JP2004221327A

JP2004221327A - Semiconductor element housing package and semiconductor device

Info

Publication number: JP2004221327A
Application number: JP2003007009A
Authority: JP
Inventors: Taizo Suemitsu; 泰三末光
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2003-01-15
Filing date: 2003-01-15
Publication date: 2004-08-05

Abstract

<P>PROBLEM TO BE SOLVED: To keep the inside of a package air-tight for good operation characteristics of a semiconductor element by making the a semiconductor element housing package hard to warp. <P>SOLUTION: The semiconductor element housing package comprises a rectangular metal base body 1 where a placement 1b on which a semiconductor element 5 is placed is formed on the upper-side main surface while a screwing fitting part 1a extending outside is formed at each of four corners, a metal frame 3 which is attached to enclose the placement part 1b on the outer peripheral part of the upper-side main surface of the base body 1 with a fitting part 3a of an input/output terminal 4 composed of a through hole or notch formed on a side, and the ceramics input/output terminal 4 which is fitted to the fitting part 3a and comprises a metallized wiring layer for electrical continuation between the inside and the outside of the frame 3. The through hole of the screw fitting part 1a that penetrates the upper and lower surfaces in which a screw is inserted, is so formed that the shape of cross section is circular, with the upper side having a smaller bore than the lower side. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、半導体素子を収納するための半導体素子収納用パッケージおよび半導体装置に関する。
【０００２】
【従来の技術】
従来の半導体素子を収納するための半導体素子収納用パッケージ（以下、パッケージともいう）を図７、図８に示す。図７はパッケージの平面図、図８は図７のパッケージの断面図である。これらの図において、２１は四角形状の基体、２３は枠体、２４は入出力端子を示し、これら基体２１、枠体２３、入出力端子２４とで、内部空間に半導体素子２５を収容する容器が基本的に構成される。
【０００３】
基体２１は、鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金，銅（Ｃｕ）−タングステン（Ｗ）等の金属から成り、基体２１の上側主面の中央部には、半導体集積回路素子（ＩＣ，ＬＳＩ），半導体レーザ（ＬＤ），フォトダイオード（ＰＤ）等の半導体素子２５を載置するための載置部２１ｂが設けられている。また、基体２１の四隅部に外側に延出して設けられた張出部から成るネジ止め部２１ａが設けられている。この基体２１は、ネジ止め部２１ａの貫通穴にネジを挿入し外部電気回路基板にネジ止め固定される。
【０００４】
基体２１の上側主面の外周部には、載置部２１ｂを囲繞するようにして接合された枠体２３が立設されている。この枠体２３は、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属から成り、基体２１に銀（Ａｇ）ロウ等のロウ材を介してロウ付けされる。
【０００５】
枠体２３は、側部に貫通孔または切欠きから成る入出力端子２４を取り付けるための取付部が形成されている。そして、アルミナ（Ａｌ_２Ｏ_３）質焼結体等のセラミックスから成る入出力端子２４が枠体２３の取付部にＡｇロウ等のロウ材を介してロウ付けされる。
【０００６】
入出力端子２４は、上面に一辺から対向する他辺にかけて形成された枠体２３の内外を導通するメタライズ配線層を有する四角形状の平板部およびこの平板部の上面にメタライズ配線層の一部を間に挟んで接合された直方体状の立壁部とから成り、この入出力端子２４の枠体２３外面側のメタライズ配線層にはＦｅ−Ｎｉ−Ｃｏ合金等の金属から成るリード端子２６がＡｇロウ等のロウ材を介して電気的に接続されることによってパッケージが製作される（例えば、下記の特許文献１参照）。
【０００７】
このような構成のパッケージの載置部２１ｂに半導体素子２５を載置固定した後、半導体素子２５の電極と入出力端子２４の枠体２３内面側のメタライズ配線層とをボンディングワイヤで電気的に接続し、枠体２３の上面にＦｅ−Ｎｉ−Ｃｏ合金等から成る蓋体２７をシーム溶接法等の溶接法により接合することによって、製品としての半導体装置と成る。そして、ネジ止め部２１ａの貫通穴にネジを挿入し、基体２１を外部電気回路基板にネジ止め固定する。この半導体装置は、リード端子２６が外部電気回路に接続され、半導体素子２５が外部電気回路に電気的に接続されることによって、半導体素子２５が高周波信号で作動することとなる。
【０００８】
また、半導体素子２５がＬＤ，ＰＤ等の光半導体素子である場合には、枠体２３の側部に光ファイバ２８を挿通させるための貫通孔が設けられ、半導体素子２５の光入出力端面と光ファイバ２８の光入出力端面が対向するようにして、光ファイバ２８が枠体２３の貫通孔に挿通固定される。
【０００９】
このような光半導体素子を収納するパッケージとしては、下記の特許文献２に記載されているように、ネジ止め部２１ａを基体２１，枠体２３よりも縦弾性係数の低い材質、例えば、Ｃｕ，Ｃｕ合金，アルミニウム（Ａｌ），Ａｌ合金等で形成し、基体２１にＡｇロウ付けする構成が提案されている。これにより、ネジ止め部２１ａをネジ止め固定しても、ネジ止め部２１ａが主に変形して基体２１の変形が抑えられ、半導体素子２５と光ファイバ２８との光入出力端面が対向した状態を維持することができるというものである。
【００１０】
【特許文献１】
特開平１１−５４６５７号公報
【特許文献２】
特開平６−８２６５９号公報
【００１１】
【発明が解決しようとする課題】
しかしながら、上記特許文献１に示される構成においては、基体２１をネジ止めして外部電気回路基板に固定した際、ネジ止めにより基体２１に歪みが発生し、入出力端子２４にクラック等の破損が生じ、パッケージ内部を気密に保持できなくなるという問題点があった。
【００１２】
また、半導体素子２５が光半導体素子である場合には、ネジ止めにより発生した基体２１の歪みで、光ファイバ２８の位置がずれ、半導体素子２５と光ファイバ２８とを光学的に結合できなくなって、光信号を入出力できなくなるという問題点もあった。
【００１３】
また、上記特許文献２に示される構成においては、ネジ止め部２１ａを構成するＣｕの焼きなまし温度が約４５０℃、Ａｌの焼きなまし温度が約４００℃であるため、ネジ止め部２１ａを約８００℃で基体２１にＡｇロウ付けする際に、ネジ止め部２１ａが焼きなまされ、ネジ止め部２１ａが変形する。このようにネジ止め部２１ａが変形した状態で、基体２１を外部電気回路基板にネジ止め固定すると、基体２１を外部電気回路基板に密着できず隙間が生じ、半導体素子２５から発生する熱を外部に効率よく放散できなくなり、その結果、半導体素子２５の温度が上昇し、半導体素子２５が正常に作動しなくなるという問題点があった。
【００１４】
従って、本発明は上記従来の問題点に鑑み完成されたものであり、その目的は、パッケージの歪を生じ難くしてパッケージ内部を気密に保持するとともに半導体素子の作動性を良好なものとすることにある。
【００１５】
【課題を解決するための手段】
本発明の半導体素子収納用パッケージは、上側主面に半導体素子が載置される載置部が形成されるとともに四隅部に外側に延出したネジ止め部がそれぞれ形成された四角形状の金属製の基体と、該基体の前記上側主面の外周部に前記載置部を囲繞するように取着され、側部に貫通孔または切欠きから成る入出力端子の取付部が形成された金属製の枠体と、前記取付部に嵌着された、前記枠体の内外を電気的に導通するメタライズ配線層を有するセラミックス製の入出力端子とを具備しており、前記ネジ止め部は、ネジが挿通される上下面間を貫通する貫通穴が、横断面形状が円形状で、かつ下側よりも上側が小径とされて形成されていることを特徴とする。
【００１６】
本発明の半導体素子収納用パッケージは、ネジ止め部は、ネジが挿通される上下面間を貫通する貫通穴が、横断面形状が円形状で、かつ下側よりも上側が小径とされて形成されていることにより、半導体素子収納用パッケージを外部電気回路基板にネジ止め固定した場合に発生する歪を生じさせようとする応力をネジ止め部における貫通穴の上側の突出部が適度に変形することによって吸収し、基体に伝わり難くすることができる。その結果、入出力端子にクラック等の破損が生じるのを有効に抑制でき、半導体素子収納用パッケージ内部を気密に保持することができる。また、半導体素子が光半導体素子である場合、半導体素子と光ファイバとの光学的な結合が低下するのを有効に抑制できる。
【００１７】
また、ネジ止め部は基体を延出して形成されていることから、枠体と基体とを高温でロウ付けした際にネジ止め部が変形することはなく、基体を外部電気回路基板に良好に密着させてネジ止め固定することができ、半導体素子から発生する熱を外部に効率よく放散させることもできる。その結果、半導体素子の温度の上昇を抑え、半導体素子を正常に作動させ得る。
【００１８】
本発明の半導体装置は、上記本発明の半導体素子収納用パッケージと、前記載置部に載置固定されるとともに前記入出力端子に電気的に接続された半導体素子と、前記枠体の上面に接合された蓋体とを具備したことを特徴とする。
【００１９】
本発明の半導体装置は、上記の構成により、上記本発明の半導体素子収納用パッケージを用いた信頼性の高いものとなる。
【００２０】
【発明の実施の形態】
本発明の半導体素子収納用パッケージについて以下に詳細に説明する。図１は本発明のパッケージについて実施の形態の一例を示す平面図、図２は図１のパッケージの断面図である。また、図３は本発明のパッケージにおけるネジ止め部の断面図である。これらの図において、１は基体、３は枠体、４は入出力端子、６はリード端子を示し、基体１と枠体３と入出力端子４とで半導体素子５を内部に収納する容器が基本的に構成される。
【００２１】
本発明のパッケージは、図１〜図３に示すように、上側主面に半導体素子５が載置される載置部１ｂが形成されるとともに四隅部に外側に延出したネジ止め部１ａがそれぞれ形成された四角形状の金属製の基体１と、この基体１の上側主面の外周部に載置部１ｂを囲繞するように取着され、側部に貫通孔または切欠きから成る入出力端子４の取付部３ａが形成された金属製の枠体３と、取付部３ａに嵌着された、枠体３の内外を電気的に導通するメタライズ配線層を有するセラミックス製の入出力端子４とを具備しており、ネジ止め部１ａは、ネジが挿通される上下面間を貫通する貫通穴が、横断面形状が円形状で、かつ下側よりも上側が小径とされて形成されている。
【００２２】
本発明の基体１は、Ｆｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ等の金属から成り、そのインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施したり、射出成形と切削加工等を施すことによって所定形状に製作される。基体１の上側主面には、半導体素子５を載置する載置部１ｂが設けられる。この基体１は、半導体素子５が作動時に発する熱を外部に放熱させる放熱板の役割をも果たす。基体１の表面には、酸化腐食の防止や半導体素子５のロウ付け等による載置固定を良好にするために、厚さ０．５〜９μｍのＮｉ層や厚さ０．５〜５μｍの金（Ａｕ）層から成る金属層をめっき法等により被着させておくとよい。また、半導体素子５の熱を効率よく外部へ放熱させるために、半導体素子５がペルチェ素子等の熱電冷却素子（図示せず）に搭載された状態で載置部１ｂに載置固定されていてもよい。
【００２３】
基体１は四角形状で、その四隅部に外側に延出したネジ止め部１ａが形成されている。ネジ止め部１ａは、光ファイバ８が枠体３に固定されている場合、図１に示すように、光ファイバ８が固定されている枠体３の側面側およびこの面に対向する側面側に形成されているのがよい。これにより、パッケージを外部電気回路基板にネジ止め固定した際に発生する応力が、光ファイバ８が固定されている枠体３の側面部に加わるのを抑制することができる。即ち、互いに逆の方向に延出した２つのネジ止め部１ａの間に位置する部分において曲げ応力が最も大きくなり易いのに対し、枠体３の同じ側面側にある２つのネジ止め部１ａの間に位置する部分においては曲げ応力は小さく、この曲げ応力の小さい部分で光ファイバ８を固定することにより、光ファイバ８の位置がずれるのを有効に抑制することができる。
【００２４】
また、ネジ止め部１ａは、光ファイバ８が枠体３に固定されていない場合には、枠体３の入出力端子４が嵌着されている側面側に形成されているのがよい。これにより、枠体３の同じ側面側にある２つのネジ止め部１ａの間に位置する部分、即ち曲げ応力の小さい部分で入出力端子４を嵌着することにより、入出力端子４に加わる応力を小さくして入出力端子４にクラックが生じるのを有効に抑制できる。
【００２５】
また、基体１の上側主面の外周部には、載置部１ｂを囲繞するようにしてＡｇロウ等のロウ材を介して接合された枠体３が立設されており、枠体３は基体１とともにその内側に半導体素子５を収容する空所を形成する。枠体３は、Ｆｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ等の金属から成る平面視形状が四角形状の枠状体であり、そのインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施したり、射出成形と切削加工等を施すことによって所定形状に製作され、基体１にＡｇロウ等のロウ材を介して接続される。また、枠体３の表面には、酸化腐食の防止や入出力端子４のロウ付け等による嵌着を良好にするために、厚さ０．５〜９μｍのＮｉ層や厚さ０．５〜５μｍのＡｕ層から成る金属層をめっき法等により被着させておくとよい。
【００２６】
また、枠体３には、側部に貫通孔または切欠きから成る入出力端子４を取り付けるための取付部３ａが形成されている。そして、入出力端子４が枠体３の取付部３ａにＡｇロウ等のロウ材を介してロウ付けされる。
【００２７】
入出力端子４は、上面に一辺から対向する他辺にかけて形成された枠体３の内外を導通するメタライズ配線層を有する四角形状の平板部およびこの平板部の上面にメタライズ配線層の一部を間に挟んで接合された直方体状の立壁部とから構成され、枠体３の側部に設けられた取付部３ａにＡｇロウ等のロウ材を介してロウ付けされる。
【００２８】
入出力端子４を構成する上記の平板部および立壁部は、酸化アルミニウム（Ａｌ_２Ｏ_３）質焼結体、窒化アルミニウム（ＡｌＮ）質焼結体等のセラミックスから成り、セラミックグリーンシートを打ち抜き加工し、セラミックグリーンシートを多層積層し焼成することによって形成される。
【００２９】
入出力端子４の平板部の上面に設けられたメタライズ配線層は、Ｗ，Ｍｏ，Ｍｎ等の導体ペーストを焼成することにより形成され、枠体３外側のメタライズ配線層にはＦｅ−Ｎｉ−Ｃｏ合金等の金属から成るリード端子６がＡｇロウ等のロウ材を介して電気的に接続される。
【００３０】
本発明のパッケージは、図３に示すように、ネジ止め部１ａは、ネジが挿通される上下面間を貫通する貫通穴が、横断面形状が円形状で、かつ下側よりも上側が小径とされて形成されている。これにより、パッケージを外部電気回路基板にネジ止め固定した場合に発生する歪を生じさせようとする応力をネジ止め部１ａにおける貫通穴の上側の突出部１ｃが適度に変形することによって吸収し、基体１に伝わり難くすることができる。その結果、入出力端子４にクラック等の破損が生じるのを有効に抑制でき、パッケージ内部を気密に保持することができる。また、半導体素子５が光半導体素子である場合、半導体素子５と光ファイバ８との光学的な結合が低下するのを有効に抑制できる。
【００３１】
また、ネジ止め部１ａは基体１を延出して形成されていることから、枠体３と基体１とを高温でロウ付けした際にネジ止め部１ａが変形することはなく、基体１を外部電気回路基板に良好に密着させてネジ止め固定することができ、半導体素子５から発生する熱を外部に効率よく放散させることもできる。その結果、半導体素子５の温度の上昇を抑え、半導体素子５を正常に作動させ得る。
【００３２】
ネジ止め部１ａにおける貫通穴は、円形，楕円形等の円形状であり、図３に示すように内周面に段差が形成されていてもよい。この場合、貫通穴の上側の突出部１ｃが段差部分を支点として大きく変形することができ、突出部１ｃに加わる応力を緩和する効果が大きくなる。また、貫通穴は、内径が下側から上側にかけて滑らかに変化するように形成されていてもよい。この場合、突出部１ｃの変形による応力緩和効果を有しながら突出部１ｃの強度を大きくすることもでき、突出部１ｃが変形することによって生じ易くなる破損を有効に抑制することができる。
【００３３】
突出部１ｃの厚みＡ（図３）はネジ止め部１ａの厚みをＢとした場合に、Ｂ／５≦Ａ≦３Ｂ／５とするのがよく、ネジ止め部１ａをネジ止め固定した場合に、基体１に歪を生じさせようとする応力を突出部１ｃが適度に変形することによって吸収し、入出力端子４にクラック等の破損が生ずるのを有効に抑制できる。Ａ＜Ｂ／５の場合、突出部１ｃが大きく変形して突出部１ｃが破断し易くなり、基体１をネジ止め固定するのが困難になる。また、Ａ＞３Ｂ／５の場合、突出部１ｃが変形し難くなって突出部１ｃで吸収される応力が小さくなり、ネジ止め固定時に基体１に歪みが生じ易くなる。
【００３４】
また、ネジ止め部１ａにおける貫通穴の上側の内径Ｃ（図３）は下側の内径をＤとした場合に、Ｄ／３≦Ｃ≦５Ｄ／６とするのがよく、ネジ止め部１ａをネジ止め固定した場合に、基体１に歪を生じさせようとする応力を吸収して入出力端子４にクラック等の破損が生ずるのを有効に抑制できる。Ｃ＜Ｄ／３の場合、突出部１ｃが大きく変形し、突出部１ｃが破断し易くなるとともに、ネジ止め部１ａを大きくする必要があり近時の小型化傾向に適さないものとなる。また、Ｃ＞５Ｄ／６の場合、突出部１ｃで吸収される応力が小さくなり、ネジ止め固定時に基体１に歪みが生じ易くなる。
【００３５】
また、図３の構成において、図４にネジ止め部１ａの断面図で示すように、ネジ止め部１ａの上面の貫通穴の開口の周囲に全周にわたって溝が形成されていてもよい。この場合、突出部１ｃがより変形して応力を緩和し易くなる。さらに、図５にネジ止め部１ａの断面図で示すように、段差の側面と天井面との間に凹んだ曲面状の溝を全周にわたって形成してもよい。これにより、突出部１ｃがより変形して応力を緩和し易くなる。また、図６にネジ止め部１ａの平面図で示すように、突出部１ｃの上下面を貫通するスリット状の切り込みを複数、等間隔で形成してもよい。これにより、突出部１ｃがより変形して応力を緩和し易くなる。なお、これらを組み合わせてもよい。
【００３６】
上記構成のパッケージの載置部１ｂに半導体素子５を載置固定した後、半導体素子５の電極と入出力端子４のメタライズ配線層の枠体３内側の部位とをボンディングワイヤで電気的に接続し、枠体３の上面にＦｅ−Ｎｉ−Ｃｏ合金等から成る蓋体７をシーム溶接法等の溶接法により接合し、半導体素子５を気密に封止することにより、製品としての半導体装置となる。
【００３７】
また、半導体素子５がＬＤ，ＰＤ等の光半導体素子である場合には、枠体３の側部に光ファイバ８を挿通させるための貫通孔３ｂが設けられ、半導体素子５の光入出力端面と光ファイバ８の光入出力端面が対向するようにして、貫通孔３ｂに石英等の透光性材料からなる光ファイバ８がロウ付け等により挿通固定される。
【００３８】
そして、ネジ止め部１ａの貫通穴にネジを挿入し基体１を外部電気回路基板にネジ止め固定し、リード端子６を外部電気回路に接続することにより、半導体装置内部に収納した半導体素子５が外部電気回路に電気的に接続され、半導体素子５が電気信号で作動することとなる。
【００３９】
なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは可能である。
【００４０】
【発明の効果】
本発明の半導体素子収納用パッケージは、上側主面に半導体素子が載置される載置部が形成されるとともに四隅部に外側に延出したネジ止め部がそれぞれ形成された四角形状の金属製の基体と、この基体の上側主面の外周部に載置部を囲繞するように取着され、側部に貫通孔または切欠きから成る入出力端子の取付部が形成された金属製の枠体と、取付部に嵌着された、枠体の内外を電気的に導通するメタライズ配線層を有するセラミックス製の入出力端子とを具備しており、前記ネジ止め部は、ネジが挿通される上下面間を貫通する貫通穴が、横断面形状が円形状で、かつ下側よりも上側が小径とされて形成されていることにより、半導体素子収納用パッケージを外部電気回路基板にネジ止め固定した場合に発生する歪を生じさせようとする応力をネジ止め部における貫通穴の上側の突出部が適度に変形することによって吸収し、基体に伝わり難くすることができる。その結果、入出力端子にクラック等の破損が生じるのを有効に抑制でき、半導体素子収納用パッケージ内部を気密に保持することができる。また、半導体素子が光半導体素子である場合、半導体素子と光ファイバとの光学的な結合の低下も有効に抑制できる。
【００４１】
また、ネジ止め部は基体を延出して形成されていることから、枠体と基体とを高温でロウ付けした際にネジ止め部が変形することはなく、基体を外部電気回路基板に良好に密着させてネジ止め固定することができ、半導体素子から発生する熱を外部に効率よく放散させることもできる。その結果、半導体素子の温度の上昇を抑え、半導体素子を正常に作動させ得る。
【００４２】
本発明の半導体装置は、上記本発明の半導体素子収納用パッケージと、載置部に載置固定されるとともに入出力端子に電気的に接続された半導体素子と、枠体の上面に接合された蓋体とを具備したことにより、上記本発明の半導体素子収納用パッケージを用いた信頼性の高いものとなる。
【図面の簡単な説明】
【図１】本発明の半導体素子収納用パッケージについて実施の形態の例を示す平面図である。
【図２】図１の半導体素子収納用パッケージの断面図である。
【図３】本発明の半導体素子収納用パッケージにおけるネジ止め部の拡大断面図である。
【図４】本発明の半導体素子収納用パッケージにおけるネジ止め部について実施の形態の他の例を示す断面図である。
【図５】本発明の半導体素子収納用パッケージにおけるネジ止め部について実施の形態の他の例を示す断面図である。
【図６】本発明の半導体素子収納用パッケージにおけるネジ止め部について実施の形態の他の例を示す平面図である。
【図７】従来の半導体素子収納用パッケージの平面図である。
【図８】図７の半導体素子収納用パッケージの断面図である。
【符号の説明】
１：基体
１ａ：ネジ止め部
１ｂ：載置部
１ｃ：突出部
３：枠体
４：入出力端子
５：半導体素子[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor element housing package for housing a semiconductor element and a semiconductor device.
[0002]
[Prior art]
FIGS. 7 and 8 show a conventional semiconductor element housing package (hereinafter, also referred to as a package) for housing a semiconductor element. FIG. 7 is a plan view of the package, and FIG. 8 is a sectional view of the package of FIG. In these figures, reference numeral 21 denotes a rectangular base, 23 denotes a frame, and 24 denotes input / output terminals. These base 21, frame 23 and input / output terminals 24 are containers for accommodating the semiconductor element 25 in the internal space. Is basically configured.
[0003]
The base 21 is made of a metal such as an iron (Fe) -nickel (Ni) -cobalt (Co) alloy or copper (Cu) -tungsten (W). A mounting portion 21b for mounting a semiconductor element 25 such as an element (IC, LSI), a semiconductor laser (LD), or a photodiode (PD) is provided. In addition, a screwing portion 21a formed of an overhanging portion provided to extend outward at four corners of the base 21 is provided. The base 21 is screwed and fixed to an external electric circuit board by inserting a screw into a through hole of the screwing portion 21a.
[0004]
On the outer peripheral portion of the upper main surface of the base 21, a frame 23 joined so as to surround the mounting portion 21b is provided upright. The frame 23 is made of a metal such as an Fe—Ni—Co alloy, and is brazed to the base 21 via a brazing material such as silver (Ag) brazing.
[0005]
The frame 23 has a mounting portion for mounting an input / output terminal 24 formed of a through hole or a notch on a side portion. Then, the input / output terminal 24 made of ceramics such as alumina (Al ₂ O ₃ ) sintered body is brazed to the mounting portion of the frame 23 via a brazing material such as Ag brazing.
[0006]
The input / output terminal 24 has a rectangular flat plate portion having a metallized wiring layer that conducts inside and outside of the frame 23 formed from one side to the other side facing the upper surface, and a part of the metallized wiring layer on the upper surface of the flat plate portion. The metallized wiring layer on the outer surface side of the frame 23 of the input / output terminal 24 has a lead terminal 26 made of a metal such as an Fe-Ni-Co alloy, and an Ag solder. The package is manufactured by being electrically connected via a brazing material such as (for example, see Patent Document 1 below).
[0007]
After the semiconductor element 25 is mounted and fixed on the mounting portion 21b of the package having such a configuration, the electrodes of the semiconductor element 25 and the metallized wiring layer on the inner surface side of the frame 23 of the input / output terminal 24 are electrically connected by bonding wires. The semiconductor device as a product is obtained by connecting and joining a lid 27 made of an Fe-Ni-Co alloy or the like to the upper surface of the frame 23 by a welding method such as a seam welding method. Then, a screw is inserted into the through hole of the screwing portion 21a, and the base 21 is screwed and fixed to the external electric circuit board. In this semiconductor device, when the lead terminal 26 is connected to an external electric circuit and the semiconductor element 25 is electrically connected to the external electric circuit, the semiconductor element 25 operates with a high-frequency signal.
[0008]
When the semiconductor element 25 is an optical semiconductor element such as an LD or a PD, a through hole for inserting the optical fiber 28 is provided on a side portion of the frame 23 so that the light input / output end face of the semiconductor element 25 is connected to the optical input / output end face. The optical fiber 28 is inserted and fixed in the through hole of the frame 23 so that the light input / output end faces of the optical fiber 28 face each other.
[0009]
As described in Patent Document 2 below, as a package for accommodating such an optical semiconductor element, a screwing portion 21a is made of a material having a lower longitudinal elastic modulus than the base 21 and the frame 23, for example, Cu, There has been proposed a configuration in which the base 21 is formed of a Cu alloy, aluminum (Al), an Al alloy, or the like, and is brazed to the base 21. As a result, even if the screwed portion 21a is fixed by screwing, the screwed portion 21a is mainly deformed and deformation of the base 21 is suppressed, and the light input / output end faces of the semiconductor element 25 and the optical fiber 28 face each other. Can be maintained.
[0010]
[Patent Document 1]
Japanese Patent Application Laid-Open No. H11-54657 [Patent Document 2]
JP-A-6-82659
[Problems to be solved by the invention]
However, in the configuration disclosed in Patent Document 1, when the base 21 is screwed and fixed to an external electric circuit board, the base 21 is distorted due to the screwing, and the input / output terminals 24 are not damaged by cracks or the like. This causes a problem that the inside of the package cannot be kept airtight.
[0012]
Further, when the semiconductor element 25 is an optical semiconductor element, the position of the optical fiber 28 is shifted due to the distortion of the base 21 caused by screwing, and the semiconductor element 25 and the optical fiber 28 cannot be optically coupled. Also, there has been a problem that optical signals cannot be input / output.
[0013]
In the configuration shown in Patent Document 2, the annealing temperature of Cu constituting the screwed portion 21a is about 450 ° C. and the annealing temperature of Al is about 400 ° C., so that the screwed portion 21a is heated at about 800 ° C. At the time of Ag brazing to the base 21, the screwed portion 21a is annealed, and the screwed portion 21a is deformed. When the base 21 is screwed and fixed to the external electric circuit board with the screwed portion 21a deformed in this manner, the base 21 cannot be in close contact with the external electric circuit board and a gap is generated, and the heat generated from the semiconductor element 25 is transferred to the outside. However, there is a problem that the semiconductor element 25 does not operate normally because the temperature of the semiconductor element 25 rises.
[0014]
Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and an object of the present invention is to make the package hardly distorted, keep the inside of the package airtight, and improve the operability of the semiconductor element. It is in.
[0015]
[Means for Solving the Problems]
The semiconductor element housing package according to the present invention is a square metal package in which a mounting portion on which a semiconductor element is mounted is formed on an upper main surface, and screw-out portions extending outward at four corners are formed. And a metal member which is attached to an outer peripheral portion of the upper main surface of the substrate so as to surround the mounting portion, and has a mounting portion for an input / output terminal formed of a through hole or a cutout on a side portion. And a ceramic input / output terminal having a metallized wiring layer that is electrically connected to the inside and outside of the frame, which is fitted to the mounting portion, and the screwing portion includes a screw. Is characterized in that a through-hole penetrating between the upper and lower surfaces through which is inserted has a circular cross-sectional shape, and has a smaller diameter on the upper side than on the lower side.
[0016]
In the package for accommodating a semiconductor element of the present invention, the screwing portion is formed such that a through-hole penetrating between upper and lower surfaces into which screws are inserted has a circular cross-sectional shape and a smaller diameter at the upper side than at the lower side. By doing so, the stress that tends to cause distortion generated when the semiconductor element housing package is screwed and fixed to the external electric circuit board is appropriately deformed by the protrusion above the through hole in the screwed portion. This makes it possible to absorb and make it difficult to transmit to the substrate. As a result, the occurrence of damage such as cracks in the input / output terminals can be effectively suppressed, and the inside of the semiconductor element housing package can be kept airtight. Further, when the semiconductor element is an optical semiconductor element, it is possible to effectively suppress a decrease in optical coupling between the semiconductor element and the optical fiber.
[0017]
Further, since the screwed portion is formed by extending the base, the screwed portion is not deformed when the frame body and the base are brazed at a high temperature, and the base is favorably attached to the external electric circuit board. The heat generated from the semiconductor element can be efficiently dissipated to the outside by being closely attached and fixed by screws. As a result, an increase in the temperature of the semiconductor element can be suppressed, and the semiconductor element can operate normally.
[0018]
The semiconductor device of the present invention includes the semiconductor element housing package of the present invention, a semiconductor element mounted and fixed to the mounting portion and electrically connected to the input / output terminal, and an upper surface of the frame body. And a joined lid.
[0019]
With the above configuration, the semiconductor device of the present invention has high reliability using the semiconductor element housing package of the present invention.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
The package for housing a semiconductor element of the present invention will be described in detail below. FIG. 1 is a plan view showing an example of an embodiment of the package of the present invention, and FIG. 2 is a sectional view of the package of FIG. FIG. 3 is a sectional view of a screwed portion in the package of the present invention. In these figures, reference numeral 1 denotes a base, 3 denotes a frame, 4 denotes an input / output terminal, and 6 denotes a lead terminal. The base 1, the frame 3, and the input / output terminals 4 constitute a container for housing the semiconductor element 5 inside. Basically configured.
[0021]
In the package of the present invention, as shown in FIGS. 1 to 3, a mounting portion 1b on which the semiconductor element 5 is mounted is formed on the upper main surface, and a screwing portion 1a extending outward at four corners is provided. A rectangular metal base 1 formed and an input / output comprising a through-hole or a notch at a side portion attached to the outer peripheral portion of the upper main surface of the base 1 so as to surround the mounting portion 1b. A metal input / output terminal 4 having a metal frame 3 on which a mounting portion 3a of a terminal 4 is formed, and a metallized wiring layer fitted to the mounting portion 3a and electrically conducting inside and outside of the frame 3 The screwing portion 1a is formed such that a through-hole penetrating between the upper and lower surfaces through which the screw is inserted has a circular cross-sectional shape and a smaller diameter on the upper side than on the lower side. I have.
[0022]
The substrate 1 of the present invention is made of a metal such as an Fe-Ni-Co alloy or Cu-W, and the ingot is subjected to a conventionally known metal working method such as rolling or punching, or injection molding and cutting. It is manufactured in a predetermined shape by applying. A mounting portion 1 b on which the semiconductor element 5 is mounted is provided on the upper main surface of the base 1. The base 1 also functions as a heat radiating plate for radiating heat generated when the semiconductor element 5 operates to the outside. On the surface of the base 1, a Ni layer having a thickness of 0.5 to 9 μm or a gold layer having a thickness of 0.5 to 5 μm It is preferable that a metal layer composed of the (Au) layer is applied by a plating method or the like. Further, in order to efficiently radiate the heat of the semiconductor element 5 to the outside, the semiconductor element 5 is mounted and fixed on the mounting portion 1b while being mounted on a thermoelectric cooling element (not shown) such as a Peltier element. Is also good.
[0023]
The base 1 has a quadrangular shape, and has screwed portions 1a extending outward at four corners. When the optical fiber 8 is fixed to the frame 3, the screwing portion 1 a is provided on the side of the frame 3 to which the optical fiber 8 is fixed and on the side opposite to this surface, as shown in FIG. 1. It should be formed. Thereby, it is possible to suppress the stress generated when the package is screwed and fixed to the external electric circuit board from being applied to the side surface of the frame 3 to which the optical fiber 8 is fixed. That is, the bending stress tends to be the largest at a portion located between the two screwing portions 1a extending in opposite directions, whereas the two screwing portions 1a on the same side surface of the frame body 3 have the same bending stress. The bending stress is small in the portion located between them, and by fixing the optical fiber 8 in the portion where the bending stress is small, the displacement of the optical fiber 8 can be effectively suppressed.
[0024]
When the optical fiber 8 is not fixed to the frame 3, the screwing portion 1a is preferably formed on the side of the frame 3 where the input / output terminal 4 is fitted. As a result, the stress applied to the input / output terminal 4 is increased by fitting the input / output terminal 4 at a portion located between the two screwing portions 1a on the same side surface of the frame 3, that is, a portion having a small bending stress. Can be reduced to effectively suppress the occurrence of cracks in the input / output terminal 4.
[0025]
Further, a frame 3 joined via a brazing material such as Ag brazing so as to surround the mounting portion 1b is provided upright on the outer peripheral portion of the upper main surface of the base 1, and the frame 3 is A space for accommodating the semiconductor element 5 is formed inside the base 1 together with the base 1. The frame body 3 is a frame-shaped body made of a metal such as an Fe-Ni-Co alloy or Cu-W and has a rectangular shape in a plan view, and a conventionally known metal working method such as rolling or punching is applied to the ingot. It is manufactured into a predetermined shape by performing injection molding and cutting, and is connected to the base 1 via a brazing material such as Ag brazing. On the surface of the frame 3, a Ni layer having a thickness of 0.5 to 9 μm or a thickness of 0.5 to 9 μm is formed in order to prevent oxidation corrosion and improve the fitting of the input / output terminals 4 by brazing or the like. It is preferable that a metal layer made of a 5 μm Au layer be applied by plating or the like.
[0026]
The frame 3 has a mounting portion 3a for mounting an input / output terminal 4 formed of a through hole or a notch on a side portion. Then, the input / output terminal 4 is brazed to the mounting portion 3a of the frame 3 via a brazing material such as Ag brazing.
[0027]
The input / output terminal 4 has a rectangular flat plate portion having a metallized wiring layer that conducts inside and outside of the frame 3 formed from one side to the other side facing the upper surface, and a part of the metallized wiring layer on the upper surface of the flat plate portion. A rectangular parallelepiped standing wall portion interposed therebetween is joined, and is brazed to a mounting portion 3a provided on a side portion of the frame 3 via a brazing material such as Ag brazing.
[0028]
The flat plate portion and the vertical wall portion constituting the input / output terminal 4 are made of ceramics such as an aluminum oxide (Al ₂ O ₃ ) -based sintered body and an aluminum nitride (AlN) -based sintered body, and are formed by punching a ceramic green sheet. Then, it is formed by laminating and firing ceramic green sheets in multiple layers.
[0029]
The metallized wiring layer provided on the upper surface of the flat plate portion of the input / output terminal 4 is formed by firing a conductive paste such as W, Mo, Mn, and the like. Lead terminals 6 made of a metal such as an alloy are electrically connected through a brazing material such as an Ag brazing material.
[0030]
In the package of the present invention, as shown in FIG. 3, the screwing portion 1a has a circular through-hole formed between the upper and lower surfaces into which the screws are inserted, and has a circular cross-sectional shape, and the upper side is smaller in diameter than the lower side. It is formed. As a result, the stress that tends to generate a distortion generated when the package is fixed to the external electric circuit board by screwing is absorbed by appropriately deforming the protrusion 1c above the through hole in the screwing portion 1a, It can be hardly transmitted to the base 1. As a result, it is possible to effectively prevent the input / output terminals 4 from being damaged such as cracks, and to keep the inside of the package airtight. Further, when the semiconductor element 5 is an optical semiconductor element, it is possible to effectively suppress a decrease in optical coupling between the semiconductor element 5 and the optical fiber 8.
[0031]
Further, since the screw portion 1a is formed by extending the base 1, the screw portion 1a is not deformed when the frame 3 and the base 1 are brazed at a high temperature, and the base 1 is externally mounted. It can be tightly fixed to the electric circuit board by screwing, and the heat generated from the semiconductor element 5 can be efficiently radiated to the outside. As a result, a rise in the temperature of the semiconductor element 5 can be suppressed, and the semiconductor element 5 can operate normally.
[0032]
The through hole in the screwing portion 1a has a circular shape such as a circular shape or an elliptical shape, and a step may be formed on the inner peripheral surface as shown in FIG. In this case, the protrusion 1c above the through hole can be largely deformed with the step portion as a fulcrum, and the effect of relaxing the stress applied to the protrusion 1c is increased. Further, the through hole may be formed such that the inner diameter changes smoothly from the lower side to the upper side. In this case, the strength of the protruding portion 1c can be increased while having a stress relaxation effect due to the deformation of the protruding portion 1c, and breakage that easily occurs due to the deformation of the protruding portion 1c can be effectively suppressed.
[0033]
The thickness A of the protruding portion 1c (FIG. 3) is preferably B / 5 ≦ A ≦ 3B / 5, where B is the thickness of the screwing portion 1a, and when the screwing portion 1a is fixed by screwing. In addition, the stress that tends to cause strain in the base 1 is absorbed by appropriately deforming the protruding portion 1c, and it is possible to effectively prevent the input / output terminal 4 from being damaged such as a crack. In the case of A <B / 5, the protruding portion 1c is greatly deformed, so that the protruding portion 1c is easily broken, and it is difficult to fix the base body 1 by screwing. In the case of A> 3B / 5, the protrusion 1c is hardly deformed, the stress absorbed by the protrusion 1c is reduced, and the base 1 is easily distorted at the time of fixing by screwing.
[0034]
When the inner diameter C on the upper side of the through hole in the screwing portion 1a (FIG. 3) is D, the inner diameter on the lower side is preferably D / 3 ≦ C ≦ 5D / 6. When fixed by screwing, it is possible to effectively prevent the input / output terminal 4 from being damaged by absorbing a stress that would cause the substrate 1 to be distorted. In the case of C <D / 3, the protruding portion 1c is greatly deformed, and the protruding portion 1c is easily broken, and the screwing portion 1a needs to be large, which is not suitable for recent miniaturization tendency. When C> 5D / 6, the stress absorbed by the protruding portion 1c is small, and the base 1 is likely to be distorted at the time of fixing by screwing.
[0035]
In addition, in the configuration of FIG. 3, as shown in a cross-sectional view of the screwing portion 1a in FIG. 4, a groove may be formed all around the opening of the through hole on the upper surface of the screwing portion 1a. In this case, the protruding portion 1c is more deformed, and the stress is easily relieved. Further, as shown in a sectional view of the screwing portion 1a in FIG. 5, a curved groove may be formed over the entire circumference between the side surface of the step and the ceiling surface. As a result, the protruding portion 1c is more deformed and the stress is easily alleviated. Further, as shown in a plan view of the screwing portion 1a in FIG. 6, a plurality of slit-shaped cuts penetrating the upper and lower surfaces of the projecting portion 1c may be formed at equal intervals. As a result, the protruding portion 1c is more deformed and the stress is easily alleviated. Note that these may be combined.
[0036]
After the semiconductor element 5 is mounted and fixed on the mounting portion 1b of the package having the above configuration, the electrodes of the semiconductor element 5 and the portion of the metallized wiring layer of the input / output terminal 4 inside the frame 3 are electrically connected by bonding wires. Then, a lid 7 made of an Fe-Ni-Co alloy or the like is joined to the upper surface of the frame 3 by a welding method such as a seam welding method, and the semiconductor element 5 is hermetically sealed, so that a semiconductor device as a product can be obtained. Become.
[0037]
When the semiconductor element 5 is an optical semiconductor element such as an LD or a PD, a through hole 3b for inserting the optical fiber 8 is provided on a side portion of the frame 3, and an optical input / output end face of the semiconductor element 5 is provided. The optical fiber 8 made of a translucent material such as quartz is inserted and fixed in the through hole 3b by brazing or the like so that the light input / output end faces of the optical fiber 8 and the optical fiber 8 face each other.
[0038]
Then, a screw is inserted into the through hole of the screwing portion 1a, the base 1 is screwed and fixed to the external electric circuit board, and the lead terminal 6 is connected to the external electric circuit, whereby the semiconductor element 5 housed inside the semiconductor device is formed. The semiconductor element 5 is electrically connected to an external electric circuit, and operates by an electric signal.
[0039]
Note that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the spirit of the present invention.
[0040]
【The invention's effect】
The semiconductor element housing package according to the present invention is a square metal package in which a mounting portion on which a semiconductor element is mounted is formed on an upper main surface, and screw-out portions extending outward at four corners are formed. And a metal frame attached to the outer peripheral portion of the upper main surface of the base so as to surround the mounting portion, and formed with a mounting portion for an input / output terminal formed of a through hole or a cutout on a side portion. Body, and a ceramic input / output terminal having a metallized wiring layer electrically connected between the inside and outside of the frame body, which is fitted to the mounting portion, and the screw portion is inserted with a screw. The through hole that passes between the upper and lower surfaces is formed with a circular cross section and a smaller diameter on the upper side than on the lower side, so that the semiconductor element storage package is fixed to the external electric circuit board with screws. Try to cause the distortion that occurs when Stress is absorbed by the protruding portion of the upper through-holes in the screw portion is appropriately deformed, it can be easily transferred to the substrate. As a result, the occurrence of damage such as cracks in the input / output terminals can be effectively suppressed, and the inside of the semiconductor element housing package can be kept airtight. Further, when the semiconductor element is an optical semiconductor element, a decrease in optical coupling between the semiconductor element and the optical fiber can be effectively suppressed.
[0041]
Further, since the screwed portion is formed by extending the base, the screwed portion is not deformed when the frame body and the base are brazed at a high temperature, and the base is favorably attached to the external electric circuit board. The heat generated from the semiconductor element can be efficiently dissipated to the outside by being closely attached and fixed by screws. As a result, an increase in the temperature of the semiconductor element can be suppressed, and the semiconductor element can operate normally.
[0042]
The semiconductor device of the present invention is joined to the semiconductor element housing package of the present invention, the semiconductor element mounted and fixed on the mounting portion and electrically connected to the input / output terminal, and the upper surface of the frame. By providing the lid, the semiconductor device housing package of the present invention is highly reliable.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of an embodiment of a package for housing a semiconductor element of the present invention.
FIG. 2 is a cross-sectional view of the semiconductor device housing package of FIG. 1;
FIG. 3 is an enlarged cross-sectional view of a screwing portion of the semiconductor device housing package of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the screw fixing portion in the semiconductor element housing package of the present invention.
FIG. 5 is a cross-sectional view showing another example of the embodiment of the screw fixing portion in the semiconductor element housing package of the present invention.
FIG. 6 is a plan view showing another example of the embodiment of the screw fixing portion in the semiconductor element housing package of the present invention.
FIG. 7 is a plan view of a conventional semiconductor element storage package.
FIG. 8 is a cross-sectional view of the semiconductor device housing package of FIG. 7;
[Explanation of symbols]
1: base 1a: screwed portion 1b: mounting portion 1c: projecting portion 3: frame body 4: input / output terminal 5: semiconductor element

Claims

A mounting portion on which the semiconductor element is mounted is formed on the upper main surface, and a rectangular metal base formed with screw-out portions extending outward at four corners, respectively; A metal frame attached to an outer peripheral portion of the surface so as to surround the mounting portion and having a mounting portion for an input / output terminal formed of a through hole or a cutout on a side portion; A ceramic input / output terminal having a metallized wiring layer electrically connected between the inside and outside of the frame body, wherein the screwed portion penetrates between upper and lower surfaces through which screws are inserted. A semiconductor element storage package, characterized in that the through hole is formed with a circular cross section and a smaller diameter on the upper side than on the lower side.

2. The package for storing a semiconductor element according to claim 1, a semiconductor element mounted and fixed to the mounting portion and electrically connected to the input / output terminal, and a lid bonded to an upper surface of the frame. A semiconductor device comprising: