JP2005235576A - Airtight terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an airtight terminal with high reliability on airtightness, capable of surely blocking an internal atmosphere used for electric devices like a semiconductor manufacturing device, an electronic device, a semiconductor device or the like from an external atmosphere. <P>SOLUTION: The airtight terminal, comprising a cylinder-shaped metallic pin 1 having a flange part 1a; and a ceramic plate 3, on which, a throughhole 3a penetrating through both main surfaces for penetrating the pin 1, a first metallized layer 3b formed around an opening part at one side of the throughhole 3a, and a second metallized layer 3c for mounting an electric device at an outer peripheral part are formed; is formed by brazing a main surface of the flange part 1a on the first metallized layer 3b. A groove 1b having an inner surface continued to a main surface of the flange part 1a is formed on the whole outer peripheral surface of the pin 1 at the part corresponding to the inside of the throughhole 3a. As a remnant brazing material 2 can be released to a groove 1b, crack is hardly generated at the neighboring area of the opening of the throughhole of the ceramic plate 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an airtight terminal used for an electrical apparatus such as a semiconductor manufacturing apparatus, an electronic apparatus, and a semiconductor apparatus.

  Conventionally, an airtight terminal is attached to an electric apparatus that uses an internal atmosphere of a semiconductor manufacturing apparatus or the like while being cut off from an external atmosphere in order to transmit and receive electric signals inside and outside.

  An example of such an airtight terminal is shown in FIG. FIG. 4 is a cross-sectional view showing an example of a conventional hermetic terminal, wherein 11 is a pin, 12 is a brazing material, and 13 is a ceramic plate, and these constitute an airtight terminal.

  This hermetic terminal includes a cylindrical metal pin 11 provided with a flange 11a, a through hole 13a for inserting the pin 11, and a first opening around one opening of the through hole 13a. The ceramic plate 13 provided with the metallized layer 13b and having the second metallized layer 13c formed on the outer peripheral portion is brazed to the lower surface of the flange portion 11a and the upper surface of the metallized layer 13b by the brazing material 12. It is made up.

  The pin 11 has a cylindrical shape made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and is provided with a flange portion 11a. The pin 11 is inserted into the through hole 13a of the ceramic plate 13 and is inserted into the flange portion 11a. And the first metallized layer 13b are brazed to function as terminals for electrically connecting the inside and outside of the electric device. A plurality of pins 11 are provided as necessary, and are arranged in the ceramic plate 13 with appropriate arrangement and intervals.

  The pin 11 and the ceramic plate 13 are fixed by, for example, depositing a first metallized layer 13b made of molybdenum (Mo) -manganese (Mn) or the like around one opening of the through hole 13a of the ceramic plate 13. The first metallized layer 13b and the pin 11 on which the Ni plating is applied are formed on the outer peripheral portion of the pin 11 and placed on the upper surface of the first metallized layer 13b. It is performed by brazing and joining with a brazing material 12 such as silver (Ag) brazing at the elbow 11a.

  By brazing and joining the pin 11 and the ceramic plate 13 via the flange portion 11a and the first metallized layer 13b, a meniscus of the brazing material 12 for joining the pin 11 and the ceramic plate 13 is satisfactorily formed. Therefore, the pin 11 can be brazed and firmly joined to the ceramic plate 13 in an airtight manner.

The ceramic plate 13 is an insulating material made of, for example, alumina (Al ₂ O ₃ ) ceramics, and a through hole 13a is provided in the center thereof, and a pin 11 is inserted into the through hole 13a and brazed. Yes.

In order to braze the ceramic plate 13 to an electric device, for example, a second metallized layer 13c made of Mo-Mn is deposited on the outer peripheral surface of the ceramic plate 13, and Ni plating is applied to the second metallized layer 13c. A method of brazing the plated second metallized layer 13c and the electric device through a brazing material such as Ag brazing is adopted. Alternatively, a method is adopted in which a cylindrical metal sleeve (not shown) is brazed to the second metallized layer 13c in advance by a brazing material such as Ag brazing, and this metal sleeve and the electric device are welded.
Japanese Patent Laid-Open No. 10-189091

  However, in the conventional hermetic terminal shown in FIG. 4, the brazing material 12 accumulates between the base of the flange portion 11a and the peripheral portion of the through hole 13a of the first metallized layer 13b. There is a problem that stress due to a difference in thermal expansion with respect to 13 tends to occur, cracks start from the peripheral edge of the through-hole 13a, and the ceramic plate 13 is damaged. In particular, when the diameter of the pin 11 increases, not only the stress due to the thermal expansion difference between the ceramic plate 13 and the brazing material 12 but also the stress due to the thermal expansion difference between the pin 11 and the peripheral portion of the through hole 13b of the ceramic plate 13 increases. There was a significant problem that the ceramic plate 13 was damaged due to the action.

  As a result, there is a problem in that it is impossible to hermetically block between both main surfaces of the ceramic plate 13, that is, between the external atmosphere side and the internal atmosphere side of the electric device, so that it cannot function as an airtight terminal.

  Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to provide an airtight terminal with high hermetic reliability that can reliably block the internal atmosphere and the external atmosphere.

  The hermetic terminal of the present invention has a cylindrical metal pin provided with a flange and a through hole for inserting this pin formed between both main surfaces, and one opening of the through hole. The first metallized layer is formed in an annular shape around the periphery, and the second metallized layer for brazing on the inner surface of the cylindrical metal member or the main surface of the annular metal member is formed on the outer periphery. The plate is an airtight terminal formed by brazing one main surface of the flange portion and the first metallized layer, and the pin is located at a portion located on the inner side of the through hole on the outer peripheral surface. A groove having an inner surface continuous with the one main surface of the collar portion is formed over the entire circumference.

  The hermetic terminal of the present invention has a cylindrical metal pin provided with a flange and a through-hole for inserting the pin formed between both main surfaces, around one opening of the through-hole. A ceramic plate in which a first metallized layer is formed in an annular shape and a second metallized layer for brazing on the inner surface of the cylindrical metal member or the main surface of the annular metal member is formed on the outer periphery; Is a hermetic terminal formed by brazing one main surface of the buttocks and the first metallized layer, and the pin is located on the inner surface of the through hole on the outer peripheral surface, on one main surface of the buttocks. Since the groove with the continuous inner surface is formed over the entire circumference, the brazing material is easily flown into the groove with the inner surface continuous with one main surface of the flange, provided at the base of the flange, and the peripheral portion of the through hole It is possible to effectively prevent the brazing material from accumulating. Therefore, it becomes difficult for the stress due to the difference in thermal expansion between the brazing material and the ceramic plate to act on the periphery of the through hole, and it is possible to effectively prevent cracks from occurring in the ceramic plate.

  Further, since it is possible to effectively prevent the brazing material from being accumulated between the base of the collar portion and the peripheral portion of the through hole, the stress due to the difference in thermal expansion with the pin hardly acts on the peripheral portion of the through hole of the ceramic plate. Therefore, even if the diameter of the pin is increased, the stress due to the difference in thermal expansion from the pin does not act on the peripheral portion of the through hole of the ceramic plate, and damage to the ceramic plate can be effectively prevented.

  As a result of the above, the hermetic terminal of the present invention effectively prevents the ceramic plate from being damaged, and can reliably and hermetically cut off between the two main surfaces of the ceramic plate, that is, between the external atmosphere side and the internal atmosphere side of the electric device. It can function well as an airtight terminal.

  The airtight terminal of the present invention will be described in detail below. FIG. 1 is a sectional view showing an example of an embodiment of an airtight terminal of the present invention. In the figure, 1 is a pin, 2 is a brazing material, 3 is a ceramic plate, and these constitute an airtight terminal.

  The hermetic terminal of the present invention has a cylindrical metal pin 1 provided with a flange 1a, and a through hole 3a through which the pin 1 is inserted so as to penetrate between both main surfaces. The first metallized layer 3b is formed in an annular shape around one opening, and the second metallized layer is brazed to the inner surface of the cylindrical metal member or the main surface of the annular metal member on the outer periphery. The ceramic plate 3 on which 3c is formed is an airtight terminal formed by brazing and joining one main surface of the flange portion 1a and the first metallized layer 3b, and the pin 1 is connected to the through hole 3a on the outer peripheral surface. A groove 1b whose inner surface is continuous with one main surface of the flange 1a is formed over the entire circumference in a portion located on the inner side.

  In FIG. 1, the structure by which the 2nd metallization layer 3c was formed in the outer periphery of the ceramic board 3 as an attaching part for attaching to an electric apparatus is shown. Hereinafter, the metallized layer formed around one opening of the through hole 3a will be described as a first metallized layer 3b, and the metallized layer formed on the outer periphery of the ceramic plate 3 will be described as a second metallized layer 3c.

  In the hermetic terminal of the present invention, the pin 1 is a cylindrical shape made of a metal such as an Fe—Ni—Co alloy, and has a flange 1a formed in a concentric disk shape on the outer peripheral portion, and inside the through hole 3a of the ceramic plate 3. And the flange 1a is brazed to the first metallized layer 3b so that one end of the pin 1 is on the external atmosphere side of the electric device and the other end is on the internal atmosphere side. Functions as a terminal for electrical connection. A plurality of pins 1 are provided on the ceramic plate 3 as necessary, and are arranged in the ceramic plate 3 with appropriate arrangement and intervals.

  Here, the pin 1 is provided at the base of the flange portion 1a at a portion located inside the through hole 3a on the outer peripheral surface, and a groove whose inner surface is continuous on one main surface of the flange portion 1a is formed over the entire periphery. Yes. The pin 1 is formed by subjecting a bar material to be the pin 1 to metal processing known in the art such as cutting using a lathe or press working using a die. The flange portion 1 a may be formed integrally with the pin 1, or may be brazed to the outer peripheral portion of the pin 1 after being formed as an annular member separately from the pin 1.

  The pin 1 is preferably made of a material whose coefficient of thermal expansion is similar to that of the ceramic plate 3. With this configuration, both the heat of the pin 1 and the ceramic plate 3 when the pin 1 is brazed is used. The difference in expansion can be minimized, and the pin 1 can be firmly bonded to the ceramic plate 3 with good airtightness. Further, when the hardness of the metal constituting the pin 1 is high, the pin 1 is relatively hard and is not easily bent. Therefore, the pin 1 is hardly bent when the connector socket is fitted to the external atmosphere side of the pin 1.

Therefore, when the ceramic plate 3 is made of an Al ₂ O ₃ ceramic, the pin 1 is preferably made of an Fe—Ni—Co alloy. The Fe—Ni—Co alloy has a thermal expansion coefficient of 5.7 to 6.2 × 10 ⁻⁶ which is similar to the thermal expansion coefficient of 7 to 8 × 10 ^{−6 of} Al ₂ O ₃ ceramics, and Vickers Since the hardness is about Hv = 200 and it is hard and difficult to bend, it is a suitable material for the pin 1.

  Further, when the plated metal layer made of Ni is deposited on the surface of the pin 1 to a thickness of 1 to 10 μm, the pin 1 can be effectively prevented from being oxidatively corroded. Therefore, it is preferable to deposit a plated metal layer made of Ni to a thickness of 1 to 10 μm on the surface of the pin 1.

  In order to insert the pin 1 into the through hole 3a of the ceramic plate 3 and braze the pin 1, for example, as shown in FIG. 1, the through hole 3a larger than the diameter of the pin 1 is formed in the ceramic plate 3, A first metallized layer 3b made of Mo-Mn or the like is deposited around one opening of the through-hole 3a, and Ni is plated on the first metallized metal layer 3b. This is done by brazing the upper surface and the lower surface of the flange 1a of the pin 1 with a brazing material 2 such as Ag brazing and bonding them together.

  Here, in the pin 1, a groove 1 b having an inner surface continuous with the main surface of the flange portion 1 a is formed in the portion that is the base of the flange portion 1 a over the entire circumference. With this configuration, the brazing material 2 can easily flow into the groove 1b, and the brazing material 2 can be prevented from accumulating between the root of the flange portion 1a and the peripheral portion of the through hole 3a of the first metallized layer 3b. Therefore, it becomes difficult for the stress due to the difference in thermal expansion between the brazing material 2 and the ceramic plate 3 to act on the periphery of the through hole 3a, and it is possible to effectively prevent the ceramic plate 3 from cracking.

  Further, even if the diameter of the pin 1 is large, the stress due to the difference in thermal expansion from the pin 1 does not act on the peripheral portion of the through hole 3a of the ceramic plate 3 effectively, and the ceramic plate 3 is effectively damaged. Can be prevented.

  Therefore, breakage of the ceramic plate 3 can be effectively prevented, and the main surfaces of the ceramic plate 3, that is, between the external atmosphere side and the internal atmosphere side of the electric device can be surely hermetically sealed, and functions well as an airtight terminal. It will be possible.

  When the diameter of the pin 1 is d, preferably the vertical width of the groove 1b is about 0.1 mm to d / 2, and the depth of the groove 1b is about 0.05 mm to d / 4. With this configuration, it is possible to effectively prevent the brazing material 2 from accumulating between the root of the flange portion 1a and the peripheral portion of the through hole 3a of the first metallized layer 3b. If the width of the groove 1b is less than 0.1 mm and the depth of the groove 1b is less than 0.05 mm, the groove 1b becomes too small, and the gap between the root of the flange 1a and the peripheral edge of the through hole 3a of the first metallized layer 3b. The brazing material 2 collected in the groove cannot be released into the groove 1b. Further, if the width of the groove 1b increases beyond d / 2 and the depth of the groove 1b increases beyond d / 4, the size of the groove 1b becomes too large and the pin 1 is likely to be damaged. Further, since the diameter of the pin 1 is reduced by the groove 1b and the electric resistance is increased, if the groove 1b is too large, a large resistance loss occurs when the electric signal transmitted through the pin 1 passes through the groove 1b portion. It is inconvenient.

  Further, the cross-sectional shape of the groove 1b may be various shapes such as an elliptical shape, a square shape, and a triangular shape in addition to the semicircular shape shown in FIG. Preferably, the shape has a curved shape such as a semicircular shape. With this configuration, the brazing material 2 accumulated between the root of the flange 1a and the peripheral portion of the through hole 3a of the first metallized layer 3b is grooved. 1b can be easily released, and the brazing material 2 is effectively prevented from accumulating between the base of the flange 1a and the peripheral edge of the through hole 3a of the metallized layer 3b, and the ceramic plate 3 is effectively prevented from being damaged. can do.

  Preferably, as shown in FIG. 2, the first metallized layer 3b may be configured such that the first metallized layer 3b is provided over the inner surface of the through hole 3a. With this configuration, the brazing material 2 accumulated between the base of the flange 1a and the peripheral portion of the through hole 3a of the metallized layer 3b is guided to the notch 1b, and the brazing material 2 is guided to the base of the flange 1a and the through hole 3a. It is possible to reliably prevent the water from accumulating between the peripheral edge of the two.

  Further, a meniscus of the brazing material 2 is also formed between the first metallized layer 3b on the inner surface of the through hole 3a and the flange portion 1a. As a result, the pin 1 is in two directions with the ceramic plate 3 in two directions. Even if the pins 1 are subjected to external forces in various directions, they are difficult to be detached from the ceramic plate 3.

  In this case, the vertical length of the first metallized layer 3b provided on the inner surface of the through hole 3a is preferably 0.1 mm or more and less than the width of the groove 1b. With this configuration, it is possible to reliably prevent the brazing material 2 from accumulating between the base of the flange portion 1a and the peripheral portion of the through hole 3a of the metallized layer 3b, and to reliably prevent the ceramic plate 3 from being damaged. Will be able to. If the length in the vertical direction of the metallized layer 3b provided at the upper part of the inner surface of the through hole 3a is less than 0.1 mm, the length of the metallized layer 3b is too short, so the root of the flange 1a and the through hole 3a of the first metallized layer 3b The brazing material 2 accumulated between the peripheral edge portions cannot be guided to the groove 1b. If the width of the groove 1b exceeds the width, the outer periphery of the pin 1 below the groove 1b and the ceramic plate 3 are brazed and joined via the first metallized layer 3b. The stress due to the thermal expansion difference in the vertical direction acts. As a result, generation of cracks in the ceramic plate 3 cannot be prevented.

The ceramic plate 3 is insulative made of, for example, Al ₂ O ₃ ceramics, and a through hole 3a is provided at the center thereof, and the pin 1 is inserted into the through hole 3a and brazed.

The ceramic plate 3 functions to hold the pin 1 while maintaining electrical insulation from the electric device. For example, when the ceramic plate 3 is made of Al ₂ O ₃ ceramics, silicon oxide (SiO ₂ ), magnesium oxide (MgO) and oxide A binder such as polyvinyl alcohol is added to and mixed with Al ₂ O ₃ ceramic raw material powder such as calcium (CaO), and this is filled into a press mold of a predetermined shape and pressed at a predetermined pressure to obtain a press-formed body. After that, this press-formed body is processed in the same manner as the method using a ceramic green sheet described later, and is fired at a temperature of about 1600 ° C.

Alternatively, an appropriate organic binder, solvent, etc. are added to and mixed with raw material powders such as Al ₂ O ₃ , SiO ₂ , MgO, CaO to form a slurry, and this slurry is then converted into a ceramic green sheet by a doctor blade method or a calender roll method. And cut to the required size. Next, an appropriate punching process is performed to form the through holes 3a and the like in the plurality of ceramic green sheets.

  The ceramic green sheets are printed with a metal paste mainly composed of a metal powder such as tungsten (W) to form a printed pattern to be a conductor layer such as the first metallized layer 3b and the second metallized layer 3c. The ceramic green sheets formed and then formed with these printed patterns are laminated and fired at a temperature of about 1600 ° C.

  In order to braze the ceramic plate 3 to an electric device, for example, a second metallized layer 3c made of Mo-Mn is deposited on the outer peripheral surface of the ceramic plate 3, and Ni plating is applied to the second metallized layer 3c. A method of brazing the plated second metallized layer 3c and the electric device through a brazing material such as Ag brazing is adopted.

  In addition, as shown in FIG. 3A, the ceramic plate 3 is attached to the electric device with a cylindrical metal sleeve 4 made of Fe—Ni—Co alloy or the like in advance on the second metallized metal layer 3c. The metal sleeve 4 and the electric device may be welded by brazing with a brazing material such as Ag brazing, and the second metallized layer 3c is the main surface of the ceramic plate 3 as shown in FIG. The main surface of the ceramic plate 3 and the electric device may be brazed and joined to each other.

  Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention. For example, chamfering such as a C surface may be applied to the opening or corner of the through hole 3 a of the ceramic plate 3. With this configuration, stress concentration at the opening of the through hole 3a of the ceramic plate 3 can be eliminated, and cracks in the ceramic plate 3 can be more effectively prevented.

It is sectional drawing which shows an example of embodiment of the airtight terminal of this invention. It is sectional drawing which shows the other example of embodiment of the airtight terminal of this invention. (A), (b) is sectional drawing which shows an example of the form of attachment to the electric apparatus of the airtight terminal of this invention. It is sectional drawing which shows the example of the conventional airtight terminal.

Explanation of symbols

1: Pin 1a: Eaves 1b: Notch 2: Brazing material 3: Ceramic plate 3a: Through hole 3b: First metallized layer 3c: Second metallized layer

Claims (1)

A cylindrical metal pin provided with a flange and a through hole for inserting the pin are formed so as to penetrate between both main surfaces, and a first metallization is formed around one opening of the through hole. A ceramic plate in which a layer is formed in an annular shape and a second metallized layer is formed on the outer peripheral portion to be brazed to the inner surface of the cylindrical metal member or the main surface of the annular metal member; An airtight terminal formed by brazing one main surface and the first metallized layer, wherein the pin is located on the inner surface of the through hole on the outer peripheral surface, and the one main surface of the flange portion An airtight terminal characterized in that a groove having an inner surface is formed over the entire circumference.

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