JP2005216641A - Airtight terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an airtight terminal suitable for mass production, having high airtight reliability. <P>SOLUTION: The airtight terminal has a ceramic plate 3 with a pierced hole 3a of which periphery of opening has a ring shape first metallized layer 3b, and with a peripheral portion where a second metallized layer 3c for brazing it to the inside of a metal member is formed, a ring shape metal member 2 which is brazed to an upper surface of the first metallized layer 3b coaxially in relation to the pierced hole 3a, and a cylindrical metal pin 1 which is inserted in the pierced hole 3a and the ring shape metal member 2 and is brazed to the ring shape metal member 2. Inner diameter of the ring shape metal member 2 is smaller than diameter of the pierced hole 3a. The pin 1 consists of a large diameter part 1a on one end side and a small diameter part 1b on other end side. A diameter difference portion which is formed between the large diameter part 1a and the small diameter part 1b is locked to the ring shape metal member 2. The diameter of the large diameter part 1a is larger than the inner diameter of the ring shape metal member 2 and smaller than diameter of the ring shape first metallized layer 3b. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an airtight terminal used for an electrical apparatus such as a semiconductor manufacturing apparatus, an electronic apparatus, and a semiconductor apparatus.

  Conventionally, an airtight terminal is attached to an electric apparatus that uses an internal atmosphere of a semiconductor manufacturing apparatus or the like while being cut off from an external atmosphere in order to transmit and receive electric signals inside and outside.

  An example of such an airtight terminal is shown in FIG. FIG. 4 is a cross-sectional view showing an example of a conventional hermetic terminal, in which 11 is a pin, 12 is an annular member, and 13 is a ceramic plate, and these mainly constitute an airtight terminal.

  This hermetic terminal is provided with a cylindrical metal pin 11 and a through hole 13a for inserting the pin 11, and a first metallized layer 13b is provided around one opening of the through hole 13a. From a ceramic plate 13 having a second metallized layer 13c formed on the outer periphery, and a metal annular member 12 that is placed on the upper surface of the first metallized layer 13b and is pinned and brazed inside. It is configured.

  The pin 11 has a cylindrical shape made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and is inserted into the through hole 13a of the ceramic plate 13 and brazed to electrically connect the inside and outside of the electric device. Acts as a terminal to connect to. A plurality of pins 11 are provided as necessary, and are arranged in the ceramic plate 13 with appropriate arrangement and intervals.

  In order to braze the pin 11 into the through hole 13a of the ceramic plate 13, for example, a first metallized layer made of molybdenum (Mo) -manganese (Mn) or the like around one opening of the through hole 13a of the ceramic plate 13 is used. 13b is deposited and Ni-plated, and the first metallized metal layer 13b and the pin 11 on which the Ni plating is applied are inserted into the outer periphery of the pin 11 and the upper surface of the first metallized layer 13b Are brazed by a brazing material such as silver (Ag) brazing through an annular member 12 made of a metal such as an Fe-Ni-Co alloy.

  The brazing material meniscus for joining the pin 11 and the ceramic plate 13 is formed satisfactorily by brazing the pin 11 and the ceramic plate 13 via the annular member 12 and the first metallized layer 13b. The pin 11 can be brazed and firmly joined to the ceramic plate 13 in an airtight manner.

The ceramic plate 13 is an insulating material made of, for example, alumina (Al ₂ O ₃ ) ceramics, and a through hole 13a is provided in the center thereof, and a pin 11 is inserted into the through hole 13a and brazed. Yes.

In order to braze the ceramic plate 13 to an electric device, for example, a second metallized metal layer 13c made of Mo-Mn is deposited on the outer peripheral surface of the ceramic plate 13, and Ni plating is applied to the second metallized metal layer 13c. A method of brazing the second metallized metal layer 13c on which the Ni plating is applied and the electric device through a brazing material such as Ag brazing is adopted. Alternatively, a method is adopted in which a cylindrical metal sleeve (not shown) is brazed to the second metallized metal layer 13c in advance by a brazing material such as Ag brazing, and this metal sleeve is welded to the electric device.
Japanese Patent Laid-Open No. 10-189091

  However, in the conventional hermetic terminal shown in FIG. 4, when the pin 11 is brazed to the ceramic plate 13, the pin 11 protrudes from the ceramic plate 13 of the pin 11 from below the pin 11 with a carbon jig. It was necessary to braze while fixing the part. For this reason, there is a problem that the brazing work is very troublesome and is not suitable for mass production.

  Also, the protruding portion of the pin 11 is fixed with a carbon jig, and the annular member 12 is easily caught by the pin 11 during brazing joining, so the pin 11 is pulled by the pin 11 due to the thermal expansion of the pin 11 and is annular. There is a problem that the member 12 is pushed up, a gap is generated between the annular member 12 and the ceramic plate 13, and the pin 11 and the ceramic plate 13 cannot be joined in an airtight manner.

  Further, there is a problem in that a crack is generated in the ceramic plate 13 due to the stress caused by the difference in thermal expansion between the pin 11 and the ceramic plate 13 being applied to the ceramic plate 13 during brazing.

  As a result, there is a problem in that it is impossible to hermetically block between both main surfaces of the ceramic plate 13, that is, between the external atmosphere side and the internal atmosphere side of the electric device, so that it cannot function as an airtight terminal.

  Accordingly, the present invention has been completed in view of the above problems, and an object thereof is to provide an airtight terminal which is suitable for mass production and has high airtight reliability.

  In the hermetic terminal of the present invention, a through hole is formed, and an annular first metallized layer is formed around the opening of the through hole on the upper surface, and a cylindrical metal member is formed on the outer periphery. A ceramic plate on which a second metallized layer for brazing is formed on the main surface of the inner or annular metal member, and a lower surface with a central axis coinciding with the through hole on the upper surface of the first metallized layer. A brazed metal annular member; and a cylindrical metal pin that is inserted into the through hole and the annular member and brazed to the annular member. Is smaller than the diameter of the through hole, and the pin comprises a large diameter portion on one end side and a small diameter portion on the other end side, and a step formed between the large diameter portion and the small diameter portion is formed in the annular shape. The large diameter is locked to the member It is characterized by a diameter greater than the inner diameter of the annular member, and less than the inner diameter of the first metallized layer.

  In the hermetic terminal of the present invention, a through hole is formed and an annular first metallized layer is formed around the opening of the through hole on the upper surface, and the inner side of the cylindrical metal member is formed on the outer periphery. Alternatively, the ceramic plate on which the second metallized layer for brazing the main surface of the annular metal member is formed, and the lower surface is brazed to the upper surface of the first metallized layer with the central axis aligned with the through hole. An annular member made of metal, and a cylindrical metal pin that is inserted into the through hole and the annular member and brazed to the annular member, and the inner diameter of the annular member is larger than the diameter of the through hole. The pin has a large-diameter portion on one end side and a small-diameter portion on the other end side, and a step formed between the large-diameter portion and the small-diameter portion is locked to the annular member. The diameter is larger than the inner diameter of the annular member and the first member is Since it is smaller than the inner diameter of the rise layer, there is no need to use a carbon jig as in the prior art when brazing the pin to the ceramic plate, and the step between the large diameter portion and the small diameter portion Then, it can be hooked on the annular member and fixed to the ceramic plate. As a result, the brazing operation is greatly improved as compared with the prior art, and is suitable for mass production.

  In addition, since it is not necessary to fix the end of the pin to the jig, even if the pin is extended due to thermal expansion of the pin, it is not possible to push up the annular member by extending both ends of the opened pin without being fixed. In addition, it is possible to prevent a gap from being generated between the annular member and the ceramic plate. Therefore, the state in which the annular member and the first metallized layer are in contact with each other at the time of brazing is maintained, a good meniscus of brazing material is formed at the joint between the pin and the ceramic plate, and the pin and the ceramic plate are firmly and firmly It becomes possible to join hermetically.

  In addition, since the diameter of the large-diameter portion is smaller than the inner diameter of the first metallized layer formed on the ceramic plate, even if stress due to the difference in thermal expansion between the pin and the ceramic plate generated during brazing joining occurs, the annular member The stress can be effectively absorbed at the portion located between the joint portion with the pin and the joint portion with the first metallized layer, and the occurrence of cracks in the ceramic plate can be effectively prevented.

  As a result of the above, the hermetic terminal of the present invention is suitable for mass production, and can reliably and hermetically cut off between the two main surfaces of the ceramic plate, that is, between the external atmosphere side and the internal atmosphere side of the electric device. Can function well.

  The airtight terminal of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of an airtight terminal of the present invention. In the figure, 1 is a pin, 2 is an annular member, 3 is a ceramic plate, and these constitute an airtight terminal.

  The hermetic terminal of the present invention has a through-hole 3a and an annular first metallized layer 3b formed around the opening of the upper-side through-hole 3a. The central axis of the ceramic plate 3 on which the second metallized layer 3c for brazing the inner surface of the member or the main surface of the annular metal member is formed and the upper surface of the first metallized layer 3b coincide with the through hole 3a. And a metal annular member 2 whose lower surface is brazed, and a cylindrical metal pin 1 that is inserted into the through hole 3a and the annular member 2 and brazed to the annular member 2. The annular member 2 has an inner diameter smaller than the diameter of the through-hole 3a, and the pin 1 includes a large-diameter portion 1a on one end side and a small-diameter portion 1b on the other end side, and includes a large-diameter portion 1a and a small-diameter portion 1b. The step formed between them is locked to the annular member 2 Cage, the large-diameter portion 1a is greater than the inner diameter of the annular member 2 in diameter, and a smaller construction than the inner diameter of the first metallized layer 3b.

  In FIG. 1, the structure by which the 2nd metallization layer 3c was formed in the outer peripheral surface of the ceramic board 3 as an attaching part for attaching to an electric apparatus is shown. And the through-hole is opened in the wall part which comprises the airtight container part of electrical apparatuses, such as a semiconductor manufacturing apparatus, an electronic device, and a semiconductor device, The metal member formed in the circumference | surroundings of this internal peripheral surface or opening of a through-hole The electric device can be sealed by bonding the second metallized layer 3c of the hermetic terminal to each other.

  In the hermetic terminal of the present invention, the pin 1 has a cylindrical shape made of a metal such as an Fe—Ni—Co alloy, and functions as a terminal for electrically connecting the inside and outside of the electric device. A plurality of pins 1 are provided as necessary, and are arranged in the ceramic plate 3 with appropriate arrangement and intervals.

  Here, the pin 1 has a large diameter portion 1a and a small diameter portion 1b, and a step is provided at the boundary between the large diameter portion 1a and the small diameter portion 1b. The pin 1 is formed by subjecting a bar material to be the pin 1 to metal processing known in the art such as cutting using a lathe or press working using a die.

The pin 1 is preferably made of a material whose coefficient of thermal expansion is similar to that of the ceramic plate 3. With this configuration, both the heat of the pin 1 and the ceramic plate 3 when the pin 1 is brazed is used. The difference in expansion can be minimized, and the pin 1 can be firmly bonded to the ceramic plate 3 with high airtightness. Further, if the metal constituting the pin 1 has a Vickers hardness of Hv = 200 or higher, it is relatively hard and difficult to bend. Therefore, when the connector socket is fitted to the external atmosphere side of the pin 1, etc. 1 is preferable because it is difficult to bend. Therefore, when the ceramic plate 3 is made of Al ₂ O ₃ ceramics, the pin 1 is preferably made of an Fe—Ni—Co alloy having a thermal expansion coefficient similar to that of Al ₂ O ₃ ceramics and high hardness.

  Further, when the plated metal layer made of Ni is deposited on the surface of the pin 1 to a thickness of 1 to 10 μm, the pin 1 can be effectively prevented from being oxidatively corroded. Therefore, it is preferable to deposit a plated metal layer made of Ni to a thickness of 1 to 10 μm on the surface of the pin 1.

  In order to braze the pin 1 into the through hole 3a of the ceramic plate 3, for example, as shown in FIG. 1, a through hole 3a larger than the large diameter portion 1a of the pin 1 is formed in the ceramic plate 3, and the through hole 3a is formed. A first metallized layer 3b made of Mo-Mn or the like is deposited around one of the openings, and Ni is plated on the first metallized metal layer 3b and the pin 1 which are plated with Ni. Are brazed with a brazing material such as Ag brazing through an annular member 2 made of a metal such as Fe-Ni-Co alloy that is inserted into the outer periphery of the pin 1 and placed on the upper surface of the first metallized layer 3b. Has been.

  With such a joining structure of the pin 1 and the ceramic plate 3, when the pin 1 is brazed to the ceramic plate 3, it is not necessary to use a carbon jig as in the prior art, and the pin 1 has a large diameter portion. It becomes possible to be hooked on the annular member 2 at the step between 1a and the small diameter portion 1b and fixed to the ceramic plate 3. As a result, the brazing operation is greatly improved as compared with the prior art, and is suitable for mass production.

  Further, since it is not necessary to fix the end portion of the pin 1 to the jig, even if the pin 1 is extended due to the thermal expansion of the pin 1, both ends of the pin 1 that is opened without being fixed are extended so that the annular member is extended. 2 is not pushed up, and it is possible to prevent a gap from being formed between the annular member 2 and the ceramic plate 3. Therefore, a state in which the annular member 2 and the first metallized layer 3b are in contact with each other at the time of brazing is maintained, and a good meniscus of brazing material is formed at the joint between the pin 1 and the ceramic plate 3, and the pin 1 And the ceramic plate 3 can be joined firmly and airtightly.

  Further, since the diameter of the large diameter portion 1a is smaller than the inner diameter of the first metallized layer 3b formed on the ceramic plate 3, the stress due to the thermal expansion difference between the pin 1 and the ceramic plate 3 generated during brazing joining is generated. Even if it occurs, the stress can be effectively absorbed at the portion located between the joint portion with the pin 1 and the joint portion with the first metallized layer 3b in the annular member 2, and the ceramic plate 3 is cracked. Can be effectively prevented.

  Further, as shown in FIG. 2, the first metallized layer 3b is provided around the opening of the through hole 3a so that the inner diameter of the first metallized layer 3b is larger than the diameter of the through hole 3a of the ceramic plate 3. It may be configured as described above.

  The brazing material meniscus for joining the pin 1 and the ceramic plate 3 is formed satisfactorily by brazing the pin 1 and the ceramic plate 3 via the annular member 2 and the first metallized layer 3b. The pin 1 can be brazed and firmly joined to the ceramic plate 3 in an airtight manner. Thereby, the distance between the joint part of the annular member 2 and the pin 1 and the joint part of the annular member 2 and the first metallized layer 3 b can be increased, and the stress due to the thermal expansion difference between the pin 1 and the ceramic plate 3. Can be more effectively absorbed at a portion located between these joint portions of the annular member 2.

The ceramic plate 3 is insulative made of, for example, Al ₂ O ₃ ceramics, and has the function of holding the pins 1 while maintaining electrical insulation with the electric device, for example, made of Al ₂ O ₃ ceramics. In this case, a binder such as polyvinyl alcohol is added to and mixed with Al ₂ O _{3 based} ceramic raw material powder such as silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO), and this is added to a predetermined shape in a press die. And is pressed at a predetermined pressure to obtain a press-formed body, and thereafter, the press-formed body is manufactured by firing at a temperature of about 1600 ° C.

Alternatively, a suitable organic binder, solvent, etc. are added to and mixed with raw material powders such as Al ₂ O ₃ , SiO ₂ , MgO, CaO to form a slurry. This slurry is formed into a ceramic green sheet by a doctor blade method or a calender roll method, and cut into a required size. Next, an appropriate punching process is performed to form the through holes 3a and the like in the plurality of ceramic green sheets. The ceramic green sheets are printed with a metal paste mainly composed of a metal powder such as tungsten (W) to form a printed pattern to be a conductor layer such as the first metallized layer 3b and the second metallized layer 3c. The ceramic green sheets formed and then formed with these printed patterns are laminated and fired at a temperature of about 1600 ° C.

  In order to braze the ceramic plate 3 to an electric device, for example, the second metallized metal layer 3c made of Mo-Mn is deposited on the outer peripheral surface of the ceramic plate 3, and Ni plating is applied thereto, A method of brazing the second metallized metal layer 3c to which Ni plating has been applied and an electric device via a brazing material such as Ag brazing is employed.

  In addition, as shown in FIG. 3A, the ceramic plate 3 is attached to the electric device with a cylindrical metal sleeve 4 made of Fe—Ni—Co alloy or the like in advance on the second metallized metal layer 3c. The metal sleeve 4 and the electric device may be welded by brazing with a brazing material such as Ag brazing, and the second metallized layer 3c is the main surface of the ceramic plate 3 as shown in FIG. The main surface of the ceramic plate 3 and the electric device may be brazed and joined to each other.

  Note that the present invention is not limited to the above-described embodiment, and various modifications may be made without departing from the scope of the present invention.

It is sectional drawing which shows the example of embodiment of the airtight terminal of this invention. It is sectional drawing which shows the other example of embodiment of the airtight terminal of this invention. (A), (b) is sectional drawing which shows the other example of embodiment of the airtight terminal of this invention, respectively. It is sectional drawing which shows the example of the conventional airtight terminal.

Explanation of symbols

1: Pin 1a: Large diameter portion 1b: Small diameter portion 2: Annular member 3: Ceramic plate 3a: Through hole 3b: First metallized layer 3c: Second metallized layer

Claims (1)

A through-hole is formed, and an annular first metallization layer is formed around the opening of the through-hole on the upper surface, and the inner periphery of the cylindrical metal member or the annular metal member is formed on the outer periphery. A ceramic plate having a second metallized layer for brazing on the main surface, and a metal plate whose lower surface is brazed to the upper surface of the first metallized layer so that the center axis coincides with the through hole. An annular member, and a cylindrical metal pin inserted into the through hole and the annular member and brazed to the annular member, the inner diameter of the annular member being larger than the diameter of the through hole. The pin is composed of a large-diameter portion on one end side and a small-diameter portion on the other end side, and a step formed between the large-diameter portion and the small-diameter portion is locked to the annular member. The large diameter portion has the annular shape Larger than the inner diameter of the timber, and the hermetic terminal, characterized in that less than the inner diameter of the first metallized layer.

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