JP4931851B2 - Package and electronic equipment - Google Patents

Package and electronic equipment Download PDF

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Publication number
JP4931851B2
JP4931851B2 JP2008103226A JP2008103226A JP4931851B2 JP 4931851 B2 JP4931851 B2 JP 4931851B2 JP 2008103226 A JP2008103226 A JP 2008103226A JP 2008103226 A JP2008103226 A JP 2008103226A JP 4931851 B2 JP4931851 B2 JP 4931851B2
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Prior art keywords
input
output terminal
buffer member
container body
package
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JP2008294418A (en
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猛夫 佐竹
亮太 松本
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Semiconductor Lasers (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

本発明は、パッケージおよび電子装置に関するものである。   The present invention relates to a package and an electronic device.

従来、電子部品収納用パッケージには、金属製の容器の周壁に開口部を設け、この開口部にメタライズ回路を有したセラミックスからなる入出力端子を取り付けたものがあった。このような電子部品収納用パッケージとして、開口部内周面の厚みを開口部周囲のパッケージを構成する壁部の厚みよりも薄く形成したものが知られている（例えば、特許文献１参照）。
実開平４−２５２５３号公報 Conventionally, there has been an electronic component storage package in which an opening is provided in a peripheral wall of a metal container, and an input / output terminal made of ceramics having a metallized circuit is attached to the opening. As such an electronic component storage package, a package in which the thickness of the inner peripheral surface of the opening is formed thinner than the thickness of the wall portion constituting the package around the opening is known (for example, see Patent Document 1).
Japanese Utility Model Publication No. 4-25253

しかしながら、上記従来の電子部品収納用パッケージにおいては、容器に直接入出力端子が接合される構成であるため、容器の熱膨張係数と入出力端子の熱膨張係数との熱膨張係数差が大きい場合、入出力端子を容器に接合する際に入出力端子に容器との熱収縮差による熱応力が大きく作用し易く、入出力端子にクラック等の破損が生じてしまい、電子部品収納用パッケージ内部の気密を保持できなくなるという問題点が発生していた。   However, in the conventional electronic component storage package, since the input / output terminals are directly joined to the container, the difference between the thermal expansion coefficients of the container and the input / output terminals is large. When the input / output terminals are joined to the container, the thermal stress due to the thermal contraction difference between the input / output terminals and the container tends to be large, and the input / output terminals are damaged such as cracks. There was a problem that the airtightness could not be maintained.

本発明は上記問題点に鑑み案出されたもので、その目的は内部の気密信頼性が高いパッケージおよび電子装置を提供することにある。   The present invention has been devised in view of the above problems, and an object of the present invention is to provide a package and an electronic device having high internal airtight reliability.

上記の課題を解決するために、請求項１のパッケージは、キャビティを有する基体の壁部に前記キャビティに通じる開口部を有した容器体と、前記開口部に挿入され、前記容器体と異なる熱膨張係数を有したセラミックスから成る絶縁部材に貫通する線路導体が形成された入出力端子と、前記容器体の熱膨張係数と前記入出力端子の熱膨張係数との間の熱膨張係数を有し、前記入出力端子を前記開口部の内周に沿って囲むように、前記開口部の内面と前記入出力端子との間に配された緩衝部材と、を備えてなるものである。

In order to solve the above problems, package according to claim 1 includes a container body having an opening communicating with the cavity in the wall of the base body having a cavity, is inserted into the opening, heat different from the container body An input / output terminal having a line conductor formed through an insulating member made of ceramics having an expansion coefficient, and a thermal expansion coefficient between the thermal expansion coefficient of the container body and the thermal expansion coefficient of the input / output terminal. And a buffer member disposed between the inner surface of the opening and the input / output terminal so as to surround the input / output terminal along the inner periphery of the opening.

また、請求項２の発明は、請求項１に記載のパッケージであって、前記緩衝部材は金属製であることが好ましい。   The invention according to claim 2 is the package according to claim 1, wherein the buffer member is preferably made of metal.

また、請求項３の発明は、請求項１又は請求項２に記載のパッケージであって、前記緩衝部材は板状であり、前記入出力端子と前記容器体との間を塞ぐように形成され、前記緩衝部材の少なくとも一部に曲面を有してなることが好ましい。   The invention according to claim 3 is the package according to claim 1 or 2, wherein the buffer member is plate-shaped and is formed so as to block between the input / output terminal and the container body. It is preferable that at least a part of the buffer member has a curved surface.

また、請求項４の発明は、請求項１乃至請求項３のいずれかに記載のパッケージであって、前記開口部の前記内面に設けられた段差部に、板状の前記緩衝部材が載置されてなることが好ましい。   A fourth aspect of the present invention is the package according to any one of the first to third aspects, wherein the plate-shaped buffer member is placed on a step portion provided on the inner surface of the opening. It is preferable to be made.

また、請求項５の発明は、請求項１乃至請求項４のいずれかに記載のパッケージであって、前記入出力端子と前記緩衝部材との間、又は前記緩衝部材と前記開口部の内面との間に、ロウ材のフィレットが形成されてなることが好ましい。   The invention according to claim 5 is the package according to any one of claims 1 to 4, wherein the package is between the input / output terminal and the buffer member or between the buffer member and the inner surface of the opening. It is preferable that a braze fillet is formed between them.

また、請求項６の発明は、請求項４又は請求項５に記載のパッケージであって、前記段差部において前記壁部の厚み方向の段差は、前記緩衝部材の厚みよりも大きいことが好ましい。   The invention according to claim 6 is the package according to claim 4 or claim 5, wherein in the stepped portion, the step in the thickness direction of the wall portion is preferably larger than the thickness of the buffer member.

また、請求項７の発明は、請求項１乃至請求項６のいずれかに記載のパッケージであって、前記入出力端子は前記容器体の外表面を境にその内外に挿通され、前記容器体の内部側前記入出力端子の長さは、前記容器体の外部側前記入出力端子の長さよりも長いことが好ましい。   The invention according to claim 7 is the package according to any one of claims 1 to 6, wherein the input / output terminal is inserted into and out of the outer surface of the container body, and the container body The length of the input / output terminal on the inner side is preferably longer than the length of the input / output terminal on the outer side of the container body.

本発明に係る電子装置は、請求項１乃至請求項７のいずれかに記載のパッケージを用いた電子装置であって、前記パッケージに収納され前記入出力端子と電気的に接続された電子部品を備えたものである。   An electronic device according to the present invention is an electronic device using the package according to any one of claims 1 to 7, wherein an electronic component housed in the package and electrically connected to the input / output terminal is provided. It is provided.

本発明のパッケージは、キャビティを有する基体の壁部に前記キャビティに通じる開口部を有した容器体と、前記容器体と異なる熱膨張係数を有し、前記容器体の開口部に挿入される入出力端子と、前記容器体の熱膨張係数と前記入出力端子の熱膨張係数との間の熱膨張係数を有し、前記入出力端子を前記開口部の内周に沿って囲むように、前記開口部の内面と前記入出力端子との間に配された緩衝部材と、を備えてなることから、パッケージ製造時や、電子部品がパッケージ内部に搭載され電子装置内部で動作する時に、容器体や入出力端子に熱が加わった場合であっても、容器体および入出力端子の熱膨張係数の差異から両者に加わる熱応力を緩衝部材によって低減させることができる。それゆえ、例えば入出力端子の熱膨張係数の方が容器体の熱膨張係数よりも小さい場合、容器体の熱膨張によって入出力端子が押圧されて入出力端子にクラック等の破損が生じることを抑制し、パッケージの気密信頼性を向上させることができる。また、前記緩衝部材は孔部を有し、該孔部に前記入出力端子が挿入されてなることから、容器体と入出力端子との間の周囲に緩衝部材を有する構造となるため、一層両者に加わる熱応力を低減させることができる。   The package of the present invention has a container body having an opening communicating with the cavity on the wall portion of the base body having the cavity, and has a different thermal expansion coefficient from the container body, and is inserted into the opening of the container body. The output terminal has a thermal expansion coefficient between the thermal expansion coefficient of the container body and the thermal expansion coefficient of the input / output terminal, and surrounds the input / output terminal along the inner periphery of the opening. And a buffer member disposed between the inner surface of the opening and the input / output terminal. Therefore, when the package is manufactured or when the electronic component is mounted inside the package and operates inside the electronic device, the container body Even when heat is applied to the input / output terminal, the thermal stress applied to the container body and the input / output terminal due to the difference in coefficient of thermal expansion can be reduced by the buffer member. Therefore, for example, when the coefficient of thermal expansion of the input / output terminal is smaller than the coefficient of thermal expansion of the container body, the input / output terminal is pressed by the thermal expansion of the container body, and the input / output terminal is damaged such as a crack. It is possible to suppress and improve the hermetic reliability of the package. In addition, since the buffer member has a hole, and the input / output terminal is inserted into the hole, the buffer member has a structure between the container body and the input / output terminal. The thermal stress applied to both can be reduced.

また、前記緩衝部材は金属製であることが好ましく、入出力端子に形成された線路導体を伝送する高周波信号の特性インピーダンスを所定値に整合し易く、入出力端子における接地電位を強化することができる。それゆえ、入出力端子において伝送損失が生ずることを抑制することができる。   Further, the buffer member is preferably made of metal, and it is easy to match the characteristic impedance of the high-frequency signal transmitted through the line conductor formed on the input / output terminal to a predetermined value, and the ground potential at the input / output terminal can be strengthened. it can. Therefore, it is possible to suppress the occurrence of transmission loss at the input / output terminals.

また、前記緩衝部材は板状であり、前記入出力端子と前記容器体との間を塞ぐように形成され、前記緩衝部材の少なくとも一部に曲面を有してなることが好ましく、パッケージに加わる応力を当該緩衝部材の曲面で分散させて保持できるためパッケージが変形することを抑制できる。

 The front Symbol buffer member has a plate shape, and the formed so as to close between the input and output terminal and the container body, is preferably made with a curved surface to at least a portion of the cushioning member, the package Since the applied stress can be dispersed and held on the curved surface of the buffer member, deformation of the package can be suppressed.

また、前記開口部の前記内面に設けられた段差部に、板状の前記緩衝部材が載置されてなることが好ましく、当該段差部に緩衝部材を載置する際に位置合わせが容易となり、生産性を向上させたパッケージを提供することができる。   In addition, it is preferable that the plate-like buffer member is placed on the step portion provided on the inner surface of the opening, and positioning becomes easier when the buffer member is placed on the step portion, A package with improved productivity can be provided.

また、前記入出力端子と前記緩衝部材との間、又は前記緩衝部材と前記開口部の内面との間に、ロウ材のフィレットが形成されてなることが好ましく、ロウ材のフィレットにより、入出力端子と緩衝部材との間、又は緩衝部材と容器体との間を気密に接合させることができる。   In addition, it is preferable that a braze fillet is formed between the input / output terminal and the buffer member or between the buffer member and the inner surface of the opening. The terminal and the buffer member or the buffer member and the container body can be airtightly joined.

また、前記段差部において前記壁部の厚み方向の段差は、前記緩衝部材の厚みよりも大きいことが好ましく、上述した生産性をさらに高めたパッケージを提供することができる。また、緩衝部材の厚みを薄くすることで緩衝部材が変形し易くなり、パッケージで生じる熱応力を緩衝部材の変形によって緩和させることができる。   Moreover, it is preferable that the level | step difference of the thickness direction of the said wall part in the said level | step-difference part is larger than the thickness of the said buffer member, and can provide the package which raised the productivity mentioned above further. Further, the buffer member can be easily deformed by reducing the thickness of the buffer member, and the thermal stress generated in the package can be reduced by the deformation of the buffer member.

また、前記入出力端子は前記容器体の外表面を境にその内外に挿通され、前記容器体の内部側前記入出力端子の長さは、前記容器体の外部側前記入出力端子の長さよりも長いことが好ましく、ボンディングワイヤや導線等の電気的接続手段を介して入出力端子の容器体内部側と容器体外部側とを電気的に接続する際に、作業性を向上させることができる。   The input / output terminal is inserted into and out of the outer surface of the container body, and the length of the input / output terminal on the inner side of the container body is longer than the length of the input / output terminal on the outer side of the container body. It is also preferable that the length is longer, and workability can be improved when the container inner side and the container outer side of the input / output terminal are electrically connected via an electrical connection means such as a bonding wire or a conductive wire. .

また、前記パッケージに収納され前記入出力端子と電気的に接続された電子部品を備えた電子装置とすることで、入出力端子にクラック等の破損が生じることを抑制し、パッケージの気密信頼性を向上させた電子装置を提供することができる。   In addition, by providing an electronic device including an electronic component housed in the package and electrically connected to the input / output terminal, it is possible to suppress the occurrence of breakage such as a crack in the input / output terminal and to improve the hermetic reliability of the package. It is possible to provide an electronic device with improved performance.

本発明のパッケージおよび電子装置について以下に詳細に説明する。本発明の電子部品収納用パッケージおよび電子装置を図１に示す。図１（ａ）は本発明の電子部品収納用パッケージおよび電子装置の実施の形態の一例を示す斜視図である。図１（ｂ）は図１（ａ）に示すパッケージおよび電子装置の断面図である。   The package and electronic device of the present invention will be described in detail below. An electronic component storage package and an electronic apparatus according to the present invention are shown in FIG. FIG. 1A is a perspective view showing an example of an embodiment of an electronic component storage package and an electronic device according to the present invention. FIG. 1B is a cross-sectional view of the package and the electronic device shown in FIG.

図中、１は容器体、２は壁部、３は緩衝部材、４は入出力端子、５は電子部品、６はワイヤー、７は蓋体である。   In the figure, 1 is a container body, 2 is a wall, 3 is a buffer member, 4 is an input / output terminal, 5 is an electronic component, 6 is a wire, and 7 is a lid.

＜パッケージの構成＞
本発明のパッケージは、主に開口部２ａを有する容器体１と、入出力端子４とを備える。 <Package structure>
The package of the present invention mainly includes a container body 1 having an opening 2 a and an input / output terminal 4.

なお、本発明に係る容器体１の熱膨張係数は、容器体１の外表面であって特に開口部２ａ周囲領域におけるものである。また、入出力端子４の熱膨張係数は入出力端子４の絶縁体部位におけるものである。さらに、緩衝部材３の熱膨張係数は容器体１と入出力端子４との間に位置する部位におけるものである。   In addition, the thermal expansion coefficient of the container body 1 according to the present invention is the outer surface of the container body 1 and particularly the region around the opening 2a. The coefficient of thermal expansion of the input / output terminal 4 is that of the insulator portion of the input / output terminal 4. Furthermore, the coefficient of thermal expansion of the buffer member 3 is that at a portion located between the container body 1 and the input / output terminal 4.

（容器体）
容器体１は、キャビティを有する基体の壁部２に開口部２ａを備えている。キャビティ内には電子部品５が収納される。 (Container)
The container body 1 includes an opening 2a in a wall portion 2 of a base body having a cavity. The electronic component 5 is accommodated in the cavity.

容器体１は、ステンレス鋼（ＳＵＳ），銅（Ｃｕ），銅（Ｃｕ）−タングステン（Ｗ），銅（Ｃｕ）−モリブデン（Ｍｏ），鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等の金属から成る。   The container body 1 is made of stainless steel (SUS), copper (Cu), copper (Cu) -tungsten (W), copper (Cu) -molybdenum (Mo), iron (Fe) -nickel (Ni) -cobalt (Co). Made of metal such as alloy.

この容器体１は、金属のインゴットを圧延加工やプレス加工，切削加工等の金属加工を施すことにより所定形状に一体成形してもよいし、容器体１の底部を成す底板と壁部２とを別々に準備し、この底板の上面に銀（Ａｇ）−銅（Ｃｕ）ロウ等のロウ材を介して壁部２を接合してもよい。この場合、壁部２の底板への接合は底板上面と壁部２下面とを、底板上面に敷設したプリフォーム状のＡｇ−Ｃｕロウ等のロウ材を介して接合される。   The container body 1 may be integrally formed into a predetermined shape by subjecting a metal ingot to metal processing such as rolling, pressing, and cutting, or a bottom plate and a wall 2 that form the bottom of the container body 1. May be prepared separately, and the wall 2 may be joined to the upper surface of the bottom plate via a brazing material such as silver (Ag) -copper (Cu) brazing. In this case, the wall 2 is joined to the bottom plate by joining the upper surface of the bottom plate and the lower surface of the wall 2 through a brazing material such as preformed Ag-Cu brazing laid on the upper surface of the bottom plate.

壁部２には、電子部品５と外部電気回路とを電気的に接続する入出力端子４を挿着するための開口部２ａが形成される。   The wall 2 is formed with an opening 2a for inserting an input / output terminal 4 for electrically connecting the electronic component 5 and an external electric circuit.

なお、例えば電子部品５として半導体レーザ（ＬＤ），フォトダイオード（ＰＤ）等の光半導体素子を収納する場合のパッケ−ジにおいては、壁部２の一部に電子部品５と光結合するための光伝送路である光信号入出力窓２ｃが形成されている。   For example, in a package in which an optical semiconductor element such as a semiconductor laser (LD) or a photodiode (PD) is accommodated as the electronic component 5, the electronic component 5 is optically coupled to a part of the wall portion 2. An optical signal input / output window 2c, which is an optical transmission line, is formed.

また、容器体１は、その表面に耐蝕性に優れかつロウ材との濡れ性に優れる金属、具体的には厚さ０．５〜９μｍのＮｉ層と、厚さ０．５〜５μｍの金（Ａｕ）層とを順次メッキ法により被着させておくのがよく、容器体１が酸化腐食するのを有効に防止できるとともに、容器体１上面に電子部品５を強固に接着固定することができる。   Further, the container body 1 has a metal with excellent corrosion resistance and wettability with the brazing material, specifically, a Ni layer having a thickness of 0.5 to 9 μm and a gold layer having a thickness of 0.5 to 5 μm. The (Au) layer is preferably deposited sequentially by a plating method, and the container body 1 can be effectively prevented from being oxidized and corroded, and the electronic component 5 can be firmly bonded and fixed to the upper surface of the container body 1. it can.

（入出力端子）
また、壁部２の開口部２ａには電子部品５と外部電気回路との電気信号の入出力を行なう機能を有するとともにパッケージの内外を遮断する機能を有するセラミックス等の絶縁部材を有する入出力端子４を具備している。 (I / O terminal)
The opening 2a of the wall 2 has an input / output terminal having an insulating member such as ceramics having a function of inputting / outputting electric signals between the electronic component 5 and an external electric circuit and a function of blocking the inside / outside of the package. 4 is provided.

この入出力端子４は、例えば長方形の誘電体から成る平板部４ａの上面の一方の長辺から他方の長辺にかけてＷ，Ｍｏ，Ｍｎ等のメタライズ層によって線路導体４ｃが形成されている。この平板部４ａの短辺方向のほぼ中央部に四角柱状の誘電体から成る立壁部４ｂが線路導体４ｃを間に挟んで入出力端子４が形成される。   In this input / output terminal 4, a line conductor 4c is formed of a metallized layer of W, Mo, Mn or the like from one long side to the other long side of the upper surface of a flat plate portion 4a made of, for example, a rectangular dielectric. An input / output terminal 4 is formed at a substantially central portion in the short side direction of the flat plate portion 4a with a standing wall portion 4b made of a quadrangular prism-like dielectric with a line conductor 4c interposed therebetween.

線路導体４ｃは、例えば、Ｗ，Ｍｏ等の粉末に有機溶剤、溶媒を添加混合して得た金属ペーストを、平板部４ａとなるセラミック生成形体の上面に、予め従来周知のスクリーン印刷法により所定パターンに印刷塗布しておき、焼成することにより形成される。   For the line conductor 4c, for example, a metal paste obtained by adding and mixing an organic solvent and a solvent to a powder of W, Mo, or the like is preliminarily formed on the upper surface of the ceramic generating body to be the flat plate portion 4a by a conventionally known screen printing method. It is formed by printing and applying to a pattern and baking.

平板部４ａおよび立壁部４ｂは、アルミナ（Ａｌ２Ｏ３）質セラミックス，窒化アルミニウム（ＡｌＮ）質セラミックス，ムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）質セラミックス等の誘電体から成り、好ましくは、セラミックグリーンシート積層法によって形成されるのがよい。 The flat plate portion 4a and the standing wall portion 4b are made of a dielectric material such as alumina (Al 2 O 3 ) ceramic, aluminum nitride (AlN) ceramic, mullite (3Al 2 O 3 · 2SiO 2 ) ceramic, and preferably ceramic. It may be formed by a green sheet lamination method.

例えば、入出力端子４がＡｌ２Ｏ３質焼結体の場合は、Ａｌ２Ｏ３，酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダ，溶剤，可塑剤，分散剤等を混合添加してペースト状とし、ドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート（セラミック生シート）を形成する。しかる後に、平板部４ａの上面に線路導体４ｃとなるＷ，Ｍｏ，Ｍｎ等の金属粉末に適当なバインダ，溶剤を混合してなる導体ペーストを、セラミックグリーンシートの所定位置にスクリーン印刷法等によって所定パターンに印刷塗布することによって、平板部４ａの上面に線路導体４ｃとなる導体ペースト層を形成する。このセラミックグリーンシートに平板部４ａおよび立壁部４ｂの外形と成る適当な打ち抜き加工を施した後に、このグリーンシートを複数枚積層し、約１６００℃の温度で焼成することによって作製される。 For example, when the input / output terminal 4 is an Al 2 O 3 sintered material, an organic material suitable for raw material powders such as Al 2 O 3 , silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc. A ceramic green sheet (ceramic green sheet) is formed by mixing and adding a binder, a solvent, a plasticizer, a dispersant, and the like to form a paste and adopting a doctor blade method or a calender roll method. After that, a conductive paste prepared by mixing an appropriate binder and solvent with metal powder such as W, Mo, Mn, etc., which becomes the line conductor 4c, on the upper surface of the flat plate portion 4a is applied to a predetermined position of the ceramic green sheet by a screen printing method or the like. A conductor paste layer to be the line conductor 4c is formed on the upper surface of the flat plate portion 4a by printing and applying a predetermined pattern. The ceramic green sheet is produced by subjecting an appropriate punching process to the outer shape of the flat plate portion 4a and the standing wall portion 4b, and then laminating a plurality of the green sheets and firing them at a temperature of about 1600 ° C.

セラミックグリーンシート積層法によって形成されることによって、容易に所定形状の入出力端子４を形成することができ、製造効率の良い入出力端子４を提供することができる。   By forming by the ceramic green sheet laminating method, the input / output terminal 4 having a predetermined shape can be easily formed, and the input / output terminal 4 with high manufacturing efficiency can be provided.

平板部４ａの下面には、その全面に線路導体４ｃと同様のメタライズ層から成る下部接地導体４ｄが形成されていることが好ましい。この場合、平板部４ａとなるセラミック生成形体に、予め従来周知のスクリーン印刷法により所定パターンに印刷塗布しておき、焼成することにより形成される。また、平板部４ａと立壁部４ｂの側面にもメタライズ層から成る側面接地導体４ｆが形成されており、立壁部４ｂの上面にも上部接地導体４ｅが形成されていることが好ましい。   A lower ground conductor 4d made of a metallized layer similar to the line conductor 4c is preferably formed on the entire lower surface of the flat plate portion 4a. In this case, it is formed by printing and applying a predetermined pattern on the ceramic generating body to be the flat plate portion 4a in advance by a well-known screen printing method and baking it. Further, it is preferable that a side surface ground conductor 4f made of a metallized layer is also formed on the side surfaces of the flat plate portion 4a and the upright wall portion 4b, and an upper ground conductor 4e is also formed on the upper surface of the upright wall portion 4b.

また、入出力端子４となるセラミック生成形体を焼成した後、立壁部４ｂの上面および平板部４ａと立壁部４ｂの側面に研磨加工を施し、この研磨加工面にＷ，Ｍｏ，Ｍｎ等の金属粉末に適当なバインダ，溶剤を混合してなる導体ペーストをスクリーン印刷法等によって所定パターンに印刷塗布しておき、再度熱処理することにより入出力端子４を形成してもよい。   Further, after firing the ceramic generating body that will be the input / output terminal 4, the upper surface of the upright wall portion 4b and the side surfaces of the flat plate portion 4a and the upright wall portion 4b are polished, and the polished surface is made of a metal such as W, Mo, or Mn. The input / output terminal 4 may be formed by printing and applying a conductive paste obtained by mixing an appropriate binder and solvent to powder in a predetermined pattern by a screen printing method or the like, and performing heat treatment again.

なお、得られたセラミック焼結体に研磨加工を施せば、より寸法精度の高い入出力端子４を得ることができる。それゆえ、孔部３ａと入出力端子４との間の隙間寸法を接合材で埋め込むことが可能な適切な寸法とすることができ、入出力端子４を後述する緩衝部材３の孔部３ａに容易に挿入させることができる。   If the obtained ceramic sintered body is polished, the input / output terminal 4 with higher dimensional accuracy can be obtained. Therefore, the gap dimension between the hole 3a and the input / output terminal 4 can be set to an appropriate dimension that can be embedded with the bonding material, and the input / output terminal 4 is placed in the hole 3a of the buffer member 3 to be described later. It can be easily inserted.

以上のように、下部接地導体４ｄ，上部接地導体４ｅ，側面接地導体４ｆを形成することにより、下部接地導体４ｄ，上部接地導体４ｅ，側面接地導体４ｆを線路導体４ｃに対する接地電位として機能させることができ、線路導体４ｃを伝送する電気信号のインピーダンス値を所定値に整合させ易くすることができる。その結果、線路導体４ｃを高周波信号が伝送する場合においても、線路導体４ｃを伝送する高周波信号のインピーダンス値を所定値として、高周波信号に反射損失等の伝送損失が生ずることを抑制することができる。   As described above, by forming the lower ground conductor 4d, the upper ground conductor 4e, and the side ground conductor 4f, the lower ground conductor 4d, the upper ground conductor 4e, and the side ground conductor 4f can function as a ground potential for the line conductor 4c. It is possible to easily match the impedance value of the electric signal transmitted through the line conductor 4c to a predetermined value. As a result, even when a high-frequency signal is transmitted through the line conductor 4c, the impedance value of the high-frequency signal transmitted through the line conductor 4c is set to a predetermined value, and transmission loss such as reflection loss can be suppressed from occurring in the high-frequency signal. .

線路導体４ｃの壁部２外側の部位には、外部電気回路と入出力端子３との電気信号の入出力を行なう、Ｆｅ−Ｎｉ−Ｃｏ合金等の金属から成るリード端子（図示せず）がＡｇ−Ｃｕロウ等のロウ材で接合されていてもよい。この構成により、線路導体４ｃを外部電気回路に作業効率良く接続できるものとなる。   A lead terminal (not shown) made of a metal such as an Fe-Ni-Co alloy for inputting / outputting an electric signal between the external electric circuit and the input / output terminal 3 is provided on the outside of the wall portion 2 of the line conductor 4c. It may be joined with a brazing material such as Ag-Cu brazing. With this configuration, the line conductor 4c can be connected to the external electric circuit with high work efficiency.

（緩衝部材）
緩衝部材３はＦｅ−Ｎｉ−Ｃｏ合金，Ｆｅ−Ｎｉ合金，Ｃｕ−Ｗ，Ｃｕ−Ｍｏ等の金属から成る板状の部材が好ましい。緩衝部材３を金属製とすることで、上述した入出力端子４の線路導体４ｃを伝送する高周波信号のインピーダンス値を所定値に整合し易く、入出力端子４における接地電位を強化することができる。それゆえ、入出力端子４において伝送損失が生ずることを抑制することができる。特に、入出力端子４に上述した接地導体４ｄ〜４ｆを備えていれば、接地導体４ｄ〜４ｆと金属製の緩衝部材３とで金属材料の量が増加しているため、一層接地電位を強化でき、入出力端子４における伝送損失をさらに低減させることができる。 (Buffer member)
The buffer member 3 is preferably a plate-like member made of a metal such as Fe—Ni—Co alloy, Fe—Ni alloy, Cu—W, or Cu—Mo. By making the buffer member 3 made of metal, the impedance value of the high-frequency signal transmitted through the line conductor 4c of the input / output terminal 4 can be easily matched to a predetermined value, and the ground potential at the input / output terminal 4 can be strengthened. . Therefore, the occurrence of transmission loss at the input / output terminal 4 can be suppressed. In particular, if the input / output terminal 4 is provided with the above-described ground conductors 4d to 4f, the amount of the metal material is increased between the ground conductors 4d to 4f and the metal buffer member 3, so that the ground potential is further enhanced. And transmission loss at the input / output terminal 4 can be further reduced.

また、緩衝部材３には入出力端子４を挿入する孔部３ａが設けられている。緩衝部材３の外形の平面視形状は種々の形状とすることができ、例えば、図１に示すような四角形とする他に、円形や多角形とすることもできる。   Further, the buffer member 3 is provided with a hole portion 3a into which the input / output terminal 4 is inserted. The shape of the buffer member 3 in plan view can be various shapes, for example, in addition to a quadrangle as shown in FIG. 1, it can also be a circle or a polygon.

緩衝部材３は、例えば金属のインゴットに圧延加工やプレス加工，切削加工等の金属加工を施すことにより所定形状に成形される。好ましくは、圧延加工によって所定の厚みとされ、緩衝部材３を多数個打ち抜くことのできる大きさとされた緩衝部材３を準備し、しかる後、緩衝部材３の外形と孔部３ａとなる開口部をプレス加工によって多数個同時に打ち抜き形成するのがよい。このような方法により、緩衝部材３を効率良く量産することができる。   The buffer member 3 is formed into a predetermined shape, for example, by subjecting a metal ingot to metal processing such as rolling, pressing, or cutting. Preferably, a buffer member 3 having a predetermined thickness by rolling and having a size capable of punching a large number of the buffer members 3 is prepared, and thereafter, an outer shape of the buffer member 3 and an opening serving as the hole 3a are formed. It is preferable to punch and form a large number simultaneously by pressing. By such a method, the buffer member 3 can be mass-produced efficiently.

図３（ａ）、図３（ｂ）に示すように、緩衝部材３の孔部３ａには入出力端子４が挿入され、入出力端子４と緩衝部材３との間にはＡｇ−Ｃｕロウ，Ａｕ−Ｓｎ半田，樹脂接着剤等の接合材を介して接合されることが好ましい。入出力端子４と緩衝部材３との間にロウ材を使用することで、緩衝部材３と入出力端子４とを気密かつ強固に接合することが可能となる。   As shown in FIGS. 3A and 3B, the input / output terminal 4 is inserted into the hole 3 a of the buffer member 3, and an Ag—Cu solder is interposed between the input / output terminal 4 and the buffer member 3. , Au—Sn solder, resin adhesive, etc. are preferably used for bonding. By using a brazing material between the input / output terminal 4 and the buffer member 3, the buffer member 3 and the input / output terminal 4 can be joined airtight and firmly.

以上、本発明のパッケージは、入出力端子４と緩衝部材３との間、及び緩衝部材３と容器体１との間にＡｇ−Ｃｕロウ，Ａｕ−Ｓｎ半田，樹脂接着剤等の接合材を介して、例えば上述した各部材を図２に示すように、開口部２ａの内周に沿って入出力端子４を囲むように、開口部２ａの内面と入出力端子４との間に緩衝部材２が配されて、従来周知の固定治具等で載置固定した後、高温炉内で加熱することにより作製することができる。   As described above, in the package of the present invention, a bonding material such as Ag—Cu solder, Au—Sn solder, or resin adhesive is provided between the input / output terminal 4 and the buffer member 3 and between the buffer member 3 and the container body 1. For example, as shown in FIG. 2, each of the above-described members includes a buffer member between the inner surface of the opening 2 a and the input / output terminal 4 so as to surround the input / output terminal 4 along the inner periphery of the opening 2 a. 2 can be prepared by mounting in a conventionally known fixing jig or the like and then heating in a high temperature furnace.

このようなパッケージ製造時や、電子部品５が容器体１内部に搭載され、電子装置内部で動作する時に、容器体１や入出力端子４に熱が加わった場合であっても、両者の熱膨張係数の差異から生じる、両者に加わる熱応力を緩衝部材３によって低減させることができる。それゆえ、例えば入出力端子４の熱膨張係数の方が容器体１の熱膨張係数よりも小さい場合であっても、容器体１の熱膨張によって入出力端子４が押圧されて入出力端子４にクラック等の破損が生じることを抑制し、パッケージの気密信頼性を向上させることができる。また、緩衝部材３は孔部３ａを有し、該孔部３ａに入出力端子４が挿入されてなることから、入出力端子４と容器体１との間の周囲に緩衝部材３を有する構造となるため、一層両者に加わる熱応力を低減させることができる。   Even when heat is applied to the container body 1 or the input / output terminal 4 when such a package is manufactured or when the electronic component 5 is mounted inside the container body 1 and operates inside the electronic apparatus, The buffer member 3 can reduce the thermal stress applied to both due to the difference in expansion coefficient. Therefore, for example, even when the thermal expansion coefficient of the input / output terminal 4 is smaller than the thermal expansion coefficient of the container body 1, the input / output terminal 4 is pressed by the thermal expansion of the container body 1 and the input / output terminal 4. It is possible to suppress the occurrence of breakage such as cracks and improve the hermetic reliability of the package. Further, since the buffer member 3 has a hole 3a, and the input / output terminal 4 is inserted into the hole 3a, the buffer member 3 is provided around the input / output terminal 4 and the container body 1. Therefore, the thermal stress applied to both can be further reduced.

ここで、熱膨張係数の測定方法について説明する。上述した容器体１、入出力端子４、及び緩衝部材３の熱膨張係数は、ひずみゲージにより測定することができる。すなわち、常温状態と所定温度まで加熱された状態とで、各部材の抵抗値をひずみゲージにより測定することで、各部材の熱膨張係数を測定することができる。また、パッケージの形状によりひずみゲージによる測定が難しい場合は、Ｘ線回折法により測定することができる。すなわち、常温状態と所定温度まで加熱された状態とで、各部材の結晶内部の原子間距離をＸ線回折法により測定することで、各部材の熱膨張係数を測定することができる。   Here, a method for measuring the thermal expansion coefficient will be described. The thermal expansion coefficients of the container 1, the input / output terminal 4, and the buffer member 3 described above can be measured with a strain gauge. That is, the coefficient of thermal expansion of each member can be measured by measuring the resistance value of each member with a strain gauge in a normal temperature state and a state heated to a predetermined temperature. Moreover, when measurement with a strain gauge is difficult due to the shape of the package, it can be measured by an X-ray diffraction method. That is, the thermal expansion coefficient of each member can be measured by measuring the interatomic distance inside the crystal of each member by an X-ray diffraction method in a normal temperature state and a state heated to a predetermined temperature.

また、開口部２ａの内面には、緩衝部材３が載置される段差部２ｂが設けられることが好ましく、この段差部２ｂに緩衝部材３を載置することにより、当該段差部２ｂに緩衝部材３を載置する際の位置合わせが容易となり、生産性を向上させたパッケージを提供することができる。なお、段差部２ｂは開口部２ａのキャビティ側の内側に設けられてもよいし、開口部２ａの容器体１外表面側の内面に設けられてもよい。   Moreover, it is preferable that a stepped portion 2b on which the buffer member 3 is placed is provided on the inner surface of the opening 2a. By placing the buffer member 3 on the stepped portion 2b, the buffered member is placed on the stepped portion 2b. Positioning at the time of mounting 3 is facilitated, and a package with improved productivity can be provided. The stepped portion 2b may be provided on the inner side of the opening 2a on the cavity side, or may be provided on the inner surface of the opening 2a on the outer surface side of the container body 1.

また、入出力端子４と緩衝部材３との間、又は緩衝部材３と開口部の内面との間に、ロウ材のフィレットが形成されてなることが好ましい。   Moreover, it is preferable that a filler fillet be formed between the input / output terminal 4 and the buffer member 3 or between the buffer member 3 and the inner surface of the opening.

ロウ材としては、例えば、従来周知の銀（Ａｇ）−銅（Ｃｕ）ロウや金（Ａｕ）−錫（Ｓｎ）ロウを好適に用いることができる。   As the brazing material, for example, conventionally known silver (Ag) -copper (Cu) brazing or gold (Au) -tin (Sn) brazing can be suitably used.

フィレットの形成は、上記ロウ材の接触角が鋭角となるように、ロウ材、緩衝部材、入出力端子に形成するメタライズ層を適宜選択すればよい。   The fillet may be formed by appropriately selecting a metallized layer formed on the brazing material, the buffer member, and the input / output terminal so that the contact angle of the brazing material becomes an acute angle.

このように、入出力端子４と緩衝部材３との間に設けられた第２のフィレット９や、緩衝部材３と容器体１との間に設けられた第１のフィレット８によって、気密性を向上させたパッケージを作製することができる。また、ロウ材の接着面積を増加させることができるため、接合をより強固なものとすることができる。   As described above, the second fillet 9 provided between the input / output terminal 4 and the buffer member 3 and the first fillet 8 provided between the buffer member 3 and the container body 1 provide airtightness. An improved package can be manufactured. Further, since the bonding area of the brazing material can be increased, the bonding can be made stronger.

加えて、フィレットの一端は他端と比較してロウ材厚みが薄いため、一端を起点として緩衝部材、容器体１、又は入出力端子にクラックが発生することを抑制できる。   In addition, since one end of the fillet has a thinner brazing material than the other end, it is possible to suppress the occurrence of cracks in the buffer member, the container body 1 or the input / output terminal starting from the one end.

図５（ａ）では、緩衝部材３は容器体１の段差部２ｂに接合され、緩衝部材３と開口部の内面との間に設けられた第１ロウ材８、入出力端子４と緩衝部材３との間に設けられた第２ロウ材９を有する。また、図５（ｂ）に示すように、緩衝部材３は容器体１の外側に凸となる曲面を有している場合は、容器体１の段差部２ｂの段差面に緩衝部材３の外側面の先端が位置するように載置される。このような構成の場合は、緩衝部材３の外側面の先端付近と段差部２ｂの段差面および側面にロウ材の第１のフィレット８が形成されていればよい。   In FIG. 5A, the buffer member 3 is joined to the step portion 2b of the container body 1, and the first brazing material 8, the input / output terminal 4 and the buffer member provided between the buffer member 3 and the inner surface of the opening. 3 and a second brazing material 9 provided between the two. In addition, as shown in FIG. 5B, when the buffer member 3 has a curved surface that protrudes outward from the container body 1, the buffer member 3 is placed on the step surface of the step portion 2 b of the container body 1. It is mounted so that the tip of the side surface is located. In the case of such a configuration, it is only necessary that the first fillet 8 made of brazing material is formed near the tip of the outer surface of the buffer member 3 and the step surface and side surface of the step portion 2b.

さらに、段差部２ｂにおいて、壁部２の厚み方向の段差は、緩衝部材３の厚みよりも大きいことが好ましく、上述した生産性をさらに高めたパッケージを提供することができる。   Further, in the stepped portion 2b, the stepped portion in the thickness direction of the wall portion 2 is preferably larger than the thickness of the buffer member 3, so that the above-described package with further improved productivity can be provided.

また、緩衝部材３の厚みを薄くすることで緩衝部材３の変形し易くなり、パッケージで生じる熱応力を緩衝部材３の変形によって緩和させることができる。すなわち、図１（ｂ）において、段差部２ｂの壁部２の厚み方向の段差をＡ、緩衝部材３の厚みをＢとすれば、Ｂ＜Ａとなっている。この構成によれば、入出力端子４に接合される緩衝部材３との接合面積を小さいものとすることができ、入出力端子４に作用する緩衝部材３との熱膨張係数の差異による熱応力を低減するとともに、緩衝部材３が入出力端子４と容器体１とを接合する際に適度に変形するようになり、入出力端子４に作用する容器体１との熱膨張係数の差異による熱応力を低減することができる。以上により、入出力端子４にクラック等の破損が生じ難くすることができる。   Further, the buffer member 3 can be easily deformed by reducing the thickness of the buffer member 3, and the thermal stress generated in the package can be reduced by the deformation of the buffer member 3. That is, in FIG. 1B, if the step in the thickness direction of the wall 2 of the step 2b is A and the thickness of the buffer member 3 is B, then B <A. According to this configuration, the joining area with the buffer member 3 joined to the input / output terminal 4 can be made small, and the thermal stress due to the difference in thermal expansion coefficient with the buffer member 3 acting on the input / output terminal 4. In addition, the buffer member 3 is appropriately deformed when the input / output terminal 4 and the container body 1 are joined, and heat due to a difference in thermal expansion coefficient from the container body 1 acting on the input / output terminal 4 is reduced. Stress can be reduced. As described above, the input / output terminal 4 can be hardly damaged such as a crack.

またさらに、図４（ａ）に示すように、緩衝部材３は板状であり、入出力端子４と容器体１との間を塞ぐように形成され、緩衝部材３の少なくとも一部に曲面を有してなることが好ましく、緩衝部材３が平面の場合と比較して表面積が増加するため、パッケージに加わる熱に対して放熱性を高めることができるとともに、パッケージに加わる応力を当該緩衝部材３の曲面３ｂで分散させて保持できるためパッケージが変形することを抑制できる。   Furthermore, as shown in FIG. 4A, the buffer member 3 is plate-shaped and is formed so as to close the space between the input / output terminal 4 and the container body 1, and at least a part of the buffer member 3 has a curved surface. Since the surface area is increased as compared with the case where the buffer member 3 is a flat surface, the heat dissipation performance can be enhanced with respect to the heat applied to the package, and the stress applied to the package can be increased. Since the curved surface 3b can be dispersed and held, deformation of the package can be suppressed.

なお、緩衝部材３に曲面３ｂを形成する方法としては、緩衝部材３の外形をプレス加工で打ち抜く際に同時に形成するのがよく。緩衝部材３のプレス加工用の金型のダイとポンチのクリアランス寸法を適宜設けてプレス加工することで、緩衝部材３に曲面３ｂが形成される。   In addition, as a method of forming the curved surface 3b on the buffer member 3, it is preferable to form the buffer member 3 at the same time when the outer shape of the buffer member 3 is punched out by press working. A curved surface 3 b is formed on the buffer member 3 by appropriately pressing the die of the die for punching of the buffer member 3 and a punch to provide a clearance dimension.

さらにまた、図４（ｂ）に示すように、緩衝部材３は入出力端子４側端部に平面部３ｃを有することが好ましく、入出力端子４をロウ材，半田等の接合材を介して緩衝部材３に接合する際に、緩衝部材３の平面部３ｃに入出力端子４の緩衝部材３との接合部との間に接合材のメニスカスを良好に形成することができ、入出力端子４を緩衝部材３に強固かつ気密に接合させることができる。   Furthermore, as shown in FIG. 4 (b), the buffer member 3 preferably has a flat surface portion 3c at the end on the input / output terminal 4 side, and the input / output terminal 4 is connected via a bonding material such as brazing material or solder. When joining to the buffer member 3, a meniscus of a bonding material can be satisfactorily formed between the flat portion 3 c of the buffer member 3 and the joint portion of the input / output terminal 4 with the buffer member 3. Can be firmly and airtightly bonded to the buffer member 3.

また、緩衝部材３が容器体１から外側に延びる曲面３ｂを有する構成において、図４（ｂ）に示すように、入出力端子４は容器体１の外表面を境にその内外に挿通され、容器体１の内部側入出力端子４の長さは、容器体１の外部側入出力端子４の長さよりも長いことが好ましく、ボンディングワイヤ等の電気的接続手段を介して容器体内部と容器体外部とを電気的に接続する際に、容器体１内部に延びた入出力端子４とワイヤー６とを接続し易くできるため、パッケージ製造過程の作業性を向上させたものとすることができる。   Further, in the configuration in which the buffer member 3 has a curved surface 3b extending outward from the container body 1, as shown in FIG. 4 (b), the input / output terminal 4 is inserted inside and outside the outer surface of the container body 1, The length of the input / output terminal 4 on the inner side of the container body 1 is preferably longer than the length of the input / output terminal 4 on the outer side of the container body 1, and the container body and the container are connected via an electrical connection means such as a bonding wire. Since the input / output terminal 4 extending inside the container body 1 and the wire 6 can be easily connected when electrically connecting to the outside of the body, the workability in the package manufacturing process can be improved. .

すなわち、緩衝部材３が容器体１から外側に延びる曲面３ｂを有することで入出力端子４の位置も容器体１から離れ易くなるが、上記構成とすることで電子部品５と入出力端子４とを容易にワイヤー６等で接続することができる。   That is, since the buffer member 3 has the curved surface 3b extending outward from the container body 1, the position of the input / output terminal 4 can be easily separated from the container body 1. However, the electronic component 5 and the input / output terminal 4 Can be easily connected by the wire 6 or the like.

＜パッケージの製造方法＞
次に、本発明に係るパッケージの製造方法について詳細に説明する。 <Package manufacturing method>
Next, the manufacturing method of the package according to the present invention will be described in detail.

上述したように、入出力端子４及び緩衝部材３、緩衝部材３及び容器体１はＡｇ−Ｃｕロウ，Ａｕ−Ｓｎ半田，樹脂接着剤等の接合材を介して接合される。すなわち、孔部３ａを有する緩衝部材３の孔部３ａに入出力端子４が挿通され、入出力端子４と緩衝部材３とを接合材を介して保持する第１工程と、キャビティを有する基体の壁部２にこのキャビティに通じる開口部２ａを有する容器体１において、この開口部２ａに緩衝部材３が接合材を介して保持される第２工程と、第１工程又は第２工程の後に、この接合材の溶融温度以上に加熱する工程と、を備えるものである。   As described above, the input / output terminal 4 and the buffer member 3, the buffer member 3, and the container body 1 are bonded via a bonding material such as Ag—Cu solder, Au—Sn solder, or resin adhesive. That is, the input / output terminal 4 is inserted into the hole 3a of the buffer member 3 having the hole 3a, the first step of holding the input / output terminal 4 and the buffer member 3 through the bonding material, and the base having the cavity In the container body 1 having the opening 2a leading to the cavity in the wall portion 2, the buffer member 3 is held in the opening 2a via a bonding material, and after the first step or the second step, Heating to a temperature equal to or higher than the melting temperature of the bonding material.

このような製法によれば、接合材の溶融温度以上に加熱することで、入出力端子４と緩衝部材３との間に介在した接合材、及び緩衝部材３と容器体１との間に介在した接合材は溶融するため、入出力端子４と緩衝部材３との間隙、及び緩衝部材３と容器体１との間隙を溶融した接合材によって塞ぐことができる。それゆえ、パッケージの気密信頼性を向上させることができる。また、当該容器体１と入出力端子４は、上述したようにそれぞれ熱膨張係数が異なるものであり、接合材の溶融温度以上に加熱した場合に、両者の熱膨張係数の差異に起因する応力を緩衝部材３によって低減させることができる。それゆえ、例えば入出力端子４の熱膨張係数の方が容器体１の熱膨張係数よりも小さい場合、容器体１の熱膨張によって入出力端子４が押圧されて入出力端子４にクラック等の破損が生じることを抑制するため、パッケージの気密信頼性をさらに向上させることができる。   According to such a manufacturing method, by heating above the melting temperature of the bonding material, the bonding material interposed between the input / output terminal 4 and the buffer member 3 and the buffer member 3 and the container body 1 are interposed. Since the bonding material thus melted, the gap between the input / output terminal 4 and the buffer member 3 and the gap between the buffer member 3 and the container body 1 can be closed with the molten bonding material. Therefore, the hermetic reliability of the package can be improved. In addition, the container body 1 and the input / output terminal 4 have different thermal expansion coefficients as described above. When the container body 1 and the input / output terminal 4 are heated to a temperature higher than the melting temperature of the bonding material, the stress caused by the difference between the thermal expansion coefficients of the two. Can be reduced by the buffer member 3. Therefore, for example, when the thermal expansion coefficient of the input / output terminal 4 is smaller than the thermal expansion coefficient of the container body 1, the input / output terminal 4 is pressed by the thermal expansion of the container body 1, and cracks or the like occur in the input / output terminal 4. In order to suppress the occurrence of breakage, the hermetic reliability of the package can be further improved.

また、図６に示すように、接合材の溶融温度以上に加熱する際に、容器体１の収納部１ａの開口１ｂが横向きになるようにし、かつ収納部１ａ内部に入出力端子４を支持するための治具１０を嵌め込んで加熱するのがよい。   Further, as shown in FIG. 6, when heating to a temperature higher than the melting temperature of the bonding material, the opening 1b of the storage portion 1a of the container body 1 is turned sideways, and the input / output terminal 4 is supported inside the storage portion 1a. It is preferable to heat by inserting a jig 10 for the purpose.

このように開口１ｂが横向きになるようにして、緩衝部材３及び入出力端子４を支持することで、緩衝部材３の上下方向に接合材が流れ易くなり、入出力端子４と緩衝部材３との間、及び緩衝部材３と容器体１との間にそれぞれ第２のフィレット９と第１のフィレット８とが形成され易くなる。   By supporting the buffer member 3 and the input / output terminal 4 in such a manner that the opening 1b faces sideways, the bonding material can easily flow in the vertical direction of the buffer member 3, and the input / output terminal 4 and the buffer member 3 , And between the buffer member 3 and the container body 1, the second fillet 9 and the first fillet 8 are easily formed.

なお、治具１０の材質は、接合材の溶融温度以上に加熱しても耐えられるカーボン，セラミックス，金属等を適宜選択すればよい。   Note that the material of the jig 10 may be appropriately selected from carbon, ceramics, metal, and the like that can withstand heating even when heated to a temperature higher than the melting temperature of the bonding material.

＜電子装置の構成＞
最後に、本発明に係る電子装置について以下に説明する。 <Configuration of electronic device>
Finally, the electronic device according to the present invention will be described below.

上述したパッケージに電子部品５を搭載することで電子装置とすることができる。図１（ａ）に示すように蓋体７を被せて電子部品５とすることができる。   By mounting the electronic component 5 on the package described above, an electronic device can be obtained. As shown in FIG. 1A, the electronic component 5 can be formed by covering the lid body 7.

電子部品５の一例として光半導体素子を搭載する場合は、図１（ａ）に示すように壁部２の一部に光信号入出力窓２ｃが形成され、この光信号入出力窓２ｃによって光ファイバ（図示せず）の一端が支持される。   When an optical semiconductor element is mounted as an example of the electronic component 5, an optical signal input / output window 2c is formed in a part of the wall portion 2 as shown in FIG. One end of a fiber (not shown) is supported.

特に、容器体１がＳＵＳからなり、電子部品５としてニオブ酸リチウムを用いた光変調器用パッケージとした場合は、容器体１の熱膨張係数と電子部品５の熱膨張係数とが近似しているため、電子部品５を容器体１の収納部１ａに収納した後に、電子装置に温度変化が加わった場合であっても、電子部品５と容器体１との熱膨張係数差に起因した熱応力により電子部品５が劣化することを抑制できる。それゆえ、電子部品５に対してパッケージを小さくすることができるため、電子装置の小型化を可能にすることができる。   In particular, when the container body 1 is made of SUS and the electronic component 5 is a package for an optical modulator using lithium niobate, the thermal expansion coefficient of the container body 1 and the thermal expansion coefficient of the electronic component 5 are approximated. Therefore, even when the electronic device 5 is stored in the storage portion 1a of the container body 1 and a temperature change is applied to the electronic device, the thermal stress caused by the difference in thermal expansion coefficient between the electronic component 5 and the container body 1 is obtained. Therefore, it is possible to suppress deterioration of the electronic component 5. Therefore, since the package can be made smaller with respect to the electronic component 5, it is possible to reduce the size of the electronic device.

また、入出力端子４は、例えばＦｅ−Ｎｉ−Ｃｏ合金から成る緩衝部材３を介して容器体１に接合される。それゆえ、入出力端子４の熱膨張係数は緩衝部材３の熱膨張係数に近づき、容器体１の熱膨張係数は緩衝部材３の熱膨張係数に近づくため、入出力端子４が容器体１の熱膨張・熱収縮により劣化することを抑制できる。   The input / output terminal 4 is joined to the container body 1 via a buffer member 3 made of, for example, an Fe—Ni—Co alloy. Therefore, the coefficient of thermal expansion of the input / output terminal 4 approaches the coefficient of thermal expansion of the buffer member 3, and the coefficient of thermal expansion of the container body 1 approaches the coefficient of thermal expansion of the buffer member 3. Deterioration due to thermal expansion / shrinkage can be suppressed.

また、容器体１はＣｕからなることが好ましく、この構成により、電子部品５が作動時に多量の熱を発する場合においても、高い熱伝導率を有するＣｕから成る容器体１によって、効率良く外部に熱を放散させることができ、電子部品５を正常かつ安定に作動させることができる。   The container body 1 is preferably made of Cu. With this configuration, even when the electronic component 5 generates a large amount of heat during operation, the container body 1 made of Cu having a high thermal conductivity can efficiently be externally provided. Heat can be dissipated and the electronic component 5 can be operated normally and stably.

このようなパッケージに、電子部品５を収納部１ａにＡｕ−Ｓｎ半田，Ｓｎ−鉛（Ｐｂ）半田等の低融点ロウ材で載置固定するとともに、入出力端子４の線路導体４ｃと電子部品５の電極とをボンディングワイヤ等で電気的に接続し、壁部２上面に蓋体７をシーム溶接等により収納部１ａを覆うように接合することで、本発明に係る電子装置とすることができる。   In such a package, the electronic component 5 is placed and fixed in the housing portion 1a with a low melting point solder such as Au-Sn solder, Sn-lead (Pb) solder, and the line conductor 4c of the input / output terminal 4 and the electronic component. 5 is electrically connected with a bonding wire or the like, and the lid body 7 is joined to the upper surface of the wall portion 2 so as to cover the housing portion 1a by seam welding or the like. it can.

なお、電子部品５として、光半導体素子を用いる場合は、さらに光信号入出力窓２ｃに光ファイバを溶接法や接合材を用いて支持固定することによって、製品としての光半導体装置となる。   When an optical semiconductor element is used as the electronic component 5, an optical semiconductor device as a product is obtained by further supporting and fixing an optical fiber to the optical signal input / output window 2c using a welding method or a bonding material.

この電子装置は、外部電気回路基板にネジ止め等によって固定された後、外部電気回路から供給される駆動信号によって電子部品５を駆動させる。または、電子部品５から出力される電気信号が外部電気回路に取り出される。   The electronic device is fixed to the external electric circuit board by screws or the like, and then drives the electronic component 5 by a drive signal supplied from the external electric circuit. Alternatively, an electric signal output from the electronic component 5 is taken out to an external electric circuit.

また、光半導体装置として用いる場合、外部電気回路から供給される駆動信号によって電子部品５を光励起させ、励起したレーザ光等の光信号を光ファイバに授受させるとともに、光ファイバ内を伝送させることにより、大容量の情報を高速に伝送できる光電変換装置として機能する。または、光ファイバから伝送されてきた光信号を電子部品５に授受させて、電子部品５から電気信号を取り出すことにより、大容量の情報を高速に伝送できる光電変換装置として機能するものであり、光通信分野等に多く用いられる。   When used as an optical semiconductor device, the electronic component 5 is optically excited by a drive signal supplied from an external electric circuit, and an optical signal such as excited laser light is transmitted to the optical fiber and transmitted through the optical fiber. It functions as a photoelectric conversion device capable of transmitting a large amount of information at high speed. Or, it functions as a photoelectric conversion device capable of transmitting a large amount of information at high speed by exchanging an optical signal transmitted from an optical fiber to the electronic component 5 and taking out an electrical signal from the electronic component 5. It is often used in the field of optical communications.

かくして、本発明は高周波信号や光信号によって作動する電子部品を長期にわたり正常かつ安定なものとできる。   Thus, according to the present invention, an electronic component operated by a high-frequency signal or an optical signal can be made normal and stable for a long time.

（変形例）
なお、本発明は上記実施の形態および実施例に限定されるものではなく、本発明の要旨を逸脱しない範囲内であれば種々の変更を施すことは何等差し支えない。 (Modification)
The present invention is not limited to the above-described embodiments and examples, and various modifications may be made without departing from the scope of the present invention.

例えば、電子部品５は光半導体素子に限ることはなく、本発明のパッケージは、発光素子（ＬＥＤ），電界効果型トランジスタ（ＦＥＴ），集積回路素子（ＩＣ），コンデンサ，圧電素子等の電子部品５にも適用することができる。   For example, the electronic component 5 is not limited to an optical semiconductor element, and the package of the present invention includes electronic components such as a light emitting element (LED), a field effect transistor (FET), an integrated circuit element (IC), a capacitor, and a piezoelectric element. 5 can also be applied.

また、図１において容器体１は平面視形状が四角形である場合について示したが、これに限定されるものではなく、容器体１の平面視形状が六角形，八角形，長円形等であってもよく、種々の形状とすることができる。   Further, in FIG. 1, the container body 1 is shown as having a square shape in plan view. However, the shape is not limited to this, and the shape of the container body 1 in plan view is hexagonal, octagonal, oval or the like. It may be possible to have various shapes.

さらに、容器体１と緩衝部材３との間に介在させる接合材は、容器体１の熱膨張係数と緩衝部材３の熱膨張係数との間の熱膨張係数を有するものが好ましく、緩衝部材３と入出力端子４との間に介在させる接合材は、緩衝部材３の熱膨張係数と入出力端子４の熱膨張係数との間の熱膨張係数を有することが好ましい。   Further, the bonding material interposed between the container body 1 and the buffer member 3 preferably has a thermal expansion coefficient between the thermal expansion coefficient of the container body 1 and the thermal expansion coefficient of the buffer member 3. The bonding material interposed between the input / output terminal 4 and the input / output terminal 4 preferably has a thermal expansion coefficient between the thermal expansion coefficient of the buffer member 3 and the thermal expansion coefficient of the input / output terminal 4.

（ａ）は本発明の電子部品収納用パッケージおよび電子装置の実施の形態の一例を示す斜視図、（ｂ）は図１（ａ）に示す電子部品収納用パッケージおよび電子装置の断面図である。(A) is a perspective view which shows an example of embodiment of the electronic component storage package and electronic device of this invention, (b) is sectional drawing of the electronic component storage package and electronic device which are shown to Fig.1 (a). . 図１のパッケージにおける一部分解斜視図である。It is a partially exploded perspective view in the package of FIG. （ａ），（ｂ）は図１の電子部品収納用パッケージおよび電子装置における緩衝部材および入出力端子の拡大斜視図である。(A), (b) is an expansion perspective view of the buffer member and input / output terminal in the electronic component storage package and electronic device of FIG. （ａ），（ｂ）はそれぞれ本発明の電子部品収納用パッケージおよび電子装置の実施の形態の他の例を示し、緩衝部材の周辺の要部拡大断面図である。(A), (b) is the principal part expanded sectional view of the periphery of a buffer member, which shows the other example of embodiment of the electronic component storage package of this invention, and an electronic device, respectively. （ａ），（ｂ）はそれぞれ本発明の電子部品収納用パッケージおよび電子装置の実施の形態の他の例を示し、緩衝部材の周辺の要部拡大断面図である。(A), (b) is the principal part expanded sectional view of the periphery of a buffer member, which shows the other example of embodiment of the electronic component storage package of this invention, and an electronic device, respectively. 本発明の電子部品収納用パッケージの製造方法の一例を示す断面図である。It is sectional drawing which shows an example of the manufacturing method of the electronic component storage package of this invention.

符号の説明Explanation of symbols

１：容器体
１ａ：収納部
１ｂ：開口
２：壁部
２ａ：開口部
２ｂ：段差部
３：緩衝部材
３ａ：孔部
３ｂ：曲面
３ｃ：平面部
４：入出力端子
５：電子部品
６：ワイヤー
７：蓋体
８：第１のフィレット
９：第２のフィレット DESCRIPTION OF SYMBOLS 1: Container body 1a: Storage part 1b: Opening 2: Wall part 2a: Opening part 2b: Step part 3: Buffer member 3a: Hole part 3b: Curved surface 3c: Plane part 4: Input / output terminal 5: Electronic component 6: Wire 7: Lid 8: First fillet 9: Second fillet

Claims (8)

キャビティを有する基体の壁部に前記キャビティに通じる開口部を有した容器体と、
前記開口部に挿入され、前記容器体と異なる熱膨張係数を有したセラミックスから成る絶縁部材に貫通する線路導体が形成された入出力端子と、
前記容器体の熱膨張係数と前記入出力端子の熱膨張係数との間の熱膨張係数を有し、前記入出力端子を前記開口部の内周に沿って囲むように、前記開口部の内面と前記入出力端子との間に配された緩衝部材と、
を備えてなるパッケージ。 A container body having an opening leading to the cavity in a wall portion of the base body having the cavity;
An input / output terminal formed with a line conductor penetrating through an insulating member made of ceramics having a thermal expansion coefficient different from that of the container body inserted into the opening ,
The inner surface of the opening has a thermal expansion coefficient between the thermal expansion coefficient of the container body and the thermal expansion coefficient of the input / output terminal, and surrounds the input / output terminal along the inner periphery of the opening. And a buffer member arranged between the input / output terminal,
Package comprising. 前記緩衝部材は金属製であることを特徴とする請求項１に記載のパッケージ。 The package according to claim 1, wherein the buffer member is made of metal. 前記緩衝部材は板状であり、前記入出力端子と前記容器体との間を塞ぐように形成され、前記緩衝部材の少なくとも一部に曲面を有してなることを特徴とする請求項１又は請求項２に記載のパッケージ。 2. The buffer member according to claim 1, wherein the buffer member has a plate shape, is formed so as to block between the input / output terminal and the container body, and has at least a part of the curved surface. The package according to claim 2. 前記開口部の前記内面に設けられた段差部に、板状の前記緩衝部材が載置されてなることを特徴とする請求項１乃至請求項３のいずれかに記載のパッケージ。 The package according to any one of claims 1 to 3, wherein the plate-like buffer member is placed on a step portion provided on the inner surface of the opening. 前記入出力端子と前記緩衝部材との間、又は前記緩衝部材と前記開口部の内面との間に、ロウ材のフィレットが形成されてなることを特徴とする請求項１乃至請求項４のいずれかに記載のパッケージ。 5. A brazing filler fillet is formed between the input / output terminal and the buffer member, or between the buffer member and the inner surface of the opening. Package of crab. 前記段差部において前記壁部の厚み方向の段差は、前記緩衝部材の厚みよりも大きいことを特徴とする請求項４又は請求項５に記載のパッケージ。 The package according to claim 4 or 5, wherein a step in the thickness direction of the wall portion in the step portion is larger than a thickness of the buffer member. 前記入出力端子は前記容器体の外表面を境にその内外に挿通され、前記容器体の内部側前記入出力端子の長さは、前記容器体の外部側前記入出力端子の長さよりも長いことを特徴とする請求項１乃至請求項６のいずれかに記載のパッケージ。 The input / output terminal is inserted inside and outside the outer surface of the container body, and the length of the input / output terminal on the inner side of the container body is longer than the length of the input / output terminal on the outer side of the container body. The package according to claim 1, wherein the package is a package. 請求項１乃至請求項７のいずれかに記載のパッケージを用いた電子装置であって、
前記パッケージに収納され前記入出力端子と電気的に接続された電子部品を備えた電子装置。
An electronic device using the package according to any one of claims 1 to 7,
An electronic device comprising an electronic component housed in the package and electrically connected to the input / output terminal.
JP2008103226A 2007-04-26 2008-04-11 Package and electronic equipment Expired - Fee Related JP4931851B2 (en)

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