JP2006100410A - Package for storing electronic component, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for storing an electronic component which can operate an electronic component inside the package properly and stably over a long period of time without decreasing the airtight reliability inside the package, by effectively emitting the heat generated by the electronic component out of the package, and which is suitable for mass-productivity; and also to provide an electronic apparatus using the same. <P>SOLUTION: The package for storing an electronic component comprises a flat heat dissipation member 1 having a mounting portion 1e to mount the electronic component 5 at the center of the top face, and a frame 2 which is so installed as to surround the mounting portion 1e on the top face of the heat dissipation member 1 and contains a plurality of wiring conductors 2a. The heat dissipation member 1 consists of a flat substrate 1a, and a top metal plate 1c joined to the top face of the substrate 1a and a bottom metal plate 1b joined to the bottom face of the substrate 1a, both of which are formed of a material having a coefficient of thermal expansion and a thermal conductivity larger than that of the substrate 1a and has a modulus of longitudinal elasticity smaller than that of the substrate 1a. In the substrate 1a, a passage 1d is formed for a cooling liquid which has a belt-like shape in top view and is passed through the top and bottom faces of the substrate 1a. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

  The present invention relates to an electronic component storage package for storing an electronic component such as a semiconductor element, which has a heat dissipation structure with good heat dissipation characteristics, and an electronic device using the same.

Conventionally, an electronic component storage package for storing electronic components such as passive elements such as piezoelectric vibrators and chip capacitors, and active elements using semiconductor elements such as transistors, LSIs, and light emitting elements (hereinafter also simply referred to as packages). consists typically aluminum oxide _(Al 2 _{O 3)} sintered material, aluminum nitride (AlN) sintered material, mullite _{(3Al 2 O 3 · 2SiO 2} ) sintered material, electrical insulating material such as glass ceramic Consists of a frame, a heat dissipation member for dissipating heat generated during the operation of the electronic component to the outside or the atmosphere, and a lid, and mounting the electronic component on the top surface of the heat dissipation member The frame is arranged so as to surround the part, and from the inside to the outside of the recess formed by the frame and the heat dissipation member, tungsten W), molybdenum (Mo), manganese (Mn), copper (Cu), a plurality of wiring conductors made of silver (Ag) or the like is derived is applied to the frame.

  Then, the electronic component is bonded and fixed to the mounting portion on the upper surface of the heat radiating member via an adhesive such as glass, resin, or brazing material, and each electrode of the electronic component is electrically connected to the wiring conductor via a bonding wire. After that, the lid body is joined to the frame body through a sealing material made of glass, resin, brazing material, etc., and the electronic component is accommodated inside the package composed of the heat radiating member, the frame body, and the lid body. Thus, an electronic device as a product is configured.

  In such a package, when an electronic component that generates a large amount of heat, such as a field effect transistor (FET) used for applications such as power amplification, is mounted inside, the heat generated during the operation of the electronic component is transferred to the outside. In order to dissipate well, a heat radiating member having excellent thermal conductivity is provided. Further, as a measure for suppressing the temperature rise of the electronic component, a method of dissipating heat of the electronic component by natural air cooling or forced air cooling by a fan by attaching a heat radiating component such as a heat radiating member to the heat radiating member is widely adopted.

An example of a conventional package including a heat dissipating member having excellent thermal conductivity is shown in the cross-sectional view of FIG. In the figure, 21 is a heat radiating member, 21e is an electronic component mounting portion, 22 is a frame, and 24 is a lid. The heat dissipating member 21 comprises, for example, a lower metal plate 21b and an upper metal plate 21c made of Cu or the like on both upper and lower surfaces of a base 21a made of a metal material impregnated with molten Cu in a porous sintered body of Mo. The outer peripheral portion of the upper main surface of the heat dissipating member 21 has an alumina (Al ₂ O ₃ ) sintered body, an aluminum nitride (AlN) sintered body, mullite (3Al ₂ ) joined so as to surround the mounting portion 21e. A frame 22 made of an electrically insulating material such as an O ₃ .2SiO ₂ ) sintered material and glass ceramics is provided upright. The frame body 22 is provided by being brazed to the base 21 via a brazing material such as Ag brazing.

  The frame body 22 includes a flat plate portion having a wiring conductor 22a formed of a metallized layer on the upper surface and a standing wall portion joined to the upper surface with a part of the wiring conductor 22a interposed therebetween. An external lead terminal 23 is joined to the exposed wiring conductor 22a via a brazing material such as Ag brazing.

  Then, the electronic component 25 is mounted and fixed on the mounting portion 21e of such a package, and the wiring conductor 22a and the electrode of the electronic component 25 are electrically connected via an electrical connection means 26 such as a bonding wire, The lid 24 made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy is brazed onto the upper surface 22 using a brazing material such as gold (Au) -tin (Sn) or seam weld. The electronic device as a product mainly composed of the heat radiating member 21, the frame body 22, the lid body 24, and the electronic component 25 is configured by being attached by a welding method such as a method.

  This electronic device functions as an electronic device for a power amplifier module used in a radio base station or the like by driving the electronic component 25 with an electric signal supplied from an external electric circuit.

  And according to this electronic device, since the electronic component 25 is mounted on the heat dissipation member 21 with good thermal conductivity, the heat generated by the electronic component 25 can be efficiently radiated to the outside via the heat dissipation member 21, It is possible to suppress the temperature rise of the electronic component 25 (see, for example, Patent Document 1).

Conventionally, there has been proposed a power module in which a coolant channel is formed in a heat radiating member made of copper, aluminum, or the like. According to this power module, it is possible to improve the cooling capacity, and further, it is not necessary to use heat radiating parts such as heat radiating fins, and the module can be miniaturized (see, for example, Patent Document 2).
JP 2001-177019 Japanese Patent Laid-Open No. 9-92762

  However, in the heat radiating member 21 of the conventional package, heat generated from the electronic component 25 is transmitted to the outside in the order of the upper metal plate 21c, the base 21a, and the lower metal plate 21b. When the electronic component 25 with a large amount of heat is mounted because the base 21a contains Mo, the heat dissipation becomes insufficient, the temperature of the electronic component 25 rises, and the electronic component 25 malfunctions. There was a problem that there was.

  In addition, if the heat dissipation member 21 for the conventional power module is used in the package, an improvement in cooling capacity can be expected. However, since the heat dissipation member 21 is made of copper, aluminum, or the like, The expansion difference tends to increase, and when the frame body 22 and the electronic component 25 are joined to the heat radiating member 21 with a brazing material or the like, a large thermal stress may act on the frame body 22 and the electronic component 25 in some cases. As a result, breakage such as cracks occurs in the frame body 22 and the electronic component 25, the airtightness inside the package cannot be maintained in the frame body 22, the wiring conductor 22a formed in the frame body 22 is disconnected, and the electronic component 25 Has been damaged and malfunctioned or cannot be operated, and the electronic component 25 cannot be operated normally and stably.

  Also, in order to pierce the coolant channel in the copper plate or aluminum plate, a pipe that becomes the coolant channel is embedded and cast, or a groove is dug into the plate divided in two and bonded together. However, such a heat dissipating member is not suitable for mass production.

  Accordingly, the present invention has been devised in view of the above-mentioned conventional problems, and its purpose is to dissipate the heat generated by the electronic components well to the outside of the package and to reduce the hermetic reliability inside the package. It is an object of the present invention to provide an electronic component storage package suitable for mass production and an electronic device using the same, in which the electronic components in the package can operate normally and stably over a long period of time.

  The electronic component storage package of the present invention includes a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface that is attached to the upper surface of the heat radiating member so as to surround the mounting portion. A frame body having a wiring conductor to be led out, and the heat dissipating member is made of a flat substrate and a material having a larger coefficient of thermal expansion and thermal conductivity and a smaller longitudinal elastic modulus than the substrate. A cooling liquid flow path comprising an upper metal plate bonded to the upper surface of the substrate and a lower metal plate bonded to the lower surface of the substrate, the substrate passing through the upper and lower surfaces and having a band shape in plan view. It is provided.

  In the electronic component storage package according to the present invention, preferably, the coolant flow path is provided so as to be branched into a plurality of flow paths having different cross-sectional areas on the way, and then merge to form one flow path. And the cross-sectional area of the coolant channel provided below the mounting portion is larger than the cross-sectional area of the coolant channel on the outside thereof.

  In the electronic component storage package according to the present invention, preferably, the cooling liquid flow path provided below the mounting portion has a roughened inner surface.

  The electronic device according to the present invention includes the electronic component storage package according to the present invention, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the upper surface of the frame. A lid attached to cover the electronic component or a sealing resin filled to cover the electronic component is provided inside the frame.

  According to the electronic component storage package of the present invention, a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface to an outer surface attached to the upper surface of the heat radiating member so as to surround the mounting portion. The heat dissipation member is made of a flat substrate and a material having a larger coefficient of thermal expansion and thermal conductivity and a smaller longitudinal elastic modulus than the substrate. It consists of an upper metal plate joined to the upper surface and a lower metal plate joined to the lower surface of the base, and the base is provided with a coolant flow path that penetrates the upper and lower surfaces and has a strip shape in plan view. Therefore, in order to match the thermal expansion coefficient of the heat radiating member with the thermal expansion coefficient of the frame and the electronic component, even when the base is made of a material having a low thermal expansion coefficient and a low thermal conductivity, the electronic component mounted on the mounting portion Heat generated By cooling by the cooling liquid flowing through 却液 passage can dramatically improve the cooling capacity. Therefore, damage such as cracks does not occur in the frame and the electronic component, and the electronic component can be operated normally and stably.

  Further, in the heat radiating member, the coolant flow path is formed so as to penetrate the upper and lower surfaces of the base and have a band shape in plan view, and the upper and lower metal plates are joined to the upper and lower surfaces of the base. As a result, the coolant flow path can be formed easily and efficiently. Therefore, it becomes a heat radiating member with the flow path for coolant suitable for mass production.

  As a result, the heat generated by the electronic components inside the package can be dissipated well outside the package, and the electronic components inside the package can operate normally and stably over a long period of time without degrading the airtight reliability inside the package. In addition, an electronic component storage package suitable for mass production can be provided.

  According to the electronic component storage package of the present invention, preferably, in the above configuration, the coolant channel is branched into a plurality of channels having different cross-sectional areas on the way, and then merges into one channel. The cooling liquid flow path provided below the mounting portion is larger in cross-sectional area than the cooling liquid flow path on the outside thereof, so that a large amount and a large area of the cooling liquid can be contained in the heat radiating member. Furthermore, it is possible to flow the cooling liquid intensively below the mounting portion of the electronic component that is a heating element, so that the cooling capacity can be improved and the entire surface of the heat dissipation member can be uniformly cooled. Further, it is possible to effectively prevent breakage such as cracks in the frame body and the electronic component, and to operate the electronic component normally and stably.

  According to the electronic component storage package of the present invention, preferably, in the above configuration, the coolant flow path provided below the mounting portion is roughened because the inner surface is roughened. The surface area of the coolant flow path increases, increasing the surface area, allowing rapid heat transfer to the coolant, and the rough surface unevenness agitates the coolant appropriately, effectively transferring heat to the coolant. Can be performed.

  An electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on a mounting portion and having an electrode electrically connected to a wiring conductor, and an electronic component covered on an upper surface of a frame. And a sealing resin filled so as to cover the electronic component inside the lid body or frame attached to the electronic component housing. An electronic device having the characteristics of a package and capable of operating an electronic component stably over a long period of time can be provided.

Next, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1A is a cross-sectional view showing an example of an embodiment of an electronic component storage package and an electronic device using the same according to the present invention. Reference numeral 1 denotes a mounting portion 1e for an electronic component 5 at the center of the upper surface. A flat plate heat dissipation member, 1a is a flat substrate of the heat dissipation member 1, 1b is a lower metal plate bonded to the lower surface of the substrate 1a of the heat dissipation member 1, and 1c is an upper portion bonded to the upper surface of the substrate 1a of the heat dissipation member 1. The metal plate 2 is a frame body attached to the upper surface of the heat radiating member 1 so as to surround the mounting portion 1 e, 2 a is a wiring conductor led out from the inner surface of the frame body 2 to the outer surface, and 4 is an electron on the upper surface of the frame body 2. The lid 5 attached so as to cover the component 5 is an electronic component. FIG.1 (b) is a top view of the thermal radiation member 1 used with the package and electronic device which are shown to Fig.1 (a).

  The heat dissipation member 1 and the frame 2 constitute an electronic component storage package that stores the electronic component 5. Further, after mounting the electronic component 5 on the mounting portion 1e of the heat radiating member 1, the lid 4 is attached to the upper surface of the frame 2 so as to cover the concave portion formed of the heat radiating member 1 and the frame 2 and the electronic component is mounted. 5 or by sealing the electronic component 5 by filling a recess made of the heat radiating member 1 and the frame body 2 with a sealing resin so as to cover the electronic component 5. The device is configured.

Frame 2, alumina _(Al 2 _{O 3)} sintered material, aluminum nitride (AlN) sintered material, mullite _{(3Al 2 O 3 · 2SiO 2} ) sintered material made of glass ceramic or the like, the brazing material Is attached to the upper surface of the heat radiating member 1 so as to surround the mounting portion 1e. Note that a brazing metal layer (not shown) may be formed at the joint portion of the frame 2 with the heat dissipating member 1 when the brazing material is attached. Further, the frame 2 may be made of metal. In that case, in order to insulate the wiring conductor 2a from the metal constituting the frame 2, the periphery of the wiring conductor 2a is made of an insulator such as ceramics, resin, or glass. Cover it.

  Further, the electronic component 5 is fixed to the heat dissipating member 1 on the mounting portion 1e at the center of the upper surface thereof through an adhesive such as resin, glass, brazing material or the like. Note that when a brazing material is used as the adhesive, a brazing metal layer (not shown) may be formed at a joint portion of the heat radiating member 1 with the electronic component 5. However, when sufficient brazing can be performed by the upper metal plate 1c joined to the mounting portion 1e on the upper surface of the heat radiating member 1, a brazing metal layer is not particularly necessary.

If the frame 2 is made of, for example, an Al ₂ O ₃ sintered material, the raw material powder such as Al ₂ O ₃ , silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO) is used. Appropriate organic binders, solvents, plasticizers, dispersants, etc. are mixed and added to form a slurry, and from this, a ceramic green sheet (ceramic green sheet) is formed by adopting a doctor blade method or a calender roll method. Later, the ceramic green sheet is appropriately punched and mixed with a metal powder such as W, Mo, Mn, Cu, Ag, Ni, Au, and palladium (Pd) with an appropriate organic binder and solvent. After the conductive paste is printed and applied to the green sheet in advance by a screen printing method or the like in a predetermined pattern of the wiring conductor 2a, the conductive paste is applied. The green sheet laminating a plurality, is produced by firing at a temperature of about 1600 ° C..

  In addition, the frame 2 is formed with a plurality of wiring conductors 2a led out from the inner surface (periphery of the mounting portion 1e) of the concave portion constituted by the heat dissipation member 1 and the frame 2 to the outer surface of the frame 2. Each electrode of the electronic component 5 is electrically connected to one end inside the concave portion of the conductor 2a through an electrical connection means 6 such as a bonding wire. In addition, a lead terminal 3 for connection to an external electric circuit board is connected to the other end of the wiring conductor 2a outside the frame 2.

  The wiring conductor 2a is made of a high melting point metal such as W or Mo, and a metal paste obtained by adding and mixing an appropriate organic binder, solvent or the like to a metal powder such as W or Mo is preliminarily applied to the ceramic green sheet serving as the frame 2. By printing and applying in a predetermined pattern by a screen printing method or the like, the heat radiation member 1 and the frame body 2 are deposited from the inner surface of the recess to the outer surface of the frame body 2.

  Further, the wiring conductor 2a is formed by depositing a metal having excellent corrosion resistance such as Ni, Au and the like on the exposed surface and excellent bonding properties of the electrical connection means 6 to a thickness of 1 to 20 μm by plating. The oxidative corrosion of the conductor 2a can be effectively prevented and the connection of the electrical connection means 6 to the wiring conductor 2a can be strengthened. Therefore, it is desirable that the wiring conductor 2a is coated with a metal having excellent corrosion resistance such as Ni and Au and excellent bonding properties on the exposed surface to a thickness of 1 to 20 μm.

  The heat dissipating member 1 of the present invention includes a flat base 1a, an upper metal plate 1c and a base made of a material having a thermal expansion coefficient and a thermal conductivity larger than that of the base 1a bonded to the upper surface of the base 1a. It consists of a lower metal plate 1b made of a material having a larger thermal expansion coefficient and thermal conductivity and smaller longitudinal elastic modulus than the base body 1a joined to the lower surface of the base 1a, and the base body 1a has a continuous channel in a plan view. A coolant flow path 1d that penetrates the upper and lower surfaces is formed so as to be formed.

  The heat radiating member 1 has a function of absorbing heat generated by the operation of the electronic component 5 and dissipating it to the outside of the package or conducting it to an external electric circuit board (not shown). The base body 1a which becomes a part of the heat radiating member 1 is formed, for example, by subjecting a metal plate of Mo, W, iron (Fe) or the like or an alloy thereof to a conventionally known metal processing method such as rolling or punching. First, W powder or Mo powder having an average particle size of 5 to 40 μm is pressure-molded into the shape of the base 1a, and sintered in an atmosphere of 1300 to 1600 ° C. to thereby obtain a porous body to be the base 1a. The porous body is prepared in advance and impregnated with 10 to 50% by mass of Cu at about 1200 ° C. in a hydrogen atmosphere. Thereafter, the portion of the substrate 1a that becomes the coolant flow path 1d is removed by performing a conventionally known metal processing method such as punching or etching, thereby forming the substrate 1a.

  The base 1a formed by impregnating the sintered body made of W or Mo with Cu has improved thermal conductivity as compared with the case where the sintered body made of W or Mo is made simple, and makes the heat radiating member 1 have better heat dissipation characteristics. This is preferable.

  Then, the upper metal plate 1c is joined to the upper surface of the substrate 1a, and the lower metal plate 1b is joined to the lower surface of the substrate 1a, whereby the heat radiating member 1 is formed. The upper metal plate 1c and the lower metal plate 1b are made of materials such as Cu, Ag, aluminum (Al), Au, stainless steel (SUS), etc., which have a higher thermal expansion coefficient and thermal conductivity than the base 1a and a smaller longitudinal elastic modulus. It consists of a metal material or an alloy thereof.

  By using the base 1a made of a material whose thermal expansion coefficient is smaller than the thermal expansion coefficients of the upper metal plate 1c and the lower metal plate 1b and approximates the thermal expansion coefficients of the frame 2 and the electronic component 5, this base 1a is formed in the middle layer. Since the thermal expansion coefficient of the heat radiating member 1 joined is constrained by the thermal expansion coefficient of the base 1 a, the thermal expansion coefficient of the heat radiating member 1 can be approximated to the thermal expansion coefficients of the frame 2 and the electronic component 5. Therefore, the electronic component 5 can be operated normally and stably without causing breakage such as cracks in the frame 2 and the electronic component 5.

  As shown in FIG. 1B, the coolant flow path 1 d is provided in the heat radiating member 1 from the coolant introduction part 11 to the coolant discharge part 12. Then, a coolant introduction pipe is connected to the coolant introduction section 11, and a coolant discharge pipe is connected to the coolant discharge section 12. Thus, by providing the coolant channel 1d in the heat radiating member 1 and continuously flowing a coolant such as water or chlorofluorocarbon from the coolant introduction part 11 toward the coolant discharge part 12, the heat radiating member 1 Heat generated from the electronic component 5 mounted on the mounting portion 1e is transmitted to the coolant flowing through the coolant flow path 1d and is exhausted to the outside by the coolant, so that the cooling capacity can be dramatically improved. As the cooling liquid, pure water or chlorofluorocarbon is preferably used, and the cooling capacity can be very excellent.

  The cooling liquid introduction part 11 and the cooling liquid discharge part 12 are preferably provided so as to be provided one by one, and piping for connecting to the cooling liquid introduction part 11 and the cooling liquid discharge part 12 becomes simple.

  Preferably, each of the coolant introduction part 11 and the coolant discharge part 12 is provided with a base for connecting a pipe, and the coolant introduction part 11 is provided with a pipe for introducing a coolant, and the coolant discharge part 12 It is easy to connect the pipes for discharging the coolant to each other.

  The arrangement of the coolant flow path 1d is provided in the entire heat dissipating member 1 as shown in FIG. 1B, and the mounting portion 1e of the heat dissipating member 1 as shown in FIG. 2A. 2B, or a mode in which the coolant flow path 1d is densely provided immediately below the mounting portion 1e of the heat radiating member 1 and provided on the entire heat radiating member 1 as shown in FIG. Good.

  In the form shown in FIG. 1B, the entire heat dissipating member 1 can be cooled without any problem. In particular, even when a plurality of electronic components 5 are mounted on the substrate, etc., and the heat generating parts are dispersed in various places of the mounting part 1e, the mounting part 1e has a large area. It can cool and can suppress the temperature rise at the time of the operation | movement of the electronic component 5 effectively. As a result, even when the electronic component 5 has a large area, it is possible to effectively prevent the electronic component 5 from rising in temperature and malfunctioning.

  In the embodiment shown in FIG. 2 (a), the cooling liquid channel is directly cooled immediately below the electronic component 5 which is a heat generation source, and directly below the portion where the frame 2 of the heat radiating member 1 is joined. Since 1d is hardly provided, the lower metal plate 1b and the upper metal plate 1c are firmly restrained and fixed by the base 1a, and the thermal expansion coefficient of the heat radiating member 1 is suppressed from increasing, and the frame body 2 is joined. The thermal expansion coefficient of the heat radiating member 1 at the portion to be brought close to the thermal expansion coefficient of the frame body 2 can effectively prevent the frame body 2 from being damaged such as cracks. In particular, when the frame body 2 is made of ceramics, the frame body 2 can be extremely effectively prevented from being damaged by cracks or the like.

  Moreover, the form shown in FIG. 2B is an intermediate form of FIG. 1B and FIG. 2A, and the whole heat radiation member 1 can be cooled and the electronic component 5 which is a heat generation source. In particular, the thermal expansion coefficient of the heat radiating member 1 at the portion to which the frame body 2 is joined is brought close to the thermal expansion coefficient of the frame body 2 to effectively prevent the frame body 2 from being damaged such as cracks. it can. That is, since there are few portions where the coolant flow path 1d intersects immediately below the portion where the frame 2 inside the heat radiating member 1 is joined, the coefficient of thermal expansion of the heat radiating member 1 at the portion where the frame 2 is joined is reduced. This is because the thermal expansion coefficient of the heat dissipating member 1 can be suppressed from being larger than the thermal expansion coefficient of the frame body 2 because it is constrained by the base 1a.

  Preferably, the coolant flow path 1d provided below the mounting portion 1e has a roughened inner surface, so that the surface of the roughened coolant flow path 1d is roughened due to the unevenness of the surface of the coolant flow path 1d. The surface area of the flow path 1d is increased so that heat can be quickly transferred to the cooling liquid, and the cooling liquid is appropriately stirred by the unevenness of the rough surface, so that heat can be efficiently transferred to the cooling liquid. Will be able to.

  In order to roughen the inner surface of the coolant channel 1d, the roughened portions of the base 1a, the lower metal plate 1b, and the upper metal plate 1c may be roughened in advance using sandpaper or the like.

Moreover, it is preferable that a plurality of grooves be provided along the portions of the lower surface of the upper metal plate 1c and the upper surface of the lower metal plate 1b that serve as the wall surfaces of the coolant channel 1d. Since the contact area between the upper metal plate 1c and the lower metal plate 1b and the coolant can be increased by this groove, heat exchange from the upper metal plate 1c to the coolant and heat exchange from the coolant to the lower metal plate 1b are performed. The cooling effect can be enhanced. Further, the coolant in the groove can be agitated by changing the depth of the groove.
As described above, the arrangement of the coolant flow path 1d can be variously arranged according to the purpose. However, when the frame 2 made of ceramics is provided, preferably, as shown in FIG. It is preferable that the coolant flow path 1d is provided only directly below the mounting portion 1e of the electronic component 5, and the frame body 2 can be reliably prevented from being damaged by cracks or the like.

  Preferably, as shown in FIG. 3, the coolant flow path 1 d is provided in a parallel circuit shape that is branched into a plurality of flow paths having different cross-sectional areas along the way, and then merges into one flow path. It is good to be. With this configuration, it is possible to flow a large amount of cooling liquid in the heat radiating member 1 over a wide area, further improving the cooling efficiency and thereby improving the cooling capacity. And since the cooling capability of the heat radiating member 1 can be changed according to the position of the heating element such as the electronic component 5, the heat radiating member 1 can be cooled efficiently and more uniformly, and the thermal expansion of the heat radiating member 1 can be suppressed. Therefore, it is possible to effectively prevent the frame 2 and the electronic component 5 from being damaged such as cracks, and to operate the electronic component 5 extremely normally and stably.

  Also in this case, similarly to the above, the coolant channel 1d may be provided on the entire heat radiating member 1 or may be provided just below the electronic component 5 that is a heat generation source. When the frame 2 made of ceramics is provided, it is preferable that the coolant flow path 1d is provided only directly below the mounting portion 1e of the electronic component 5.

  Further, in the coolant flow path 1d, the cross-sectional area of the coolant flow path 1d provided below the mounting portion 1e is preferably larger than the cross-sectional area of the coolant flow path 1d outside. With this configuration, it is possible to efficiently dissipate the heat generated from the electronic component 5 to the outside through the cooling liquid so that the flow rate of the cooling liquid increases immediately below the mounting portion 1e of the electronic component 5 that is a heating element. it can. As the temperature of the heat dissipating member 1 is reduced by the heat generated from the electronic component 5 as the distance from the lower portion of the mounting portion 1e of the electronic component 5 decreases, Even if the cross-sectional area is reduced, the heat generated from the electronic component 5 can be dissipated to the outside sufficiently efficiently through the coolant.

  In FIG. 3, the edge of the mounting portion 1 e of the electronic component 5 is preferably located inside the outermost edge of the coolant channel 1 d, thereby cooling the heat generated from the electronic component 5. It can be efficiently diffused to the outside through the liquid.

  The lower metal plate 1b bonded to the lower surface of the substrate 1a and the upper metal plate 1c bonded to the upper surface of the substrate 1a are connected to the lower metal plate 1b and the upper metal plate 1c via a brazing material such as Ag brazing or Ag-Cu brazing. Are formed by joining.

  Here, preferably, the thickness of the lower metal plate 1b and the upper metal plate 1c is about 1.5 to 4 times thicker than the thickness of the base 1a. With this configuration, the heat radiating member 1 is supported by the lower metal plate 1b and the upper metal plate 1c positioned above and below the coolant flow channel 1d at the portion where the coolant flow channel 1d is provided, and the heat radiating member 1 is When fixing to the circuit board with screws or the like, the heat radiating member 1 is hardly deformed even at the portion where the coolant flow path 1d of the heat radiating member 1 is located, so that the heat radiating member 1 is effectively prevented from being deformed. can do. Further, when the coolant flows through the coolant channel 1d, the lower metal plate 1b and the upper metal plate 1c positioned above and below the coolant channel 1d are deformed by the liquid pressure of the coolant. The heat dissipation member 1 is maintained flat and the heat dissipation member 1 and the electronic component 5, the heat dissipation member 1 and the external electric circuit board are brought into close contact with each other to efficiently dissipate heat generated from the electronic component 5 to the outside. Can be made.

  In addition, the arithmetic average roughness Ra of the lower surface side of the heat radiating member 1, that is, the lower surface of the lower metal plate 1b opposite to the mounting portion 1e on which the electronic component 5 is mounted is Ra ≦ 30 (μm). preferable. Usually, the electronic component storage package is connected to a support substrate made of a metal body such as Al or Cu or a ceramic body having high thermal conductivity by screwing. At this time, when the arithmetic average roughness Ra of the lower surface of the lower metal plate 1b on the lower surface of the base 1a is Ra> 30 (μm), it is difficult to sufficiently adhere the electronic component storage package and the support substrate. There is a possibility that heat generated in the electronic component 5 cannot be efficiently transferred from the electronic component storage package to the support substrate. Accordingly, it is desirable that the lower surface, which is the outer surface of the lower metal plate 1b, is a smooth surface with Ra ≦ 30 (μm) so as to obtain good adhesion to the support substrate.

  When the material of the lower metal plate 1b and the upper metal plate 1c formed on the upper and lower surfaces of the base 1a of the heat radiating member 1 is made of Cu, it is not limited to pure Cu, and has good thermal conductivity and W or Various Cu alloys containing Cu as a main component may be used as long as sufficient bonding strength can be obtained with a metal such as Mo or the substrate 1a which is a matrix of these and Cu.

  Also, other materials such as Ag, Al, etc., which have a higher thermal expansion coefficient and thermal conductivity and a smaller longitudinal elastic modulus than the base 1a, need not be pure metals as described above.

  Further, although not shown, preferably, the upper metal plate 1c may be provided so as to wrap around the side surface of the base 1a at the end thereof and be in contact with the lower metal plate 1b. With this configuration, heat generated from the electronic component 5 mounted on the mounting portion 1e is not only transmitted in the order of the upper metal plate 1c, the base 1a, and the lower metal plate 1b, but is also formed from the upper surface to the side surface of the base 1a. Since it can be directly transmitted to the lower metal plate 1b via the upper metal plate 1c, heat can be efficiently transmitted to the lower metal plate 1b and heat generated from the electronic component can be efficiently dissipated from the lower metal plate. it can. In this case, it is not necessary to be in contact with the lower metal plate 1b over the entire circumference, and it is sufficient that the upper metal plate 1c is in contact with the lower metal plate 1b even at a part thereof. For example, when the base 1a is a rectangle, the upper metal plate 1c may be in contact with the lower metal plate 1b on the side surfaces of the two opposite sides of the base 1a. Also in this configuration, the heat generated from the electronic component 5 can be dissipated sufficiently efficiently from the lower metal plate 1b.

  Thus, according to the above-described package, the electronic component 5 is bonded and fixed onto the mounting portion 1e of the heat radiating member 1 via an adhesive made of glass, resin, brazing material, etc., and each electrode of the electronic component 5 is bonded to the bonding wire. Electrically connected to a predetermined wiring conductor 2a via an electrical connecting means 6 such as an epoxy resin, and then an epoxy resin or the like so as to cover the electronic component 5 inside the recess formed by the heat radiating member 1 and the frame 2 The electronic component 5 is sealed by filling the sealing resin with the sealing resin, or by attaching the lid 4 made of resin, metal, ceramics or the like so as to cover the recess on the upper surface of the frame 2. By sealing, an electronic device as a product is obtained.

  In addition, this invention is not limited to the example of the above embodiment, A various change is possible if it is the range which does not deviate from the summary of this invention. For example, a ceramic circuit board having the function of the frame 2 is mounted instead of the discrete electronic component 5 on the mounting portion 1e on the upper surface of the heat radiating member 1, and the electronic component 5 is mounted on the circuit board. Good. With this configuration, heat generated from the electronic component 5 mounted on the circuit board can be efficiently dissipated without causing damage such as cracks on the circuit board.

(A) is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention and the electronic device of this invention using the same, (b) is the electronic component storage package of this invention shown to (a) It is a top view of the heat radiating member used with an electronic device. (A), (b) shows the other example of embodiment of the electronic component storage package of this invention and the electronic device of this invention using the same, and is used with the electronic component storage package and electronic device of this invention It is a top view of the heat radiating member. FIG. 6 is a plan view of a heat dissipation member used in the electronic component storage package and the electronic device of the present invention, showing another example of the embodiment of the electronic component storage package of the present invention and the electronic device of the present invention using the same. . It is sectional drawing which shows the example of the conventional electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Heat dissipation member 1a: Base | substrate 1b: Lower metal plate 1c: Upper metal plate 1d: Coolant flow path 1e: Mounting part 2: Frame body 2a: Wiring conductor 4: Cover body 5: Electronic component

Claims (4)

A flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and a frame having a wiring conductor led out from the inner surface to the outer surface, and attached to the upper surface of the heat radiating member so as to surround the mounting portion; The heat dissipating member comprises a flat base, and an upper metal bonded to the upper surface of the base, made of a material having a larger coefficient of thermal expansion and thermal conductivity and a smaller longitudinal elastic modulus than the base. An electronic device comprising: a plate and a lower metal plate joined to a lower surface of the base body, wherein the base body is provided with a coolant flow path penetrating the upper and lower surfaces and having a band shape in plan view. Parts storage package. The coolant channel is divided into a plurality of channels having different cross-sectional areas on the way, and then merged into a single channel. The coolant channel is provided below the mounting portion. 2. The electronic component storage package according to claim 1, wherein a cross-sectional area of the flow path is larger than a cross-sectional area of the cooling liquid flow path outside the flow path. 3. The electronic component storage package according to claim 1, wherein an inner surface of the coolant flow path provided below the mounting portion is roughened. 4. The electronic component storage package according to any one of claims 1 to 3, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and an upper surface of the frame body An electronic device comprising: a lid attached to cover the electronic component; or a sealing resin filled inside the frame so as to cover the electronic component.

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