WO2020054703A1 - Hermetic terminal - Google Patents

Hermetic terminal Download PDF

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Publication number
WO2020054703A1
WO2020054703A1 PCT/JP2019/035503 JP2019035503W WO2020054703A1 WO 2020054703 A1 WO2020054703 A1 WO 2020054703A1 JP 2019035503 W JP2019035503 W JP 2019035503W WO 2020054703 A1 WO2020054703 A1 WO 2020054703A1
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WO
WIPO (PCT)
Prior art keywords
cylindrical body
ceramic substrate
flange
terminal according
alloy
Prior art date
Application number
PCT/JP2019/035503
Other languages
French (fr)
Japanese (ja)
Inventor
遥 大村
晃一 岩本
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to EP19861121.2A priority Critical patent/EP3852199B1/en
Priority to JP2020546024A priority patent/JP7037662B2/en
Publication of WO2020054703A1 publication Critical patent/WO2020054703A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/53Bases or cases for heavy duty; Bases or cases for high voltage with means for preventing corona or arcing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/73Means for mounting coupling parts to apparatus or structures, e.g. to a wall
    • H01R13/74Means for mounting coupling parts in openings of a panel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • H01R13/504Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together

Definitions

  • the present disclosure relates to a hermetic terminal.
  • a hermetic terminal used in vacuum equipment, nuclear power equipment, etc. has a contact pin 21, a heat-resistant insulator 22, and a pipe flange (cylinder) like an hermetic terminal 30 shown in FIG. 5 in order to obtain high leakage resistance.
  • 23 are required to be air-tightly joined to each other, and this joining is performed by brazing or the like, has a required mechanical strength, and is required to be sufficiently resistant to impact and high temperature.
  • alumina is used as the heat-resistant insulator 22, the surface is metallized, and the contact pin 21 and the pipe flange 23 are air-tightly joined thereto by brazing, and the contact pin 21 and the pipe flange 23 have a coefficient of thermal expansion with respect to alumina.
  • it is usually formed of an iron-nickel alloy or an iron-nickel-cobalt alloy.
  • Non-Patent Document 1 multi-pole terminals have been used as hermetic terminals for extracting signals from a liquid hydrogen tank of a rocket.
  • the hermetic terminal includes a plate-shaped ceramic substrate provided with a through hole for inserting a columnar conductive member in a thickness direction, a first cylindrical body surrounding the ceramic substrate, and a coaxial with the first cylindrical body.
  • the second cylindrical body is made of an austenitic stainless steel having a nickel content of 10.4% by mass or more.
  • FIG. 1A is a perspective view of a first cylindrical body side
  • FIG. 2B is a perspective view of a second cylindrical body side, illustrating an example of an airtight terminal of the present disclosure.
  • FIG. 1A is a view showing an example of a cross section of an airtight terminal of FIG. 1 along an axial direction of a first cylindrical body and a second cylindrical body
  • FIG. 1B is a side view of FIG.
  • (c) is a cross-sectional view showing an example in which the portion A shown in (a) is enlarged
  • (d) is a cross-sectional view showing another example in which the A portion shown in (a) is enlarged
  • (e) is a sectional view. It is sectional drawing which shows an example which expanded the B section shown to a).
  • FIG. 1A is a view showing another example of a cross section along the axial direction of a first cylindrical body and a second cylindrical body
  • FIG. 1B is a side view of FIG. (C) is a cross-sectional view showing an example in which the portion A shown in (a) is enlarged
  • (d) is a cross-sectional view showing another example in which the portion A shown in (a) is enlarged
  • FIG. 2 is a cross-sectional view showing an example in which a portion B shown in FIG. It is a perspective view showing an example of the conventional airtight terminal.
  • FIG. 1 shows an example of the hermetic terminal of the present disclosure, wherein (a) is a perspective view of the first cylindrical body, and (b) is a perspective view of the second cylindrical body.
  • FIG. 2A and 2B are views showing an example of a cross section along the axial direction of a first cylindrical body and a second cylindrical body
  • FIG. 2B is a side view of FIG.
  • C) is a cross-sectional view showing an example in which the portion A shown in (a) is enlarged.
  • D) is a cross-sectional view showing another example in which the portion A shown in (a) is enlarged.
  • e) is a cross-sectional view showing an example in which a portion B shown in (a) is enlarged.
  • the hermetic terminal 20 shown in FIGS. 1 and 2 includes a plate-shaped ceramic substrate 3 provided with a through hole 2 for inserting the columnar conductive member 1 in a thickness direction, and a first cylindrical body 4 surrounding the ceramic substrate 3. , A second cylinder 5 coaxially connected to the first cylinder 4.
  • the conductive member 1 includes a columnar base 1a inserted into the through-hole 2, and a flange 1b facing the ceramic substrate 3 in the axial direction of the columnar base 1a.
  • the conductive member 1 is made of a fernico-based alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Co-Cr alloy or an Fe-Cr-Al alloy, and the ceramic substrate 3 is made of aluminum oxide.
  • the conductive member 1 is supported on a ceramic substrate 3 having a metallized layer 10 formed on the surface thereof by a brazing material mainly composed of silver, such as BAg-8, BAg-8A, and BAg-8B. Have been.
  • the main component in the ceramics refers to 85% by mass or more of the total 100% by mass of the components constituting the ceramics
  • the main component in the brazing material refers to the total of 100% by mass of the components constituting the brazing material.
  • % Means a component of 60% by mass or more.
  • the ceramics may contain, as an oxide, at least one of silicon, calcium, and magnesium other than the main component, aluminum oxide.
  • the components constituting the ceramics are identified using an X-ray diffractometer (XRD), and then the content of elements is determined using an X-ray fluorescence analyzer (XRF) or an ICP emission spectrometer (ICP) to identify the components. What is necessary is just to convert into the content of the done component.
  • XRD X-ray diffractometer
  • XRF X-ray fluorescence analyzer
  • ICP ICP emission spectrometer
  • the content of the elements constituting the joining layer made of the brazing material may be determined using an X-ray fluorescence analyzer (XRF) or an ICP emission spectrometer (ICP).
  • XRF X-ray fluorescence analyzer
  • ICP ICP emission spectrometer
  • the first cylindrical body 4 includes a shaft 4a and a head 4b having an outer diameter larger than the outer diameter of the shaft 4a.
  • the second cylindrical body 5 includes a shaft portion 5a and a head portion 5b having an outer diameter larger than the outer diameter of the shaft portion 5a.
  • the hermetic terminal 20 is fixed to a low-temperature liquid storage container or the like (not shown) by inserting a plurality of through holes 6a for inserting the second cylindrical body 5 and fastening members such as bolts on the outer peripheral side thereof. And a plurality of through holes 6b.
  • the flange 6 is made of, for example, austenitic stainless steel.
  • the flange 6 surrounds the shaft 4a of the first cylinder 4 and the shaft 5a of the second cylinder 5, and separates the left and right environments with the flange 6 as a boundary. are doing.
  • the head 4b of the first cylinder 4 and the head 4b of the shaft 4a located on the left side of the ceramic substrate 3 are located on the right side of the ceramic substrate 3 in an environment exposed to the atmosphere.
  • the second cylinders 5 are used in an environment exposed to liquid hydrogen.
  • the shaft portion 4a of the first cylinder 4 located on the right side of the ceramic substrate 3 is configured by the second cylinder 5 so as not to be directly exposed to liquid hydrogen.
  • the first cylinder 4 is made of a fernico-based alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy, or an Fe-Co-Cr alloy.
  • the austenitic stainless steel has a nickel content of 10.4% by mass or more.
  • the first cylinder 4 is made of the above-mentioned alloy
  • the residual stress hardly accumulates on the ceramic substrate 3 even when heating and cooling are repeated, since the linear expansion coefficient of these alloys is small compared to the linear expansion coefficient of aluminum oxide. Therefore, cracks hardly occur in the ceramic substrate 3.
  • the second cylindrical body 5 is made of austenitic stainless steel having a nickel content of 10.4% by mass or more, embrittlement due to hydrogen hardly occurs, and thus the second cylindrical body 5 can be used for a long period of time.
  • the second cylinder 5 is made of, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L, or SUS317L.
  • first cylinder 4 and the second cylinder 5 shown in FIGS. 1 and 2 are both cylinders and the ceramic substrate 3 is a disk, but both the first cylinder 4 and the second cylinder 5 are square.
  • the cylindrical body and the ceramic substrate 3 may be square plates.
  • the end of the second cylinder 5 on the first cylinder 4 side is provided with a step surface 5c.
  • the end of the first cylinder 4 on the second cylinder 5 side has a step surface 4c.
  • a step is formed on at least one of the end of the second cylinder 5 on the first cylinder 4 side and the end of the first cylinder 4 on the second cylinder 5 side. It may have surfaces 4c and 5c.
  • the outer peripheral surface of the second cylindrical body 5 has the step surface 5c, but the inner peripheral surface of the second cylindrical body 5 may have the step surface.
  • the outer peripheral surface of the first cylindrical body 4 has a step surface 4c, but the inner peripheral surface of the first cylindrical body 4 may have a step surface.
  • FIG. 3 is a cross-sectional view showing another example in which the portion A of the hermetic terminal shown in FIG. 2 is enlarged.
  • the second cylindrical body 5 may include a coating layer 5 d containing nickel, copper, or a copper-nickel alloy as a main component at least on a joint with the first cylindrical body 4.
  • the first cylinder 4 and the second cylinder 5 can be firmly joined to each other by the joining layer 7 made of a brazing material, so that the reliability is improved.
  • the second cylindrical body 5 has not only a joint portion but also a surface exposed to liquid hydrogen, for example, nickel, copper, or a copper-nickel alloy as a main component on at least one of an inner peripheral surface, an outer peripheral surface, and an end surface.
  • a coating layer 5d may be provided.
  • the second cylindrical body 5 shown in FIG. 3 has a coating layer 5d on the inner peripheral surface, the outer peripheral surface, and the end surface.
  • the first cylindrical body 4 may include a coating layer 4d containing nickel, copper, or a copper-nickel alloy as a main component at least on a joint with the second cylindrical body 5.
  • the first cylindrical body 4 and the second cylindrical body 5 can be firmly joined by the brazing material, so that the reliability is improved.
  • the inner peripheral surface of the first cylindrical body 4 may be located outside the outer peripheral surface of the second cylindrical body 5.
  • the first cylinder 4 has a smaller linear expansion coefficient than the second cylinder 5, so that it is difficult for the gap to expand even if heating and cooling are repeated. Leakage to the outside via the internal space of the body 4 is reduced.
  • the outer peripheral surface corresponds to the step surface 5c.
  • a flange 6 that surrounds the second cylinder 5 and that is joined to the outer peripheral surface of the second cylinder 5 may be further provided.
  • the flange 6 includes a second concave portion 6 d on the side of the second cylindrical body 5, and has a U-shaped flange 8 having a cross section along the axial direction of the second cylindrical body 5. Is mounted in the second recess 6 d, and the second cylindrical body 5 and the flange 6 are joined via the flange 8.
  • the flange 8 may include a coating layer (not shown) containing nickel, copper, or a copper-nickel alloy as a main component at least on a joint with the second cylindrical body 5.
  • a coating layer (not shown) may be provided.
  • the main component in the coating layer in the present disclosure refers to a component of 88% by mass or more of a total of 100% by mass of the components constituting the coating layer, and may include phosphorus and the like other than the main component.
  • the total of the respective contents of copper and nickel is the content of the main component.
  • the components in the coating layer may be determined by X-ray fluorescence spectroscopy (XRF) or ICP emission spectroscopy (ICP) to determine the content of the elements.
  • XRF X-ray fluorescence spectroscopy
  • ICP ICP emission spectroscopy
  • the flange 8 and the second cylindrical body 5 are joined by a brazing material containing silver as a main component such as BAg-8, BAg-8A, and BAg-8B, and the flange 6 and the flange 8 are formed by TIG (Tungsten Inert Gas).
  • the members are welded by a welding method, and the welding is performed after the joining of the members with the brazing material is completed.
  • the flange 6 is provided with a first concave portion 6c on the first cylindrical member 4 side, and a joint between the ceramic substrate 3 and the first cylindrical member 4 is closer to the second cylindrical member 5 than the bottom surface 6c1 of the first concave portion 6c. 2A, the joint between the ceramic substrate 3 and the first cylindrical body 4 is located on the left side of the virtual plane where the bottom surface 6c1 of the first recess 6c is located.
  • the second cylindrical body 5 is preferably located on the right side of the drawing with respect to the virtual plane).
  • the joint between the ceramic substrate 3 and the first cylindrical body 4 is at this position, the heat generated by welding is less likely to be transmitted to the ceramic substrate 3, so that residual stress is less likely to be generated in the ceramic substrate 3, so that cracks are formed in the ceramic substrate 3. It hardly occurs in the substrate 3.
  • the first concave portion 6c is a counterbore for facilitating the mounting of the first cylindrical body 4.
  • ⁇ Flange 8 may be austenitic stainless steel having a nickel content of 10.4% by mass or more. When the flange portion 8 has such a configuration, embrittlement due to hydrogen is unlikely to occur, so that the flange portion 8 can be used for a long time.
  • the flange 8 is made of, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L or SUS317L.
  • the content of nickel in the second cylinder 5 and the flange 8 may be measured using an inductively coupled plasma (ICP) emission spectrometer or a fluorescent X-ray analyzer (XRF).
  • ICP inductively coupled plasma
  • XRF fluorescent X-ray analyzer
  • FIG. 4A and 4B show the hermetic terminal of FIG. 1, wherein FIG. 4A is a diagram showing another example of a cross section along the axial direction of the first cylinder and the second cylinder, and FIG. It is a side view, (c) is sectional drawing which shows an example which expanded A part shown to (a), and (d) is sectional drawing which shows another example which expanded A part shown to (a). And (e) is a cross-sectional view showing an example in which the portion B shown in (a) is enlarged.
  • a plurality of conductive members 1 are individually inserted into a plurality of through holes 2, and a ceramic substrate 3 is provided around the through hole 2 with a step recessed from at least one of main surfaces 3 b and 3 c.
  • a portion 9 (9a, 9b) may be provided.
  • the ceramic substrate 3 includes a stepped portion 9 which is recessed from both the main surfaces 3b and 3c around the through hole 2, and one of the stepped portions 9a further includes a metallized layer 10 on the stepped surface.
  • the step 9a on the side provided with the layer 10 may be deeper than the step 9b on the side not provided with the metallized layer 10.
  • the metallized layer 10 is for fixing the conductive member 1 to the ceramic substrate 3 by brazing, and has a thickness of, for example, 5 ⁇ m or more and 55 ⁇ m or less.
  • the step 9a on the side provided with the metallized layer 10 is deeper than the step 9b on the side not provided with the metallized layer 10, the creepage distance between the columnar bases 1a of the adjacent conductive members 1 can be increased. Even if the metallized layer 10 is made thicker, the occurrence of creeping discharge between the conductive members 1 can be suppressed.
  • the depth of the step portion 9a is a distance from the main surface to the step surface, and does not include the thickness of the metallized layer 10.
  • the depth of the step portion 9 a on the side provided with the metallized layer 10 may be 45% or less of the thickness of the ceramic substrate 3.
  • the thickness of the ceramic substrate 3 is the distance between the two main surfaces 3b and 3c of the ceramic substrate 3.
  • a plurality of conductive members 1 are individually inserted into a plurality of through holes 2, and a ceramic substrate 3 is provided around at least one main surface (see FIG. In the example shown in (1), a ridge 3a extending from the main surface 3c) may be provided.
  • a ridge 3a extending from the main surface 3c
  • the ceramic substrate 3 has a plurality of open pores on the stepped surface provided with the metallized layer 10 or the tip end face of the convex portion 3a, and the value obtained by subtracting the average value of the circle equivalent diameter of the open pores from the distance between the centers of gravity of the open pores is It may be 20 ⁇ m or more and 50 ⁇ m or less.
  • the open pores become difficult to communicate with each other even in an environment where heating and cooling are repeated.
  • the mechanical strength can be maintained, and the metallized layer 10 is less likely to crack.
  • the value obtained by subtracting the average value of the circle-equivalent diameter of the open pores from the distance between the centers of gravity of the open pores is 50 ⁇ m or less, the density of the open pores increases, so the anchoring effect of the metallized layer 10 on the ceramic substrate 3. And the adhesion strength of the metallized layer 10 increases.
  • the mechanical strength of the ceramic substrate 3 is maintained, the cracks in the metallized layer 10 are suppressed, and the metallized layer 10 is suppressed. Can be improved in adhesion strength.
  • the step surface of the ceramic substrate 3 or the tip end surface of the protruding ridge portion 3a is polished with diamond abrasive to have a mirror surface.
  • the arithmetic average roughness Ra of the mirror surface is set to 0.2 ⁇ m or less using a measuring method based on JIS B 0601: 2013.
  • a portion where the size and distribution of the open pores are averagely observed is selected from the mirror surface, and the magnification is set to 200 times using an optical microscope to measure a range having an area of, for example, 1.5 ⁇ 10 5 ⁇ m 2. Area.
  • the distance between the centers of gravity of the open pores in the present disclosure is a linear distance connecting the centers of gravity of the open pores.
  • the threshold may be set so that the appearing marker matches the shape of the open pore.
  • the threshold value is, for example, 155.
  • the ceramic substrate can be obtained by the following manufacturing method.
  • an aluminum oxide powder as a main component magnesium hydroxide, silicon oxide, calcium carbonate and zirconium oxide powder, a dispersant for dispersing the aluminum oxide powder as needed, and an organic binder, a ball mill,
  • a slurry is obtained by wet mixing with a bead mill or a vibration mill.
  • the average particle diameter (D 50 ) of the aluminum oxide powder is 3 ⁇ m or less, preferably 1 ⁇ m or less, and the content of magnesium hydroxide powder in the total 100% by mass of the powder is 0.87% to 1.07%.
  • the content of silicon oxide powder is 6.1% by mass to 7.5% by mass
  • the content of calcium carbonate powder is 2.5% by mass to 3.1% by mass
  • the content of zirconium oxide is 1.% by mass. 0 mass% to 1.3 mass%.
  • the wet mixing time is, for example, 40 to 50 hours.
  • the organic binder is, for example, paraffin wax, wax emulsion (wax + emulsifier), PVA (polyvinyl alcohol), PEG (polyethylene glycol), PEO (polyethylene oxide) and the like.
  • the granules are formed by a powder press molding method or a cold isostatic pressing method to obtain a disk-shaped molded body. . ⁇ Circle around (2) ⁇ Then, a through-hole and a step or a ridge are formed by cutting, and the formed body having the through-hole or the like is fired at a temperature of 1550 ° C. or more and 1750 ° C. or less to obtain a ceramic substrate.
  • a plurality of open pores are provided on the tip surface of the stepped surface or the ridge portion provided with the metallized layer, and a value obtained by subtracting the average value of the circle equivalent diameter of the open pores from the distance between the centers of gravity of the open pores is not less than 20 ⁇ m and not more than 50 ⁇ m.
  • a compact may be produced using a cold isostatic pressing method at a molding pressure of 98 MPa to 147 MPa, and fired at a temperature of 1580 ° C. to 1750 ° C.
  • a junction between the conductive member and the ceramic substrate, a junction between the first cylinder and the second cylinder, a junction between the first cylinder and the ceramic substrate, a junction between the second cylinder and the first cylinder, and A coating layer containing nickel, copper, or a copper-nickel alloy as a main component may be previously formed on at least one of the joints of the ceramic substrate with the first cylinder by a plating method.
  • the above-described coating layer may be formed on the entire surface of the conductive member, the first cylindrical body, and the second cylindrical body.
  • the coating layer may be formed on the step surface.
  • At least one of the joint portion of the ceramic substrate with the conductive member and the joint portion of the ceramic substrate with the first cylindrical body is formed by forming a metallized layer in advance by a Mo—Mn method, and then plating nickel or copper by a plating method.
  • a coating layer mainly containing a copper-nickel alloy may be formed.
  • the coating layer may be formed on the entire outer peripheral surface of the ceramic substrate.
  • a brazing material containing silver as a main component such as BAg-8, BAg-8A, or BAg-8B is applied to each of the opposing joints, and heat treatment is performed at an appropriate temperature.
  • the disclosed hermetic terminal can be obtained.
  • the appropriate temperature is a brazing temperature described in JIS Z 3281: 1998.
  • a first cylindrical body, a ceramic substrate in which a conductive member is inserted into a through hole, and a second cylindrical body in which a flange is mounted are prepared.
  • a flange is attached to the outer peripheral side of the flange, and is welded and fixed by a TIG (Tungsten Inert Gas) welding method to obtain an airtight terminal of the present disclosure. be able to.
  • TIG Torsten Inert Gas
  • the hermetic terminal of the present disclosure obtained by the above-described manufacturing method has high brittleness to hydrogen and can be used for a long time.
  • the second cylindrical body 5 is joined to the flange 6 via the flange 8
  • the second cylindrical body 5 may be directly joined to the flange 6.
  • the flange 8 has a U-shaped cross section.
  • the flange 8 may have another shape such as an L-shaped cross section.
  • the bent portion may be curved.
  • the example in which the flange portion 8 is joined to the second concave portion 6d of the flange 6 has been described.
  • the flange 6 does not have the second concave portion 6d, and the inner peripheral surface of the flange 6 or the second concave portion 6d.
  • the flange 8 may be joined to the main surface on the side of the two cylinders 5.

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Abstract

This hermetic terminal includes a plate-like ceramic substrate that has, in the thickness direction, a through hole for inserting a columnar conducting member, a first tube body that encloses the ceramic substrate, and a second tube body that is coupled coaxially to the first tube body. The first tube body comprises a fernico alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy, or an Fe-Co-Cr alloy. The second tube body comprises austenitic stainless steel which has a nickel content of 10.4 mass% or more.

Description

気密端子Airtight terminal
 本開示は、気密端子に関する。 The present disclosure relates to a hermetic terminal.
 従来、真空機器、原子力機器等で用いられる気密端子は、高い耐漏洩性を得るために、図5に示す気密端子30のように、コンタクトピン21、耐熱絶縁体22およびパイプフランジ(筒体)23が互いに気密に接合されていること、またこの接合は、ろう付け等により行なわれ、必要な機械的強度を有し、衝撃および高温に十分耐え得ることが求められている。このため、耐熱絶縁体22としてアルミナを用い、その表面をメタライズしてこれにコンタクトピン21及びパイプフランジ23をろう付けにより気密に接合し、このコンタクトピン21とパイプフランジ23はアルミナに対する熱膨張係数の差を少なくするため、通常、鉄ニッケル合金または鉄ニッケルコバルト合金により形成されている。 Conventionally, a hermetic terminal used in vacuum equipment, nuclear power equipment, etc. has a contact pin 21, a heat-resistant insulator 22, and a pipe flange (cylinder) like an hermetic terminal 30 shown in FIG. 5 in order to obtain high leakage resistance. 23 are required to be air-tightly joined to each other, and this joining is performed by brazing or the like, has a required mechanical strength, and is required to be sufficiently resistant to impact and high temperature. For this reason, alumina is used as the heat-resistant insulator 22, the surface is metallized, and the contact pin 21 and the pipe flange 23 are air-tightly joined thereto by brazing, and the contact pin 21 and the pipe flange 23 have a coefficient of thermal expansion with respect to alumina. In order to reduce the difference between the two, it is usually formed of an iron-nickel alloy or an iron-nickel-cobalt alloy.
 また、昨今、非特許文献1で示されるように、ロケットの液体水素タンクの信号取出しに気密端子として多極端子が使われるようになっている。 In recent years, as shown in Non-Patent Document 1, multi-pole terminals have been used as hermetic terminals for extracting signals from a liquid hydrogen tank of a rocket.
特許第2519642号公報Japanese Patent No. 2519642
 本開示の気密端子は、柱状の導通部材を挿入するための貫通孔を厚み方向に備えた板状のセラミック基板と、該セラミック基板を囲繞する第1筒体と、該第1筒体と同軸上に連結されてなる第2筒体とを備え、前記第1筒体はフェルニコ系合金、Fe-Ni合金、Fe-Ni-Cr-Ti-Al合金、Fe-Cr-Al合金またはFe-Co-Cr合金からなり、前記第2筒体は、ニッケルの含有量が10.4質量%以上であるオーステナイト系ステンレス鋼からなる。 The hermetic terminal according to the present disclosure includes a plate-shaped ceramic substrate provided with a through hole for inserting a columnar conductive member in a thickness direction, a first cylindrical body surrounding the ceramic substrate, and a coaxial with the first cylindrical body. A second cylinder connected to the first cylinder, wherein the first cylinder is a fernico-based alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy, or an Fe-Co alloy. The second cylindrical body is made of an austenitic stainless steel having a nickel content of 10.4% by mass or more.
本開示の気密端子の一例を示す、(a)は第1筒体側の斜視図であり、(b)は第2筒体側の斜視図である。1A is a perspective view of a first cylindrical body side, and FIG. 2B is a perspective view of a second cylindrical body side, illustrating an example of an airtight terminal of the present disclosure. 図1の気密端子を示す、(a)は第1筒体および第2筒体の軸方向に沿った断面の一例を示す図であり、(b)は(a)の側面図であり、(c)は(a)に示すA部を拡大した一例を示す断面図であり、(d)は(a)に示すA部を拡大した他の例を示す断面図であり、(e)は(a)に示すB部を拡大した一例を示す断面図である。FIG. 1A is a view showing an example of a cross section of an airtight terminal of FIG. 1 along an axial direction of a first cylindrical body and a second cylindrical body, and FIG. 1B is a side view of FIG. (c) is a cross-sectional view showing an example in which the portion A shown in (a) is enlarged, (d) is a cross-sectional view showing another example in which the A portion shown in (a) is enlarged, and (e) is a sectional view. It is sectional drawing which shows an example which expanded the B section shown to a). 図2に示す気密端子のA部を拡大した他の例を示す断面図である。It is sectional drawing which shows the other example which expanded the A section of the airtight terminal shown in FIG. 図1の気密端子を示す、(a)は第1筒体および第2筒体の軸方向に沿った断面の他の例を示す図であり、(b)は(a)の側面図であり、(c)は(a)に示すA部を拡大した一例を示す断面図であり、(d)は(a)に示すA部を拡大した他の例を示す断面図であり、(e)は(a)に示すB部を拡大した一例を示す断面図である。FIG. 1A is a view showing another example of a cross section along the axial direction of a first cylindrical body and a second cylindrical body, and FIG. 1B is a side view of FIG. (C) is a cross-sectional view showing an example in which the portion A shown in (a) is enlarged, (d) is a cross-sectional view showing another example in which the portion A shown in (a) is enlarged, and (e). FIG. 2 is a cross-sectional view showing an example in which a portion B shown in FIG. 従来の気密端子の一例を示す斜視図である。It is a perspective view showing an example of the conventional airtight terminal.
 以下、図面を参照して、本発明の実施形態について詳細に説明する。ただし、本明細書の全図において、混同を生じない限り、同一部分には同一符号を付し、その説明を適時省略する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, in all the drawings of the present specification, the same parts are denoted by the same reference numerals and the description thereof will be appropriately omitted unless confusion occurs.
 図1は、本開示の気密端子の一例を示す、(a)は第1筒体側の斜視図であり、(b)は第2筒体側の斜視図である。 1 shows an example of the hermetic terminal of the present disclosure, wherein (a) is a perspective view of the first cylindrical body, and (b) is a perspective view of the second cylindrical body.
 図2は、図1の気密端子を示す、(a)は第1筒体および第2筒体の軸方向に沿った断面の一例を示す図であり、(b)は(a)の側面図であり、(c)は(a)に示すA部を拡大した一例を示す断面図であり、(d)は(a)に示すA部を拡大した他の例を示す断面図であり、(e)は(a)に示すB部を拡大した一例を示す断面図である。 2A and 2B are views showing an example of a cross section along the axial direction of a first cylindrical body and a second cylindrical body, and FIG. 2B is a side view of FIG. (C) is a cross-sectional view showing an example in which the portion A shown in (a) is enlarged. (D) is a cross-sectional view showing another example in which the portion A shown in (a) is enlarged. (e) is a cross-sectional view showing an example in which a portion B shown in (a) is enlarged.
 図1,2に示す気密端子20は、柱状の導通部材1を挿入するための貫通孔2を厚み方向に備えた板状のセラミック基板3と、セラミック基板3を囲繞する第1筒体4と、第1筒体4と同軸上に連結されてなる第2筒体5とを備えている。 The hermetic terminal 20 shown in FIGS. 1 and 2 includes a plate-shaped ceramic substrate 3 provided with a through hole 2 for inserting the columnar conductive member 1 in a thickness direction, and a first cylindrical body 4 surrounding the ceramic substrate 3. , A second cylinder 5 coaxially connected to the first cylinder 4.
 導通部材1は、貫通孔2に挿入される柱状基部1aと、柱状基部1aの軸方向の途中にセラミック基板3に対向する鍔部1bを備えている。また、導通部材1は、フェルニコ系合金、Fe-Ni合金、Fe-Ni-Cr-Ti-Al合金、Fe-Co-Cr合金またはFe-Cr-Al合金からなり、セラミック基板3は、酸化アルミニウムを主成分とするセラミックスからなり、導通部材1はBAg-8、BAg-8A、BAg-8B等の銀を主成分とするろう材によって、表面にメタライズ層10が形成されたセラミック基板3に支持されている。 The conductive member 1 includes a columnar base 1a inserted into the through-hole 2, and a flange 1b facing the ceramic substrate 3 in the axial direction of the columnar base 1a. The conductive member 1 is made of a fernico-based alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Co-Cr alloy or an Fe-Cr-Al alloy, and the ceramic substrate 3 is made of aluminum oxide. The conductive member 1 is supported on a ceramic substrate 3 having a metallized layer 10 formed on the surface thereof by a brazing material mainly composed of silver, such as BAg-8, BAg-8A, and BAg-8B. Have been.
 ここで、セラミックスにおける主成分とは、セラミックスを構成する成分の合計100質量%のうち、85質量%以上の成分をいい、ろう材における主成分とは、ろう材を構成する成分の合計100質量%のうち、60質量%以上の成分をいう。 Here, the main component in the ceramics refers to 85% by mass or more of the total 100% by mass of the components constituting the ceramics, and the main component in the brazing material refers to the total of 100% by mass of the components constituting the brazing material. % Means a component of 60% by mass or more.
 セラミックスは、主成分である酸化アルミニウム以外、珪素、カルシウムおよびマグネシウムの少なくともいずれかを酸化物として含んでいてもよい。 The ceramics may contain, as an oxide, at least one of silicon, calcium, and magnesium other than the main component, aluminum oxide.
 セラミックスを構成する成分は、X線回折装置(XRD)を用いて同定した後、蛍光X線分析装置(XRF)またはICP発光分光分析装置(ICP)を用いて、元素の含有量を求め、同定された成分の含有量に換算すればよい。 The components constituting the ceramics are identified using an X-ray diffractometer (XRD), and then the content of elements is determined using an X-ray fluorescence analyzer (XRF) or an ICP emission spectrometer (ICP) to identify the components. What is necessary is just to convert into the content of the done component.
 ろう材を構成する成分は、蛍光X線分析装置(XRF)またはICP発光分光分析装置(ICP)を用いて、ろう材からなる接合層を構成する元素の含有量を求めればよい。 For the components constituting the brazing material, the content of the elements constituting the joining layer made of the brazing material may be determined using an X-ray fluorescence analyzer (XRF) or an ICP emission spectrometer (ICP).
 第1筒体4は、軸部4aと、軸部4aの外径よりも大きい外径を有する頭部4bとからなる。同様に、第2筒体5は、軸部5aと、軸部5aの外径よりも大きい外径を有する頭部5bとからなる。 The first cylindrical body 4 includes a shaft 4a and a head 4b having an outer diameter larger than the outer diameter of the shaft 4a. Similarly, the second cylindrical body 5 includes a shaft portion 5a and a head portion 5b having an outer diameter larger than the outer diameter of the shaft portion 5a.
 また、気密端子20は、第2筒体5を挿入するための複数の貫通孔6aと、その外周側にボルト等の締結部材を挿入して低温液体用の貯蔵容器等(図示しない)に固定するための複数の貫通孔6bと、を有するフランジ6を備えている。フランジ6は、例えば、オーステナイト系ステンレス鋼からなる。 The hermetic terminal 20 is fixed to a low-temperature liquid storage container or the like (not shown) by inserting a plurality of through holes 6a for inserting the second cylindrical body 5 and fastening members such as bolts on the outer peripheral side thereof. And a plurality of through holes 6b. The flange 6 is made of, for example, austenitic stainless steel.
 このフランジ6は、図2(a)に示す通り、第1筒体4の軸部4aおよび第2筒体5の軸部5aを囲繞しており、フランジ6を境界として左右の異なる環境を分離している。 As shown in FIG. 2A, the flange 6 surrounds the shaft 4a of the first cylinder 4 and the shaft 5a of the second cylinder 5, and separates the left and right environments with the flange 6 as a boundary. are doing.
 図2(a)において、セラミック基板3より左側に位置する第1筒体4の頭部4bおよび軸部4aの頭部4b側は、大気に曝される環境で、セラミック基板3より右側に位置する第2筒体5は、液体水素に曝される環境でそれぞれ用いられる。セラミック基板3より右側に位置する第1筒体4の軸部4aは、第2筒体5によって、直接、液体水素に曝されることのないように構成されている。 In FIG. 2A, the head 4b of the first cylinder 4 and the head 4b of the shaft 4a located on the left side of the ceramic substrate 3 are located on the right side of the ceramic substrate 3 in an environment exposed to the atmosphere. The second cylinders 5 are used in an environment exposed to liquid hydrogen. The shaft portion 4a of the first cylinder 4 located on the right side of the ceramic substrate 3 is configured by the second cylinder 5 so as not to be directly exposed to liquid hydrogen.
 第1筒体4は、フェルニコ系合金、Fe-Ni合金、Fe-Ni-Cr-Ti-Al合金、Fe-Cr-Al合金またはFe-Co-Cr合金からなり、第2筒体5は、ニッケルの含有量が10.4質量%以上であるオーステナイト系ステンレス鋼からなる。 The first cylinder 4 is made of a fernico-based alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy, or an Fe-Co-Cr alloy. The austenitic stainless steel has a nickel content of 10.4% by mass or more.
 第1筒体4が上記合金からなると、加熱および冷却を繰り返してもこれらの合金の線膨張係数は、酸化アルミニウムの線膨張係数との差が小さいので、残留応力がセラミック基板3に蓄積しにくくなるため、クラックがセラミック基板3内に生じにくくなる。また、第2筒体5は、ニッケルの含有量が10.4質量%以上であるオーステナイト系ステンレス鋼からなると、水素による脆化が生じにくくなるので、長期間に亘って用いることができる。 When the first cylinder 4 is made of the above-mentioned alloy, the residual stress hardly accumulates on the ceramic substrate 3 even when heating and cooling are repeated, since the linear expansion coefficient of these alloys is small compared to the linear expansion coefficient of aluminum oxide. Therefore, cracks hardly occur in the ceramic substrate 3. Further, when the second cylindrical body 5 is made of austenitic stainless steel having a nickel content of 10.4% by mass or more, embrittlement due to hydrogen hardly occurs, and thus the second cylindrical body 5 can be used for a long period of time.
 第2筒体5は、例えば、SUS310S、SUS316L、SUS316LN、SUS316J1LまたはSUS317Lからなる。 The second cylinder 5 is made of, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L, or SUS317L.
 なお、図1,2に示す第1筒体4および第2筒体5はいずれも円筒体、セラミック基板3は円板であるが、第1筒体4および第2筒体5はいずれも角筒体、セラミック基板3は角板であってもよい。 Note that the first cylinder 4 and the second cylinder 5 shown in FIGS. 1 and 2 are both cylinders and the ceramic substrate 3 is a disk, but both the first cylinder 4 and the second cylinder 5 are square. The cylindrical body and the ceramic substrate 3 may be square plates.
 図2(c)に示すように、第2筒体5の第1筒体4側の端部は段差面5cを備えている。 端 As shown in FIG. 2C, the end of the second cylinder 5 on the first cylinder 4 side is provided with a step surface 5c.
 また、図2(d)に示すように、第1筒体4の第2筒体5側の端部は段差面4cを備えている。 As shown in FIG. 2D, the end of the first cylinder 4 on the second cylinder 5 side has a step surface 4c.
 図2(c)、(d)に示すように、第2筒体5の第1筒体4側の端部および第1筒体4の第2筒体5側の端部の少なくとも一方に段差面4c、5cを有していてもよい。なお、図2(c)では第2筒体5の外周面に段差面5cを有しているが、第2筒体5の内周面に段差面を有していてもよい。また、図2(d)では第1筒体4の外周面に段差面4cを有しているが、第1筒体4の内周面に段差面を有していてもよい。 As shown in FIGS. 2C and 2D, a step is formed on at least one of the end of the second cylinder 5 on the first cylinder 4 side and the end of the first cylinder 4 on the second cylinder 5 side. It may have surfaces 4c and 5c. In FIG. 2C, the outer peripheral surface of the second cylindrical body 5 has the step surface 5c, but the inner peripheral surface of the second cylindrical body 5 may have the step surface. In FIG. 2D, the outer peripheral surface of the first cylindrical body 4 has a step surface 4c, but the inner peripheral surface of the first cylindrical body 4 may have a step surface.
 このような構成であると、高圧がかかることによって揮発した水素が、第1筒体4および第2筒体5の隙間を通りにくくなるため、第1筒体4の内部空間を介して外部に漏洩しにくくなる。 With such a configuration, it is difficult for hydrogen volatilized by applying a high pressure to pass through the gap between the first cylindrical body 4 and the second cylindrical body 5, so that the hydrogen is discharged to the outside via the internal space of the first cylindrical body 4. It is less likely to leak.
 図3は、図2に示す気密端子のA部を拡大した他の例を示す断面図である。 FIG. 3 is a cross-sectional view showing another example in which the portion A of the hermetic terminal shown in FIG. 2 is enlarged.
 図3に示すように、第2筒体5は、少なくとも第1筒体4との接合部上にニッケル、銅または銅ニッケル合金を主成分とする被覆層5dを備えていてもよい。 As shown in FIG. 3, the second cylindrical body 5 may include a coating layer 5 d containing nickel, copper, or a copper-nickel alloy as a main component at least on a joint with the first cylindrical body 4.
 このような構成であると、第1筒体4および第2筒体5とはろう材からなる接合層7によって強固に接合することができるので、信頼性が向上する。 With such a configuration, the first cylinder 4 and the second cylinder 5 can be firmly joined to each other by the joining layer 7 made of a brazing material, so that the reliability is improved.
 なお、第2筒体5は、接合部だけではなく、液体水素に曝される表面、例えば、内周面、外周面および端面の少なくともいずれかにニッケル、銅または銅ニッケル合金を主成分とする被覆層5dを備えていてもよい。 In addition, the second cylindrical body 5 has not only a joint portion but also a surface exposed to liquid hydrogen, for example, nickel, copper, or a copper-nickel alloy as a main component on at least one of an inner peripheral surface, an outer peripheral surface, and an end surface. A coating layer 5d may be provided.
 このような構成であると、第2筒体5を構成するオーステナイト系ステンレス鋼の水素による脆化を遅らせることができるので、さらに長期間に亘って用いることができる。 構成 With such a configuration, the embrittlement of the austenitic stainless steel constituting the second cylindrical body 5 due to hydrogen can be delayed, so that it can be used for a longer period of time.
 図3に示す第2筒体5は、内周面、外周面および端面に被覆層5dを備えている。 2The second cylindrical body 5 shown in FIG. 3 has a coating layer 5d on the inner peripheral surface, the outer peripheral surface, and the end surface.
 また、第1筒体4は、少なくとも第2筒体5との接合部上にニッケル、銅または銅ニッケル合金を主成分とする被覆層4dを備えていてもよい。 The first cylindrical body 4 may include a coating layer 4d containing nickel, copper, or a copper-nickel alloy as a main component at least on a joint with the second cylindrical body 5.
 このような構成であると、第1筒体4および第2筒体5とはろう材によって強固に接合することができるので、信頼性が向上する。 With such a configuration, the first cylindrical body 4 and the second cylindrical body 5 can be firmly joined by the brazing material, so that the reliability is improved.
 また、図3に示すように、第1筒体4の内周面は、第2筒体5の外周面よりも外側に位置していてもよい。 As shown in FIG. 3, the inner peripheral surface of the first cylindrical body 4 may be located outside the outer peripheral surface of the second cylindrical body 5.
 このような構成であると、第1筒体4は、第2筒体5よりも線膨張係数が小さいため、加熱および冷却を繰り返しても隙間が拡がりにくくなるので、揮発した水素は第1筒体4の内部空間を介して外部に漏洩しにくくなる。 With such a configuration, the first cylinder 4 has a smaller linear expansion coefficient than the second cylinder 5, so that it is difficult for the gap to expand even if heating and cooling are repeated. Leakage to the outside via the internal space of the body 4 is reduced.
 なお、図3(a)に示すように、第2筒体5の第1筒体4側の端部に段差面5cを有している場合、外周面は段差面5cに相当する。 As shown in FIG. 3A, when the second cylinder 5 has a step surface 5c at the end on the first cylinder 4 side, the outer peripheral surface corresponds to the step surface 5c.
 また、図1、2に示すように、第2筒体5の外周面に接合された、第2筒体5を囲繞するフランジ6をさらに具備していてもよい。 Furthermore, as shown in FIGS. 1 and 2, a flange 6 that surrounds the second cylinder 5 and that is joined to the outer peripheral surface of the second cylinder 5 may be further provided.
 このような構成であると、第2筒体5の外周側で、フランジ6を境界として異なる環境を分離することができる。 With such a configuration, different environments can be separated on the outer peripheral side of the second cylindrical body 5 with the flange 6 as a boundary.
 そして、図2に示すように、フランジ6は、第2筒体5側に第2凹部6dを備えてなり、第2筒体5の軸方向に沿った断面がコの字状の鍔部8が第2凹部6dに装着され、第2筒体5およびフランジ6は、鍔部8を介して接合されている。 As shown in FIG. 2, the flange 6 includes a second concave portion 6 d on the side of the second cylindrical body 5, and has a U-shaped flange 8 having a cross section along the axial direction of the second cylindrical body 5. Is mounted in the second recess 6 d, and the second cylindrical body 5 and the flange 6 are joined via the flange 8.
 鍔部8は、少なくとも第2筒体5との接合部上にニッケル、銅または銅ニッケル合金を主成分とする被覆層(図示しない)を備えていてもよく、鍔部8の表面全体にこの被覆層(図示しない)を備えていてもよい。 The flange 8 may include a coating layer (not shown) containing nickel, copper, or a copper-nickel alloy as a main component at least on a joint with the second cylindrical body 5. A coating layer (not shown) may be provided.
 なお、本開示における被覆層における主成分とは、被覆層を構成する成分の合計100質量%のうち、88質量%以上の成分をいい、主成分以外、リン等を含んでいてもよい。銅ニッケル合金を主成分とする被覆層の場合、銅およびニッケルの各含有量の合計が主成分の含有量である。 主 成分 In addition, the main component in the coating layer in the present disclosure refers to a component of 88% by mass or more of a total of 100% by mass of the components constituting the coating layer, and may include phosphorus and the like other than the main component. In the case of a coating layer containing a copper-nickel alloy as a main component, the total of the respective contents of copper and nickel is the content of the main component.
 被覆層における成分は、蛍光X線分析装置(XRF)またはICP発光分光分析装置(ICP)を用いて、元素の含有量を求めればよい。 成分 The components in the coating layer may be determined by X-ray fluorescence spectroscopy (XRF) or ICP emission spectroscopy (ICP) to determine the content of the elements.
 鍔部8および第2筒体5は、BAg-8、BAg-8A、BAg-8B等の銀を主成分とするろう材によって接合され、フランジ6および鍔部8は、TIG(Tungsten Inert Gas)溶接法によって溶接され、この溶接は、各部材のろう材による接合が終了した後になされる。 The flange 8 and the second cylindrical body 5 are joined by a brazing material containing silver as a main component such as BAg-8, BAg-8A, and BAg-8B, and the flange 6 and the flange 8 are formed by TIG (Tungsten Inert Gas). The members are welded by a welding method, and the welding is performed after the joining of the members with the brazing material is completed.
 フランジ6は、第1筒体4側に第1凹部6cを備えてなり、セラミック基板3と第1筒体4との接合部は、第1凹部6cの底面6c1よりも第2筒体5から離れているとよい(すなわち、図2(a)において、セラミック基板3と第1筒体4との接合部が、第1凹部6cの底面6c1が位置する仮想平面よりも図の左側に位置し、第2筒体5が、上記仮想平面よりも図の右側に位置しているとよい)。 The flange 6 is provided with a first concave portion 6c on the first cylindrical member 4 side, and a joint between the ceramic substrate 3 and the first cylindrical member 4 is closer to the second cylindrical member 5 than the bottom surface 6c1 of the first concave portion 6c. 2A, the joint between the ceramic substrate 3 and the first cylindrical body 4 is located on the left side of the virtual plane where the bottom surface 6c1 of the first recess 6c is located. , The second cylindrical body 5 is preferably located on the right side of the drawing with respect to the virtual plane).
 セラミック基板3と第1筒体4との接合部が、この位置であると、溶接によって生じる熱がセラミック基板3に伝わりにくくなるので、セラミック基板3に残留応力が生じにくくなるため、クラックがセラミック基板3内に生じにくくなる。 If the joint between the ceramic substrate 3 and the first cylindrical body 4 is at this position, the heat generated by welding is less likely to be transmitted to the ceramic substrate 3, so that residual stress is less likely to be generated in the ceramic substrate 3, so that cracks are formed in the ceramic substrate 3. It hardly occurs in the substrate 3.
 ここで、第1凹部6cは、第1筒体4の装着を容易にするための座繰りである。 Here, the first concave portion 6c is a counterbore for facilitating the mounting of the first cylindrical body 4.
 また、鍔部8は、ニッケルの含有量が10.4質量%以上であるオーステナイト系ステンレス鋼であってもよい。鍔部8がこのような構成であると、水素による脆化が生じにくくなるので、長期間に亘って用いることができる。 鍔 Flange 8 may be austenitic stainless steel having a nickel content of 10.4% by mass or more. When the flange portion 8 has such a configuration, embrittlement due to hydrogen is unlikely to occur, so that the flange portion 8 can be used for a long time.
 鍔部8は、例えば、SUS310S、SUS316L、SUS316LN、SUS316J1LまたはSUS317Lからなる。 The flange 8 is made of, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L or SUS317L.
 なお、第2筒体5および鍔部8におけるニッケルの含有量は、ICP(Inductively Coupled Plasma)発光分光分析装置または蛍光X線分析装置(XRF)を用いて測定すればよい。 The content of nickel in the second cylinder 5 and the flange 8 may be measured using an inductively coupled plasma (ICP) emission spectrometer or a fluorescent X-ray analyzer (XRF).
 図4は、図1の気密端子を示す、(a)は第1筒体および第2筒体の軸方向に沿った断面の他の例を示す図であり、(b)は(a)の側面図であり、(c)は(a)に示すA部を拡大した一例を示す断面図であり、(d)は(a)に示すA部を拡大した他の例を示す断面図であり、(e)は(a)に示すB部を拡大した一例を示す断面図である。 4A and 4B show the hermetic terminal of FIG. 1, wherein FIG. 4A is a diagram showing another example of a cross section along the axial direction of the first cylinder and the second cylinder, and FIG. It is a side view, (c) is sectional drawing which shows an example which expanded A part shown to (a), and (d) is sectional drawing which shows another example which expanded A part shown to (a). And (e) is a cross-sectional view showing an example in which the portion B shown in (a) is enlarged.
 図4に示すように、複数の導通部材1が複数の貫通孔2に個別に挿入されてなり、セラミック基板3は、貫通孔2の周囲に少なくともいずれか一方の主面3b、3cから凹む段差部9(9a、9b)を備えていてもよい。 As shown in FIG. 4, a plurality of conductive members 1 are individually inserted into a plurality of through holes 2, and a ceramic substrate 3 is provided around the through hole 2 with a step recessed from at least one of main surfaces 3 b and 3 c. A portion 9 (9a, 9b) may be provided.
 このような構成であると、隣り合う導通部材1の柱状基部1a間の沿面距離が長くなるので、柱状基部1a間の沿面放電の発生を抑制することができる。 With such a configuration, the creepage distance between the columnar bases 1a of the adjacent conductive members 1 is increased, so that the generation of the creeping discharge between the columnar bases 1a can be suppressed.
 セラミック基板3は、貫通孔2の周囲に、両方の主面3b、3cからそれぞれ凹む段差部9を備え、段差部9aのいずれか一方は段差面上にさらにメタライズ層10を備えてなり、メタライズ層10を備えている側の段差部9aはメタライズ層10を備えていない側の段差部9bよりも深くてもよい。ここで、メタライズ層10は、導通部材1をろう付けによってセラミック基板3に固定するためのものであり、その厚みは、例えば、5μm以上55μm以下である。 The ceramic substrate 3 includes a stepped portion 9 which is recessed from both the main surfaces 3b and 3c around the through hole 2, and one of the stepped portions 9a further includes a metallized layer 10 on the stepped surface. The step 9a on the side provided with the layer 10 may be deeper than the step 9b on the side not provided with the metallized layer 10. Here, the metallized layer 10 is for fixing the conductive member 1 to the ceramic substrate 3 by brazing, and has a thickness of, for example, 5 μm or more and 55 μm or less.
 メタライズ層10を備えている側の段差部9aはメタライズ層10を備えていない側の段差部9bよりも深いと、隣り合う導通部材1の柱状基部1a間の沿面距離を長くすることができるので、メタライズ層10を厚くしても、導通部材1間の沿面放電の発生を抑制することができる。ここで、段差部9aの深さは主面から段差面までの距離であり、メタライズ層10の厚みは含めない。 If the step 9a on the side provided with the metallized layer 10 is deeper than the step 9b on the side not provided with the metallized layer 10, the creepage distance between the columnar bases 1a of the adjacent conductive members 1 can be increased. Even if the metallized layer 10 is made thicker, the occurrence of creeping discharge between the conductive members 1 can be suppressed. Here, the depth of the step portion 9a is a distance from the main surface to the step surface, and does not include the thickness of the metallized layer 10.
 メタライズ層10を備えている側の段差部9aの深さは、セラミック基板3の厚さの45%以下であってもよい。段差部9aの深さがこの範囲であると、貫通孔2の周囲におけるセラミック基板3の機械的強度を確保することができる。ここで、セラミック基板3の厚さとは、セラミック基板3の両主面3b、3c間の間隔である。 (4) The depth of the step portion 9 a on the side provided with the metallized layer 10 may be 45% or less of the thickness of the ceramic substrate 3. When the depth of the step portion 9a is within this range, the mechanical strength of the ceramic substrate 3 around the through hole 2 can be secured. Here, the thickness of the ceramic substrate 3 is the distance between the two main surfaces 3b and 3c of the ceramic substrate 3.
 また、図2に示すように、複数の導通部材1が複数の貫通孔2に個別に挿入されてなり、セラミック基板3は、貫通孔2の周囲に、少なくともいずれか一方の主面(図2に示す例では主面3c)から伸びる凸条部3aを備えていてもよい。このような構成であると、導通部材1に対向するメタライズ層10を長くすることができるので、セラミック基板3に対する導通部材1の接合の信頼性を高くすることができる。 As shown in FIG. 2, a plurality of conductive members 1 are individually inserted into a plurality of through holes 2, and a ceramic substrate 3 is provided around at least one main surface (see FIG. In the example shown in (1), a ridge 3a extending from the main surface 3c) may be provided. With such a configuration, the metallized layer 10 facing the conductive member 1 can be lengthened, so that the reliability of joining the conductive member 1 to the ceramic substrate 3 can be increased.
 また、セラミック基板3は、メタライズ層10を備える段差面または凸条部3aの先端面に開気孔を複数備え、開気孔の重心間距離から開気孔の円相当径の平均値を引いた値は20μm以上50μm以下であってもよい。 Further, the ceramic substrate 3 has a plurality of open pores on the stepped surface provided with the metallized layer 10 or the tip end face of the convex portion 3a, and the value obtained by subtracting the average value of the circle equivalent diameter of the open pores from the distance between the centers of gravity of the open pores is It may be 20 μm or more and 50 μm or less.
 開気孔の重心間距離から開気孔の円相当径の平均値を引いた値が20μm以上であると、加熱および冷却が繰り返されるような環境で用いられても、開気孔同士が連通しにくくなり、機械的強度を維持することができるとともに、メタライズ層10にも亀裂が生じにくくなる。また、開気孔の重心間距離から開気孔の円相当径の平均値を引いた値が50μm以下であると、開気孔が存在する密度が高くなるため、セラミック基板3に対するメタライズ層10のアンカー効果が向上し、メタライズ層10の密着強度が高くなる。 If the value obtained by subtracting the average value of the equivalent circle diameter of the open pores from the distance between the centers of gravity of the open pores is 20 μm or more, the open pores become difficult to communicate with each other even in an environment where heating and cooling are repeated. In addition, the mechanical strength can be maintained, and the metallized layer 10 is less likely to crack. Further, if the value obtained by subtracting the average value of the circle-equivalent diameter of the open pores from the distance between the centers of gravity of the open pores is 50 μm or less, the density of the open pores increases, so the anchoring effect of the metallized layer 10 on the ceramic substrate 3. And the adhesion strength of the metallized layer 10 increases.
 開気孔の重心間距離から開気孔の円相当径の平均値を引いた値が20μm以上50μm以下であると、セラミック基板3の機械的強度の維持、メタライズ層10における亀裂の抑制およびメタライズ層10の密着強度の向上を図ることができる。 When the value obtained by subtracting the average value of the equivalent circle diameter of the open pores from the distance between the centers of gravity of the open pores is 20 μm or more and 50 μm or less, the mechanical strength of the ceramic substrate 3 is maintained, the cracks in the metallized layer 10 are suppressed, and the metallized layer 10 is suppressed. Can be improved in adhesion strength.
 開気孔の重心間距離を求める場合、セラミック基板3の段差面または凸条部3aの先端面をダイヤモンド砥粒で研磨して鏡面とする。ここで、鏡面の算術平均粗さRaは、JIS B 0601:2013に準拠する測定方法を用いて、0.2μm以下とする。この鏡面から開気孔の大きさや分布が平均的に観察される部分を選択し、光学顕微鏡を用いて倍率を200倍として、面積が、例えば、1.5×105μm2である範囲を計測領域とする。 When obtaining the distance between the centers of gravity of the open pores, the step surface of the ceramic substrate 3 or the tip end surface of the protruding ridge portion 3a is polished with diamond abrasive to have a mirror surface. Here, the arithmetic average roughness Ra of the mirror surface is set to 0.2 μm or less using a measuring method based on JIS B 0601: 2013. A portion where the size and distribution of the open pores are averagely observed is selected from the mirror surface, and the magnification is set to 200 times using an optical microscope to measure a range having an area of, for example, 1.5 × 10 5 μm 2. Area.
 この計測領域を計測の対象として、画像解析ソフト「A像くん(Ver2.52)」(登録商標、旭化成エンジニアリング(株)製、以下、画像解析ソフトという。)の重心間距離法という手法を適用して、隣り合う開気孔の重心間距離を求めることができる。なお、本開示における開気孔の重心間距離とは、開気孔の重心同士を結ぶ直線距離である。 With this measurement area as a measurement target, a method called a distance between centers of gravity method of image analysis software “A image kun (Ver2.52)” (registered trademark, manufactured by Asahi Kasei Engineering Corporation, hereinafter referred to as image analysis software) is applied. Thus, the distance between the centers of gravity of the adjacent open pores can be obtained. The distance between the centers of gravity of the open pores in the present disclosure is a linear distance connecting the centers of gravity of the open pores.
 開気孔の円相当径の測定は、上記計測領域を対象として、画像解析ソフトの粒子解析という手法を適用する。 測定 For measuring the circle-equivalent diameter of the open pores, a method called particle analysis of image analysis software is applied to the above measurement area.
 なお、重心間距離法および粒子解析の設定条件としては、例えば、明度を暗、2値化の方法を手動、小図形除去面積を1μm2、雑音除去フィルタを有とした上で、画面上に現れるマーカーが開気孔の形状と一致するように、しきい値を設定すればよい。しきい値は、例えば、155である。 In addition, as the setting conditions of the distance between centers of gravity method and the particle analysis, for example, the brightness is dark, the binarization method is manual, the small figure removal area is 1 μm 2 , and the noise removal filter is provided. The threshold may be set so that the appearing marker matches the shape of the open pore. The threshold value is, for example, 155.
 次に、本開示の気密端子の製造方法の一例について説明する。 Next, an example of a method for manufacturing a hermetic terminal according to the present disclosure will be described.
 第1筒体と、第2筒体と、導通部材が貫通孔に挿入されたセラミック基板とを準備する。 。Preparing the first cylinder, the second cylinder, and the ceramic substrate having the conductive member inserted into the through hole.
 セラミック基板は、以下のような製造方法で得ることができる。 The ceramic substrate can be obtained by the following manufacturing method.
 まず、主成分である酸化アルミニウム粉末と、水酸化マグネシウム、酸化珪素、炭酸カルシウムおよび酸化ジルコニウムの各粉末と、必要に応じて酸化アルミニウム粉末を分散させる分散剤と、有機結合剤とを、ボールミル、ビーズミルまたは振動ミルにより湿式混合してスラリーとする。 First, an aluminum oxide powder as a main component, magnesium hydroxide, silicon oxide, calcium carbonate and zirconium oxide powder, a dispersant for dispersing the aluminum oxide powder as needed, and an organic binder, a ball mill, A slurry is obtained by wet mixing with a bead mill or a vibration mill.
 ここで、酸化アルミニウム粉末の平均粒径(D50)は3μm以下、好ましくは1μm以下であり、上記粉末の合計100質量%における水酸化マグネシウム粉末の含有量は0.87質量%~1.07質量%、酸化珪素粉末の含有量は6.1質量%~7.5質量%、炭酸カルシウム粉末の含有量は2.5質量%~3.1質量%、酸化ジルコニウムの含有量は、1.0質量%~1.3質量%である。 Here, the average particle diameter (D 50 ) of the aluminum oxide powder is 3 μm or less, preferably 1 μm or less, and the content of magnesium hydroxide powder in the total 100% by mass of the powder is 0.87% to 1.07%. % By mass, the content of silicon oxide powder is 6.1% by mass to 7.5% by mass, the content of calcium carbonate powder is 2.5% by mass to 3.1% by mass, and the content of zirconium oxide is 1.% by mass. 0 mass% to 1.3 mass%.
 湿式混合する時間は、例えば、40~50時間である。また、有機結合剤は、例えば、パラフィンワックス、ワックスエマルジョン(ワックス+乳化剤)、PVA(ポリビニールアルコール)、PEG(ポリエチレングリコール)、PEO(ポリエチレンオキサイド)等である。 The wet mixing time is, for example, 40 to 50 hours. The organic binder is, for example, paraffin wax, wax emulsion (wax + emulsifier), PVA (polyvinyl alcohol), PEG (polyethylene glycol), PEO (polyethylene oxide) and the like.
 次に、上述した方法によって得たスラリーを噴霧造粒して顆粒を得た後、この顆粒を粉末プレス成形法あるいは冷間静水圧成形法により、成形することで円板状の成形体を得る。 そして、切削加工により、貫通孔と段差部または凸条部とを形成し、貫通孔等を形成した成形体を1550℃以上1750℃以下の温度で焼成することによりセラミック基板を得ることができる。 Next, after the slurry obtained by the above-described method is spray-granulated to obtain granules, the granules are formed by a powder press molding method or a cold isostatic pressing method to obtain a disk-shaped molded body. . {Circle around (2)} Then, a through-hole and a step or a ridge are formed by cutting, and the formed body having the through-hole or the like is fired at a temperature of 1550 ° C. or more and 1750 ° C. or less to obtain a ceramic substrate.
 ここで、メタライズ層を備える段差面または凸条部の先端面に開気孔を複数備え、開気孔の重心間距離から前記開気孔の円相当径の平均値を引いた値が20μm以上50μm以下であるセラミック基板を得るには、冷間静水圧成形法を用い、成形圧を98MPa以上147MPa以下として成形体を作製し、1580℃以上1750℃以下の温度で焼成すればよい。 Here, a plurality of open pores are provided on the tip surface of the stepped surface or the ridge portion provided with the metallized layer, and a value obtained by subtracting the average value of the circle equivalent diameter of the open pores from the distance between the centers of gravity of the open pores is not less than 20 μm and not more than 50 μm. In order to obtain a certain ceramic substrate, a compact may be produced using a cold isostatic pressing method at a molding pressure of 98 MPa to 147 MPa, and fired at a temperature of 1580 ° C. to 1750 ° C.
 導通部材のセラミック基板との接合部、第1筒体の第2筒体との接合部、第1筒体のセラミック基板との接合部、第2筒体の第1筒体との接合部およびセラミック基板の第1筒体との接合部の少なくともいずれかに、めっき法により、予め、ニッケル、銅または銅ニッケル合金を主成分とする被覆層を形成してもよい。 A junction between the conductive member and the ceramic substrate, a junction between the first cylinder and the second cylinder, a junction between the first cylinder and the ceramic substrate, a junction between the second cylinder and the first cylinder, and A coating layer containing nickel, copper, or a copper-nickel alloy as a main component may be previously formed on at least one of the joints of the ceramic substrate with the first cylinder by a plating method.
 導通部材、第1筒体および第2筒体の各全面に、上記被覆層を形成してもよい。 被覆 The above-described coating layer may be formed on the entire surface of the conductive member, the first cylindrical body, and the second cylindrical body.
 第2筒体の第1筒体側の端部および第1筒体の前記第2筒体側の端部の少なくともいずれか一方に段差面を有する場合、段差面に上記被覆層を形成してもよい。 When at least one of the end of the second cylinder on the first cylinder side and the end of the first cylinder on the second cylinder side, the coating layer may be formed on the step surface. .
 また、セラミック基板の導通部材との接合部およびセラミック基板の第1筒体との接合部の少なくともいずれかは、予め、Mo-Mn法でメタライズ層を形成した後、めっき法により、ニッケル、銅または銅ニッケル合金を主成分とする被覆層を形成してもよい。 In addition, at least one of the joint portion of the ceramic substrate with the conductive member and the joint portion of the ceramic substrate with the first cylindrical body is formed by forming a metallized layer in advance by a Mo—Mn method, and then plating nickel or copper by a plating method. Alternatively, a coating layer mainly containing a copper-nickel alloy may be formed.
 セラミック基板の外周面全体に、上記被覆層を形成してもよい。 被覆 The coating layer may be formed on the entire outer peripheral surface of the ceramic substrate.
 そして、対向する各接合部にBAg-8、BAg-8A、BAg-8B等の銀を主成分とするろう材を塗布して、適正温度で熱処理することによって各接合部は、接合されて本開示の気密端子を得ることができる。 Then, a brazing material containing silver as a main component such as BAg-8, BAg-8A, or BAg-8B is applied to each of the opposing joints, and heat treatment is performed at an appropriate temperature. The disclosed hermetic terminal can be obtained.
 ここで、適正温度とは、JIS Z 3281:1998に記載されているろう付け温度である。 適 正 Here, the appropriate temperature is a brazing temperature described in JIS Z 3281: 1998.
 また、フランジを備えた気密端子を得る場合には、第1筒体と、導通部材が貫通孔に挿入されたセラミック基板と、鍔部が装着された第2筒体とを準備する。 In order to obtain an airtight terminal provided with a flange, a first cylindrical body, a ceramic substrate in which a conductive member is inserted into a through hole, and a second cylindrical body in which a flange is mounted are prepared.
 そして、対向する各接合部に上記ろう材で接合した後、鍔部の外周側にフランジを装着し、TIG(Tungsten Inert Gas)溶接法によって溶接、固定することによって、本開示の気密端子を得ることができる。 Then, after joining the opposed joints with the brazing material, a flange is attached to the outer peripheral side of the flange, and is welded and fixed by a TIG (Tungsten Inert Gas) welding method to obtain an airtight terminal of the present disclosure. be able to.
 上述した製造方法によって得られた本開示の気密端子は、水素に対する脆性が高いので、長期間に亘って用いることができる。 気 The hermetic terminal of the present disclosure obtained by the above-described manufacturing method has high brittleness to hydrogen and can be used for a long time.
 本発明は、上述した実施形態に限定されるものではなく、本発明の技術思想に則して種々の変更および改良が可能である。 The present invention is not limited to the above-described embodiment, and various modifications and improvements can be made based on the technical idea of the present invention.
 たとえば、前述した実施形態においては、第2筒体5が鍔部8を介してフランジ6に接合された例を示したが、第2筒体5が直接、フランジ6に接合されていてもよい。また、前述した実施形態においては、鍔部8がコの字状の断面である例を示したが、鍔部8はL字状の断面等、他の形状であってもよい。また、鍔部8がコの字状やL字状等の場合、屈曲部が湾曲したものであってもよい。また、前述した実施形態においては、フランジ6の第2凹部6dに鍔部8が接合された例を示したが、フランジ6が第2凹部6dを有さず、フランジ6の内周面または第2筒体5側の主面に鍔部8が接合されていてもよい。 For example, in the above-described embodiment, an example in which the second cylindrical body 5 is joined to the flange 6 via the flange 8 has been described, but the second cylindrical body 5 may be directly joined to the flange 6. . Further, in the above-described embodiment, an example is shown in which the flange 8 has a U-shaped cross section. However, the flange 8 may have another shape such as an L-shaped cross section. When the flange portion 8 has a U-shape or an L-shape, the bent portion may be curved. Further, in the above-described embodiment, the example in which the flange portion 8 is joined to the second concave portion 6d of the flange 6 has been described. However, the flange 6 does not have the second concave portion 6d, and the inner peripheral surface of the flange 6 or the second concave portion 6d. The flange 8 may be joined to the main surface on the side of the two cylinders 5.
1  導通部材
2  貫通孔
3  セラミック基板
3a 凸条部
3b、3c 主面
4  第1筒体
5  第2筒体
6  フランジ
7  接合層
8  鍔部
9  段差部
10 メタライズ層
20 気密端子
REFERENCE SIGNS LIST 1 conductive member 2 through hole 3 ceramic substrate 3 a convex ridge 3 b, 3 c main surface 4 first cylinder 5 second cylinder 6 flange 7 bonding layer 8 flange 9 step 10 metallization layer 20 airtight terminal

Claims (12)

  1. 柱状の導通部材を挿入するための貫通孔を厚み方向に備えた板状のセラミック基板と、該セラミック基板を囲繞する第1筒体と、該第1筒体と同軸上に連結されてなる第2筒体とを備え、前記第1筒体はフェルニコ系合金、Fe-Ni合金、Fe-Ni-Cr-Ti-Al合金、Fe-Cr-Al合金またはFe-Co-Cr合金からなり、前記第2筒体は、ニッケルの含有量が10.4質量%以上であるオーステナイト系ステンレス鋼からなる、気密端子。 A plate-shaped ceramic substrate provided with a through hole for inserting a columnar conductive member in a thickness direction, a first cylindrical body surrounding the ceramic substrate, and a first cylindrical body coaxially connected to the first cylindrical body. A first cylindrical body made of a fernico-based alloy, an Fe—Ni alloy, an Fe—Ni—Cr—Ti—Al alloy, an Fe—Cr—Al alloy, or an Fe—Co—Cr alloy; The hermetic terminal, wherein the second cylinder is made of austenitic stainless steel having a nickel content of 10.4% by mass or more.
  2. 前記第2筒体の前記第1筒体側の端部および前記第1筒体の前記第2筒体側の端部の少なくとも一方に段差面を有している、請求項1に記載の気密端子。 The airtight terminal according to claim 1, wherein at least one of an end of the second cylindrical body on the first cylindrical body side and an end of the first cylindrical body on the second cylindrical body side has a step surface.
  3. 前記第2筒体は、少なくとも前記第1筒体との接合部上にニッケル、銅または銅ニッケル合金を主成分とする被覆層を備えてなる、請求項1または2に記載の気密端子。 The hermetic terminal according to claim 1, wherein the second cylindrical body includes a coating layer containing nickel, copper, or a copper-nickel alloy as a main component, at least on a joint with the first cylindrical body.
  4. 前記第1筒体の内周面は、前記第2筒体の外周面よりも外側に位置する、請求項1乃至3のいずれかに記載の気密端子。 The airtight terminal according to any one of claims 1 to 3, wherein an inner peripheral surface of the first cylindrical body is located outside an outer peripheral surface of the second cylindrical body.
  5. 前記第2筒体の外周面に接合された、前記第2筒体を囲繞するフランジをさらに具備する、請求項1乃至請求項4のいずれかに記載の気密端子。 The hermetic terminal according to any one of claims 1 to 4, further comprising a flange that is joined to an outer peripheral surface of the second cylindrical body and surrounds the second cylindrical body.
  6. 前記フランジは、前記第2筒体側に第2凹部を備えてなり、前記第2筒体の軸方向に沿った断面がコの字状の鍔部が前記第2凹部に装着され、前記第2筒体および前記フランジは、前記鍔部を介して接合されているとともに、前記フランジは、前記第1筒体側に第1凹部を備えてなり、前記セラミック基板と前記第1筒体との接合部は、前記第1凹部の底面よりも前記第2筒体から離れている、請求項5に記載の気密端子。 The flange is provided with a second concave portion on the side of the second cylindrical body, and a flange portion having a U-shaped cross section along the axial direction of the second cylindrical body is attached to the second concave portion. The cylinder and the flange are joined via the flange, and the flange includes a first concave portion on the first cylinder side, and a joint between the ceramic substrate and the first cylinder is provided. The hermetic terminal according to claim 5, wherein the terminal is further away from the second cylindrical body than the bottom surface of the first recess.
  7. 前記鍔部はニッケルの含有量が10.4質量%以上であるオーステナイト系ステンレス鋼である、請求項6に記載の気密端子。 The hermetic terminal according to claim 6, wherein the collar portion is an austenitic stainless steel having a nickel content of 10.4% by mass or more.
  8. 複数の前記導通部材が複数の前記貫通孔に個別に挿入されてなり、前記セラミック基板は、前記貫通孔の周囲に少なくともいずれか一方の主面から凹む段差部を備えてなる、請求項1乃至請求項7のいずれかに記載の気密端子。 The plurality of conductive members are individually inserted into the plurality of through holes, and the ceramic substrate includes a stepped portion that is recessed from at least one of the main surfaces around the through hole. An airtight terminal according to claim 7.
  9. 前記セラミック基板は、前記貫通孔の周囲に、両方の主面からそれぞれ凹む段差部を備え、該段差部のいずれか一方は段差面上にさらにメタライズ層を備えてなり、該メタライズ層を備えている側の前記段差部は前記メタライズ層を備えていない側の前記段差部よりも深い、請求項8に記載の気密端子。 The ceramic substrate, around the through hole, includes a stepped portion that is respectively depressed from both main surfaces, and one of the stepped portions further includes a metallized layer on the stepped surface, and includes the metallized layer. The hermetic terminal according to claim 8, wherein the step portion on the side where the metallized layer is provided is deeper than the step portion on the side not provided with the metallized layer.
  10. 前記メタライズ層を備えている側の前記段差部の深さは、前記セラミック基板の厚さの45%以下である請求項9に記載の気密端子。 The hermetic terminal according to claim 9, wherein a depth of the step portion on a side provided with the metallized layer is 45% or less of a thickness of the ceramic substrate.
  11. 複数の前記導通部材が複数の前記貫通孔に個別に挿入されてなり、前記セラミック基板は、前記貫通孔の周囲に、少なくともいずれか一方の主面から伸びる凸条部を備えてなる、請求項1乃至請求項7のいずれかに記載の気密端子。 The plurality of conductive members are individually inserted into the plurality of through-holes, and the ceramic substrate is provided with a ridge extending from at least one of the main surfaces around the through-hole. An airtight terminal according to any one of claims 1 to 7.
  12. 前記セラミック基板は、前記メタライズ層を備える段差面または凸条部の先端面に開気孔を複数備え、前記開気孔の重心間距離から前記開気孔の円相当径の平均値を引いた値は20μm以上50μm以下である請求項9乃至請求項11のいずれかに記載の気密端子。 The ceramic substrate is provided with a plurality of open pores on a step surface or a tip end surface of the convex portion provided with the metallized layer, and a value obtained by subtracting an average value of a circle equivalent diameter of the open pores from a distance between centers of gravity of the open pores is 20 μm. The hermetic terminal according to any one of claims 9 to 11, which is not less than 50 µm.
PCT/JP2019/035503 2018-09-11 2019-09-10 Hermetic terminal WO2020054703A1 (en)

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JP2005235576A (en) * 2004-02-19 2005-09-02 Kyocera Corp Airtight terminal
JP2006179340A (en) * 2004-12-22 2006-07-06 Kyocera Corp Airtight terminal
JP2006324229A (en) * 2005-04-18 2006-11-30 Kyocera Corp Airtight terminal
JP2007201335A (en) * 2006-01-30 2007-08-09 Kyocera Corp Airtight terminal
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JPH0212682Y2 (en) * 1983-10-28 1990-04-10
JPH04119964U (en) * 1991-04-10 1992-10-27 京セラ株式会社 vacuum terminal
JP2519642B2 (en) 1992-11-24 1996-07-31 日立原町電子工業株式会社 Airtight connector manufacturing method
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JP2005235577A (en) * 2004-02-19 2005-09-02 Kyocera Corp Airtight terminal
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JP2006179340A (en) * 2004-12-22 2006-07-06 Kyocera Corp Airtight terminal
JP2006324229A (en) * 2005-04-18 2006-11-30 Kyocera Corp Airtight terminal
JP2007201335A (en) * 2006-01-30 2007-08-09 Kyocera Corp Airtight terminal
WO2011096592A1 (en) * 2010-02-04 2011-08-11 小田産業株式会社 High-nitrogen stainless-steel pipe with high strength, high ductility, and excellent corrosion and heat resistance and process for producing same

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EP3852199A4 (en) 2022-06-08
JP7037662B2 (en) 2022-03-16
EP3852199B1 (en) 2023-08-30
JPWO2020054703A1 (en) 2021-08-30

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