JP5116614B2 - Airtight terminal and electronic component storage package and electronic device - Google Patents

Airtight terminal and electronic component storage package and electronic device Download PDF

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JP5116614B2
JP5116614B2 JP2008220485A JP2008220485A JP5116614B2 JP 5116614 B2 JP5116614 B2 JP 5116614B2 JP 2008220485 A JP2008220485 A JP 2008220485A JP 2008220485 A JP2008220485 A JP 2008220485A JP 5116614 B2 JP5116614 B2 JP 5116614B2
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pin
annular member
electronic component
ceramic
recess
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JP2010056346A (en
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真二 中本
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Kyocera Corp
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    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
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    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

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Description

本発明は、半導体装置，電子機器，半導体製造装置等の電気装置に使用される気密端子および電子部品収納用パッケージならびに電子装置に関する。   The present invention relates to an airtight terminal, an electronic component storage package, and an electronic device that are used in an electrical device such as a semiconductor device, an electronic device, and a semiconductor manufacturing device.

従来、半導体製造装置等の内部雰囲気と外部雰囲気とを遮断して密閉雰囲気下で使用する電気装置には、装置の内外で電気信号を送受信するために気密端子が用いられている。   2. Description of the Related Art Conventionally, in an electrical apparatus that is used in a sealed atmosphere with an internal atmosphere and an external atmosphere cut off, such as a semiconductor manufacturing apparatus, an airtight terminal is used to transmit and receive electrical signals inside and outside the apparatus.

このような気密端子の一例を図３に断面図で示す。図３において、11は電気信号が導通されるピン、12はピン11の外周面に接合された環状部材、13はセラミック部材であり、主にこれらにより気密端子が構成されている。   An example of such an airtight terminal is shown in a sectional view in FIG. In FIG. 3, 11 is a pin through which an electric signal is conducted, 12 is an annular member joined to the outer peripheral surface of the pin 11, and 13 is a ceramic member, and these mainly constitute an airtight terminal.

この気密端子は、円柱状の金属製のピン11と、ピン11を挿通させるための貫通孔13ａが設けられ、かつ貫通孔13ａの一方の開口部周囲に第一のメタライズ層13ｂが設けられるとともに外周部に第二のメタライズ層13ｃが形成されたセラミック部材13と、第一のメタライズ層13ｂ上面に載置されるとともに内側にピン11が挿通されロウ付けされる金属製の環状部材12とから構成されている。   This hermetic terminal is provided with a cylindrical metal pin 11 and a through hole 13a for inserting the pin 11, and a first metallized layer 13b is provided around one opening of the through hole 13a. From the ceramic member 13 in which the second metallized layer 13c is formed on the outer periphery, and the metal annular member 12 that is placed on the upper surface of the first metallized layer 13b and the pin 11 is inserted and brazed inside. It is configured.

ピン11は鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等の金属から成る円柱状であり、セラミック部材13の貫通孔13ａ内に挿通されて、Ｆｅ−Ｎｉ−Ｃｏ合金から成る環状部材12および第一のメタライズ層13ｂを介してセラミック部材13にロウ付けされている。そして、電気装置内外を電気的に接続するための端子として用いられる。ピン11は必要に応じて複数本設けられ、セラミック部材13内に適当な配置や間隔でもって配設される。   The pin 11 has a cylindrical shape made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and is inserted into the through hole 13a of the ceramic member 13 to form an annular shape made of an Fe-Ni-Co alloy. The ceramic member 13 is brazed via the member 12 and the first metallized layer 13b. And it is used as a terminal for electrically connecting the inside and outside of the electric device. A plurality of pins 11 are provided as necessary, and are arranged in the ceramic member 13 with appropriate arrangement and intervals.

環状部材12および第一のメタライズ層13ｂを介してピン11とセラミック部材13とをロウ付け接合することにより、ピン11とセラミック部材13とを接合するためのロウ材のメニスカスを良好に形成することができ、ピン11をセラミック部材13に気密かつ強固にロウ付け接合することができる。   The brazing material meniscus for joining the pin 11 and the ceramic member 13 is formed satisfactorily by brazing the pin 11 and the ceramic member 13 via the annular member 12 and the first metallized layer 13b. Thus, the pin 11 can be brazed and firmly joined to the ceramic member 13 in an airtight manner.

図３に示した上記従来の気密端子においては、ピン11および環状部材12としてＦｅ−Ｎｉ−Ｃｏ合金等のセラミック部材13と比較的熱膨張係数の近い金属材料を用いることによって、ロウ付け接合時に、ピン11および環状部材12とセラミック部材13との熱膨張差による応力がセラミック部材13に大きく作用するのを抑制することができる。その結果、セラミック部材13にクラックが発生することを防止し、気密端子としての気密性を保持するようにしている。
特開平10−189091号公報 In the above-described conventional hermetic terminal shown in FIG. 3, a ceramic material 13 such as Fe-Ni-Co alloy or the like is used as the pin 11 and the annular member 12, so that a metal material having a relatively close thermal expansion coefficient is used. The stress due to the thermal expansion difference between the pin 11 and the annular member 12 and the ceramic member 13 can be prevented from acting on the ceramic member 13 greatly. As a result, cracks are prevented from occurring in the ceramic member 13, and airtightness as an airtight terminal is maintained.
Japanese Patent Laid-Open No. 10-189091

しかしながら、セラミック部材13と熱膨張係数の近いＦｅ−Ｎｉ−Ｃｏ合金等から成る金属は、電気抵抗値が大きく、ピン11の電気抵抗を小さくできないという問題点があった。   However, a metal made of an Fe—Ni—Co alloy or the like having a thermal expansion coefficient close to that of the ceramic member 13 has a problem that the electrical resistance value is large and the electrical resistance of the pin 11 cannot be reduced.

そこで、ピン11として電気抵抗値の小さい銅（Ｃｕ）等を用いることが考えられるが、この場合、ピン11の熱膨張係数がセラミック部材13に比べて大きくなり、ロウ付け接合時にピン11とセラミック部材13との熱膨張差による応力がセラミック部材13に大きく作用してしまう。その結果、セラミック部材13にクラックが発生し、気密端子としての気密性を保持することができないという問題点があった。   Therefore, it is conceivable to use copper (Cu) or the like having a small electric resistance value as the pin 11. In this case, the thermal expansion coefficient of the pin 11 is larger than that of the ceramic member 13, and the pin 11 and the ceramic are brazed. The stress due to the difference in thermal expansion with the member 13 acts greatly on the ceramic member 13. As a result, there is a problem that a crack occurs in the ceramic member 13 and the airtightness as the airtight terminal cannot be maintained.

従って、本発明は上記問題点に鑑み完成されたものであり、その目的は、電気抵抗が小さく電気信号を良好に伝送できるとともに、気密信頼性の高い気密端子および電子部品収納用パッケージならびに電子装置を提供することにある。   Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to provide an airtight terminal, an electronic component storage package, and an electronic device that have a low electric resistance and can transmit an electric signal satisfactorily and have high airtight reliability. Is to provide.

本発明の気密端子は、金属製のピンと、このピンが挿通されるとともにこのピンの外周面にロウ付けされた第１の環状部材と、前記ピンが挿通されるとともに前記第１の環状部材の外周部にロウ付けされた第２の環状部材と、前記ピンが挿通されるとともに前記第２の環状部材の外周部にメタライズ層を介してロウ付けされたセラミック部材とを具備しており、前記第１の環状部材は、前記ピンおよび前記第２の環状部材よりも熱膨張係数が小さくかつ剛性が高いことを特徴とする。   The hermetic terminal of the present invention includes a metal pin, a first annular member that is inserted through the pin and brazed to the outer peripheral surface of the pin, and a pin that is inserted through the first annular member. A second annular member brazed to an outer peripheral part, and a ceramic member brazed to the outer peripheral part of the second annular member through a metallized layer while the pin is inserted, The first annular member has a smaller coefficient of thermal expansion and higher rigidity than the pin and the second annular member.

本発明の気密端子において、好ましくは、前記ピンは銅または銀の少なくとも一方を含む金属から成ることを特徴とする。   In the hermetic terminal of the present invention, preferably, the pin is made of a metal containing at least one of copper and silver.

本発明の気密端子において、好ましくは、前記第１の環状部材はモリブデンから成ることを特徴とする。   In the hermetic terminal of the present invention, preferably, the first annular member is made of molybdenum.

本発明の気密端子において、好ましくは、前記第２の環状部材は鉄−ニッケル−コバルト合金から成ることを特徴とする。   In the hermetic terminal of the present invention, preferably, the second annular member is made of an iron-nickel-cobalt alloy.

本発明の気密端子において、好ましくは、前記セラミック部材はアルミナ質セラミックスから成ることを特徴とする。   In the hermetic terminal of the present invention, preferably, the ceramic member is made of alumina ceramics.

本発明の電子部品収納用パッケージは、上面に電子部品を収容するための凹部を有する基体と、前記ピンが前記凹部の内外に挿通するように設けられた上記構成の気密端子とを具備することを特徴とする。   An electronic component storage package according to the present invention includes a base having a recess for storing an electronic component on an upper surface, and an airtight terminal having the above-described configuration provided so that the pin is inserted into and out of the recess. It is characterized by.

本発明の電子装置は、上記構成の電子部品収納用パッケージと、前記凹部の底面に電子部品が載置固定され、前記ピンに接続された電子部品と、前記凹部を塞ぐように接合された蓋体とを具備していることを特徴とする。   The electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component placed and fixed on the bottom surface of the recess, the electronic component connected to the pin, and a lid joined so as to close the recess. And a body.

本発明の気密端子によれば、第１の環状部材は、ピンおよび第２の環状部材よりも熱膨張係数が小さくかつ剛性が高いことから、第１の環状部材によってピンの熱膨張が第２の環状部材に伝わるのを遮ることができ、セラミック部材にピンとの熱膨張差による応力が加わり難くすることができる。その結果、セラミック部材がクラック等によって破損し難くなる。   According to the hermetic terminal of the present invention, since the first annular member has a smaller coefficient of thermal expansion and higher rigidity than the pin and the second annular member, the first annular member causes a second thermal expansion of the pin. Therefore, it is possible to prevent the ceramic member from being subjected to stress due to a difference in thermal expansion from the pin. As a result, the ceramic member is not easily damaged by cracks or the like.

本発明の気密端子において、好ましくは、ピンは銅または銀の少なくとも一方を含む金属から成ることから、ピンの電気抵抗値を低いものとできる。   In the hermetic terminal of the present invention, preferably, the pin is made of a metal containing at least one of copper and silver, so that the electric resistance value of the pin can be lowered.

本発明の気密端子において、好ましくは、第１の環状部材はモリブデンから成ることから、第１の環状部材を熱膨張係数が小さくかつ剛性が高いものとすることができる。   In the hermetic terminal of the present invention, preferably, since the first annular member is made of molybdenum, the first annular member can have a low thermal expansion coefficient and high rigidity.

本発明の気密端子において、好ましくは、第２の環状部材は鉄−ニッケル−コバルト合金から成ることから、第２の環状部材の熱膨張係数がセラミック部材の熱膨張係数に近いものとなり、セラミック部材に作用する第２の環状部材との熱膨張差による応力を低減できる。また、第２の環状部材の熱伝導率を低いものとすることができ、ピンにジュール熱が発生してもセラミック部材に熱が伝わり難いものとすることができる。   In the hermetic terminal of the present invention, preferably, the second annular member is made of an iron-nickel-cobalt alloy, so that the thermal expansion coefficient of the second annular member is close to the thermal expansion coefficient of the ceramic member. It is possible to reduce the stress due to the difference in thermal expansion with the second annular member acting on the. Further, the thermal conductivity of the second annular member can be made low, and even if Joule heat is generated in the pin, it is difficult for heat to be transmitted to the ceramic member.

本発明の気密端子において、好ましくは、セラミック部材はアルミナ質セラミックスからなることから、ピンを電気的に絶縁することができる。   In the hermetic terminal of the present invention, preferably, the ceramic member is made of alumina ceramic, so that the pins can be electrically insulated.

本発明の電子部品収納用パッケージは、上面に電子部品を収容するための凹部を有する基体と、ピンが凹部の内外に挿通するように設けられた上記構成の気密端子とを具備することから、電気信号の抵抗損失が少なく、気密信頼性の高い電子部品収納用パッケージとすることができる。   Since the electronic component storage package of the present invention includes a base body having a recess for storing an electronic component on the upper surface, and an airtight terminal having the above-described configuration provided so that the pin is inserted into and out of the recess. It is possible to provide an electronic component storage package with low resistance loss of electrical signals and high airtight reliability.

本発明の電子装置は、上記構成の電子部品収納用パッケージと、凹部の底面に電子部品が載置固定され、ピンに接続された電子部品と、凹部を塞ぐように接合された蓋体とを具備していることから、作動性に優れた電子装置とすることができる。   An electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component mounted and fixed on the bottom surface of the recess, connected to a pin, and a lid joined so as to close the recess. Since it has, it can be set as the electronic device excellent in operativity.

本発明の気密端子および電子部品収納用パッケージならびに電子装置について以下に詳細に説明する。図１は本発明の気密端子の実施の形態の一例を示す断面図であり、図２は本発明の電子装置の実施の形態の一例を示す分解斜視図である。これらの図において、１は金属製のピン、21は中央部の貫通孔にピン１が挿通されるとともにピンの外周面にロウ付けされた第１の環状部材、22は中央部の貫通孔にピン１が挿通されるとともに第１の環状部材の外周部にロウ付けされた第２の環状部材、３は貫通孔３ａにピン１が挿通されるとともに第２の環状部材22がメタライズ層３ｂを介してロウ付けされたセラミック部材であり、これらにより気密端子が構成される。また、５は基体、５ａは基体５の上面に設けられた凹部、５ｂは凹部５ａの底面、６は凹部５ａに収容された電子部品、７はピン１と電子部品６の電極とを接続する電気的接続手段、８は凹部５ａを塞ぐように接合される蓋体であり、これらにより電子装置が形成される。   The airtight terminal, electronic component storage package, and electronic device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of an airtight terminal of the present invention, and FIG. 2 is an exploded perspective view showing an example of an embodiment of an electronic apparatus of the present invention. In these drawings, 1 is a metal pin, 21 is a first annular member that is inserted into the central through hole and brazed to the outer peripheral surface of the pin, and 22 is a central through hole. The second annular member 3 is brazed to the outer peripheral portion of the first annular member while the pin 1 is inserted therethrough, and the second annular member 22 is inserted into the through hole 3a and the second annular member 22 passes through the metallized layer 3b. These are ceramic members brazed via, and these constitute an airtight terminal. Reference numeral 5 denotes a base, 5a denotes a recess provided on the upper surface of the base 5, 5b denotes a bottom surface of the recess 5a, 6 denotes an electronic component housed in the recess 5a, and 7 connects the pin 1 and the electrode of the electronic component 6. The electrical connecting means 8 is a lid joined so as to close the recess 5a, and these form an electronic device.

まず、本発明の気密端子について詳細に説明する。   First, the airtight terminal of the present invention will be described in detail.

本発明の気密端子は、貫通孔３ａが形成されるとともに貫通孔３ａの一方の開口の周囲に全周にわたって環状のメタライズ層３ｂが形成されているセラミック部材３と、メタライズ層３ｂの上面に、貫通孔３ａに中心軸を一致させるように下面がロウ付けされた金属製の第２の環状部材22と、第２の環状部材22の内周側の周辺部に、貫通孔３ａに中心軸を一致させるようにして下面がロウ付けされた金属製の第１の環状部材21と、貫通孔３ａおよび第１の環状部材21と第２の環状部材22に挿通されるとともに第１の環状部材21にロウ付けされた柱状の金属製のピン１とを具備している。   The hermetic terminal of the present invention includes a ceramic member 3 in which a through hole 3a is formed and an annular metallized layer 3b is formed around one opening of the through hole 3a, and an upper surface of the metallized layer 3b. A metal-made second annular member 22 whose lower surface is brazed so that the central axis coincides with the through-hole 3a, and a central axis in the through-hole 3a on the inner peripheral side of the second annular member 22. The first annular member 21 is inserted through the metal first annular member 21 whose lower surface is brazed so as to match, the through hole 3a, the first annular member 21 and the second annular member 22, and the first annular member 21. And a columnar metal pin 1 brazed to each other.

ピン１には、第１の環状部材21および第２の環状部材22に比べ電気抵抗値が小さい金属が用いられる。また、第１の環状部材21はピン１および第２の環状部材22に比べ熱膨張係数が小さくかつ剛性が高く変形し難い。第２の環状部材22はピン１および第１の環状部材21に比べ最もセラミック部材３と熱膨張係数が近いものが用いられる。   For the pin 1, a metal having a smaller electrical resistance value than the first annular member 21 and the second annular member 22 is used. The first annular member 21 has a smaller coefficient of thermal expansion and higher rigidity than the pin 1 and the second annular member 22, and is difficult to deform. As the second annular member 22, a member having a thermal expansion coefficient closest to that of the ceramic member 3 is used as compared with the pin 1 and the first annular member 21.

この構成により、ピン１は電気抵抗が小さく、大電流の電気信号を導通することができるとともに、セラミック部材３にピン１との熱膨張差による応力が加わり難くでき、セラミック部材３がクラック等によって破損し難いものとできる。したがって、気密信頼性の高い気密端子とすることができる。すなわち、セラミック部材３により区分される外部雰囲気側と内部雰囲気側とを遮断する気密端子として良好に機能し得るものとなる。   With this configuration, the pin 1 has a small electrical resistance and can conduct a large-current electrical signal, and it is difficult for the ceramic member 3 to be subjected to stress due to a difference in thermal expansion from the pin 1. Can be hard to break. Therefore, an airtight terminal with high airtight reliability can be obtained. That is, it can function well as an airtight terminal that blocks the external atmosphere side and the internal atmosphere side, which are separated by the ceramic member 3.

図１に示す気密端子は、半導体装置，半導体製造装置，電子機器等の電気装置の気密容器部分を構成する壁部等に取り付けられるセラミック部材３を備えている。これによって、気密容器部分を構成する壁部に貫通穴を設け、ピン１を壁部の貫通穴に挿通するとともに、この貫通穴の内周面または開口を塞ぐようにセラミック部材３を取り付けることにより、密閉された電気装置の内外に電気信号を導通させることができる。なお、気密容器の壁部がセラミックスであれば、その壁部をセラミック部材３として共用してもよい。   The hermetic terminal shown in FIG. 1 includes a ceramic member 3 attached to a wall portion or the like constituting an airtight container portion of an electric device such as a semiconductor device, a semiconductor manufacturing device, or an electronic device. Thus, by providing a through hole in the wall portion constituting the airtight container portion, inserting the pin 1 into the through hole of the wall portion, and attaching the ceramic member 3 so as to close the inner peripheral surface or opening of the through hole. The electrical signal can be conducted inside and outside the sealed electrical device. If the wall portion of the hermetic container is ceramic, the wall portion may be shared as the ceramic member 3.

本発明の気密端子において、ピン１は第１の環状部材21および第２の環状部材22に比べ電気抵抗値が小さい導電性材料から成る柱状のものである。ピン１は、電気装置内外を電気的に接続するための端子として機能する。ピン１は必要に応じて複数本設けられ、セラミック部材３に設けられた各貫通孔３ａ内に適当な配置や間隔でもって配設される。複数本のピン１が同電位である場合は、共用の貫通孔３ａ、第１の環状部材21および第２の環状部材22に設けられたそれぞれの貫通孔に複数本設けてもよい。   In the hermetic terminal of the present invention, the pin 1 is a columnar member made of a conductive material having a smaller electrical resistance value than the first annular member 21 and the second annular member 22. The pin 1 functions as a terminal for electrically connecting the inside and outside of the electric device. A plurality of pins 1 are provided as necessary, and are arranged in each through hole 3a provided in the ceramic member 3 with an appropriate arrangement and interval. When a plurality of pins 1 are at the same potential, a plurality of pins 1 may be provided in each of the through holes provided in the shared through hole 3a, the first annular member 21 and the second annular member 22.

ピン１となる導電性材料としては、Ｃｕ，Ａｇ，アルミニウム（Ａｌ）等の金属が挙げられる。これらは第１の環状部材21および第２の環状部材22に比べ電気抵抗値が小さい。   Examples of the conductive material for the pin 1 include metals such as Cu, Ag, and aluminum (Al). These have smaller electrical resistance values than the first annular member 21 and the second annular member 22.

ピン１の電気抵抗値が小さいことから、ピン１に電気信号が流れる際にジュール熱の発生が少なくなり、ピン１が熱膨張するのを抑制することができる。その結果、電気信号が導通するたびにピン１が熱膨張を繰り返し、ピン１と第１の環状部材21との間に熱膨張差による応力が繰り返し作用するのを防止できる。   Since the electrical resistance value of the pin 1 is small, the generation of Joule heat is reduced when an electrical signal flows through the pin 1, and the thermal expansion of the pin 1 can be suppressed. As a result, whenever the electrical signal is conducted, the pin 1 repeats thermal expansion, and it is possible to prevent the stress due to the difference in thermal expansion between the pin 1 and the first annular member 21 from acting repeatedly.

好ましくは、ピン１はＣｕまたはＡｇの少なくとも一方を含む金属からなるのがよい。より好ましくは、ピン１が純Ｃｕまたは純Ａｇからなるのがよい。これら金属は最も電気抵抗の小さい金属として知られているもので、ピン１の電気抵抗値を小さく抑えることが可能となる。なお、純Ｃｕの電気抵抗値は1.55×10-8／Ω・ｍ、純Ａｇの電気抵抗値は1.47×10-8／Ω・ｍである。 Preferably, the pin 1 is made of a metal containing at least one of Cu and Ag. More preferably, the pin 1 is made of pure Cu or pure Ag. These metals are known as metals having the lowest electric resistance, and the electric resistance value of the pin 1 can be suppressed to a small value. The electric resistance value of pure Cu is 1.55 × 10 −8 / Ω · m, and the electric resistance value of pure Ag is 1.47 × 10 −8 / Ω · m.

このピン１は、ピン１となる棒材に旋盤を用いた切削加工や金型を用いたプレス加工，押出し加工等の従来周知の金属加工を施すことによって形成される。   The pin 1 is formed by subjecting a bar material to be the pin 1 to metal processing known in the art such as cutting using a lathe, pressing using a die, and extrusion.

また、ピン１は、その表面にＮｉから成るめっき金属層を１〜10μｍの厚みに被着させておくとピン１が酸化腐食することを有効に防止することができる。   Further, when the plated metal layer made of Ni is deposited on the surface of the pin 1 to a thickness of 1 to 10 μm, the pin 1 can be effectively prevented from being oxidatively corroded.

セラミック部材３の貫通孔３ａ内にピン１を固定するには、例えば図１に示すように、セラミック部材３にピン１の断面よりも大きな断面を有する貫通孔３ａを形成し、貫通孔３ａの一方の開口部周囲にＭｏ−Ｍｎ，タングステン（Ｗ）等から成るメタライズ層３ｂを被着させておくとともにこれにＮｉめっきを施し、このＮｉめっきが施されたメタライズ金属層３ｂの表面に、ピン１が挿通されたＦｅ−Ｎｉ−Ｃｏ合金等の金属からなる第２の環状部材22と、第２の環状部材22の上面に載置されるＭｏ等からなる第１の環状部材21とを載置し、これらをＡｇロウ等のロウ材によって接合する。   In order to fix the pin 1 in the through hole 3a of the ceramic member 3, for example, as shown in FIG. 1, the through hole 3a having a cross section larger than the cross section of the pin 1 is formed in the ceramic member 3, and the through hole 3a A metallized layer 3b made of Mo-Mn, tungsten (W) or the like is deposited around one of the openings, and Ni is plated on the metallized metal layer 3b. A second annular member 22 made of a metal such as an Fe-Ni-Co alloy through which 1 is inserted, and a first annular member 21 made of Mo or the like placed on the upper surface of the second annular member 22 are mounted. These are joined by a brazing material such as Ag brazing.

ここで、第１の環状部材21はピン１および第２の環状部材22に比べ熱膨張係数が小さくかつ剛性が高く変形し難い材料からなる。この構成により、ピン１を第１の環状部材21にロウ付け接合する際に、ピン１の熱膨張が第１の環状部材21より外側に伝わるのを第１の環状部材21が遮るので、セラミック部材３にピン１との熱膨張差による応力がそのまま作用するのを防ぐことができる。   Here, the first annular member 21 is made of a material having a smaller coefficient of thermal expansion and higher rigidity than the pin 1 and the second annular member 22 and being difficult to deform. With this configuration, when the pin 1 is brazed to the first annular member 21, the first annular member 21 blocks the thermal expansion of the pin 1 from being transmitted outside the first annular member 21. It can prevent that the stress by the thermal expansion difference with the pin 1 acts on the member 3 as it is.

好ましくは、第１の環状部材21はＭｏからなるのがよい。Ｍｏは、熱膨張係数が小さく、かつ剛性（縦弾性係数）が高いので、ピン１の熱膨張が第１の環状部材21より外側に伝わるのを抑えることができる。なお、Ｍｏの熱膨張係数は6.1×10-６／Ｋ，縦弾性係数（ヤング率）が323.4ＧＰａである。 Preferably, the first annular member 21 is made of Mo. Since Mo has a small thermal expansion coefficient and a high rigidity (longitudinal elastic modulus), it is possible to suppress the thermal expansion of the pin 1 from being transmitted to the outside from the first annular member 21. Mo has a thermal expansion coefficient of 6.1 × 10 −6 / K and a longitudinal elastic modulus (Young's modulus) of 323.4 GPa.

また第２の環状部材22はピン１および第１の環状部材21に比べ最もセラミック部材３と熱膨張係数が近い材料からなるのが好ましい。この構成により、第２の環状部材22よりセラミック部材３が受ける熱膨張差による応力を小さなものにすることができる。その結果、セラミック部材３がクラック等によって破損するのを抑制することができる。例えば、第２の環状部材22はＦｅ−Ｎｉ−Ｃｏ合金からなるのがよい。また、Ｆｅ−Ｎｉ−Ｃｏ合金は、熱伝導率が低いので、ピン１にジュール熱が発生してもセラミック部材３に熱を伝え難くすることができる。なお、Ｆｅ−Ｎｉ−Ｃｏ合金の熱膨張係数は9.1×10-６／Ｋ，熱伝導率は17Ｗ／ｍ・Ｋである。 The second annular member 22 is preferably made of a material having a thermal expansion coefficient closest to that of the ceramic member 3 as compared with the pin 1 and the first annular member 21. With this configuration, the stress due to the difference in thermal expansion that the ceramic member 3 receives from the second annular member 22 can be reduced. As a result, the ceramic member 3 can be prevented from being damaged by cracks or the like. For example, the second annular member 22 is preferably made of an Fe—Ni—Co alloy. In addition, since the Fe—Ni—Co alloy has low thermal conductivity, it is difficult to transfer heat to the ceramic member 3 even if Joule heat is generated in the pin 1. Note that the thermal expansion coefficient of the Fe—Ni—Co alloy is 9.1 × 10 −6 / K, and the thermal conductivity is 17 W / m · K.

環状部材２（以下、第１の環状部材21および第２の環状部材22を総称して環状部材２という）およびメタライズ層３ｂを介してピン１とセラミック部材３とをロウ付け接合し、ピン１とセラミック部材３とを接合するためのロウ材のメニスカスを良好に形成すれば、ピン１をセラミック部材３に気密かつ強固にロウ付け接合することができる。   The pin 1 and the ceramic member 3 are brazed and joined via the annular member 2 (hereinafter, the first annular member 21 and the second annular member 22 are collectively referred to as the annular member 2) and the metallized layer 3b. If the meniscus of the brazing material for joining the ceramic member 3 and the ceramic member 3 is well formed, the pin 1 can be brazed and firmly joined to the ceramic member 3 in an airtight manner.

セラミック部材３は、例えばＡｌ２Ｏ３質セラミックス，窒化アルミニウム（ＡｌＮ）質セラミックス，ムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）質セラミックス等から成る絶縁性のものであり、電気装置との電気的絶縁を保ってピン１を保持する機能を有し、例えばＡｌ２Ｏ３質セラミックスから成る場合、酸化珪素（ＳｉＯ２）、酸化マグネシウム（ＭｇＯ）および酸化カルシウム（ＣａＯ）等のＡｌ２Ｏ３質セラミック原料粉末にポリビニルアルコール等のバインダを添加混合するとともに、これを所定形状のプレス型内に充填し、所定の圧力でプレスすることによりプレス成形体を得、しかる後、このプレス成形体を約1600℃の温度で焼成することによって製作される。 The ceramic member 3 is an insulating member made of, for example, Al 2 O 3 ceramics, aluminum nitride (AlN) ceramics, mullite (3Al 2 O 3 · 2SiO 2 ) ceramics, and is electrically insulated from an electric device. has the function of holding the pin 1 while maintaining, for example, if made of Al 2 O 3 quality ceramics, silicon oxide (SiO 2), Al 2 O 3 quality ceramic such as magnesium oxide (MgO) and calcium oxide (CaO) A binder such as polyvinyl alcohol is added to and mixed with the raw material powder, and this is filled into a press mold of a predetermined shape and pressed at a predetermined pressure to obtain a press molded body. It is manufactured by firing at a temperature of ° C.

または、Ａｌ２Ｏ３，ＳｉＯ２，ＭｇＯ，ＣａＯ等の原料粉末に適当な有機バインダ，溶剤等を添加混合してスラリーと成す。このスラリーをドクターブレード法やカレンダーロール法によってセラミックグリーンシートと成し、所要の大きさに切断する。次に、複数のセラミックグリーンシートにおいて貫通孔３ａ等を形成するために適当な打抜き加工を施す。そして、これらのセラミックグリーンシートにタングステン（Ｗ）等の金属粉末を主成分とする金属ペーストを印刷塗布してメタライズ層３ｂ等の導体層となる印刷パターンを形成し、次いでこれらの印刷パターンを形成したセラミックグリーンシートを積層し、約1600℃の温度で焼成することによって製作される。 Alternatively, an appropriate organic binder, solvent, etc. are added to and mixed with raw material powders such as Al 2 O 3 , SiO 2 , MgO, CaO to form a slurry. This slurry is formed into a ceramic green sheet by a doctor blade method or a calender roll method, and cut into a required size. Next, an appropriate punching process is performed to form the through holes 3a and the like in the plurality of ceramic green sheets. Then, a metal paste mainly composed of a metal powder such as tungsten (W) is printed on these ceramic green sheets to form a print pattern to be a conductor layer such as a metallized layer 3b, and then these print patterns are formed. The ceramic green sheets are laminated and fired at a temperature of about 1600 ° C.

好ましくは、セラミック部材３はＡｌ２Ｏ３質セラミックスからなるのがよい。この構成により、セラミック部材３の強度を高いものとして破損し難くし、気密端子としての気密信頼性を向上させることができる。 Preferably, the ceramic member 3 is made of Al 2 O 3 ceramics. With this configuration, the strength of the ceramic member 3 can be made high so that it is difficult to break, and the airtight reliability as an airtight terminal can be improved.

なお、セラミック部材３を電気装置の金属壁にロウ付けするには、例えばセラミック部材３の外周面にＭｏ−Ｍｎから成るメタライズ金属層を被着させておくとともにこれにＮｉめっきを施し、このＮｉめっきが施されたメタライズ金属層と電気装置とをＡｇロウ等のロウ材を介してロウ付けする方法が採用される。   In order to braze the ceramic member 3 to the metal wall of the electric device, for example, a metallized metal layer made of Mo-Mn is deposited on the outer peripheral surface of the ceramic member 3 and Ni plating is applied thereto. A method of brazing the plated metallized metal layer and the electric device through a brazing material such as Ag brazing is adopted.

次に、本発明の電子部品収納用パッケージについて詳細に説明する。   Next, the electronic component storage package of the present invention will be described in detail.

本発明の電子部品収納用パッケージは、図２に示すように、上面に電子部品６を収容するための凹部５ａが形成された基体５と、ピン１が凹部５ａの内外に挿通するように設けられた上記構成の気密端子とを具備する構成である。   As shown in FIG. 2, the electronic component storage package of the present invention is provided so that the base 5 having a recess 5a for storing the electronic component 6 on the upper surface and the pin 1 are inserted into and out of the recess 5a. And a hermetic terminal having the above-described configuration.

この構成により、本発明の気密端子を用いた電気信号を効率良く伝送でき、気密信頼性の高い電子部品収納用パッケージとすることができる。   With this configuration, an electrical signal using the hermetic terminal of the present invention can be efficiently transmitted, and a highly airtight and reliable electronic component storage package can be obtained.

図２においては、基体５が側壁３と底板４とが接合されて成る形態を示しているが、基体５は全体が一体のものとして形成されていてもよいし、側壁３と底板４とが別々に形成され両者が互いに接合されることで形成されていてもよい。また図２においては、気密端子のセラミック部材３が側壁３と一体となっている形態を示している。また、気密端子が側壁３に取り付けられた形態を示しているが、底板４に取り付けられていてもよく、パッケージ内外の導通を取るに最適な位置に取り付けられる。   Although FIG. 2 shows a form in which the base body 5 is formed by bonding the side wall 3 and the bottom plate 4, the base body 5 may be formed as a whole, or the side wall 3 and the bottom plate 4 may be integrated. They may be formed separately and joined together. FIG. 2 shows a form in which the ceramic member 3 of the airtight terminal is integrated with the side wall 3. Moreover, although the form which the airtight terminal was attached to the side wall 3 is shown, it may be attached to the baseplate 4, and it is attached in the optimal position for taking the inside and outside of a package.

基体５は全体が一体のものとして形成されている場合、底板４を側壁３と同様の材質からなるセラミック材料で形成し、基体５の全体をセラミックグリーンシート積層法によって効率良く製造することが可能となる。   When the base 5 is formed as a whole, the bottom plate 4 can be formed of a ceramic material made of the same material as the side wall 3, and the entire base 5 can be efficiently manufactured by a ceramic green sheet lamination method. It becomes.

また、側壁３と底板４とが別々に形成され両者が互いに接合される場合、底板４を金属によって形成することができ、底板４に搭載される高出力の電子部品６から発生する熱を外部に効率良く放散させることができる。底板４を形成する金属材料として、好ましくは、Ｃｕ−Ｗ，Ｃｕ−ＭｏやＣｕ−Ｃｒ等のＣｕを含む複合材料からなるのがよい。これらの材料は、Ｃｕを含有して熱伝導率が高く、熱膨張係数が側壁３の熱膨張係数に近い値を有する点で好ましい。金属からなる底板４は、金属のインゴットを圧延加工やプレス加工，切削加工等の金属加工を施すことにより所定形状に成形される。   When the side wall 3 and the bottom plate 4 are separately formed and joined together, the bottom plate 4 can be formed of metal, and heat generated from the high-power electronic component 6 mounted on the bottom plate 4 is externally generated. Can be efficiently diffused. The metal material forming the bottom plate 4 is preferably made of a composite material containing Cu such as Cu—W, Cu—Mo, or Cu—Cr. These materials are preferable in that they contain Cu, have high thermal conductivity, and have a thermal expansion coefficient close to that of the side wall 3. The bottom plate 4 made of metal is formed into a predetermined shape by subjecting a metal ingot to metal processing such as rolling, pressing, and cutting.

なお、図２においては側壁３と一体に気密端子が設けられた例を示したが、気密端子のセラミック部材３と電子部品収納用パッケージの側壁とが別体で、気密端子のセラミック部材３が電子部品収納用パッケージの側壁に接合される形態であってもよい。この場合、側壁を金属で形成することができ、底板４と側壁の両方を金属で形成することも可能となる。底板４と側壁の両方を金属で形成することによって、電子部品６から発生する熱を底板４からだけでなく、底板４を介し側壁からも熱を放散させることができる。この結果、電子部品６から発生する熱をさらに効率よく熱放散させることができる。   2 shows an example in which the hermetic terminal is provided integrally with the side wall 3. However, the ceramic member 3 of the hermetic terminal and the side wall of the electronic component storage package are separate, and the ceramic member 3 of the hermetic terminal is provided. The form joined to the side wall of the electronic component storage package may be sufficient. In this case, the side wall can be formed of metal, and both the bottom plate 4 and the side wall can be formed of metal. By forming both the bottom plate 4 and the side wall with metal, heat generated from the electronic component 6 can be dissipated not only from the bottom plate 4 but also from the side wall via the bottom plate 4. As a result, the heat generated from the electronic component 6 can be more efficiently dissipated.

またこの構成により、電子部品収納用パッケージの接地電位（ケースグランド）を強化することができる。従って、電子部品収納用パッケージ内に高周波信号で作動する電子部品６を載置する場合においても、高周波信号の伝送特性に優れる電子部品収納用パッケージとすることができる。   Also, with this configuration, the ground potential (case ground) of the electronic component storage package can be strengthened. Therefore, even when the electronic component 6 that operates with a high frequency signal is placed in the electronic component storage package, the electronic component storage package having excellent high frequency signal transmission characteristics can be obtained.

次に、本発明の電子装置について詳細に説明する。   Next, the electronic device of the present invention will be described in detail.

本発明の電子装置は、図２に示すように、上記構成の電子部品収納用パッケージと、凹部５ａの例えば底面５ｂに載置固定された電子部品６と、基体５の上面に凹部５ａを塞ぐための蓋体８とを具備する。電子部品６の電極とピン１とは電気的接続手段７によって接続され、蓋体８が接合されることによって、電子部品６が凹部５ａに封止されている。   As shown in FIG. 2, the electronic device of the present invention closes the recess 5 a on the electronic component 6 package having the above-described configuration, the electronic component 6 placed and fixed on, for example, the bottom surface 5 b of the recess 5 a, and the upper surface of the base 5. And a lid 8 for the purpose. The electrode of the electronic component 6 and the pin 1 are connected by the electrical connection means 7, and the electronic component 6 is sealed in the recess 5 a by joining the lid 8.

この構成により、本発明の電子部品収納用パッケージを用いた、作動性に優れた電子装置とすることができる。   With this configuration, an electronic device excellent in operability using the electronic component storage package of the present invention can be provided.

電子部品６としては、例えば、ダイオード，ＦＥＴ，ＭＯＳＦＥＴ，ＩＧＢＴ，サイリスター等の大電流の電気信号で作動する大電力用の電子部品６が例示される。電子部品６は、基体５の凹部５ａの底面５ｂにＡｕ−錫（Ｓｎ）半田，Ａｕ−ゲルマニウム（Ｇｅ）半田等の半田やＡｇ−Ｃｕロウ等のロウ材を介して載置固定され、電子部品６の電極がピン１にボンディングワイヤ等の電気的接続手段７を介して電気的に接続される。なお、電子部品６は底面５ｂに載置固定される場合を示したが、凹部５ａ内のどこに収容されていてもよい。例えば、回路基板の上に搭載されていてもよい。   Examples of the electronic component 6 include a high-power electronic component 6 that operates with an electric signal of a large current, such as a diode, FET, MOSFET, IGBT, or thyristor. The electronic component 6 is mounted and fixed to the bottom surface 5b of the recess 5a of the base 5 via solder such as Au-tin (Sn) solder, Au-germanium (Ge) solder, or a brazing material such as Ag-Cu solder. The electrode of the component 6 is electrically connected to the pin 1 via an electrical connection means 7 such as a bonding wire. In addition, although the case where the electronic component 6 was mounted and fixed to the bottom face 5b was shown, it may be accommodated anywhere in the recessed part 5a. For example, it may be mounted on a circuit board.

電気的接続手段７としては、ピン１と電子部品６とを低抵抗で接続するために、直径が300μｍ〜500μｍと比較的大きな直径を有するボンディングワイヤを用いるのがよい。このような電気的接続手段７としてのボンディングワイヤは、例えば、Ａｌ，Ａｕ等から成るのがよい。ボンディングワイヤは、図２に示すように、１本のピン１に対して複数設けるのがよく、この構成により、より低抵抗での接続ができる。また、電気的接続手段７には、ボンディングワイヤに限らず、銅線をハンダ付けした電気的接続手段７や断面積の大きいリボンワイヤ等が用いられてもよい。なお、ピン１の電気的接続手段７との接続部は偏平に成形しておくとよい。   As the electrical connection means 7, in order to connect the pin 1 and the electronic component 6 with low resistance, it is preferable to use a bonding wire having a relatively large diameter of 300 μm to 500 μm. Such a bonding wire as the electrical connection means 7 is preferably made of, for example, Al, Au or the like. As shown in FIG. 2, it is preferable to provide a plurality of bonding wires with respect to one pin 1, and this configuration enables connection with a lower resistance. The electrical connection means 7 is not limited to a bonding wire, but may be an electrical connection means 7 soldered with a copper wire, a ribbon wire having a large cross-sectional area, or the like. In addition, it is good to shape | mold the connection part with the electrical connection means 7 of the pin 1 flatly.

最後に、基体５の上面に凹部５ａの内側を塞ぐようにして金属やセラミックス等からなる蓋体８が接合されることによって本発明の電子装置となる。   Finally, the lid 8 made of metal, ceramics, or the like is joined to the upper surface of the base 5 so as to close the inside of the recess 5a, whereby the electronic device of the present invention is obtained.

なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。   Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention.

例えば、図１において、第１の環状部材21，第２の環状部材22を平板状の環状部材２として示したが、例えば、筒状に成形されたものであってもよい。筒状に成形することにより、熱膨張による歪がセラミック部材３に伝わり難いものとできる。   For example, in FIG. 1, the first annular member 21 and the second annular member 22 are shown as the flat annular member 2, but may be formed into a cylindrical shape, for example. By forming into a cylindrical shape, strain due to thermal expansion can hardly be transmitted to the ceramic member 3.

また、第１の環状部材21が第２の環状部材22の上面に接合される例を示したが、第２の環状部材22の下面に接合されてもよい。第１の環状部材21を第２の環状部材22の下面に接合し、貫通孔３ａ内に収納すれば、小形な気密端子とすることができる。   Further, although the example in which the first annular member 21 is joined to the upper surface of the second annular member 22 has been shown, it may be joined to the lower surface of the second annular member 22. If the first annular member 21 is joined to the lower surface of the second annular member 22 and accommodated in the through hole 3a, a small airtight terminal can be obtained.

また、第２の環状部材22がセラミック部材３の上面に接合される例を示したが、第２の環状部材22は貫通孔３ａの内周面に接合されてもよい。第２の環状部材22を貫通孔３ａ内に接合し、貫通孔３３ａ内に収納するようにすれば、小形な気密端子とすることができる。   Further, although the example in which the second annular member 22 is joined to the upper surface of the ceramic member 3 has been shown, the second annular member 22 may be joined to the inner peripheral surface of the through hole 3a. If the 2nd annular member 22 is joined in the through-hole 3a, and it accommodates in the through-hole 33a, it can be set as a small airtight terminal.

本発明の気密端子の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the airtight terminal of this invention. 本発明の電子装置の実施の形態の一例を示す分解斜視図である。It is a disassembled perspective view which shows an example of embodiment of the electronic device of this invention. 従来の気密端子の例を示す断面図である。It is sectional drawing which shows the example of the conventional airtight terminal.

符号の説明Explanation of symbols

１：ピン
２：環状部材
２１：第１の環状部材
２２：第２の環状部材
３：セラミック部材（側壁）
３ａ：貫通孔
３ｂ：メタライズ層
５：基体
５ａ：凹部
５ｂ：底面
６：電子部品
７：電気的接続手段
８：蓋体 1: Pin 2: Ring member 21: First ring member 22: Second ring member 3: Ceramic member (side wall)
3a: Through-hole 3b: Metallized layer 5: Substrate 5a: Recessed part 5b: Bottom surface 6: Electronic component 7: Electrical connection means 8: Lid

Claims (7)

金属製のピンと、
該ピンが挿通されるとともに該ピンの外周面にロウ付けされた第１の環状部材と、
前記ピンが挿通されるとともに前記第１の環状部材の外周部にロウ付けされた第２の環状部材と、
前記ピンが挿通されるとともに前記第２の環状部材の外周部にメタライズ層を介してロウ付けされたセラミック部材とを具備しており、
前記第１の環状部材は、前記ピンおよび前記第２の環状部材よりも熱膨張係数が小さくかつ剛性が高いことを特徴とする気密端子。 With metal pins,
A first annular member inserted through the pin and brazed to the outer peripheral surface of the pin;
A second annular member that is inserted through the pin and brazed to the outer periphery of the first annular member;
A ceramic member brazed to the outer peripheral portion of the second annular member through a metallized layer while the pin is inserted;
The hermetic terminal, wherein the first annular member has a smaller coefficient of thermal expansion and higher rigidity than the pin and the second annular member. 前記ピンは銅または銀の少なくとも一方を含む金属から成ることを特徴とする請求項１記載の気密端子。 2. The airtight terminal according to claim 1, wherein the pin is made of a metal containing at least one of copper and silver. 前記第１の環状部材はモリブデンから成ることを特徴とする請求項１または請求項２に記載の気密端子。 The hermetic terminal according to claim 1, wherein the first annular member is made of molybdenum. 前記第２の環状部材は鉄−ニッケル−コバルト合金から成ることを特徴とする請求項１乃至請求項３のいずれかに記載の気密端子。 The hermetic terminal according to any one of claims 1 to 3, wherein the second annular member is made of an iron-nickel-cobalt alloy. 前記セラミック部材はアルミナ質セラミックスから成ることを特徴とする請求項１乃至請求項４のいずれかに記載の気密端子。 The hermetic terminal according to any one of claims 1 to 4, wherein the ceramic member is made of alumina ceramics. 上面に電子部品を収容するための凹部を有する基体と、前記ピンが前記凹部の内外に挿通するように設けられた請求項１乃至請求項５のいずれかに記載の気密端子とを具備する電子部品収納用パッケージ。 6. An electronic device comprising: a base having a recess for accommodating an electronic component on an upper surface; and the airtight terminal according to claim 1, wherein the pin is provided so as to be inserted into and out of the recess. Parts storage package. 請求項６に記載の電子部品収納用パッケージと、前記凹部に載置固定され、前記ピンに接続された電子部品と、前記凹部を塞ぐように接合された蓋体とを具備した電子装置。 An electronic device comprising the electronic component storage package according to claim 6, an electronic component placed and fixed in the recess and connected to the pin, and a lid joined so as to close the recess.
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