JP5261259B2 - Electronic component storage package, input / output terminal, and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package, an input / output terminal used for the electronic component storage package, and an electronic device including the electronic component storage package.

  2. Description of the Related Art Conventionally, an electronic component storage package for storing electronic components such as semiconductor elements has a base for storing electronic components and input / output terminals attached to the base. The input / output terminal generally has a rectangular parallelepiped insulating member, and a connecting terminal such as a lead terminal for transmitting an electric signal to the inside and outside of the package is formed on the surface of the insulating member by, for example, a brazing material. It is attached side by side in the longitudinal direction of the insulating member.

Japanese Patent Laid-Open No. 11-54657

  However, recently, the number of connecting terminals tends to increase as the electronic components housed in the electronic component housing package become multifunctional and high performance. On the other hand, there is a strong demand for miniaturization of electronic component storage packages, and there is a situation in which the input / output terminals cannot be enlarged in accordance with the multi-function and high performance of electronic components.

  Therefore, in order to increase the number of connection terminals without increasing the size of the input / output terminals, a method of connecting to the insulating member by reducing the distance between the connecting terminals is conceivable. Connection, there is a possibility that the brazing material used for connection flows and the adjacent connection terminals become conductive.

An electronic component storage package according to an aspect of the present invention includes a base having a recess in which an electronic component is stored, and having a through hole or a notch communicating with an inside and an outside of the recess on a side wall of the recess, And an input / output terminal inserted into the through hole or notch. The input / output terminal includes an insulating member having a plurality of adjacent first planar regions and second planar regions on a surface exposed to the inside or the exterior of the recess, and a first connected to the first planar region. One connection terminal and a second connection terminal connected to the second planar region. The first plane area and the second plane area include a first plane including the first plane area, and a second plane including the second plane area, and the first connection terminal and the second plane area. The second connection terminal is disposed so as to form an angle larger than 0 degree and smaller than 180 degrees .
According to the input / output terminal according to the aspect of the present invention, the insulating member having the first planar region and the second planar region on the surface, the first connection terminal connected to the first planar region, and the second And a second connection terminal connected to the planar region. The first plane area and the second plane area include a first plane including the first plane area, and a second plane including the second plane area, and the first connection terminal and the second plane area. The second connection terminal is disposed so as to form an angle larger than 0 degree and smaller than 180 degrees.

  An electronic device according to an aspect of the present invention includes the electronic component storage package and an electronic component stored in the recess of the base.

  According to the electronic component housing package according to one embodiment of the present invention, conduction between the connection terminals can be suppressed even when more connection terminals are connected.

  According to the input / output terminal of one embodiment of the present invention, even when more connection terminals are connected, conduction between the connection terminals can be suppressed.

  With the electronic device according to one embodiment of the present invention, an electronic device capable of higher-density wiring can be realized without being relatively large.

(A) is a top view which shows the structural example of the electronic component storage package by the 1st Embodiment of this invention, (b) is sectional drawing in the AA of (a). (A) is a perspective view which shows the structural example of the input / output terminal of FIG. 1, (b) is sectional drawing of the insulating member of the input / output terminal of (a). (A) is a top view which shows another structural example of the electronic component storage package by the 1st Embodiment of this invention, (b) is sectional drawing in the BB line of (a). FIG. 4 is a perspective view illustrating a configuration example of an input / output terminal in FIG. 3. It is a figure explaining the manufacturing method of the input / output terminal of FIG. It is a perspective view which shows another structural example of an input / output terminal. (A) is a top view which shows the structural example of the package for electronic component accommodation by the 2nd Embodiment of this invention, (b) is sectional drawing in CC line of (a). It is a perspective view which shows the structural example of the input / output terminal of FIG. (A) is a top view which shows another structural example of the package for electronic component accommodation, (b) is sectional drawing in the DD line | wire of (a).

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

(First embodiment)
FIG. 1A is a plan view illustrating a configuration example of an electronic component storage package according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA in FIG. is there. As shown in FIG. 1, an electronic component storage package 1 according to the present embodiment includes a base 2 having a recess for storing electronic components, and an input / output terminal 3 attached to a side wall of the base 2. The base body 2 has a through hole or a notch that communicates the recess and the outside on the side wall. The input / output terminal 3 is inserted into the through hole or notch.

  The base body 2 has a mounting plate 4 having a mounting portion 4a on which an electronic component is mounted, and a frame 5 attached to an outer peripheral portion of the upper surface of the mounting plate 4 so as to surround the mounting portion 4a. And have. The mounting plate 4 is made of a metal such as Fe-Ni-Co alloy or Cu-W, and the ingot is subjected to conventionally known metal processing methods such as rolling and punching, or subjected to extrusion and cutting. To produce a predetermined shape. On the upper surface of the mounting plate 4, a mounting portion 4a for mounting electronic components is provided. The mounting plate 4 also serves as a heat radiating plate that radiates heat generated when the electronic component is operated. On the surface of the mounting plate 4, a 0.5 to 9 μm thick Ni layer and a 0.5 to 5 μm thick layer are used to suppress oxidative corrosion and to improve the mounting and fixing by brazing electronic components. A metal layer made of a gold (Au) layer may be deposited by a plating method or the like. Further, in order to efficiently dissipate the heat of the electronic component to the outside, the electronic component may be mounted and fixed on the mounting portion 4a in a state of being mounted on a thermoelectric cooling element (not shown) such as a Peltier element. .

  A frame body 5 joined via a brazing material such as silver solder is provided on the outer peripheral portion of the upper surface of the mounting plate 4 so as to surround the mounting portion 4a. 4 and a recess for accommodating an electronic component is formed inside thereof. When the electronic device is manufactured, the electronic component is placed on the placement portion 4a, and the lid 6 is joined to the frame 5 to cover the recess, thereby accommodating the electronic component in the package.

  The frame body 5 is made of a metal such as Fe-Ni-Co alloy or Cu-W, and is a frame body having a plan view shape, for example, a quadrangular shape. Conventionally known metal processing for rolling and punching an ingot. It is manufactured in a predetermined shape by applying a method, or extrusion and cutting, and is connected to the mounting plate 4 via a brazing material such as silver brazing. In addition, on the surface of the frame body 5, a Ni layer having a thickness of 0.5 to 9 μm and a thickness of 0.5 to 5 μm are used in order to suppress oxidative corrosion and to improve the bonding by brazing the input / output terminals 3. A metal layer made of the Au layer may be formed by a plating method or the like.

  Further, the frame 5 is formed with a mounting portion 3a formed of a through hole or a notch for mounting the input / output terminal 3. The input / output terminal 3 is connected to the attachment portion 3a of the frame 5 via a brazing material such as silver brazing. Here, it is assumed that a through-hole is provided in the frame body 5.

  The input / output terminal 3 has a plurality of connection terminals 7 such as lead terminals that are electrically connected to the inside and outside of the base 2. Here, a perspective view of the input / output terminal 3 is shown in FIG. As shown in FIG. 2A, the input / output terminal 3 has an insulating member 8, and a plurality of connection terminals 7 are connected to the outer surface of the insulating member 8. In FIG. 2, the insulating member 8 is a quadrangular prism, and a plurality of connection terminals 7 are attached to four side surfaces S1 to S4, respectively. In addition, the input / output terminal 3 includes a plurality of wiring portions 9 provided inside the insulating member 8 so as to be separated from each other. In the input / output terminal 3 of FIG. 2, the plurality of wiring portions 9 include a first wiring portion 9 a and a second wiring portion 9 b (if the first wiring portion 9 a and the second wiring portion 9 b are not distinguished, simply “ It is referred to as a wiring portion 9 ”). The wiring part 9 is electrically connected to the corresponding connection terminal 7. When the input / output terminal 3 is inserted into the through hole of the frame body 5, for example, the portion of the side L at the boundary between two adjacent side surfaces is fitted into a groove provided on the inner wall surface of the through hole, or It is connected to the inner wall surface of the through hole. At that time, two side surfaces S 1 and S 2 are exposed inside the recess of the base 2, and the other two side surfaces S 3 and S 4 are exposed outside the base 2.

  The plurality of connection terminals 7 include an internal connection terminal 7a connected to the surfaces S1 and S2 exposed inside the recess, and an external connection terminal 7b connected to the surfaces S3 and S4 exposed outside the recess, respectively. Have In addition, when not distinguishing the internal connection terminal 7a and the external connection terminal 7b, it is simply called the connection terminal 7.

  One end of the first wiring portion 9a is electrically connected to the internal connection terminal 7a on the side surface S1 exposed inside the recess, and the other end is connected to the external connection terminal 7b on the side surface S3 exposed to the outside of the base body 2. And electrically connected. The second wiring portion 9b has one end electrically connected to the internal connection terminal 7a on the side surface S2 exposed inside the recess, and the other end connected externally on the side surface S4 exposed to the outside of the base body 2. It is electrically connected to the terminal 7b. In FIG. 2, the wiring portion 9 is illustrated for easy understanding of the configuration. However, since the wiring portion 9 is covered with the insulating member 8, it cannot be normally viewed from the outside of the input / output terminal 3. .

  The insulating member 8 is made of ceramics whose main component is, for example, aluminum oxide, aluminum nitride, silicon nitride, or mullite. Moreover, the wiring part 9 consists of a metal which has tungsten, molybdenum, gold | metal | money, silver, copper, platinum etc. as a main component, for example. A lead terminal 7 made of a metal such as an Fe—Ni—Co alloy is electrically connected to an end portion of the wiring conductor 9 exposed on the surface of the insulating member 8 via a brazing material such as silver brazing.

  FIG. 2B is a cross-sectional view of a plane perpendicular to the side surfaces S1 to S4 of the insulating member 8. As shown in FIGS. 2A and 2B, the insulating member 8 on which the wiring portion 9 is formed is made of a quadrangular prism ceramic laminate. This ceramic laminate is formed by laminating a plurality of ceramic green sheets in which a metal paste is applied at a predetermined position and filling a predetermined through-hole with the metal paste and firing them integrally. In the insulating member 8, ceramic green sheets are laminated in a direction perpendicular to the two opposing side surfaces S1 and S4.

  At this time, the wiring part 9 formed inside the ceramic laminate extends stepwise from one side surface to the other side surface among the adjacent side surfaces of the ceramic laminate body. Here, the first wiring portion 9a extends from the surface S1 to the surface S3 of the ceramic multilayer body, and the second wiring portion 9b extends from the surface S2 to the surface S4 of the ceramic multilayer body. In FIG. 2B, one cross section of the ceramic laminate is shown, but the other cross section has the same configuration. In other words, the ceramic laminate has a plurality of square poles, that is, a plurality of internal connection terminals 7a on the side surface S1 and a plurality of external connection terminals 7b on the side surface S3 in a direction parallel to the side surfaces S1 to S4. The first wiring conductors 9a are arranged, and similarly, the plurality of second wiring conductors 9b are arranged corresponding to the plurality of internal connection terminals 7a on the side surface S2 and the plurality of external connection terminals 7b on the side surface S4.

  According to the electronic component storage package according to the present embodiment, the side surfaces S1, S2 of the insulating member 8 of the input / output terminal 3 are exposed inside the recess, and the side surfaces S1, S2 are between the internal connection terminals 7a. Make an angle of degrees. Further, the side surfaces S3 and S4 of the insulating member 8 of the input / output terminal 3 are exposed to the outside of the recess, and the side surfaces S3 and S4 form an angle of 90 degrees between the external connection terminals 7b.

  According to the electronic component storage package according to the present embodiment, the distance between the external connection terminals 7b in the height direction of the side walls of the recesses connects the plurality of external connection terminals 7b on the same plane in the height direction of the side walls of the recesses. Even if it is the same as the case where it does, the distance between the connection parts of the external connection terminal 7b and the surface of the insulating member 8 can be lengthened. Similarly, even if the distance between the internal connection terminals 7a in the height direction of the side wall of the recess is the same as the case where the plurality of internal connection terminals 7b are connected to the same plane in the height direction of the side wall of the recess, the external connection The distance between the connection part of the terminal 7b and the surface of the insulating member 8 can be lengthened.

  Further, the connecting portions of the side surfaces S1, S2 forming an angle of 90 degrees are located between the internal connection terminals 7a connected to the side surfaces S1, S2, and in particular, the insulating members so that the side surfaces S1, S2 are positioned vertically. 8 is connected to the internal connection terminal 7a, the brazing material used when connecting the internal connection terminal 7a to the side surface S1 (S2) is connected to the side surface S1 (S2) to which the internal connection terminal 7a is connected. Reaching to the adjacent side surface S2 (S1) is suppressed. Further, the connecting portions of the side surfaces S3 and S4 forming an angle of 90 degrees are located between the external connection terminals 7b connected to the side surfaces S3 and S4, and in particular, the insulating members so that the side surfaces S3 and S4 are positioned vertically. 8 is connected to the internal connection terminal 7b, the brazing material used when connecting the external connection terminal 7b to the side surface S3 (S4) is connected to the side surface S3 (S4) to which the external connection terminal 7b is connected. Reaching to the adjacent side surface S4 (S3) is suppressed. Thereby, it can suppress that the adjacent internal connection terminals 7a and external connection terminals 7b conduct | electrically_connect.

  From the above, even if the connection terminals 7 are densely connected to the insulating member 8, it is possible to suppress conduction between adjacent connection terminals.

  As a result, the number of connection terminals can be increased in the height direction of the side wall of the recess without increasing the size of the input / output terminals, and the electronic component storage package according to the present embodiment enables high-density wiring. Become.

  Further, since the connection portion between the side surfaces S1 and S2 is located between the external connection terminals 7b, the insulation between the two internal connection terminals 7a is also improved. Further, since the connection portion between the side surfaces S3 and S4 is located between the external connection terminals 7b, the insulation between the two external connection terminals 7b is also improved.

  Furthermore, the input / output terminal 3 is easy to mount because the surface to which the connection terminal 7 is mounted is a flat surface. Furthermore, compared with the case where the several connection terminal 7 is connected to the same plane, the area of the area | region which can attach one connection terminal 7 can be enlarged more.

  Note that the shape of the insulating member 8 of the input / output terminal 3 is not limited to a quadrangular column, and may be a hexagonal column, for example. FIG. 3A is a top view of the electronic component storage package 11 in such a case, and FIG. 3B is a cross-sectional view taken along line BB in FIG. FIG. 4 is a perspective view of the input / output terminal 13. In the input / output terminal 3 shown in FIG. 2, when the input / output terminal 3 is attached to the through hole of the base body 2, the portion of the side L at the boundary between the two adjacent side surfaces of the insulating member 8 is the inner wall surface of the through hole. In the input / output terminal 13 shown in FIG. 3 and FIG. 4, since the two opposite side surfaces are attached to the inner wall surface of the through hole of the base body 2, the bonding area increases and the bonding strength increases. More stable joining is possible. Further, the airtight reliability of the electronic component storage package 1 is increased.

  FIG. 5 is a diagram for explaining a method of manufacturing the input / output terminal 13. In this manufacturing method, first, a rectangular parallelepiped ceramic laminate is formed as shown in FIG. This ceramic laminate is formed by laminating a plurality of ceramic green sheets in which a metal paste is applied at a predetermined position and filling a predetermined through-hole with the metal paste and firing them integrally.

  At this time, the wiring part 9 formed inside the ceramic laminate extends stepwise from one surface to the other surface among the adjacent surfaces of the ceramic laminate. However, the difference from the ceramic laminate of FIG. 2B is that the end portion of the wiring portion 9 may stay inside without reaching the surface. 5A shows one cross section of the ceramic laminate, the other cross section has the same configuration. That is, in the ceramic laminate, a plurality of first wiring conductors 9a and a plurality of second wiring conductors 9b are arranged in one direction, here, in a direction perpendicular to the cross section of FIG. Yes.

  Next, as shown in (b), the ceramic laminated body is subjected to cutting such as a machining center to be processed into a hexagonal column having six side surfaces S11 to S16.

  When the input / output terminal 3 is attached to the base 2, the insulating member 8 processed into a hexagonal column is rotated to join the side surfaces S 12 and S 15 to the inner wall surface of the through hole of the base 2.

  In this electronic component storage package 11, the side surfaces S11 and S12 of the insulating member 8 of the input / output terminal 3 are exposed inside the recess, and the side surfaces S11 and S12 form an angle of 120 degrees between the internal connection terminals 7a. Eggplant. Further, the side surfaces S13 and S14 of the insulating member 8 of the input / output terminal 3 are exposed to the outside of the recess, and the side surfaces S13 and S14 form an angle of 120 degrees between the external connection terminals 7b.

  According to the electronic component storage package according to the present embodiment, the distance between the external connection terminals 7b in the height direction of the side wall of the recess is the same as in the case where a plurality of external connection terminals 7b are connected to the same plane. Even if it exists, the distance between the connection parts of the external connection terminal 7b and the surface of the insulating member 8 can be lengthened.

  Further, the connection portions of the side surfaces S11 and S12 forming an angle of 120 degrees are located between the internal connection terminals 7a connected to the side surfaces S11 and S12, and when connecting the internal connection terminal 7a to the side surface S11 (S12). The brazing material used is prevented from reaching the side surface S12 (S11) adjacent to the side surface S11 (S12) to which the internal connection terminal 7a is connected. Further, the connecting portions of the side surfaces S13 and S14 forming an angle of 120 degrees are located between the external connection terminals 7b connected to the side surfaces S13 and S14, and when connecting the external connection terminal 7b to the side surface S13 (S14). The brazing material used is prevented from reaching the side surface S14 (S13) adjacent to the side surface S13 (S14) to which the external connection terminal 7b is connected. Thereby, it can suppress that the adjacent internal connection terminals 7a and external connection terminals 7b conduct | electrically_connect.

  From the above, even if the connection terminals 7 are densely connected to the insulating member 8, it is possible to suppress conduction between adjacent connection terminals.

  According to the electronic component storage package according to the present embodiment, the insulating member 8 of the input / output terminal has a columnar shape having N (N is an integer of 4 or more) side surfaces. In this case, a plurality of side surfaces can be exposed in the recesses of the base body 2 and outside the base body 2, respectively. As a result, a plurality of wiring portions 9 each having one end on each of the different side surfaces exposed to the inside of the concave portion of the base body 2 and each having the other end on each of the different side surfaces exposed to the outside of the base body 2 are connected to the insulating member 8 of the input / output terminal. It can be provided inside. Therefore, if the number of side surfaces exposed to the inside of the recess of the base 2 and the outside of the base 2 is n (n is an integer of 2 or more), one side face is provided inside the recess of the base 2 and outside the base 2. Compared with the case where it exposes, the n times wiring part 9 can be formed in the insulating member 8. FIG. Therefore, the number of connection terminals 7 exposed to the inside and the outside of the recess of the base body 2 can be increased by n times as compared with the case where one side surface is exposed inside and outside the recess of the base body 2, respectively. High-density wiring becomes possible.

  In addition, when one side surface is exposed inside and outside the recess of the base body 2, many connection terminals 7 are provided in the height direction of the side wall of the recess on the exposed side surface for insulation and other reasons. Although it is difficult to form, according to the electronic component storage package 1 according to the present embodiment, each side surface exposed to the inside and the outside of the recess has at least one along the outer periphery of the bottom surface of the insulating member 8. Since it is possible to make the connection terminal 7 long enough, it is possible to make the electronic component storage package relatively smaller than the case where one side surface is exposed inside and outside the base 2. More connection terminals 7 can be provided without increasing the size.

  From the above, according to the electronic component storage package according to the present embodiment, an electronic component storage package capable of high-density wiring can be realized.

  In the above-described input / output terminals 3 and 13, the shape of the wiring portion 9 formed inside the insulating member 8 is a stepped shape, but is not limited thereto, and may be, for example, a linear shape. FIG. 6 is a perspective view of the input / output terminal 23 when the wiring portion 9 is linear. Such an input / output terminal 23 is subjected to grinding processing such as machining on a hexagonal column ceramic laminate formed by firing after firing to form a through hole for burying a conductor, and a conductor is formed in the through hole. It can be formed by filling the paste and firing again.

  Further, in the input / output terminals 3, 13, and 23 according to the present embodiment, the planar regions (S1 to S6) to which the connection terminal 7 is connected are continuously connected. For example, the connection terminal 7 is connected. Two planar regions (a first planar region and a second planar region) may be connected via another region to which the connection terminal 7 is not connected. In any case, the first plane area and the second plane area are the first plane including the first plane area and the second plane including the second plane area, and the first connection terminal and the second plane area. It is arranged so as to form an angle larger than 0 degree and smaller than 180 degrees with the connection terminal.

  Further, the input / output terminals 3, 13, and 23 according to the present embodiment have a plurality of connecting terminals 7 by having a plurality of planar regions in the height direction of the side walls of the recesses on the surfaces exposed inside and outside the recesses. However, even when the insulating member 8 has a plurality of planar regions in the longitudinal direction, the insulating member 8 is erected, that is, the upper and lower sides of the insulating member 8 are positioned along the longitudinal direction. For example, when connecting the connection terminals 7 by arranging the connection terminals 7, it is possible to connect more connection terminals 7 while reducing the possibility that the connection terminals adjacent to each other by flowing the brazing material used for the bonding flow. It is.

(Second Embodiment)
Fig.7 (a) is a top view which shows the structural example of the package for electronic component accommodation by embodiment of this invention, FIG.7 (b) is sectional drawing in CC line of Fig.7 (a). is there. FIG. 8 is a perspective view of the input / output terminal 33. The electronic component storage package according to the present embodiment is different from the electronic component storage package according to the first embodiment in that the shape of the insulating member 8 in the input / output terminal 13 and the insulating member 8 and the base 2 are different. Connected state.

  That is, the point that the insulating member 8 is a hexagonal column is the same as the configuration of the input / output terminal 33 in FIGS. 3 and 4, but the bottom surface is not substantially a regular hexagon, and the side surface S32 is the side surface S31 and the side surface S33. The side surface S35 is inclined between the side surface S36 and the side surface S34.

  Thereby, the intersection line between the bottom surface of the insulating member 8 and the side surface S33 is shorter than the intersection line between the bottom surface and the side surface S31, and the intersection line between the bottom surface and the side surface S34 of the insulating member 8 is between the bottom surface and the side surface S36. It becomes shorter than the intersection line.

  And when attaching such an insulating member 8 to the base | substrate 2, inclined surface S32, S35 and the inner wall face of a through-hole are connected. That is, the side surfaces other than the side surfaces S33 and S34 exposed in the recess of the base 2 and the side surfaces S31 and S36 exposed to the outside of the base 2 are connected to the inner wall surface of the through hole.

  Therefore, the interval between the inner wall surface of the through hole and the side surfaces S32 and S33 of the insulating member 8 connected to the inner wall surface gradually decreases in the direction from the inside of the recess of the base body 2 to the outside of the base body 2. .

  According to such a configuration, the connection surface between the inner wall surface of the through hole of the substrate 2 and the side surface of the insulating member 8 is inclined between the inside of the recess of the substrate 2 and the outside of the substrate 2. Even when a force is applied in the direction in which the output terminal 31 is pulled out or inserted, that is, in the horizontal direction in FIGS. 7A and 7B, the stress applied between the insulating member 8 and the inner wall surface of the through hole is connected. 7A and 7B, the stress is locally concentrated in the vertical direction in FIGS. 7A and 7B, the input / output terminal 33 moves in the horizontal direction, or the input / output terminal 33 is cracked. It is possible to suppress such things as entering. That is, the connection reliability between the input / output terminal 33 and the base 2 is improved.

  Further, the distance between the inner wall surface of the through hole and the side surfaces S32 and S35 of the insulating member 8 connected to the inner wall surface gradually decreases in the direction from the inside of the recess of the base body 2 to the outside of the base body 2. Since the side surfaces S31 and S36 outside the base 2 are larger than the side surfaces S33 and S34, the interval (interval G) between the external connection terminals 7 can be widened outside the base 2. Thereby, the connection between the external connection terminal 7 and the lead wire or the like becomes easier without increasing the size of the electronic component storage package.

  When the interval between the inner wall surface of the through hole and the side surfaces S32 and S35 of the insulating member 8 connected to the inner wall surface is different between the inside and the outside of the recess of the base body 2, When a force is applied in the horizontal direction in FIGS. 7A and 7B, the stress applied between the insulating member 8 and the inner wall surface of the through-hole is vertical in FIGS. 7A and 7B. Local concentration in the direction can be suppressed, and the connection reliability between the input / output terminal 33 and the substrate 2 can be improved.

  The insulating member 8 of the input / output terminal 33 is obtained by subjecting the ceramic laminated body to a machining process such as a machining center and processing it into a hexagonal column having six side surfaces S31 to S36.

  In the above description, the rectangular columnar and hexagonal column insulating members 8 have been described as examples. However, in the case of the columnar insulating members 8 having N side surfaces, similar effects can be obtained. However, from the viewpoint of easy connection of the input / output terminals to the base and airtightness after the connection, it is better that all the side surfaces are right-angled columns orthogonal to the bottom surface.

  When the side surfaces of the input / output terminals 13, 23, 33 connected to the inner wall surface of the through hole of the base 2 are flattened by performing a conventionally known grinding process in the electronic component storage packages 11, 31 described above, The connection area between the terminals 13, 23, 33 and the inner wall surface of the through hole is increased, and the connection strength is also increased. As a result, a highly airtight and reliable electronic component storage package can be realized.

  Heretofore, a configuration has been described in which a through hole is provided in the side wall of the base 2, here the frame body 5, and the inner wall surface of the through hole is connected to the insulating member 8, but as shown in FIG. Instead of providing a through hole in the side wall of 2, the notch may be provided, and the inner surface of the notch may be connected to the insulating member 8.

  In the electronic component storage package 31 according to the present embodiment, the side surfaces S31 and S32 of the insulating member 8 of the input / output terminal 3 are exposed inside the recess, and the side surfaces S31 and S32 are 0 between the internal connection terminals 7a. An angle greater than 180 degrees and less than 180 degrees. Further, the side surfaces S13 and S14 of the insulating member 8 of the input / output terminal 3 are exposed to the outside of the recess, and the side surfaces S33 and S34 form an angle greater than 0 degree and less than 180 degrees between the external connection terminals 7b.

  According to the electronic component storage package according to the present embodiment, the distance between the external connection terminals 7b in the height direction of the side wall of the recess is the same as in the case where a plurality of external connection terminals 7b are connected to the same plane. Even if it exists, the distance between the connection parts of the external connection terminal 7b and the surface of the insulating member 8 can be lengthened.

  Moreover, the connection part of side surface S31, S32 is located between the internal connection terminal 7a connected to side surface S31, S32, and the brazing material used when connecting the internal connection terminal 7a to side surface S31, S32 is the Reducing the side surface adjacent to the side surface to which the internal connection terminal 7a is connected is suppressed. Also, the connecting portions of the side surfaces S33 and S34 are located between the external connection terminals 7b connected to the side surfaces S33 and S34, and the brazing material used when connecting the external connection terminals 7b to the side surfaces S33 and S34 is Reducing the side surface adjacent to the side surface to which the external connection terminal 7b is connected is suppressed. Thereby, it can suppress that the adjacent internal connection terminals 7a and external connection terminals 7b conduct | electrically_connect.

  From the above, even if the connection terminals 7 are densely connected to the insulating member 8, it is possible to suppress conduction between adjacent connection terminals.

  In addition, the insulating member 8 is not limited to the columnar shape having N side surfaces, and the first and second planar regions exposed to the inside or the outside of the recess are also the first and second planar regions. The connection terminal 7 is connected to each of the second plane regions, and the angle formed by the first plane including the first plane region and the second plane including the second plane region is greater than 0 degrees between the connection terminals 7. If it is smaller than 180 degrees, the connection part of the 1st and 2nd plane area | region can suppress the flow of the brazing material used when connecting the connection terminal 7. FIG.

  After mounting and fixing the electronic component 5 on the mounting portion 4a of the electronic component storage package having the above-described configuration, the electrodes of the electronic component and the external connection terminals 7 inside the frame 5 are electrically connected with bonding wires or the like, A lid body 6 made of a Fe—Ni—Co alloy or the like is joined to the upper surface of the frame body 5 by a welding method such as a seam welding method, and the electronic component is hermetically sealed, whereby an electronic device as a product is obtained.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. Therefore, the above-described embodiment is merely an example in all respects, and the scope of the present invention is shown in the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the scope of the claims are within the scope of the present invention.

2: Base 3: Input / output terminal 4: Mounting table 4a: Mounting unit 5: Frame 6: Lid 7: External terminal

Claims (6)

A base having a recess for storing an electronic component, and having a through-hole or a notch communicating the inside and the outside of the recess on the side wall of the recess;
An electronic component storage package having an input / output terminal inserted into the through hole or notch,
The input / output terminal includes an insulating member having a plurality of adjacent first planar regions and second planar regions on a surface exposed to the inside or outside of the recess, and a first connection terminal connected to the first planar region And a second connection terminal connected to the second planar region,
The first plane area and the second plane area include a first plane including the first plane area, and a second plane including the second plane area, and the first connection terminal and the second connection terminal . An electronic component storage package arranged at an angle greater than 0 degrees and less than 180 degrees.   2. The electronic component storage package according to claim 1, wherein the insulating member has a third planar region connected to an inner wall surface of the through hole or an inner surface of the notch.   The electronic component storage package according to claim 2, wherein a distance between the third planar region and the inner wall surface or the inner surface is different between the inside and the outside of the recess.   The electronic component storage package according to claim 3, wherein a distance between the third planar region and the inner wall surface or the inner surface decreases from the inside of the recess toward the outside. An insulating member having a first planar region and a second planar region on the surface;
A first connection terminal connected to the first planar region;
An input / output terminal having a second connection terminal connected to the second planar region,
The first plane area and the second plane area include a first plane including the first plane area, and a second plane including the second plane area, and the first connection terminal and the second connection terminal . Input / output terminals arranged so as to form an angle larger than 0 degrees and smaller than 180 degrees. An electronic component storage package according to any one of claims 1 to 4,
And an electronic component housed in the recess of the base.

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