JP4969389B2 - Heat dissipation member, electronic component storage package and electronic device using the same - Google Patents

Description

  The present invention relates to a heat dissipation member for mounting an electronic component and dissipating heat generated from the electronic component to the outside, an electronic component storage package using the heat dissipation member, and an electronic apparatus.

  2. Description of the Related Art Conventionally, hermetically sealed electronic devices that house electronic components such as semiconductor elements have been used. In recent years, semiconductor devices such as gallium arsenide field effect transistors (GaAs FETs) have been increased in size, density, and integration, and the amount of heat generated during operation of the semiconductor devices has been increasing.

  FIG. 10A is a cross-sectional view showing an example of this type of electronic device, where 101 is a heat dissipation member, 102 is a frame, 104 is a lid, and 105 is an electronic component.

  The heat dissipating member 101 has a three-layer structure in which a copper (Cu) plate 111 is brazed on both upper and lower surfaces of a molybdenum (Mo) plate 110 via a silver (Ag) braze 112. An electronic component 105 is mounted on the upper surface of the heat radiating member 101, and a frame body 102 for forming a space for accommodating the electronic component 105 is joined around the mounting portion 1 a of the electronic component 105 on the upper main surface of the heat radiating member 101. Has been. The frame body 102 is formed with a wiring conductor 102a made of a metallized layer that is electrically connected to the inside and outside of the frame body 102, and bonding wires 106 extending from the respective electrodes of the electronic component 105 are connected to the metallized layer 102a inside the frame body 102. A plurality of external lead terminals 103 are brazed to the metallized layer 102 a outside the frame 102. Then, a lid body 104 made of metal, ceramics, or the like is joined to the upper surface of the frame body 102 to constitute an electronic device in which the electronic component 105 is hermetically sealed.

FIG. 10B is a cross-sectional view showing an example in which the heat dissipation property of the heat dissipation member 1 is improved as compared with the electronic device of FIG. In FIG. 10B, the heat radiating member 101 has a three-layer structure in which a Cu plate 111 is brazed to the upper and lower surfaces of the Mo plate 110 via Ag brazing 112. A Cu piece 113 is brazed by Ag brazing 112 in place of Mo in a region of the Mo plate 110 almost directly below the electronic component 105 mounted on the upper surface of the heat radiating member 101. With this configuration, heat generated from the electronic component 105 is transmitted from the Cu plate 111 on the upper surface of the heat dissipation member 101 to the Cu plate 111 on the lower surface of the heat dissipation member 101 via the Cu piece 113 having a higher thermal conductivity than the Mo plate. Then, heat can be radiated from the Cu plate 111 to the outside of the electronic device, and good heat dissipation can be obtained (for example, see Patent Document 1).
JP 2000-183222 A

  However, in the conventional heat radiating member, it is difficult to fill the space between the Mo plate 110 and the Cu plate 111 with the Ag solder 112 as thinly as possible without gaps. May be generated.

  By the way, an electronic device in which the electronic component 105 is housed in a container composed of the heat radiating member 101 and the frame body 102 and the lid body 104 is joined to the upper part of the frame body 102 is a joint portion between the frame body 102 and the lid body 104. A He leak test using a helium (He) leak detector is performed to check the airtightness or sealing performance of the gas.

  In this case, when a leak test is performed on an electronic device in which a bubble-like void or the like is generated in the Ag solder 112 exposed outside the joint between the Mo plate 110 and the Cu plate 111, the He gas is adsorbed in the void. Therefore, although it is a non-defective product that has no problem with the hermetic sealing between the frame 102 and the lid 104, which is a part in which the electronic component is accommodated, the He gas released from the gap is detected and is not good. There has been a problem that a so-called pseudo leak, which is determined as a non-defective product, occurs.

  Accordingly, the present invention has been devised in view of the above-described conventional problems, and an object of the present invention is to provide a heat radiating member that does not generate a pseudo leak when an electronic device is subjected to a leak test, and an electronic component housing using the heat radiating member. It is to provide a package and an electronic device.

The heat dissipating member of the present invention is a heat dissipating member formed by alternately laminating a first metal plate and a second metal plate having a lower thermal expansion than the first metal plate, the first metal plate And a brazing material having a thicker outer peripheral portion than the center portion are interposed between the first metal plate and the second metal plate, and the first metal plate and the second metal plate are joined by the brazing material. The side surface of one metal plate of the first metal plate and the second metal plate is formed to be located inside the side surface of the other metal plate. A fillet of the brazing material is formed between the outer peripheral side surface and the surface of the other metal plate .

Radiating member of the present invention preferably comprises at least one of the first metal plate and the second metal plate, wherein the Turkey plate thickness is thin at the outer peripheral portion.

  In the heat dissipating member of the present invention, preferably, the one metal plate is the second metal plate, and the brazing fillets formed on both surfaces of the second metal plate are connected, whereby the second metal plate is connected. The outer peripheral side surface of the metal plate is covered with the brazing material.

Preferably, the heat dissipating member of the present invention is provided with a groove on a laminated surface of the first metal plate and the second metal plate of at least one of the first metal plate and the second metal plate. It is characterized by.

The heat dissipation member of the present invention is preferably characterized in that the groove is provided in a circular shape . The heat dissipating member of the present invention is preferably characterized in that the grooves are provided in a lattice shape.

  The heat dissipating member of the present invention is preferably characterized in that the groove is provided on the first metal plate side.

  In the heat dissipating member of the present invention, preferably, the second metal plate has a through hole in a central portion, and is made of a metal having higher thermal conductivity than the second metal plate at both ends of the through hole. A through metal body is embedded.

  In the heat radiating member of the present invention, preferably, the first metal plate is made of copper or silver.

  In the heat dissipation member of the present invention, preferably, the second metal plate is made of molybdenum, tungsten, a copper-molybdenum sintered body, or a copper-tungsten sintered body.

  An electronic component storage package according to the present invention includes a heat dissipating member having the above-described configuration having an electronic component mounting portion on a surface, a frame attached to the heat dissipating member so as to surround the mounting portion inside, and the frame And a wiring conductor for connecting the inside and outside of the wire.

  The electronic component storage package of the present invention has a base having a recess, a wiring conductor formed from the inside of the recess to the outside of the base, a mounting portion for the electronic component on the surface, and joined to the inside of the recess. The heat dissipation member having the above-described configuration is provided.

  An electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the frame on the upper surface of the frame. And a lid attached so as to close the inside.

  An electronic device according to the present invention includes an electronic component storage package having the above configuration, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and an inner side of the concave portion above the concave portion. And a lid attached so as to close the cover.

The heat dissipating member of the present invention is a heat dissipating member formed by alternately laminating a first metal plate and a second metal plate having a lower thermal expansion than the first metal plate, Between the second metal plate, a brazing material having a thicker outer peripheral portion than the center portion is interposed, and the first metal plate and the second metal plate are joined by the brazing material , The side surface of one metal plate of the first metal plate and the second metal plate is formed to be located inside the side surface of the other metal plate, and the outer peripheral side surface of the one metal plate and the other metal plate Since a fillet of brazing material is formed between the surface and the surface, even if a gap is created in the brazing material between the first metal plate and the second metal plate, A fillet-like brazing material having a thicker outer peripheral portion than the part is interposed, and the brazing material causes the first metal And thus it is cut off voids the outside by bonding the second metal plate. Therefore, it is possible to prevent a pseudo leak from occurring in the He leak test.

Radiating member of the present invention preferably comprises at least one of the first metal plate and the second metal plate, and a benzalkonium plate thickness is thin at the outer peripheral portion, and the first metal plate of the second metal Even if a gap is generated in the brazing material between the plates, the gap is blocked from the outside by the fillet of the brazing material formed in the portion exposed to the outside. Therefore, it is possible to prevent a pseudo leak from occurring in the He leak test.

  In the heat radiating member of the present invention, preferably, the one metal plate is the second metal plate, and the braze fillets formed on both surfaces of the second metal plate are connected to each other, whereby the outer peripheral side surface of the second metal plate is connected. Is covered with the brazing material, the outer peripheral side surface of the second metal plate can be protected with the brazing material.

  In the heat radiating member of the present invention, preferably, a groove is provided on the laminated surface of the first metal plate and the second metal plate of at least one of the first metal plate and the second metal plate. The brazing material between the first metal plate and the second metal plate also flows into the groove, and the bonding between the first metal plate and the second metal plate becomes stronger due to the anchor effect. As a result, peeling at the joint between the first metal plate and the second metal plate can be prevented.

In the heat dissipating member of the present invention, preferably, since the grooves are provided in a circular shape or a lattice shape , the first metal plate and the second metal plate are more strongly bonded in a wide range of the laminated surface. It becomes. As a result, peeling between the first metal plate and the second metal plate can be effectively prevented.

  In the heat dissipation member of the present invention, preferably, the groove is provided on the first metal plate side, so that the first metal plate is made of a metal that is softer and easier to process than the second metal plate. Processing can be performed efficiently.

  In the heat dissipating member of the present invention, preferably, the second metal plate has a through hole in the center portion, and a through metal body made of a metal having higher thermal conductivity than the second metal plate at both ends of the through hole. Therefore, the heat conduction in the thickness direction of the heat radiating member can be improved by the penetrating metal body made of a highly heat conductive metal.

  In the heat dissipating member of the present invention, preferably, the first metal plate is made of copper or silver, so that the heat dissipating member has high thermal conductivity.

  In the heat dissipation member of the present invention, preferably, the second metal plate is made of molybdenum, tungsten, a copper-molybdenum sintered body, or a copper-tungsten sintered body. It can be close to the coefficient of thermal expansion.

  An electronic component storage package according to the present invention includes a heat dissipating member having the electronic component mounting portion on the surface, a frame attached to the heat dissipating member so as to surround the mounting portion on the inside, and the inside and outside of the frame. Since the wiring conductor to be connected is provided, it is possible to provide a highly reliable electronic component storage package that has good heat dissipation and does not generate pseudo-leakage.

  The electronic component storage package of the present invention has a base having a recess, a wiring conductor formed from the inside of the recess to the outside of the base, a mounting portion for the electronic component on the surface, and joined to the inside of the recess. Since the heat dissipation member having the above-described configuration is provided, by mounting the electronic component on the mounting portion of the heat dissipation member having the above-described configuration, the heat conductivity becomes good, and the heat generated from the electronic component is efficiently dissipated to the outside. become able to.

  An electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component that is mounted on a mounting portion and whose electrodes are electrically connected to a wiring conductor, and the inside of the frame is closed on the upper surface of the frame. Since the lid attached in this manner is provided, it is possible to provide a high-power electronic device that can store electronic components that generate a large amount of heat during operation, and an electronic device that can be easily sealed.

  An electronic device according to the present invention includes an electronic component storage package configured as described above, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the inner side of the concave portion being blocked above the concave portion. Since the attached lid body is provided, it is possible to provide a high-power electronic device that can store electronic components that generate a large amount of heat during operation, and an electronic device that can easily perform an airtight test.

The heat radiating member of the present invention, an electronic component storage package (hereinafter also simply referred to as a package) and an electronic device using the same will be described in detail below. FIG. 1 (a), 1 (b) is a cross-sectional view showing the respective reference examples, FIG. 2 (a), the one embodiment of the heat dissipating member shown in FIG. 2 (b) and FIG. 4 (c) present invention, respectively It is sectional drawing which shows an example. 3 (a), 3 (b), 3 (c), 3 (d), 4 (a), 4 (b) , 5 (a), 5 (b) and 7 These are sectional views showing a reference example. 6 (a) and 6 (b) are plan views showing examples of embodiments of grooves formed in the heat dissipation member of the present invention. FIG. 8 is a cross-sectional view of an electronic component storage package and an electronic device in which the heat dissipating member shown in FIG. FIG. 9 is a cross-sectional view showing one embodiment of an electronic component storage package and an electronic device in which the heat dissipation member shown in FIG. In addition, the heat radiating member of this invention is formed symmetrically about the central axis. That is, for example, cross sectional view of a section from the mounting portion 1a side surface along the center line drawn to the opposite surface of the diagram of FIG. 2 (a), have the same cross-sectional shape shown in FIG. 2 (a) Yes.

  In these drawings, reference numeral 1 denotes a flat plate-like heat radiating member on which the mounting portion 1a of the electronic component 5 is provided, and 10 denotes a second metal plate (hereinafter referred to as low thermal expansion property) that has a lower thermal expansion than the first metal plate 11. (Also referred to as a metal plate) 10a is the surface (or also referred to as a laminated surface) of the low thermal expansion metal plate 10, 10b is the outer peripheral side surface of the low thermal expansion metal plate 10, and 10c is thick at the outer peripheral portion of the low thermal expansion metal plate 10. Is a thin-walled portion, 11 is a first metal plate (hereinafter also referred to as a high thermal conductivity metal plate) made of a highly heat conductive metal member, and 11a is a surface (or a laminated surface) of the high thermal conductivity metal plate 11. ), 11b is the outer peripheral side surface of the high thermal conductivity metal plate 11, 11c is a thin portion where the thickness is reduced at the outer peripheral portion of the high thermal conductivity metal plate 11, and 12 is the surface 11a of the high thermal conductivity metal plate 11 and low thermal expansion. Between the surface 10a of the metal plate 10 Intervening brazing material, 12a is a fillet of brazing material formed on the outer peripheral portion and thicker in the stacking direction than the central portion, 2 is a frame body, 2a is a wiring conductor that connects the inside and outside of the frame body 2, 3 is a lead terminal, Reference numeral 4 denotes a lid attached to the upper surface of the frame 2 so as to block the inside of the frame 2, and 5 denotes a heat-generating electronic component such as a semiconductor element or a resistor.

  The heat radiation member 1, the frame body 2, and the wiring conductor 2a constitute an electronic component storage package that stores the electronic component 5. Further, after mounting the electronic component 5 on the mounting portion 1 a of the heat radiating member 1, the lid 4 is attached to the upper surface of the frame body 2 so as to close the concave portion 8 formed of the heat radiating member 1 and the frame body 2. By sealing 5, the electronic device of the present invention is configured.

Frame 2, alumina _(Al 2 _{O 3)} sintered material, aluminum nitride (AlN) sintered material, mullite _{(3Al 2 O 3 · 2SiO 2} ) sintered material, ceramics such as glass ceramics or iron, It is made of a metal such as (Fe) -nickel (Ni) -cobalt (Co), Fe-Ni, and the like, and is selected from materials whose thermal expansion coefficient and thermal expansion coefficient of the low thermal expansion metal plate 10 are similar. The frame body 2 is formed in a frame shape so that the inner side of the frame surrounds the mounting portion 1a, and is attached to the surface side having the mounting portion 1a of the heat radiating member 1 via an adhesive such as a brazing material. When the frame 2 is made of ceramics, a brazing metal layer (not shown) may be formed at the joint portion of the frame 2 with the heat radiating member 1 when the brazing material is attached. When the frame 2 is made of metal, the periphery of the wiring conductor 2a may be covered with an insulator such as ceramics, resin, or glass in order to insulate the wiring conductor 2a from the metal constituting the frame 2.

  In addition, the heat dissipating member 1 has an electronic component 5 fixed to a mounting portion 1a provided at the center of the surface of the heat dissipating member 1 via an adhesive such as resin, glass, or brazing material. When a brazing material is used as the adhesive, a nickel (Ni) layer or a gold (Au) layer is used as a brazing metal layer (not shown) with the electronic component 5 of the heat radiating member 1 by plating or the like. You may form in a junction part. However, a brazing metal layer is not particularly necessary when the surface of the highly thermally conductive metal plate 11 exposed to the mounting portion 1a of the heat radiating member 1 can be sufficiently brazed.

If the frame 2 is made of, for example, an Al ₂ O ₃ sintered material, the raw material powder such as Al ₂ O ₃ , silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO) is used. Appropriate organic binders, solvents, plasticizers, dispersants, etc. are mixed and added to form a slurry, and from this, a ceramic green sheet (ceramic green sheet) is formed by adopting a doctor blade method or a calender roll method. Later, this ceramic green sheet is subjected to an appropriate punching process and suitable for metal material powders such as tungsten (W), Mo, manganese (Mn), Cu, silver (Ag), Ni, Au, palladium (Pd). Conductive paste made by mixing organic binder and solvent on green sheet in advance by screen printing method etc. After printing applied in a pattern of the green sheet laminating a plurality, it is produced by firing at a temperature of about 1600 ° C..

  In the frame 2, a wiring conductor 2 a led out from the inner surface of the recess 8 (in the vicinity of the mounting portion 1 a) formed on the inner side of the frame 2 by the heat radiating member 1 and the frame 2 to the outside of the frame 2 is formed. Each electrode of the electronic component 5 is electrically connected to one end inside the recess 8 of the wiring conductor 2a via an electrical connection means 6 such as a bonding wire. Thus, by providing the frame 2 so as to surround the mounting portion 1a on the inner side, the concave portion 8 composed of the heat radiating member 1 and the frame 2 can be formed. Then, after the electronic component 5 is mounted on the mounting portion 1a of the heat radiating member 1, the lid 4 is attached to the upper surface of the frame 2 so as to close the concave portion 8 composed of the heat radiating member 1 and the frame 2 and the electronic component is mounted. By sealing 5, the electronic component 5 can be hermetically sealed. Further, a lead terminal 3 for connection to an external electric circuit board may be connected to the other end of the wiring conductor 2a outside the frame body 2. By connecting the lead terminal 3, the wiring conductor 2a and the outside are connected. The connection with the electric circuit board can be facilitated, and the workability of the connection between the wiring conductor 2a and the external electric circuit board can be improved.

  The wiring conductor 2a is made of a high melting point metal such as W or Mo, or a low resistance metal such as Cu, and a metal paste obtained by adding and mixing an appropriate organic binder, solvent, or the like to a metal powder such as W, Mo or Cu. The ceramic green sheet to be the body 2 is preliminarily printed and applied in a predetermined pattern by a screen printing method or the like, so that the heat radiation member 1 and the frame body 2 are deposited from the inner surface of the recess 8 to the outer surface of the frame body 2. .

  Further, the wiring conductor 2a is formed by depositing a metal having excellent corrosion resistance such as Ni, Au and the like on the exposed surface and excellent bonding properties of the electrical connection means 6 to a thickness of 1 to 20 μm by plating. The oxidative corrosion of the conductor 2a can be effectively prevented and the connection of the electrical connection means 6 to the wiring conductor 2a can be strengthened. Therefore, it is desirable that the wiring conductor 2a is coated with a metal having excellent corrosion resistance such as Ni and Au and excellent bonding properties on the exposed surface to a thickness of 1 to 20 μm.

Heating members 1 release are, for example, FIG. 1 (a), (b), the same polygonal shape in plan view, a circular shape or a highly thermal conductive metal plate 11 such as elliptical low thermal expansion metal plate 10 Are laminated alternately via brazing materials, and at least one of the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 is a thin portion 10c, 11c having a reduced thickness on the entire outer periphery thereof. The fillet 12a of the brazing material 12 is thicker in the laminating direction than the central portion between the thin portions 10c, 11c and the adjacent high thermal conductivity metal plate 11 or low thermal expansion metal plate 10. Is formed.

  In FIGS. 1A and 1B, an example in which the thin portion 11c is formed toward the high thermal conductive metal plate 11 is shown. However, as shown in FIGS. You may form the thin part 10c in the outer peripheral part of the expansible metal plate 10. FIG.

  The low thermal expansion metal plate 10 is formed, for example, by applying conventionally known metal processing methods such as rolling and punching of molybdenum (Mo), tungsten (W), and alloys thereof. These metals have a thermal expansion coefficient that approximates the thermal expansion coefficient of the electronic component 5 such as a semiconductor element and is excellent in compatibility as a bonding material for the electronic component 5, but has a relatively low thermal conductivity and longitudinal elasticity. Has a large coefficient. The low thermal expansion metal plate 10 is provided in order to make the thermal expansion coefficient of the heat radiating member 1 compatible with the electronic component 5. The thickness of the low thermal expansion metal plate 10 is large in the thermal expansion coefficient of the entire heat radiating member 1. It is preferable to make it as thin as possible within a range where the thermal expansion coefficient can be suppressed and within a range where the thermal expansion coefficient can be suppressed.

  Preferably, the low thermal expansion metal plate 10 is made of a Cu—Mo sintered body or a Cu—W sintered body. With this configuration, since the thermal conductivity of the low thermal expansion metal plate 10 can be improved, the heat dissipation property of the heat radiating member 1 can be improved, and the thermal expansion of the high thermal conductivity metal plate 11 of the heat radiating member 1 can be reduced. It can be constrained by the expandable metal plate 10 and close to the thermal expansion coefficient of the electronic component 5 such as a semiconductor element.

  The high thermal conductivity metal plate 11 is made of a material having a higher thermal conductivity than the low thermal expansion metal plate 10, for example, a metal material such as copper (Cu), silver (Ag), aluminum (Al), gold (Au) or the like. Made of these alloys. Since these metal materials are soft metals having a large coefficient of thermal expansion but a small longitudinal elastic modulus and a small Vickers hardness, heat is applied to the heat radiating member 1 to form a high thermal conductivity metal plate 11 and a low thermal expansion metal plate 10. When thermally expanded, the high thermal conductivity metal plate 11 is easily restrained by the thermal expansion of the low thermal expansion metal plate 10, and the combined thermal expansion coefficient of the heat radiating member 1 is close to the thermal expansion coefficient of the low thermal expansion metal plate 10. .

  In addition, when the material of the high thermal conductive metal plate is made of Cu, it is not limited to pure Cu, as long as the thermal conductivity is good and sufficient bonding strength can be obtained with the low thermal expansion metal plate 10, Various Cu alloys mainly composed of Cu may be used. Similarly, when the material of the high thermal conductive metal plate is made of another material such as Ag or Al, it is not necessary to be a pure metal.

  When the thin portion 11c is formed on the outer peripheral portion of the high thermal conductivity metal plate 11, the high thermal conductivity metal plate 11 is made of a relatively soft material having a low longitudinal elastic modulus such as copper (Cu) or silver (Ag). The thin portion 11c can be easily formed by subjecting the high heat conductive metal plate 11 to press working or the like.

  On the other hand, when the thin portion 10 c is formed on the outer peripheral portion of the low thermal expansion metal plate 10, the outer peripheral side surface of the low thermal expansion metal plate 10 is covered with the fillet 12 a of the brazing material 12 and the exposed surface of the low thermal expansion metal plate 10. Less.

Heating members 1 release, as shown for example in FIG. 1 (a), the mounting portion 1a from the top surface in order side high thermal conductivity metal plate 11 of the electronic component 5, the low thermal expansion metal plate 10, the lowermost surface of the high thermal conductivity Three layers of metal plates 11 are alternately laminated via brazing material 12. The surface 11a of the high thermal conductivity metal plate 11 and the surface 10a of the low thermal expansion metal plate 10 are thinly joined via the brazing material 12, and the outer peripheral portion of the high thermal conductivity metal plate 11 has high thermal conductivity on the entire circumference. It has a thin portion 11 c that is thinner than the thickness of the central portion of the metal plate 11. Thus, the space between the surface 10a of the low thermal expansion metal plate 10 is surrounded by the metal plates 10 and 11 and opened in the extending direction of the low thermal expansion metal plate 10 and the high thermal conductivity metal plate 11. 11d is formed. And the fillet 12a of the brazing material 12 is formed in the space 11d between the surface of the thin part 11c and the surface 10a of the low thermal expansion metal plate 10 adjacent to this. The fillet 12a of the brazing material 12 wets and spreads on the thin portion 11c of the high thermal conductivity metal plate 11, so that the distance between the tip of the fillet 12a and the surface of the low thermal expansion metal plate 10, that is, the maximum thickness in the stacking direction is low. It becomes thicker than the thickness of the central part of the material 12.

Heating members 1 release, as shown in FIG. 1 (b), the mounting portion 1a from the top surface in order side high thermal conductivity metal plate 11 of the electronic component 5, the low thermal expansion metal plate 10, the lowermost surface of the high thermal conductivity metal Three layers of the plate 11 are alternately laminated via the brazing material 12. The surface 11a of the high thermal conductivity metal plate 11 and the surface 10a of the low thermal expansion metal plate 10 are thinly joined via a brazing material, and the outer peripheral portion of the high thermal conductivity metal plate 11 is the low thermal expansion metal plate all around. Of the low thermal expansion metal plate 10 adjacent to the surface of the thin portion 11c. The thin portion 11c is chamfered in the shape of a C surface between the surface 11a and the outer peripheral side surface 11b. A fillet 12a of the brazing material 12 is formed in a space 11d formed between the surface 10a. By this fillet 12a, the thickness of the brazing material 12 in the stacking direction becomes thicker than the central portion.

  As shown in FIG. 1A, when the thin portion 11c is provided in a stepped shape, the thin portion 11c covers the fillet 12a of the brazing material 12 in a bowl shape, and the brazing material 12 exceeds the thin portion 11c. Thus, it is difficult for the electronic component 5 to spread on the mounting portion 1a side.

  On the other hand, as in the example shown in FIG. 1B, when the thin portion 11 c is chamfered, the space 11 d can be easily filled with the fillet 12 a of the brazing material 12, and the low thermal expansion metal plate at the outer peripheral portion of the heat radiating member 1. 10 and the high thermal conductive metal plate 11 can be firmly bonded via the brazing material 12.

The heat radiating member 1 shown to Fig.3 (a) shows the example which provided the thin part 10c in the direction of the low thermal expansion metal plate 10 in the heat radiating member 1 shown to Fig.1 (a). That is, the heat dissipating member 1 of the reference example shown in FIG. 3A includes an uppermost high heat conductive metal plate 11, a low thermal expansion metal plate 10, and a lowermost high heat conductive metal in order from the mounting portion 1a of the electronic component 5. Three layers of the plate 11 are alternately laminated via the brazing material 12. The low thermal expansion metal plate 10 is a surface 10a bonded to the high thermal conductivity metal plate 11, that is, between the upper and lower main surfaces 10a and the outer peripheral side surface 10b of the low thermal expansion metal plate 10, over the entire circumference. A thin portion 10c whose thickness is made thinner than the thickness of the central portion is provided in a space 10d formed between the thin portion 10c and the surface 10a of the adjacent high thermal conductive metal plate 10. A fillet 12a of the brazing material 12 is formed, and the low thermal expansion metal plate 10 and the high thermal conductivity metal plate 11 are joined.

Moreover, the heat radiating member 1 shown in FIG.3 (b) shows the example which provided the thin part 10c in the direction of the low thermal expansion metal plate 10 in the heat radiating member 1 shown in FIG.1 (b). That is, the heat dissipating member 1 of the reference example shown in FIG. 3B has a high thermal conductivity metal plate 11 on the uppermost surface, a low thermal expansion metal plate 10 and a higher thermal conductivity on the lowermost layer in order from the mounting portion 1a side of the electronic component 5. Three layers of the metal plate 11 are alternately laminated via the brazing material 12, and the low thermal expansion metal plate 10 is a surface 10 a bonded to the high thermal conductivity metal plate 11, that is, the low thermal expansion metal plate 10. A thin-walled portion 10c having a chamfered chamfered shape is provided between the upper and lower main surfaces 10a and the outer peripheral side surface 10b, and the surface of the highly thermally conductive metal plate 10 adjacent to the surface of the thin-walled portion 10c. A fillet 12a of the brazing material 12 is formed so as to fill a space 10d formed between the filler 10a and 10a.

  In the example shown in FIGS. 1A, 1B, 3A, and 3B, one of the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 is used. The thin-walled portion 11c or the thin-walled portion 10c is provided only on the outer peripheral portion, but the thin-walled portions 11c and 10c may be provided on the high thermal conductivity metal plate 11 and the low thermal conductivity metal plate 10, respectively. For example, as shown in FIG. 3C, a chamfered space 11d is formed between the lower surface side surface 11a and the outer peripheral side surface 11b joined to the low thermal expansion metal plate 10 of the uppermost high thermal conductivity metal plate 11. The thin portion 11c may be provided so as to be formed, and the thin portion 10c may be provided so that a chamfered space 10d is provided between the lower surface side surface 10a and the outer peripheral side surface 11b of the low thermal expansion metal plate 10, As shown in FIG. 3 (d), a space 11d is formed between the surface 11a of the high thermal conductivity metal plate 11 and the outer peripheral side surface 11b joined to the low thermal expansion metal plate 10, and this high thermal conductivity metal plate. High thermal conductivity metal plate 11 and low thermal expansion metal plate so that chamfered spaces 10d are formed on both sides between the surface 10a of the low thermal expansion metal plate 10 and the outer peripheral side surface 10b. Both 10 are thin Parts 11c, 10c may be provided.

  Alternatively, as shown in FIGS. 2A and 2B, the heat radiating member 1 of the present invention is formed by alternately laminating high thermal conductive metal plates 11 and low thermal expansion metal plates 10 via brazing materials. . One metal plate of the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 is formed so that the shape in plan view is slightly smaller than the other metal plate, or the one metal plate and the other metal plate are The brazing material is disposed between the outer peripheral side surface of the one metal plate and the surface of the other metal plate so that the side surface of the one metal plate is positioned inside the side surface of the other metal plate. Twelve fillets 12a are joined to the other metal plate. The brazing material 12 wets and spreads on the outer peripheral side surface of the metal plate, and the thickness of the brazing material 12 in the stacking direction becomes thicker than the thickness of the central portion.

  That is, for example, as shown in FIG. 2A, the heat dissipating member 1 of the present invention is arranged in order from the mounting portion 1 a side of the electronic component 5 on the upper side of the paper in order from the uppermost high thermal conductive metal plate 11 and the low thermal expansion metal. Three layers of the plate 10 and the high thermal conductive metal plate 11 on the lowermost surface are alternately laminated via the brazing material 12. In the example shown in FIG. 2A, the high thermal conductivity metal plate 11 disposed on the uppermost surface and the lowermost surface corresponds to one metal plate, and the low thermal conductivity metal plate 10 corresponds to the other metal plate. The high thermal conductivity metal plate 11 is formed so that the shape in plan view is slightly smaller than the low thermal expansion metal plate 10, and the outer peripheral side surface 11 b of the high thermal conductivity metal plate 11 is smaller than the outer peripheral side surface 10 b of the low thermal expansion metal plate 10. It will be located inside. The high thermal conductivity metal plate 11 is made of the low thermal expansion metal plate 10 by the fillet 12a of the brazing material 12 formed between the outer peripheral side surface 11c of the high thermal conductivity metal plate 11 and the surface 10a of the low thermal expansion metal plate 10. Joined with.

  Here, the one metal plate may be the low thermal expansion metal plate 10 and the other metal plate may be the high thermal conductivity metal plate 11. For example, in the example shown in FIG. The high thermal conductivity metal plate 11 disposed on the lower surface and the intermediate low thermal expansion metal plate 10 are alternately laminated and brazed and brazed, and the low thermal expansion metal plate 10 has a high thermal conductivity in plan view. It is slightly smaller than the conductive metal plate 11. The low thermal expansion metal plate 10 becomes the high thermal expansion metal plate 11 by the fillet 12a of the brazing material 12 formed between the outer peripheral side surface 10b of the low thermal expansion metal plate 10 and the surface 11a of the high thermal conductivity metal plate 11. It is joined.

  Preferably, as in the example shown in FIG. 2B, the low thermal expansion metal plate 10 has upper and lower brazing materials in which the entire outer peripheral side surface 10 b is formed on both front and back surfaces of the low thermal expansion metal plate 10. It is preferable that the side surface of the low thermal expansion metal plate 10 is covered with the brazing material 12c by connecting the 12 fillets 12a. Thereby, the outer peripheral side surface 10b of the low thermal expansion metal plate 10 can be protected from the outside air by the brazing material 12c, and the heat radiating member 1 is made of Ni, Au or the like in order to improve the corrosion resistance of the heat radiating member 1. Even when the plated metal layer is applied, the plating property on the side surface of the heat radiating member 1 can be improved by selecting the material of the brazing material 12. And it can be set as the heat radiating member 1 which the surface does not carry out oxidative corrosion.

  Further, the fillet 12a of the brazing material 12 formed between the uppermost high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10, and the lowermost high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 are provided. The high heat conductive metal plate 11 from the upper high heat conductive metal plate 11 to the lower high heat conductive metal plate 11 through the side metal layer 12c covering the side surface of the low thermal expansion metal plate 10 so that the fillet 12a of the brazing material 12 formed therebetween is connected. Can convey heat to.

  In the example shown in FIGS. 2A and 2B, the example in which one metal plate is formed to be slightly smaller than the other metal plate is shown, but it is not necessarily required to be formed to be slightly smaller. The side surface (end surface) of the metal plate should just be located inside the side surface (end surface) of the other metal plate. For example, the one metal plate and the other metal plate are the same size, and by laminating them, the side surface of the one metal plate is located on the inner side of the side surface of the other metal plate on any one side of the heat dissipation member 1. In the other side which is located and opposes one side of the heat radiating member 1, the side surface of the other metal plate may be located inside the side surface of the one metal plate. In this case, that is, the right half of FIG. 2A and the left half of FIG.

  Further, for example, FIG. 2A and FIG. 2B are combined in one side of the heat radiating member 1, and one side of the metal plate is formed in an uneven shape, and the side surface of the one metal plate is partly in one side. May be located inside the side surface of the other metal plate, and in the other part, the side surface of the other metal plate may be located inside the side surface of the one metal plate. Moreover, you may combine what formed the thin part 11c in the outer peripheral part of one and the other metal plate as described in FIG. 2 (a), FIG.2 (b). That is, by making the outer peripheral shape of at least one of the first metal plate 11 and the second metal plate 10 different, the fillet of the brazing material 12 in which the thickness of the brazing material 12 in the stacking direction is thicker than the inner thickness is dissipated. What is necessary is just to make it form in the outer peripheral part of the member 1. FIG.

In addition, as shown in FIG. 4 (c), the layer configuration of the low thermal expansion metal plate 10 is dispersed into two or more layers so as not to increase the thermal expansion coefficient of the entire heat dissipation member 1 of the present invention . It may be arranged in one inner layer.

That is, the heat member 1 release, as shown in FIG. 4 (a), high thermal conductivity metal plate 11 from the mounting portion 1a of the uppermost surface in the order of the electronic component 5, the low thermal expansion metal plate 10, the center of the high thermal conductivity metal Five layers of the plate 11, the low thermal expansion metal plate 10, and the lowermost high thermal conductivity metal plate 11 are alternately laminated via the brazing material 12. The surface 11a of the high thermal conductivity metal plate 11 and the surface 10a of the low thermal expansion metal plate 10 are joined via a thin brazing material 12, and the uppermost high thermal conductivity metal plate 11 and the lowermost high thermal conductivity metal plate. 11 and the outer peripheral portion of the central high thermal conductive metal plate 11 are chamfered in a C-cut shape over the entire circumference between the surface 11a on the side to be joined to the low thermal expansion metal plate 10 and the outer peripheral side surface 11c. A thin portion 11c is provided so that a space 11d of the brazing material 12 is formed in the space 11d formed between the thin portion 11c and the surface 10a of the adjacent low thermal expansion metal plate 10. Is formed.

Also the heat member 1 release, as shown in FIG. 4 (b), high thermal conductivity metal plate 11 from the mounting portion 1a of the uppermost surface in the order of the electronic component 5, the low thermal expansion metal plate 10, the center of the high thermal conductivity metal Five layers of the plate 11, the low thermal expansion metal plate 10, and the lowermost high thermal conductivity metal plate 11 are alternately laminated via the brazing material 12. The low thermal expansion metal plate 10 is provided with a thin portion 10c between the surface 10a and the outer peripheral side surface 10b joined to the high thermal conductivity metal plate 11 so that a space 10d is formed over the entire circumference. A fillet 12a of a brazing material 12 for brazing and joining the high thermal conductivity metal plate 10 and the low thermal expansion metal plate 11 is formed on the surface of the metal plate.

  Moreover, as shown in FIG.4 (c), the heat radiating member 1 of this invention is the surface 10a side joined with the low thermal expansion metal plate 10 in the outer peripheral part of the high heat conductive metal plate 11 of the uppermost surface and the lowermost surface. A thin-walled portion 11c is provided so that a space 11d is formed, and the intermediate high thermal conductive metal plate 11 is formed to be slightly smaller in plan view than the low thermal expansion metal plate 10 disposed on both sides thereof. Yes. Therefore, the outer peripheral side surface 11b of the high thermal conductive metal plate 11 disposed in the middle is positioned inside the outer peripheral side surface 10b of the low thermal expansion metal plate 10 on both sides thereof. That is, in the example of FIG. 2B, one metal plate is an intermediate high thermal conductivity metal plate 11, and the other metal plate is a low thermal expansion metal plate joined to both surfaces 11a of the high thermal conductivity metal plate 11. It corresponds to 10. The intermediate high thermal conductivity metal plate 11 has a low thermal expansion due to the fillet 12a of the brazing material 12 formed between the outer peripheral side surface 11b of the intermediate high thermal conductivity metal plate 11 and the surface 10a of the low thermal expansion metal plate 10. Bonded to the conductive metal plate 10.

  Similarly, it goes without saying that the heat dissipating member 1 of the present invention may be formed by laminating a high thermal conductivity metal plate 11 and a low thermal expansion metal plate 10 in a multilayer of five or more layers.

  Further, as shown in the above example, the heat dissipating member 1 of the present invention has a high heat conductive metal plate 11 and a low thermal expansion metal plate 10 such that the uppermost surface side and the lowermost surface side become the high heat conductive metal plate 11. Are preferably laminated alternately. By arranging the high thermal conductivity metal plate 11 on the uppermost surface side and the lowermost surface side, the heat generated from the electronic component 5 by the high thermal conductivity metal plate 11 on the uppermost surface side is directed toward the surface 11a of the high thermal conductivity metal plate 11. It is possible to diffuse heat efficiently and to dissipate heat efficiently using a wide area of the heat radiating member 1. Moreover, the high thermal conductive metal plate 11 on the lowermost side has an effect of preventing the entire heat radiating member 1 from being warped and deformed. That is, the low thermal expansion metal plate 10 and the high thermal conductivity metal plate 11 have different thermal expansion coefficients and may be warped when heated. However, the high thermal conductivity metal plate is formed on the uppermost surface side and the lowermost surface side. By providing the layer 11, it is possible to effectively prevent the heat radiating member 1 from being warped and deformed by balancing the stress due to the difference in thermal expansion acting on the uppermost surface and the lowermost surface. As described above, the high heat conductive metal plates 11 are arranged on the uppermost surface side and the lowermost surface side, and the low heat conductive metal plates 10 are alternately arranged therebetween, so that the heat dissipating member 1 of the present invention has three or more odd layers. It is preferable that Further, in terms of preventing warpage deformation, the upper and lower metal plates 11 and 10 are laminated so that the thicknesses thereof are symmetrical with respect to the central high thermal conductive metal plate 11 or the low thermal expansion metal plate 10. preferable.

  The heat radiating member 1 of the present invention is formed by performing a punching process using a flat low thermal expansion metal plate 10 having a predetermined plan view shape and thickness and a high thermal conductivity metal plate 11, for example, a mold. A low thermal expansion metal plate 10 punched into a square shape having a side length of 10 to 30 mm and a thickness of 0.1 to 0.4 mm, and a side length of 10 to 30 mm and a thickness of 0.2 to 0. A high thermal conductivity metal plate 11 having a thin portion 11c formed by punching into an 8 mm square shape and pressing the outer peripheral portion is prepared, and then the low thermal expansion metal plate 10 and the high thermal conductivity metal plate 11 are prepared. In the state where the preform of the brazing material 12 such as Ag-Cu brazing is sandwiched between the uppermost surface and the lowermost surface, the high thermal conductivity metal plate 11 and the low thermal expansion are obtained. The conductive metal plates 10 are alternately stacked. Further, in this state, the brazing material 12 is put into a high temperature furnace (for example, about 800 ° C. when Ag—Cu brazing is used) and is sandwiched between the low thermal expansion metal plate 10 and the high thermal conductivity metal plate 11. Melt the preform. Thereafter, by removing from the high temperature furnace, the heat radiating member 1 in which the low thermal expansion metal plate 10 and the high thermal conductivity metal plate 11 are joined by the brazing material 12 is produced.

  When the preform of the brazing material 12 is melted in a high-temperature furnace, the brazing material 12 flows to the outer peripheral portion of the joint portion between the low thermal expansion metal plate 10 and the high thermal conductive metal plate 11. The fillet 12a of the brazing material 12 is formed over the entire circumference. In addition, the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 are joined via the brazing material 12, and the free thermal expansion of the high thermal conductivity metal plate 11 is restrained by the low thermal expansion metal plate 10. It becomes.

  Since the fillet 12a of the brazing material 12 is formed on the entire periphery of the joint surface between the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10, the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 Even if a gap inadequately filled with the brazing material 12 occurs in the outer peripheral portion of the joint surface, the gap is blocked by the fillet 12a of the brazing material 12 and is blocked from the outside. For this reason, it is possible to prevent a pseudo leak that occurs when He is adsorbed in this gap or is released from the gap in the He leak test.

  The He leak test is a method for determining, for example, an airtightness or a sealing failure caused by, for example, a defect in the joint between the lid 4 and the frame 2 in an electronic device, and is performed as follows. First, the sealed electronic device is accommodated in a predetermined container and sealed, and He gas is injected into the container. Next, the electronic device is taken out, transferred to another inspection container, and sealed. Then, the inside of the cuvette is evacuated, and sealing (bonding) failure between the lid body 4 and the frame body 2 is determined depending on whether He is detected. That is, for example, when there is a communication hole communicating with the inside and outside of the electronic device at the joint between the frame body 2 and the lid body 4, the gas passes through the communication hole in the semiconductor device in the above-described He gas press-fitting step. Get in. In this case, when the vacuum is subsequently evacuated, the He gas flows out of the semiconductor device and is detected, so that it can be determined as a defective product.

  Further, the side surface where the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 are laminated is covered with the fillet 12a of the brazing material 12 over the entire circumference, so that the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 are formed. Even if a gap that is insufficiently filled with the brazing material 12 is formed at the outer peripheral portion of the joint surface, the gap is blocked by the fillet 12a of the brazing material 12 and is blocked from the outside. When preventing the radiating member 1 from corroding starting from the gap between the expansible metal plate 10 and when a plated metal layer is deposited on the surface of the radiating member 1, the high thermal conductivity metal plate 11 and the low thermal expansion are provided. It is possible to prevent the plating solution from entering between the conductive metal plate 10 and the occurrence of a problem that the plating solution oozes out after plating.

  The heat radiating member 1 preferably has a high thermal conductivity metal plate 11 and a low thermal expansion metal plate 10 joined via a brazing material 12 as shown in cross-sectional views in FIGS. A groove 14 is formed on at least one of the surface (laminated surface) 11a of the high thermal conductive metal plate 11 in contact with the brazing material 12 and the surface (laminated surface) 10a of the low thermal expansion metal plate 10 in contact with the brazing material 12. It is good to be provided. FIG. 5A shows an example in which the groove 14 is provided on the laminated surface 11 a of the high thermal conductive metal plate 11, and FIG. 5B shows the groove 14 provided on the laminated surface 10 a of the low thermal expansion metal plate 10. An example is shown. Although not shown, the groove 14 may be provided in both the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10.

  With this configuration, the brazing material 12 disposed between the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 also flows into the groove 14, and the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 are joined. Becomes stronger due to the anchor effect. As a result, it is possible to prevent peeling at the joint between the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10. In addition, the brazing material can easily go around the entire joining surface of the high thermal conductive metal plate 11 and the low thermal expansion metal plate 10 and can be firmly joined, and the brazing material itself has a very high thermal conductivity, for example, Since it is a silver-copper braze, it is possible to conduct heat throughout the area between the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10.

  The cross-sectional shape of the groove 14 can be a quadrangular shape as shown in FIG. 5 (a), an arc shape as shown in FIG. 5 (b), or a U-shape or V-shape although not shown. Various shapes can be used.

  The grooves 14 are formed on the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 in a lattice shape shown in FIG. 6A in a plan view, and in a concentric circle shape shown in FIG. It is preferable that a plurality of the low thermal expansion metal plates 10 are provided so as to reach almost the entire outer surface of the low thermal expansion metal plate 10. With this configuration, it is possible to firmly braze and join the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 over almost the entire surface of the high thermal conductivity metal plate 11 and / or the low thermal expansion metal plate 10. It becomes possible to make it.

  As shown in FIG. 6A, the heat radiating member 1 is preferably provided with grooves 14 in a lattice shape in plan view. With this configuration, the plurality of grooves 14 cross each other, and the brazing material 12 can be easily spread and uniformly spread over all of the plurality of grooves 14 provided. Therefore, the bonding between the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 becomes stronger in a wide range by the grooves 14 provided in a lattice shape. As a result, peeling between the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10 can be prevented. In addition, it is possible to conduct heat in the entire region between the high thermal conductivity metal plate 11 and the low thermal expansion metal plate 10.

  Further, preferably, as shown in FIG. 5A, the groove 14 is provided on the high thermal conductive metal plate 11 side. Since the high thermal conductive metal plate 11 is softer and easier to process than the low thermal expansion metal plate 10, the grooves 14 are easily processed and the uniform grooves 14 are easily formed.

Also the heat member 1 release, as shown in FIG. 7, the central region of the low thermal expansion metal plate 10 to be substantially immediately below the mounting portion 1a of the upper surface of the exoergic member 1 has a through hole 10e, A through metal body 13 made of a metal having a higher thermal conductivity than the low thermal expansion metal plate 10, particularly preferably a high thermal conductivity metal of the same material as that of the high thermal conductivity metal plate 11, is embedded in the upper and lower ends of the through hole 10 e. Is good. And the fillet 12a of the brazing material 12 is formed in the outer peripheral part of the surface where the low thermal expansion metal plate 10 and the high thermal conductivity metal plate 11 are joined. Since the through metal body 13 is embedded, the heat generated from the electronic component 5 is efficiently conducted from the upper side to the lower side of the heat radiating member 1 through the through metal body 13 made of a highly heat conductive metal. Can do.

  Further, the mounting portion 1a on which the electronic component 5 is mounted is provided on the surface of the high thermal conductive metal plate 11 as shown in FIGS. 1 to 5 and FIG. It is possible to quickly transfer heat with high thermal conductivity in the thickness direction and the surface direction of the heat radiating member 1 by the uppermost highly thermally conductive metal plate 11. Then, the surface of the high thermal conductivity metal plate 11b is diffused from the surface of the uppermost high thermal conductivity metal plate 11b on the side to be joined to the low thermal expansion metal plate 10 to an area larger than the junction area with the electronic component. Heat is transferred to the low thermal expansion metal plate 10 arranged in a direction orthogonal to the thickness direction (thickness direction of the heat radiating member 1). Then, heat is transferred to the outside of the heat radiating member 1 from the lowermost high thermal conductivity metal plate 11c through the sequentially laminated low thermal expansion metal plate 10 and high thermal conductivity metal plate 11a.

  Furthermore, as shown in FIGS. 1 to 5 and FIG. 7, the lower main surface of the heat radiating member 1 is also made of the high thermal conductive metal plate 11 (the surface of the lowermost high thermal conductive metal plate 11), so that the lowermost layer The heat dissipation from the high thermal conductive metal plate 11 to the external heat radiating plate can be improved.

  In addition, since the high thermal conductivity metal plate 11 and the side metal layer 12c are superior in electrical conductivity compared to the low thermal expansion metal plate 10, the mounting portion 1a and the lowermost high thermal conductivity metal plate 11 are electrically low in resistance. Will be connected. That is, the grounding of the uppermost highly heat conductive metal plate 11b is strengthened, and when the electronic component 5 that operates with a high frequency signal is mounted on the heat radiating member 1, the responsiveness of the electronic component 5 to the high frequency signal becomes excellent. .

  Moreover, as shown in FIG. 9, when the heat radiating member 1 is used as the carrier 7 for mounting the electronic component 5 inside the package, the heat dissipation from the electronic component 5 to the package can be improved. For example, in a package including a base body having a recess 8 surrounded by a substrate part and a frame part, and a wiring conductor 2 a formed from the inside of the recess 8 to the outside of the base body, the electronic component 5 is placed inside the recess 8. A carrier 7 which is mounted and made of the heat dissipation member 1 can be used. In this case, the substrate is formed of ceramic or metal having good thermal conductivity, and the heat radiated from the electronic component 5 is dissipated from the substrate to the outside of the package via the carrier 7.

  For example, as shown in FIG. 9, a high thermal conductivity metal plate 11 and a low thermal expansion metal plate 10 having a lower thermal expansion than the high thermal conductivity metal plate 11 are alternately laminated via a brazing material 12, By changing the shape of the outer peripheral portion of at least one of the conductive metal plate 11 and the low thermal expansion metal plate 10 over the entire circumference, the fillet 12a of the brazing material 12 in which the thickness of the brazing material 12 in the stacking direction is thicker than the inner side is formed on the outer peripheral portion. The formed carrier 7 may be provided on the mounting portion 1 a inside the recess 8.

  In this case, even if the electronic component 5 is thin, by mounting the electronic component 5 on the carrier 7, an electrical connection means 6 such as a bonding wire between each electrode of the electronic component 5 and the line conductor 2a. The transmission loss of the electric signal generated by the electric connecting means 6 can be minimized. Thus, even when the electronic component 5 is mounted on the mounting portion 1a via the carrier 7, the thermal conductivity of the carrier 7 becomes good, and the heat generated from the electronic component 5 can be efficiently dissipated to the outside. become.

Carrier 7, the substrate of good thermal conductivity package, in the example of FIG. 9, to dissipate heat to the outside of the package through a substrate heating members 1 release was used.

  The carrier 7 is preferably provided by being joined to the upper main surface of the heat radiating member 1 via a brazing material such as Ag-Cu brazing. In this case, when the high thermal conductivity metal plate 11 constituting the heat radiating member 1 and the low thermal expansion metal plate 10 are joined via the brazing material 12, at the same time, the high thermal conductivity metal plate 11 constituting the carrier 7 and the low thermal conductivity. The expandable metal plate 10 may be joined using the same brazing material 12.

  Thus, according to the package described above, the electronic component 5 is bonded and fixed on the mounting portion 1a of the heat radiating member 1 via an adhesive made of glass, resin, brazing material, etc., and each electrode of the electronic component 5 is bonded to the bonding wire. Electrically connected to a predetermined wiring conductor 2a via an electrical connection means 6 such as the like, and then, the lid 4 made of resin, metal, ceramics or the like is covered with the recess 8 on the upper surface of the frame 2 The electronic component 5 is sealed by sealing the electronic component 5.

  In addition, this invention is not limited to the example of the above embodiment, A various change is possible if it is the range which does not deviate from the summary of this invention. For example, instead of the discrete electronic component 5, a ceramic circuit board having the function of the frame 2 is mounted on the mounting portion 1 a on the uppermost surface of the heat dissipation member 1, and the electronic component 5 is mounted on this circuit board. May be. With this configuration, heat generated from the electronic component 5 mounted on the circuit board can be efficiently dissipated without causing damage such as cracks on the circuit board.

  In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship in the drawings, and do not mean the positional relationship in actual use.

(A), (b) is a sectional view showing a reference example of their respective release heat member. (A), (b) is sectional drawing which shows an example of the heat radiating member of this invention, respectively. (A), a cross-sectional view showing a reference example of (b), (c), (d) is, respectively it release heat member. (A), (b) is a sectional view showing a reference example of their respective release heat member. (C) is sectional drawing which shows an example of the heat radiating member of this invention. (A), (b) is a sectional view showing a reference example of their respective release heat member. (A), (b) is a top view which shows the example of the groove | channel formed in the heat radiating member of this invention, respectively. It is a sectional view showing a reference example of the heat release member. It is sectional drawing which shows an example of the electronic component storage package and electronic device using the heat radiating member shown to Fig.1 (a). It is a sectional view showing a reference example of electronic component storing package and the electronic apparatus. (A), (b) is sectional drawing which shows the example of the conventional package for electronic component accommodation, and an electronic device.

Explanation of symbols

1: Heat radiating member 1a: Mounting portion 2: Frame body 2a: Wiring conductor 4: Cover body 5: Electronic component 7: Carrier 8: Recessed portion 10: Second metal plate (low thermal expansion metal plate)
10a: Surface (of low thermal expansion metal plate) 10b: Outer peripheral side surface (of low thermal expansion metal plate) 10c: Thin part (of low thermal expansion metal plate) 10d: Space 11: First metal plate (high thermal conductive metal) Board)
11a: Surface (of high thermal conductivity metal plate) 11b: Peripheral side surface (of high thermal conductivity metal plate) 11c: Thin wall portion (of high thermal conductivity metal plate) 11d: Space 12: Brazing material 12a: Fillet (of brazing material) 12c: Side metal layer 14: Groove

Claims (14)

A heat dissipating member in which a first metal plate and a second metal plate having a lower thermal expansion than the first metal plate are alternately laminated, the first metal plate and the second metal plate Between the first metal plate and the second metal plate are joined by the brazing material, with a brazing material having a thicker outer peripheral portion than the central portion interposed therebetween ,
The side surface of one metal plate of the first metal plate and the second metal plate is formed so as to be located inside the side surface of the other metal plate, and the outer peripheral side surface of the one metal plate and the A heat radiating member , wherein the brazing filler fillet is formed between the other metal plate surface . The first at least one of the metal plate and the second metal plate, the heat radiating member according to claim 1, wherein the Turkey plate thickness is thin at the outer peripheral portion. The one metal plate is the second metal plate, and the braze fillets formed on both surfaces of the second metal plate are connected, so that the outer peripheral side surface of the second metal plate is made of the brazing material. The heat radiating member according to claim 1 , wherein the heat radiating member is covered. The groove is provided in the lamination surface of the first metal plate and the second metal plate of at least one of the first metal plate and the second metal plate. The heat radiating member in any one of Claim 3 thru | or 3 . The heat radiating member according to claim 4, wherein the groove is provided in a circular shape. The heat dissipation member according to claim 4 , wherein the grooves are provided in a lattice shape . The heat dissipation member according to any one of claims 4 to 6, wherein the groove is provided on the first metal plate side.   The second metal plate has a through hole in the central portion, and a through metal body made of a metal having higher thermal conductivity than the second metal plate is embedded at both ends of the through hole. The heat radiating member according to any one of claims 1 to 7, wherein   The heat radiating member according to any one of claims 1 to 8, wherein the first metal plate is made of copper or silver.   The heat radiating member according to any one of claims 1 to 9, wherein the second metal plate is made of molybdenum, tungsten, a copper-molybdenum sintered body, or a copper-tungsten sintered body.   The heat dissipating member according to any one of claims 1 to 10, wherein the heat dissipating member has an electronic component mounting portion on a surface, a frame attached to the heat dissipating member so as to surround the mounting portion on the inside, and the frame And a wiring conductor for connecting the inside and the outside of the electronic component storage package.   11. The substrate according to claim 1, wherein the substrate has a recess, the wiring conductor is formed from the inside of the recess to the outside of the substrate, the electronic component mounting portion is provided on the surface, and is bonded to the inside of the recess. An electronic component storage package comprising the heat dissipating member described in 1.   12. The electronic component storage package according to claim 11; an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor; and an inner surface of the frame body closed to the upper surface of the frame body. An electronic device comprising: a lid attached to the housing.   The electronic component storage package according to claim 12, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and an inner side of the concave portion being blocked above the concave portion. An electronic device comprising an attached lid.

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