JP2008085096A - Heat radiating member, electronic component storing package using the member, and electronic apparatus using the member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiating member, an electronic-component storing package using the member, and an electronic apparatus using the member wherein it excels in heat radiating performance and a heat radiating property is favorably maintained even in a long-term use. <P>SOLUTION: The heat radiating member A has a one-side metal plate 2a present, the other-side metal plate 2b, and inorganic particles 1 each of which has thermal conductivity larger than those of the metal plates, and is interposed between the one-side metal plate 2a and the other-side metal plate 2b, and further, is so joined via a brazing filler metal 5 to the metal plates that respective portions of each inorganic particle are buried in the one-side metal plate 2a and the other-side metal plate 2b. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat radiating member that can efficiently dissipate heat generated by a high-power electronic component during operation to the outside, an electronic component housing package and an electronic device that use this heat radiating member and have good heat dissipation.

  An example of a conventional heat radiating member is shown in the cross-sectional view of FIG. As a conventional heat dissipating member, there is a heat sink (hereinafter referred to as a heat dissipating member) composed of diamond particles 101 having an average particle diameter of 50 μm or more and 800 μm or less and a metal 102 mainly composed of one or more of silver, copper, aluminum, gold or the like ( For example, see Patent Document 1).

  This heat dissipating member is obtained by putting diamond particles 101 in a frame serving as a jig for a predetermined heat dissipating member, spreading diamond particles 101 by adding shaking, and then pouring powder or paste-like metal 102 into the heat dissipating member frame. Then, a composite material is formed by combining the diamond particles 101 and the metal 102 in a state where the diamond particles 101 are arranged in a single layer. Then, after one layer is completed, the operation is repeated to obtain a heat dissipation member having a predetermined thickness.

In this heat radiating member, in order to strengthen the adhesion between the diamond particles 101 and the metal 102, a small amount of a metal of the 4a to 7a group of the periodic table such as titanium is added, or it is preliminarily adhered to the diamond. It was.
Japanese Patent Laid-Open No. 9-312362

  However, in the conventional heat radiating member, when heat is applied to the heat radiating member in the brazing step or the like, the metals in groups 4a to 7a of the periodic table diffuse into the metal 102, and the surroundings of the diamond particles 101 In some cases, adhesion between the metal 102 and the diamond particles 101 disposed on the surface becomes insufficient, and heat cannot be transferred between the diamond particles 101 and the metal 102. As a result, there has been a problem that heat generated from electronic components such as semiconductors to be mounted cannot be dissipated well through the heat dissipation member.

  Accordingly, the present invention has been completed in view of the above-described conventional problems, and the object thereof is a heat radiating member having excellent heat radiating performance and excellent heat radiability even in long-term use, and an electronic component using the same. It is to provide a storage package and an electronic device.

  The heat dissipating member of the present invention has one metal plate, the other metal plate opposed to the surface of the one metal plate, and a thermal conductivity larger than the thermal conductivity of the one metal plate and the other metal plate, and One surface of the metal plate is interposed between the metal plate and the other metal plate, and is joined to the one metal plate and the other metal plate through a brazing material so as to be partially embedded. It is characterized by comprising inorganic particles being worn.

  The heat dissipating member of the present invention preferably has the above-described configuration, wherein the one metal plate and the other metal plate are made of silver, copper or aluminum.

  The heat dissipating member of the present invention preferably has the above structure, wherein the inorganic particles include at least one of diamond particles and cubic boron nitride particles.

  The heat dissipating member of the present invention preferably has the above-described configuration, wherein the brazing material is silver-copper brazing, aluminum brazing, silver brazing or copper brazing.

  The heat dissipating member of the present invention preferably has the above-described configuration, wherein the brazing material has a thickness of 5 μm or more and 25 μm or less.

  In the above configuration, the heat dissipating member of the present invention is preferably characterized in that a conductor is disposed between the inorganic particles so as to connect the one metal plate and the other metal plate.

  The heat dissipating member of the present invention preferably has the above-described configuration, and the heat dissipating member of the present invention is laminated in a plurality of layers.

An electronic component storage package according to the present invention includes the heat dissipation member according to the present invention, and a terminal having a wiring conductor and attached to the outer peripheral portion of the surface of the heat dissipation member.

  An electronic device according to the present invention includes the electronic component storage package according to the present invention, an electronic component that is installed at the center of the surface of the heat dissipation member to which the terminal is attached, and is connected to the wiring conductor. A sealing resin or a lid provided so as to cover is provided.

  The heat dissipating member of the present invention has one metal plate, the other metal plate opposed to the surface of the one metal plate, and a thermal conductivity larger than the thermal conductivity of the one metal plate and the other metal plate, and One surface of the metal plate is interposed between the metal plate and the other metal plate, and is joined to the one metal plate and the other metal plate through a brazing material so as to be partially embedded. The heat generated when the electronic component installed on the surface of the heat radiating member is operated is changed from one metal plate to the other metal plate with high thermal conductivity. Therefore, the electronic component can be efficiently cooled.

  In the heat dissipating member of the present invention, the one metal plate and the other metal plate may be made of silver, copper or aluminum, and the heat conductivity of these metals is large. The heat transmitted from the inorganic particles can be well transmitted to the outside.

  In the heat dissipation member of the present invention, the inorganic particles only need to contain at least one of diamond particles and cubic boron nitride particles, and these inorganic particles have a very high thermal conductivity. The heat dissipating property of the heat dissipating member is improved.

  In the heat dissipating member of the present invention, the brazing material may be silver-copper brazing, aluminum brazing, silver brazing or copper brazing. These brazing materials have good wettability to the metal film, the one metal plate and the other metal plate, and the bondability between the inorganic particles and the one metal plate or the other metal plate is improved.

  In the heat radiating member of the present invention, the thickness of the brazing material is preferably 5 μm or more and 25 μm or less, and the inorganic particles and the one metal plate or the other metal plate can be satisfactorily bonded and the heat transfer performance can be greatly impaired. Absent.

  In the heat dissipation member of the present invention, a conductor may be disposed between the inorganic particles so as to connect the one metal plate and the other metal plate, and the electric resistance between the one metal plate and the other metal plate. Therefore, the heat radiating member can function as a ground for the electronic component.

  Further, the heat radiating member of the present invention may be formed by laminating a plurality of layers of the heat radiating member of the present invention, and the inorganic particles aligned in the layer direction can be stacked in an orderly manner. Even after this, the heat dissipation member has uniform thermal conductivity.

  In addition, the electronic component storage package of the present invention includes the heat dissipating member of the present invention, a wiring member, and a terminal attached to the outer peripheral portion of the surface of the heat dissipating member. It can be suitably used as a package that accommodates many electronic components.

  An electronic device according to the present invention includes the electronic component storage package according to the present invention, an electronic component that is installed in the center of the surface of the heat dissipation member to which the terminal is attached, and is connected to the wiring conductor. Since the sealing resin or the lid provided so as to cover is provided, an electronic device that can suppress the temperature rise of the electronic component and operate the electronic component very well is obtained.

  The heat radiating member of the present invention, the electronic component storage package using the heat radiating member, and the electronic device will be described in detail below. 1 (a), 1 (b), and 1 (c) are cross-sectional views showing an example of an embodiment of a heat radiating member of the present invention. FIG. 2 (a), FIG. 2 (b), and FIG. (C) is sectional drawing which shows the other example of embodiment of the thermal radiation member of this invention. Moreover, Fig.3 (a) and FIG.3 (b) are the principal part expanded sectional views of the thermal radiation member of this invention. 4 is a sectional view showing an example of an electronic component storage package using the heat dissipation member shown in FIG. 1B, and FIG. 5 shows an example of an electronic device using the electronic component storage package shown in FIG. It is sectional drawing.

  In these drawings, 1 is inorganic particles, 2a is one metal plate (hereinafter also referred to as an upper metal plate), and 2b is the other metal plate arranged so that the upper surface faces the lower surface of the one metal plate. (Hereinafter also referred to as a lower metal plate) 3 is a conductor disposed so as to connect the one metal plate 2a and the other metal plate 2b between the inorganic particles 1, and 4 is deposited on the surface of the inorganic particles 1. The metal film 5 is a brazing material that is interposed between the one metal plate 2a or the other metal plate 2b and the inorganic particles 1 and joins the inorganic particles 1 to the one metal plate 2a or the other metal plate 2b. The heat radiating member A of the present invention is constituted by the particles 1, the one metal plate 2a, the other metal plate 2b, and the brazing material 5.

  A1 is a mounting portion where the electronic component C is mounted and installed at the center of the surface where the terminal B of the heat dissipation member A is attached, and B is a terminal having a wiring conductor B1 for signal input / output. The member A and the terminal B constitute an electronic component storage package for storing the electronic component C in the mounting portion A1. A2 is the lower surface of the lower metal plate 2b of the heat dissipation member A. When the electronic component storage package is mounted on the external substrate or the like, the electronic component storage package is placed on the external substrate or the like. A mounting surface that contacts the surface of the external substrate, C is an electronic component that is installed on the mounting portion A1 of the heat dissipation member A, and an electrode is connected to the wiring conductor B1, and D is a lid that is bonded to the upper surface of the terminal B. After the electronic component C is mounted on the mounting portion A1 of the electronic component storage package, the wiring conductor B1 and the electronic component C are electrically connected by an electrical connection member such as a bonding wire, and the electronic component C is further connected by the lid D. The electronic device is configured by sealing so as to cover. The electronic device is fixed with the mounting surface A2 in close contact with an external substrate (not shown) such as an external electric circuit substrate or a heat sink. As a result, the electronic device according to the present invention causes heat generated during the operation of the electronic component C to be transferred to the external substrate through the heat radiating member A, and suppresses the temperature rise of the electronic component C to ensure the operation reliability of the electronic component C. The property can be improved.

  As shown in FIG. 1A and FIG. 3A showing an enlarged cross section of one inorganic particle 1 around the heat radiating member A of the present invention, the heat radiating member of the present invention includes an upper metal plate 2a and the upper metal plate 2a. Lower metal plate 2b having a mounting surface A2 disposed opposite to the surface of the metal plate 2a and having a lower surface mounted on the external substrate, and thermal conductivity greater than the thermal conductivity of the upper metal plate 2a and the lower metal plate 2b And the Vickers hardness is higher than that of the upper metal plate 2a and the lower metal plate 2b, and is interposed between the upper metal plate 2a and the lower metal plate 2b to be connected to the upper metal plate 2a and the lower metal plate 2b. The electronic component C installed on the surface of the heat dissipating member A operates because it comprises the inorganic particles 1 joined via the brazing material 5 so that a part of the upper part 1a and the lower part 1b are embedded. The heat generated during the process from the upper metal plate 2a to the lower metal plate 2b Transmitted to good through the large inorganic particles 1 conductivity. The electronic component C can be efficiently cooled by dissipating heat to an external board such as an external electric circuit board or a heat sink.

The inorganic particles 1 are made of a material having good thermal conductivity, and are, for example, non-metallic single crystal particles such as artificial diamond or cubic boron nitride, aluminum nitride (AlN), silicon nitride (Si ₃ N ₄ ), or carbonized. It consists of non-metallic particles with good thermal conductivity such as silicon (SiC). Alternatively, metal particles having good thermal conductivity such as silver and copper may be used.

  For example, the inorganic particles 1 are made of a material having higher thermal conductivity and Vickers hardness than the upper metal plate 2a and the lower metal plate 2b, and include at least one of insulating or conductive artificial diamond particles and cubic boron nitride particles. Contains. That is, the inorganic particles 1 are composed of only artificial diamond particles, only cubic boron nitride particles, a mixture of these particles, or a mixture mainly composed of these particles. Among these particles, an artificial diamond having excellent physical properties is more preferable from the viewpoint of thermal conductivity and hardness, and considering that the metal film 4 can be easily formed by plating, the conductive diamond is an electrically conductive material among the artificial diamonds. The thing which has property is good. The particle diameter of the inorganic particles 1 is set within a predetermined range by passing through a mesh having mesh sizes of 650 μm and 750 μm, for example.

  One or more inorganic particles 1 are used. When considering the maximum manufacturable diameter of the artificial diamond or cubic boron nitride particles as the inorganic particles 1 and the heat generation and size of the electronic component C, these inorganic particles are actually in the plane direction of the mounting portion A1. It is better to arrange a plurality of 1, and heat transfer characteristics can be further improved by increasing the heat radiation area. When a plurality of inorganic particles 1 are used, the inorganic particles 1 can be densely aligned on the lower metal plate 2b using an aligner or the like, and a plurality of inorganic particles 1 are arranged in the plane direction of the mounting portion A1. The arranged heat dissipating member A can be easily manufactured.

  The alignment by the aligner is performed by placing the inorganic particles 1 on the lower metal plate 2a and then vibrating the lower metal plate 2a. Artificial diamond particles and cubic boron nitride particles are crystal bodies having an irregular polyhedron, and by aligning in this way, one plane of the crystal body becomes substantially parallel to the surface of the lower metal plate 2b. Aligned. A part of the inorganic particles 1 is embedded in the upper metal plate 2a and the lower metal plate 2b, and the upper metal plate 2a, the lower metal plate 2b, and the inorganic particles 1 come into contact with each other on the surface.

  In this way, by arranging a plurality of small inorganic particles 1 with respect to the surface direction of the mounting portion A1, when mounting an electronic component having a very high exothermic property, or when mounting a large electronic component, The heat dissipating area can be easily increased, and the heat dissipating member A having good heat conduction characteristics can be obtained.

  A metal film 4 is formed on the surface of the inorganic particles 1. Since the metal film 4 not only functions as a bonding medium between the inorganic particles 1 and the brazing material 5 but also needs to function as a heat transfer medium, it is preferable to perform copper plating or silver plating by electroplating. For example, a copper plating having a thickness of about 3 μm is applied.

  Also, the brazing material 5 at the site where the inorganic particles 1 and the upper metal plate 2a are joined and the site where the inorganic particles 1 and the lower metal plate 2b are joined are a silver-copper brazing material with good thermal conductivity. Aluminum brazing material, silver brazing material or copper brazing material is preferably used, and the thickness after bonding is preferably 5 μm or more and 25 μm or less. If the thickness is less than 5 μm, the bonding strength between the upper metal plate 2a or the lower metal plate 2b and the inorganic particles 1 becomes weak, and cracks occur in the brazing material 5 due to the thermal stress caused by the heat generated by the electronic component C. It may be peeled off. Therefore, it becomes difficult to transfer the heat generated by the electronic component C to the external substrate. On the other hand, if it exceeds 25 μm, the thermal conductivity of the brazing material 5 is as low as about 300 W / mK as compared with the inorganic particles 1, so that the heat between the upper metal plate 2 a or the lower metal plate 2 b and the inorganic particles 1 is low. It may become a blocking medium. Therefore, the thickness of the brazing material 5 is preferably 5 μm or more and 25 μm or less.

  As the brazing material 5, JIS-regulated BAg-1, 1A, 2, 3, 4, 5, 6, 7, 7A, 7B, 8, 8A, 8B, 20, 20A, 21, 24, BVAg-0, 6b , 8, 18, 29, 30, 31, 32, etc., silver-copper brazing material, silver brazing material made of pure silver, copper brazing material such as BCu-1, 1A, A1085, A1080, A1070, A1060, A1050, A1100, An aluminum brazing material such as A1200 can be used. Further, when a small amount of an active metal such as titanium (Ti), zirconium (Zr), niobium (Nb) is added to the brazing material 5, the bondability with the inorganic particles 1 is further strengthened.

  Moreover, since the brazing material 5 is a relatively soft metal, the brazing material 5 has a buffering effect against external impacts on the inorganic particles 1. Also, since the electrical conductivity is good, if the surface of the inorganic particles 1 is covered with the brazing material 5, the function of electrically connecting the upper metal plate 2a and the lower metal plate 2b can be achieved. it can. Alternatively, the brazing material 5 may be used as the conductor 3 that fills the space between the inorganic particles 1.

  When this brazing material 5 is used as the conductor 3 as shown in FIGS. 1B, 2B, and 3B, there is a particular problem even if a certain amount of voids are present in the conductor 3. There is no. That is, since the heat path transmitted to the external substrate through the upper metal plate 2a, the inorganic particles 1, and the lower metal plate 2b is dominant, voids in the brazing material 5 as the conductor 3 do not matter. The conductor 3 also functions as a holding member for the inorganic particles 1 against external impacts and the like. Furthermore, in the electronic component storage package or the electronic device, the inorganic particles 1 of the heat radiating member A are used when performing a helium leak test that is used when performing a hermeticity inspection of a portion (so-called cavity) that stores the electronic component. It also has a function of preventing the so-called pseudo leak that helium remaining in the space between them is detected.

  The conductor 3 only needs to be conductive. For example, a conductive resin such as silver epoxy in which silver particles are dispersed in an epoxy resin may be used. Furthermore, when sufficient electrical continuity is obtained between the upper metal plate 2a and the lower metal plate 2b by the metal film 4 or the brazing material 5 deposited on the surface of the inorganic particles 1, the resin having no conductivity is made conductive. It may be used instead of the body 3.

  The upper metal plate 2a and the lower metal plate 2b have a high thermal conductivity and are preferably a flexible metal, and copper, silver or aluminum is used. From the viewpoint of thermal conductivity, pure silver, pure copper, or pure aluminum having a purity of 99% or more is preferably used. The upper metal plate 2a and the lower metal plate 2b are formed by, for example, rolling a pure copper ingot to form a plate-like body having a thickness of about 0.1 mm, and further performing metal processing such as punching by press or wire electric discharge machining. Are processed into a copper plate or the like formed into a predetermined plan view shape.

  Since copper, silver, and aluminum metal are very soft, the inorganic particles 1 (the upper portion 1a and the lower portion 1b of the inorganic particles 1) are embedded in the upper metal plate 2a and the lower metal plate 2b by hot pressing or the like (pressure contact). Is easy. Since the inorganic particles 1 are embedded in the upper metal plate 2a and the lower metal plate 2b, the thicknesses of the upper metal plate 2a and the lower metal plate 2a, which have lower thermal conductivity than the inorganic particles 1, are less than the inorganic particles 1. It becomes thin at the portion where is embedded, and heat is easily transferred to the inorganic particles 1.

  The upper metal plate 2a and the lower metal plate 2b have a function as a support substrate for fixing the inorganic particles 1 in addition to the function of mounting the electronic component C and placing the electronic component C on an external substrate. In addition, since the upper part 1a and the lower part 1b of the inorganic particles 1 are bonded via the brazing material 5 with the upper part 1a and the lower part 1b being embedded in the upper metal plate 2a and the lower metal plate 2b, the upper metal plate 2a and the lower metal plate are joined. The bond strength of the particles to 2b is very high.

  Since the inorganic particles 1 are embedded in the upper metal plate 2a or the lower metal plate 2b, the lower surface of the upper metal plate 2a, the upper portion 1a of the inorganic particles 1, the upper surface of the lower metal plate 2b, and the inorganic particles 1 The contact area with the lower portion 1b is increased, and the heat transfer properties between the upper metal plate 2a and the lower metal plate 2b and the inorganic particles 1 are excellent. In addition, since the inorganic particles 1 are firmly bonded to the upper metal plate 2a and the lower metal plate 2b via the brazing material 5, heat during processing of the brazing process or the operation of the electronic component C is repeatedly applied. However, the adhesion between the inorganic particles 1 and the upper metal plate 2a or the lower metal plate 2b becomes insufficient, and heat transfer is not impaired. The heat dissipating member A of the present invention efficiently externalizes heat from the electronic component C due to the heat conduction characteristics of the inorganic particles 1 having better heat conductivity than the heat conductivity of the upper metal plate 2a and the lower metal plate 2b. It can be transmitted to the substrate.

  Further, since the metal film 4 is deposited on the surface of the inorganic particles 1 and this metal film 4 is interposed between the inorganic particles 1 and the brazing material 5, the wettability of the brazing material 5 with respect to the metal film 4 is increased. As a result, the bonding property of the inorganic particles 1 to the upper metal plate 2a or the lower metal plate 2b is improved, and the thermal conductivity of the heat dissipation member is improved.

  FIG. 6 is an explanatory view schematically illustrating a method for manufacturing the heat dissipation member A of the present invention. Hereinafter, the manufacturing method of the heat radiating member A of this invention is demonstrated using FIG.

  The heat dissipating member A of the present invention is placed on the base plate in the order of the lower metal plate 2b, the thin plate of the brazing material 5, the inorganic particles 1, the thin plate of the brazing material 5, and the upper metal plate 2a. The upper metal plate 2a and the lower metal plate 2b can be manufactured by a hot uniaxial pressing method (hereinafter referred to as hot pressing) in which pressure is applied while adjusting the temperature so as not to melt. For example, when the upper metal plate 2a and the lower metal plate 2b are made of copper, hot pressing is performed using a silver-copper brazing material such as BAg-8 containing 72% silver and 28% copper. When the upper metal plate 2a and the lower metal plate 2b are made of copper and a copper brazing material is used for the brazing material 5, the temperature is adjusted so that the upper metal plate 2a and the lower metal plate 2b are cooled before melting. .

  By adjusting the amount of the brazing material 5 to be small, as shown in FIG. 1 (a) or FIG. 3 (a), between the upper metal plate 2a and the lower metal plate 2b and the inorganic particles 1, and between the inorganic particles 1 It is fabricated so as to connect the lower metal plate 2b from the upper metal plate 2a to the lower metal plate 2b on the side surface. Further, as shown in FIG. 3 (b) showing an enlarged cross section around one inorganic particle 1 of the heat dissipating member A of the present invention shown in FIG. 1 (b) or FIG. 1 (b), the amount of the brazing material 5 is adjusted. The conductor 3 is prepared by adjusting a lot or by mixing the powder of the brazing material 5 with the inorganic particles 1 and flowing the excess brazing material 5 so as to fill the space between the inorganic particles 1. The

  Then, due to the pressure applied to the upper metal plate 2a and the lower metal plate 2b, the inorganic particles 1 pass through the thin film of the brazing material 5 so that the upper part 1a is the upper metal plate 2a and the lower part 1b is the lower metal. It joins so that it may be embedded in the board 2b.

  In addition to the brazing material 5, a conductive resin such as silver epoxy as the conductive material 3 is separately injected into the space formed between the side surfaces of the inorganic particles 1 as shown in FIG. Also good. Further, when hot pressing is performed in a vacuum atmosphere, it is possible to avoid oxidation of the upper metal plate 2a, the lower metal plate 2b, the silver-copper brazing material as the brazing material 5, etc., and to improve the bondability and heat transfer characteristics. It can be maintained well.

  Further, the distance between the lower surface of the upper metal plate 2a and the brazing material 5 and the distance between the lower surface of the lower metal plate 2b and the brazing material 5 are narrower, that is, directly below the upper metal plate 2a and the inorganic particles 1 immediately below the inorganic particles 1. As the thickness of the lower metal plate 2b is thinner, the heat generated by the electronic component C can be quickly transmitted to the inorganic particles 1, and the heat conduction characteristics of the inorganic particles 1 can be effectively utilized. The thicknesses of the upper metal plate 2a and the lower metal plate 2b by embedding the inorganic particles 1 are preferably set so that the minimum thickness is 15 μm by appropriately adjusting the pressing force in the hot press. When thinner than 15 μm, the brazing material 5 diffuses into the upper metal plate 2a or the lower metal plate 2b, so that a white stain appears on the surface of the upper metal plate 2a or the lower metal plate 2b. May cause problems.

  Further, by making the upper metal plate 2a and the lower metal plate 2b thick and performing hot pressing by adjusting the pressure and temperature conditions, as shown in FIG. It is also possible to obtain a heat dissipation member A in which most of the inorganic particles 1 are embedded in the upper metal plate 2a and the lower metal plate 2b in 1b.

  When the electronic component C is joined to the mounting portion A1 with solder such as gold-tin alloy or gold-germanium alloy, at least the upper surface of the upper metal plate 2a is preferably plated with nickel and gold.

  Then, artificial diamond particles having a particle size of 650 μm to 750 μm are used as the inorganic particles 1, and a metal film 4 made of copper having a thickness of 3 μm is deposited on the surface thereof by an electroplating method, and a brazing material 5 (BAg-8) having a thickness of 20 μm. The upper metal plate 2a and the lower metal plate 2b made of copper having a thickness of 0.1 mm are joined to the upper metal plate 2a and the lower metal plate 2b in the portion where the inorganic particles 1 are embedded. When the heat radiating member A embedded to have a thickness of 15 μm or more was produced, the heat radiating member A of the present invention having a thermal conductivity of 500 W / mK or more could be obtained. That is, the heat radiating member A having a thermal conductivity larger than that of the upper metal plate 2a and the lower metal plate 2b could be produced.

  Further, as shown in FIGS. 2A and 2B, a plurality of heat radiation members A can be stacked in a direction perpendicular to the surface direction of the mounting portion A1. In FIGS. 2A and 2B, an example in which two layers are stacked is shown, but a multilayer structure can also be used.

  A method of directly stacking a large number of inorganic particles 1 in the vertical direction is also conceivable in increasing the size, but it is difficult to arrange and stack them in an orderly manner because the inorganic particles 1 have an irregular shape. Moreover, even if it can be laminated | stacked, since the inorganic particles 1 are irregularly shaped, it is not easy to align the directions of the inorganic particles 1, and the inorganic particles 1 are in contact with each other in a very small area such as point contact. Therefore, it is not easy to improve the heat transfer between the particles. A method of making the inorganic particles 1 into a prismatic shape, a columnar shape, etc. with a well-shaped shape by polishing or the like and orderly stacking the inorganic particles 1 with each other is not practical because it takes a lot of time and cost for polishing and stacking operations. On the other hand, according to the method of stacking the heat radiation member A of the present invention, the inorganic particles 1 can be stacked in an orderly manner in the vertical direction.

  Lamination of the heat radiating members A may be performed, for example, by joining the lower metal plate 2b of the other heat radiating member A to the surface of the upper metal plate 2a of the one heat radiating member A by brazing or the like. Alternatively, the upper metal plate 2a of the one heat radiating member A and the lower metal plate 2b of the other heat radiating member A may be used as a single metal plate and hot-pressed to form a multilayer heat radiating member A. However, if one common metal plate is used, it is difficult to apply pressure between the inorganic particles 1 and the common metal plate depending on the positions of the inorganic particles 1 arranged above and below the common metal plate. It may be difficult to embed in the board.

  Further, as shown in FIG. 2C, a molybdenum (Mo) plate 6 having a thickness of about 20 μm is interposed between the upper metal plate 2a of the one heat radiating member A and the lower metal plate 2b of the other heat radiating member A. When brazed, the thermal expansion coefficient in the surface direction of the laminated heat radiating member A becomes smaller than that of copper, silver, aluminum, etc., and the heat radiating member A having good compatibility with the thermal expansion coefficient of the electronic component C It can be.

  Next, as shown in FIG. 4, the electronic component storage package of the present invention is attached to the upper surface having the heat dissipating member A of the present invention and the mounting portion A1 by brazing or the like. And a terminal B having a wiring conductor B1 for signal input / output to be connected. The thermal expansion coefficient of the heat radiating member A largely depends on the size and number of the inorganic particles 1 and the size and thickness of the upper metal plate 2a and the lower metal plate 2b. Since the thermal expansion coefficient of the inorganic particles 1 is smaller than that of the upper metal plate 2a and the lower metal plate 2b, the thermal expansion coefficients of the heat radiating member A and the terminal B can be substantially matched by using these in combination. is there. Therefore, the residual thermal stress after manufacturing the electronic component storage package is also reduced, and it is possible to mount the electronic component C such that a large thermal stress is applied to the electronic component storage package by the electronic component C that generates a large amount of heat. It becomes.

Further, the terminal B is alumina _(Al 2 _{O 3)} sintered material, aluminum nitride (AlN) sintered material, mullite _{(3Al 2 O 3 · 2SiO 2} ) sintered material, the surface of the ceramics such as glass ceramics A wiring conductor B1 composed of a metallized layer for signal input / output is formed on the outside, and lead terminals for electrical connection with an external electric circuit board (not shown) are provided on the outer surface of the electronic component storage package of the wiring conductor B1. Be joined. Then, the mounting portion A1 is attached to the upper surface of the heat radiating member A via solder, resin, brazing material, glass or the like.

If the terminal B is made of, for example, an Al ₂ O ₃ sintered material, it is suitable for a raw material powder such as Al ₂ O ₃ , silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), etc. A mixture of organic binders, solvents, plasticizers, dispersants, etc. is added to form a slurry, and from this, a ceramic green sheet (ceramic raw sheet) is formed by adopting a doctor blade method or a calender roll method. In addition, the ceramic green sheet is subjected to an appropriate punching process, and a conductive material obtained by mixing an appropriate organic binder and solvent with a metal material powder such as W, Mo, Mn, Cu, Ag, Ni, Au, and palladium (Pd). After a functional paste is applied to a green sheet in advance by a screen printing method or the like in a predetermined pattern of the wiring conductor B1, this paste is applied. The green sheet laminating a plurality, is produced by firing at a temperature of about 1600 ° C..

  Further, when a metal having excellent corrosion resistance such as Ni and Au and excellent bonding property of electrical connection means such as a bonding wire is deposited on the exposed surface of the wiring conductor B1 to a thickness of 1 to 20 μm by a plating method, The oxidative corrosion of the wiring conductor B1 can be effectively prevented and the bonding force of the electrical connection means to the wiring conductor B1 can be strengthened.

  Next, as shown in FIG. 5, the electronic component C is mounted on the mounting portion A1 of the electronic component storage package of the present invention via an adhesive such as solder, resin, brazing material, or glass. As the electronic component C, a semiconductor element, a piezoelectric vibrator, a chip capacitor, a transistor, a light emitting element, or the like can be mounted. In particular, even when an electronic component C having a large calorific value as represented by a field effect transistor (FET) is mounted on the mounting portion A1 of the heat dissipation member A, the heat generated from the electronic component C is efficiently stored. Can be dissipated outside the package. Then, after mounting the electronic component C on the mounting portion A1 via an adhesive, the electrode of the electronic component C and the wiring conductor B1 of the terminal B are electrically connected by an electrical connection means such as a bonding wire, and further, by sealing resin The electronic device of the present invention is manufactured by so-called potting or by airtightly sealing the upper surface of the terminal B with the lid D.

  Thus, even when the amount of heat generated during operation of the electronic component C is very large, the electronic device C can be maintained at an appropriate operating temperature and can be operated normally and reliably.

  In addition, this invention is not limited to the example of the above embodiment, A various change is possible if it is the range which does not deviate from the summary of this invention. For example, instead of the discrete electronic component C, the ceramic circuit board may be mounted on the mounting portion A1 on the upper surface of the heat dissipation member A, and the electronic component C may be mounted on the circuit board.

  In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship in the drawings, and do not mean the positional relationship in actual use.

(A), (b), (c) is sectional drawing which shows an example of embodiment of the thermal radiation member of this invention, respectively. (A), (b) is sectional drawing which shows the other example of embodiment of the thermal radiation member of this invention, respectively. (A) is the principal part expanded sectional view of Fig.1 (a), (b) is the principal part expanded sectional view of FIG.1 (b). It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention. It is sectional drawing which shows an example of embodiment of the electronic device of this invention. It is the schematic explaining the schematic manufacturing method in producing the heat radiating member of this invention. It is sectional drawing which shows the example of the conventional heat radiating member.

Explanation of symbols

1: Inorganic particles 1a: Upper part (of inorganic particles 1) 1b: Lower part (of inorganic particles 1) 2a: One metal plate (upper metal plate)
2b: the other metal plate (lower metal plate)
3: Conductor 4: Metal film 5: Brazing material A: Heat radiation member A1: Mounting portion A2: Mounting surface B: Terminal B1: Wiring conductor C: Electronic component D: Lid

Claims (9)

One metal plate, the other metal plate opposed to the surface of the one metal plate, the one metal plate and the other metal having a thermal conductivity greater than that of the one metal plate and the other metal plate An inorganic particle having a metal film deposited on a surface thereof, which is interposed between a plate and joined via a brazing material so as to be partially embedded in the one metal plate and the other metal plate. A heat dissipating member characterized by comprising: 2. The heat radiating member according to claim 1, wherein the one metal plate and the other metal plate are made of silver, copper, or aluminum. The heat radiating member according to claim 1, wherein the inorganic particles include at least one of diamond particles and cubic boron nitride particles. The heat radiating member according to claim 1, wherein the brazing material is silver-copper brazing, aluminum brazing, silver brazing, or copper brazing. The heat radiating member according to claim 1, wherein the brazing material has a thickness of 5 μm to 25 μm. The heat radiating member according to any one of claims 1 to 5, wherein a conductor is disposed so as to connect the one metal plate and the other metal plate between the inorganic particles. A heat dissipating member comprising a plurality of heat dissipating members according to any one of claims 1 to 6. An electronic component storage package comprising: the heat dissipating member according to claim 1; and a terminal having a wiring conductor and attached to the outer peripheral portion of the surface of the heat dissipating member. . 9. The electronic component storage package according to claim 8, and an electronic component that is installed at the center of the surface of the heat dissipation member to which the terminal is attached and is connected to the wiring conductor, and is provided so as to cover the electronic component. An electronic device comprising: a sealing resin or a lid

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