JP2006100410A - Package for storing electronic component, and electronic apparatus - Google Patents

Package for storing electronic component, and electronic apparatus Download PDF

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Publication number
JP2006100410A
JP2006100410A JP2004282380A JP2004282380A JP2006100410A JP 2006100410 A JP2006100410 A JP 2006100410A JP 2004282380 A JP2004282380 A JP 2004282380A JP 2004282380 A JP2004282380 A JP 2004282380A JP 2006100410 A JP2006100410 A JP 2006100410A
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electronic component
mounting portion
metal plate
package
substrate
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Yoshiaki Ueda
義明 植田
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Kyocera Corp
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Kyocera Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for storing an electronic component which can operate an electronic component inside the package properly and stably over a long period of time without decreasing the airtight reliability inside the package, by effectively emitting the heat generated by the electronic component out of the package, and which is suitable for mass-productivity; and also to provide an electronic apparatus using the same. <P>SOLUTION: The package for storing an electronic component comprises a flat heat dissipation member 1 having a mounting portion 1e to mount the electronic component 5 at the center of the top face, and a frame 2 which is so installed as to surround the mounting portion 1e on the top face of the heat dissipation member 1 and contains a plurality of wiring conductors 2a. The heat dissipation member 1 consists of a flat substrate 1a, and a top metal plate 1c joined to the top face of the substrate 1a and a bottom metal plate 1b joined to the bottom face of the substrate 1a, both of which are formed of a material having a coefficient of thermal expansion and a thermal conductivity larger than that of the substrate 1a and has a modulus of longitudinal elasticity smaller than that of the substrate 1a. In the substrate 1a, a passage 1d is formed for a cooling liquid which has a belt-like shape in top view and is passed through the top and bottom faces of the substrate 1a. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

本発明は良好な放熱特性の放熱構造を有する、半導体素子などの電子部品を収納するための電子部品収納用パッケージおよびそれを用いた電子装置に関するものである。   The present invention relates to an electronic component storage package for storing an electronic component such as a semiconductor element, which has a heat dissipation structure with good heat dissipation characteristics, and an electronic device using the same.

従来、圧電振動子,チップコンデンサ等の受動素子や、トランジスタ,LSI,発光素子等の半導体素子を用いる能動素子等の電子部品を収容するための電子部品収納用パッケージ(以下、単にパッケージともいう)は、一般に酸化アルミニウム(Al)質焼結体,窒化アルミニウム(AlN)質焼結体,ムライト(3Al・2SiO)質焼結体,ガラスセラミックス等の電気絶縁材料から成る枠体と、電子部品が搭載されてその動作時に発生する熱を外部もしくは大気中に良好に放散させるための放熱部材と、蓋体とから構成されており、放熱部材の上面の電子部品の搭載部を取り囲むように枠体が配置されているとともに、これら枠体および放熱部材によって形成される凹部の内側から外側にかけて、タングステン(W),モリブデン(Mo),マンガン(Mn),銅(Cu),銀(Ag)等から成る複数の配線導体が枠体に被着され導出されている。 Conventionally, an electronic component storage package for storing electronic components such as passive elements such as piezoelectric vibrators and chip capacitors, and active elements using semiconductor elements such as transistors, LSIs, and light emitting elements (hereinafter also simply referred to as packages). consists typically aluminum oxide (Al 2 O 3) sintered material, aluminum nitride (AlN) sintered material, mullite (3Al 2 O 3 · 2SiO 2 ) sintered material, electrical insulating material such as glass ceramic Consists of a frame, a heat dissipation member for dissipating heat generated during the operation of the electronic component to the outside or the atmosphere, and a lid, and mounting the electronic component on the top surface of the heat dissipation member The frame is arranged so as to surround the part, and from the inside to the outside of the recess formed by the frame and the heat dissipation member, tungsten W), molybdenum (Mo), manganese (Mn), copper (Cu), a plurality of wiring conductors made of silver (Ag) or the like is derived is applied to the frame.

そして、放熱部材の上面の搭載部に電子部品をガラス,樹脂,ロウ材等の接着剤を介して接着固定するとともに、この電子部品の各電極をボンディングワイヤを介して配線導体に電気的に接続し、しかる後、枠体に蓋体をガラス,樹脂,ロウ材等から成る封止材を介して接合し、放熱部材と枠体と蓋体とから成るパッケージの内部に電子部品を収容することによって製品としての電子装置が構成される。   Then, the electronic component is bonded and fixed to the mounting portion on the upper surface of the heat radiating member via an adhesive such as glass, resin, or brazing material, and each electrode of the electronic component is electrically connected to the wiring conductor via a bonding wire. After that, the lid body is joined to the frame body through a sealing material made of glass, resin, brazing material, etc., and the electronic component is accommodated inside the package composed of the heat radiating member, the frame body, and the lid body. Thus, an electronic device as a product is configured.

このようなパッケージにおいて、電力増幅等の用途に用いられる電界効果トランジスタ(FET)に代表されるような発熱量が大きな電子部品を内部に搭載する場合、電子部品の作動時に発生する熱を外部に良好に放散させるために、熱伝導性に優れた放熱部材が備えられている。さらに、電子部品の温度上昇を抑制する対策として、放熱部材に放熱用フィン等の放熱用部品を取り付けて自然空冷あるいはファンによる強制空冷で電子部品の熱を放散する方法が広く採用されている。   In such a package, when an electronic component that generates a large amount of heat, such as a field effect transistor (FET) used for applications such as power amplification, is mounted inside, the heat generated during the operation of the electronic component is transferred to the outside. In order to dissipate well, a heat radiating member having excellent thermal conductivity is provided. Further, as a measure for suppressing the temperature rise of the electronic component, a method of dissipating heat of the electronic component by natural air cooling or forced air cooling by a fan by attaching a heat radiating component such as a heat radiating member to the heat radiating member is widely adopted.

従来の熱伝導性に優れた放熱部材を備えたパッケージの一例を図5の断面図に示す。同図において、21は放熱部材、21eは電子部品の搭載部、22は枠体、24は蓋体である。放熱部材21は、例えばMoの多孔質焼結体に溶融したCuを含浸させた金属材料から成る基体21aの上下両面にそれぞれCu等から成る下部金属板21bおよび上部金属板21cを設けることで成り、放熱部材21の上側主面の外周部には、搭載部21eを取り囲むように接合されたアルミナ(Al)質焼結体,窒化アルミニウム(AlN)質焼結体,ムライト(3Al・2SiO)質焼結体,ガラスセラミックス等の電気絶縁材料から成る枠体22が立設されている。この枠体22は、基体21にAgロウなどのロウ材を介してロウ付けされることにより設けられる。 An example of a conventional package including a heat dissipating member having excellent thermal conductivity is shown in the cross-sectional view of FIG. In the figure, 21 is a heat radiating member, 21e is an electronic component mounting portion, 22 is a frame, and 24 is a lid. The heat dissipating member 21 comprises, for example, a lower metal plate 21b and an upper metal plate 21c made of Cu or the like on both upper and lower surfaces of a base 21a made of a metal material impregnated with molten Cu in a porous sintered body of Mo. The outer peripheral portion of the upper main surface of the heat dissipating member 21 has an alumina (Al 2 O 3 ) sintered body, an aluminum nitride (AlN) sintered body, mullite (3Al 2 ) joined so as to surround the mounting portion 21e. A frame 22 made of an electrically insulating material such as an O 3 .2SiO 2 ) sintered material and glass ceramics is provided upright. The frame body 22 is provided by being brazed to the base 21 via a brazing material such as Ag brazing.

枠体22は、上面にメタライズ層から成る配線導体22aが形成された平板部とこの上面に配線導体22aの一部を間に挟んで接合された立壁部とからなり、枠体22の外側の露出した配線導体22a上には外部リード端子23がAgロウなどのロウ材を介して接合されている。   The frame body 22 includes a flat plate portion having a wiring conductor 22a formed of a metallized layer on the upper surface and a standing wall portion joined to the upper surface with a part of the wiring conductor 22a interposed therebetween. An external lead terminal 23 is joined to the exposed wiring conductor 22a via a brazing material such as Ag brazing.

そして、このようなパッケージの搭載部21eに電子部品25を搭載固定するとともに配線導体22aと電子部品25の電極とをボンディングワイヤ等の電気的接続手段26を介して電気的に接続し、枠体22の上面に鉄(Fe)−ニッケル(Ni)−コバルト(Co)合金などの金属から成る蓋体24を金(Au)−錫(Sn)などのロウ材を用いたロウ付け法やシームウエルド法などの溶接法で取着することにより、主にこれら放熱部材21、枠体22、蓋体24および電子部品25から成る製品としての電子装置が構成されている。   Then, the electronic component 25 is mounted and fixed on the mounting portion 21e of such a package, and the wiring conductor 22a and the electrode of the electronic component 25 are electrically connected via an electrical connection means 26 such as a bonding wire, The lid 24 made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy is brazed onto the upper surface 22 using a brazing material such as gold (Au) -tin (Sn) or seam weld. The electronic device as a product mainly composed of the heat radiating member 21, the frame body 22, the lid body 24, and the electronic component 25 is configured by being attached by a welding method such as a method.

この電子装置は、外部電気回路から供給される電気信号によって電子部品25を駆動することで無線基地局などに用いられるパワーアンプモジュール用などの電子装置として機能する。   This electronic device functions as an electronic device for a power amplifier module used in a radio base station or the like by driving the electronic component 25 with an electric signal supplied from an external electric circuit.

そして、この電子装置によれば、電子部品25を熱伝導性のよい放熱部材21上に搭載するため、電子部品25が発する熱を放熱部材21を介して外部に効率よく放熱することができ、電子部品25の温度上昇を抑制すことが可能になるというものである(例えば、特許文献1参照)。   And according to this electronic device, since the electronic component 25 is mounted on the heat dissipation member 21 with good thermal conductivity, the heat generated by the electronic component 25 can be efficiently radiated to the outside via the heat dissipation member 21, It is possible to suppress the temperature rise of the electronic component 25 (see, for example, Patent Document 1).

また従来、パワーモジュールにおいて、銅やアルミニウム等から成る放熱部材に冷却液用流路が穿設されて成るものが提案されている。このパワーモジュールによれば、冷却能力を向上でき、しかも放熱用フィン等の放熱用部品が不要となり、モジュールを小型化させることが可能となるというものである(例えば、特許文献2参照)。
特開2001−177019号公報 特開平9−92762号公報
Conventionally, there has been proposed a power module in which a coolant channel is formed in a heat radiating member made of copper, aluminum, or the like. According to this power module, it is possible to improve the cooling capacity, and further, it is not necessary to use heat radiating parts such as heat radiating fins, and the module can be miniaturized (see, for example, Patent Document 2).
JP 2001-177019 Japanese Patent Laid-Open No. 9-92762

しかしながら、上記従来のパッケージの放熱部材21では、電子部品25から発生した熱は、上部金属板21c,基体21a,下部金属板21bの順に伝達して外部へ放散されるが、熱伝達経路の途中となる基体21aにMoを含有しているため、発熱量の多い電子部品25を搭載した場合、熱放散性が不十分となって、電子部品25が温度上昇し、電子部品25が誤動作する場合があるという問題点があった。   However, in the heat radiating member 21 of the conventional package, heat generated from the electronic component 25 is transmitted to the outside in the order of the upper metal plate 21c, the base 21a, and the lower metal plate 21b. When the electronic component 25 with a large amount of heat is mounted because the base 21a contains Mo, the heat dissipation becomes insufficient, the temperature of the electronic component 25 rises, and the electronic component 25 malfunctions. There was a problem that there was.

また、パッケージにおいて、上記従来のパワーモジュール用の放熱部材21を用いると、冷却能力の向上が期待できるが、放熱部材21が銅やアルミニウム等から成るため、枠体22や電子部品25との熱膨張差が大きくなる傾向にあり、放熱部材21に枠体22および電子部品25をロウ材等によって接合する際に、枠体22および電子部品25に大きな熱応力が作用する場合があった。その結果、枠体22および電子部品25にクラック等の破損が生じて、枠体22においてパッケージ内部の気密を保持できなくなるとともに枠体22に形成された配線導体22aが断線し、かつ電子部品25が破損して誤作動したり作動できなくなったりしてしまい、電子部品25を正常かつ安定に作動させることができなくなるという問題点があった。   In addition, if the heat dissipation member 21 for the conventional power module is used in the package, an improvement in cooling capacity can be expected. However, since the heat dissipation member 21 is made of copper, aluminum, or the like, The expansion difference tends to increase, and when the frame body 22 and the electronic component 25 are joined to the heat radiating member 21 with a brazing material or the like, a large thermal stress may act on the frame body 22 and the electronic component 25 in some cases. As a result, breakage such as cracks occurs in the frame body 22 and the electronic component 25, the airtightness inside the package cannot be maintained in the frame body 22, the wiring conductor 22a formed in the frame body 22 is disconnected, and the electronic component 25 Has been damaged and malfunctioned or cannot be operated, and the electronic component 25 cannot be operated normally and stably.

また、銅板やアルミニウム板に冷却液用流路を穿設するために、冷却液用流路となる管を埋設して鋳造したり、二つ割りにした板に溝を掘り込んで貼り合せたりするのが困難であり、このような放熱部材は量産に適さないという問題点があった。   Also, in order to pierce the coolant channel in the copper plate or aluminum plate, a pipe that becomes the coolant channel is embedded and cast, or a groove is dug into the plate divided in two and bonded together. However, such a heat dissipating member is not suitable for mass production.

従って、本発明は上記従来の問題点に鑑み案出されたものであり、その目的は、電子部品の発した熱をパッケージの外部に良好に放散させ、パッケージ内部の気密信頼性を低下させることがなく、パッケージ内部の電子部品を長期間にわたり正常かつ安定に作動させることができ、かつ量産に適した電子部品収納用パッケージおよびそれを用いた電子装置を提供することにある。   Accordingly, the present invention has been devised in view of the above-mentioned conventional problems, and its purpose is to dissipate the heat generated by the electronic components well to the outside of the package and to reduce the hermetic reliability inside the package. It is an object of the present invention to provide an electronic component storage package suitable for mass production and an electronic device using the same, in which the electronic components in the package can operate normally and stably over a long period of time.

本発明の電子部品収納用パッケージは、上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、この放熱部材の上面に前記搭載部を取り囲んで取着された、内面から外面に導出される配線導体を有する枠体とを具備しており、前記放熱部材は、平板状の基体と、この基体よりも熱膨張係数および熱伝導率が大きくかつ縦弾性係数が小さい材料から成る、前記基体の上面に接合された上部金属板および前記基体の下面に接合された下部金属板とから成り、前記基体はその上下面を貫通するとともに平面視形状が帯状である冷却液用流路が設けられていることを特徴とする。   The electronic component storage package of the present invention includes a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface that is attached to the upper surface of the heat radiating member so as to surround the mounting portion. A frame body having a wiring conductor to be led out, and the heat dissipating member is made of a flat substrate and a material having a larger coefficient of thermal expansion and thermal conductivity and a smaller longitudinal elastic modulus than the substrate. A cooling liquid flow path comprising an upper metal plate bonded to the upper surface of the substrate and a lower metal plate bonded to the lower surface of the substrate, the substrate passing through the upper and lower surfaces and having a band shape in plan view. It is provided.

本発明の電子部品収納用パッケージは、上記構成において好ましくは、前記冷却液用流路は、途中で複数の断面積が異なる流路に分岐され、その後合流し一つの流路となるように設けられており、前記搭載部の下方に設けられる前記冷却液用流路の断面積がその外側の前記冷却液用流路の断面積より大きいことを特徴とする。   In the electronic component storage package according to the present invention, preferably, the coolant flow path is provided so as to be branched into a plurality of flow paths having different cross-sectional areas on the way, and then merge to form one flow path. And the cross-sectional area of the coolant channel provided below the mounting portion is larger than the cross-sectional area of the coolant channel on the outside thereof.

また本発明の電子部品収納用パッケージは、上記構成において好ましくは、前記搭載部の下方に設けられる前記冷却液用流路は、その内面が粗面化されていることを特徴とする。   In the electronic component storage package according to the present invention, preferably, the cooling liquid flow path provided below the mounting portion has a roughened inner surface.

本発明の電子装置は、上記本発明の電子部品収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された前記電子部品と、前記枠体の上面に前記電子部品を覆うように取着された蓋体または前記枠体の内側に前記電子部品を覆うように充填された封止樹脂とを具備していることを特徴とする。   The electronic device according to the present invention includes the electronic component storage package according to the present invention, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the upper surface of the frame. A lid attached to cover the electronic component or a sealing resin filled to cover the electronic component is provided inside the frame.

本発明の電子部品収納用パッケージによれば、上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、放熱部材の上面に搭載部を取り囲んで取着された、内面から外面に導出される配線導体を有する枠体とを具備しており、放熱部材は、平板状の基体と、基体よりも熱膨張係数および熱伝導率が大きくかつ縦弾性係数が小さい材料から成る、基体の上面に接合された上部金属板および基体の下面に接合された下部金属板とから成り、基体はその上下面を貫通するとともに平面視形状が帯状である冷却液用流路が設けられていることから、放熱部材の熱膨張係数を枠体および電子部品の熱膨張係数に合わせるため、基体が熱膨張係数の小さい熱伝導率の低い材料から成る場合においても、搭載部に搭載された電子部品から発生する熱を冷却液用流路を流れる冷却液によって冷却することにより、冷却能力を飛躍的に向上できる。従って、枠体および電子部品にクラック等の破損が生じることがなく、電子部品を正常かつ安定に作動させることができるようになる。   According to the electronic component storage package of the present invention, a flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and an inner surface to an outer surface attached to the upper surface of the heat radiating member so as to surround the mounting portion. The heat dissipation member is made of a flat substrate and a material having a larger coefficient of thermal expansion and thermal conductivity and a smaller longitudinal elastic modulus than the substrate. It consists of an upper metal plate joined to the upper surface and a lower metal plate joined to the lower surface of the base, and the base is provided with a coolant flow path that penetrates the upper and lower surfaces and has a strip shape in plan view. Therefore, in order to match the thermal expansion coefficient of the heat radiating member with the thermal expansion coefficient of the frame and the electronic component, even when the base is made of a material having a low thermal expansion coefficient and a low thermal conductivity, the electronic component mounted on the mounting portion Heat generated By cooling by the cooling liquid flowing through 却液 passage can dramatically improve the cooling capacity. Therefore, damage such as cracks does not occur in the frame and the electronic component, and the electronic component can be operated normally and stably.

また、放熱部材において、冷却液用流路は基体の上下面を貫通するとともに平面視形状が帯状であるように穿設し、この基体の上下面に上部金属板および下部金属板を接合することにより、冷却液用流路を容易かつ効率良く形成できるようになる。従って、量産に適した冷却液用流路付きの放熱部材となる。   Further, in the heat radiating member, the coolant flow path is formed so as to penetrate the upper and lower surfaces of the base and have a band shape in plan view, and the upper and lower metal plates are joined to the upper and lower surfaces of the base. As a result, the coolant flow path can be formed easily and efficiently. Therefore, it becomes a heat radiating member with the flow path for coolant suitable for mass production.

以上により、パッケージ内部の電子部品の発した熱をパッケージ外部に良好に放散させ、パッケージ内部の気密信頼性を低下させることがなく、パッケージ内部の電子部品を長期間にわたり正常かつ安定に作動させることができ、かつ量産に適した電子部品収納用パッケージを提供することができる。   As a result, the heat generated by the electronic components inside the package can be dissipated well outside the package, and the electronic components inside the package can operate normally and stably over a long period of time without degrading the airtight reliability inside the package. In addition, an electronic component storage package suitable for mass production can be provided.

本発明の電子部品収納用パッケージによれば、上記構成において好ましくは、冷却液用流路は、途中で複数の断面積が異なる流路に分岐され、その後合流し一つの流路となるように設けられており、搭載部の下方に設けられる冷却液用流路の断面積がその外側の前記冷却液用流路の断面積より大きいことにより、放熱部材内に冷却液を大量にかつ広い面積に流すことができ、さらに発熱体である電子部品の搭載部の下方に重点的に冷却液を流すことができ、冷却能力を向上できるとともに放熱部材の全面を均一に冷却することができる。そして、枠体および電子部品にクラック等の破損が生じるのを有効に防止し、電子部品を正常かつ安定に作動させることができるようになる。   According to the electronic component storage package of the present invention, preferably, in the above configuration, the coolant channel is branched into a plurality of channels having different cross-sectional areas on the way, and then merges into one channel. The cooling liquid flow path provided below the mounting portion is larger in cross-sectional area than the cooling liquid flow path on the outside thereof, so that a large amount and a large area of the cooling liquid can be contained in the heat radiating member. Furthermore, it is possible to flow the cooling liquid intensively below the mounting portion of the electronic component that is a heating element, so that the cooling capacity can be improved and the entire surface of the heat dissipation member can be uniformly cooled. Further, it is possible to effectively prevent breakage such as cracks in the frame body and the electronic component, and to operate the electronic component normally and stably.

また本発明の電子部品収納用パッケージによれば、上記構成において好ましくは、搭載部の下方に設けられる冷却液用流路は、その内面が粗面化されていることから、粗面化された冷却液用流路の表面の凹凸によって表面積が大きくなり、冷却液に迅速な熱伝達が行なえるとともに、粗面の凹凸によって冷却液が適度に撹拌されるので、冷却液に効率的に熱伝達を行なうことができるものとなる。   According to the electronic component storage package of the present invention, preferably, in the above configuration, the coolant flow path provided below the mounting portion is roughened because the inner surface is roughened. The surface area of the coolant flow path increases, increasing the surface area, allowing rapid heat transfer to the coolant, and the rough surface unevenness agitates the coolant appropriately, effectively transferring heat to the coolant. Can be performed.

本発明の電子装置は、上記本発明の電子部品収納用パッケージと、搭載部に搭載されるとともに電極が配線導体に電気的に接続された電子部品と、枠体の上面に電子部品を覆うように取着された蓋体または枠体の内側に電子部品を覆うように充填された封止樹脂とを具備していることから、電子部品の放熱特性が極めて良好な本発明の電子部品収納用パッケージの特徴を備え、長期にわたって安定して電子部品が作動する電子装置を提供することができる。   An electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on a mounting portion and having an electrode electrically connected to a wiring conductor, and an electronic component covered on an upper surface of a frame. And a sealing resin filled so as to cover the electronic component inside the lid body or frame attached to the electronic component housing. An electronic device having the characteristics of a package and capable of operating an electronic component stably over a long period of time can be provided.

次に、本発明を添付図面に基づき詳細に説明する。
図1(a)は本発明の電子部品収納用パッケージおよびこれを用いた電子装置の実施の形態の一例を示す断面図であり、1は上面の中央部に電子部品5の搭載部1eを有する平板状の放熱部材、1aは放熱部材1の平板状の基体、1bは放熱部材1の基体1aの下面に接合された下部金属板、1cは放熱部材1の基体1aの上面に接合された上部金属板、2は放熱部材1の上面に搭載部1eを取り囲んで取着された枠体、2aは枠体2の内面から外面に導出されている配線導体、4は枠体2の上面に電子部品5を覆うように取着された蓋体、5は電子部品である。図1(b)は図1(a)に示すパッケージおよび電子装置で用いられる放熱部材1の平面図である。
Next, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1A is a cross-sectional view showing an example of an embodiment of an electronic component storage package and an electronic device using the same according to the present invention. Reference numeral 1 denotes a mounting portion 1e for an electronic component 5 at the center of the upper surface. A flat plate heat dissipation member, 1a is a flat substrate of the heat dissipation member 1, 1b is a lower metal plate bonded to the lower surface of the substrate 1a of the heat dissipation member 1, and 1c is an upper portion bonded to the upper surface of the substrate 1a of the heat dissipation member 1. The metal plate 2 is a frame body attached to the upper surface of the heat radiating member 1 so as to surround the mounting portion 1 e, 2 a is a wiring conductor led out from the inner surface of the frame body 2 to the outer surface, and 4 is an electron on the upper surface of the frame body 2. The lid 5 attached so as to cover the component 5 is an electronic component. FIG.1 (b) is a top view of the thermal radiation member 1 used with the package and electronic device which are shown to Fig.1 (a).

これら放熱部材1と枠体2とで電子部品5を収納する電子部品収納用パッケージが構成される。また、この放熱部材1の搭載部1eに電子部品5を搭載した後に、枠体2の上面に蓋体4を放熱部材1と枠体2とから成る凹部を覆うように取着して電子部品5を封止することにより、または、放熱部材1と枠体2とから成る凹部に電子部品5を覆うように封止樹脂を充填して電子部品5を封止することにより、本発明の電子装置が構成される。   The heat dissipation member 1 and the frame 2 constitute an electronic component storage package that stores the electronic component 5. Further, after mounting the electronic component 5 on the mounting portion 1e of the heat radiating member 1, the lid 4 is attached to the upper surface of the frame 2 so as to cover the concave portion formed of the heat radiating member 1 and the frame 2 and the electronic component is mounted. 5 or by sealing the electronic component 5 by filling a recess made of the heat radiating member 1 and the frame body 2 with a sealing resin so as to cover the electronic component 5. The device is configured.

枠体2は、アルミナ(Al)質焼結体,窒化アルミニウム(AlN)質焼結体,ムライト(3Al・2SiO)質焼結体,ガラスセラミックス等から成り、ロウ材を介して放熱部材1の上面に搭載部1eを取り囲んで取着される。なお、このロウ材による取着に際しては、ロウ付け用の金属層(図示せず)が枠体2の放熱部材1との接合部に形成されてもよい。また、枠体2は金属から構成されていてもよく、その場合、配線導体2aを枠体2を構成する金属と絶縁させるために配線導体2aの周囲をセラミックスや樹脂、ガラス等の絶縁体で覆えばよい。 Frame 2, alumina (Al 2 O 3) sintered material, aluminum nitride (AlN) sintered material, mullite (3Al 2 O 3 · 2SiO 2 ) sintered material made of glass ceramic or the like, the brazing material Is attached to the upper surface of the heat radiating member 1 so as to surround the mounting portion 1e. Note that a brazing metal layer (not shown) may be formed at the joint portion of the frame 2 with the heat dissipating member 1 when the brazing material is attached. Further, the frame 2 may be made of metal. In that case, in order to insulate the wiring conductor 2a from the metal constituting the frame 2, the periphery of the wiring conductor 2a is made of an insulator such as ceramics, resin, or glass. Cover it.

また、放熱部材1には、その上面の中央部の搭載部1eに電子部品5が樹脂,ガラス,ロウ材等の接着材を介して固定される。なお、接着材としてロウ材を用いる場合には、ロウ付け用の金属層(図示せず)が放熱部材1の電子部品5との接合部に形成されてもよい。ただし、放熱部材1の上面の搭載部1eに接合された上部金属板1cにより十分なロウ付けができる場合には、ロウ付け用の金属層は特に必要ではない。   Further, the electronic component 5 is fixed to the heat dissipating member 1 on the mounting portion 1e at the center of the upper surface thereof through an adhesive such as resin, glass, brazing material or the like. Note that when a brazing material is used as the adhesive, a brazing metal layer (not shown) may be formed at a joint portion of the heat radiating member 1 with the electronic component 5. However, when sufficient brazing can be performed by the upper metal plate 1c joined to the mounting portion 1e on the upper surface of the heat radiating member 1, a brazing metal layer is not particularly necessary.

枠体2は、例えば、Al質焼結体から成る場合であれば、Al,酸化珪素(SiO),酸化マグネシウム(MgO),酸化カルシウム(CaO)等の原料粉末に適当な有機バインダ,溶剤,可塑剤,分散剤等を混合添加して泥漿状となすとともに、これからドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート(セラミック生シート)を形成し、しかる後に、このセラミックグリーンシートに適当な打ち抜き加工を施すとともに、W,Mo,Mn,Cu,Ag,Ni,Au,パラジウム(Pd)等の金属材料粉末に適当な有機バインダ,溶剤を混合して成る導電性ペーストをグリーンシートに予めスクリーン印刷法等により所定の配線導体2aのパターンに印刷塗布した後に、このグリーンシートを複数枚積層し、約1600℃の温度で焼成することによって作製される。 If the frame 2 is made of, for example, an Al 2 O 3 sintered material, the raw material powder such as Al 2 O 3 , silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO) is used. Appropriate organic binders, solvents, plasticizers, dispersants, etc. are mixed and added to form a slurry, and from this, a ceramic green sheet (ceramic green sheet) is formed by adopting a doctor blade method or a calender roll method. Later, the ceramic green sheet is appropriately punched and mixed with a metal powder such as W, Mo, Mn, Cu, Ag, Ni, Au, and palladium (Pd) with an appropriate organic binder and solvent. After the conductive paste is printed and applied to the green sheet in advance by a screen printing method or the like in a predetermined pattern of the wiring conductor 2a, the conductive paste is applied. The green sheet laminating a plurality, is produced by firing at a temperature of about 1600 ° C..

また、枠体2には、放熱部材1と枠体2とで構成される凹部の内面(搭載部1e周辺)から枠体2の外面にかけて導出される配線導体2aが複数形成されており、配線導体2aの凹部の内側の一端には電子部品5の各電極がボンディングワイヤ等の電気的接続手段6を介して電気的に接続される。また、枠体2の外側の配線導体2aの他端には外部電気回路基板との接続用のリード端子3が接続される。   In addition, the frame 2 is formed with a plurality of wiring conductors 2a led out from the inner surface (periphery of the mounting portion 1e) of the concave portion constituted by the heat dissipation member 1 and the frame 2 to the outer surface of the frame 2. Each electrode of the electronic component 5 is electrically connected to one end inside the concave portion of the conductor 2a through an electrical connection means 6 such as a bonding wire. In addition, a lead terminal 3 for connection to an external electric circuit board is connected to the other end of the wiring conductor 2a outside the frame 2.

配線導体2aはW,Mo等の高融点金属から成り、W,Mo等の金属粉末に適当な有機バインダ,溶剤等を添加混合して得た金属ペーストを枠体2となるセラミックグリーンシートに予めスクリーン印刷法等によって所定のパターンに印刷塗布しておくことによって、放熱部材1および枠体2による凹部の内面から枠体2の外面にかけて被着形成される。   The wiring conductor 2a is made of a high melting point metal such as W or Mo, and a metal paste obtained by adding and mixing an appropriate organic binder, solvent or the like to a metal powder such as W or Mo is preliminarily applied to the ceramic green sheet serving as the frame 2. By printing and applying in a predetermined pattern by a screen printing method or the like, the heat radiation member 1 and the frame body 2 are deposited from the inner surface of the recess to the outer surface of the frame body 2.

また、配線導体2aはその露出する表面にNi,Au等の耐食性に優れ、かつ電気的接続手段6のボンディング性に優れる金属を1〜20μmの厚みにメッキ法によって被着させておくと、配線導体2aの酸化腐食を有効に防止できるとともに配線導体2aへの電気的接続手段6の接続を強固となすことができる。従って、配線導体2aは、その露出する表面にNi,Au等の耐食性に優れ、かつボンディング性に優れる金属を1〜20μmの厚みに被着させておくことが望ましい。   Further, the wiring conductor 2a is formed by depositing a metal having excellent corrosion resistance such as Ni, Au and the like on the exposed surface and excellent bonding properties of the electrical connection means 6 to a thickness of 1 to 20 μm by plating. The oxidative corrosion of the conductor 2a can be effectively prevented and the connection of the electrical connection means 6 to the wiring conductor 2a can be strengthened. Therefore, it is desirable that the wiring conductor 2a is coated with a metal having excellent corrosion resistance such as Ni and Au and excellent bonding properties on the exposed surface to a thickness of 1 to 20 μm.

本発明の放熱部材1は、平板状の基体1aと、基体1aの上面に接合された基体1aよりも熱膨張係数および熱伝導率が大きく縦弾性係数が小さい材料から成る上部金属板1cおよび基体1aの下面に接合された基体1aよりも熱膨張係数および熱伝導率が大きく縦弾性係数が小さい材料から成る下部金属板1bとから成り、基体1aは平面視形状が帯状に連続した流路が形成されるようにその上下面を貫通する冷却液用流路1dが穿設されている。   The heat dissipating member 1 of the present invention includes a flat base 1a, an upper metal plate 1c and a base made of a material having a thermal expansion coefficient and a thermal conductivity larger than that of the base 1a bonded to the upper surface of the base 1a. It consists of a lower metal plate 1b made of a material having a larger thermal expansion coefficient and thermal conductivity and smaller longitudinal elastic modulus than the base body 1a joined to the lower surface of the base 1a, and the base body 1a has a continuous channel in a plan view. A coolant flow path 1d that penetrates the upper and lower surfaces is formed so as to be formed.

放熱部材1は、電子部品5の作動に伴い発生する熱を吸収するとともにパッケージの外部に放散させる、あるいは外部電気回路基板(図示せず)に伝導させる機能を有する。放熱部材1の一部となる基体1aは、例えば、Mo,W,鉄(Fe)等またはこれらの合金の金属板を圧延加工,打ち抜き加工等の従来周知の金属加工法を施すことによって形成したり、先ず平均粒径が5〜40μmのW粉末またはMo粉末を基体1aの形状に加圧成形し、これを1300〜1600℃の雰囲気中で焼結することにより、基体1aとなる多孔体を予め作製し、この多孔体に水素雰囲気下において約1200℃で10〜50質量%のCuを含浸させたりすることにより成る。その後、基体1aの冷却液用流路1dとなる部分を、打ち抜き加工やエッチング加工等の従来周知の金属加工法を施して除去することで、基体1aとなる。   The heat radiating member 1 has a function of absorbing heat generated by the operation of the electronic component 5 and dissipating it to the outside of the package or conducting it to an external electric circuit board (not shown). The base body 1a which becomes a part of the heat radiating member 1 is formed, for example, by subjecting a metal plate of Mo, W, iron (Fe) or the like or an alloy thereof to a conventionally known metal processing method such as rolling or punching. First, W powder or Mo powder having an average particle size of 5 to 40 μm is pressure-molded into the shape of the base 1a, and sintered in an atmosphere of 1300 to 1600 ° C. to thereby obtain a porous body to be the base 1a. The porous body is prepared in advance and impregnated with 10 to 50% by mass of Cu at about 1200 ° C. in a hydrogen atmosphere. Thereafter, the portion of the substrate 1a that becomes the coolant flow path 1d is removed by performing a conventionally known metal processing method such as punching or etching, thereby forming the substrate 1a.

このWまたはMoから成る焼結体にCuを含浸させて成る基体1aは、W単体またはMo単体から成る場合に比べ熱伝導率が向上し、放熱部材1の放熱特性をより優れたものとさせることができるので好適である。   The base 1a formed by impregnating the sintered body made of W or Mo with Cu has improved thermal conductivity as compared with the case where the sintered body made of W or Mo is made simple, and makes the heat radiating member 1 have better heat dissipation characteristics. This is preferable.

そして、この基体1aの上面に上部金属板1cを接合し、基体1aの下面に下部金属板1bを接合することによって放熱部材1が形成される。上部金属板1cおよび下部金属板1bは、基体1aよりも熱膨張係数および熱伝導率が大きく縦弾性係数が小さい材料、例えばCu,Ag,アルミニウム(Al),Au,ステンレス鋼(SUS)等の金属材料またはこれらの合金から成る。   Then, the upper metal plate 1c is joined to the upper surface of the substrate 1a, and the lower metal plate 1b is joined to the lower surface of the substrate 1a, whereby the heat radiating member 1 is formed. The upper metal plate 1c and the lower metal plate 1b are made of materials such as Cu, Ag, aluminum (Al), Au, stainless steel (SUS), etc., which have a higher thermal expansion coefficient and thermal conductivity than the base 1a and a smaller longitudinal elastic modulus. It consists of a metal material or an alloy thereof.

熱膨張係数が上部金属板1cおよび下部金属板1bの熱膨張係数より小さく、枠体2および電子部品5の熱膨張係数に近似する材料から成る基体1aを用いることにより、この基体1aが中層に接合されて成る放熱部材1の熱膨張係数が基体1aの熱膨張係数に拘束されるので、放熱部材1の熱膨張係数を枠体2および電子部品5の熱膨張係数に近似させることができる。そのため、枠体2および電子部品5にクラック等の破損を生じさせることなく、電子部品5を正常かつ安定に作動させることができるようになる。   By using the base 1a made of a material whose thermal expansion coefficient is smaller than the thermal expansion coefficients of the upper metal plate 1c and the lower metal plate 1b and approximates the thermal expansion coefficients of the frame 2 and the electronic component 5, this base 1a is formed in the middle layer. Since the thermal expansion coefficient of the heat radiating member 1 joined is constrained by the thermal expansion coefficient of the base 1 a, the thermal expansion coefficient of the heat radiating member 1 can be approximated to the thermal expansion coefficients of the frame 2 and the electronic component 5. Therefore, the electronic component 5 can be operated normally and stably without causing breakage such as cracks in the frame 2 and the electronic component 5.

冷却液用流路1dは、図1(b)に示すように、放熱部材1中に冷却液導入部11から冷却液排出部12にかけて設ける。そして、冷却液導入部11に冷却液導入用の配管を接続し、冷却液排出部12に冷却液排出用の配管を接続する。このように放熱部材1中に冷却液用流路1dを設け、冷却液導入部11から冷却液排出部12に向けて水やフロン等の冷却液を連続的に流すことによって、放熱部材1の搭載部1eに搭載された電子部品5から発生する熱は冷却液用流路1dを流れる冷却液に伝えられ、冷却液によって外部へ排熱されるので冷却能力を飛躍的に向上できる。冷却液としては、純水やフロンを使用するのがよく、冷却能力に非常に優れたものとすることができる。   As shown in FIG. 1B, the coolant flow path 1 d is provided in the heat radiating member 1 from the coolant introduction part 11 to the coolant discharge part 12. Then, a coolant introduction pipe is connected to the coolant introduction section 11, and a coolant discharge pipe is connected to the coolant discharge section 12. Thus, by providing the coolant channel 1d in the heat radiating member 1 and continuously flowing a coolant such as water or chlorofluorocarbon from the coolant introduction part 11 toward the coolant discharge part 12, the heat radiating member 1 Heat generated from the electronic component 5 mounted on the mounting portion 1e is transmitted to the coolant flowing through the coolant flow path 1d and is exhausted to the outside by the coolant, so that the cooling capacity can be dramatically improved. As the cooling liquid, pure water or chlorofluorocarbon is preferably used, and the cooling capacity can be very excellent.

冷却液導入部11と冷却液排出部12は一箇所ずつになるように設けるのがよく、冷却液導入部11と冷却液排出部12に接続するための配管が簡単なものとなる。   The cooling liquid introduction part 11 and the cooling liquid discharge part 12 are preferably provided so as to be provided one by one, and piping for connecting to the cooling liquid introduction part 11 and the cooling liquid discharge part 12 becomes simple.

好ましくは、冷却液導入部11と冷却液排出部12には、それぞれ配管を接続するための口金を設けるのがよく、冷却液導入部11に冷却液導入用の配管を、冷却液排出部12に冷却液排出用の配管をそれぞれ接続するのが容易となる。   Preferably, each of the coolant introduction part 11 and the coolant discharge part 12 is provided with a base for connecting a pipe, and the coolant introduction part 11 is provided with a pipe for introducing a coolant, and the coolant discharge part 12 It is easy to connect the pipes for discharging the coolant to each other.

冷却液用流路1dの配置は、図1(b)に示すような放熱部材1の全体に万偏なく設ける形態である他、図2(a)に示すように放熱部材1の搭載部1eの直下のみに設ける形態や、図2(b)に示すように放熱部材1の搭載部1eの直下に冷却液用流路1dを密に設けるとともに放熱部材1の全体に設ける形態であってもよい。   The arrangement of the coolant flow path 1d is provided in the entire heat dissipating member 1 as shown in FIG. 1B, and the mounting portion 1e of the heat dissipating member 1 as shown in FIG. 2A. 2B, or a mode in which the coolant flow path 1d is densely provided immediately below the mounting portion 1e of the heat radiating member 1 and provided on the entire heat radiating member 1 as shown in FIG. Good.

図1(b)に示す形態においては、放熱部材1の全体を万偏なく冷却できる。特に、複数の電子部品5が基板上に搭載される等により、発熱部が搭載部1eの各所に分散されて搭載部1eが広い面積となる場合においても、放熱部材1の全体を万偏なく冷却でき、電子部品5の作動時の温度上昇を有効に抑制できる。その結果、電子部品5が広面積である場合においても、電子部品5が温度上昇し誤作動するのを有効に防止することができる。   In the form shown in FIG. 1B, the entire heat dissipating member 1 can be cooled without any problem. In particular, even when a plurality of electronic components 5 are mounted on the substrate, etc., and the heat generating parts are dispersed in various places of the mounting part 1e, the mounting part 1e has a large area. It can cool and can suppress the temperature rise at the time of the operation | movement of the electronic component 5 effectively. As a result, even when the electronic component 5 has a large area, it is possible to effectively prevent the electronic component 5 from rising in temperature and malfunctioning.

図2(a)に示す形態においては、熱の発生源である電子部品5の直下を効果的に冷却するとともに、放熱部材1の枠体2が接合される部位の直下に冷却液用流路1dがほとんど設けられないので、下部金属板1bと上部金属板1cとが基体1aで強固に拘束固定され、放熱部材1の熱膨張係数が大きくなるのが抑制されて、枠体2が接合される部位の放熱部材1の熱膨張係数を枠体2の熱膨張係数に近づけ、枠体2にクラック等の破損が生ずるのを有効に抑制できる。特に、枠体2がセラミックスから成る場合、枠体2がクラック等によって破損するのを極めて有効に防止できる。   In the embodiment shown in FIG. 2 (a), the cooling liquid channel is directly cooled immediately below the electronic component 5 which is a heat generation source, and directly below the portion where the frame 2 of the heat radiating member 1 is joined. Since 1d is hardly provided, the lower metal plate 1b and the upper metal plate 1c are firmly restrained and fixed by the base 1a, and the thermal expansion coefficient of the heat radiating member 1 is suppressed from increasing, and the frame body 2 is joined. The thermal expansion coefficient of the heat radiating member 1 at the portion to be brought close to the thermal expansion coefficient of the frame body 2 can effectively prevent the frame body 2 from being damaged such as cracks. In particular, when the frame body 2 is made of ceramics, the frame body 2 can be extremely effectively prevented from being damaged by cracks or the like.

また、図2(b)に示す形態は、図1(b)および図2(a)の中間的な形態であり、放熱部材1の全体を冷却できるとともに、熱の発生源である電子部品5の直下を特に冷却するとともに、枠体2が接合される部位の放熱部材1の熱膨張係数を枠体2の熱膨張係数に近づけ、枠体2にクラック等の破損が生ずるのを有効に抑制できる。すなわち、放熱部材1の内部の枠体2が接合される部位の直下に冷却液用流路1dが交わる部位が少ないことによって、枠体2が接合される部位の放熱部材1の熱膨張係数が基体1aに拘束された状態となり、放熱部材1の熱膨張係数が枠体2の熱膨張係数より大きくなるのを抑制できるためである。   Moreover, the form shown in FIG. 2B is an intermediate form of FIG. 1B and FIG. 2A, and the whole heat radiation member 1 can be cooled and the electronic component 5 which is a heat generation source. In particular, the thermal expansion coefficient of the heat radiating member 1 at the portion to which the frame body 2 is joined is brought close to the thermal expansion coefficient of the frame body 2 to effectively prevent the frame body 2 from being damaged such as cracks. it can. That is, since there are few portions where the coolant flow path 1d intersects immediately below the portion where the frame 2 inside the heat radiating member 1 is joined, the coefficient of thermal expansion of the heat radiating member 1 at the portion where the frame 2 is joined is reduced. This is because the thermal expansion coefficient of the heat dissipating member 1 can be suppressed from being larger than the thermal expansion coefficient of the frame body 2 because it is constrained by the base 1a.

また、好ましくは、搭載部1eの下方に設けられる冷却液用流路1dは、その内面を粗面化しておくと、粗面化された冷却液用流路1dの表面の凹凸によって冷却液用流路1dの表面積が大きくなり、冷却液に迅速に熱伝達が行なえるようにできるとともに、粗面の凹凸によって冷却液が適度に撹拌されるので、冷却液に効率的に熱伝達を行なうことができるものとなる。   Preferably, the coolant flow path 1d provided below the mounting portion 1e has a roughened inner surface, so that the surface of the roughened coolant flow path 1d is roughened due to the unevenness of the surface of the coolant flow path 1d. The surface area of the flow path 1d is increased so that heat can be quickly transferred to the cooling liquid, and the cooling liquid is appropriately stirred by the unevenness of the rough surface, so that heat can be efficiently transferred to the cooling liquid. Will be able to.

冷却液用流路1dの内面を粗面化するには、基体1a,下部金属板1b,上部金属板1cの粗面化する部位を予めサンドペーパー等を用いて粗面化しておけばよい。   In order to roughen the inner surface of the coolant channel 1d, the roughened portions of the base 1a, the lower metal plate 1b, and the upper metal plate 1c may be roughened in advance using sandpaper or the like.

また、上部金属板1cの下面および下部金属板1bの上面の冷却液用流路1dの壁面となる部位に沿って複数の溝が設けられているようにするとよい。この溝によって上部金属板1cおよび下部金属板1bと冷却液との接触面積を大きくすることができるので、上部金属板1cから冷却液への熱交換および冷却液から下部金属板1bへの熱交換を効率的に行なわせ、冷却効果を高めることができる。また、溝の深さを変化させることにより、溝内の冷却液を撹拌することができる。
以上に記したように、冷却液用流路1dの配置は目的に応じて種々の配置とし得るが、セラミックスから成る枠体2を具備する場合、好ましくは、図2(a)に示すような電子部品5の搭載部1eの直下にのみ冷却液用流路1dが設けられる形態とするのがよく、枠体2がクラック等によって破損するのを確実に防止することができる。
Moreover, it is preferable that a plurality of grooves be provided along the portions of the lower surface of the upper metal plate 1c and the upper surface of the lower metal plate 1b that serve as the wall surfaces of the coolant channel 1d. Since the contact area between the upper metal plate 1c and the lower metal plate 1b and the coolant can be increased by this groove, heat exchange from the upper metal plate 1c to the coolant and heat exchange from the coolant to the lower metal plate 1b are performed. The cooling effect can be enhanced. Further, the coolant in the groove can be agitated by changing the depth of the groove.
As described above, the arrangement of the coolant flow path 1d can be variously arranged according to the purpose. However, when the frame 2 made of ceramics is provided, preferably, as shown in FIG. It is preferable that the coolant flow path 1d is provided only directly below the mounting portion 1e of the electronic component 5, and the frame body 2 can be reliably prevented from being damaged by cracks or the like.

また、好ましくは、図3に示すように、冷却液用流路1dは、途中で複数の断面積が異なる流路に分岐され、その後合流し一つの流路となる並列回路状に設けられているのがよい。この構成により、放熱部材1内に冷却液を大量にかつ広い面積に流すことができ、さらに冷却効率を向上し、これによって冷却能力を向上できる。そして、電子部品5等の発熱体の位置に応じて放熱部材1の冷却能力を変化させることができることにより、放熱部材1を効率的かつより均一に冷却でき、放熱部材1の熱膨張を抑制できるので、枠体2および電子部品5にクラック等の破損が生じるのを有効に防止し、電子部品5を極めて正常かつ安定に作動させることができるようになる。   Preferably, as shown in FIG. 3, the coolant flow path 1 d is provided in a parallel circuit shape that is branched into a plurality of flow paths having different cross-sectional areas along the way, and then merges into one flow path. It is good to be. With this configuration, it is possible to flow a large amount of cooling liquid in the heat radiating member 1 over a wide area, further improving the cooling efficiency and thereby improving the cooling capacity. And since the cooling capability of the heat radiating member 1 can be changed according to the position of the heating element such as the electronic component 5, the heat radiating member 1 can be cooled efficiently and more uniformly, and the thermal expansion of the heat radiating member 1 can be suppressed. Therefore, it is possible to effectively prevent the frame 2 and the electronic component 5 from being damaged such as cracks, and to operate the electronic component 5 extremely normally and stably.

この場合も上記と同様、放熱部材1の全体に万偏なく冷却液用流路1dを設けてもよいし、熱の発生源である電子部品5の直下のみに設けてもよい。セラミックスから成る枠体2を具備する場合、好ましくは、電子部品5の搭載部1eの直下にのみ冷却液用流路1dが設けられる形態とするのがよい。   Also in this case, similarly to the above, the coolant channel 1d may be provided on the entire heat radiating member 1 or may be provided just below the electronic component 5 that is a heat generation source. When the frame 2 made of ceramics is provided, it is preferable that the coolant flow path 1d is provided only directly below the mounting portion 1e of the electronic component 5.

また、冷却液用流路1dは、搭載部1eの下方に設けられる冷却液用流路1dの断面積がその外側の冷却液用流路1dの断面積より大きいのがよい。この構成により、発熱体である電子部品5の搭載部1eの直下において冷却液の流量が大きくなるようにして、電子部品5から発生する熱を冷却液を介して外部に効率よく放散させることができる。電子部品5の搭載部1eの下方から遠ざかるにつれ、電子部品5から発生する熱による放熱部材1の温度は低くなるため、放熱部材1の搭載部1eの下方の外側の冷却液用流路1dの断面積が小さくなっても、電子部品5から発生する熱を冷却液を介して十分効率よく外部に放散させることができる。   Further, in the coolant flow path 1d, the cross-sectional area of the coolant flow path 1d provided below the mounting portion 1e is preferably larger than the cross-sectional area of the coolant flow path 1d outside. With this configuration, it is possible to efficiently dissipate the heat generated from the electronic component 5 to the outside through the cooling liquid so that the flow rate of the cooling liquid increases immediately below the mounting portion 1e of the electronic component 5 that is a heating element. it can. As the temperature of the heat dissipating member 1 is reduced by the heat generated from the electronic component 5 as the distance from the lower portion of the mounting portion 1e of the electronic component 5 decreases, Even if the cross-sectional area is reduced, the heat generated from the electronic component 5 can be dissipated to the outside sufficiently efficiently through the coolant.

なお、図3において、電子部品5の搭載部1eの縁は、冷却液用流路1dの最外縁よりも内側になるようにするのがよく、これによって、電子部品5から発生する熱を冷却液を介して外部に効率よく放散させることができる。   In FIG. 3, the edge of the mounting portion 1 e of the electronic component 5 is preferably located inside the outermost edge of the coolant channel 1 d, thereby cooling the heat generated from the electronic component 5. It can be efficiently diffused to the outside through the liquid.

基体1aの下面に接合された下部金属板1bおよび基体1aの上面に接合された上部金属板1cは、下部金属板1b,上部金属板1cをAgロウ,Ag−Cuロウ等のロウ材を介して接合することにより形成する。   The lower metal plate 1b bonded to the lower surface of the substrate 1a and the upper metal plate 1c bonded to the upper surface of the substrate 1a are connected to the lower metal plate 1b and the upper metal plate 1c via a brazing material such as Ag brazing or Ag-Cu brazing. Are formed by joining.

ここで好ましくは、下部金属板1bおよび上部金属板1cの厚みは、基体1aの厚みよりも1.5倍〜4倍程度厚くなっているのがよい。この構成により、冷却液用流路1dが設けられる部位において、冷却液用流路1dの上下に位置する下部金属板1bおよび上部金属板1cで放熱部材1を支持し、放熱部材1を外部電気回路基板にネジ止め等の手段で固定する際に、放熱部材1の冷却液用流路1dが位置する部位においても放熱部材1が変形し難くなるので放熱部材1が変形するのを有効に防止することができる。また、冷却液用流路1dに冷却液を流した際に、冷却液の液圧で冷却液用流路1dの上下に位置する下部金属板1bおよび上部金属板1cが突出するように変形するのを防止し、放熱部材1の上下面を平坦に維持し、放熱部材1と電子部品5,放熱部材1と外部電気回路基板とを密着させ電子部品5から発生する熱を外部に効率良く放散させることができる。   Here, preferably, the thickness of the lower metal plate 1b and the upper metal plate 1c is about 1.5 to 4 times thicker than the thickness of the base 1a. With this configuration, the heat radiating member 1 is supported by the lower metal plate 1b and the upper metal plate 1c positioned above and below the coolant flow channel 1d at the portion where the coolant flow channel 1d is provided, and the heat radiating member 1 is When fixing to the circuit board with screws or the like, the heat radiating member 1 is hardly deformed even at the portion where the coolant flow path 1d of the heat radiating member 1 is located, so that the heat radiating member 1 is effectively prevented from being deformed. can do. Further, when the coolant flows through the coolant channel 1d, the lower metal plate 1b and the upper metal plate 1c positioned above and below the coolant channel 1d are deformed by the liquid pressure of the coolant. The heat dissipation member 1 is maintained flat and the heat dissipation member 1 and the electronic component 5, the heat dissipation member 1 and the external electric circuit board are brought into close contact with each other to efficiently dissipate heat generated from the electronic component 5 to the outside. Can be made.

また、放熱部材1の下面側、すなわち、電子部品5が搭載される搭載部1eとは反対側の下部金属板1bの下面の算術平均粗さRaは、Ra≦30(μm)であることが好ましい。通常、電子部品収納用パッケージは、AlやCu等の金属体あるいは、高熱伝導を有するセラミック体から成る支持基板へネジ止めにより接続される。このとき、基体1aの下面の下部金属板1bの下面の算術平均粗さRaがRa>30(μm)の場合には、電子部品収納用パッケージと支持基板とを十分に密着させることが困難となり電子部品5で発生した熱を電子部品収納用パッケージからこの支持基板へ効率よく伝達させることができなくなるおそれがある。従って、下面の下部金属板1bの外側表面となる下面は、支持基板との良好な密着性が得られるように、Ra≦30(μm)の平滑面であることが望ましい。   In addition, the arithmetic average roughness Ra of the lower surface side of the heat radiating member 1, that is, the lower surface of the lower metal plate 1b opposite to the mounting portion 1e on which the electronic component 5 is mounted is Ra ≦ 30 (μm). preferable. Usually, the electronic component storage package is connected to a support substrate made of a metal body such as Al or Cu or a ceramic body having high thermal conductivity by screwing. At this time, when the arithmetic average roughness Ra of the lower surface of the lower metal plate 1b on the lower surface of the base 1a is Ra> 30 (μm), it is difficult to sufficiently adhere the electronic component storage package and the support substrate. There is a possibility that heat generated in the electronic component 5 cannot be efficiently transferred from the electronic component storage package to the support substrate. Accordingly, it is desirable that the lower surface, which is the outer surface of the lower metal plate 1b, is a smooth surface with Ra ≦ 30 (μm) so as to obtain good adhesion to the support substrate.

なお、放熱部材1の基体1aの上下面に形成される下部金属板1bおよび上部金属板1cの材料がCuから成るときは、純Cuに限られるものではなく、熱伝導性が良好でWまたはMo等の金属またはこれらとCuとのマトリックスである基体1aと十分な接合強度が得られるものであれば、Cuを主成分とする各種のCu合金であっても構わない。   When the material of the lower metal plate 1b and the upper metal plate 1c formed on the upper and lower surfaces of the base 1a of the heat radiating member 1 is made of Cu, it is not limited to pure Cu, and has good thermal conductivity and W or Various Cu alloys containing Cu as a main component may be used as long as sufficient bonding strength can be obtained with a metal such as Mo or the substrate 1a which is a matrix of these and Cu.

また、Ag,Al等の基体1aよりも熱膨張係数および熱伝導率が大きく縦弾性係数が小さい他の材料についても上記同様に純金属である必要はない。   Also, other materials such as Ag, Al, etc., which have a higher thermal expansion coefficient and thermal conductivity and a smaller longitudinal elastic modulus than the base 1a, need not be pure metals as described above.

また、図示しないが、好ましくは、上部金属板1cは、その端部で基体1aの側面に回り込むように設けられて下部金属板1bと接していてもよい。この構成により、搭載部1eに搭載された電子部品5から発生する熱は、上部金属板1c,基体1a,下部金属板1bの順に伝達するだけでなく、基体1aの上面から側面にかけて形成された上部金属板1cを介して直接下部金属板1bに伝達させることができるので、下部金属板1bに効率よく熱を伝達させて、電子部品から発生する熱を下部金属板から効率よく放散させることができる。この場合、全周にわたって下部金属板1bに接している必要はなく、一部分でも上部金属板1cが下部金属板1bに接していればよい。例えば、基体1aが四角形である場合、対向する2辺の基体1aの側面で、上部金属板1cが下部金属板1bに接していればよい。この構成においても、電子部品5から発生する熱を下部金属板1bから十分効率よく放散させることができる。   Further, although not shown, preferably, the upper metal plate 1c may be provided so as to wrap around the side surface of the base 1a at the end thereof and be in contact with the lower metal plate 1b. With this configuration, heat generated from the electronic component 5 mounted on the mounting portion 1e is not only transmitted in the order of the upper metal plate 1c, the base 1a, and the lower metal plate 1b, but is also formed from the upper surface to the side surface of the base 1a. Since it can be directly transmitted to the lower metal plate 1b via the upper metal plate 1c, heat can be efficiently transmitted to the lower metal plate 1b and heat generated from the electronic component can be efficiently dissipated from the lower metal plate. it can. In this case, it is not necessary to be in contact with the lower metal plate 1b over the entire circumference, and it is sufficient that the upper metal plate 1c is in contact with the lower metal plate 1b even at a part thereof. For example, when the base 1a is a rectangle, the upper metal plate 1c may be in contact with the lower metal plate 1b on the side surfaces of the two opposite sides of the base 1a. Also in this configuration, the heat generated from the electronic component 5 can be dissipated sufficiently efficiently from the lower metal plate 1b.

かくして、上述のパッケージによれば、放熱部材1の搭載部1e上に電子部品5をガラス,樹脂,ロウ材等から成る接着材を介して接着固定するとともに、電子部品5の各電極をボンディングワイヤ等の電気的接続手段6を介して所定の配線導体2aに電気的に接続し、しかる後に、放熱部材1と枠体2とから成る凹部の内側に電子部品5を覆うようにエポキシ樹脂等の封止樹脂を充填して電子部品5を封止することによって、あるいは、樹脂や金属,セラミックス等から成る蓋体4を枠体2の上面に凹部を覆うように取着して電子部品5を封止することによって製品としての電子装置となる。   Thus, according to the above-described package, the electronic component 5 is bonded and fixed onto the mounting portion 1e of the heat radiating member 1 via an adhesive made of glass, resin, brazing material, etc., and each electrode of the electronic component 5 is bonded to the bonding wire. Electrically connected to a predetermined wiring conductor 2a via an electrical connecting means 6 such as an epoxy resin, and then an epoxy resin or the like so as to cover the electronic component 5 inside the recess formed by the heat radiating member 1 and the frame 2 The electronic component 5 is sealed by filling the sealing resin with the sealing resin, or by attaching the lid 4 made of resin, metal, ceramics or the like so as to cover the recess on the upper surface of the frame 2. By sealing, an electronic device as a product is obtained.

なお、本発明は以上の実施の形態の例に限定されるものではなく、本発明の要旨を逸脱しない範囲であれば種々の変更が可能である。例えば、放熱部材1の上面の搭載部1eにディスクリートな電子部品5の代わりに枠体2の機能を兼ね備えたセラミックス製の回路基板が搭載され、この回路基板に電子部品5が搭載されていてもよい。この構成により、回路基板にクラック等の破損を発生させることなく、回路基板に搭載される電子部品5から発生する熱を効率よく放散できるものとなる。   In addition, this invention is not limited to the example of the above embodiment, A various change is possible if it is the range which does not deviate from the summary of this invention. For example, a ceramic circuit board having the function of the frame 2 is mounted instead of the discrete electronic component 5 on the mounting portion 1e on the upper surface of the heat radiating member 1, and the electronic component 5 is mounted on the circuit board. Good. With this configuration, heat generated from the electronic component 5 mounted on the circuit board can be efficiently dissipated without causing damage such as cracks on the circuit board.

(a)は本発明の電子部品収納用パッケージおよびそれを用いた本発明の電子装置の実施の形態の一例を示す断面図、(b)は(a)に示す本発明の電子部品収納用パッケージおよび電子装置で用いられる放熱部材の平面図である。(A) is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention and the electronic device of this invention using the same, (b) is the electronic component storage package of this invention shown to (a) It is a top view of the heat radiating member used with an electronic device. (a),(b)は本発明の電子部品収納用パッケージおよびそれを用いた本発明の電子装置の実施の形態の他の例を示し、本発明の電子部品収納用パッケージおよび電子装置で用いられる放熱部材の平面図である。(A), (b) shows the other example of embodiment of the electronic component storage package of this invention and the electronic device of this invention using the same, and is used with the electronic component storage package and electronic device of this invention It is a top view of the heat radiating member. 本発明の電子部品収納用パッケージおよびそれを用いた本発明の電子装置の実施の形態の他の例を示し、本発明の電子部品収納用パッケージおよび電子装置で用いられる放熱部材の平面図である。FIG. 6 is a plan view of a heat dissipation member used in the electronic component storage package and the electronic device of the present invention, showing another example of the embodiment of the electronic component storage package of the present invention and the electronic device of the present invention using the same. . 従来の電子装置の例を示す断面図である。It is sectional drawing which shows the example of the conventional electronic device.

符号の説明Explanation of symbols

1:放熱部材
1a:基体
1b:下部金属板
1c:上部金属板
1d:冷却液用流路
1e:搭載部
2:枠体
2a:配線導体
4:蓋体
5:電子部品
DESCRIPTION OF SYMBOLS 1: Heat dissipation member 1a: Base | substrate 1b: Lower metal plate 1c: Upper metal plate 1d: Coolant flow path 1e: Mounting part 2: Frame body 2a: Wiring conductor 4: Cover body 5: Electronic component

Claims (4)

上面の中央部に電子部品の搭載部を有する平板状の放熱部材と、該放熱部材の上面に前記搭載部を取り囲んで取着された、内面から外面に導出される配線導体を有する枠体とを具備しており、前記放熱部材は、平板状の基体と、該基体よりも熱膨張係数および熱伝導率が大きくかつ縦弾性係数が小さい材料から成る、前記基体の上面に接合された上部金属板および前記基体の下面に接合された下部金属板とから成り、前記基体はその上下面を貫通するとともに平面視形状が帯状である冷却液用流路が設けられていることを特徴とする電子部品収納用パッケージ。 A flat plate-like heat radiating member having an electronic component mounting portion at the center of the upper surface, and a frame having a wiring conductor led out from the inner surface to the outer surface, and attached to the upper surface of the heat radiating member so as to surround the mounting portion; The heat dissipating member comprises a flat base, and an upper metal bonded to the upper surface of the base, made of a material having a larger coefficient of thermal expansion and thermal conductivity and a smaller longitudinal elastic modulus than the base. An electronic device comprising: a plate and a lower metal plate joined to a lower surface of the base body, wherein the base body is provided with a coolant flow path penetrating the upper and lower surfaces and having a band shape in plan view. Parts storage package. 前記冷却液用流路は、途中で複数の断面積が異なる流路に分岐され、その後合流し一つの流路となるように設けられており、前記搭載部の下方に設けられる前記冷却液用流路の断面積がその外側の前記冷却液用流路の断面積より大きいことを特徴とする請求項1記載の電子部品収納用パッケージ。 The coolant channel is divided into a plurality of channels having different cross-sectional areas on the way, and then merged into a single channel. The coolant channel is provided below the mounting portion. 2. The electronic component storage package according to claim 1, wherein a cross-sectional area of the flow path is larger than a cross-sectional area of the cooling liquid flow path outside the flow path. 前記搭載部の下方に設けられる前記冷却液用流路は、その内面が粗面化されていることを特徴とする請求項1または請求項2記載の電子部品収納用パッケージ。 3. The electronic component storage package according to claim 1, wherein an inner surface of the coolant flow path provided below the mounting portion is roughened. 4. 請求項1乃至請求項3のいずれかに記載の電子部品収納用パッケージと、前記搭載部に搭載されるとともに電極が前記配線導体に電気的に接続された前記電子部品と、前記枠体の上面に前記電子部品を覆うように取着された蓋体または前記枠体の内側に前記電子部品を覆うように充填された封止樹脂とを具備していることを特徴とする電子装置。 The electronic component storage package according to any one of claims 1 to 3, the electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and an upper surface of the frame body An electronic device comprising: a lid attached to cover the electronic component; or a sealing resin filled inside the frame so as to cover the electronic component.
JP2004282380A 2004-09-28 2004-09-28 Package for storing electronic component, and electronic apparatus Pending JP2006100410A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007333357A (en) * 2006-06-19 2007-12-27 Toyota Motor Corp Cooler
JP2013048204A (en) * 2011-07-28 2013-03-07 Kyocera Corp Passage member, heat exchanger using passage member, electronic component device, and semiconductor manufacturing apparatus
WO2018173942A1 (en) * 2017-03-22 2018-09-27 フリージア・マクロス株式会社 Cooling structure, cooling system, heating device, and structural object
JP2018160659A (en) * 2017-03-22 2018-10-11 フリージア・マクロス株式会社 Cooling structure, cooling system, heat generation device, and structure
US11276617B2 (en) 2017-11-28 2022-03-15 Kyocera Corporation Electronic device mounting board, electronic package, and electronic module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007333357A (en) * 2006-06-19 2007-12-27 Toyota Motor Corp Cooler
JP4675285B2 (en) * 2006-06-19 2011-04-20 トヨタ自動車株式会社 Cooler
JP2013048204A (en) * 2011-07-28 2013-03-07 Kyocera Corp Passage member, heat exchanger using passage member, electronic component device, and semiconductor manufacturing apparatus
WO2018173942A1 (en) * 2017-03-22 2018-09-27 フリージア・マクロス株式会社 Cooling structure, cooling system, heating device, and structural object
JP2018160659A (en) * 2017-03-22 2018-10-11 フリージア・マクロス株式会社 Cooling structure, cooling system, heat generation device, and structure
EP3605600A4 (en) * 2017-03-22 2020-11-18 Freesia Macross Corporation Cooling structure, cooling system, heating device, and structural object
US11994351B2 (en) 2017-03-22 2024-05-28 Beji Sasaki Cooling structural body, cooling system, heat generator and construction
US11276617B2 (en) 2017-11-28 2022-03-15 Kyocera Corporation Electronic device mounting board, electronic package, and electronic module

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