JP3619445B2

JP3619445B2 - Package for storing semiconductor elements

Info

Publication number: JP3619445B2
Application number: JP2000362229A
Authority: JP
Inventors: 弘水島
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2000-11-29
Filing date: 2000-11-29
Publication date: 2005-02-09
Anticipated expiration: 2020-11-29
Also published as: JP2002164454A

Description

【０００１】
【発明の属する技術分野】
本発明は信号入出力部として同軸コネクタを具備した半導体素子収納用パッケージに関する。
【０００２】
【従来の技術】
従来、光通信やマイクロ波帯、ミリ波帯等の高周波信号を用いる各種半導体素子を収納する半導体素子収納用パッケージ（以下、半導体パッケージという）には、半導体素子と外部電気回路基板とを電気的に接続するための入出力端子として同軸コネクタが設けられている。この同軸コネクタを具備した半導体パッケージを図６に断面図で示す。同図において、２１は基体、２２は枠体、２３は同軸コネクタ、２４は蓋体である。
【０００３】
基体２１は鉄−ニッケル−コバルト合金や銅−タングステンの焼結材等から成る略四角形状の板状体であり、その上側主面略中央部には、ＩＣ、ＬＳＩ、半導体レーザ（ＬＤ）、フォトダイオード（ＰＤ）等の半導体素子２５を搭載して成る回路基板２６を載置する載置部２１ａが形成されており、載置部２１ａには半導体素子２５が、例えばアルミナ質セラミックスから成る回路基板２６に搭載された状態で載置固定される。
【０００４】
なお、回路基板２６に搭載された半導体素子２５は、その電極が回路基板２６に被着形成されている線路導体２６ａにボンディングワイヤ２７等を介して電気的に接続されている。
【０００５】
基体２１の上側主面外周部には載置部２１ａを囲繞するようにして枠体２２が立設されており、枠体２２は基体２１とともにその内側に半導体素子２５を収容する空所を形成する。
【０００６】
枠体２２は基体２１と同様に鉄−ニッケル−コバルト合金や銅−タングステンの焼結材等から成り、基体２１と一体成形されることによって、あるいは基体２１に銀ろう等のろう材を介してろう付けされたり、シーム溶接法等の溶接法により接合されることによって基体２１の上側主面外周部に立設される。
【０００７】
同軸コネクタ２３は、鉄−ニッケル−コバルト合金等の金属から成る円筒状の外周導体２３ａの中心部に鉄−ニッケル−コバルト合金等の金属から成る棒状の中心導体２３ｂが絶縁体２３ｃを介して固定されて成る。
【０００８】
枠体２２の側面には同軸コネクタ２３が外側より挿着される貫通孔２２ａが形成されている。貫通孔２２ａ内に外周導体２３ａを挿入するとともに半田等の封着材２８を挿入し、しかる後、加熱して封着材２８を溶融させ、溶融した封着材２８を毛細管現象により外周導体２３ａと貫通孔２２ａの内壁との隙間に充填させることによって、同軸コネクタ２３が枠体２２の貫通孔２２ａ内に半田等の封着材２８を介して挿着される。グランドとしての外周導体２３ａが封着材２８を介して枠体２２に電気的に接続され、また中心導体２３ｂが半田等から成る導電性接着材２６ｂを介して回路基板２６の線路導体２６ａに電気的に接続されることとなる。
【０００９】
この同軸コネクタ２３を備えた半導体パッケージは、内周面にネジ切りを有する貫通孔２２ｂに同軸コネクタプラグ２９のネジ状の外周面がネジ止めされ、外部電気回路に接続された同軸ケーブル３０が同軸コネクタプラグ２９に装着されることによって、内部に収納された半導体素子２５が同軸コネクタ２３の中心導体２３ｂを介して外部電気回路に電気的に接続されることとなる。
【００１０】
枠体２２の上面に蓋体２４をろう付け法やシームウエルド法等の溶接法を採用して接合し、基体２１、枠体２２および蓋体２４から成る容器内部に半導体素子２５を収容し気密に封止することによって製品としての半導体装置となる。
【００１１】
この半導体パッケージは、基体２１に貫通孔２１ｂが設けられており、貫通孔２１ｂにネジを止めることにより、外部回路基板等に実装されることとなる。
【００１２】
【発明が解決しようとする課題】
しかしながら、従来の半導体パッケージでは、貫通孔２１ｂにネジを止め、外部回路基板等に実装する際、半導体パッケージの製造時に反ってしまっていた基体２１の反りが矯正されることとなり、基体２１に載置固定されていた回路基板２６にクラックが入り、線路導体２６ａが寸断され、高周波信号を伝送できなくなる原因となっていた。
【００１３】
基体２１の反りが矯正されると、枠体２２が歪み、貫通孔２２ａに挿着された外周導体２３ａに応力が加わることとなり、外周導体２３ａの内周面に介在させた絶縁体２３ｃにクラックが入ってしまい、半導体パッケージの気密性を損なうとともに、同軸コネクタ２３の中心導体２３ｂを伝送する高周波信号の伝送効率を劣化させるという問題点があった。さらに、枠体２２の歪みにより貫通孔２２ａの位置が本来あるべき位置からずれることとなり、貫通孔２２ａに挿着された外周導体２３ａがずれてしまい、同軸コネクタ２３の全体の位置もずれてしまう。そのため、中心導体２３ｂが導電性接着材２６ｂから外れ、高周波信号の伝送ができなくなる原因となっていた。
【００１４】
中心導体２３ｂのずれ量が少なく、中心導体２３ｂと導電性接着材２６ｂの接続が保たれたとしても、回路基板２６は基体２１上に載置され、同軸コネクタ２３は枠体２２の側面に設けられた貫通孔２２ａに挿着されていることから、半導体パッケージ製造時において、基体２１の上面に枠体２２を接合する位置がずれて、中心導体２３ｂと線路導体２６ａとの接続部の位置がずれることがあった。そのため、接続部におけるインピーダンスが安定せず、接続部において高周波信号の伝送効率が劣化することがあった。
【００１５】
従って、本発明は上記問題点に鑑み完成されたものであり、高周波信号の伝送効率にすぐれた半導体パッケージを提供することを目的としている。
【００１６】
【課題を解決するための手段】
本発明の半導体素子収納用パッケージは、上側主面に半導体素子を載置するための載置部を有する基体と、前記上側主面の外周部に前記載置部を囲繞するように接合され、かつ側部に同軸コネクタの保持部材を嵌着させる貫通孔または切り欠き部から成る嵌着部が設けられた枠体と、筒状の外周導体およびその中心軸に設置させた中心導体ならびにそれらの間に介在させた絶縁体から成るとともに前記嵌着部に嵌着された同軸コネクタとを具備した半導体素子収納用パッケージにおいて、前記保持部材は、前記枠体内外を貫通するとともに外側より前記同軸コネクタを挿着する貫通孔が形成され、かつ前記枠体内側の面の前記貫通孔の下方の部位に回路基板を上面に設置した棚部が設けられ、さらに前記回路基板の表面に前記枠体内側の面より突出した前記中心導体の端部と前記半導体素子とを電気的に接続する線路導体が形成されており、前記保持部材の厚みが前記枠体より肉厚にされていることを特徴とする。
【００１７】
本発明の半導体素子収納用パッケージによれば、同軸コネクタの挿着部と回路基板の設置部を保持部材に設け、保持部材を枠体に嵌着している。保持部材の厚みは枠体に比べ厚くすることにより保持部材の体積を大きくすることで、半導体パッケージをネジ止め等により外部回路基板等に装着する際の枠体に加わる歪みが、保持部材で分散および吸収され、同軸コネクタと回路基板に不要な応力および歪みが伝わることを防止できる。
【００１８】
従来基体上に載置固定されていて、基体の貫通孔をネジ止めし外部電気回路に装着する際に、クラックが入り高周波信号の伝送線路を寸断させていた回路基板は、保持部材上に設置固定されることとなり、回路基板にはほとんど歪みが加わらない状態になり、回路基板のクラック発生を有効に防止できる。また、従来枠体の側面に挿着されていた同軸コネクタも、保持部材に挿着させることとなり、半導体パッケージ製造時の中心導体と線路導体の位置ずれの低減と、半導体パッケージを外部回路基板に実装する際の同軸コネクタに伝わる応力の低減が可能となる。中心導体と線路導体の位置ずれを低減させることで、中心導体と線路導体との接続部における高周波信号の伝送特性を向上でき、同軸コネクタに伝わる応力を低減させることで、同軸コネクタの絶縁体へのクラックを防止することができる。同時に同軸コネクタに伝わる歪みを有効に防止し、同軸コネクタの位置ずれが無くなり、中心導体が線路導体から離脱することを有効に防止できる。
【００１９】
好ましくは、保持部材の嵌着部と前記外周導体の挿着部との最短距離をＸ、前記外周導体の幅をｄとした場合、ｄ≧１．５ｍｍの場合にＸ≧０．２ｄであり、またはｄ＜１．５ｍｍの場合にＸ≧０．３ｍｍであることを特徴とする。
【００２０】
Ｘ≧０．２ｄとすることにより、半導体パッケージを外部回路基板に実装する際に枠体より同軸コネクタの外周導体の挿着部に伝わる歪みを保持部材で有効に吸収し、同軸コネクタの中心導体が位置ずれして線路導体から離脱することを確実に防止することができる。また、Ｘ≧０．３ｍｍとすることにより、金属に機械加工を施し、保持部材を形成することが可能となる。
【００２１】
また本発明において、好ましくは、前記嵌着部の前記枠体内側の開口の外周部に段差部が形成されていることを特徴とする。
【００２２】
本発明は、上記の構成により、枠体と保持部材間をろう付けにより接合する際、保持部材をろう付けするためのろう材が保持部材の枠体内側の面に流れ出て保持部材に設けられた棚部に不要なろう材溜りを形成するのを防止できる。
【００２３】
さらに本発明において、好ましくは、前記保持部材の前記枠体内側の面が前記枠体内面より前記枠体内側に突出していることを特徴とする。
【００２４】
本発明は、上記の構成により、枠体と保持部材間をろう付けにより接合する際、保持部材をろう付けするためのろう材が保持部材の枠体内側の面に流れ出て保持部材に設けられた棚部に不要なろう材溜りを形成するのを防止できる。
【００２５】
【発明の実施の形態】
本発明の半導体パッケージを以下に詳細に説明する。図１は本発明の半導体パッケージの実施の形態の一例を示す断面図であり、１は基体、２は枠体、３は同軸コネクタ、６は回路基板、１１は保持部材である。
【００２６】
基体１は鉄−ニッケル−コバルト合金や銅−タングステンの焼結材等から成り、そのインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すか、または射出成形と切削加工を施すことによって所定の形状に製作される。その上側主面の略中央部には、ＩＣ、ＬＳＩ、半導体レーザ（ＬＤ）、フォトダイオード（ＰＤ）等の半導体素子５を載置するための載置部１ａが形成されており、載置部１ａには半導体素子５が半田等の接合材により載置固定される。半導体素子５は、その電極が回路基板６に被着形成されている線路導体６ａにボンディングワイヤ７等を介して電気的に接続されている。
【００２７】
また、基体１の上側主面の外周部には載置部１ａを囲繞するようにして枠体２が接合され立設されており、枠体２は基体１とともにその内側に半導体素子５を収容する空所を形成する。
【００２８】
枠体２は基体１と同様に鉄−ニッケル−コバルト合金や銅−タングステンの焼結材等から成り、基体１と一体成形されることによって、あるいは基体１に銀ろう等のろう材を介してろう付けされたり、シーム溶接法等の溶接法により接合されることによって基体１の上側主面の外周部に立設される。
【００２９】
枠体２の側面には保持部材１１が嵌着される嵌着部２ａが形成されている。嵌着部２ａは、枠体２内外を貫通する貫通孔であったり、枠体２の基体１との接合面側から逆Ｕ字型に切り欠かれて枠体２内外を貫通する切り欠きであったり、枠体２の蓋体４との接合面側からＵ字型に切り欠かれて枠体２内外を貫通する切り欠きであっても良い。
【００３０】
嵌着部２ａ内には鉄−ニッケル−コバルト合金等の金属からなる保持部材１１が挿入されるとともに保持部材１１の外周面と嵌着部２ａの内周面とが銀ろう等のろう材を介して嵌着接合されている。
【００３１】
同軸コネクタ３は、内部に収容する半導体素子５を外部の同軸ケーブル１０に電気的に接続するものであり、鉄−ニッケル−コバルト合金等の金属から成る円筒状の外周導体３ａの中心軸に同じく鉄−ニッケル−コバルト合金等の金属から成る中心導体３ｂが絶縁体３ｃを介して固定された構造をしている。
【００３２】
保持部材１１には、回路基板６を上面に設置するための棚部１１ａと、同軸コネクタ３を挿入するための貫通孔１１ｂが設けられている。棚部１１ａには半田等の接合材６ｄを載置し、接合材６ｄの上に線路導体６ａと接地導体６ｃとを具備した回路基板６を、接地導体６ｃ面が接合材６ｄ側になるようにして設置する。貫通孔１１ｂは、枠体２の内外を貫通するように形成され、同軸コネクタ３を挿入するとともに外周導体３ａとの間に半田等の封着材８を挿入する。中心導体３ｂの先端部は、回路基板６の上面に突出させ、中心導体３ｂの先端部と線路導体６ａの上面との間に半田等の導電性接着材６ｂを載置する。
【００３３】
しかる後、加熱して接合材６ｄと封着材８および導電性接着材６ｂを溶融させ、接合材６ｄにより回路基板６が棚部１１ａに強固に固定され、溶融した封着材８は毛細管現象により外周導体３ａと貫通孔１１ｂの内壁との隙間に充填させることによって、外周導体３ａが貫通孔１１ｂ内に半田等の封着材８を介して挿着され、導電性接着材６ｂにより中心導体３ｂと線路導体６ａとが接続される。
【００３４】
かくして、グランドとしての外周導体３ａが保持部材１１に封着材８を介して保持部材１１に電気的に接続され、また信号線路としての中心導体３ｂが回路基板６の線路導体６ａに半田等から成る導電性接着材６ｂを介してそれぞれ電気的に接続される。
【００３５】
中心導体３ｂを伝送する高周波信号は、貫通孔１１ｂ，１１ｃ部において貫通孔１１ｂ，１１ｃの中心軸を伝送する同軸線路を伝送し、保持部材１１の枠体２内側の面から出て線路導体６ａの一端の半田等の導電性接着材６ｂに達した後は、マイクロストリップ線路となっている線路導体６ａ上を伝送する。この同軸線路とマイクロストリップ線路は、所定の特性インピーダンス値に整合されている。導電性接着材６ｂの接続部において、中心導体３ｂの先端部の位置、線路導体６ａの位置、および導電性接着材６ｂの量により、信号線路のインピーダンスが所定の値に設定されている。このようにして、半導体パッケージ内において、反射損失や透過損失等の伝送損失のない良好な信号線路が形成される。
【００３６】
保持部材１１の貫通孔１１ｃ内に挿入固定される同軸コネクタプラグ９は、外部電気回路に接続された同軸ケーブル１０と保持部材１１に挿着された同軸コネクタ３とを接続するためのプラグであり、その外周面はネジ状となっており、内周面にネジ切りを有する貫通孔１１ｃにネジ止めされる。
【００３７】
そして、本発明の半導体パッケージは、半導体素子５の電極と回路基板６の上面に被着された線路導体６ａとをボンディングワイヤ７により電気的に接続し、しかる後、枠体２の上面に鉄−ニッケル−コバルト合金等の金属から成る蓋体４を半田付け法やシームウエルド法により接合することにより製品としての半導体装置となる。
【００３８】
この半導体装置は、基体１の外周側に設けられた貫通孔１ｂをネジ止めすることにより、外部回路基板に実装される。また、同軸コネクタプラグ９と外部電気回路に接続された同軸ケーブル１０とを接続することにより、内部に収容する半導体素子５が外部電気回路に電気的に接続され、半導体素子５が高周波信号で作動することとなる。
【００３９】
貫通孔１ｂを外部回路基板にネジ止めして実装する際、半導体パッケージ製造時のろう付け工程において反りが発生していた基体１の反りが矯正され、基体１および枠体２に余計な応力や歪みが加わることとなる。本発明の半導体パッケージにおいては、同軸コネクタ３および回路基板６が保持部材１１を介して枠体２に設けられているため、枠体２に余計な応力や歪みが加わった場合においても、保持部材１１において分散および吸収される。保持部材１１で応力や歪みを分散させる、即ち単位体積当たりの変形を少なくさせかつ歪みを吸収させるためには、保持部材１１の体積が大きい方がよく、保持部材１１の厚みを枠体２より肉厚にすることにより体積を大きくする。
【００４０】
従来、枠体２の側面に設けられた貫通孔に挿着されていた同軸コネクタ３は、保持部材１１の貫通孔１１ｂに挿着され、また従来基体１の上側主面の載置部１ａに載置されていた回路基板６は、保持部材１１の棚部１１ａに設置され、同軸コネクタ３と回路基板６はともに保持部材１１に設けられることとなる。したがって、枠体２と基体１の接合位置がずれることによる同軸コネクタ３と回路基板６の位置ずれが解消され、同軸コネクタ３の中心導体３ｂと回路基板６の線路導体６ａとの接続部の位置を安定させることができる。
【００４１】
本発明において、図２に示すように、保持部材１１の嵌着部２ａと外周導体３ａの挿着部との最短距離をＸ、外周導体３ａの幅をｄとした場合、ｄ≧１．５ｍｍの場合にＸ≧０．２ｄであり、またはｄ＜１．５ｍｍの場合にＸ≧０．３ｍｍであるようにすると、接続部の位置をより安定させることができる。
【００４２】
Ｘ＜０．２ｄ（ただし、ｄ≧１．５ｍｍ）とした場合、枠体２より保持部材１１に伝わってくる歪みを保持部材１１で十分に吸収できず、同軸コネクタ３に応力や歪みが加わり、中心導体３ｂが位置ずれを起こす。そのため、半導体パッケージを外部回路基板に実装する際に基体１の反りが矯正されると、中心導体３ｂの先端部が導電性接着材６ｂから外れてしまう可能性があり、中心導体３ｂと線路導体６ａとの接続の信頼性が低下することになる。
【００４３】
また、保持部材１１は、鉄−ニッケル−コバルト合金等の金属に切削加工等の機械加工を施すことによって形成されるものであるから、ｄ＜１．５ｍｍであってＸ＜０．３ｍｍの場合、機械加工の最小限界値を超えてしまい加工がきわめて困難になる。したがって、ｄ＜１．５ｍｍである場合は、Ｘ≧０．３ｍｍであることがよい。
【００４４】
好ましくは、図３に示すように、保持部材１１を嵌着するための嵌着部２ａの枠体２内側の開口から内側にかけて内法が小となる段差部１２が形成されていることが良く、この場合、枠体２と保持部材１１をろう付け等により接合する際にろう材が保持部材１１の枠体２内側の面に流れ出て棚部１１ａへ流れこむことを段差部１２により防止できる。
【００４５】
この段差部１２は、図３のように、嵌着部２ａの枠体２内側の開口において嵌着部２ａの外周部を階段状に窪ませて形成したり、図４のように、嵌着部２ａの枠体２内側の開口において角部を面取り加工して、枠体２内側の開口の外周部を斜面状にして形成することもできる。段差部１２は、枠体２と保持部材１１を接合するためのろう材が自重で保持部材１１の枠体２内側の面を垂れて、棚部１１ａへ流れ込むことを防止するのが目的であるため、段差部１２は少なくとも棚部１１ａの上方の部位に設ければ効果がある。
【００４６】
段差部１２の深さは０．１ｍｍ以上、幅は０．２ｍｍ以上、長さは棚部１１ａの幅以上であれば良い。深さが０．１ｍｍ未満の場合、段差部１２の深さが浅いため、段差部１２を越えてろう材が保持部材１１の枠体２内側の面に流れ出易くなり、幅が０．２ｍｍ未満の場合、同じく段差部１２を越えてろう材が保持部材１１の枠体２内側の面に流れ出易くなる。段差部１２の長さが棚部１１ａの幅以下であると、保持部材１１の枠体２内側の面にろう材が流れ出て、棚部１１ａへろう材が流れ込み易くなる。
【００４７】
このようにして、棚部１１ａへのろう材の流れ込みを防いで、結果として回路基板６を棚部１１ａの上面と平行になるようにして棚部１１ａに設置できる。
【００４８】
段差部１２を設ける代わりに、図５のように、保持部材１１の枠体２内側の面が枠体２内面より枠体２内側に突出した構成としても良い。保持部材１１の枠体２内側の面の突出長さは０．１ｍｍ以上であれば良く、この構成により、枠体２と保持部材１１をろう付け等により接合する際に、同様にして棚部１１ａへろう材が流れこむことを防止できる。突出長さが０．１ｍｍ未満の場合は、保持部材１１の枠体２内側の面にろう材が流れ出易くなる。この構成では、段差部１２を設ける構成と比して、枠体２に段差部１２を設けるための工程を減らすことが可能である。
【００４９】
また、段差部１２を設けるとともに、保持部材１１の枠体２内側の面が枠体２内面より枠体２内側に突出した構成でも良く、この場合段差部１２の底面から保持部材１１の枠体２内側の面までの距離が０．１ｍｍ以上であれば、保持部材１１の枠体２内側の面にろう材が流れ出るのを防ぐ点で有効である。
【００５０】
本発明においては、周波数が５〜５０ＧＨｚ程度の高周波信号の伝送特性を良好なものとすることができる。
【００５１】
なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更は何等差し支えない。
【００５２】
【発明の効果】
本発明は、同軸コネクタの保持部材は、枠体内外を貫通するとともに外側より同軸コネクタを挿着する貫通孔が形成され、かつ枠体内側の面の貫通孔の下方の部位に回路基板を上面に設置した棚部が設けられ、さらに回路基板の表面に枠体内側の面より突出した中心導体の端部と半導体素子とを電気的に接続する線路導体が形成されていることにより、同軸コネクタと回路基板が保持部材を介して枠体に設けられていることから、半導体パッケージをネジ止め等によって外部回路基板等に装着する際の枠体に加わる歪みが、保持部材部において分散および吸収され、保持部材に設置固定される回路基板と挿着される同軸コネクタにはほとんど歪みが発生しない状態になり、回路基板のクラックを有効に防止できるとともに同軸コネクタの絶縁体へのクラックを防止することができる。
【００５３】
回路基板のクラック防止により、回路基板上面に形成した線路導体の断線が防止され、高周波信号を効率良く伝送させることが可能となり、同軸コネクタの絶縁体へのクラックを防止することにより、半導体パッケージ内の気密に保つことと、中心導体を伝送する高周波信号の同軸線路のモードを保つことが可能となり高周波信号を効率良く伝送させることができる。
【００５４】
また、同軸コネクタと回路基板が保持部材に設けられることから、半導体パッケージの製造の際に中心導体と線路導体の位置ずれを従来よりも低減させることが可能となり、中心導体と線路導体の接続部におけるインピーダンスのばらつきを抑えることができ、高周波信号の伝送特性を向上できる。
【００５５】
外部回路基板に実装する際に、枠体に歪みが加わった場合においても同軸コネクタ挿着部に伝わる歪みを有効に防止することになるため、同軸コネクタの位置ずれが無くなり、中心導体が線路導体から外れることも有効に防止できる。
【００５６】
このようにして、回路基板のクラック防止、同軸コネクタの絶縁体のクラック防止、中心導体の線路導体に対する位置ずれ防止、中心導体の線路導体からの外れを防止を実現することとなる。また、これら効果によって、高周波信号の伝送効率に優れかつ気密性に優れた半導体パッケージを提供できる。
本発明は、好ましくは、保持部材の嵌着部と外周導体の挿着部との最短距離をＸ、外周導体の幅をｄとした場合、ｄ≧１．５ｍｍの場合にＸ≧０．２ｄであり、またはｄ＜１．５ｍｍの場合にＸ≧０．３ｍｍであることにより、保持部材の枠体への嵌着面から保持部材の同軸コネクタとの挿着面までの距離が適切に確保されることとなり、枠体より保持部材を介して同軸コネクタに伝わってくる歪みを保持部材で十分に吸収させることができる。同軸コネクタに加わる歪みを減少させることによって、半導体パッケージを外部回路基板に実装する際の中心導体の位置ずれを防止し、中心導体が線路導体から外れるのを確実に防止することができる。
【００５７】
また本発明は、好ましくは、嵌着部の枠体内側の開口の外周部に段差部が形成されていることにより、枠体と保持部材をろう付け等により接合する際に、保持部材を枠体に嵌着するためのろう材が保持部材の棚部に流れ込むのを防止する。その結果、回路基板が棚部に対して傾いて設置されることを防止し、線路導体と同軸コネクタの中心導体との接続位置を一定にすることができ、インピーダンスが安定した、より良好な高周波信号の伝送路を形成することが可能となる。
【００５８】
また本発明は、好ましくは、保持部材の枠体内側の面が枠体内面より枠体内側に突出していることにより、枠体と保持部材をろう付け等により接合する際に、保持部材を枠体に嵌着するためのろう材が保持部材の棚部に流れ込むのを防止する。その結果、回路基板が棚部に対して傾いて設置されることを防止し、線路導体と同軸コネクタの中心導体との接続位置を一定にすることができ、インピーダンスが安定した、より良好な高周波信号の伝送路を形成することが可能となる。即ち、枠体を切り欠いて段差部を設けることなく、段差部を設けた場合と同様の良好な高周波信号の伝送路を形成できる。
【００５９】
従って、本発明は５〜５０ＧＨｚ程度の高周波信号の伝送特性に優れかつ気密性に優れた半導体パッケージを構成し得る。
【図面の簡単な説明】
【図１】本発明の半導体パッケージの一実施形態を示す断面図である。
【図２】本発明の半導体パッケージの他の実施形態を示す保持部材部の要部拡大断面図である。
【図３】本発明の半導体パッケージの他の実施形態を示す保持部材部の要部拡大断面図である。
【図４】本発明の半導体パッケージの他の実施形態を示す保持部材部の要部拡大断面図である。
【図５】本発明の半導体パッケージの他の実施形態を示す保持部材部の要部拡大断面図である。
【図６】従来の半導体パッケージの断面図である。
【符号の説明】
１：基体
１ａ：載置部
２：枠体
２ａ：嵌着部
３：同軸コネクタ
３ａ：外周導体
３ｂ：中心導体
３ｃ：絶縁体
５：半導体素子
６：回路基板
６ａ：線路導体
１１：保持部材
１１ａ：棚部
１１ｂ：貫通孔
１２：段差部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a package for housing a semiconductor element having a coaxial connector as a signal input / output unit.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in a semiconductor element housing package (hereinafter referred to as a semiconductor package) that houses various semiconductor elements that use high-frequency signals such as optical communication, microwave band, and millimeter wave band, the semiconductor element and an external electric circuit board are electrically connected. A coaxial connector is provided as an input / output terminal for connection to the terminal. A semiconductor package having this coaxial connector is shown in a sectional view in FIG. In this figure, 21 is a base, 22 is a frame, 23 is a coaxial connector, and 24 is a lid.
[0003]
The base 21 is a substantially rectangular plate-like body made of a sintered material of iron-nickel-cobalt alloy, copper-tungsten, or the like, and has an IC, LSI, semiconductor laser (LD), A mounting portion 21a for mounting a circuit board 26 on which a semiconductor element 25 such as a photodiode (PD) is mounted is formed. On the mounting portion 21a, the semiconductor element 25 is a circuit made of, for example, alumina ceramics. It is placed and fixed while mounted on the substrate 26.
[0004]
The semiconductor element 25 mounted on the circuit board 26 is electrically connected to a line conductor 26a whose electrode is attached to the circuit board 26 via a bonding wire 27 or the like.
[0005]
A frame body 22 is erected on the outer peripheral portion of the upper main surface of the base body 21 so as to surround the mounting portion 21 a, and the frame body 22 forms a space for housing the semiconductor element 25 together with the base body 21. To do.
[0006]
The frame body 22 is made of an iron-nickel-cobalt alloy, copper-tungsten sintered material or the like, similar to the base body 21, and is formed integrally with the base body 21 or via a brazing material such as silver solder. It is erected on the outer peripheral portion of the upper main surface of the base body 21 by being brazed or joined by a welding method such as a seam welding method.
[0007]
In the coaxial connector 23, a rod-shaped center conductor 23b made of a metal such as iron-nickel-cobalt alloy is fixed to the center of a cylindrical outer conductor 23a made of a metal such as iron-nickel-cobalt alloy via an insulator 23c. Made up.
[0008]
A through hole 22 a into which the coaxial connector 23 is inserted from the outside is formed on the side surface of the frame body 22. The outer peripheral conductor 23a is inserted into the through-hole 22a and the sealing material 28 such as solder is inserted. Then, the sealing material 28 is melted by heating, and the molten sealing material 28 is melted by the capillary phenomenon. The coaxial connector 23 is inserted into the through hole 22a of the frame body 22 via a sealing material 28 such as solder by filling the gap between the through hole 22a and the inner wall of the through hole 22a. The outer peripheral conductor 23a as a ground is electrically connected to the frame body 22 via the sealing material 28, and the center conductor 23b is electrically connected to the line conductor 26a of the circuit board 26 via the conductive adhesive 26b made of solder or the like. Will be connected.
[0009]
In the semiconductor package having the coaxial connector 23, the screw-shaped outer peripheral surface of the coaxial connector plug 29 is screwed into a through hole 22b having a threaded inner peripheral surface, and the coaxial cable 30 connected to an external electric circuit is coaxial. By being attached to the connector plug 29, the semiconductor element 25 housed inside is electrically connected to an external electric circuit via the center conductor 23 b of the coaxial connector 23.
[0010]
The lid body 24 is joined to the upper surface of the frame body 22 by using a welding method such as a brazing method or a seam weld method, and the semiconductor element 25 is accommodated inside the container composed of the base body 21, the frame body 22 and the lid body 24. By being sealed in, a semiconductor device as a product is obtained.
[0011]
This semiconductor package is provided with a through hole 21b in the base 21, and is mounted on an external circuit board or the like by fastening a screw to the through hole 21b.
[0012]
[Problems to be solved by the invention]
However, in the conventional semiconductor package, when the screw is fixed to the through hole 21b and mounted on the external circuit board or the like, the warp of the base 21 that has been warped during the manufacture of the semiconductor package is corrected, and the base 21 is mounted. The fixed circuit board 26 is cracked, the line conductor 26a is cut off, and the high frequency signal cannot be transmitted.
[0013]
When the warping of the base body 21 is corrected, the frame body 22 is distorted and stress is applied to the outer peripheral conductor 23a inserted into the through hole 22a, and the insulator 23c interposed on the inner peripheral surface of the outer peripheral conductor 23a cracks. The airtightness of the semiconductor package is impaired, and the transmission efficiency of the high-frequency signal transmitted through the central conductor 23b of the coaxial connector 23 is deteriorated. Further, the distortion of the frame body 22 causes the position of the through hole 22a to deviate from the position where it should be, the outer peripheral conductor 23a inserted into the through hole 22a deviates, and the overall position of the coaxial connector 23 also deviates. . For this reason, the central conductor 23b is detached from the conductive adhesive 26b, and it is impossible to transmit a high-frequency signal.
[0014]
Even if the shift amount of the center conductor 23 b is small and the connection between the center conductor 23 b and the conductive adhesive 26 b is maintained, the circuit board 26 is placed on the base 21, and the coaxial connector 23 is provided on the side surface of the frame body 22. Therefore, when the semiconductor package is manufactured, the position where the frame 22 is joined to the upper surface of the base body 21 is shifted, and the position of the connecting portion between the center conductor 23b and the line conductor 26a is changed. There was a shift. For this reason, the impedance at the connection portion is not stable, and the transmission efficiency of the high-frequency signal may deteriorate at the connection portion.
[0015]
Therefore, the present invention has been completed in view of the above problems, and an object thereof is to provide a semiconductor package having excellent high-frequency signal transmission efficiency.
[0016]
[Means for Solving the Problems]
The package for housing a semiconductor element of the present invention is bonded to a base body having a mounting portion for mounting a semiconductor element on the upper main surface, and to surround the mounting portion on the outer peripheral portion of the upper main surface, And a frame provided with a through hole or a cutout portion for fitting the holding member of the coaxial connector on the side, a cylindrical outer peripheral conductor, a central conductor installed on the central axis thereof, and their In the package for housing a semiconductor element, comprising an insulator interposed therebetween and a coaxial connector fitted to the fitting portion, the holding member penetrates the inside and outside of the frame and the coaxial connector from outside And a shelf having a circuit board installed on the upper surface is provided in a portion below the through hole on the inner surface of the frame body, and further on the surface of the circuit board, the inner side of the frame body is formed. The face The end portion of the protruding the central conductor wherein are line conductor for electrically connecting the semiconductor element is formed, the thickness of the holding member is characterized in that it is in thick from the frame.
[0017]
According to the semiconductor element storage package of the present invention, the insertion portion of the coaxial connector and the installation portion of the circuit board are provided on the holding member, and the holding member is fitted to the frame. By increasing the thickness of the holding member by increasing the thickness of the holding member compared to the frame, the strain applied to the frame when the semiconductor package is mounted on an external circuit board by screwing or the like is dispersed by the holding member. Further, unnecessary stress and strain can be prevented from being transmitted to the coaxial connector and the circuit board.
[0018]
The circuit board that has been mounted and fixed on the base body and that has cracked the transmission line of the high-frequency signal when the through hole of the base body is screwed and attached to an external electric circuit is installed on the holding member. As a result, the circuit board is hardly distorted and cracks in the circuit board can be effectively prevented. In addition, the coaxial connector that has been conventionally attached to the side surface of the frame body is also attached to the holding member, so that the positional deviation between the center conductor and the line conductor during manufacturing of the semiconductor package is reduced, and the semiconductor package is attached to the external circuit board. The stress transmitted to the coaxial connector during mounting can be reduced. By reducing the misalignment between the center conductor and the line conductor, it is possible to improve the transmission characteristics of the high-frequency signal at the connection between the center conductor and the line conductor, and by reducing the stress transmitted to the coaxial connector, to the insulator of the coaxial connector Can be prevented. At the same time, the distortion transmitted to the coaxial connector can be effectively prevented, the positional displacement of the coaxial connector can be eliminated, and the central conductor can be effectively prevented from separating from the line conductor.
[0019]
Preferably, when the shortest distance between the fitting portion of the holding member and the insertion portion of the outer conductor is X and the width of the outer conductor is d, X ≧ 0.2d when d ≧ 1.5 mm. Or, if d <1.5 mm, X ≧ 0.3 mm.
[0020]
By setting X ≧ 0.2d, the strain transmitted from the frame body to the insertion portion of the outer peripheral conductor of the coaxial connector when the semiconductor package is mounted on the external circuit board is effectively absorbed by the holding member. Can be reliably prevented from being displaced from the line conductor. Further, by setting X ≧ 0.3 mm, the metal can be machined to form the holding member.
[0021]
In the present invention, it is preferable that a stepped portion is formed on an outer peripheral portion of the opening inside the frame body of the fitting portion.
[0022]
In the present invention, when the frame and the holding member are joined by brazing, the brazing material for brazing the holding member flows out to the inner surface of the holding member and is provided on the holding member. It is possible to prevent an unnecessary brazing material reservoir from being formed on the shelf.
[0023]
Furthermore, in the present invention, it is preferable that the inner surface of the holding member protrudes from the inner surface of the frame to the inner side of the frame.
[0024]
In the present invention, when the frame and the holding member are joined by brazing, the brazing material for brazing the holding member flows out to the inner surface of the holding member and is provided on the holding member. It is possible to prevent an unnecessary brazing material reservoir from being formed on the shelf.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
The semiconductor package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a semiconductor package of the present invention. 1 is a base, 2 is a frame, 3 is a coaxial connector, 6 is a circuit board, and 11 is a holding member.
[0026]
The substrate 1 is made of a sintered material of iron-nickel-cobalt alloy or copper-tungsten, and the ingot is subjected to a conventionally well-known metal processing method such as rolling or punching or injection molding and cutting. To produce a predetermined shape. A mounting portion 1a for mounting a semiconductor element 5 such as an IC, LSI, semiconductor laser (LD), or photodiode (PD) is formed in a substantially central portion of the upper main surface. The semiconductor element 5 is placed and fixed to 1a by a bonding material such as solder. The semiconductor element 5 is electrically connected to a line conductor 6a whose electrode is attached to the circuit board 6 via a bonding wire 7 or the like.
[0027]
A frame body 2 is joined and erected on the outer peripheral portion of the upper main surface of the base body 1 so as to surround the mounting portion 1 a, and the frame body 2 houses the semiconductor element 5 along with the base body 1. A void is formed.
[0028]
The frame 2 is made of a sintered material of iron-nickel-cobalt alloy, copper-tungsten or the like in the same manner as the base 1, and is formed integrally with the base 1 or via a brazing material such as silver solder. It is erected on the outer peripheral portion of the upper main surface of the base 1 by being brazed or joined by a welding method such as a seam welding method.
[0029]
A fitting portion 2 a to which the holding member 11 is fitted is formed on the side surface of the frame body 2. The fitting part 2a is a through-hole penetrating the inside and outside of the frame body 2 or a notch penetrating through the inside and outside of the frame body 2 by being cut out in an inverted U shape from the side of the joint surface of the frame body 2 with the base body 1. Or a notch that is notched in a U shape from the side of the joint surface of the frame body 2 with the lid body 4 and penetrates the inside and outside of the frame body 2.
[0030]
A holding member 11 made of a metal such as iron-nickel-cobalt alloy is inserted into the fitting portion 2a, and a brazing material such as silver brazing is used between the outer peripheral surface of the holding member 11 and the inner peripheral surface of the fitting portion 2a. Are fitted and joined.
[0031]
The coaxial connector 3 is for electrically connecting the semiconductor element 5 accommodated in the inside to an external coaxial cable 10, and is similar to the central axis of the cylindrical outer conductor 3 a made of metal such as iron-nickel-cobalt alloy. A central conductor 3b made of a metal such as iron-nickel-cobalt alloy is fixed via an insulator 3c.
[0032]
The holding member 11 is provided with a shelf 11 a for installing the circuit board 6 on the upper surface and a through hole 11 b for inserting the coaxial connector 3. A bonding material 6d such as solder is placed on the shelf portion 11a, and the circuit board 6 including the line conductor 6a and the ground conductor 6c on the bonding material 6d is disposed so that the surface of the ground conductor 6c faces the bonding material 6d. Install. The through-hole 11b is formed so as to penetrate the inside and outside of the frame 2, and the coaxial connector 3 is inserted and the sealing material 8 such as solder is inserted between the outer peripheral conductor 3a. The tip of the center conductor 3b is projected from the top surface of the circuit board 6, and a conductive adhesive 6b such as solder is placed between the tip of the center conductor 3b and the top surface of the line conductor 6a.
[0033]
Thereafter, the bonding material 6d, the sealing material 8 and the conductive adhesive material 6b are melted by heating, and the circuit board 6 is firmly fixed to the shelf portion 11a by the bonding material 6d, and the molten sealing material 8 has a capillary phenomenon. By filling the gap between the outer conductor 3a and the inner wall of the through hole 11b with the outer conductor 3a, the outer conductor 3a is inserted into the through hole 11b via the sealing material 8 such as solder, and the central conductor is formed by the conductive adhesive 6b. 3b and the line conductor 6a are connected.
[0034]
Thus, the outer peripheral conductor 3a as the ground is electrically connected to the holding member 11 via the sealing material 8 and the center conductor 3b as the signal line is connected to the line conductor 6a of the circuit board 6 from solder or the like. Each is electrically connected via the conductive adhesive 6b.
[0035]
The high-frequency signal transmitted through the center conductor 3b is transmitted through a coaxial line that transmits the central axis of the through holes 11b and 11c in the through holes 11b and 11c, and exits from the inner surface of the frame 2 of the holding member 11 to the line conductor 6a. After reaching the conductive adhesive 6b such as solder at one end of the wire, it is transmitted on the line conductor 6a which is a microstrip line. The coaxial line and the microstrip line are matched to a predetermined characteristic impedance value. In the connection portion of the conductive adhesive 6b, the impedance of the signal line is set to a predetermined value depending on the position of the tip of the central conductor 3b, the position of the line conductor 6a, and the amount of the conductive adhesive 6b. In this way, a good signal line without transmission loss such as reflection loss or transmission loss is formed in the semiconductor package.
[0036]
The coaxial connector plug 9 inserted and fixed in the through hole 11 c of the holding member 11 is a plug for connecting the coaxial cable 10 connected to the external electric circuit and the coaxial connector 3 inserted into the holding member 11. The outer peripheral surface has a screw shape and is screwed into a through-hole 11c having a threaded inner peripheral surface.
[0037]
In the semiconductor package of the present invention, the electrode of the semiconductor element 5 and the line conductor 6a attached to the upper surface of the circuit board 6 are electrically connected by the bonding wire 7, and then the iron is formed on the upper surface of the frame body 2. A semiconductor device as a product is obtained by joining the lid 4 made of a metal such as nickel-cobalt alloy by a soldering method or a seam weld method.
[0038]
This semiconductor device is mounted on an external circuit board by screwing a through hole 1b provided on the outer peripheral side of the base 1. Further, by connecting the coaxial connector plug 9 and the coaxial cable 10 connected to the external electric circuit, the semiconductor element 5 accommodated therein is electrically connected to the external electric circuit, and the semiconductor element 5 operates with a high frequency signal. Will be.
[0039]
When the through-hole 1b is screwed to the external circuit board and mounted, the warp of the base body 1 that has been warped in the brazing process at the time of manufacturing the semiconductor package is corrected. Distortion will be added. In the semiconductor package of the present invention, since the coaxial connector 3 and the circuit board 6 are provided on the frame body 2 via the holding member 11, the holding member can be used even when excessive stress or distortion is applied to the frame body 2. 11 is dispersed and absorbed. In order to disperse stress and strain with the holding member 11, that is, to reduce deformation per unit volume and absorb strain, it is better that the volume of the holding member 11 is larger, and the thickness of the holding member 11 is larger than that of the frame 2. Increase the volume by making it thick.
[0040]
Conventionally, the coaxial connector 3 inserted into the through hole provided on the side surface of the frame body 2 is inserted into the through hole 11 b of the holding member 11, and is mounted on the mounting portion 1 a on the upper main surface of the conventional base 1. The mounted circuit board 6 is installed on the shelf 11 a of the holding member 11, and the coaxial connector 3 and the circuit board 6 are both provided on the holding member 11. Therefore, the position shift of the coaxial connector 3 and the circuit board 6 due to the shift of the joining position of the frame 2 and the base body 1 is eliminated, and the position of the connecting portion between the center conductor 3b of the coaxial connector 3 and the line conductor 6a of the circuit board 6 is eliminated. Can be stabilized.
[0041]
In the present invention, as shown in FIG. 2, when the shortest distance between the fitting portion 2a of the holding member 11 and the insertion portion of the outer conductor 3a is X and the width of the outer conductor 3a is d, d ≧ 1.5 mm. In the case of X, if X ≧ 0.2d, or if d <1.5 mm, X ≧ 0.3 mm, the position of the connecting portion can be made more stable.
[0042]
When X <0.2d (d ≧ 1.5 mm), the strain transmitted from the frame 2 to the holding member 11 cannot be sufficiently absorbed by the holding member 11, and stress and strain are applied to the coaxial connector 3. The center conductor 3b is displaced. For this reason, when the warp of the base body 1 is corrected when the semiconductor package is mounted on the external circuit board, the tip of the center conductor 3b may be detached from the conductive adhesive 6b, and the center conductor 3b and the line conductor The reliability of connection with 6a will fall.
[0043]
In addition, since the holding member 11 is formed by subjecting a metal such as an iron-nickel-cobalt alloy to machining such as cutting, when d <1.5 mm and X <0.3 mm The minimum limit value for machining is exceeded, making machining extremely difficult. Therefore, when d <1.5 mm, it is preferable that X ≧ 0.3 mm.
[0044]
Preferably, as shown in FIG. 3, a stepped portion 12 whose inner method is small is formed from the opening inside the frame 2 of the fitting portion 2 a for fitting the holding member 11 to the inside. In this case, when the frame body 2 and the holding member 11 are joined by brazing or the like, the stepped portion 12 can prevent the brazing material from flowing out to the inner surface of the holding body 11 and flowing into the shelf portion 11a. .
[0045]
This step 12 is formed by stepping the outer periphery of the fitting 2a in the opening inside the frame 2 of the fitting 2a as shown in FIG. 3, or as shown in FIG. It is also possible to chamfer the corners in the opening inside the frame body 2 of the portion 2a so that the outer peripheral portion of the opening inside the frame body 2 is inclined. The step portion 12 is intended to prevent the brazing material for joining the frame body 2 and the holding member 11 from dripping down the surface of the holding member 11 on the inner side of the frame body 2 and flowing into the shelf portion 11a. Therefore, it is effective if the stepped portion 12 is provided at least at a position above the shelf portion 11a.
[0046]
The depth of the stepped portion 12 may be 0.1 mm or more, the width is 0.2 mm or more, and the length is not less than the width of the shelf portion 11a. When the depth is less than 0.1 mm, the depth of the stepped portion 12 is shallow, so that the brazing material easily flows out over the stepped portion 12 to the inner surface of the frame 2 and the width is less than 0.2 mm. In this case, the brazing material easily flows out to the surface inside the frame 2 of the holding member 11 similarly over the step portion 12. When the length of the stepped portion 12 is equal to or less than the width of the shelf portion 11a, the brazing material flows out to the inner surface of the frame 2 of the holding member 11, and the brazing material easily flows into the shelf portion 11a.
[0047]
In this way, the brazing material can be prevented from flowing into the shelf portion 11a, and as a result, the circuit board 6 can be installed on the shelf portion 11a so as to be parallel to the upper surface of the shelf portion 11a.
[0048]
Instead of providing the stepped portion 12, as shown in FIG. 5, the surface inside the frame 2 of the holding member 11 may protrude from the inner surface of the frame 2 to the inside of the frame 2. The protruding length of the inner surface of the frame 2 of the holding member 11 may be 0.1 mm or more. With this configuration, when the frame 2 and the holding member 11 are joined by brazing or the like, the shelf portion is similarly formed. It is possible to prevent the brazing material from flowing into 11a. When the protruding length is less than 0.1 mm, the brazing material easily flows out to the inner surface of the frame 2 of the holding member 11. In this configuration, it is possible to reduce the number of steps for providing the step portion 12 in the frame 2 as compared with the configuration in which the step portion 12 is provided.
[0049]
Further, the step portion 12 may be provided and the inner surface of the frame 2 of the holding member 11 may protrude from the inner surface of the frame 2 to the inner side of the frame 2. In this case, the frame of the holding member 11 from the bottom surface of the step portion 12. 2 If the distance to the inner surface is 0.1 mm or more, it is effective in preventing the brazing material from flowing out to the inner surface of the frame 2 of the holding member 11.
[0050]
In the present invention, the transmission characteristic of a high frequency signal having a frequency of about 5 to 50 GHz can be improved.
[0051]
It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
[0052]
【The invention's effect】
According to the present invention, the holding member of the coaxial connector is formed with a through-hole through which the coaxial connector is inserted from outside and into the frame, and the circuit board is placed on the upper surface of the circuit board at a portion below the through-hole on the inner surface of the frame. And a line conductor that electrically connects the end of the central conductor protruding from the inner surface of the frame and the semiconductor element is formed on the surface of the circuit board. Since the circuit board is provided on the frame body via the holding member, the strain applied to the frame body when the semiconductor package is mounted on the external circuit board by screwing or the like is dispersed and absorbed in the holding member portion. In addition, the coaxial connector to be inserted and fixed to the circuit board that is installed and fixed to the holding member is in a state in which almost no distortion occurs, and the crack of the circuit board can be effectively prevented and the coaxial connector is insulated. It is possible to prevent the cracks to.
[0053]
By preventing cracks in the circuit board, disconnection of the line conductor formed on the upper surface of the circuit board is prevented, enabling high-frequency signals to be transmitted efficiently, and preventing cracks in the insulator of the coaxial connector. It is possible to keep the air-tightness and to maintain the mode of the coaxial line of the high-frequency signal transmitted through the center conductor, so that the high-frequency signal can be transmitted efficiently.
[0054]
In addition, since the coaxial connector and the circuit board are provided on the holding member, it is possible to reduce the positional deviation between the center conductor and the line conductor during manufacturing of the semiconductor package, and the connection portion between the center conductor and the line conductor. Variation in impedance can be suppressed, and transmission characteristics of high-frequency signals can be improved.
[0055]
When mounting on an external circuit board, even if the frame is distorted, the distortion transmitted to the coaxial connector insertion part is effectively prevented, so that the positional displacement of the coaxial connector is eliminated and the center conductor is the line conductor. It is also possible to effectively prevent detachment.
[0056]
In this way, it is possible to prevent the circuit board from cracking, the coaxial connector insulator from cracking, the center conductor from being displaced relative to the line conductor, and the center conductor from coming off the line conductor. In addition, due to these effects, it is possible to provide a semiconductor package having excellent high-frequency signal transmission efficiency and excellent airtightness.
In the present invention, preferably, when the shortest distance between the fitting portion of the holding member and the insertion portion of the outer conductor is X and the width of the outer conductor is d, X ≧ 0.2d when d ≧ 1.5 mm. Or if X <0.3 mm when d <1.5 mm, the distance from the fitting surface of the holding member to the frame to the insertion surface of the holding member with the coaxial connector is appropriately secured. Thus, the strain transmitted from the frame body to the coaxial connector via the holding member can be sufficiently absorbed by the holding member. By reducing the strain applied to the coaxial connector, it is possible to prevent the center conductor from being displaced when the semiconductor package is mounted on the external circuit board, and to reliably prevent the center conductor from coming off the line conductor.
[0057]
In the present invention, it is preferable that the step portion is formed in the outer peripheral portion of the opening inside the frame body of the fitting portion, so that the holding member is attached to the frame when the frame body and the holding member are joined by brazing or the like. The brazing material for fitting to the body is prevented from flowing into the shelf of the holding member. As a result, the circuit board can be prevented from being inclined with respect to the shelf, the connection position between the line conductor and the central conductor of the coaxial connector can be made constant, and the impedance is stable and the better high frequency A signal transmission path can be formed.
[0058]
In the present invention, it is preferable that the inner surface of the holding member protrudes from the inner surface of the frame to the inner side of the frame so that the holding member is attached to the frame when the frame and the holding member are joined by brazing or the like. The brazing material for fitting to the body is prevented from flowing into the shelf of the holding member. As a result, the circuit board can be prevented from being inclined with respect to the shelf, the connection position between the line conductor and the central conductor of the coaxial connector can be made constant, and the impedance is stable and the better high frequency A signal transmission path can be formed. That is, it is possible to form a good high-frequency signal transmission line similar to the case where the step portion is provided without cutting out the frame body and providing the step portion.
[0059]
Therefore, the present invention can constitute a semiconductor package having excellent transmission characteristics of high frequency signals of about 5 to 50 GHz and excellent airtightness.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of a semiconductor package of the present invention.
FIG. 2 is an enlarged cross-sectional view of a main part of a holding member portion showing another embodiment of the semiconductor package of the present invention.
FIG. 3 is an enlarged sectional view of a main part of a holding member showing another embodiment of the semiconductor package of the present invention.
FIG. 4 is an enlarged cross-sectional view of a main part of a holding member showing another embodiment of the semiconductor package of the present invention.
FIG. 5 is an enlarged cross-sectional view of a main part of a holding member showing another embodiment of the semiconductor package of the present invention.
FIG. 6 is a cross-sectional view of a conventional semiconductor package.
[Explanation of symbols]
1: Base 1a: Placement part 2: Frame body 2a: Fitting part 3: Coaxial connector 3a: Outer conductor 3b: Center conductor 3c: Insulator 5: Semiconductor element 6: Circuit board 6a: Line conductor 11: Holding member 11a : Shelf portion 11b: Through hole 12: Stepped portion

Claims

A base body having a mounting portion for mounting a semiconductor element on the upper main surface, and a peripheral member of the coaxial connector that is joined to the outer peripheral portion of the upper main surface so as to surround the mounting portion. A frame body provided with a fitting portion including a through-hole or a notch to be fitted, a cylindrical outer conductor, a central conductor installed on the central axis thereof, and an insulator interposed therebetween In a package for housing a semiconductor element comprising a coaxial connector fitted to the fitting part,
The holding member has a through-hole through which the coaxial connector is inserted from outside and into the frame body, and a circuit board is installed on the upper surface of the inner surface of the frame below the through-hole. And a line conductor that electrically connects the end of the central conductor protruding from the inner surface of the frame and the semiconductor element is formed on the surface of the circuit board, and the holding A package for housing a semiconductor element, wherein the thickness of the member is greater than that of the frame .

When the shortest distance between the fitting portion of the holding member and the insertion portion of the outer conductor is X and the width of the outer conductor is d, X ≧ 0.2d when d ≧ 1.5 mm, or 2. The package for housing a semiconductor element according to claim 1, wherein X ≧ 0.3 mm when d <1.5 mm.

3. The package for housing a semiconductor element according to claim 1, wherein a step portion is formed on an outer peripheral portion of the opening inside the frame body of the fitting portion.

3. The package for housing a semiconductor element according to claim 1, wherein a surface inside the frame body of the holding member protrudes inside the frame body from an inner surface of the frame body.