JP2002164453A - Semiconductor element storing package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the transmission efficiency of a high frequency signal excellent in a semiconductor element storing package using a coaxial connector on the input and output of the signal. SOLUTION: In the constitution fitting the holding member 11 of the coaxial connector 3 to the fitting part 2a of a frame body 2, the holding member 11 penetrates the inside and outside of a frame body 2, a through hole 11b inserting the coaxial connector 3 from the outside is formed, a shelf part 11a installing a circuit board 6 on the upper face at a part downward of the through hole 11b of the face of the inside of the frame body 2 is provided, further a line conductor 6a electrically connecting the end of a central conductor 3b projected from the face of the inside of the frame body 2 and a semiconductor element 5 is formed on the surface of a circuit board 6, and the fitting part 2a is fitted on the frame body through a metal cushion material 12 whose Young's modulus is smaller than the frame body 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device package having a coaxial connector as a signal input / output unit.

[0002]

2. Description of the Related Art Conventionally, a semiconductor element housing package (hereinafter referred to as a semiconductor package) for housing various semiconductor elements using high-frequency signals in optical communication, microwave band, millimeter wave band, etc. has a semiconductor element and an external electric circuit. A coaxial connector is provided as an input / output terminal for electrically connecting to a substrate. FIG. 4 is a cross-sectional view of a semiconductor package provided with the coaxial connector.

[0003] In the figure, 21 is a base, 22 is a frame,
23 is a coaxial connector and 24 is a lid.

The base 21 is a substantially square plate made of a metal such as an iron-nickel-cobalt alloy or a sintered material of copper-tungsten.
SI, semiconductor laser (LD), photodiode (P
A mounting portion 21a for mounting a circuit board 26 on which a semiconductor element 25 such as D) is mounted is formed.
The semiconductor element 25 is mounted and fixed on a circuit board 26 made of, for example, alumina ceramics.

The electrodes of the semiconductor element 25 mounted on the circuit board 26 are electrically connected to line conductors 26a formed on the circuit board 26 via bonding wires 27 and the like.

The mounting portion 21 is provided on the outer peripheral portion of the upper main surface of the base 21.
The frame 22 is erected so as to surround a. The frame 22 forms a space for accommodating the semiconductor element 25 inside the base together with the base 21.

The frame 22 is made of a sintered material of iron-nickel-cobalt alloy or copper-tungsten similarly to the base 21, and is formed integrally with the base 21 or the base 21 is made of a brazing material such as silver solder. The base 21 is erected on the outer peripheral portion of the upper main surface of the base 21 by brazing through a joint or by a welding method such as a seam welding method.

In the coaxial connector 23, a rod-shaped central conductor 23b made of a metal such as an iron-nickel-cobalt alloy is provided with an insulator 23c at the center of a cylindrical outer conductor 23a made of a metal such as an iron-nickel-cobalt alloy. It is fixed through.

A through hole 22a into which a coaxial connector 23 is inserted from the outside is formed on a side surface of the frame 22. The outer conductor 23a is inserted into the through-hole 22a, and at the same time, a sealing material 28 such as solder is inserted.
Is melted, and the molten sealing material 28 is filled into the gap between the outer conductor 23a and the inner wall of the through hole 22a by capillary action, so that the coaxial connector 23 seals the inside of the through hole 22a of the frame 22 with solder or the like. It is inserted through the material 28. The outer conductor 23a as a ground is electrically connected to the frame 22 via a sealing material 28, and the center conductor 23b is electrically connected to the line conductor 26a of the circuit board 26 via a conductive adhesive 26b made of solder or the like. Will be connected.

In the semiconductor package provided with the coaxial connector 23, the coaxial connector plug 29 has a threaded outer peripheral surface screwed into the through hole 22b having a threaded inner peripheral surface, and is connected to an external electric circuit. By attaching 30 to the coaxial connector plug 29, the semiconductor element 25 housed inside is electrically connected to an external electric circuit via the central conductor 23 b of the coaxial connector 23.

The lid 24 is joined to the upper surface of the frame 22 by using a welding method such as brazing or seam welding.
1. A semiconductor device as a product is obtained by accommodating the semiconductor element 25 in a container formed by the frame body 22 and the lid body 24 and hermetically sealing it.

This semiconductor package is provided with a through hole 21b in the base 21, and is mounted on an external circuit board or the like by fixing a screw in the through hole 21b.

[0013]

However, in the conventional semiconductor package, when the screw is fixed to the through hole 21b and mounted on an external circuit board or the like, the warpage of the base 21 which has been warped at the time of manufacturing the semiconductor package is corrected. As a result, the circuit board 26 mounted and fixed on the base 21 is cracked, the line conductor 26a is cut off, and high-frequency signals cannot be transmitted.

When the warpage of the base 21 is corrected, the frame 22
Is distorted, and stress is applied to the outer conductor 23a inserted in the through hole 22a, and a crack is formed in the insulator 23c interposed on the inner peripheral surface of the outer conductor 23a, thereby impairing the airtightness of the semiconductor package. , Coaxial connector 2
There is a problem that the transmission efficiency of the high-frequency signal transmitted through the third center conductor 23b is deteriorated. Further, the position of the through-hole 22a is shifted from the original position due to the distortion of the frame 22, the outer conductor 23a inserted in the through-hole 22a is shifted, and the entire position of the coaxial connector 23 is also shifted. . For this reason, the center conductor 23b comes off the conductive adhesive 26b, which causes a high-frequency signal to be unable to be transmitted.

Even if the displacement of the center conductor 23b is small and the connection between the center conductor 23b and the conductive adhesive 26b is maintained, the circuit board 26 is mounted on the base 21 and the coaxial connector 23 is mounted on the frame 22. Since it is inserted into the through hole 22a provided on the side surface, the position at which the frame body 22 is joined to the upper main surface of the base 21 is shifted during the manufacture of the semiconductor package, and the center conductor 23b and the line conductor 26a are displaced. The position of the connection part sometimes shifted. For this reason, the impedance at the connecting portion was not stabilized, and the transmission efficiency of the high-frequency signal was sometimes deteriorated at the connecting portion.

Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to provide a semiconductor package having excellent high-frequency signal transmission efficiency.

[0017]

According to a first aspect of the present invention, there is provided a package for housing a semiconductor element, the base having a mounting portion for mounting a semiconductor element on an upper main surface, and a base mounted on an outer peripheral portion of the upper main surface. And a cylindrical outer conductor and a central axis thereof, which are joined so as to surround the portion, and provided with a fitting portion formed of a through-hole or a cutout portion for fitting the holding member of the coaxial connector to the side portion. And a coaxial connector fitted to the fitting portion and comprising a central conductor disposed in the frame and an insulator interposed therebetween, wherein the holding member is provided inside and outside the frame. A through-hole through which the coaxial connector is inserted from the outside is formed, and a shelf portion provided with a circuit board on an upper surface is provided in a portion of the inner surface of the frame below the through-hole,
Further, a line conductor for electrically connecting an end of the central conductor protruding from a surface inside the frame body and the semiconductor element is formed on a surface of the circuit board, and the fitting portion is provided with a line conductor from the frame body. Also, it is characterized in that it is fitted to the frame via a metal buffer having a small Young's modulus.

According to the present invention, since the holding member is fitted to the frame via a metal buffer having a Young's modulus smaller than that of the frame, the semiconductor package can be screwed to the external circuit board or the like. Distortion applied to the frame when it is mounted on the frame is absorbed by the metal buffer being more distorted than the frame, and unnecessary stress and distortion can be prevented from being transmitted to the coaxial connector and the circuit board provided on the holding member. .

Conventionally, a circuit board which is mounted and fixed on a base and cracks into a transmission line of a high-frequency signal when a through-hole of the base is screwed and mounted on an external electric circuit is cut off. It will be fixed on the shelf,
As a result, almost no distortion is applied to the circuit board, and the occurrence of cracks in the circuit board can be prevented. In addition, the coaxial connector, which was conventionally directly inserted into the side surface of the frame, is also inserted into the holding member, thereby reducing the displacement between the center conductor and the line conductor during the manufacture of the semiconductor package, and connecting the semiconductor package to the external circuit board. It is possible to reduce the stress transmitted to the coaxial connector when mounting on a coaxial connector. By reducing the displacement between the center conductor and the line conductor, the transmission characteristics of the high-frequency signal at the connection between the center conductor and the line conductor can be improved, and by reducing the stress transmitted to the coaxial connector, the insulation of the coaxial connector can be reduced. Cracks can be prevented. At the same time, the distortion transmitted to the coaxial connector is prevented, the positional displacement of the coaxial connector is eliminated, and the center conductor can be prevented from coming off the line conductor.

In the present invention, preferably, the inner surface of the holding member protrudes inward of the frame from the inner surface of the metal cushioning material.

With this configuration, when the metal cushioning material and the holding member are joined to the frame by brazing, the brazing material for brazing between the frame and the metal cushioning material and between the metal cushioning material and the holding member is formed. Unnecessary brazing material can be prevented from flowing out to the inner surface of the frame and accumulating on the shelf of the holding member. By preventing unnecessary brazing material from accumulating on the shelf, it is possible to prevent the circuit board from being inclined and fixed on the shelf.

In the present invention, preferably, when the thickness of the metal cushioning material is W and the width of the holding member is d, d ≧ g
In the case of 3 mm, d / 10 ≦ W ≦ d / 2, or d
When <3 mm, 0.3 mm ≦ W ≦ d / 2.

With this configuration, the metal buffer material effectively absorbs the strain that is going to be transmitted from the frame to the holding member, and almost no distortion or stress is transmitted to the holding member. Deviation and cracks in the insulator can be effectively prevented.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The semiconductor package of the present invention will be described in detail below. FIG. 1 is a sectional view showing an example of an embodiment of a semiconductor package of the present invention.
Is a base, 2 is a frame, 3 is a coaxial connector, 6 is a circuit board,
11 is a holding member, and 12 is a metal buffer.

The substrate 1 is made of a sintered material of iron-nickel-cobalt alloy or copper-tungsten or the like. To produce a predetermined shape. At the approximate center of the upper main surface,
A mounting section 1 for mounting a semiconductor element 5 such as an IC, LSI, semiconductor laser (LD), photodiode (PD), etc.
The semiconductor element 5 is mounted and fixed on the mounting portion 1a with a bonding material such as solder. The semiconductor element 5
The line conductor 6 whose electrode is formed on the circuit board 6
a is electrically connected via a bonding wire 7 or the like.

A frame 2 is joined and erected on the outer peripheral portion of the upper main surface of the base 1 so as to surround the mounting portion 1a. 5 is formed.

The frame 2 is made of a sintered material of iron-nickel-cobalt alloy or copper-tungsten as in the case of the base 1, and is formed integrally with the base 1, or the base 1 is made of a brazing material such as silver brazing. The base 1 is erected on the outer peripheral portion of the upper main surface of the base 1 by brazing or joining by a welding method such as a seam welding method.

A fitting portion 2a to which the holding member 11 is fitted is formed on the side surface of the frame 2. The fitting portion 2a is connected to the frame 2
It may be a through hole penetrating inside and outside, or a notch cut out in an inverted U shape from the joint surface side of the frame 2 with the base 1 to penetrate the inside and outside of the frame 2, a lid of the frame 2 It may be a notch that is cut out in a U-shape from the joining surface side with the frame 4 and penetrates the inside and outside of the frame 2.

A holding member 11 made of a metal such as an iron-nickel-cobalt alloy is inserted into the fitting portion 2a, and a frame is provided between the outer peripheral surface of the holding member 11 and the inner peripheral surface of the fitting portion 2a. A metal buffer material 12 having a Young's modulus smaller than that of the body 2 is fitted, and brazing is performed between the metal buffer material 12 and the frame 2 and between the holding member 11 and the metal buffer material 12 via a brazing material such as silver brazing. It is airtightly joined by.

The metal buffer 12 is made of iron which forms the frame 2.
Nickel-cobalt alloy (Young's modulus is about 137GP
a), copper-tungsten sintered material (Young's modulus is 225 to
Copper (314 GPa) or the like (Young's modulus is about 11
7 GPa), silver (Young's modulus is about 86 GPa) and the like. By fitting the metal cushioning material 12 to the fitting portion 2a, the stress and strain to be transmitted from the frame 2 to the holding member 11 are absorbed by the metal cushioning material 12 being distorted more greatly than the frame 2. Thus, the holding member 11 is hardly distorted or stressed. From such a point, it is preferable that the material of the metal cushioning material 12 is selected to be 0.9 times or less of the Young's modulus of the frame 2.

The coaxial connector 3 is for electrically connecting the semiconductor element 5 housed therein to an external coaxial cable 10, and has a center of a cylindrical outer conductor 3a made of metal such as iron-nickel-cobalt alloy. A central conductor 3b also made of a metal such as an iron-nickel-cobalt alloy is fixed to the shaft via an insulator 3c.

The holding member 11 is provided with a shelf 11a for mounting the circuit board 6 on the upper surface and a through hole 11b for inserting the coaxial connector 3. A bonding material 6d such as solder is placed on the shelf 11a, and the circuit board 6 including the line conductor 6a and the ground conductor 6c is placed on the bonding material 6d such that the surface of the ground conductor 6c is on the bonding material 6d side. And install it. The through hole 11b is formed so as to penetrate the inside and outside of the frame 2, inserts the coaxial connector 3, and also inserts the sealing material 8 such as solder between the outer conductor 3a and the coaxial connector 3. The tip of the center conductor 3b is projected from the upper surface of the circuit board 6, and the center conductor 3b
A conductive adhesive 6b such as solder is interposed between the tip of the line conductor b and the upper surface of the line conductor 6a, and the end of the center conductor 3b is connected to the upper surface of the line conductor 6a.

A coaxial connector 3 having an insulator 3c and a circuit board 6 made of an insulator such as alumina ceramic are used.
When joined to the holding member 11 by soldering or the like, heat is applied to the coaxial connector 3, the circuit board 6, and the holding member 11, and thermal expansion occurs respectively. Due to the difference between these coefficients of thermal expansion, stress is applied to each of the insulator 3c and the circuit board 6, and cracks are easily formed. In order to suppress the stress due to thermal expansion, the holding member 11 is made of an insulating material such as an alumina ceramic (having a linear expansion coefficient of about 7.0 × 10 ⁻⁶ / ° C.) and an iron-nickel-cobalt alloy (line The expansion coefficient is about 5.7 × 10 ^{-6 to} 6.45 × 10 ^-6 / ° C.
Tungsten sintered material (linear expansion coefficient is about 6.4 × 10 ^-6
~ 8.5 × 10 ^-6 / ° C).

Thereafter, the bonding material 6d and the sealing material 8 are heated by heating.
And the conductive adhesive 6b is melted, and the circuit board 6 is firmly fixed to the shelf 11a by the bonding material 6d, and the melted sealing material 8 is formed into the outer conductor 3a and the through hole 11b by capillary action.
Is filled in the gap with the inner wall of the outer conductor 3.
a is inserted into the through hole 11b via a sealing material 8 such as solder, and the center conductor 3b and the line conductor 6 are connected by the conductive adhesive 6b.
a is connected.

Thus, the outer conductor 3a as a ground
Are electrically connected to the holding member 11 via the sealing material 8 and the center conductor 3b is electrically connected to the line conductor 6a of the circuit board 6 via the conductive adhesive 6b made of solder or the like. Connected.

The high-frequency signal transmitted through the central conductor 3b is transmitted through a coaxial line transmitting the central axes of the through holes 11b and 11c at the through holes 11b and 11c, and exits from the inner surface of the holding member 11 inside the frame 2. After reaching the conductive adhesive material 6b such as solder, the light is transmitted on the line conductor 6a which is a microstrip line. The coaxial line and the microstrip line are matched to a predetermined characteristic impedance value. In the connection portion using the conductive adhesive 6b, the impedance of the signal line is set to a predetermined value depending on the position of the tip of the center conductor 3b, the position of the line conductor 6a, and the amount of the conductive adhesive 6b. In this way, a good signal line without transmission loss such as reflection loss and transmission loss is formed in the semiconductor package.

The coaxial connector plug 9 inserted and fixed in the through hole 11c of the holding member 11 connects the coaxial cable 10 connected to an external electric circuit to the coaxial connector 3 inserted into the holding member 11. It is a plug, the outer peripheral surface of which is screw-shaped, and is screwed into a through hole 11c having a threaded inner peripheral surface.

In the semiconductor package of the present invention, the electrodes of the semiconductor element 5 and the line conductors 6a attached to the upper surface of the circuit board 6 are electrically connected by bonding wires 7, and then the frame 2 A semiconductor device as a product is obtained by joining a lid 4 made of a metal such as an iron-nickel-cobalt alloy to the upper surface by a soldering method or a seam welding method.

This semiconductor device is mounted on an external circuit board by screwing a through hole 1b provided in the base 1. Further, by connecting the coaxial connector plug 9 and the coaxial cable 10 connected to the external electric circuit, the semiconductor element 5 housed inside is electrically connected to the external electric circuit, and the semiconductor element 5 operates by a high frequency signal. Will be done.

When the through-hole 1b is screwed to the external circuit board and mounted on the external circuit board, the warpage of the base 1, which has been warped in the brazing step in the manufacture of a semiconductor package, is corrected, and the base 1 and the frame are formed. 2 is distorted.

In the semiconductor package of the present invention, the coaxial connector 3 and the circuit board 6 are provided on the frame 2 via the holding member 11, and the fitting portion 2a of the frame 2 and the outer peripheral surface of the holding member 11 The metal cushioning material 12 is fitted between them. Even when distortion is applied to the frame 2, the distortion that is transmitted from the frame 2 to the holding member 11 is reduced by the metal cushioning material 1.
2 is made of a material that is softer and more easily distorted than the frame 2, the metal cushioning material 12 is greatly distorted compared to the frame 2, and absorbs the distortion. It will not be added.

The coaxial connector 3 conventionally inserted into the through hole provided on the side surface of the frame 2 is inserted into the through hole 11b of the holding member 11, and the mounting portion on the upper main surface of the conventional base 1 The circuit board 6 placed on 1a is set on the shelf 11a of the holding member 11, and the coaxial connector 3 and the circuit board 6 are both provided on the holding member 11. Accordingly, the displacement between the coaxial connector 3 and the circuit board 6 due to the displacement of the joint between the frame 2 and the base 1 is eliminated, and the position of the connection between the center conductor 3b of the coaxial connector 3 and the line conductor 6a of the circuit board 6 is eliminated. Can be stabilized.

In the present invention, preferably, as shown in FIG.
From the inner surface of the frame 2. With this configuration, the metal cushioning material 12 and the holding member 11
When joining the frame 2 and the metal cushioning material 12
The brazing material for brazing between the metal cushioning material 12 and the holding member 11 flows out onto the inner surface of the frame 2 of the holding member 11, and the shelf 1 provided on the holding member 11 by its own weight.
1a can be prevented from flowing. In this case, the surface of the holding member 11 inside the frame 2 may be made to protrude from the surface of the metal cushioning material 12 inside the frame 2 by 0.1 mm or more, which is effective in preventing the brazing material from flowing into the shelf 11a. .

As shown in FIG. 3, when the thickness of the metal cushioning material 12 is W and the width of the holding member 11 is d, d ≧ 3.
In the case of mm, it is preferable that d / 10 ≦ W ≦ d / 2. W
In the case of <d / 10, the thickness W of the metal cushioning material 12 is too small and the cushioning function does not work sufficiently, and when the semiconductor package is mounted on the external circuit board, the strain applied from the frame 2 to the holding member 11 is reduced by the metal cushioning. It becomes difficult to effectively absorb the material 12. In the case of W> d / 2, distortion and stress due to a difference in thermal expansion coefficient during brazing of the holding member 11 and the metal cushioning material 12 increase, and distortion and stress are applied to the holding member 11,
Stress acts on the insulator 3c of the coaxial connector 3 and the circuit board 6, and cracks easily occur.

The metal buffer 12 is formed by subjecting a metal such as copper or silver to machining such as cutting, so that when d <3 mm and W <0.3 mm, Exceeding the minimum limit of machining makes machining extremely difficult. Therefore, when d <3 mm, it is preferable that 0.3 mm ≦ W ≦ d / 2.

The semiconductor device housing package of the present invention
Transmission characteristics of a high-frequency signal having a frequency of about 5 to 50 GHz can be improved.

The present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention.

[0048]

According to the present invention, the holding member of the coaxial connector is:
A through hole that penetrates the inside and outside of the frame and through which the coaxial connector is inserted from the outside is formed, and a shelf portion on the upper surface of the circuit board is provided at a portion of the inner surface of the frame below the through hole, and further a circuit is provided. A line conductor that electrically connects the end of the center conductor protruding from the inner surface of the frame to the semiconductor element is formed on the surface of the substrate, and a metal buffer material having a smaller Young's modulus than the frame at the fitting portion. When the semiconductor package is mounted on an external circuit board or the like by screwing or the like, since the metal cushioning material is fitted between the holding member and the frame by being fitted to the frame via When the strain applied to the frame body is to be transmitted from the frame body to the holding member, the metal buffer material is greatly distorted compared to the frame body, and absorbs the distortion that is going to be transmitted from the frame body to the holding member. A state where almost no stress is applied is obtained. Accordingly, the circuit board installed and fixed on the shelf of the holding member and the coaxial connector inserted into the holding member are hardly distorted, so that cracks in the circuit board can be effectively prevented and the insulator of the coaxial connector can be prevented. Cracks can be prevented.

By preventing cracks in the circuit board, breakage of the line conductor formed on the upper surface of the circuit board can be prevented, high-frequency signals can be transmitted efficiently, and cracks in the insulator of the coaxial connector can be prevented. It is possible to keep the inside of the semiconductor package airtight and to maintain the mode of the coaxial line of the high-frequency signal transmitted through the center conductor,
High-frequency signals can be transmitted efficiently.

Further, since the coaxial connector and the circuit board are provided on the holding member, it is possible to reduce the displacement between the center conductor and the line conductor during the manufacture of the semiconductor package as compared with the conventional case, and to reduce the displacement between the center conductor and the line conductor. Variation in impedance at the connection portion can be suppressed, and transmission characteristics of a high-frequency signal are improved.

When the semiconductor element housing package is mounted on the external circuit board, even if the frame is distorted, the distortion transmitted to the coaxial connector insertion portion is effectively prevented. The displacement is eliminated, and the center conductor can be effectively prevented from coming off the line conductor.

In this way, it is possible to prevent cracks on the circuit board, cracks on the insulator of the coaxial connector, displacement of the center conductor with respect to the line conductor, and prevention of the center conductor coming off the line conductor. as a result,
By these effects, a semiconductor package having excellent high-frequency signal transmission efficiency and excellent airtightness can be provided. In the present invention, preferably, the metal buffer and the holding member are joined to the frame by brazing, since the inner surface of the holding member projects from the inner surface of the metal buffer to the inner side of the frame. In doing so, the brazing material for brazing between the frame and the metal cushioning material and between the metal cushioning material and the holding member flows out to the inner surface of the frame of the holding member, flows into the shelf of the holding member, and enters the shelf. Prevents accumulation of excess brazing material. As a result, the circuit board can be installed so that the upper surface of the shelf portion and the upper surface of the circuit board are parallel, and the position of the connection between the center conductor of the coaxial connector and the line conductor of the circuit board is stabilized. It is preferable that the inner surface of the holding member project from the inner surface of the metal cushioning material by 0.1 mm or more, and the parallelism between the upper surface of the shelf and the upper surface of the circuit board can be 0.2 mm or less. . By stabilizing the position of the connection between the center conductor and the line conductor, the impedance at the connection is stabilized, and a good transmission path for high-frequency signals can be formed.

In the present invention, preferably, when the thickness of the metal cushioning material is W and the width of the holding member is d, d / 10 ≦ W ≦ d / 2 when d ≧ 3 mm, or d <d / 2. 3mm
In this case, by setting 0.3 mm ≦ W ≦ d / 2, the metal buffer material effectively absorbs the strain that is going to be transmitted from the frame to the holding member, so that almost no strain or stress is transmitted to the holding member. The semiconductor package can more reliably realize prevention of cracks in the circuit board, prevention of cracks in the insulator of the coaxial connector, prevention of displacement of the center conductor with respect to the line conductor, and prevention of the center conductor coming off the line conductor.

Therefore, the semiconductor package of the present invention
The transmission characteristics of high-frequency signals of about 50 GHz are excellent and the airtightness is excellent.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a semiconductor package of the present invention.

FIG. 2 is a sectional view showing another embodiment of the semiconductor package of the present invention.

FIG. 3 is a sectional view of a main part showing another embodiment of the semiconductor package of the present invention.

FIG. 4 is a cross-sectional view of a conventional semiconductor package.

[Explanation of symbols]

 1: Base 1a: Placement section 2: Frame 2a: Fitting section 3: Coaxial connector 3a: Outer conductor 3b: Center conductor 3c: Insulator 5: Semiconductor element 6: Circuit board 6a: Line conductor 11: Holding member 11a : Shelf 11b: Insertion part 12: Metal cushioning material

Claims (3)

[Claims] A base having a mounting portion for mounting a semiconductor element on an upper main surface; and a peripheral portion of the upper main surface joined to surround the mounting portion and coaxial with a side portion. A frame provided with a fitting portion formed of a through-hole or a notch for fitting the holding member of the connector, a cylindrical outer conductor, a center conductor disposed on the center axis thereof, and a center conductor interposed therebetween; A semiconductor device housing package comprising an insulator and a coaxial connector fitted to the fitting portion, wherein the holding member penetrates inside and outside the frame and penetrates the coaxial connector from outside. A hole is formed, and a shelf portion provided with a circuit board on the upper surface is provided at a portion of the inner surface of the frame below the through hole, and further protrudes from the inner surface of the frame on the surface of the circuit board. End of the center conductor A line conductor for electrically connecting the portion and the semiconductor element is formed, and the line conductor is fitted to the frame via a metal buffer having a Young's modulus smaller than that of the frame at the fitting portion. A semiconductor device storage package characterized by the above-mentioned. 2. The semiconductor element storage device according to claim 1, wherein the inner surface of the holding member projects from the inner surface of the metal buffer to the inner side of the frame. package. 3. When the thickness of the metal buffer is W and the width of the holding member is d, d / 10 ≦ W when d ≧ 3 mm.
≦ d / 2 or 0.3 mm if d <3 mm
3. The package for housing a semiconductor element according to claim 1, wherein ≤W≤d / 2.