く加工することによって設けられるか、または、基体１の一部を曲げ加工して設けられるが、ここで、基体１の一部を厚くすることによって設けられる形態を第１の実施の形態とし、基体１の一部を曲げ加工して設けられる形態を第２の実施の形態とする。このようにして、凸部１ｂが設けられることによって、載置部１ａの上面と凸部１ｂの上面との間で段差が生ずる構成となり、枠体２を基体１に接合させる際に基体１に生ずる反り変形が小さくなる。そして、パッケージとして完成されても基体１が反り変形の小さい平坦なものとなり、基体１の下側主面を外部部材に密着させて、光半導体素子５の作動時に発生する熱を外部部材に効率良く熱放散させることができる。   In addition, although the convex part 1b is provided by processing a part of the base | substrate 1 thickly, or it is provided by bending a part of the base | substrate 1, here, by thickening a part of the base | substrate 1 here, it is provided. The form provided is the first embodiment, and the form provided by bending a portion of the substrate 1 is the second embodiment. Thus, by providing the convex portion 1 b, a step is formed between the upper surface of the mounting portion 1 a and the upper surface of the convex portion 1 b, and when the frame body 2 is joined to the base body 1, The warping deformation that occurs is reduced. And even if it is completed as a package, the base body 1 becomes flat with little warping deformation, the lower main surface of the base body 1 is brought into close contact with the external member, and the heat generated during the operation of the optical semiconductor element 5 is efficiently transmitted to the external member. It can dissipate heat well.

また、特に凸部１ｂにおいては基体１の剛性が増し、凸部１ｂの反り変形を極めて小さく抑えることができる。従って、凸部１ｂの上面に載置される入出力端子３にクラック等の破損が生ずるのを有効に防止することができる。   In particular, the rigidity of the base body 1 is increased in the convex portion 1b, and the warp deformation of the convex portion 1b can be suppressed to a very small level. Therefore, it is possible to effectively prevent breakage such as cracks in the input / output terminal 3 placed on the upper surface of the convex portion 1b.

なお、第１の実施の形態において、基体１は、金属板に凸部１ｂとなる金属部材を接合させたものでもよい。また、金属板と凸部１ｂとなる金属部材のそれぞれの材質を、基体１の反り変形が小さくなるような熱膨張係数の異なる組み合わせとすると、これら金属板と凸部１ｂとなる金属部材の熱膨張差によって基体１を平坦に保ちやすくすることができる。   In the first embodiment, the base 1 may be a metal plate joined with a metal member that becomes the convex portion 1b. Further, when the respective materials of the metal plate and the metal member to be the convex portion 1b are combined with different coefficients of thermal expansion so as to reduce the warp deformation of the base 1, the heat of the metal member to be the metal plate and the convex portion 1b is reduced. The base 1 can be easily kept flat by the expansion difference.

本発明のパッケージを構成する基体１は、無酸素Ｃｕ，Ｃｕ−Ｗ，Ｃｕ−Ｍｏ合金などのＣｕ系材料やＦｅ−Ｎｉ−Ｃｏ合金、Ｆｅ−Ｎｉ合金などの金属から成る。特に、基体１の熱伝導性をよくして内部に収容する光半導体素子５から発生した熱を効率よく外部へ放散させるという観点からは、Ｃｕ系材料（Ｃｕ、Ｃｕを主成分とする合金、またはＣｕを含浸した金属材料）が好ましい。   The substrate 1 constituting the package of the present invention is made of a Cu-based material such as oxygen-free Cu, Cu—W, or Cu—Mo alloy, or a metal such as Fe—Ni—Co alloy or Fe—Ni alloy. In particular, from the viewpoint of improving the thermal conductivity of the substrate 1 and efficiently dissipating the heat generated from the optical semiconductor element 5 accommodated inside, a Cu-based material (Cu, an alloy containing Cu as a main component, Or a metal material impregnated with Cu).

このような基体１は、それぞれ金属のインゴットに圧延加工または打ち抜き加工などの従来周知の金属加工法を施すことによって所定形状に製作される。そして、基体１の表面には、酸化腐食の防止および光半導体素子５のロウ付けなどによる載置固定をさらに良好にするために、電解めっき法または無電解めっき法によって厚さ0.5〜９μｍのＮｉ層および厚さ0.5〜５μｍのＡｕ層を被着させておくとよい。   Such a base | substrate 1 is manufactured in a predetermined shape by giving conventionally well-known metal processing methods, such as a rolling process or stamping, to a metal ingot, respectively. Then, on the surface of the substrate 1, in order to further improve the mounting and fixing by prevention of oxidative corrosion and brazing of the optical semiconductor element 5, Ni having a thickness of 0.5 to 9 μm is formed by electrolytic plating or electroless plating. A layer and an Au layer having a thickness of 0.5 to 5 μm are preferably deposited.

また、基体１は入出力端子３の直下において上側主面に突出する凸部１ｂを有しているが、入出力端子３の下面の全面に基体１の凸部１ｂが設けられているのが好ましい。これによって、入出力端子３の下面全面が基体１によって支持され、近時のパッケージの小型化および高周波化によって薄型化する傾向にある入出力端子３を基体１で補強することができる。例えば、枠体２の外側の線路導体３ａをボンディングワイヤ等によって外部電気回路基板等の外部部材の配線導体に接続する際に、入出力端子３の枠体２の外側に位置する部位に外力が加わった場合においても、入出力端子３を破損し難くすることができる。その結果、入出力端子３の線路導体３ａを外部部材の配線導体に接続する際において、入出力端子３が破損することがなくなって、線路導体３ａの電気導通性を維持することができ、光半導体素子５を長期にわたって正常かつ安定に作動させることができる。   In addition, the base 1 has a convex portion 1 b that projects from the upper main surface directly below the input / output terminal 3, but the convex portion 1 b of the base 1 is provided on the entire lower surface of the input / output terminal 3. preferable. As a result, the entire lower surface of the input / output terminal 3 is supported by the base 1, and the base 1 can reinforce the input / output terminal 3 that tends to become thinner due to the recent downsizing and higher frequency of the package. For example, when the line conductor 3a outside the frame 2 is connected to a wiring conductor of an external member such as an external electric circuit board by a bonding wire or the like, an external force is applied to a portion located outside the frame 2 of the input / output terminal 3 Even when added, the input / output terminal 3 can be made difficult to break. As a result, when the line conductor 3a of the input / output terminal 3 is connected to the wiring conductor of the external member, the input / output terminal 3 is not damaged, and the electrical conductivity of the line conductor 3a can be maintained. The semiconductor element 5 can be operated normally and stably over a long period of time.

また、これによって、入出力端子３の下面が全面にわたってロウ付け用に形成されたメタライズ層および金属から成る基体１で覆われるので、基体１が線路導体３ａの全長にわたって接地導体として機能するようになる。その結果、線路導体３ａを伝送する電気信号が高周波信号である場合に、線路導体３ａおよび基体１をマイクロストリップ線路またはストリップ線路として動作させ、反射損失や透過損失等の伝送損失が少ない信号線路とすることができる。   This also covers the entire bottom surface of the input / output terminal 3 with the metallized layer formed for brazing and the base 1 made of metal, so that the base 1 functions as a ground conductor over the entire length of the line conductor 3a. Become. As a result, when the electrical signal transmitted through the line conductor 3a is a high-frequency signal, the line conductor 3a and the base 1 are operated as a microstrip line or a strip line, and a signal line with less transmission loss such as reflection loss and transmission loss is obtained. can do.

基体１の上側主面にはＦｅ−Ｎｉ−Ｃｏ合金等から成る金属で形成された枠体２が載置部１ａを囲繞するように設置され、ＡｇロウまたはＡｇ−Ｃｕロウ等のロウ材または樹脂接着剤等によって接合固定される。   A frame 2 made of a metal made of Fe-Ni-Co alloy or the like is placed on the upper main surface of the base 1 so as to surround the mounting portion 1a, and a brazing material such as Ag brazing or Ag-Cu brazing or Bonded and fixed with a resin adhesive or the like.

枠体２には、枠体２の一部が切り欠かれて成る入出力端子３と凸部１ｂの切り欠き部２ａが形成されている。例えば、切り欠き部２ａは枠体２を成す側壁の一辺に設けられたり、隣接する２つの角部間が切り欠かれ、すなわち３辺に亘って切り欠かれることで設けられたりする。好ましくは、切り欠き部２ａのうち凸部１ｂに接合される部位は、枠体２の隣接する２つの角部間が切り欠かれた切り欠き部２ａとされているのがよく、これにより、凸部１ｂを基体１の隣接する２つの角部間（基体１の対向する辺の間）にわたって設けることができ、基体１の枠体２との熱膨張差によって生ずる変形を十分抑制することができる。さらに好ましくは、切り欠き部２ａの凸部１ｂおよび入出力端子３に接合される部位の双方ともに、枠体２の隣接する２つの角部間が切り欠かれた切り欠き部２ａとされているのがよく、これにより、凸部１ｂを基体１の隣接する２つの角部間（基体１の対向する辺の間）にわたって設けることができ、基体１の枠体２との熱膨張差によって生ずる変形を抑制することができるとともに、入出力端子３を枠体２の隣接する２つの角部間にわたって、枠体２の幅と同じ長さで最大限長く設けることができ、入出力端子３に設けられる線路導体３ａの本数を最大限多く設けることが可能となる。   The frame body 2 is formed with an input / output terminal 3 in which a part of the frame body 2 is cut out and a cutout portion 2a of the convex portion 1b. For example, the notch 2a is provided on one side of the side wall of the frame 2, or is provided by notching between two adjacent corners, that is, notching over three sides. Preferably, the part joined to the convex part 1b in the notch part 2a is preferably a notch part 2a in which a portion between two adjacent corners of the frame body 2 is notched. The convex portion 1b can be provided between two adjacent corners of the base body 1 (between opposite sides of the base body 1), and the deformation caused by the difference in thermal expansion between the base body 1 and the frame 2 can be sufficiently suppressed. it can. More preferably, both the convex portion 1b of the cutout portion 2a and the portion joined to the input / output terminal 3 are cutout portions 2a in which two adjacent corner portions of the frame body 2 are cut out. Thus, the convex portion 1b can be provided between two adjacent corners of the base body 1 (between opposite sides of the base body 1), and is caused by a difference in thermal expansion between the base body 1 and the frame body 2. The deformation can be suppressed, and the input / output terminal 3 can be provided as long as possible with the same length as the width of the frame 2 between two adjacent corners of the frame 2. It is possible to provide as many line conductors 3a as possible.

また、凸部１ｂおよび入出力端子３の長さは枠体２の幅と同一（凸部１ｂと入出力端子３の端面が枠体２の端面と面一）の形態であっても、凸部１ｂおよび入出力端子３の長さが枠体２の幅よりも長い形態であっても、凸部１ｂおよび入出力端子３の長さが枠体２の幅よりも短い形態であっても構わない。すなわち、凸部１ｂおよび入出力端子３の両端面が枠体２の外側面と面一であってもよいし、枠体２の外側面よりも外側に位置してもよいし、または、枠体２の外側面よりも内側に位置していてもよい。   Further, the length of the convex portion 1b and the input / output terminal 3 is the same as the width of the frame body 2 (the end surfaces of the convex portion 1b and the input / output terminal 3 are flush with the end surface of the frame body 2). Even if the length of the portion 1b and the input / output terminal 3 is longer than the width of the frame 2, the length of the convex portion 1b and the input / output terminal 3 may be shorter than the width of the frame 2. I do not care. That is, both end surfaces of the convex portion 1b and the input / output terminal 3 may be flush with the outer surface of the frame body 2, may be located outside the outer surface of the frame body 2, or You may be located inside the outer surface of the body 2.

好ましくは、凸部１ｂおよび入出力端子３の長さは枠体２の幅と同一または短いのがよく、枠体２の切り欠き部２ａから凸部１ｂおよび入出力端子３の側面が枠体２から突出することがなくなりパッケージの小型化集積化を実現でき、近時のパッケージの小型化に適応するものとなる。   Preferably, the length of the convex portion 1b and the input / output terminal 3 is the same as or shorter than the width of the frame body 2, and the side surface of the convex portion 1b and the input / output terminal 3 from the notch portion 2a of the frame body 2 is the frame body. Thus, the package can be miniaturized and integrated, and can be adapted to the recent miniaturization of packages.

この切り欠き部２ａが設けられた部分に入出力端子３および凸部１ｂの一部がロウ付け等によって嵌着固定される。このように、枠体２，凸部１ｂおよび入出力端子３によって載置部１ａが囲まれることによって光半導体素子５を収納するための空所が形成されている。   A part of the input / output terminal 3 and the convex portion 1b are fitted and fixed to the portion where the notch 2a is provided by brazing or the like. As described above, the mounting portion 1 a is surrounded by the frame body 2, the convex portion 1 b, and the input / output terminal 3, thereby forming a space for housing the optical semiconductor element 5.

基体１の平面視における大きさは、枠体２の内面および入出力端子３の内面の平面視における大きさよりも大きければよく、これによって基体１と枠体２と入出力端子３とでパッケージとなる容器を形成することができる。そして、枠体２の内面の平面視における大きさよりも基体１が大きいので、枠体２全体が基体１によって拘束され、枠体２の変形を抑制することができる。例えば、図１に示すように、基体１の平面視における形状を枠体２と入出力端子３とを接合した状態の外周部の平面視形状と同一とする、または、図２に示すように、基体１の平面視における形状を枠体２の外周部の平面視形状と同一とすることによって、枠体２をその外周部が基体１の外周部に一致するように位置合わせさせて接合することができ、枠体２を基体１の所定の位置に正確かつ容易に接合させることも可能となる。   The size of the base body 1 in plan view may be larger than the size of the inner surface of the frame body 2 and the inner surface of the input / output terminal 3 in plan view, whereby the base body 1, the frame body 2 and the input / output terminal 3 A container can be formed. And since the base | substrate 1 is larger than the magnitude | size in planar view of the inner surface of the frame 2, the whole frame 2 is restrained by the base | substrate 1, and the deformation | transformation of the frame 2 can be suppressed. For example, as shown in FIG. 1, the shape of the base body 1 in plan view is the same as the shape of the outer peripheral portion in a state where the frame 2 and the input / output terminal 3 are joined, or as shown in FIG. By making the shape of the base body 1 in plan view the same as the shape of the outer periphery of the frame body 2 in plan view, the frame body 2 is aligned and joined so that the outer peripheral portion matches the outer periphery of the base body 1. Therefore, the frame body 2 can be accurately and easily joined to a predetermined position of the base body 1.

なお、本発明の第１の実施の形態においては、凸部１ｂが基体１の一部を厚くすることによって設けられることから、基体１の体積が増加することとなり、基体１の熱容量を増大させることができる。これによって、基体１の下側主面と外部部材との接する面の面積を確保し、基体１から外部部材への熱放散性を良好に保持することができるとともに、光半導体素子５が作動する際に発生する熱を速やかに光半導体素子５から凸部１ｂに逃がすことができる。その結果、光半導体素子５の温度が上昇するのを防止することができる。   In the first embodiment of the present invention, since the convex portion 1b is provided by thickening a part of the base 1, the volume of the base 1 is increased, and the heat capacity of the base 1 is increased. be able to. As a result, the area of the surface where the lower main surface of the substrate 1 is in contact with the external member can be secured, the heat dissipation from the substrate 1 to the external member can be maintained well, and the optical semiconductor element 5 operates. The heat generated at this time can be quickly released from the optical semiconductor element 5 to the convex portion 1b. As a result, it is possible to prevent the temperature of the optical semiconductor element 5 from rising.

また、本発明の第２の実施の形態においては、基体１の一部を曲げ加工して設けられることから、入出力端子３の下方において基体１の下側主面と外部部材との間に空間が生ずる。この空間によって、基体１を外部部材に固定する際の機械的な応力が基体１を介して基体１と入出力端子３との接合部に作用し難くなる。以上により、入出力端子３がクラック等によって破損してしまうのを有効に防止することができ、高い気密信頼性でパッケージ内部を気密に保持することができる。   Further, in the second embodiment of the present invention, a part of the base body 1 is bent and provided, so that it is below the input / output terminal 3 between the lower main surface of the base body 1 and the external member. Space is created. This space makes it difficult for mechanical stress when the base 1 is fixed to the external member to act on the joint between the base 1 and the input / output terminal 3 via the base 1. As described above, it is possible to effectively prevent the input / output terminals 3 from being damaged by cracks and the like, and the inside of the package can be kept airtight with high airtight reliability.

本発明のパッケージにおいて、好ましくは、基体１の両側の、凸部１ｂを鋏んだ下側面、または、第２の実施形態において、凸部１ｂ（曲げ加工部分）の側面を延出させた部分にネジ止め部１１が設けられる。この構成により、反り変形の小さい凸部１ｂの両側にネジ止め部１１が設けられる構成となり、反り変形の小さい基体１の下面が外部部材に当接するように固定されるので、ネジ止め時に基体１に歪みが加わるのを抑制し、入出力端子３がクラック等によって破損するのを確実に防止できる。その結果、パッケージの気密信頼性をさらに向上させることができるとともに、線路導体３ａの断線を防止することができ、内部に収納される光半導体素子５の動作信頼性に優れたパッケージとすることができる。   In the package of the present invention, it is preferable that the lower surface of both sides of the base 1 sandwich the convex portion 1b, or a portion in which the side surface of the convex portion 1b (bending portion) is extended in the second embodiment. Is provided with a screwing portion 11. With this configuration, the screwing portions 11 are provided on both sides of the convex portion 1b having a small warpage deformation, and the lower surface of the base body 1 having a small warpage deformation is fixed so as to contact the external member. Thus, it is possible to reliably prevent the input / output terminal 3 from being damaged by a crack or the like. As a result, the hermetic reliability of the package can be further improved, the disconnection of the line conductor 3a can be prevented, and the package having excellent operational reliability of the optical semiconductor element 5 housed therein can be obtained. it can.

基体１の下側面を延出させてネジ止め部１１を設けた例を図１（ｂ）に、および基体１の凸部側面を延出させてネジ止め部１１を設けた例を図３（ｂ）に示す。ネジ止め部１１には、貫通孔やＵ字状の切り欠きからなる固定部１１ａが設けられており、固定部１１ａの上側からネジを挿通させネジ止めすることによって、パッケージが外部部材にネジ止め固定される。基体１または凸部１ｂの延出部にネジ止め部１１を設ける場合、好ましくは、ネジ止め部１１の厚みを基体１の載置部１ａの厚みよりも薄くする、またはネジ止め部１１の基体１側の付け根に基体１の載置部１ａの厚みよりも薄い薄肉部を設けるのがよい。これより、ネジ止め部１１をネジ止めした際に加わる力をネジ止め部１１の変形によって吸収させて、基体１に作用し難くすることができ、ネジ止め時に基体１に歪みが生じにくくすることができる。   FIG. 1B shows an example in which the lower surface of the base 1 is extended to provide the screwing portion 11, and FIG. 3B shows an example in which the screwing portion 11 is provided by extending the convex side surface of the base 1. Shown in b). The screwing part 11 is provided with a fixing part 11a composed of a through-hole or a U-shaped notch, and the package is screwed to an external member by inserting a screw from above the fixing part 11a and screwing it. Fixed. When the screwing part 11 is provided in the extension part of the base body 1 or the convex part 1b, the thickness of the screwing part 11 is preferably made thinner than the thickness of the mounting part 1a of the base body 1 or the base of the screwing part 11 It is preferable to provide a thin part thinner than the thickness of the mounting part 1a of the base body 1 at the base of one side. As a result, the force applied when the screwing portion 11 is screwed can be absorbed by the deformation of the screwing portion 11 so that it does not easily act on the base body 1 and the base body 1 is less likely to be distorted during screwing. Can do.

また、光半導体素子５から発生する熱量が大きい場合、ネジ止め部１１の厚みを凸部１ｂ部分の基体１の厚さと同じ厚さとしてもよい。この場合、ネジ止め部１１とネジ止めされるネジとの接触面積が大きくなり、光半導体素子５から発生する熱を効率良く外部部材に熱放散させることができ、光半導体素子５の動作信頼性を良好なものとできる。   Further, when the amount of heat generated from the optical semiconductor element 5 is large, the thickness of the screwing portion 11 may be the same as the thickness of the base 1 in the convex portion 1b. In this case, the contact area between the screwing portion 11 and the screw to be screwed is increased, the heat generated from the optical semiconductor element 5 can be efficiently dissipated to the external member, and the operation reliability of the optical semiconductor element 5 is improved. Can be made good.

また、図示しないが、ネジ止め部１１は、基体１から延出するように設けられたネジ止め部１１に限ることはなく、例えば凸部１ｂの幅を枠体２の幅より小さいものとし、この凸部１ｂの両側の基体１に貫通孔またはＵ字状の切り欠きから成る固定部１１ａを設けてもよいし、入出力端子３の幅を枠体２の幅より小さいものとし、入出力端子３の両側の凸部１ｂの上面から基体１の下面にかけて貫通孔またはＵ字状の切り欠きから成る固定部１１ａを設けてもよい。この場合、ネジ止め部１１が基体１から張り出すことがないため、パッケージを小型化することもできる。   Although not shown, the screwing portion 11 is not limited to the screwing portion 11 provided so as to extend from the base body 1, and for example, the width of the convex portion 1b is smaller than the width of the frame body 2, A fixing portion 11a composed of a through hole or a U-shaped notch may be provided on the base body 1 on both sides of the convex portion 1b, and the input / output terminal 3 is made smaller than the width of the frame body 2, A fixing portion 11a composed of a through hole or a U-shaped notch may be provided from the upper surface of the convex portion 1b on both sides of the terminal 3 to the lower surface of the base 1. In this case, since the screwing portion 11 does not protrude from the base 1, the package can be reduced in size.

さらに、図示しないが、凸部１ｂが設けられた基体１の下面からねじを切った穴を設けることによってネジ止め部１１とし、外部部材の下面側からネジを挿通させ、ネジ止め部１１にネジをねじ込むことで基体１を外部部材にネジ止め固定してもよい。   Further, although not shown in the drawings, a screwed portion 11 is formed by providing a screwed hole from the lower surface of the base body 1 provided with the convex portion 1b, and a screw is inserted from the lower surface side of the external member. The base 1 may be fixed to the external member by screwing.

これらの構成は、光半導体素子５の載置部１ａからネジ止め部１１までの距離を近くすることができるので、光半導体素子５から発生する熱をネジを介して効率良く外部部材に熱放散させることができ、光半導体素子５の動作信頼性を良好なものとできる。   Since these configurations can reduce the distance from the mounting portion 1a of the optical semiconductor element 5 to the screwing portion 11, the heat generated from the optical semiconductor element 5 is efficiently dissipated to the external member via the screw. Therefore, the operational reliability of the optical semiconductor element 5 can be improved.

ここで、載置部１ａには光半導体素子５として半導体レーザ（ＬＤ）および／またはフォトダイオード（ＰＤ）、発光ダイオード（ＬＥＤ）その他、光信号を入出力する光半導体素子等が載置固定される。図１〜図３に示すように、枠体２の一側面に光信号入出力用の貫通孔２ｂを設け、この貫通孔２ｂの外側面側の周囲に接合または貫通孔２ｂの内面に嵌着接合された円筒形状の光ファイバ取付部材８がロウ付け等により固定されている。貫通孔２ｂは、入出力端子３が嵌着された枠体２の側壁と対向する枠体２の側壁の、入出力端子３に対向する位置に設けられている。この構成によって、入出力端子３の線路導体３ａと光半導体素子５と光ファイバ９とを一直線上に配置することができ、線路導体３ａから光半導体素子５の発光部または受光部までの配線を直線化することができる。   Here, a semiconductor laser (LD) and / or a photodiode (PD), a light emitting diode (LED), and other optical semiconductor elements for inputting and outputting optical signals are mounted and fixed on the mounting portion 1a as the optical semiconductor element 5. The As shown in FIGS. 1 to 3, a through hole 2b for inputting / outputting an optical signal is provided on one side surface of the frame body 2, and is joined or fitted to the inner surface of the through hole 2b around the outer surface side of the through hole 2b. The joined cylindrical optical fiber mounting member 8 is fixed by brazing or the like. The through hole 2b is provided at a position facing the input / output terminal 3 on the side wall of the frame 2 facing the side wall of the frame 2 to which the input / output terminal 3 is fitted. With this configuration, the line conductor 3a of the input / output terminal 3, the optical semiconductor element 5, and the optical fiber 9 can be arranged in a straight line, and the wiring from the line conductor 3a to the light emitting part or the light receiving part of the optical semiconductor element 5 can be provided. Can be linearized.

すなわち、線路導体３ａから光半導体素子５の電極までの配線に屈曲部がなくなり、屈曲部で配線を伝送する高周波信号に反射損失および透過損失等の伝送損失が発生するということがなくなる。その結果、高周波信号の伝送効率に優れたものとすることができる。   That is, there is no bending portion in the wiring from the line conductor 3a to the electrode of the optical semiconductor element 5, and transmission loss such as reflection loss and transmission loss is not generated in the high-frequency signal transmitted through the wiring at the bending portion. As a result, high-frequency signal transmission efficiency can be improved.

そして、光ファイバ取付部材８のパッケージ外側から、環状の光ファイバ支持部材１０に支持固定された光ファイバ９の先端を挿入するとともに、光ファイバ９の先端を光半導体素子５の光入出力部と光結合するように位置合わせし、光ファイバ取付部材８のパッケージ外側面に光ファイバ支持部材１０の端面を溶接接合またはロウ付け接合等することによって、光ファイバ９の先端が光半導体素子５の光入出力部に光結合された状態でパッケージに取着される。このように光ファイバ取付部材８を介して光ファイバ支持部材１０をパッケージに溶接接合やロウ付け等によって接合することで、光ファイバ支持部材１０のパッケージへの接合時にパッケージに加わる熱応力を光ファイバ取付部材８で吸収緩和させて、入出力端子３に熱応力が大きく作用するのを抑制し、入出力端子３にクラック等の破損が生ずるのを防止できる。   Then, from the outside of the package of the optical fiber attachment member 8, the tip of the optical fiber 9 supported and fixed to the annular optical fiber support member 10 is inserted, and the tip of the optical fiber 9 is connected to the light input / output unit of the optical semiconductor element 5. The optical fiber 9 is positioned so that it is optically coupled, and the end surface of the optical fiber support member 10 is welded or brazed to the outer surface of the optical fiber mounting member 8 so that the tip of the optical fiber 9 is light of the optical semiconductor element 5. It is attached to the package while being optically coupled to the input / output unit. In this way, by joining the optical fiber support member 10 to the package via the optical fiber attachment member 8 by welding or brazing, the thermal stress applied to the package when the optical fiber support member 10 is joined to the package is reduced. It is possible to suppress absorption of the input / output terminal 3 from being greatly absorbed by the mounting member 8 and prevent the input / output terminal 3 from being damaged such as cracks.

なお、図示しないが、光ファイバ支持部材１０が設けられずに光ファイバ取付部材８の内面に直接光ファイバ９がロウ付け接合される形態であっても構わない。この場合は、光ファイバ取付部材８の光ファイバ９挿通用の貫通孔の直径を光ファイバ９の直径に合わせて小さくしておく必要がある。また、光ファイバ取付部材８が設けられず貫通孔２ｂの開口周囲に光ファイバ支持部材１０が溶接接合やロウ付け等によって接合される形態や、光ファイバ取付部材８および光ファイバ支持部材１０が設けられずに、貫通孔２ｂの内面に直接光ファイバ９がロウ付け接合される形態であっても構わない。   Although not shown, the optical fiber 9 may be brazed and joined directly to the inner surface of the optical fiber attachment member 8 without the optical fiber support member 10 being provided. In this case, it is necessary to make the diameter of the through hole for inserting the optical fiber 9 of the optical fiber attachment member 8 small in accordance with the diameter of the optical fiber 9. In addition, the optical fiber mounting member 8 is not provided, and the optical fiber support member 10 is joined around the opening of the through hole 2b by welding or brazing, or the optical fiber mounting member 8 and the optical fiber support member 10 are provided. Instead, the optical fiber 9 may be brazed directly to the inner surface of the through hole 2b.

なお、光半導体素子５は、その光入出力部を光ファイバ９の先端と光結合させるために、無酸素Ｃｕ，Ｃｕ−Ｗ，Ｃｕ−Ｍｏ合金などのＣｕ系材料やＦｅ−Ｎｉ−Ｃｏ合金、Ｆｅ−Ｎｉ合金などの金属やＡｌ２Ｏ３質焼結体，ＡｌＮ質焼結体，３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等のセラミックス、またはペルチェ素子等を用いた熱電変換冷却装置から成る基台１ｃに搭載された状態で載置されている。光半導体素子５を基台１ｃに搭載することにより、光半導体素子５を基体１の上側主面よりも高い位置に載置することができ、光ファイバ９の先端の位置と対向する位置に光半導体素子５を載置させやすくすることができる。 In addition, in order to optically couple the optical input / output part with the tip of the optical fiber 9, the optical semiconductor element 5 has a Cu-based material such as oxygen-free Cu, Cu—W, Cu—Mo alloy or Fe—Ni—Co alloy. , metal or Al 2 O such as Fe-Ni alloy 3 sintered material, AlN sintered material, a thermoelectric conversion cooling device using a 3Al 2 O 3 · 2SiO 2 quality sintered body or the like of ceramics or a Peltier element or the like, It is mounted in the state mounted in the base 1c which consists of. By mounting the optical semiconductor element 5 on the base 1 c, the optical semiconductor element 5 can be placed at a position higher than the upper main surface of the base 1, and light is emitted at a position facing the position of the tip of the optical fiber 9. The semiconductor element 5 can be easily placed.

入出力端子３は、例えば、互いに対向する辺の間に線路導体３ａを有する矩形状の平板部３ｂと、平板部３ｂの上側主面に線路導体３ａを横切るようにして設けられ、線路導体３ａと他の金属を絶縁し、かつパッケージを気密に封止するための立壁部３ｃとから構成される。平板部３ｂおよび立壁部３ｃは、ポリテトラフルオロエチレン，ポリエチレン，エポキシ，ポリフェニレンサルファイト，液晶ポリマー等の樹脂，ガラス，セラミックス等の絶縁材から成る。   The input / output terminal 3 is provided, for example, in a rectangular flat plate portion 3b having a line conductor 3a between opposite sides, and on the upper main surface of the flat plate portion 3b so as to cross the line conductor 3a. And an upright wall portion 3c for insulating other metals and hermetically sealing the package. The flat plate portion 3b and the standing wall portion 3c are made of a resin such as polytetrafluoroethylene, polyethylene, epoxy, polyphenylene sulfite, or a liquid crystal polymer, or an insulating material such as glass or ceramics.

入出力端子３の絶縁材がセラミックスから成る場合は、酸化アルミニウム（Ａｌ２Ｏ３）質焼結体（アルミナセラミックス），窒化アルミニウム（ＡｌＮ）質焼結体，ムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）質焼結体等のセラミックスから成る。例えばＡｌ２Ｏ３質焼結体から成る場合、以下のようにして作製される。アルミナ（Ａｌ２Ｏ３），酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダ，有機溶剤，可塑剤，分散剤等を添加混合してスラリー状となし、これを従来周知のドクターブレード法によってシート状となすことによって、複数枚のセラミックグリーンシートを得る。 When the insulating material of the input / output terminal 3 is made of ceramics, an aluminum oxide (Al 2 O 3 ) sintered body (alumina ceramics), an aluminum nitride (AlN) sintered body, mullite (3Al 2 O 3 .2SiO 2). ) Made of ceramics such as a sintered material. For example, in the case of an Al 2 O 3 sintered body, it is manufactured as follows. Add appropriate organic binder, organic solvent, plasticizer, dispersant, etc. to raw material powders such as alumina (Al 2 O 3 ), silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO). A plurality of ceramic green sheets are obtained by forming a slurry and forming this into a sheet by a conventionally known doctor blade method.

次に、このセラミックグリーンシートに入出力端子３の平板部３ｂおよび立壁部３ｃとなるように適当な打抜き加工を施す。そして、Ｗ，Ｍｏ，Ｍｎ等の金属粉末に適当なバインダ，溶剤を混合してなる導体ペーストを、セラミックグリーンシートにスクリーン印刷法等によって所定パターンに印刷塗布することによって、光半導体素子５の電極と電気的に接続される線路導体３ａ等となる導体層を形成する。また、入出力端子３の基体１および枠体２に接合される面となるセラミックグリーンシートにはロウ付け用の導体層（メタライズ層）が形成される。   Next, an appropriate punching process is performed on the ceramic green sheet so as to form the flat plate portion 3b and the standing wall portion 3c of the input / output terminal 3. An electrode of the optical semiconductor element 5 is formed by applying a conductive paste obtained by mixing an appropriate binder and solvent to a metal powder such as W, Mo, or Mn in a predetermined pattern on a ceramic green sheet by a screen printing method or the like. A conductor layer to be a line conductor 3a and the like that are electrically connected to is formed. Also, a brazing conductor layer (metallized layer) is formed on the ceramic green sheet which is the surface to be joined to the base 1 and the frame 2 of the input / output terminal 3.

これらのセラミックグリーンシートを所定の順序で積層した後、所定の寸法に切断し約１６００℃の温度で焼成し、その後、ダイシングソー、スライサー等のダイヤモンドと砥粒等を用いた切断刃にて所定の大きさに切断し、枠体２の切り欠き部２ａに入出力端子３が精度良く嵌め込みできるよう立壁部３ｃの上面を所定の高さに研磨する。最後に立壁部３ｃの上面、平板部３ｂの枠体２に接合される側面および立壁部３ｃの枠体２に接合される側面にＭｏ，Ｍｎ等の金属層３ｄを印刷塗布し約１３００℃の温度で焼成する。これによって、線路導体３ａなどの導体層を有した入出力端子３となる焼結体を作製することができる。入出力端子３の線路導体３ａ等の導体層の表面には、酸化腐食を防止するためやワイヤボンディング性を高めるため、さらに半田付け性を高めるために、表面に厚さ0.5〜９μｍのＮｉ層および厚さ0.5〜５μｍのＡｕ層等の金属層がめっき法によって被着されているのがよい。   After laminating these ceramic green sheets in a predetermined order, they are cut into predetermined dimensions, fired at a temperature of about 1600 ° C., and then predetermined with a cutting blade using diamond such as a dicing saw or a slicer and abrasive grains. The upper surface of the upright wall portion 3c is polished to a predetermined height so that the input / output terminal 3 can be accurately fitted into the cutout portion 2a of the frame body 2. Finally, a metal layer 3d such as Mo and Mn is printed and applied on the upper surface of the standing wall 3c, the side surface joined to the frame body 2 of the flat plate portion 3b, and the side surface joined to the frame body 2 of the standing wall portion 3c. Bake at temperature. Thus, a sintered body that becomes the input / output terminal 3 having a conductor layer such as the line conductor 3a can be manufactured. On the surface of the conductor layer such as the line conductor 3a of the input / output terminal 3, a Ni layer having a thickness of 0.5 to 9 μm is formed on the surface in order to prevent oxidative corrosion, improve the wire bonding property, and further improve the solderability. Further, a metal layer such as an Au layer having a thickness of 0.5 to 5 μm is preferably deposited by a plating method.

なお、入出力端子３は、枠体２の切り欠き部２ａを塞ぎ、枠体２内外を気密に封止するとともに、内部に載置される光半導体素子５と外部電気回路との間の電気信号を導通させる線路導体３ａが枠体２の内外を接続するように設けられていればよい。したがって、上記形態に限ることはなく、例えば、全体が直方体形状であって、その内部に線路導体３ａが一側面から他側面にかけて形成され、線路導体３ａの両端が露出されているような形態のものであってもよい。   The input / output terminal 3 closes the notch 2a of the frame 2, seals the inside and outside of the frame 2 in an airtight manner, and provides electrical connection between the optical semiconductor element 5 placed inside and the external electric circuit. The line conductor 3a that conducts the signal may be provided so as to connect the inside and the outside of the frame 2. Therefore, the present invention is not limited to the above-described form. For example, the whole is a rectangular parallelepiped shape, and the line conductor 3a is formed from one side to the other side in the inside, and both ends of the line conductor 3a are exposed. It may be a thing.

入出力端子３は、立壁部３ｃの平面視形状は棒状（直線状）であってもよいし、コ字型であってもよい。   The input / output terminal 3 may have a rod-like shape (straight shape) or a U-shape when viewed from above.

また、入出力端子３の切り欠き部２ａに沿った部位に金属層３ｄが被着されているが、入出力端子３に施される金属層３ｄは、少なくとも基体１および枠体２に沿って形成されていればよい。例えば、入出力端子３の上下面および両端面のほぼ全面に施される形態であってもよいし、入出力端子３の上下面および両端面の枠体２との接合部に沿った部分だけに施される形態であってもよい。   In addition, a metal layer 3d is attached to a portion along the notch 2a of the input / output terminal 3, but the metal layer 3d applied to the input / output terminal 3 is at least along the base body 1 and the frame body 2. It only has to be formed. For example, it may be applied to almost the entire upper and lower surfaces and both end surfaces of the input / output terminal 3, or only the portions along the joint portions of the upper and lower surfaces and both end surfaces of the input / output terminal 3 with the frame body 2. It may be a form applied to

また、入出力端子３の上下面および両端面に被着された金属層３ｄは線路導体３ａに対する接地電位として機能するようになり、線路導体３ａに高周波信号を伝送させても、反射損失および透過損失等の伝送損失が生ずるのを抑制し、高周波信号を効率よく伝送させることができる。   Further, the metal layers 3d deposited on the upper and lower surfaces and both end surfaces of the input / output terminal 3 function as a ground potential for the line conductor 3a. Even if a high-frequency signal is transmitted to the line conductor 3a, reflection loss and transmission are transmitted. It is possible to suppress the occurrence of transmission loss such as loss and to efficiently transmit a high-frequency signal.

線路導体３ａは、入出力端子３の下面の基体１または導電性のメタライズ層との間でマイクロストリップ構造を形成し、線路導体３ａの幅および入出力端子３の平板部３ｂの材質および厚みを適度なものにすることにより高周波伝送特性が向上する。また好ましくは、立壁部３ｃの枠体２の内外の線路導体３ａの線幅および立壁部３ｃに挟まれる線路導体３ａの線幅は、それぞれ異なるように形成される。   The line conductor 3a forms a microstrip structure with the base 1 or the conductive metallization layer on the lower surface of the input / output terminal 3, and the width and the material of the flat portion 3b of the input / output terminal 3 and the thickness of the line conductor 3a. By making it appropriate, the high-frequency transmission characteristics are improved. Preferably, the line widths of the line conductors 3a inside and outside the frame body 2 of the standing wall 3c and the line widths of the line conductors 3a sandwiched between the standing walls 3c are different from each other.

なお、枠体２の外側にある線路導体３ａがＦｅ−Ｎｉ−Ｃｏ合金またはＦｅ−Ｎｉ合金等の金属から成るリード端子と半田付けされたり、ボンディングワイヤが接続されたりすることによって、線路導体３ａが外部部材に電気的に接続される。   The line conductor 3a outside the frame 2 is soldered to a lead terminal made of a metal such as an Fe—Ni—Co alloy or Fe—Ni alloy, or a bonding wire is connected to the line conductor 3a. Is electrically connected to the external member.

好ましくは、図３（ｂ）に示すように、入出力端子３の両端面のほぼ全面に金属層３ｄが被着されているのがよく、この構成によって、入出力端子３の金属層３ｄの面積を拡張でき、線路導体３ａに対する接地電位をより強化することができる。そして、線路導体３ａを伝送する信号が高周波のものとなっても、高周波信号に発生する伝送損失をさらに低減させることができ、高周波信号を極めて効率よく伝送させることができるようになる。   Preferably, as shown in FIG. 3 (b), a metal layer 3d may be deposited on almost the entire surface of both end faces of the input / output terminal 3. With this configuration, the metal layer 3d of the input / output terminal 3 is formed. The area can be expanded, and the ground potential for the line conductor 3a can be further strengthened. Even if the signal transmitted through the line conductor 3a has a high frequency, the transmission loss generated in the high frequency signal can be further reduced, and the high frequency signal can be transmitted very efficiently.

特に、入出力端子３の両端面が枠体２の外側面と面一、または、枠体２の外側面よりも内側に位置している場合は、入出力端子３の上面の金属層と両端面の金属層３ｄとが接続するように被着すれば、余分なロウ材を端面の金属層３ｄにも濡れ広がらせることができるとともに、枠体２と入出力端子３の両端面の金属層３ｄとの間で、枠体２と入出力端子３とを接合するためのロウ材のメニスカスを良好に形成させることができ、入出力端子３にクラック等の破損を生じさせることなく枠体２に強固にロウ付け接合できる。   In particular, when both end surfaces of the input / output terminal 3 are flush with the outer surface of the frame body 2 or on the inner side of the outer surface of the frame body 2, the metal layer on the upper surface of the input / output terminal 3 and both ends If the metal layer 3d on the surface is attached so as to be connected, the excess brazing material can be wetted and spread also on the metal layer 3d on the end surface, and the metal layers on both end surfaces of the frame 2 and the input / output terminal 3 A braided meniscus for joining the frame body 2 and the input / output terminal 3 can be well formed between the frame body 2d and the frame body 2 without causing damage such as cracks to the input / output terminal 3. Can be brazed firmly.

本発明のパッケージにおいて、好ましくは、図２に示すように、入出力端子３は、枠体２の外側に露出する部位において、平板部３ｂの上面および下面に線路導体３ａが形成されているのがよい。この構成によって、枠体２の内側における入出力端子３の平板部３ｂの上面に光半導体素子５と接続される線路導体３ａを微細に多数設けた場合においても、枠体２の外側では入出力端子３の上面に形成された一部の線路導体３ａを内部配線を介して下面に引き回し、入出力端子３の枠体２の外側の上面または下面にそれぞれ配置される線路導体３ａの数を枠体２の内側の入出力端子３の上面に配置される線路導体３ａの数に比べ減少させることができる。したがって、入出力端子３の枠体２の外側の線路導体３ａの幅を広くすることができるとともに、隣り合う線路導体３ａ同士の間隔を広げることが可能となる。   In the package of the present invention, preferably, as shown in FIG. 2, the input / output terminal 3 has a line conductor 3 a formed on the upper surface and the lower surface of the flat plate portion 3 b in a portion exposed to the outside of the frame body 2. Is good. With this configuration, even when a large number of line conductors 3 a connected to the optical semiconductor element 5 are provided on the upper surface of the flat plate portion 3 b of the input / output terminal 3 inside the frame body 2, input / output is performed outside the frame body 2. A part of the line conductors 3a formed on the upper surface of the terminal 3 is routed to the lower surface via the internal wiring, and the number of the line conductors 3a arranged on the outer upper surface or the lower surface of the frame body 2 of the input / output terminal 3 is determined. The number of line conductors 3a arranged on the upper surface of the input / output terminal 3 inside the body 2 can be reduced. Therefore, the width of the line conductor 3a outside the frame 2 of the input / output terminal 3 can be increased, and the interval between the adjacent line conductors 3a can be increased.

このように、平板部３ｂの上面および下面に線路導体３ａを形成させる場合、図２に示すように、入出力端子３の枠体２よりも外側に位置する部位の下方には基体１が設けられていないまたは基体１との間にリード端子を配置できる空間を設けた構成とする。または、平板部３ｂの下面にも立壁部３と同様の絶縁体を接合することによって、平板部３ｂの下面に形成された線路導体３ａと基体１とが電気的短絡を生じないようにしてもよい。   Thus, when the line conductor 3a is formed on the upper surface and the lower surface of the flat plate portion 3b, the base body 1 is provided below the portion of the input / output terminal 3 located outside the frame 2 as shown in FIG. It is set as the structure which provided the space which can arrange | position a lead terminal between the base | substrate 1 which is not formed. Alternatively, an insulator similar to the standing wall 3 may be joined to the lower surface of the flat plate portion 3b so that the line conductor 3a formed on the lower surface of the flat plate portion 3b and the base 1 do not cause an electrical short circuit. Good.

そして、枠体２の外側では、隣り合う線路導体３ａ同士の間隔を広げることができるので、個々の線路導体３ａにリード端子７をロウ材等の導電性接着剤を介して接合させた場合においても、線路導体３ａとリード端子７との接合面積を十分なものとして、リード端子７を入出力端子３に強固に取着させることができる。   And since the space | interval of the adjacent line conductors 3a can be expanded on the outer side of the frame 2, in the case where the lead terminal 7 is joined to each line conductor 3a via a conductive adhesive such as a brazing material. In addition, the lead terminal 7 can be firmly attached to the input / output terminal 3 with a sufficient bonding area between the line conductor 3 a and the lead terminal 7.

また、線路導体３ａにリード端子７をロウ材等の導電性接着剤を介して接合させても、隣り合う線路導体３ａ間で溶融したロウ材等の導電性接着剤が表面張力によって結合してしまうのを防止でき、隣り合う線路導体３ａが電気的に短絡するのを有効に防止することができる。   Further, even if the lead terminal 7 is joined to the line conductor 3a through a conductive adhesive such as a brazing material, the conductive adhesive such as a brazing material melted between the adjacent line conductors 3a is bonded by the surface tension. It is possible to prevent the adjacent line conductors 3a from being electrically short-circuited.

なお、図示していないが、平板部３ｂの上面の線路導体３ａと下面の線路導体３ａとの間に接地金属層を形成しておくと、上面の線路導体３ａと下面の線路導体３ａとの間の電気信号のクロストークを避けることができるとともに、この接地金属層がそれぞれの線路導体３ａの接地導体層として作用し、それぞれの線路導体３ａがマイクロストリップラインとして動作する。したがって、線路導体３ａに高周波信号を良好に伝送させることができるようになる。   Although not shown, if a ground metal layer is formed between the line conductor 3a on the upper surface of the flat plate portion 3b and the line conductor 3a on the lower surface, the line conductor 3a on the upper surface and the line conductor 3a on the lower surface are formed. In addition to avoiding crosstalk of electrical signals therebetween, this ground metal layer acts as the ground conductor layer of each line conductor 3a, and each line conductor 3a operates as a microstrip line. Therefore, the high frequency signal can be transmitted satisfactorily to the line conductor 3a.

以上の結果、枠体２の内側における入出力端子３の上面に、光半導体素子５と接続される線路導体３ａが微細に多数設けられ、小型化および集積化されたパッケージにおいても、入出力端子３の枠体２の外側では、外部部材との接続に十分な線路導体３ａの幅を確保することができる。   As a result of the above, the input / output terminals can be provided even in a miniaturized and integrated package in which a large number of line conductors 3a connected to the optical semiconductor element 5 are finely provided on the upper surface of the input / output terminals 3 inside the frame 2. 3, the width of the line conductor 3 a sufficient for connection with an external member can be secured.

さらに、入出力端子３の平板部３ｂの上面に形成された線路導体３ａを外部部材の一主面に形成された配線導体にワイヤボンディング等を用いて電気的に接続するとともに、入出力端子３の下面に形成された線路導体３ａを外部部材の一主面に形成された配線導体にハンダ付けによって電気的に接続することもでき、パッケージを外部部材に実装する際の作業性を改善することができる。また入出力端子３の上面および下面に形成された線路導体３ａにそれぞれリード端子７を取着することで、上下のリード端子７間に外部部材を挟み込ませることができ、パッケージの外部部材の上下面に形成された配線導体への実装の作業性を極めて効率のよいものとすることができる。   Furthermore, the line conductor 3a formed on the upper surface of the flat plate portion 3b of the input / output terminal 3 is electrically connected to the wiring conductor formed on one main surface of the external member using wire bonding or the like, and the input / output terminal 3 The line conductor 3a formed on the lower surface of the external member can be electrically connected to the wiring conductor formed on one main surface of the external member by soldering, thereby improving the workability when the package is mounted on the external member. Can do. In addition, by attaching the lead terminals 7 to the line conductors 3a formed on the upper and lower surfaces of the input / output terminals 3, an external member can be sandwiched between the upper and lower lead terminals 7, and the upper part of the external member of the package The workability of mounting on the wiring conductor formed on the lower surface can be made extremely efficient.

以上の構成によって、本発明のパッケージが構成される。そして、上記構成のパッケージの基台１ｃにＬＤ，ＰＤ等の光半導体素子５を鉛（Ｐｂ）−錫（Ｓｎ）またはＡｕ−Ｓｎ等の半田によって載置固定した後、光半導体素子５の電極と線路導体３ａの枠体２の内側の部位とをボンディングワイヤ等の電気的接続手段６で電気的に接続し、光ファイバ取付部材８のパッケージ外側から、光ファイバ９の先端を挿入するとともに、光ファイバ９の先端を光半導体素子５の光入出力部と光結合するように位置合わせして、光ファイバ取付部材８に光ファイバ９を保持固定し、枠体２の上面にＦｅ−Ｎｉ−Ｃｏ合金などの金属またはセラミックスなどから成る蓋体４を半田付け法または溶接法などにより枠体２の内側を塞ぐように取着し、光半導体素子５を気密に封止することで製品としての光半導体装置となる。   The package of this invention is comprised by the above structure. Then, after the optical semiconductor element 5 such as LD, PD or the like is placed and fixed on the base 1c of the package having the above-described structure by solder such as lead (Pb) -tin (Sn) or Au-Sn, the electrode of the optical semiconductor element 5 And an inner portion of the frame 2 of the line conductor 3a are electrically connected by an electrical connection means 6 such as a bonding wire, and the tip of the optical fiber 9 is inserted from the outside of the package of the optical fiber mounting member 8, The tip of the optical fiber 9 is aligned so as to be optically coupled to the optical input / output portion of the optical semiconductor element 5, the optical fiber 9 is held and fixed to the optical fiber attachment member 8, and the upper surface of the frame 2 is Fe—Ni—. A lid 4 made of a metal such as a Co alloy or ceramics is attached so as to close the inside of the frame 2 by a soldering method or a welding method, and the optical semiconductor element 5 is hermetically sealed. Optical semiconductor equipment To become.

そして、枠体２の外側にある線路導体３ａが外部部材に電気的に接続されることによって、外部部材と光半導体素子５とは、線路導体３ａと電気的接続手段６を介して電気的に接続され、外部部材からの電気信号を受信または外部部材へ電気信号を送信することによって光半導体素子５が作動するようになる。   The line conductor 3a outside the frame 2 is electrically connected to the external member, so that the external member and the optical semiconductor element 5 are electrically connected to each other via the line conductor 3a and the electrical connection means 6. The optical semiconductor element 5 is operated by being connected and receiving an electrical signal from an external member or transmitting an electrical signal to the external member.

なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等支障ない。したがって、前述の実施形態はあらゆる点で単なる例示に過ぎず、本発明の範囲は特許請求の範囲に示すものであって、明細書本文には何ら拘束されない。さらに、特許請求の範囲に属する変形や変更は全て本発明の範囲内のものである。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. Therefore, the above-described embodiment is merely an example in all respects, and the scope of the present invention is shown in the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the scope of the claims are within the scope of the present invention.

本発明の一実施形態例として、上述のように半導体素子５として光半導体素子５を搭載したパッケージおよび光半導体装置を例に説明したが、これに限ることはない。例えば、光ファイバ取付部材８を設ける代わりに、一側面と対向する他端面にも凸部１ｂの上面に載置された状態で取着された入出力端子３を設け、この入出力端子３および凸部１ｂの少なくとも一部が枠体２の他方の切り欠き部２ａに嵌着されたものとしてもよい。   As an exemplary embodiment of the present invention, the package and the optical semiconductor device in which the optical semiconductor element 5 is mounted as the semiconductor element 5 as described above have been described as an example. However, the present invention is not limited to this. For example, instead of providing the optical fiber attachment member 8, the input / output terminal 3 attached in a state of being placed on the upper surface of the convex portion 1 b is also provided on the other end surface facing one side surface. It is good also as what at least one part of the convex part 1b was fitted by the other notch part 2a of the frame 2. As shown in FIG.

（ａ）は本発明の第１の実施の形態の半導体素子収納用パッケージおよび半導体装置の一例を示す断面図、（ｂ）は（ａ）の半導体素子収納用パッケージおよび半導体装置の斜視図である。(A) is sectional drawing which shows an example of the semiconductor element accommodation package and semiconductor device of the 1st Embodiment of this invention, (b) is a perspective view of the semiconductor element accommodation package and semiconductor device of (a). . 本発明の第１の実施の形態の半導体素子収納用パッケージおよび半導体装置の他の例を示す断面図である。It is sectional drawing which shows the other example of the package for semiconductor element accommodation of the 1st Embodiment of this invention, and a semiconductor device. （ａ）は本発明の第２の実施の形態の半導体素子収納用パッケージおよび半導体装置の一例を示す断面図、（ｂ）は（ａ）の半導体素子収納用パッケージおよび半導体装置の斜視図である。(A) is sectional drawing which shows an example of the semiconductor element accommodation package and semiconductor device of the 2nd Embodiment of this invention, (b) is a perspective view of the semiconductor element accommodation package and semiconductor device of (a). . （ａ）は従来の半導体素子収納用パッケージおよび半導体装置を示す分解平面図、（ｂ）は（ａ）の半導体素子収納用パッケージおよび半導体装置を示す断面図である。(A) is an exploded plan view showing a conventional semiconductor element housing package and semiconductor device, and (b) is a cross-sectional view showing the semiconductor element housing package and semiconductor device of (a).

符号の説明Explanation of symbols

１：基体
１ａ：載置部
１ｂ：凸部
２：枠体
２ａ：切り欠き部
２ｂ：貫通孔
３：入出力端子
３ａ：線路導体
３ｄ：金属層
４：蓋体
５：半導体素子
８：光ファイバ取付部材
９：光ファイバ
１１：ネジ止め部
１１ａ：固定部 DESCRIPTION OF SYMBOLS 1: Base 1a: Mounting part 1b: Convex part 2: Frame body 2a: Notch part 2b: Through-hole 3: Input / output terminal 3a: Line conductor 3d: Metal layer 4: Lid body 5: Semiconductor element 8: Optical fiber Mounting member 9: optical fiber 11: screwing part 11a: fixing part

Claims (5)

上側主面に半導体素子の載置部が形成された金属製の基体と、該基体の上側主面に前記載置部を多角形状に取り囲むように設けられ、内外を貫通するように隣接する２つの角部間の下端部が切り欠かれた切り欠き部を有する金属製の枠体と、前記切り欠き部に嵌着され、前記枠体の内外を電気的に導通する線路導体を有する入出力端子と、該入出力端子の直下に前記入出力端子を載置するように設けられた、前記基体の上側主面に突出した凸部とを備え、前記入出力端子と前記凸部の双方ともが前記切り欠き部の前記２つの角部間にわたって嵌着されていることを特徴とする半導体素子収納用パッケージ。 A metal base having a semiconductor element mounting portion formed on the upper main surface, and an upper main surface of the base that is provided so as to surround the mounting portion in a polygonal shape and adjacent to each other so as to penetrate inside and outside. a metal frame having a cut-out portion lower end which all Ri switching between One corner, is fitted into the notch, the input having a line conductor for electrically conducting inside and outside of the frame an output terminal, provided so as to place said input-output terminals directly under the said input and output ends child, and a convex portion protruding into the upper surface of the substrate, said input and output terminals of said protrusions both the semiconductor element storage package according to claim Rukoto also has been fitted over between the two corners of the notch. 前記枠体の前記切り欠き部と対向する側面に設けられた前記枠体の内外を貫通する貫通孔とともに、該貫通孔に光ファイバが嵌着される取付部材を設けたことを特徴とする請求項１記載の半導体素子収納用パッケージ。 An attachment member for fitting an optical fiber to the through hole is provided together with a through hole penetrating the inside and outside of the frame body provided on a side surface facing the notch portion of the frame body. Item 14. A package for housing a semiconductor element according to Item 1. 前記基体の前記凸部を挟んだ両側にネジ止め部が設けられていることを特徴とする請求項１または請求項２記載の半導体素子収納用パッケージ。 3. The package for housing a semiconductor element according to claim 1, wherein screwing portions are provided on both sides of the convex portion of the base. 請求項１乃至３のいずれかに記載の半導体素子収納用パッケージと、前記載置部に基台を介して載置され、前記線路導体に電気的に接続された半導体素子と、前記枠体の上面に前記枠体の内側を塞ぐように取着された蓋体とを具備していることを特徴とする半導体装置。 A package for housing a semiconductor element according to any one of claims 1 to 3, a semiconductor element mounted on the mounting portion via a base and electrically connected to the line conductor, and the frame body A semiconductor device, comprising: a lid attached to an upper surface so as to close the inside of the frame. 請求項２または請求項３記載の半導体素子収納用パッケージと、前記載置部に基台を介して載置され、発光部または受光部が前記貫通孔に対向するように配置されるとともに前記線路導体に電気的に接続された光半導体素子と、前記光ファイバ取付部材に前記光半導体素子の発光部または受光部と光結合するように取り付けられた光ファイバと、前記枠体の上面に前記枠体の内側を塞ぐように取着された蓋体とを具備していることを特徴とする半導体装置。 The package for housing a semiconductor element according to claim 2 or claim 3, and placed on the placement portion via a base, and disposed so that the light emitting portion or the light receiving portion faces the through hole and the line An optical semiconductor element electrically connected to a conductor; an optical fiber attached to the optical fiber attachment member so as to be optically coupled to a light emitting part or a light receiving part of the optical semiconductor element; and the frame on an upper surface of the frame body And a lid attached to close the inside of the body.
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