JP4430477B2 - High heat dissipation type electronic component storage package - Google Patents

Description

  The present invention provides a heat sink plate that is screwed to a base in order to dissipate heat from a thin semiconductor element for high frequency use and the like and a heat sink from a heat sink plate and a base to which the heat sink is attached. The present invention relates to a package for housing a high heat radiation type electronic component comprising a window frame-shaped ceramic frame body and a joined body of external connection terminals.

  Conventionally, for example, electronic components such as silicon for RF (Radio Frequency) base stations, high-frequency and high-power semiconductor elements such as gallium arsenide field-effect transistors, and capacitors simultaneously mounted in the vicinity of the semiconductor elements have been used. Since the generated heat during operation is large, the device may not be able to operate normally unless the generated heat is dissipated well into the atmosphere. Therefore, in the high heat dissipation type electronic component storage package for mounting high frequency heat generation electronic components, the cavity portion of the electronic component mounting portion deteriorates the electrical characteristics in the high frequency region of the electronic components. Therefore, the electronic component mounting area formed on the heat sink plate made of a metal plate having a high heat dissipation characteristic in a substantially rectangular shape is joined so as to be surrounded by a ceramic window frame-shaped ceramic frame. Yes. The high heat dissipation electronic component storage package is configured to hermetically seal the cavity portion with a lid after the electronic component is mounted. The high frequency signal is input / output via an external connection terminal joined to the upper surface which is one main surface of the ceramic frame. The high heat dissipation type electronic component storage package in which the electronic components are sealed is a base for further dissipating the heat radiated to the heat sink plate to the outside, and both ends of the substantially rectangular shape of the heat sink plate in the longitudinal direction. Screws are attached to the notches formed in the through holes and through holes, and fixed by screwing.

As shown in FIGS. 4A and 4B, the conventional high heat dissipation electronic component storage package 50 has a thermal expansion coefficient similar to that of ceramic and has a high thermal conductivity, for example, Cu / Cu-Mo. A heat sink plate 51 made of a bonded composite metal plate such as Cu / Cu and a ceramic frame body 52 made of Al ₂ O ₃ or the like, and the ceramic frame body 52 is placed at the center of one main surface of the heat sink plate 51 This is formed by brazing and joining on a metallized pattern formed on the main surface side through AgCu brazing 53 and heating in a heating furnace. In addition to the brazing and joining, the ceramic frame 52 has an external connection terminal 54 made of a metal member for connection to the outside on the metallized pattern formed on the other main surface side of the ceramic frame 52. It mounts via the AgCu brazing 53 and is formed by brazing joining that is heated in a heating furnace. Furthermore, Ni plating and Au plating are applied to the metal surfaces of the heat sink plate 51, the ceramic frame 52, and the external connection terminal 54. Further, at both ends in the longitudinal direction of the heat sink plate 51, a notch for attaching to a base 55 for further dissipating the heat from the heat sink plate 51 to the outside and fixing with a screw 56 is fixed. A mounting portion 57 made of a hole or the like is provided.

  The high heat dissipation type electronic component storage package has upper and lower surfaces of a core made of a unidirectional composite material in which carbon fibers arrayed in the thickness direction are bonded to the heat sink plate in order to improve heat dissipation of the electronic component. A metal layer having a three-layer structure consisting of an adhesive layer made of at least one of titanium, zirconia, vanadium or an alloy containing these as a main component, an intermediate layer made of copper, and a main layer made of molybdenum is applied. A package using the above has been proposed (see, for example, Patent Document 1). In addition, in the high heat dissipation type electronic component storage package, in order to improve the heat dissipation of the electronic component by improving the adhesion between the heat sink plate and the base, protrusions are provided at both ends in the longitudinal direction of the heat sink plate, A method has been proposed in which both ends on the inside of the protrusion are tightened with screws using the protrusion as a fulcrum, and the central portion in the longitudinal direction of the heat sink plate is brought into close contact with the base (for example, see Patent Document 2). Furthermore, in the high heat dissipation type electronic component storage package, an indium sheet is sandwiched between the heat sink plate and the base for the purpose of improving heat dissipation characteristics and electrical characteristics between the heat sink plate and the base. What has been tightened with screws has been proposed (for example, see Patent Document 3).

JP 2000-183197 A Japanese Patent Laid-Open No. 4-237552 JP 2001-230349 A

However, the conventional high heat dissipation electronic component storage package as described above has the following problems.
(1) Recent electronic components mounted on a package for storing high heat radiation type electronic components, for example, semiconductor elements represented by for RF base stations, electronic components such as capacitors, etc. As the heat generation increases, the thickness of the electronic components is reduced to cope with higher heat dissipation. When mounting such thinned semiconductor elements and electronic components such as capacitors by heat bonding with a bonding material such as AuSi brazing, slight protrusions on the surface of the heat sink plate on which the electronic components are mounted, Due to the presence of a small foreign substance attached to the surface, the shrinkage of the cooling process of the bonding material may cause a crack or breakage of the electronic component, which is a fatal defect that does not function as a device.
(2) The conventional high heat dissipation type electronic component storage package has changed the material and structure of the heat sink plate or improved the adhesion between the heat sink plate and the base in order to cope with the high heat dissipation of the electronic component. However, it is difficult to prevent the occurrence of cracks in the electronic component due to the presence of slight protrusions on the surface of the heat sink plate because the high heat dissipation response due to the thinning of the electronic component cannot be eliminated.
The present invention has been made in view of such circumstances, and even if the thickness of the electronic component is reduced in order to cope with higher heat dissipation of the electronic component such as a semiconductor element or a capacitor, the electronic component An object of the present invention is to provide a high heat dissipation type electronic component storage package that is free from cracks and breakage.

The high heat dissipation type electronic component storage package according to the present invention that meets the above-mentioned object is characterized in that a ceramic frame is brazed and joined to a heat sink plate made of a metal plate for radiating heat generated from the electronic component, and the heat sink plate in the ceramic frame is joined. In a high heat dissipation type electronic component storage package on which electronic components are placed, a heat sink plate and a ceramic frame are joined with AgCu brazing , and a plating film is applied to the surface of the heat sink plate, and then surrounded by a ceramic frame. The radius of curvature at which the inner wall of the ceramic frame can be fitted to the bottom of the cavity where the electronic components of the heat sink plate are placed with a clearance, and the contact surface with the heat sink plate is the maximum protrusion at the center. with contact of the upper jig consisting of a convex shape having a back surface of the contact surface is a heat sink plate with the backside to encompass the entire back surface of the heat sink plate And the heat sink plate lower jig abuts consisting concave shape having the same radius of curvature as the upper tool radius of the largest recess in eccentric part is pressed through the upper jig and the lower jig, the cavity The bottom surface has a smooth surface.

Sink high heat dissipation type electronic component storing package according to claim 1 Symbol placement is that by joining the heat sink plate and the ceramic frame body at AgCu brazing, after the plating film is applied to the surface of the heat sink plate, which is surrounded by the insulating wall A convex portion having a radius of curvature that can be fitted with a clearance between the inner wall of the ceramic frame body and a clearance on the bottom surface of the cavity portion on which the electronic components of the plate are placed , and the contact surface with the heat sink plate is the maximum protruding portion at the center portion. with contact of a shape upper jig, the same radius of curvature as the radius of curvature of the upper jig contact surface with the back surface to encompass the entire back surface of the heat sink plate with the maximum recess in the back surface center portion of the heat sink plate the is pressed through a heat sink plate lower jig abuts consisting concave shape upper jig and the lower jig having, since the bottom surface of the cavity portion has a smooth surface, a small bottom of the cavity Force and, embedded in the heat sink plate in and nodules foreign objects easily and reliably crushed attached to the surface can be made smooth the bottom of the cavity, and a semiconductor element is bonded to the bottom surface of the cavity, capacitors, etc. Even if the electronic component has a reduced thickness, the electronic component can be joined without causing cracks or breakage in the electronic component. In addition, even if the heat sink plate is slightly warped, it is possible to easily crush the slight protrusions on the surface of the cavity portion and small foreign matter adhering to the surface to smooth the bottom surface of the cavity portion. Even if the thickness is reduced, it can be bonded to electronic components without causing cracks or breakage, and the back surface of the heat sink plate can have a convex shape with a gentle radius of curvature. Thus, the mounting adhesion with the base can be improved, and the heat release from the electronic components can be improved.

Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIGS. 1A and 1B are a plan view, a vertical cross-sectional view taken along line AA ′, and FIG. 2A, respectively, of a high heat dissipation electronic component storage package according to an embodiment of the present invention. (B) is an explanatory view of a modified example of the same high heat dissipation type electronic component storage package, an explanatory view of another modified example, and FIGS. 3 (A) and (B) are respectively the same high heat dissipation type electronic component storage package It is explanatory drawing by which an electronic component is mounted and attached to a base.

  As shown in FIGS. 1A and 1B, a high heat dissipation electronic component storage package 10 according to an embodiment of the present invention is mounted on, for example, a high frequency semiconductor element or a capacitor. A heat sink composed of a substantially rectangular plate-like metal plate having high heat dissipation characteristics for radiating a large amount of heat generated from the electronic component 22 (see FIG. 3A) and having a thermal expansion coefficient approximate to that of ceramic. One main surface of the ceramic frame 12 made of ceramic is brazed and joined to one main surface of the plate 11 with a high-temperature brazing material (not shown) such as AgCu brazing. By bonding the heat sink plate 11 and the ceramic frame body 12, the high heat dissipation electronic component housing package 10 has a wall surface of the ceramic frame body 12 and one main surface of the heat sink plate 11 surrounded by the wall surface. A cavity portion 13 for mounting the electronic component 22 is formed. Further, the high heat dissipation type electronic component storage package 10 has an electronic component 22 mounted on the heat sink plate 11 of the cavity portion 13 and electrically connected to the upper surface, which is the other main surface of the ceramic frame 12, and externally connected. A lead frame-shaped external connection terminal 14 made of a metal plate for electrical continuity is brazed with a high-temperature brazing material (not shown) such as AgCu brazing, for example. Further, the high heat dissipation type electronic component storage package 10 has a base 27 (see FIG. 3B) and screws 28 (see FIGS. 3A and 3B) at both ends of the heat sink plate 11 in the longitudinal direction. ), And a mounting portion 15 made up of a through-hole or the like. The high heat dissipation electronic component storage package 10 is formed as a joined body 16 of the heat sink plate 11, the ceramic frame body 12, and the external connection terminal 14.

  In the high heat dissipation type electronic component storage package 10 composed of the joined body 16, after all the metal surfaces exposed on the surface of the joined body 16 are plated with, for example, Ni or NiCo, the electronic component An upper jig 17 that can be fitted with a slight clearance between the inner wall of the ceramic frame 12 is applied to one main surface of the heat sink plate 11 at the bottom surface portion of the cavity portion 13 on which 22 is placed. Touched. Further, the lower jig 18 is brought into contact with the back surface which is the other main surface of the heat sink plate 11 so as to include the entire back surface. The heat sink plate 11 is pressed through the upper jig 17 and the lower jig 18. Due to this pressing, the high heat dissipation electronic component storage package 10 has a smooth surface 19 on the bottom surface of the cavity portion 13 crushed by slight protrusions protruding on the surface of the cavity portion 13 and small foreign matter adhering to the surface. is doing.

Next, referring to FIGS. 2A and 2B, a high heat dissipation type electronic component storage package 10a as a modified example of the high heat dissipation type electronic component storage package 10 according to an embodiment of the present invention, and others. A high heat radiation type electronic component storage package 10b of the modified example will be described.
As shown in FIG. 2A, a high heat dissipation type electronic component storage package 10a, which is a modification of the high heat dissipation type electronic component storage package 10, is similar to the case of the high heat dissipation type electronic component storage package 10. All the metal surfaces exposed on the surface of the joined body 16 including the plate 11, the ceramic frame body 12, and the external connection terminals 14 are plated. After this, one main surface of the heat sink plate 11 on the bottom surface of the cavity portion 13 can be fitted with a slight clearance between the inner wall of the ceramic frame 12 and the contact surface with the heat sink plate 11. The upper jig 17a made of the convex shape 20 having a gentle radius of curvature that becomes the maximum protrusion at the center is brought into contact. Then, the lower jig 18 is brought into contact with the back surface which is the other main surface of the heat sink plate 11 so as to include the entire back surface, and the heat sink plate 11 is pressed via the upper jig 17 a and the lower jig 18. Has been. By this pressing, even if the heat sink plate 11a has a slight warp, the high heat dissipation electronic component storage package 10a removes a slight protrusion protruding on the surface of the cavity portion 13 or a small lump foreign matter adhering to the surface. The bottom surface of the cavity 13 has a smooth surface 19 that is embedded in the heat sink plate 11 easily and reliably.

  As shown in FIG. 2B, the high heat dissipation type electronic component storage package 10b of another modification of the high heat dissipation type electronic component storage package 10 is the same as the case of the high heat dissipation type electronic component storage package 10, 10a. Similarly, a plating film is applied to all metal surfaces exposed on the surface of the joined body 16. After this, the upper jig 17 that can be fitted with a slight clearance between the inner wall of the ceramic frame 12 or the heat sink plate on one main surface of the heat sink plate 11 at the bottom surface of the cavity portion 13. The upper jig 17a made of a convex shape 20 having a gentle curvature radius at the contact surface with the contact 11 is contacted. Then, the back surface, which is the other main surface of the heat sink plate 11, includes the entire back surface so that the contact surface with the back surface of the heat sink plate 11 becomes a maximum recess at the center of the back surface of the heat sink plate 11. A lower jig 18 a made of a concave shape 21 having a large radius of curvature is brought into contact with the heat sink plate 11 and is pressed through the lower jig 18 a and the upper jig 17 or the upper jig 17 a having a convex shape 20. Yes. Due to this pressing, even if the heat sink plate 11 is slightly warped, the high heat dissipation type electronic component storage package 10b has slight protrusions protruding on the bottom surface of the cavity part 13, small lump foreign matter adhering to the surface, etc. Can be easily embedded in the heat sink plate 11, and the back surface of the heat sink plate 11 can be formed into a convex shape having a gentle radius of curvature to improve attachment adhesion to the base 27, and heat dissipation from the electronic component 22. The bottom surface of the cavity 13 that can improve the smoothing has a smooth surface 19. In addition, in order to give convexity to the back surface of the heat sink plate 11 having high bending strength after the joined body 16 is formed, a large pressing force is required. Therefore, before the joined body 16 is formed, the heat sink plate 11 is formed. It is preferable that a convex shape is formed on the back surface. In this case, the concave shape 21 formed in the lower jig 18 a is preferably provided with a concave having a radius of curvature substantially equal to the convex shape of the back surface of the heat sink plate 11.

  As shown in FIGS. 3 (A) and 3 (B), in the high heat radiation type electronic component storage package 10, 10a, 10b, the electronic component 22 is joined to the cavity portion 13, and the electronic component 22 and the external connection terminal 14 are connected. After being connected with the bonding wire 23 or the like, the lid 24 made of resin, ceramic, metal, or the like is bonded with an adhesive 25 such as resin or glass, and the cavity 13 is hermetically sealed. The high frequency module substrate 26 and the like are formed. The high frequency module substrate 26 radiates heat generated from the electronic component 22 to the heat sink plate 11, and further attaches screws 28 to the mounting portion 15 provided on the heat sink plate 11 to the base 27 for radiating heat to the outside. It is inserted and fixed with screws. The high-frequency module substrate 26 has at least a convex surface with a gentle curvature radius on the back surface, which is the other main surface of the heat sink plate 11, in order to efficiently dissipate the heat generated by the electronic component 22 from the base 27. A portion corresponding to the mounting area portion of the electronic component 22 mounted in the cavity portion 13 is preferably in close contact with the base 27.

  Usually, the high heat dissipation type electronic component storage packages 10, 10 a, and 10 b have foreign matters protruding in a slightly protruding shape on the bottom surface of the cavity portion 13 of the heat sink plate 11, or on the bottom surface of the cavity portion 13 during brazing joining. Small lump foreign matter or the like due to the remaining residue remaining after the etching processing of the brazing material that has flowed out adheres. However, the high heat dissipation type electronic component storage package 10, 10 a, 10 b has a smooth surface 19 by embedding these slight protrusions and small foreign matter in the heat sink plate 11. Even if the electronic component 22 is bonded through the bonding material and a tensile stress is generated in the cooling process of the bonding material, the electronic component 22 can be prevented from being cracked or broken.

Next, a manufacturing method of the high heat radiation type electronic component storage package 10, 10a, 10b (hereinafter referred to as 10) according to an embodiment of the present invention will be described.
First, each member used for the joined body 16 forming the high heat radiation type electronic component storage package 10 will be described. The heat sink plate 11 for forming the joined body 16 has a thermal expansion coefficient approximate to that of a ceramic and has high heat dissipation characteristics with high thermal conductivity, for example, porous tungsten (W) and copper (Cu Cu-W-based composite metal plates prepared by impregnating a Cu-Mo-based composite metal plate, Cu-Mo-based alloy metal plates made of Cu and molybdenum (Mo), and Cu plates on both sides of the Cu-Mo-based composite metal plate. Is formed from a Cu / Cu—Mo / Cu bonding plate or the like clad. In selecting the heat sink plate 11, it is effective to use a material having a high ratio of Cu having good thermal conductivity in order to improve heat dissipation characteristics. However, since Cu has a high thermal expansion coefficient, Material selection other than Cu for achieving consistency of expansion coefficients, and a structure as a plate material of Cu and another metal are important. The heat sink plate 11 is formed in a substantially rectangular shape by providing an attachment portion 15 for screwing and fixing to the base 27 using a technique such as cutting or powder metallurgy. Incidentally, when the heat sink plate 11 is Cu—W, the thermal conductivity is about 220 W / m · K, the thermal expansion coefficient is about 7.8 × 10 ⁻⁶ / K (30 to 800 ° C.), and Cu / Cu—Mo / Cu (thickness ratio = 2: 3: 2), the thermal conductivity is about 260 W / m · K, and the thermal expansion coefficient is 9.2 × 10 ⁻⁶ / K (30 to 800 ° C. Therefore, the material is selected in accordance with the allowable warpage and allowable heat dissipation characteristics of the joined body 16.

Next, the ceramic frame 12 for forming the joined body 16 is formed of a ceramic made of alumina (Al ₂ O ₃ ), aluminum nitride (AlN), low-temperature fired ceramic, or the like. When the ceramic frame 12 is made of Al ₂ O ₃ which is an example of ceramic, first, dioctyl phthalate or the like is added to a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica or calcia to Al ₂ O ₃ powder. A plasticizer, a binder such as an acrylic resin, and a solvent such as toluene, xylene, and alcohols are added, kneaded sufficiently, and defoamed to prepare a slurry having a viscosity of 2000 to 40000 cps. Next, for example, a roll-shaped sheet having a thickness of 0.25 mm is formed by a doctor blade method or the like, and a ceramic green sheet cut into a rectangular shape having an appropriate size is produced.

One or a plurality of ceramic green sheets are punched into a hollow shape so as to have a window frame shape, and a metal conductor paste made of a refractory metal such as tungsten or molybdenum is used to form a lower surface of the ceramic frame 12. The metal conductor pattern is formed by screen printing so that the side becomes one main surface and the upper surface side becomes the other main surface. Further, when there are a plurality of ceramic green sheets, they are laminated and screen-printed so that one main surface and the other main surface of the laminate are metal conductor patterns. Then, a refractory metal and a ceramic green sheet are simultaneously fired in a reducing atmosphere to produce a ceramic frame 12 having metal conductor patterns on both surfaces. The metal conductor pattern on one surface is formed on the entire peripheral surface of the lower surface of the ceramic frame 12 in order to braze and join the heat sink plate 11 to the entire periphery of the window frame shape. In addition, the thermal expansion coefficient of Al ₂ O ₃ is about 6.7 × 10 ⁻⁶ / K, and although it is approximate to the heat sink plate 11 but is difficult to match, basically, after joining, It is difficult to prevent warping.

Next, the external connection terminals 14 for forming the joined body 16 are ceramics such as KV (Fe—Ni—Co alloy, trade name “Kovar”) or 42 alloy (Fe—Ni alloy). And a plurality of external connection terminals 14 provided in one high heat radiation type electronic component storage package 10 by a tie bar portion by cutting, etching, punching, or the like. It is formed in a lead frame shape. Incidentally, the thermal expansion coefficient of KV is about 5.3 × 10 ⁻⁶ / K, which is approximated to the thermal expansion coefficient of ceramic.

  Next, a manufacturing method of the joined body 16 formed by joining the heat sink plate 11, the ceramic frame body 12, and the external connection terminal 14 will be described. First, the first Ni plating made of Ni, Ni alloy, or the like is applied to the entire surface of the heat sink plate 11, the surfaces of the metal conductor patterns on both surfaces of the ceramic frame 12, and the entire surface of the external connection terminal 14. Next, a ceramic made of Ag-Cu brazing such as BAg-8 (eutectic alloy consisting of 72% Ag and the remainder Cu) is formed at the center of one main surface of the heat sink plate 11 having a planar shape. Place one main surface on the lower surface side of the ceramic frame 12 in contact with a window frame-shaped high-temperature brazing material that matches the shape of the frame 12, and heat at about 780 to 900 ° C. It is attached. Next, the lower surface side of the tip end portion of the external connection terminal 14 is brought into contact with the other main surface, which is the upper surface side of the ceramic frame body 12, via a high-temperature brazing material made of, for example, Ag-Cu brazing such as BAg-8. And brazed by heating at about 780 to 900 ° C. A joined body 16 is formed by joining the heat sink plate 11 and the ceramic frame body 12 and joining the ceramic frame body 12 and the external connection terminal 14. Then, the second Ni plating is performed on the entire metal surface exposed on the outer surface of the joined body 16. The joined body 16 can be formed by simultaneously joining the heat sink plate 11 and the ceramic frame body 12 and joining the ceramic frame body 12 and the external connection terminal 14 together.

  Next, on the bottom surface of the cavity portion 13 of the heat sink plate 11 surrounded by the ceramic frame 12 of the joined body 16, an upper jig 17 made of stainless steel or the like that can be fitted with a clearance with the inner wall of the ceramic frame 12, The upper jig 17a having a convex shape 20 having a gentle curvature radius, for example, about 2000 mm, is brought into contact with the heat sink plate 11. Further, on the back surface of the heat sink plate 11 of the joined body 16, the lower jig 18 made of stainless steel or the like that includes the entire heat sink plate 11 and the contact surface with the heat sink plate 11 have a gentle curvature radius, for example, A lower jig 18a having a concave shape 21 having a radius of curvature of about 2000 mm is brought into contact. Then, the lower jigs 18 and 18a are placed on the base of the press machine and pressed from above the upper jigs 17 and 17a. By this pressing, the bottom surface of the cavity portion 13 of the heat sink plate 11 is finished to a smooth surface 19 by crushing slight protrusions on the surface of the heat sink plate, small lump foreign matter attached to the surface, and the like.

  Next, Au plating is applied to the joined body 16 on the Ni plating. The joined body 16 formed as described above is formed between the opening of the ceramic frame 12 and one main surface of the heat sink plate 11 in order to mount a high-frequency semiconductor element or an electronic component 22 such as a capacitor. The heat sink plate 11 is formed as a high heat radiation type electronic component storage package 10 having a formed cavity portion 13 and having the other main surface of the heat sink plate 11 in contact with a heat radiation base 27.

  The high-frequency package of the present invention is mounted with a thin semiconductor element taking into consideration heat dissipation such as high frequency, high output such as silicon or gallium arsenide field effect transistor, and an electronic component such as a capacitor. For example, RF (Radio Frequency) It can be used for a base station or the like.

FIGS. 4A and 4B are a plan view and a longitudinal sectional view taken along line A-A ′ of a high heat dissipation electronic component storage package according to an embodiment of the present invention, respectively. (A), (B) is explanatory drawing of the modification of the high heat dissipation type electronic component storage package, respectively, and explanatory drawing of another modification. (A), (B) is explanatory drawing by which an electronic component is mounted in the same high heat dissipation type electronic component storage package, and is attached to a base. (A) and (B) are a plan view and a B-B ′ line longitudinal sectional view of a conventional high heat dissipation electronic component storage package, respectively.

Explanation of symbols

  10, 10a, 10b: High heat dissipation type electronic component storage package, 11: Heat sink plate, 12: Ceramic frame, 13: Cavity part, 14: External connection terminal, 15: Attachment part, 16: Joint, 17, 17a : Upper jig, 18, 18a: Lower jig, 19: Smooth surface, 20: Convex shape, 21: Concave shape, 22: Electronic component, 23: Bonding wire, 24: Lid, 25: Adhesive, 26: Module board for high frequency, 27: base, 28: screw

Claims (1)

A highly radiating electronic component housing in which a ceramic frame is brazed and joined to a heat sink plate made of a metal plate for radiating heat generated from the electronic component, and the electronic component is placed on the heat sink plate in the ceramic frame In the package for
A cavity where the heat sink plate and the ceramic frame are joined with AgCu brazing , and a plating film is applied to the surface of the heat sink plate, and then the electronic component of the heat sink plate surrounded by the ceramic frame is placed An upper jig made of a convex shape having a radius of curvature at which the contact surface with the heat sink plate becomes the maximum protruding portion at the center is applied to the bottom surface of the portion with a clearance with the inner wall of the ceramic frame. while contact, concave shape having the same radius of curvature as the abutment surface is the upper tool radius of the maximum recess in the back surface center portion of the heat sink plate with the back surface to encompass the entire back surface of the heat sink plate the heat sink plate lower jig abuts consisting is pressed through the lower jig and said upper jig, high discharge bottom surface of the cavity is characterized by having a smooth surface Type electronic component storing package.

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