JP4511376B2 - Connection terminal and electronic component storage package and electronic device using the same - Google Patents

Connection terminal and electronic component storage package and electronic device using the same Download PDF

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JP4511376B2
JP4511376B2 JP2005021181A JP2005021181A JP4511376B2 JP 4511376 B2 JP4511376 B2 JP 4511376B2 JP 2005021181 A JP2005021181 A JP 2005021181A JP 2005021181 A JP2005021181 A JP 2005021181A JP 4511376 B2 JP4511376 B2 JP 4511376B2
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flat plate
line conductor
plate portion
connection terminal
wall
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JP2006210672A (en
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厚志 小笠原
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Kyocera Corp
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本発明は、半導体レーザ（ＬＤ）、フォトダイオード（ＰＤ）、集積回路素子（ＩＣ）、チップコンデンサ等各種の電子部品を収納するための電子部品収納用パッケージの接続端子に関し、電子部品収納用パッケージの信号入出力部に使用される接続端子ならびにこの接続端子を具備している電子部品収納用パッケージおよび電子装置に関する。   The present invention relates to a connection terminal of an electronic component storage package for storing various electronic components such as a semiconductor laser (LD), a photodiode (PD), an integrated circuit element (IC), and a chip capacitor, and the electronic component storage package The present invention relates to a connection terminal used in the signal input / output unit, an electronic component storage package and an electronic device having the connection terminal.

従来、ＬＤ、ＰＤ、ＩＣ、チップコンデンサ等各種の電子部品を収納するための電子部品収納用パッケージ（以下、パッケージともいう）には、電子部品と外部電気回路基板とを電気的に接続するための接続端子が設けられている。この接続端子を図５（ａ）に斜視図で示す。   2. Description of the Related Art Conventionally, an electronic component storage package (hereinafter also referred to as a package) for storing various electronic components such as LD, PD, IC, and chip capacitor is for electrically connecting the electronic component and an external electric circuit board. Connection terminals are provided. This connection terminal is shown in a perspective view in FIG.

同図において、101はアルミナ（Ａｌ２Ｏ３）質焼結体，窒化アルミニウム（ＡｌＮ）質焼結体またはムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）質焼結体等の誘電体から成る四角平板状の平板部であり、平板部101はその上面に、一辺から対向する他辺にかけて、タングステン（Ｗ），モリブデン（Ｍｏ）等のメタライズ層から成る線路導体103が形成される。 In the figure, 101 is a rectangular flat plate made of a dielectric such as alumina (Al 2 O 3 ) sintered body, aluminum nitride (AlN) sintered body, or mullite (3Al 2 O 3 · 2SiO 2 ) sintered body. A line conductor 103 made of a metallized layer such as tungsten (W) or molybdenum (Mo) is formed on the upper surface of the flat plate portion 101 from one side to the opposite side.

また、平板部101の上面には、線路導体103の一部を間に挟んで接合されるとともに、Ａｌ２Ｏ３質焼結体，ＡｌＮ質焼結体または３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等の誘電体から成る直方体状の壁体102が設置される。そのため、線路導体103は、平板部101と壁体102とに狭持されていない部位のマイクロストリップ線路と、平板部101と壁体102とに狭持される部位のストリップ線路とから成る（例えば、特許文献１参照）。 Further, the upper surface of the flat plate portion 101 is joined with a part of the line conductor 103 interposed therebetween, and the Al 2 O 3 quality sintered body, AlN quality sintered body, or 3Al 2 O 3 · 2SiO 2 quality fired. A rectangular parallelepiped wall body 102 made of a dielectric material such as a ligature is installed. Therefore, the line conductor 103 includes a microstrip line that is not sandwiched between the flat plate portion 101 and the wall body 102, and a strip line that is sandwiched between the flat plate portion 101 and the wall body 102 (for example, , See Patent Document 1).

このような接続端子は、パッケージの側壁部に設けられた接続端子の取付部にロウ付けや半田付け等で接合して取り付けられることによりパッケージ内外を遮断，封止し、パッケージ内部を気密に保つ。   Such a connection terminal is attached by attaching to the attachment portion of the connection terminal provided on the side wall portion of the package by brazing, soldering, or the like, thereby blocking and sealing the inside and outside of the package, and keeping the inside of the package airtight. .

この接続端子は、図５（ｂ）に示すように、平板部101となるセラミックグリーンシートの上に壁体102となるセラミックグリーンシートを順次積層し、その後焼結させて作製される。   As shown in FIG. 5B, the connection terminal is manufactured by sequentially laminating a ceramic green sheet serving as the wall body 102 on the ceramic green sheet serving as the flat plate portion 101 and then sintering the ceramic green sheet.

また、近時の接続端子においては、線路導体103と同様のメタライズ層から成る接地導体を平板部102の下面に設けるとともにこの接地導体にリード端子を接合させて、外部電気回路基板の接地電位と電気的に接続させる場合や、パッケージの小型集積化に伴い高密度の線路導体103の配線が必要となり、線路導体103を平板部101の上面だけでなく、下面にも形成する場合がある。このような平板部101の上面および下面に線路導体103が形成される接続端子の例を図６（ａ）に示す。   Further, in recent connection terminals, a ground conductor made of a metallized layer similar to the line conductor 103 is provided on the lower surface of the flat plate portion 102, and a lead terminal is joined to the ground conductor, so that the ground potential of the external electric circuit board can be reduced. In the case of being electrically connected or in accordance with the miniaturization and integration of the package, wiring of the high-density line conductor 103 is required, and the line conductor 103 may be formed not only on the upper surface of the flat plate portion 101 but also on the lower surface. An example of a connection terminal in which the line conductor 103 is formed on the upper surface and the lower surface of the flat plate portion 101 is shown in FIG.

同図において、101はＡｌ２Ｏ３質焼結体，ＡｌＮ質焼結体または３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等の誘電体から成る四角平板状の平板部であり、平板部101はその上面および下面に、一辺から対向する他辺にかけてＷ，Ｍｏ等のメタライズ層から成る線路導体103が形成される。 In the figure, 101 is Al 2 O 3 sintered material, a square flat plate portion made of AlN sintered body or 3Al 2 O 3 · 2SiO 2 Quality sintered body or the like dielectric, the flat plate portion 101 A line conductor 103 made of a metallized layer of W, Mo or the like is formed on the upper and lower surfaces from one side to the opposite side.

また、平板部101の上面には、Ａｌ２Ｏ３質焼結体，ＡｌＮ質焼結体または３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等の誘電体から成る直方体状の第一の壁体102ａが設置されるとともに、平板部101の下面には、Ａｌ２Ｏ３質焼結体，ＡｌＮ質焼結体または３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等の誘電体から成る直方体状の第二の壁体102ｂが設置される（例えば、特許文献２参照）。 Further, the upper surface of the flat plate portion 101, Al 2 O 3 sintered material, AlN sintered body or 3Al 2 O 3 · 2SiO 2 Quality sintered body such as a rectangular parallelepiped first wall consisting of a dielectric with 102a is installed on the lower surface of the flat plate portion 101, Al 2 O 3 sintered material, rectangular of AlN sintered body or 3Al 2 O 3 · 2SiO 2 quality sintered body or the like dielectric The second wall 102b is installed (see, for example, Patent Document 2).

この接続端子は、図６（ｂ）に示すように、第二の壁体102ｂとなるセラミックグリーンシートの上に平板部101および第一の壁体102ａとなるセラミックグリーンシートを順次積層し、その後焼結させて作製される。   As shown in FIG. 6 (b), the connection terminal is formed by sequentially laminating a flat plate portion 101 and a ceramic green sheet serving as the first wall body 102a on the ceramic green sheet serving as the second wall body 102b. It is made by sintering.

以上のような接続端子は、上面の中央部に電子部品が載置される載置部を有する基体と、この基体の上面に載置部を囲繞するように取着され、側部に形成された貫通孔または切欠きによって接続端子の取付部が形成された枠体とから成るパッケージにおいて、枠体が金属製である場合（メタルウォールタイプ）は取付部に嵌着されロウ付けされることにより、または枠体がセラミックス製である場合（セラミックウォールタイプ）は、上記の接続端子が枠体のメタライズ層が形成された取付部に嵌着されロウ付けされる、または上記の接続端子と枠体とが一体的に形成されることにより、内部に収容する電子部品と外部電気回路基板との間で入出力される信号の接続端子として機能する。
特開2002−100693号公報 特開2001−168235号公報 The connection terminals as described above are formed on the side portion of the base body having a mounting portion on which an electronic component is placed at the center of the upper surface, and attached to the upper surface of the base body so as to surround the mounting portion. If the frame body is made of metal (metal wall type) in a package comprising a frame body in which the connection terminal mounting portion is formed by a through hole or notch, it is fitted and brazed to the mounting portion. When the frame is made of ceramics (ceramic wall type), the connection terminal is fitted and brazed to the mounting portion on which the metallization layer of the frame is formed, or the connection terminal and the frame Are integrally formed to function as a connection terminal for signals input and output between the electronic component housed inside and the external electric circuit board.
Japanese Patent Laid-Open No. 2002-100653 JP 2001-168235 A

しかしながら、特許文献２に示されるような上記従来の接続端子において、第二の壁体102ｂとなるセラミックグリーンシートの上に平板部101および第一の壁体102ａとなるセラミックグリーンシートを順次積層することによって作製されるので、積層ズレが生じて、平板部101の第一の壁体102ａと接合される面が平板部101の第二の壁体102ｂに接合される面の領域からはみ出し易く、はみ出した第一の壁体102ａ部分には下方を支える第二の壁体102ｂが存在しないために、密着圧力が加わらず、第一の壁体102ａを平板部101に完全に密着接合させるということができなかった。   However, in the conventional connection terminal as shown in Patent Document 2, the flat plate portion 101 and the ceramic green sheet to be the first wall body 102a are sequentially laminated on the ceramic green sheet to be the second wall body 102b. As a result, the misalignment occurs, and the surface joined to the first wall body 102a of the flat plate portion 101 easily protrudes from the region of the surface joined to the second wall body 102b of the flat plate portion 101, Since the protruding second wall 102a does not have the second wall 102b that supports the lower side, the first wall 102a is completely bonded to the flat plate portion 101 without applying contact pressure. I could not.

このように、第一の壁体102ａを平板部101に完全に密着接合させることができなくなると、接続端子をパッケージに設置した場合に、密着接合されていない部分から気密が破れ、パッケージ内部を気密に保持するのが困難となるとともに、接続端子をパッケージにロウ付け接合する際に、パッケージとの熱膨張差による熱応力が作用したり、線路導体103とパッケージ内部の電子部品とをボンディングワイヤを介して接合する際に平板部101に機械的衝撃が作用したり等の外力が接続端子に作用すると、第一の壁体102ａが平板部101に密着接合されていない箇所を起点としたクラックが発生して、そのクラックによってパッケージ内部を気密に保持できなくなり、かつ線路導体103が断線してしまうことがあった。   As described above, if the first wall 102a cannot be completely tightly bonded to the flat plate portion 101, when the connection terminal is installed in the package, the airtightness is broken from the portion that is not tightly bonded, and the inside of the package is It becomes difficult to hold the airtight, and when the connection terminal is brazed to the package, thermal stress due to a difference in thermal expansion from the package acts, or the line conductor 103 and the electronic component inside the package are bonded to the bonding wire. When an external force such as a mechanical shock acts on the flat plate portion 101 when it is joined via the connection terminal, a crack originated from a location where the first wall 102a is not tightly joined to the flat plate portion 101 In some cases, the inside of the package cannot be kept airtight due to the crack, and the line conductor 103 is disconnected.

その結果、パッケージ内部を気密に遮断することができなくなるとともに、電子部品と外部との間で電気信号を入出力させることができなくなって、電子部品を正常かつ安定に作動させることができなくなるという問題点があった。   As a result, the inside of the package cannot be hermetically shut off, and electrical signals cannot be input / output between the electronic component and the outside, and the electronic component cannot be operated normally and stably. There was a problem.

また、線路導体103を保護する等の目的で線路導体103の表面にめっき法によって金属層を被着させる場合、第一の壁体102ａの平板部101に積層されていない部位にめっき液が入り込み易く、めっき液が入り込んだ箇所にめっきノビ（所定のめっき箇所の周辺に不要なめっきがかかってしまう現象）が発生して、複数の線路導体103間を電気的に短絡させてしまったり、入り込んだめっき液がパッケージ内部に蒸発して電子部品を腐食させてしまったりして、電子部品の作動を妨げてしまうという問題点があった。   In addition, when a metal layer is deposited on the surface of the line conductor 103 by a plating method for the purpose of protecting the line conductor 103, the plating solution enters a portion of the first wall body 102a that is not stacked on the flat plate portion 101. Easily, a plating nobly (a phenomenon in which unnecessary plating is applied around a predetermined plating location) occurs at the location where the plating solution has entered, and the plurality of line conductors 103 are electrically short-circuited or entered. However, there is a problem that the plating solution evaporates inside the package and corrodes the electronic component, thereby hindering the operation of the electronic component.

従って、本発明は上記問題点に鑑みて完成されたものであり、その目的は、パッケージ内部を気密に遮断することができるとともに、電子部品と外部との間で電気信号を入出力させることができ、電子部品を長期にわたって正常かつ安定に作動させ得る接続端子ならびに接続端子を用いた電子部品収納用パッケージおよび電子装置を提供することにある。   Accordingly, the present invention has been completed in view of the above-described problems, and the object of the present invention is to shut off the inside of the package in an airtight manner and to input / output an electric signal between the electronic component and the outside. Another object of the present invention is to provide a connection terminal capable of operating electronic components normally and stably over a long period of time, an electronic component storage package using the connection terminal, and an electronic device.

本発明の接続端子は、矩形状を成し、両端部が上面の平行な２辺の間に形成された第一の線路導体、および下面の前記平行な２辺の一辺から中央部にかけて形成されるとともに該中央部で上下面間を貫通する貫通導体を介して前記上面に導出され、前記上面の前記貫通導体から前記平行な２辺の他辺にかけて形成された第二の線路導体を有するセラミックスから成る平板部と、セラミックスから成り、前記平板部の上面に前記第一の線路導体および前記第二の線路導体の少なくとも一方を横切るように接合された第一の壁体と、セラミックスから成り、前記平板部の下面の前記第一の壁体と対向する位置に接合された第二の壁体とを具備し、前記平板部の前記第一の壁体と接合される面積は、前記平板部の前記第二の壁体に接合される面積よりも小さく、前記平板部の前記第二の壁体に接合される面の外周と同じかそれよりも内側の領域で前記第一の壁体を前記平板部に接合し、前記平板部の前記一辺側の上下面に、前記第一の線路導体および前記第二の線路導体が上下対向する位置に配されているとともに、前記第一の線路導体が前記平板部の上面と側面との間に形成された第一の切り欠き部の内面にかけて形成されており、前記第二の線路導体が前記平板部の下面と側面との間に形成された第二の切り欠き部の内面にかけて形成されており、前記第二の切り欠き部の幅方向の両端は前記第一の切り欠き部の幅方向の両端より内側に位置していることを特徴とする。

The connection terminal of the present invention has a rectangular shape, and both end portions are formed between two parallel sides of the upper surface, and are formed from one side to the central portion of the two parallel sides of the lower surface. And a second line conductor which is led out to the upper surface through a through conductor penetrating between the upper and lower surfaces at the central portion and formed from the through conductor on the upper surface to the other two sides of the parallel side. A flat plate portion made of ceramics, a first wall body joined to the upper surface of the flat plate portion so as to cross at least one of the first line conductor and the second line conductor, and made of ceramics, A second wall body joined to a position of the lower surface of the flat plate portion facing the first wall body, and the area of the flat plate portion joined to the first wall body is the flat plate portion The area to be joined to the second wall Also small, and bonding the second said inside region than or equal to the outer periphery of the surface to be bonded to the walls of the first wall of said plate on said plate, said side of said plate The first line conductor and the second line conductor are disposed on the upper and lower surfaces on the side of the plate portion, and the first line conductor is formed between the upper surface and the side surface of the flat plate portion. The second line conductor is formed over the inner surface of the second cutout portion formed between the lower surface and the side surface of the flat plate portion. The both ends in the width direction of the second notch are located inside the both ends in the width direction of the first notch .

本発明の電子部品収納用パッケージは、上面の中央部に電子部品が載置される載置部を有する基体と、該基体の上面に前記載置部を囲繞するように取着され、側部に形成された貫通孔または切欠きから成る接続端子の取付部が形成された枠体と、前記取付部に前記一辺側が前記枠体の外側となるように嵌着された上記本発明の接続端子とを具備していることを特徴とする。   An electronic component storage package according to the present invention includes a base having a mounting portion on which an electronic component is mounted at the center of the upper surface, and a side portion attached to the upper surface of the base so as to surround the mounting portion. And a connecting body of the present invention, wherein the connecting terminal of the present invention is fitted to the mounting portion so that the one side is outside the frame body. It is characterized by comprising.

本発明の電子装置は、上記本発明の電子部品収納用パッケージと、前記載置部に載置されるとともに前記接続端子に電気的に接続された電子部品と、前記枠体の上面に前記枠体の内側を塞ぐように取着された蓋体とを具備していることを特徴とする。   The electronic device of the present invention includes the electronic component storage package of the present invention, an electronic component that is placed on the mounting portion and is electrically connected to the connection terminal, and the frame on the upper surface of the frame body. And a lid attached to close the inside of the body.

本発明の接続端子は、矩形状を成し、両端部が上面の平行な２辺の間に形成された第一の線路導体、および下面の平行な２辺の一辺から中央部にかけて形成されるとともに中央部で上下面間を貫通する貫通導体を介して上面に導出され、上面の貫通導体から平行な２辺の他辺にかけて形成された第二の線路導体を有するセラミックスから成る平板部と、セラミックスから成り、平板部の上面に第一の線路導体および第二の線路導体の少なくとも一方を横切るように接合された第一の壁体と、セラミックスから成り、平板部の下面の第一の壁体と対向する位置に接合された第二の壁体とを具備し、平板部の第一の壁体と接合される面積は、平板部の第二の壁体に接合される面積よりも小さく、平板部の第二の壁体に接合される面の外周と同じかそれよりも内側の領域で第一の壁体を平板部に接合し、前記平板部の前記一辺側の上下面に、前記第一の線路導体および前記第二の線路導体が上下対向する位置に配されているとともに、前記第一の線路導体が前記平板部の上面と側面との間に形成された第一の切り欠き部の内面にかけて形成されており、前記第二の線路導体が前記平板部の下面と側面との間に形成された第二の切り欠き部の内面にかけて形成されており、前記第二の切り欠き部の幅方向の両端は前記第一の切り欠き部の幅方向の両端より内側に位置していることから、第一の壁体となるセラミックグリーンシートを平板部となるセラミックグリーンシートに積層加圧する際、平板部の第二の壁体に接合される面の領域からはみ出ないので、平板部と第一の壁体とが接合する面の全体に確実に密着圧力が加わるようになり、第一の壁体が平板部に密着接合されない箇所が生ずるのを防止し、第一の壁体を平板部に完全に密着接合させることができる。
The connection terminal according to the present invention has a rectangular shape, and both end portions are formed between two parallel sides of the upper surface and one side to the center of the two parallel sides of the lower surface. And a flat plate portion made of ceramics having a second line conductor formed from the through conductor on the upper surface to the other side of the two parallel sides, led to the upper surface through a through conductor penetrating between the upper and lower surfaces in the central portion, A first wall body made of ceramics and joined to the upper surface of the flat plate portion so as to cross at least one of the first line conductor and the second line conductor, and a first wall of the lower surface of the flat plate portion made of ceramics A second wall body joined at a position facing the body, and an area joined to the first wall body of the flat plate portion is smaller than an area joined to the second wall body of the flat plate portion. Is the same as the outer periphery of the surface joined to the second wall of the flat plate part? A first wall bonded to the flat plate portion in the region inside the Re, the upper and lower surfaces of the one side end of said plate, to the position where the first line conductor and the second line conductor is vertically opposed And the first line conductor is formed over an inner surface of a first notch formed between an upper surface and a side surface of the flat plate portion, and the second line conductor is formed on the flat plate. Formed on the inner surface of the second cutout portion formed between the lower surface and the side surface of the portion, and both ends in the width direction of the second cutout portion are in the width direction of the first cutout portion. Since the ceramic green sheet serving as the first wall body is laminated and pressed on the ceramic green sheet serving as the flat plate portion because it is located on the inner side from both ends, the region of the surface joined to the second wall body of the flat plate portion Because it does not stick out, the flat plate and the first wall are joined As a result, it is possible to reliably apply a close contact pressure to the whole, prevent a portion where the first wall body is not tightly bonded to the flat plate portion, and completely bond the first wall body to the flat plate portion. .

また、第一の線路導体および第二の線路導体を保護する目的で第一の線路導体および第二の線路導体の表面にめっき法によって金属層を被着させる場合においても、第一の壁体と平板部とが完全に密着した状態で積層されていることから、第一の壁体と平板部との間にめっき液が入り込み難く、めっきノビが発生するのを防止することができる。従って、めっきノビによって複数の線路導体間を電気的に短絡させてしまったり、めっき液がパッケージ内部に蒸発して電子部品を腐食させてしまったりすることがなく、電子部品の作動性を良好に維持することができる。   Even when a metal layer is applied to the surfaces of the first line conductor and the second line conductor by plating for the purpose of protecting the first line conductor and the second line conductor, the first wall body is also used. Since the metal plate and the flat plate portion are laminated in close contact with each other, it is difficult for the plating solution to enter between the first wall body and the flat plate portion, and it is possible to prevent the occurrence of plating noise. Therefore, there is no electrical short circuit between the line conductors due to plating nobbling, and the plating solution does not evaporate inside the package and corrode the electronic components. Can be maintained.

その結果、接続端子をパッケージに設置しても、パッケージ内部を気密に保持することができるとともに、接続端子に外力が作用してもクラックが発生するのを防止し、線路導体の断線を防止することができる、多数の信号を入出力するための多数の線路導体を備えた小型の接続端子とすることができる。そして、パッケージ内部に収納する電子部品を長期にわたって正常かつ安定に作動させることができ、多数の信号を入出力するための多数の線路導体を備えた小型のパッケージとすることができるようになる。   As a result, even if the connection terminal is installed in the package, the inside of the package can be kept airtight, and even if an external force is applied to the connection terminal, cracks are prevented and the line conductor is prevented from being disconnected. It is possible to provide a small connection terminal including a large number of line conductors for inputting and outputting a large number of signals. The electronic components housed in the package can be operated normally and stably over a long period of time, and a small package having a large number of line conductors for inputting and outputting a large number of signals can be obtained.

また、本発明の接続端子は、第一の切り欠き部を有する平板部となるセラミックグリーンシートを第二の切り欠き部を有する平板部となるセラミックグリーンシートの上方に積層する際、第一の切り欠き部を有する平板部となるセラミックグリーンシートの積層面が第二の切り欠き部を有する平板部の積層面の領域内からはみ出ないので、第一の切り欠き部を有する平板部となるセラミックグリーンシートが接合される面の全体に確実に密着圧力が加わるようになり、平板部となるセラミックグリーンシートに密着接合されない箇所を生ずることがない。

 In addition, when the connecting terminal of the present invention is laminated above the ceramic green sheet serving as the flat plate portion having the second cutout portion , the first ceramic green sheet serving as the flat plate portion having the first cutout portion is stacked. Since the laminated surface of the ceramic green sheet that becomes the flat plate portion having the cutout portion does not protrude from the region of the laminated surface of the flat plate portion having the second cutout portion, the ceramic that becomes the flat plate portion having the first cutout portion The contact pressure is surely applied to the entire surface to which the green sheet is bonded, and there is no occurrence of a portion that is not closely bonded to the ceramic green sheet serving as the flat plate portion.

本発明の電子部品収納用パッケージは、上面の中央部に電子部品が載置される載置部を有する基体と、基体の上面に載置部を囲繞するように取着され、側部に形成された貫通孔または切欠きから成る接続端子の取付部が形成された枠体と、取付部に一辺側が枠体の外側となるように嵌着された上記構成の接続端子とを具備していることから、本発明の接続端子を具備していることより、気密性に優れかつ線路導体の断線のないパッケージとすることができ、多数の信号を入出力するための多数の線路導体を備えた小型のパッケージとすることができる。   The electronic component storage package according to the present invention is formed on the side portion of the base having a mounting portion on which the electronic component is placed at the center of the upper surface, and on the upper surface of the base so as to surround the mounting portion. And a connection terminal having the above-described structure fitted to the attachment portion so that one side is outside the frame body. Therefore, since the connection terminal of the present invention is provided, it is possible to provide a package that is excellent in airtightness and without disconnection of the line conductor, and includes a large number of line conductors for inputting and outputting a large number of signals. It can be a small package.

本発明の電子装置は、上記構成の電子部品収納用パッケージと、載置部に載置されるとともに接続端子に電気的に接続された電子部品と、枠体の上面に枠体の内側を塞ぐように取着された蓋体とを具備していることから、本発明の電子部品収納用パッケージを具備していることより、気密性を要する電子部品を収納することができ、多数の信号を入出力するための多数の線路導体を備えた作動性に優れる多機能な電子装置とすることができる。   An electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component that is mounted on the mounting portion and is electrically connected to the connection terminal, and the inner surface of the frame is closed on the upper surface of the frame. Since the electronic component storage package of the present invention is included, the electronic component requiring airtightness can be stored and a large number of signals can be received. It can be set as the multifunctional electronic device excellent in operativity provided with many line conductors for inputting and outputting.

本発明の接続端子、接続端子の製造方法、電子部品収納用パッケージおよび電子装置について以下に詳細に説明する。   The connection terminal, the method for manufacturing the connection terminal, the electronic component storage package, and the electronic device of the present invention will be described in detail below.

図１は接続端子の参考例を示す斜視図、図２（ａ）（ｂ）（ｃ）は本発明の接続端子の製造方法を示す側面図、図３（ａ）は本発明の接続端子の実施の形態を示す斜視図、図３（ｂ）は図３（ａ）の接続端子の上面図、図３（ｃ）は図３（ｂ）の接続端子のｘ−ｘ’面における断面図、図４（ａ）は図３（ａ）（ｂ）（ｃ）の接続端子を用いた電子部品収納用パッケージの平面図、図４（ｂ）は図４（ａ）の電子部品収納用パッケージの側面図、図４（ｃ）は図４（ａ）の電子部品収納用パッケージの部分斜視図である。これらの図において、１は本発明の接続端子８の平板部、２ａは第一の壁体、２ｂは第二の壁体、３ａは第一の線路導体、３ｂは第二の線路導体、８は本発明の接続端子、21は本発明の電子部品収納用パッケージの基体、21ａはその載置部、22はその枠体、23はその取付部、25は電子部品である。なお、分かり易くするために表面にメタライズ層が形成されている部分にハッチングを入れて示している。従って、断面図を示す図３（ｃ）のハッチング以外のハッチング部は断面を示すものではない。

FIG. 1 is a perspective view showing a reference example of a connection terminal, FIGS. 2A, 2B and 2C are side views showing a method of manufacturing the connection terminal of the present invention, and FIG. 3A is a view of the connection terminal of the present invention. perspective view showing an embodiment of a top view of a connection terminal of FIG. 3 (b) FIG. 3 (a), cross-sectional view along x-x 'plane of the connecting terminal of FIG. 3 (c) FIG. 3 (b), the 4A is a plan view of an electronic component storage package using the connection terminals of FIGS. 3A, 3B, and 3C, and FIG. 4B is an electronic component storage package of FIG. 4A. FIG. 4C is a partial perspective view of the electronic component storage package of FIG. In these drawings, 1 is a flat plate portion of the connection terminal 8 of the present invention, 2a is a first wall body, 2b is a second wall body, 3a is a first line conductor, 3b is a second line conductor, 8 Is a connection terminal of the present invention, 21 is a substrate of the electronic component storage package of the present invention, 21a is a mounting portion thereof, 22 is a frame body thereof, 23 is an attachment portion thereof, and 25 is an electronic component. For the sake of easy understanding, the portion where the metallized layer is formed on the surface is hatched. Therefore, hatching parts other than the hatching of FIG. 3C showing a sectional view do not show a section.

接続端子８は、図１に示すように、矩形状を成し、両端部が上面の平行な２辺の間に形成された第一の線路導体３ａ、および下面の平行な２辺の一辺から中央部にかけて形成されるとともに中央部で上下面間を貫通する貫通導体を介して上面に導出され、上面の貫通導体から平行な２辺の他辺にかけて形成された第二の線路導体３ｂを有するセラミックスから成る平板部１と、セラミックスから成り、平板部１の上面に第一の線路導体３ａおよび第二の線路導体３ｂの少なくとも一方を横切るように接合された直方体状の第一の壁体２ａと、セラミックスから成り、平板部１の下面の第一の壁体２ａと対向する位置に接合された直方体状の第二の壁体２ｂとを具備しており、平板部１の第一の壁体２ａと接合される面の面積は、平板部１の第二の壁体２ｂに接合される面の面積よりも小さく、平板部
１の第二の壁体２ｂに接合される面の外周と同じかそれよりも内側の領域で第一の壁体２ａを平板部１に接合したものである。

 As shown in FIG. 1 , the connection terminal 8 has a rectangular shape, and both end portions are formed from a first line conductor 3a formed between two parallel sides of the upper surface, and one side of the two parallel sides of the lower surface. It has a second line conductor 3b formed over the central portion and led to the upper surface through a through conductor penetrating between the upper and lower surfaces in the central portion and formed from the through conductor on the upper surface to the other two parallel sides. A flat plate portion 1 made of ceramics, and a rectangular parallelepiped first wall 2a made of ceramics and joined to the upper surface of the flat plate portion 1 so as to cross at least one of the first line conductor 3a and the second line conductor 3b. And a rectangular parallelepiped second wall body 2b joined to a position facing the first wall body 2a on the lower surface of the flat plate portion 1, and the first wall of the flat plate portion 1 The area of the surface joined to the body 2a is the first area of the flat plate portion 1. The first wall 2a is flattened in a region that is smaller than the area of the surface to be joined to the wall 2b and that is the same as the outer periphery of the surface to be joined to the second wall 2b of the flat plate portion 1 or inside thereof. It is joined to part 1.

平板部１は、アルミナ（Ａｌ２Ｏ３）質焼結体，窒化アルミニウム（ＡｌＮ）質焼結体，ムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）質焼結体等のセラミックスからなる例えば四角平板状のものである。 The flat plate portion 1 is, for example, a rectangular flat plate made of ceramics such as an alumina (Al 2 O 3 ) sintered body, an aluminum nitride (AlN) sintered body, and a mullite (3Al 2 O 3 · 2SiO 2 ) sintered body. belongs to.

第一の壁体２ａは、Ａｌ２Ｏ３質焼結体，ＡｌＮ質焼結体，３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等のセラミックスからなる例えば直方体状のものであり、平板部１の上面に第一の線路導体３ａ、または、第一の線路導体３ａおよび第二の線路導体３ｂの一部を間に挟んで接合されている。 The first wall 2a is, Al 2 O 3 sintered material, AlN sintered material, which consists of 3Al 2 O 3 · 2SiO 2 Quality sintered body or the like of the ceramic for example rectangular, flat plate portion 1 The first line conductor 3a or a part of the first line conductor 3a and the second line conductor 3b is joined to the upper surface of the first line conductor 3a.

第二の壁体２ｂは、Ａｌ２Ｏ３質焼結体，ＡｌＮ質焼結体，３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等のセラミックスからなる例えば直方体状のものであり、平板部１の下面に接合されており、第二の線路導体３ｂの一部が接合部に存在する場合は、第二の線路導体３ｂの一部を間に挟んでいる。 Second wall 2b is, Al 2 O 3 sintered material, AlN sintered material, which consists of 3Al 2 O 3 · 2SiO 2 Quality sintered body or the like of the ceramic for example rectangular, flat plate portion 1 When a part of the second line conductor 3b is present at the joint, a part of the second line conductor 3b is sandwiched therebetween.

なお、平板部１，第一の壁体２ａ，および第二の壁体２ｂの材質は搭載される電子部品25の特性に応じた誘電率や熱膨張係数等の特性を有するものが適宜選定される。   The material of the flat plate portion 1, the first wall body 2a, and the second wall body 2b is appropriately selected to have characteristics such as a dielectric constant and a thermal expansion coefficient according to the characteristics of the electronic component 25 to be mounted. The

ここで、平板部１の第一の壁体２ａと接合される面の面積の大きさは、平板部１の第二の壁体２ｂに接合される面の面積の大きさよりも小さく、平板部１の第一の壁体２ａが接合される面の外周は、平板部１の第二の壁体２ｂに接合される面の外周と同じ位置か、接合される面の内側の領域内に収まるように第一の壁体２ａが平板部１に接合されている。   Here, the size of the area of the flat plate portion 1 to be joined to the first wall 2a is smaller than the size of the area of the flat plate portion 1 to be joined to the second wall 2b. The outer periphery of the surface to which the first wall body 2a is joined is within the same position as the outer periphery of the surface to be joined to the second wall body 2b of the flat plate portion 1 or within the region inside the surface to be joined. In this way, the first wall body 2 a is joined to the flat plate portion 1.

この構成により、第一の壁体２ａとなるセラミックグリーンシートを平板部１となるセラミックグリーンシート上に積層して加圧する際、積層ズレが生じても、平板部１の第二の壁体２ｂに接合される面の領域からはみ出ないので、平板部１と第一の壁体２ａとが接合する面の下方が常に第二の壁体２ｂによって支えられ、第一の壁体２ａの接合面全体に確実に圧力が加わるようになり、第一の壁体２ａが平板部１に密着接合されない箇所が生じないので、第一の壁体２ａを平板部１に完全に密着接合させることができる。   With this configuration, when the ceramic green sheet serving as the first wall body 2a is stacked on the ceramic green sheet serving as the flat plate portion 1 and pressed, the second wall body 2b of the flat plate portion 1 is formed even if a stacking shift occurs. And the lower surface of the surface where the flat plate portion 1 and the first wall 2a are bonded is always supported by the second wall 2b, and the bonding surface of the first wall 2a Since the pressure is surely applied to the whole and there is no portion where the first wall 2a is not tightly joined to the flat plate portion 1, the first wall 2a can be completely tightly joined to the flat plate portion 1. .

また、第一の線路導体３ａおよび第二の線路導体３ｂを保護する等の目的で第一の線路導体３ａおよび第二の線路導体３ｂの表面にめっき法によって金属層を被着させる場合においても、第一の壁体２ａと平板部１とが完全に密着した状態で積層されていることから、第一の壁体２ａと平板部１との間にめっき液が入り込み難く、めっきノビが発生するのを有効に防止することができる。従って、めっきノビによって複数の線路導体（複数の第一の線路導体３ａおよび複数の第二の線路導体３ｂ）間を電気的に短絡させてしまったり、めっき液がパッケージ内部に蒸発して電子部品25を腐食させてしまったりすることがなく、電子部品25の作動性を良好に維持することができる。   Also in the case where a metal layer is applied to the surfaces of the first line conductor 3a and the second line conductor 3b by plating for the purpose of protecting the first line conductor 3a and the second line conductor 3b, etc. Since the first wall body 2a and the flat plate portion 1 are laminated in a completely intimate contact state, it is difficult for the plating solution to enter between the first wall body 2a and the flat plate portion 1, and plating nobbling occurs. Can be effectively prevented. Accordingly, the plurality of line conductors (the plurality of first line conductors 3a and the plurality of second line conductors 3b) are electrically short-circuited by plating nobi, or the plating solution evaporates inside the package and the electronic component. The operability of the electronic component 25 can be maintained satisfactorily without corroding 25.

その結果、接続端子８をパッケージに設置してもパッケージ内部を気密に保持することができるとともに、接続端子８に外力が作用してもクラックが発生するのを防止し、線路導体の断線を防止することができる、多数の信号を入出力するための多数の線路導体を備えた小型の接続端子８とすることができる。そして、パッケージ内部に収納する電子部品25を長期にわたって正常かつ安定に作動させることができ、多数の信号を入出力するための多数の線路導体を備えた小型のパッケージとすることができるようになる。   As a result, even if the connection terminal 8 is installed in the package, the inside of the package can be kept airtight, and even if an external force is applied to the connection terminal 8, cracks are prevented and the line conductor is prevented from being disconnected. The small connection terminal 8 having a large number of line conductors for inputting and outputting a large number of signals can be obtained. The electronic component 25 housed in the package can be operated normally and stably over a long period of time, and a small package having a large number of line conductors for inputting and outputting a large number of signals can be obtained. .

第二の壁体２ｂは、図１に示すように、パッケージの内部に露出する側の端面（左方の平板部１の他辺側）が平板部１のパッケージの内部に露出する他辺側の端面と面一であるのがよく、この構成により、パッケージの内部に露出する側の平板部１が下方から第二の壁体２ｂによって補強され、平板部１上面に形成された第一の線路導体３ａおよび第二の線路導体３ｂのパッケージの内側の先端付近にボンディングワイヤを打って電子部品25と電気的接続しても、ボンディングワイヤの接続時の衝撃で平板部１が破損しにくくすることができる。

 As shown in FIG. 1, the second wall 2 b is on the other side where the end surface (the other side of the left flat plate portion 1) exposed to the inside of the package is exposed inside the package of the flat plate portion 1. In this configuration, the flat plate portion 1 exposed to the inside of the package is reinforced by the second wall body 2b from below, and the first plate formed on the upper surface of the flat plate portion 1 is formed. Even if a bonding wire is placed near the inner ends of the package of the line conductor 3a and the second line conductor 3b to make an electrical connection with the electronic component 25, the flat plate portion 1 is less likely to be damaged by an impact when the bonding wire is connected. be able to.

また、この構成により、第二の壁体２ｂの体積を大きくすることが可能となり、後述の接続端子８の作製時において、第二の壁体２ｂとなるセラミックグリーンシートの積層体の上に、平板部１となるセラミックグリーンシートおよび第一の壁体２ａとなるセラミックグリーンシートを積層する際、第二の壁体２ｂに加わる単位面積あたりの応力を低減させ、第二の壁体２ｂの変形を最小限に抑えることができる。   In addition, this configuration makes it possible to increase the volume of the second wall body 2b, and at the time of manufacturing the connection terminal 8 to be described later, on the ceramic green sheet laminate that becomes the second wall body 2b, When the ceramic green sheet to be the flat plate portion 1 and the ceramic green sheet to be the first wall body 2a are laminated, the stress per unit area applied to the second wall body 2b is reduced, and the second wall body 2b is deformed. Can be minimized.

なお、第二の壁体２ｂのパッケージの内部に露出する側の端面が平板部１のパッケージの内部に露出する側の端面よりもパッケージ内側となると、第一の線路導体３ａおよび第二の線路導体３ｂが電子部品25から遠ざかってしまい、第一の線路導体３ａおよび第二の線路導体３ｂと電子部品25とを接続するためのボンディングワイヤ等の長さが長くなってしまう。その結果、このボンディングワイヤ等による接続部における電気信号の伝送損失が大きくなり、電気信号を効率よく伝送できなくなる傾向にあり、不適である。   When the end surface of the second wall 2b exposed to the inside of the package is located inside the package relative to the end surface of the flat plate portion 1 exposed to the inside of the package, the first line conductor 3a and the second line The conductor 3b moves away from the electronic component 25, and the lengths of the bonding wires and the like for connecting the first line conductor 3a and the second line conductor 3b to the electronic component 25 are increased. As a result, the transmission loss of the electric signal at the connection portion due to the bonding wire or the like increases, and the electric signal tends to be unable to be transmitted efficiently, which is inappropriate.

第一の線路導体３ａは、矩形状を成す平板部１の上面の対向する２辺の一辺から対向する他辺にかけて形成されたタングステン（Ｗ），モリブデン（Ｍｏ）等のメタライズ層から成る。この第一の線路導体３ａは、パッケージの内部に露出する一端は電子部品25に電気的に接続され、パッケージの外部に露出する一端は外部電気回路に電気的に接続される。パッケージの外部に露出する一端には、例えば図４に示すように、鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金やＦｅ−Ｎｉ合金等の金属から成るリード端子26等が接合されていてもよく、リード端子26等を介して、第一の線路導体３ａと外部電気回路とが電気的に接続されることによって、接続の作業を容易なものとすることができる。   The first line conductor 3a is made of a metallized layer such as tungsten (W) or molybdenum (Mo) formed from one side of the two opposing sides of the upper surface of the flat plate portion 1 having a rectangular shape to the other side. One end of the first line conductor 3a exposed to the inside of the package is electrically connected to the electronic component 25, and one end exposed to the outside of the package is electrically connected to an external electric circuit. For example, as shown in FIG. 4, a lead terminal 26 made of a metal such as an iron (Fe) -nickel (Ni) -cobalt (Co) alloy or an Fe—Ni alloy is joined to one end exposed to the outside of the package. The first line conductor 3a and the external electric circuit are electrically connected via the lead terminal 26 and the like, whereby the connection work can be facilitated.

第二の線路導体３ｂは、矩形状を成す平板部１の下面の対向する２辺の一辺から中央部にかけて形成されるとともに中央部で上下面間を貫通する貫通導体を介して上面に導出されるように形成され、さらに上面の貫通導体から他辺にかけて形成されたＷ，Ｍｏ等のメタライズ層から成る。この第二の線路導体３ｂは、一辺側がパッケージの外部に露出するように設置されてリード端子26やリボン線等を介することで外部電気回路に電気的に接続され、他辺側がパッケージの内部に露出するように設置されてボンディングワイヤ等を介することで電子部品25に電気的に接続される。   The second line conductor 3b is formed from one side to the center of two opposite sides of the lower surface of the flat plate portion 1 having a rectangular shape, and is led out to the upper surface through a through conductor that penetrates between the upper and lower surfaces at the center. Further, it is made of a metallized layer such as W or Mo formed from the through conductor on the upper surface to the other side. The second line conductor 3b is installed so that one side is exposed to the outside of the package, and is electrically connected to the external electric circuit through the lead terminal 26, the ribbon wire, etc., and the other side is inside the package. It is installed so as to be exposed and electrically connected to the electronic component 25 through a bonding wire or the like.

パッケージの内部に露出する平板部１の他辺側において、平板部１の上面には第一の線路導体３ａおよび第二の線路導体３ｂの両方が形成されることとなるが、第一の線路導体３ａおよび第二の線路導体３ｂと電子部品25との電気的な接続は、通常ボンディングワイヤが用いられ、第一の線路導体３ａおよび第二の線路導体３ｂはパッケージの外部に露出する一辺側ほどの幅を必要とせず、第一の線路導体３ａおよび第二の線路導体３ｂを同一面に形成することにより線幅が狭くなっても問題ない。   Both the first line conductor 3a and the second line conductor 3b are formed on the upper surface of the flat plate portion 1 on the other side of the flat plate portion 1 exposed inside the package. The electrical connection between the conductor 3a and the second line conductor 3b and the electronic component 25 is usually performed using a bonding wire, and the first line conductor 3a and the second line conductor 3b are exposed to the outside of the package. There is no problem even if the line width is narrowed by forming the first line conductor 3a and the second line conductor 3b on the same plane without requiring an appropriate width.

パッケージの外部に露出する一端には、例えば図４に示すように、予めＦｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属から成るリード端子26等が接合されていてもよく、リード端子26等を介して、第二の線路導体３ｂと外部電気回路とが電気的に接続されることによって、接続の作業を容易なものとすることができる。このように、第一の線路導体３ａおよび第二の線路導体３ｂの他辺側にはリード端子26がろう材等により接合されるので、リード端子26と第一の線路導体３ａおよび第二の線路導体３ｂとを接合するためのロウ材等の導電性接着剤のメニスカスが十分に形成され、十分な接合強度を確保できるように、第一の線路導体３ａおよび第二の線路導体３ｂが平板部１の上下面に形成され、これらの線幅が確保されるのが好ましい。   For example, as shown in FIG. 4, a lead terminal 26 made of a metal such as Fe—Ni—Co alloy or Fe—Ni alloy may be joined to one end exposed to the outside of the package. The connection work can be facilitated by electrically connecting the second line conductor 3b and the external electric circuit through, for example. Thus, since the lead terminal 26 is joined to the other side of the first line conductor 3a and the second line conductor 3b by the brazing material or the like, the lead terminal 26, the first line conductor 3a and the second line conductor 3a are connected. The first line conductor 3a and the second line conductor 3b are flat so that a meniscus of a conductive adhesive such as a brazing material for bonding the line conductor 3b is sufficiently formed and sufficient bonding strength can be secured. It is preferably formed on the upper and lower surfaces of the portion 1 to ensure these line widths.

図４に示すように第一の線路導体３ａおよび第二の線路導体３ｂにリード端子26が接合される場合、平板部１の上下に第一の壁体２ａおよび第二の壁体２ｂが接合されている部位または平板部１のパッケージの内部に露出する第一の壁体２ａの内側の部位において、第二の線路導体３ｂが平板部１の上下面間を貫通する貫通導体が形成されるのがよく、この構成により、パッケージの外部に露出する側の平板部１の上面に第一の線路導体３ａおよび第二の線路導体３ｂの両方が配置されることがないため、第一の線路導体３ａおよび第二の線路導体３ｂの幅を広くとることが可能となり、リード端子26を第一の線路導体３ａおよび第二の線路導体３ｂに強固に接合することができるとともに、第一の線路導体３ａおよび第二の線路導体３ｂの間隔を広くとることが可能となり、リード端子26を第一の線路導体３ａおよび第二の線路導体３ｂに接合するためのロウ材等の導電性接着剤が、隣接する第一の線路導体３ａおよび第二の線路導体３ｂに流れ出るのを防止して、電気的短絡を発生しにくくすることができる。

 As shown in FIG. 4, when the lead terminal 26 is joined to the first line conductor 3 a and the second line conductor 3 b, the first wall body 2 a and the second wall body 2 b are joined to the upper and lower sides of the flat plate portion 1. A through conductor through which the second line conductor 3b penetrates between the upper and lower surfaces of the flat plate portion 1 is formed at the portion that is exposed or inside the first wall 2a exposed inside the package of the flat plate portion 1. In this configuration, both the first line conductor 3a and the second line conductor 3b are not arranged on the upper surface of the flat plate portion 1 on the side exposed to the outside of the package. The conductor 3a and the second line conductor 3b can be widened, the lead terminal 26 can be firmly joined to the first line conductor 3a and the second line conductor 3b, and the first line Between the conductor 3a and the second line conductor 3b It is possible to widen the gap, and a conductive adhesive such as a brazing material for joining the lead terminal 26 to the first line conductor 3a and the second line conductor 3b is added to the adjacent first line conductor 3a and It is possible to prevent the second line conductor 3b from flowing out and to prevent an electrical short circuit from occurring.

さらに、第一の壁体２ａの内側の部位に貫通導体を形成する場合は、第一の壁体２ａおよび第二の壁体２ｂが接合され、密着圧力が加わる第一の線路導体３ａおよび第二の線路導体３ｂの部位の幅を広くしておくことができるので、これらの導通性が損なわれにくくなるという利点もある。   Furthermore, when the through conductor is formed in the inner portion of the first wall body 2a, the first line conductor 3a and the second line body 2a and the second wall body 2b are joined and the contact pressure is applied. Since the width | variety of the site | part of the 2nd line conductor 3b can be made wide, there also exists an advantage that these electroconductivity becomes difficult to be impaired.

また通常、第二の壁体２ｂの下面および第一の壁体２ａの上面にはそれぞれ全面に第一の線路導体３ａおよび第二の線路導体３ｂと同様のメタライズ層から成る下部接地導体５および上部接地導体６を形成する。さらに、平板部１の側面および第一の壁体２ａおよび第二の壁体２ｂの側面には第一の線路導体３ａおよび第二の線路導体３ｂと同様のメタライズ層から成る側面接地導体７が形成されている。これらの下部接地導体５、上部接地導体６および側面接地導体７により、第一の線路導体３ａおよび第二の線路導体３ｂに対する接地が強化され、第一の線路導体３ａおよび第二の線路導体３ｂの高周波信号の伝送特性が優れたものとなる。   In general, the lower ground conductor 5 formed of the same metallized layer as the first line conductor 3a and the second line conductor 3b on the lower surface of the second wall body 2b and the upper surface of the first wall body 2a, respectively, Upper ground conductor 6 is formed. Further, a side ground conductor 7 made of a metallized layer similar to the first line conductor 3a and the second line conductor 3b is provided on the side surface of the flat plate portion 1 and the side surfaces of the first wall body 2a and the second wall body 2b. Is formed. The lower ground conductor 5, the upper ground conductor 6, and the side ground conductor 7 enhance the grounding of the first line conductor 3a and the second line conductor 3b, and the first line conductor 3a and the second line conductor 3b. The transmission characteristics of the high-frequency signal are excellent.

このような接続端子８は以下のようにして作製される。例えば、Ａｌ２Ｏ３質焼結体（アルミナ質セラミックス）から成る場合、先ず酸化アルミニウム，酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ）および酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダ，可塑剤，溶剤等を添加混合して泥漿状と成す。これを従来周知のドクターブレード法やカレンダーロール法等のテープ成形技術により複数のセラミックグリーンシートを得てから、それぞれのセラミックグリーンシートを所定形状に打ち抜き加工する。 Such a connection terminal 8 is produced as follows. For example, when an Al 2 O 3 sintered body (alumina ceramic) is used, an organic binder suitable for raw material powders such as aluminum oxide, silicon oxide (SiO 2 ), magnesium oxide (MgO), and calcium oxide (CaO) is first used. , Plasticizer, solvent, etc. are added and mixed to form a slurry. A plurality of ceramic green sheets are obtained by a tape forming technique such as a doctor blade method or a calender roll method, which is conventionally known, and each ceramic green sheet is punched into a predetermined shape.

次に、Ｗ，Ｍｏ等の高融点金属粉末に適当な有機バインダ，可塑剤，溶剤等を添加混合して得た金属ペーストを、このセラミックグリーンシートにスクリーン印刷法等の厚膜形成技術により印刷塗布することによって下部接地導体５，第一の線路導体３ａおよび第二の線路導体３ｂ，上部接地導体６となるメタライズ層の所定パターンに形成する。   Next, a metal paste obtained by adding and mixing an appropriate organic binder, plasticizer, solvent, etc. to a refractory metal powder such as W or Mo is printed on this ceramic green sheet by a thick film forming technique such as a screen printing method. By applying, a predetermined pattern of the metallized layer to be the lower ground conductor 5, the first line conductor 3 a and the second line conductor 3 b, and the upper ground conductor 6 is formed.

そして、下層となるセラミックグリーンシートの上面に順次セラミックグリーンシートを積層する。即ち、図２（ａ）に示すように先ず第二の壁体２ｂとなるセラミックグリーンシートを順次積層し、次いで図２（ｂ）に示すように第二の壁体２ｂとなるセラミックグリーンシートの積層体の上面に平板部１となるセラミックグリーンシートを所定位置に積層し、次いで図２（ｃ）に示すように第二の壁体２ｂと平板部１となるセラミックグリーンシートの積層体の上面の所定位置に第一の壁体２ａとなるセラミックグリーンシートを順次積層することによって接続端子８となるセラミックグリーンシートの積層体を得る。   And a ceramic green sheet is laminated | stacked sequentially on the upper surface of the ceramic green sheet used as a lower layer. That is, as shown in FIG. 2 (a), first, ceramic green sheets to be the second wall 2b are sequentially laminated, and then the ceramic green sheets to be the second wall 2b as shown in FIG. 2 (b). A ceramic green sheet to be the flat plate portion 1 is laminated at a predetermined position on the upper surface of the laminate, and then the upper surface of the laminate of the ceramic green sheet to be the second wall 2b and the flat plate portion 1 as shown in FIG. A laminated body of ceramic green sheets to be the connection terminals 8 is obtained by sequentially laminating ceramic green sheets to be the first wall bodies 2a at predetermined positions.

ここで平板部１となるセラミックグリーンシートに関しては、平板部１となるセラミックグリーンシートが複数枚である場合、予め平板部１となるセラミックグリーンシートを積層して、平板部１となるセラミックグリーンシート積層体を作製しておくのがよい。これにより、平板部１となる複数枚のセラミックグリーンシートを全て完全密着させることができる。第二の壁体２ｂとなるセラミックグリーンシートの上に平板部１となるセラミックグリーンシートを順次１枚ずつ積層加圧すると、平板部１の上側のセラミックグリーンシートは第一の壁体２ａの上側に位置する部分しか加圧されず、平板部１となるセラミックグリーンシート同士をセラミックグリーンシートの全面にわたって密着させるのが困難となる。   Here, regarding the ceramic green sheet to be the flat plate portion 1, when there are a plurality of ceramic green sheets to be the flat plate portion 1, the ceramic green sheets to be the flat plate portion 1 are laminated in advance by laminating the ceramic green sheets to be the flat plate portion 1. It is preferable to prepare a laminate. Thereby, all the ceramic green sheets used as the flat plate part 1 can be completely adhered. When the ceramic green sheets to be the flat plate portion 1 are sequentially stacked and pressed one by one on the ceramic green sheet to be the second wall 2b, the ceramic green sheet on the upper side of the flat plate portion 1 is the upper side of the first wall 2a. Only the portion located at the pressure is pressed, and it becomes difficult to bring the ceramic green sheets to be the flat plate portions 1 into close contact with each other over the entire surface of the ceramic green sheets.

または、図示しないが、予め、第二の壁体２ｂとなるセラミックグリーンシートの積層体と、平板部１となるセラミックグリーンシートの積層体と、第一の壁体２ａとなるセラミックグリーンシートの積層体とを作製しておき、これらのセラミックグリーンシートの積層体を下側から順次積層することによって接続端子８となるセラミックグリーンシートの積層体を得る。この方法により、下側に位置するセラミックグリーンシートが加圧される回数を低減させることができ、セラミックグリーンシートの加圧による変形を極力抑えることが可能となる。   Alternatively, although not shown, a laminate of a ceramic green sheet that becomes the second wall 2b, a laminate of the ceramic green sheet that becomes the flat plate portion 1, and a lamination of the ceramic green sheet that becomes the first wall 2a in advance. The laminated body of ceramic green sheets to be the connection terminals 8 is obtained by sequentially laminating the laminated body of these ceramic green sheets from the lower side. By this method, the number of times the ceramic green sheet positioned below is pressed can be reduced, and deformation due to the pressing of the ceramic green sheet can be suppressed as much as possible.

最後に、この積層体の側面接地導体７となる部分に上記同様の金属ペーストを塗布した後、これを還元雰囲気中、約1600℃の温度で焼成することにより接続端子８が完成する。   Finally, a metal paste similar to the above is applied to the portion to be the side ground conductor 7 of this laminate, and then this is fired in a reducing atmosphere at a temperature of about 1600 ° C., thereby completing the connection terminal 8.

このようにして製作された接続端子８のメタライズ層の表面には、耐蝕性に優れ、かつロウ材との濡れ性に優れる金属、具体的には厚さ0.5〜９μｍのＮｉ層と厚さ0.5〜５μｍのＡｕ層とを順次めっき法により被着させておくのがよい。これにより、メタライズ層の酸化や腐食を防ぐとともに、第一の線路導体３ａおよび第二の線路導体３ｂにリード端子26を強固に接着固定することができ、下部接地導体５，上部接地導体６および側面接地導体７のろう材の濡れ性がよくなる。   On the surface of the metallized layer of the connection terminal 8 manufactured in this way, a metal excellent in corrosion resistance and wettability with a brazing material, specifically, a Ni layer having a thickness of 0.5 to 9 μm and a thickness of 0.5 It is preferable to deposit a ˜5 μm Au layer sequentially by a plating method. Thus, oxidation and corrosion of the metallized layer can be prevented, and the lead terminal 26 can be firmly bonded and fixed to the first line conductor 3a and the second line conductor 3b. The wettability of the brazing material of the side ground conductor 7 is improved.

接続端子８の製造方法は、平板部１となるセラミックグリーンシートの積層体の下面に第二の壁体２ｂとなるセラミックグリーンシートの積層体を積層し、次いで平板部１となるセラミックグリーンシートの上面に第一の壁体２ａとなるセラミックグリーンシートの積層体を積層して接続端子８となるセラミックグリーンシートの積層体を作製し、その後積層体を焼成することから、第一の壁体２ａとなるセラミックグリーンシート積層体を平
板部１となるセラミックグリーンシート積層体に積層加圧する際、平板部１の第二の壁体２ｂに接合される面の領域内で積層でき、平板部１と第一の壁体２ａとが接合する面の全体に確実に圧力が加わるようになり、第一の壁体２ａが平板部１に密着接合されない箇所が生ずるのを防止し、第一の壁体２ａを平板部１に完全に密着接合させることができる。

 The method of manufacturing the connection terminal 8 is to laminate a ceramic green sheet laminate to be the second wall body 2 b on the lower surface of the ceramic green sheet laminate to be the flat plate portion 1, and then to the ceramic green sheet to be the flat plate portion 1. A laminate of ceramic green sheets to be the first wall 2a is laminated on the upper surface to produce a laminate of ceramic green sheets to be the connection terminals 8, and then the laminate is fired, so that the first wall 2a When the ceramic green sheet laminate to be laminated is pressed on the ceramic green sheet laminate to be the flat plate portion 1, the ceramic green sheet laminate can be laminated within the region of the surface joined to the second wall 2b of the flat plate portion 1, The pressure is surely applied to the entire surface to which the first wall 2a is joined, and the first wall 2a is prevented from being in close contact with the flat plate portion 1 so that the first wall 2a is prevented from being formed. 2a it is possible to completely closely attached to the flat plate portion 1.

その結果、接続端子８をパッケージに設置してもパッケージ内部を確実に気密に保持することができるとともに、接続端子８に外力が作用してもクラックが発生するのを防止でき、第一の線路導体３ａおよび第二の線路導体３ｂの断線を防止することができる多数の信号を入出力するための多数の線路導体を備えた小型の接続端子８を製造することができる。   As a result, even if the connection terminal 8 is installed in the package, the inside of the package can be securely held airtight, and cracks can be prevented from being generated even if an external force is applied to the connection terminal 8. A small connection terminal 8 having a large number of line conductors for inputting / outputting a large number of signals capable of preventing the conductor 3a and the second line conductor 3b from being disconnected can be manufactured.

そして、このような特性を有する接続端子８を製造する際に、接続端子８に第一の壁体２ａと平板部１とが密着接合されていない密着不良が生じたり、外力によりクラック等の破損が発生しやすくなったりするのを防止できることから、高い歩留まりで接続端子８を作製することが可能となり、量産性に優れるものとすることができる。   And when manufacturing the connection terminal 8 which has such a characteristic, the adhesion failure in which the 1st wall 2a and the flat plate part 1 are not closely joined to the connection terminal 8 arises, or damage, such as a crack, by external force Therefore, it is possible to manufacture the connection terminals 8 with a high yield, and to be excellent in mass productivity.

なお、平板部１となるセラミックグリーンシートの積層体を以上のようにして予め作製した後、この積層体の上下を裏返し、第二の壁体２ｂとなるセラミックグリーンシートの積層体と、第一の壁体２ａとなるセラミックグリーンシートの積層体とを、この順番で上下面に積層して接続端子８となる積層体を作製してもよい。   In addition, after producing the laminated body of the ceramic green sheet used as the flat part 1 previously as mentioned above, the laminated body of the ceramic green sheet used as the 2nd wall 2b is turned upside down, The laminated body which becomes the connection terminal 8 may be produced by laminating the laminated body of the ceramic green sheets to be the wall body 2a on the upper and lower surfaces in this order.

パッケージの枠体22が図４に示すような四角形状である場合に、接続端子８の第一の壁体２ａは、平面視形状が図３に示すように、枠体22の３辺に沿うようなコの字状に形成されているのがよく、この構成により、隣接する２つの角部間にかけて取付部23を形成して、コの字の内側を枠体より少し広くするとともに、平板部１のパッケージの外部に露出する側を大きくすることができる。この結果、平板部１に設けることのできる第一の線路導体３ａおよび第二の線路導体３ｂの数をさらに増加させることが可能となる。

 When the frame 22 of the package has a quadrangular shape as shown in FIG. 4, the first wall 2a of the connection terminal 8 has three sides along the three sides of the frame 22 as shown in FIG. It is good to be formed in such a U-shape, and with this configuration, a mounting portion 23 is formed between two adjacent corners, the inside of the U-shape is slightly wider than the frame, The side exposed to the outside of the package of the part 1 can be enlarged. As a result, the number of first line conductors 3a and second line conductors 3b that can be provided in the flat plate portion 1 can be further increased.

なお、この場合、図４に示す接続端子８の幅は枠体22の幅とほぼ同じ幅とするのがよく、この構成によって、接続端子８が枠体22の側面から大きく突出することがなくなるとともに、第一の線路導体３ａおよび第二の線路導体３ｂの数を増加させることができるので、パッケージの小型集積化を実現することができる。   In this case, the width of the connection terminal 8 shown in FIG. 4 is preferably substantially the same as the width of the frame body 22, and this configuration prevents the connection terminal 8 from protruding greatly from the side surface of the frame body 22. At the same time, the number of the first line conductors 3a and the second line conductors 3b can be increased, so that the package can be miniaturized and integrated.

次に、本発明の接続端子８の実施の形態について図３に基づいて説明する。

Then, with the embodiment of the connection terminals 8 of the present invention will be described with reference to FIG.

図３の本発明の接続端子８は、平板部１の一辺側の上下面に、第一の線路導体３ａおよび第二の線路導体３ｂが上下対向する位置に配されているとともに、パッケージの外部に露出する一辺側の端の平板部１の上面と側面との間の第一の線路導体３ａの先端部に第一の切り欠き部１ａが形成され、第二の線路導体３ｂのパッケージの外部に露出する一辺側の先端部の平板部１の下面と側面との間に第二の切り欠き部１ｂが形成され、この第一の切り欠き部１ａと第二の切り欠き部１ｂの内面に第一の線路導体３ａおよび第二の線路導体３ｂと同様のメタライズ層が被着形成されている形態である。

 The connection terminal 8 of the present invention in FIG. 3 is arranged on the upper and lower surfaces of one side of the flat plate portion 1 at positions where the first line conductor 3a and the second line conductor 3b are vertically opposed to each other, and the outside of the package. A first cutout portion 1a is formed at the tip of the first line conductor 3a between the upper surface and the side surface of the flat plate portion 1 at the end on one side exposed to the outside of the package of the second line conductor 3b. A second cutout portion 1b is formed between the lower surface and the side surface of the flat plate portion 1 at the tip portion on one side exposed to the inner surface of the first cutout portion 1a and the second cutout portion 1b. This is a form in which the same metallized layers as the first line conductor 3a and the second line conductor 3b are formed.

そして、第二の切り欠き部１ｂの幅方向の両端は、第一の切り欠き部の幅方向の両端より内側に位置しており、さらに好ましくは、平板部１の他辺側に向けての第二の切り欠き部１ｂの深さは、第一の切り欠き部１ａの深さより浅いのがよい。第一の線路導体３ａと第一の切り欠き部１ａの内面のメタライズ層および第二の線路導体３ｂと第二の切り欠き部１ｂの内面のメタライズ層とはロウ材が流れる程度に近接していればよく、隙間が設けられて電気的に接続しないように形成されていてもよい。   And the both ends of the width direction of the 2nd notch part 1b are located inside the both ends of the width direction of the 1st notch part, More preferably, toward the other side of the flat plate part 1 The depth of the second notch 1b is preferably shallower than the depth of the first notch 1a. The metallization layer on the inner surface of the first line conductor 3a and the first cutout portion 1a and the metallization layer on the second line conductor 3b and the inner surface of the second cutout portion 1b are close enough to allow the brazing material to flow. What is necessary is just to be provided and it may be formed so that a clearance may be provided and it may not be electrically connected.

この形態により、第一の線路導体３ａのパッケージの外部に露出する側の端および第二の線路導体３ｂのパッケージの外部に露出する側の端にリード端子26を接合させる場合において、リード端子26と第一の線路導体３ａおよび第二の線路導体３ｂとを接合するためのロウ材等の導電性接着剤のメニスカスを第一の切り欠き部１ａおよび第二の切り欠き部１ｂの内面に被着形成されたメタライズ層にかけて形成することが可能となり、リード端子26を第一の線路導体３ａおよび第二の線路導体３ｂに極めて強固に接合することが可能となる。   With this configuration, when the lead terminal 26 is joined to the end of the first line conductor 3a exposed to the outside of the package and the end of the second line conductor 3b exposed to the outside of the package, the lead terminal 26 Meniscus of a conductive adhesive such as brazing material for joining the first line conductor 3a and the second line conductor 3b to the inner surfaces of the first notch 1a and the second notch 1b. It is possible to form over the formed metallized layer, and the lead terminal 26 can be very strongly joined to the first line conductor 3a and the second line conductor 3b.

また、この導電性接着剤のメニスカスは、第一の切り欠き部１ａおよび第二の切り欠き部１ｂの内面に形成され、平板部１の側面から突出しないようにできる。この結果、平板部１の側面に平板部１と同一厚さの外部電気回路基板等を当接させてリード端子26と外部電気回路とを接続させる場合においても、平板部１の側面に外部電気回路基板を隙間無く当接させることができ、リード端子26と外部電気回路との接続部の長さを最小限に抑え、接続部で発生する電気信号の伝送損失を最小限に抑えることができる。   Further, the meniscus of the conductive adhesive is formed on the inner surfaces of the first cutout portion 1 a and the second cutout portion 1 b so that it does not protrude from the side surface of the flat plate portion 1. As a result, even when an external electric circuit board having the same thickness as the flat plate portion 1 is brought into contact with the side surface of the flat plate portion 1 to connect the lead terminal 26 and the external electric circuit, the external electric circuit is connected to the side surface of the flat plate portion 1. The circuit board can be brought into contact with no gap, the length of the connecting portion between the lead terminal 26 and the external electric circuit can be minimized, and the transmission loss of the electric signal generated at the connecting portion can be minimized. .

なお、図３（ａ）に示すように、第一の切り欠き部１ａと第二の切り欠き部１ｂとの間には中間層１ｃを有していてもよいし、中間層１ｃを有さずに第一の切り欠き部１ａと第二の切り欠き部１ｂとが平板部１の上下主面間で貫通するように連続して形成され、上下のメタライズ層が電気的に短絡しないようにメタライズ層が平板部１の上側の一部と下側の一部に形成されて接続されていない形態であってもよい。   In addition, as shown to Fig.3 (a), you may have the intermediate | middle layer 1c between the 1st notch part 1a and the 2nd notch part 1b, and have the intermediate | middle layer 1c. The first cutout portion 1a and the second cutout portion 1b are continuously formed so as to penetrate between the upper and lower main surfaces of the flat plate portion 1 so that the upper and lower metallized layers are not electrically short-circuited. The metallized layer may be formed on the upper part and the lower part of the flat plate portion 1 so as not to be connected.

図３（ａ）に示すような、第一の切り欠き部１ａと第二の切り欠き部１ｂとの間に中間層１ｃを有している形態は、中間層１ｃとなるセラミックグリーンシートの上下両面に、第二の切り欠き部１ｂを有するセラミックグリーンシートと第一の切り欠き部１ｂを有するセラミックグリーンシートとを積層するような、少なくとも３枚のセラミックグリーンシートを積層する構成とされる。また、中間層１ｃを有さず、第一の切り欠き部１ａと第二の切り欠き部１ｂとが貫通するように連続して形成されている場合は、第一の切り欠き部１ａが形成されたセラミックグリーンシートと第二の切り欠き部１ｂが形成されたセラミックグリーンシートとを積層するような、少なくとも２枚のセラミックグリーンシートを積層する構成とされる。いずれにおいても、第二の切り欠き部１ｂの幅方向の両端は、第一の切り欠き部１ａの幅方向の両端より内側に位置される。   The form having the intermediate layer 1c between the first cutout portion 1a and the second cutout portion 1b as shown in FIG. 3A is the top and bottom of the ceramic green sheet that becomes the intermediate layer 1c. At least three ceramic green sheets are laminated on both sides such that a ceramic green sheet having the second notch 1b and a ceramic green sheet having the first notch 1b are laminated. Further, when the intermediate layer 1c is not provided and the first cutout portion 1a and the second cutout portion 1b are continuously formed so as to penetrate, the first cutout portion 1a is formed. At least two ceramic green sheets are laminated such that the ceramic green sheet thus formed and the ceramic green sheet on which the second notch 1b is formed are laminated. In any case, both ends in the width direction of the second cutout portion 1b are positioned inside both ends in the width direction of the first cutout portion 1a.

この構成により、第一の切り欠き部１ａを有するセラミックグリーンシートを中間層１ｃとなるセラミックグリーンシートまたは第二の切り欠き部１ａを有するセラミックグリーンシートに積層加圧する際、多少の積層ズレが生じたとしても、第一の切り欠き部１ａを有するセラミックグリーンシートが積層される面は、中間層１ｃとなるセラミックグリーンシートの第二の切り欠き部１ｂを有するセラミックグリーンシートに接合される面の領域または第二の切り欠き部を有するセラミックグリーンシートの面内になるので、第一の切り欠き部１ａを有するセラミックグリーンシートが接合される面の全体に確実に圧力が加わるようになり、第一の切り欠き部１ａを有するセラミックグリーンシートが、中間層１ｃとなるセラミックグリーンシートや第二の切り欠き部１ｂを有するセラミックグリーンシートに密着接合されない箇所が生ずるのを防止し、第一の切り欠き部１ａを有するセラミックグリーンシートを完全に密着接合させることができる。   With this configuration, when the ceramic green sheet having the first cutout portion 1a is stacked and pressed on the ceramic green sheet serving as the intermediate layer 1c or the ceramic green sheet having the second cutout portion 1a, some stacking deviation occurs. Even so, the surface on which the ceramic green sheet having the first cutout portion 1a is laminated is the surface to be joined to the ceramic green sheet having the second cutout portion 1b of the ceramic green sheet to be the intermediate layer 1c. Since it is in the plane of the ceramic green sheet having the region or the second notch, pressure is surely applied to the entire surface to which the ceramic green sheet having the first notch 1a is joined, The ceramic green sheet in which the ceramic green sheet having one cutout portion 1a becomes the intermediate layer 1c To prevent the portion that is not closely attached to the ceramic green sheet having a sheet and a second notch portion 1b is produced, a ceramic green sheet having a first cutout portion 1a can be completely closely bonded.

次に、本発明のパッケージについて図４に基づいて説明する。   Next, the package of this invention is demonstrated based on FIG.

本発明のパッケージは、上面の中央部に電子部品25が載置される載置部21ａを有する基体21と、この基体21の上面に載置部21ａを囲繞するように取着され、側部に形成された貫通孔または切欠きから成る接続端子８の取付部23が形成された枠体22と、取付部23に接続端子８のリード端子26が取り付けられる一辺側が枠体22の外側となるように嵌着された接続端子８とを具備している。   The package of the present invention has a base 21 having a mounting portion 21a on which the electronic component 25 is mounted at the center of the upper surface, and is attached to the upper surface of the base 21 so as to surround the mounting portion 21a. The frame 22 in which the attachment portion 23 of the connection terminal 8 formed of a through-hole or a notch formed in the hole is formed, and one side where the lead terminal 26 of the connection terminal 8 is attached to the attachment portion 23 is the outside of the frame 22. And a connection terminal 8 fitted in this manner.

基体21は、上面にＬＤ，ＰＤ，ＩＣ，ＬＳＩ等の半導体素子やチップコンデンサ等の電子部品25を載置するための載置部21ａを有している。   The base 21 has a mounting portion 21a on the top surface for mounting a semiconductor element such as LD, PD, IC, LSI, or an electronic component 25 such as a chip capacitor.

基体21は、Ｆｅ−Ｎｉ−Ｃｏ合金，銅（Ｃｕ）−Ｗ合金等の金属、またはＡｌ２Ｏ３質焼結体，ＡｌＮ質焼結体，３Ａｌ２Ｏ３・２ＳｉＯ２質焼結体等のセラミックスから成る。基体21が金属から成る場合、そのインゴットに圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことによって所定形状に製作される。一方、基体21がセラミックスから成る場合、その原料粉末に適当な有機バインダや溶剤等を添加混合しペースト状と成し、このペーストをドクターブレード法やカレンダーロール法等によってセラミックグリーンシートと成し、しかる後、このセラミックグリーンシートに適当な打ち抜き加工を施し、これを複数枚積層し約1600℃の高温で焼成することによって作製される。 Substrate 21, Fe-Ni-Co alloy, copper (Cu) metal, such as -W alloy or Al 2 O 3 sintered material,, AlN sintered material, 3Al 2 O 3 · 2SiO 2 Quality sintered body or the like Made of ceramics. When the base 21 is made of a metal, the ingot is manufactured into a predetermined shape by applying a conventionally known metal processing method such as rolling or punching. On the other hand, when the substrate 21 is made of ceramics, an appropriate organic binder or solvent is added to the raw material powder to form a paste, and this paste is formed into a ceramic green sheet by a doctor blade method, a calender roll method, or the like, Thereafter, the ceramic green sheet is subjected to an appropriate punching process, and a plurality of these are laminated and fired at a high temperature of about 1600 ° C.

なお、基体21が金属からなる場合、その表面に耐蝕性に優れ、かつロウ材との濡れ性に優れる金属、具体的には厚さ0.5〜９μｍのＮｉ層と厚さ0.5〜５μｍのＡｕ層とを順次めっき法により被着させておくのがよい。これにより、基体21が酸化腐蝕するのを有効に防止できるとともに、基体21上面の載置部21ａに電子部品25を強固に接着固定させることができる。一方、基体21がセラミックスから成る場合、載置部21ａや取付部23等に、Ｗ，Ｍｏ等のメタライズ層を下地層として形成し、この表面に耐蝕性に優れ、かつロウ材との濡れ性に優れる金属、具体的には厚さ0.5〜９μｍのＮｉ層と厚さ0.5〜５μｍのＡｕ層とを順次めっき法により被着させておくのがよい。これにより、載置部21ａ等に電子部品25等をロウ材を介して強固に接着固定することができる。   When the substrate 21 is made of metal, the surface thereof is excellent in corrosion resistance and wettability with the brazing material, specifically, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 5 μm. Are preferably sequentially deposited by a plating method. Thereby, the base 21 can be effectively prevented from being oxidized and corroded, and the electronic component 25 can be firmly bonded and fixed to the mounting portion 21a on the top surface of the base 21. On the other hand, when the base 21 is made of ceramics, a metallized layer such as W or Mo is formed as a base layer on the mounting portion 21a, the mounting portion 23, etc., and this surface has excellent corrosion resistance and wettability with the brazing material. It is preferable to deposit a metal excellent in thickness, specifically, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 5 μm sequentially by a plating method. Thereby, the electronic component 25 and the like can be firmly bonded and fixed to the placement portion 21a and the like via the brazing material.

枠体22は、基体21上に載置部21ａを囲繞するようにＡｇロウ、Ａｇ−Ｃｕロウ材等の高融点金属ロウ材により接合されており、基体21と同様にセラミックスまたは金属から成る。また、枠体22の側部には、貫通孔または切欠きから成る接続端子８の取付部23が形成されている。なお、基体21にも同様の切欠きを設けて接続端子８の取付部23の一部が形成されていてもよい。   The frame 22 is joined to the base 21 by a high melting point metal brazing material such as Ag brazing or Ag—Cu brazing so as to surround the mounting portion 21 a, and is made of ceramic or metal like the base 21. Further, a mounting portion 23 of the connection terminal 8 formed of a through hole or a notch is formed on a side portion of the frame body 22. The base 21 may be provided with a similar notch to form a part of the attachment portion 23 of the connection terminal 8.

取付部23は、枠体22および基体21がセラミックスから成る場合、内面にメタライズ層等の導電層が形成されている。この導電層は、基体21および枠体22またはこれらのうち一方に被着形成された接地導体に接続されて接地される。   When the frame 22 and the base body 21 are made of ceramics, the attachment portion 23 has a conductive layer such as a metallized layer formed on the inner surface. This conductive layer is connected to the base 21 and the frame 22 or a ground conductor formed on one of them and grounded.

取付部23には本発明の接続端子８がＡｇロウ、Ａｇ−Ｃｕロウ材等の高融点金属ロウ材により嵌着接合されている。そして、接続端子８の下部接地導体５、上部接地導体６および側面接地導体７は、枠体22および基体21がセラミックスからなる場合、取付部23の内面に形成された導電層に接続されることにより接地され、ケースグランドとなる。あるいは、枠体22および基体21が金属からなる場合、接続端子８の下部接地導体５、上部接地導体６および側面接地導体７は、金属製の枠体22や基体21に接続されて接地され、ケースグランドとなる。また、接続端子８の上部接地導体６は、図４に示すように枠体22の上面に取着されるＦｅ−Ｎｉ−Ｃｏ合金等の金属からなるシールリング24に接続されて接地され、ケースグランドとなっていてもよい。   The connection terminal 8 of the present invention is fitted and joined to the attachment portion 23 with a high melting point metal brazing material such as an Ag brazing material or an Ag-Cu brazing material. The lower ground conductor 5, the upper ground conductor 6, and the side ground conductor 7 of the connection terminal 8 are connected to a conductive layer formed on the inner surface of the mounting portion 23 when the frame body 22 and the base body 21 are made of ceramics. Is grounded to form a case ground. Alternatively, when the frame body 22 and the base body 21 are made of metal, the lower ground conductor 5, the upper ground conductor 6 and the side ground conductor 7 of the connection terminal 8 are connected to the metal frame body 22 or the base body 21 and grounded. Case ground. Further, the upper ground conductor 6 of the connection terminal 8 is connected to a seal ring 24 made of a metal such as Fe—Ni—Co alloy attached to the upper surface of the frame body 22 as shown in FIG. It may be ground.

なお、接続端子８を取付部23に嵌着接合させる際、接続端子８の上下の向きを換えて嵌め込んでもよい。   Note that when the connection terminal 8 is fitted and joined to the attachment portion 23, the connection terminal 8 may be fitted in a different vertical direction.

また、枠体22がセラミックスから成る場合、接続端子８は枠体22の一部として一体的に成形されてもよい。   When the frame body 22 is made of ceramics, the connection terminals 8 may be integrally formed as a part of the frame body 22.

以上、本発明のパッケージによれば、上記本発明の接続端子８を具備していることから、気密性に優れかつ線路導体（第一の線路導体３ａおよび第二の線路導体３ｂ）の断線のないパッケージとすることができ、多数の信号を入出力するための多数の線路導体を備えた小型のパッケージとすることができる。また、このような特性を有するパッケージを製造する際に、接続端子８に第一の壁体２ａと平板部１とが密着接合されていない密着不良やクラック等の破損が発生するのを確実に防止できることから、高い歩留まりで作製することが可能となり、量産性に優れるものとすることができる。   As described above, according to the package of the present invention, since the connection terminal 8 of the present invention is provided, the airtightness is excellent and the line conductors (the first line conductor 3a and the second line conductor 3b) are disconnected. A small package having a large number of line conductors for inputting and outputting a large number of signals. Further, when manufacturing a package having such characteristics, it is ensured that the first wall 2a and the flat plate portion 1 are not tightly bonded to the connection terminal 8 and that a failure such as a close contact or a crack occurs. Since it can be prevented, it can be manufactured at a high yield and can be excellent in mass productivity.

そして、このようなパッケージの載置部21ａに電子部品25を載置した後、電子部品25の電極と第一の線路導体３ａおよび第二の線路導体３ｂとをボンディングワイヤ等の接続手段（図示せず）を介して接続し、パッケージの外側の線路導体３にＦｅ−Ｎｉ−Ｃｏ合金等の金属からなるリード端子26等をＡｇロウなどの導電性接着材を介して接合して、電子部品25と外部電気回路基板とを電気的に接続する。次に、必要に応じて枠体22の上面にシールリング24を鉛（Ｐｂ）−錫（Ｓｎ）半田やＡｕ−Ｓｎ半田等の低融点金属ロウ材やＡｇ−Ｃｕロウ材等の高融点金属ロウ材等により取着し、シールリング24の上面にＦｅ−Ｎｉ−Ｃｏ合金等から成る蓋体（図示せず）を半田付けやシームウエルド法等により取着することにより、電子部品25がパッケージ内部に収納された製品としての電子装置となる。   Then, after the electronic component 25 is placed on the placement portion 21a of such a package, the electrode of the electronic component 25 and the first line conductor 3a and the second line conductor 3b are connected by means of connecting means such as bonding wires (see FIG. The lead terminal 26 made of a metal such as Fe-Ni-Co alloy is joined to the line conductor 3 outside the package via a conductive adhesive such as Ag brazing, and the electronic component. 25 and the external electric circuit board are electrically connected. Next, if necessary, a seal ring 24 is placed on the upper surface of the frame 22, such as a low melting point metal brazing material such as lead (Pb) -tin (Sn) solder or Au—Sn solder, or a high melting point metal such as Ag—Cu brazing material. The electronic component 25 is packaged by attaching it with a brazing material or the like, and attaching a lid (not shown) made of Fe-Ni-Co alloy or the like to the upper surface of the seal ring 24 by soldering or the seam weld method. It becomes an electronic device as a product housed inside.

このような本発明の電子装置は、上記本発明の接続端子８を具備しているパッケージを備えていることから、気密性を要する電子部品25を収納することができ、多数の信号を入出力するための多数の線路導体（多数の第一の線路導体３ａおよび多数の第二の線路導体３ｂ）を備えた多機能な電子装置とすることができる。   Such an electronic device according to the present invention includes a package having the connection terminal 8 according to the present invention. Therefore, the electronic component 25 requiring airtightness can be accommodated, and a large number of signals can be input / output. Therefore, a multi-functional electronic device including a large number of line conductors (a large number of first line conductors 3a and a large number of second line conductors 3b) can be obtained.

なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内であれば種々の変更を施すことは何等差し支えない。例えば、第一の線路導体３ａおよび第二の線路導体３ｂとなるメタライズ層には、Ｃｕ，Ａｇ等の導電性に優れた金属が含まれていてもよく、これにより、第一の線路導体３ａおよび第二の線路導体３ｂを伝送する高周波信号の伝送損失をさらに低減させ、高周波信号の伝送特性に優れたものとすることができる。また、電子部品25がＬＤ、ＰＤ等の光半導体素子である場合、光ファイバから出力される光信号または光ファイバに入力される光信号の伝達経路として基体１の側部に貫通孔等を形成し、光ファイバの取付部を設けてもよい。これにより、載置部21ｂに載置される電子部品25としての光半導体素子と外部との間で光ファイバを介して光信号を送受信することが可能となり、本発明の電子装置が光半導体装置として機能し得る。   Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention. For example, the metallized layer that becomes the first line conductor 3a and the second line conductor 3b may contain a metal having excellent conductivity, such as Cu, Ag, etc., and thereby the first line conductor 3a. And the transmission loss of the high frequency signal which transmits the 2nd line conductor 3b can be reduced further, and it can be set as the thing excellent in the transmission characteristic of the high frequency signal. When the electronic component 25 is an optical semiconductor element such as an LD or PD, a through hole or the like is formed in the side portion of the substrate 1 as a transmission path for an optical signal output from the optical fiber or an optical signal input to the optical fiber. However, an optical fiber mounting portion may be provided. This makes it possible to transmit and receive optical signals via the optical fiber between the optical semiconductor element as the electronic component 25 placed on the placement portion 21b and the outside, and the electronic device of the present invention is an optical semiconductor device. Can function as.

［図１］接続端子の参考例を示す斜視図である。
［図２］（ａ）（ｂ）（ｃ）は本発明の接続端子の製造方法を示す側面図である。
［図３］（ａ）は本発明の接続端子の実施の形態を示す斜視図、（ｂ）は（ａ）の接続端子の上面図、（ｃ）は（ｂ）の接続端子のｘ−ｘ’面における断面図である。
［図４］（ａ）は図３（ａ）（ｂ）（ｃ）の接続端子を用いた電子部品収納用パッケージの平面図、（ｂ）は（ａ）の電子部品収納用パッケージの側面図、（ｃ）は（ａ）の電子部品収納用パッケージの部分斜視図である。
［図５］（ａ）は従来の接続端子の一例を示す斜視図、（ｂ）は（ａ）の接続端子の製造方法を示す斜視図である。
［図６］（ａ）は従来の接続端子の他の例を示す斜視図、
（ｂ）は（ａ）の接続端子の製造方法を示す斜視図である。 FIG. 1 is a perspective view showing a reference example of a connection terminal .
[FIG. 2] (a) (b) (c) is a side view which shows the manufacturing method of the connecting terminal of this invention.
[FIG 3] (a) is a perspective view showing an embodiment of a connection terminal of the present invention, (b) is a top view of a connection terminal (a), (c) the connection terminals (b) x-x It is sectional drawing in a plane.
4A is a plan view of an electronic component storage package using the connection terminals of FIGS. 3A, 3B, and 3C, and FIG. 4B is a side view of the electronic component storage package of FIG. (C) is a fragmentary perspective view of the electronic component storage package of (a).
[FIG. 5] (a) is a perspective view showing an example of a conventional connection terminal, and (b) is a perspective view showing a method for manufacturing the connection terminal of (a).
FIG. 6A is a perspective view showing another example of a conventional connection terminal;
(B) is a perspective view which shows the manufacturing method of the connection terminal of (a).

符号の説明Explanation of symbols

１：平板部
２ａ：第一の壁体
２ｂ：第二の壁体
３ａ：第一の線路導体
３ｂ：第二の線路導体
８：接続端子
21：基体
21ａ：載置部
22：枠体
23：取付部
25：電子部品 1: flat plate portion 2a: first wall 2b: second wall 3a: first line conductor 3b: second line conductor 8: connection terminal
21: Base
21a: Placement section
22: Frame
23: Mounting part
25: Electronic components

Claims (3)

矩形状を成し、両端部が上面の平行な２辺の間に形成された第一の線路導体、および下面の前記平行な２辺の一辺から中央部にかけて形成されるとともに該中央部で上下面間を貫通する貫通導体を介して前記上面に導出され、前記上面の前記貫通導体から前記平行な２辺の他辺にかけて形成された第二の線路導体を有するセラミックスから成る平板部と、セラミックスから成り、前記平板部の上面に前記第一の線路導体および前記第二の線路導体の少なくとも一方を横切るように接合された第一の壁体と、セラミックスから成り、前記平板部の下面の前記第一の壁体と対向する位置に接合された第二の壁体とを具備し、前記平板部の前記第一の壁体と接合される面積は、前記平板部の前記第二の壁体に接合される面積よりも小さく、前記平板部の前記第二の壁体に接合される面の外周と同じかそれよりも内側の領域で前記第一の壁体を前記平板部に接合し、前記平板部の前記一辺側の上下面に、前記第一の線路導体および前記第二の線路導体が上下対向する位置に配されているとともに、前記第一の線路導体が前記平板部の上面と側面との間に形成された第一の切り欠き部の内面にかけて形成されており、前記第二の線路導体が前記平板部の下面と側面との間に形成された第二の切り欠き部の内面にかけて形成されており、前記第二の切り欠き部の幅方向の両端は前記第一の切り欠き部の幅方向の両端より内側に位置していることを特徴とする接続端子。 The first line conductor is formed between the two parallel sides of the upper surface and the both ends are formed from one side to the center of the two parallel sides of the lower surface, and the upper side at the center. A flat plate portion made of ceramics having a second line conductor led to the upper surface through a through conductor penetrating between the lower surfaces and formed from the through conductor on the upper surface to the other two sides of the parallel; A first wall body joined to the upper surface of the flat plate portion so as to cross at least one of the first line conductor and the second line conductor, and ceramic, the lower surface of the flat plate portion A second wall body joined at a position facing the first wall body, and the area of the flat plate portion joined to the first wall body is the second wall body of the flat plate portion. Smaller than the area to be joined to the flat plate Said second wall said first wall equal to or than the outer periphery of the surface to be bonded inside the area joined to said plate, the upper and lower surfaces of the one side end of said plate of, The first line conductor and the second line conductor are arranged at positions facing each other vertically, and the first line conductor is formed between the upper surface and the side surface of the flat plate portion. The second line conductor is formed over the inner surface of the second cutout portion formed between the lower surface and the side surface of the flat plate portion, and the second cutout portion is formed over the inner surface of the cutout portion. Both ends of the notch in the width direction are located on the inner side of both ends of the first notch in the width direction . 上面の中央部に電子部品が載置される載置部を有する基体と、該基体の上面に前記載置部を囲繞するように取着され、側部に形成された貫通孔または切欠きから成る接続端子の取付部が形成された枠体と、前記取付部に前記一辺側が前記枠体の外側となるように嵌着された請求項１に記載の接続端子とを具備していることを特徴とする電子部品収納用パッケージ。 A base having a placement part on which an electronic component is placed at the center of the upper surface, and a through-hole or notch formed on the side and attached so as to surround the placement part on the upper surface of the base And a connection terminal according to claim 1 , wherein the connection terminal is fitted to the attachment portion so that the one side is outside the frame body. A package for storing electronic components. 請求項２に記載の電子部品収納用パッケージと、前記載置部に載置されるとともに前記接続端子に電気的に接続された電子部品と、前記枠体の上面に前記枠体の内側を塞ぐように取着された蓋体とを具備していることを特徴とする電子装置。
The electronic component storage package according to claim 2, an electronic component placed on the placement portion and electrically connected to the connection terminal, and an upper surface of the frame body covering the inside of the frame body An electronic device comprising a lid attached in this manner.
JP2005021181A 2005-01-28 2005-01-28 Connection terminal and electronic component storage package and electronic device using the same Expired - Fee Related JP4511376B2 (en)

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EP2237316B1 (en) * 2008-01-30 2019-10-09 Kyocera Corporation Connection terminal, package using the same and electronic device
JP5261259B2 (en) * 2008-09-29 2013-08-14 京セラ株式会社 Electronic component storage package, input / output terminal, and electronic device
WO2013077199A1 (en) * 2011-11-21 2013-05-30 京セラ株式会社 Package for housing electronic component, and electronic apparatus
US9408307B2 (en) 2012-03-22 2016-08-02 Kyocera Corporation Device housing package
WO2015137489A1 (en) 2014-03-13 2015-09-17 京セラ株式会社 Package for storing electronic component, and electronic device

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