JP4480598B2 - Electronic component storage package and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package and an electronic apparatus that store electronic components.

  With the increase in speed and capacity of information processing, electronic devices used for information processing have also been improved to handle larger power at higher frequencies. For example, as an active semiconductor element, a Schottky barrier type field effect transistor or the like using a gallium (Ga) / arsenic (As) semiconductor as a material has been developed in place of a conventional semiconductor element using silicon (Si) as a material. Is being improved to handle high power.

  As an electronic component storage package (hereinafter also simply referred to as a package) for storing a semiconductor element that handles such high frequency and high power, the one shown in FIG. 10 is conventionally used. FIG. 10 is an exploded perspective view showing a conventional electronic component storage package and an electronic apparatus. In the figure, 21 is a base, 22 is a frame, and 23 is an input / output terminal.

  The package in the form shown in FIG. 10 includes a rectangular plate-shaped base body 21, a frame body 22 disposed on the base body 21, and an input / output terminal 23 disposed on the base body 21 and fixed to the frame body 22. It is mainly composed.

  The base 21 is made of a material having good thermal conductivity, such as copper (Cu) -tungsten (W), and serves as a ground electrode and a heat radiating plate of the electronic component 25. The frame 22 is a member having a rectangular planar shape made of a metal such as iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and the upper surface of the base 21 using a brazing material such as silver (Ag) brazing. It is fixed to. The size of the frame body 22 is shorter than the length of the base body 21, and the width is substantially the same as the base body 21. The frame 22 has a notch 22a on the surface on one end side in the longitudinal direction. The notch 22a extends in the width direction of the frame body 22 and extends to both side surfaces facing in the width direction.

  Such a frame body 22 together with the base body 21 forms a space for accommodating the electronic component 25 therein. The input / output terminal 23 is mainly composed of a rectangular flat plate portion 23b, a line conductor 23a formed on the flat plate portion 23b, and a standing wall portion 23c standing on the flat plate portion 23b. The flat plate portion 23b is made of an insulating material such as ceramics. The line conductor 23a is made of a refractory metal such as W, molybdenum (Mo), manganese (Mn), or the like. As shown in FIG. 10, the standing wall portion 23c is disposed at the center portion on the flat plate portion 23b so as to be orthogonal to the line conductor 23a, and both ends are bent and extend in parallel with the line conductor 23a. In addition, this standing wall part 23c consists of an insulating material similar to the flat plate part 23b, and is integrated with the flat plate part 23b.

  As shown in FIG. 10, the input / output terminal 23 has a flat plate portion 23 b fixed on the base 21, and a standing wall portion 23 c fitted into the cutout portion 22 a of the frame body 22 and fixed. Thereby, the notch 22a is hermetically sealed. The input / output terminal 23 is brazed to the base 21 and the notch 22a by a metal metallization layer (not shown) provided on the bottom surface thereof.

  In this electronic component storage package, as shown in FIG. 10, an electronic component 25 such as a field effect transistor is fixed to the mounting portion 21a on the base 21 using a brazing material, and the electrode of the electronic component 25 is connected to an input / output terminal. The line conductor 23 a formed on the line 23 is connected using an electrical connection means 26 such as a bonding wire. Thereafter, the lid body 24 is joined and fixed on the frame body 22 by a welding method such as a brazing method or a seam welding method, whereby an electronic device whose inside is hermetically sealed is completed.

In such an electronic component storage package and electronic device, the input / output terminal 23 does not protrude from the frame body 22 and can be made small.
Japanese Patent No. 2854460

  However, in the conventional configuration shown in FIG. 10, when the input / output terminal 23 is joined to the base body 21 and the frame body 22 by brazing, the brazing material flows out from the joint and the input / output terminal 23 is exposed. After the input / output terminal 23 is fixed to the base body 21 and the frame body 22 by brazing, the stress due to the difference in thermal expansion between the large volume of the brazing material pool and the input / output terminal 23 is large. There is a problem that the input / output terminal 23 is damaged due to this stress. Due to this damage, the inside and outside of the package cannot be hermetically shut off at the input / output terminal 23, or the line conductor 23a formed at the input / output terminal 23 is disconnected, so that the electronic component 25 accommodated in the inside operates normally. There is a problem that it can not be made.

  Recently, electronic components 25 housed therein are used that operate with high-frequency signals, and line conductors 23a are required to have good transmission characteristics of high-frequency signals. ing. However, in the input / output terminal 23 in the conventional configuration, the ground potential with respect to the line conductor 23a is insufficient, and transmission loss such as reflection loss and transmission loss occurs when a high-frequency signal is transmitted to the line conductor 23a. However, there is a problem that high-frequency signals cannot be transmitted efficiently.

  Therefore, the present invention has been devised in view of the above-mentioned problems, and the object thereof is to make the device small in size with excellent high-frequency characteristics, prevent damage to input / output terminals, and make electronic components for a long time. An object of the present invention is to provide an electronic component storage package and an electronic device that can be operated normally and stably.

A first electronic component storage package according to the present invention is provided so as to surround a metal base on which an electronic component placement portion is formed on an upper main surface, and the upper main surface of the base so as to surround the placement portion. A quadrangular shape having a pair of outer surfaces facing each other and an input / output terminal mounting portion which is included in the lower part of the pair of outer surfaces and is cut out between two adjacent corners . A metal frame, and the input / output terminal formed of an insulator having a line conductor that is electrically connected to the inside and outside of the frame, and is fitted to the mounting portion. The pair of end surfaces parallel to the pair of outer surfaces and facing each other are flush with the pair of outer surfaces or positioned between the outer surface and the inner surface of the frame. And along the mounting portion of the end face of the input / output terminal Each metal layer sites along the site and the substrate is characterized in that it is deposited.

A second electronic component storage package according to the present invention is provided so that a metal base on which an electronic component mounting portion is formed on an upper main surface, and the mounting portion is surrounded on the upper main surface of the base. A quadrangular shape having a pair of outer surfaces facing each other and an input / output terminal mounting portion which is included in the lower part of the pair of outer surfaces and is cut out between two adjacent corners . A metal frame, and the input / output terminal formed of an insulator having a line conductor that is electrically connected to the inside and outside of the frame, and is fitted to the mounting portion. Is a pair of end faces that are parallel to the pair of outer surfaces and are opposed to each other , and are located outside the pair of outer surfaces, and a portion that is fitted into the frame on the upper surface and the upper surface A part located outside the pair of outer surfaces Metal layer, characterized in that it is deposited.

  In the electronic component storage package of the present invention, it is preferable that the metal layer is attached to substantially the entire end face of the input / output terminal.

  In the electronic component storage package of the present invention, it is preferable that the metal layer includes a portion of the end face of the input / output terminal along a joint portion with the base body and the frame of the end face of the input / output terminal. It is characterized by being attached only to the part along the joint part.

  In the electronic component storage package of the present invention, it is preferable that the input / output terminal has a standing wall portion formed on a flat plate portion having a square shape in plan view and the line conductor formed on the upper surface. The metal layer is deposited on the entire surface of the end surface except for a ridge between the end surface of the input / output terminal and the upper surface of the flat plate portion exposed to the outside of the frame body. And

  In the electronic component storage package according to the present invention, preferably, the input / output terminal has a rectangular shape in a plan view and a standing wall portion on a flat plate portion on which the line conductor is formed on the upper surface and the lower surface. The metal layer is formed on the entire surface of the end surface excluding a ridge between the end surface of the input / output terminal and the upper surface and the lower surface of the flat plate portion exposed to the outside of the frame body. It is characterized by being.

  An electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on the mounting portion and electrically connected to the line conductor, and attached to an upper surface of the frame. And a covered lid.

According to the present invention, the first electronic component storage package surrounds the metal base on which the electronic component placement portion is formed on the upper main surface, and surrounds the placement portion on the upper main surface of the base. A quadrangular shape having a pair of outer surfaces facing each other and having an input / output terminal mounting portion that is included in a lower portion of the pair of outer surfaces and is cut out between two adjacent corners . a metal frame, is fitted to the mounting portion, and includes input and output terminals made of an insulating material having a line conductor for electrically conducting the interior and exterior of the frame body, input and output terminals, a pair A pair of end faces parallel to the outer surface and facing each other are flush with the pair of outer surfaces or positioned between the outer surface and the inner surface of the frame body, and input / output terminals Gold on the part along the mounting part and the part along the base Layers are deposited. The metal layer may be attached to almost the entire end face of the input / output terminal, and the joint between the end face of the input / output terminal along the joint with the base and the frame of the end face of the input / output terminal. It may be applied only to the part along the part.

  Therefore, when the input / output terminals are joined to the base body and the frame body by brazing, the brazing material flowing out from the joint portion can be wetted and spread well on the surface of the metal layer. And it can prevent effectively that it accumulates in the vicinity of a junction part with a frame. Therefore, it is possible to effectively prevent stress due to a difference in thermal expansion between the input / output terminal and the brazing material from acting on the end face of the input / output terminal near the joint between the input / output terminal and the base body and the frame. As a result, it is possible to effectively prevent breakage of the input / output terminals such as cracks, and to shut off the inside and outside of the electronic component storage package in an airtight manner and to prevent the line conductor formed on the input / output terminals from being formed. It is possible to provide an electronic component storage package that prevents disconnection and allows the electronic component accommodated therein to operate normally and stably over a long period of time.

  In addition, the metal layer deposited on the end face of the input / output terminal functions as a ground potential for the line conductor, and transmission loss such as reflection loss and transmission loss occurs even when a high-frequency signal is transmitted to the line conductor. And high-frequency signals can be transmitted efficiently.

According to the invention, the second electronic component storage package surrounds the metal base having the electronic component mounting portion formed on the upper main surface, and the upper main surface of the base. And a square having a pair of outer surfaces facing each other and an input / output terminal mounting portion which is included in the lower part of the pair of outer surfaces and is cut out between two adjacent corners. A metal frame having a shape, and an input / output terminal made of an insulator having a line conductor that is electrically connected to the inside and outside of the frame, and is fitted to the mounting portion. A pair of end faces that are parallel to the pair of outer surfaces and are opposed to each other are positioned outside the pair of outer surfaces, and are positioned more than the portion that fits into the upper frame and the pair of outer surfaces of the upper surface. A metal layer is applied to the portion located outside. The metal layer may be attached to almost the entire end face of the input / output terminal, and the joint between the end face of the input / output terminal along the joint with the base and the frame of the end face of the input / output terminal. It may be applied only to the part along the part.

  Therefore, when the input / output terminal is joined to the base body and the frame body by brazing, the brazing material flowing out from the joint portion is fitted to the frame on the upper surface of the input / output terminal and the pair of outer surfaces on the upper surface. It is possible to wet and spread the metal layer formed on the portion located in the region, and to effectively prevent the brazing material from accumulating on each of the exposed end faces of the input / output terminals. Therefore, it is possible to effectively prevent stress due to a difference in thermal expansion between the input / output terminal and the brazing material from acting on the end face of the input / output terminal near the joint between the input / output terminal and the base body and the frame. As a result, it is possible to effectively prevent breakage of the input / output terminals such as cracks, and to shut off the inside and outside of the electronic component storage package in an airtight manner and to prevent the line conductor formed on the input / output terminals from being formed. It is possible to provide an electronic component storage package that prevents disconnection and allows the electronic component accommodated therein to operate normally and stably over a long period of time.

  In addition, the metal layer functions as a ground potential for the line conductor. Even if a high-frequency signal is transmitted to the line conductor, transmission loss such as reflection loss and transmission loss is suppressed, and high-frequency signals are transmitted efficiently. Can be made.

  According to the invention, preferably, in the above configuration, the input / output terminal is formed by forming a standing wall portion on a flat plate portion having a square shape in plan view and a line conductor formed on the upper surface, and the metal layer is The entire surface of the end surface except for the ridge between the end surface of the input / output terminal and the upper surface of the flat plate portion exposed outside the frame body is attached.

  Therefore, even when the input / output terminals are miniaturized and integrated, and the line conductor is formed near the end face of the input / output terminal, the line conductor and the metal layer deposited on the end face of the input / output terminal Therefore, the area of the metal layer deposited on the end face of the input / output terminal can be maximized, and the ground potential for the line conductor can be very strong. Therefore, even if a high-frequency signal is transmitted to the line conductor, it is possible to effectively prevent transmission loss such as reflection loss and transmission loss, and to transmit the high-frequency signal extremely efficiently.

  According to the invention, preferably, in the above configuration, the input / output terminal is formed by forming a standing wall portion on a flat plate portion having a rectangular shape in plan view and a line conductor formed on the upper surface and the lower surface, The metal layer is deposited on the entire end surface except for the ridge between the end surface of the input / output terminal and the upper surface and the lower surface of the flat plate portion exposed to the outside of the frame.

  Therefore, even when the input / output terminals are miniaturized and integrated, and the line conductor is formed near the end face of the input / output terminal, the line conductor and the metal layer deposited on the end face of the input / output terminal Therefore, the area of the metal layer deposited on the end face of the input / output terminal can be maximized, and the ground potential for the line conductor can be very strong. Therefore, even if a high-frequency signal is transmitted to the line conductor, it is possible to effectively prevent transmission loss such as reflection loss and transmission loss, and to transmit the high-frequency signal extremely efficiently.

  According to the present invention, an electronic device is mounted on the upper surface of the frame body, the electronic component storage package of the present invention, the electronic component mounted on the mounting portion and electrically connected to the line conductor. And a covered lid. Accordingly, the electronic component housed in the electronic component housing package of the present invention can be operated normally and stably over a long period of time, and the electronic component has high operational reliability.

  The electronic component storage package of the present invention will be described in detail below. FIG. 1 is an exploded perspective view showing an electronic component storage package and an electronic apparatus according to a first embodiment of the present invention, FIG. 2 (a) is a plan view thereof, and FIG. 3 (a) is a front view thereof. FIG. 4A is a perspective view of the input / output terminals in the electronic component storage package of FIG. FIG. 2B is a plan view showing an electronic component storage package and an electronic device according to a second embodiment of the present invention, and FIG. 3B is a front view thereof. FIG. 4B is a perspective view showing another example of the input / output terminals in the electronic component storage package. FIG. 5 is an exploded perspective view showing an electronic component storage package and an electronic device according to a third embodiment of the present invention. FIG. 6 is an exploded perspective view showing an electronic component storage package and an electronic device according to a fourth embodiment of the present invention. FIG. 7 is an exploded perspective view showing an electronic component storage package and an electronic apparatus according to a fifth embodiment of the present invention. FIG. 8 is an exploded sectional view showing an electronic component storage package and an electronic device according to a sixth embodiment of the present invention. FIG. 9 is an exploded cross-sectional view showing an electronic component storage package and an electronic device according to a seventh embodiment of the present invention.

  In these drawings, reference numeral 1 denotes a base, 2 denotes a frame, 3 denotes an input / output terminal, and the base 1, the frame 2 and the input / output terminal 3 store an electronic component 5 in an internal space. Is basically constructed. In addition, hatching of these FIG. 1, FIG. 2 (a), FIG. 2 (b), FIG. 3 (a), FIG. 3 (b), FIG. 4 (a), FIG. The portion with the line is for indicating that the metal layer is formed, and does not indicate a cross section. Further, it does not indicate that a metal layer is not formed in a portion where hatching lines are not applied.

  As shown in these drawings, the electronic component storage package of the present invention (hereinafter also referred to simply as a package) includes a base 1, a frame 2, an input / output terminal 3, and a mounting portion 2a for the input / output terminal 3. It comprises. The base body 1 is made of metal, and a placement portion 1a for the electronic component 5 is formed on the upper main surface. The frame body 2 is made of a rectangular metal member, and is provided on the upper main surface of the base body 1 so as to surround the mounting portion 1a. The input / output terminal 3 is made of an insulator and has a line conductor 3 a that is electrically connected to the inside and outside of the frame 2. The mounting portion 2 a of the input / output terminal 3 is formed by fitting the input / output terminal 3 and notching between two adjacent corners at the bottom of the frame 2. In the input / output terminal 3, a pair of opposite end surfaces 3e positioned at two corners are flush with a pair of opposite outer surfaces 2c including the two corners of the frame 2 (FIG. 1). 2 (a) and 3 (a)) or between the outer surface 2c and the inner surface 2d of the frame 2 (see FIGS. 2 (b) and 3 (b)). The metal layer 3d is deposited on the portion along the attachment portion 2a of the end face 3e of the input / output terminal 3 and the portion along the base 1.

  Alternatively, in the package of the present invention, the input / output terminal 3 has a pair of opposed end surfaces 3e positioned at two corners, rather than a pair of opposed outer surfaces 2c including the two corners of the frame 2. The metal layer 3d is attached to a portion that is located on the outer side and that is located on the upper surface of the frame body 2 and on a portion located on the outer side of the pair of outer side surfaces 2c on the upper surface (see FIG. 7). .

  The substrate 1 constituting the package of the present invention is a rectangular metal member, and includes Cu-based materials such as oxygen-free Cu, Cu-W, Cu-molybdenum (Mo) alloys, Fe-Ni-Co alloys, and Fe-Ni alloys. Made of metal. In particular, from the viewpoint of improving the thermal conductivity of the base body 1 and efficiently dissipating the heat generated from the electronic component 5 housed inside to the outside, a Cu-based material (Cu, an alloy containing Cu as a main component, or A metal material impregnated with Cu) is preferred.

  Such a base | substrate 1 is manufactured in a predetermined shape by giving conventionally well-known metal processing methods, such as a rolling process or stamping, to a metal ingot, respectively. On the surface of the substrate 1, a 0.5 to 9 μm-thick Ni layer is formed by electrolytic plating or electroless plating in order to prevent oxidative corrosion and improve mounting and fixing by brazing the electronic component 5 or the like. An Au layer having a thickness of 0.5 to 5 μm is preferably deposited.

  A frame body 2 made of a metal made of Fe-Ni-Co alloy or the like is placed on the upper main surface of the base 1 so as to surround the mounting portion 1a, and is made of a brazing material such as Ag brazing or Ag-Cu brazing. Bonded and fixed. The frame body 2 is formed with a mounting portion 2a for an input / output terminal 3 formed by cutting out two adjacent corner portions at the lower portion thereof. The input / output terminal 3 is fitted and fixed to the portion surrounded by the mounting portion 2a and the upper surface of the base 1 by brazing or the like. As described above, the mounting portion 1 a is surrounded by the frame 2 and the input / output terminal 3, so that a space for storing the electronic component 5 is formed.

  The size of the base body 1 in plan view only needs to be larger than the size of the frame body 2 in plan view, whereby the base body 1 and the frame body 2 can form a container serving as a package. For example, as shown in FIGS. 1, 5, and 6, the frame 2 and the input / output terminal 3 may be combined, or as shown in FIGS. 7, 8, and 9, The size may be the same as that of the frame 2 in plan view, and a part of the flat plate portion 3 b of the input / output terminal 3 may protrude outward from the frame 2 and the base 1.

  Preferably, the size of the base body 1 in plan view may be a size obtained by combining the frame body 2 and the input / output terminal 3 as shown in FIGS. With this configuration, the lower surface of the input / output terminal 3 is supported by the base 1, and the input / output terminal 3 can be reinforced by the base 1. For example, when an external force is applied to a portion of the input / output terminal 3 located outside the frame 2 when the line conductor 3a outside the frame 2 is connected to the wiring conductor of the external electric circuit board by a bonding wire or the like. However, it is possible to make the input / output terminal 3 difficult to break. As a result, when the line conductor 3a of the input / output terminal 3 is connected to the wiring conductor of the external electric circuit board, the input / output terminal 3 is not damaged and the inside of the package can be kept airtight. 5 can be operated normally and stably over a long period of time. Further, with this configuration, the lower surface of the input / output terminal 3 is covered with the base 1 made of metallization layer and metal formed for brazing over the entire surface, so that the line conductor 3a is grounded by the base 1 over the entire length. . As a result, the line conductor 3a is stably grounded by the base 1 over the entire length, and even if the electric signal transmitted through the line conductor 3a is a high-frequency signal, the line conductor 3a operates as a microstrip line or a strip line, and the electric signal has a reflection loss or transmission. A high-frequency signal can be transmitted satisfactorily while effectively preventing transmission loss such as loss.

  Here, when an optical semiconductor element such as a semiconductor laser (LD) and / or a photodiode (PD) is mounted and fixed on the mounting portion 1a as the electronic component 5, as shown in the sectional view of the package of FIG. Further, a through hole 2b for inputting / outputting optical signals may be provided on one side surface of the frame body 2, and a cylindrical optical fiber attachment member 8 may be fitted and fixed thereto by brazing or the like. FIG. 8 is a sectional view showing a case where the through hole 2b is provided on the side wall of the frame body 2 opposite to the side wall of the frame body 2 on which the input / output terminals 3 of the package of FIG. 7 are fitted. The parts common to those in FIG.

  In this case, the tip of the optical fiber 9 supported and fixed to the annular optical fiber support member 10 is inserted from the outside of the package of the optical fiber attachment member 8, and the tip of the optical fiber 9 is connected to the light input / output unit of the electronic component 5. The end of the optical fiber 9 is welded or brazed to the outer surface of the optical fiber mounting member 8 and welded or brazed to the outer surface of the optical fiber mounting member 8 so that the tip of the optical fiber 9 is light of the electronic component 5. It is attached to the package while being optically coupled to the input / output unit. In this way, by joining the optical fiber support member 10 to the package via the optical fiber attachment member 8 by welding or brazing, the thermal stress applied to the package when the optical fiber support member 10 is joined to the package is reduced. It is possible to suppress absorption of the input / output terminal 3 from being greatly absorbed by the mounting member 8 and prevent the input / output terminal 3 from being damaged such as cracks.

  When an optical semiconductor element is mounted and fixed as the electronic component 5, it is preferable to provide a through hole 2b on the side surface facing the side surface on which the mounting portion 2a of the frame 2 is formed, as shown in FIG. . With this configuration, the line conductor 3a of the input / output terminal 3, the electronic component 5, and the optical fiber 9 can be arranged in a straight line, and the wiring from the line conductor 3a to the light emitting portion or the light receiving portion of the electronic component 5 is linearized. can do. That is, there is no bent portion in the wiring from the line conductor 3a to the light emitting portion or the light receiving portion of the electronic component 5, and transmission loss such as reflection loss and transmission loss is not generated in the high frequency signal transmitted through the bent portion. . As a result, it is possible to effectively prevent transmission loss such as reflection loss and transmission loss from occurring in the high-frequency signal transmitted through the wiring from the line conductor 3a to the light-emitting portion or the light-receiving portion of the electronic component 5. The transmission efficiency can be improved.

  Although not shown, the optical fiber 9 is brazed and joined directly to the inner surface of the through hole 2b without the optical fiber attachment member 8 and the optical fiber support member 10, or the optical fiber attachment member 8 is not provided. The optical fiber support member 10 may be welded or brazed to the outer surface of the through hole 2b.

As shown in FIG. 4A, the input / output terminal 3 includes a flat plate portion 3b having a line conductor 3a between opposite sides of a rectangular upper main surface, and a line conductor on the upper main surface of the flat plate portion 3b. The line conductor 3a is provided so as to cross the line 3a, and is composed of a standing wall portion 3c for insulating the metal from other metal and hermetically sealing the package. Flat plate portion 3b and the vertical wall portion 3c is made of _Al 2 _{O 3} sintered material, AlN sintered _material, 3Al ₂ O 3 · 2SiO ₂ Quality sintered body or the like of the ceramic. For example, in the case of an Al ₂ O ₃ sintered body, it is manufactured as follows. Add appropriate organic binder, organic solvent, plasticizer, dispersant, etc. to raw material powders such as alumina (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO). A plurality of ceramic green sheets are obtained by forming a slurry and forming this into a sheet by a conventionally known doctor blade method.

  Next, an appropriate punching process is performed on the ceramic green sheet so as to form the flat plate portion 3b and the standing wall portion 3c of the input / output terminal 3. Then, a conductive paste obtained by mixing an appropriate binder and solvent with metal powder such as W, Mo, Mn, etc. is printed on a ceramic green sheet in a predetermined pattern by a screen printing method or the like. A conductor layer to be electrically connected to the line conductor 3a and the like is formed. Also, a brazing conductor layer (metallized layer) is formed on the ceramic green sheet which is the surface to be joined to the base 1 and the frame 2 of the input / output terminal 3.

  After laminating these ceramic green sheets in a predetermined order, they are cut into predetermined dimensions, fired at a temperature of about 1600 ° C., and then predetermined with a cutting blade using diamond such as a dicing saw or a slicer and abrasive grains. The upper surface of the upright wall portion 3c is polished to a predetermined height so that the input / output terminal 3 can be fitted into the mounting portion 2a of the frame body 2 with high accuracy. Finally, a metal layer 3d such as Mo or Mn is printed on the upper surface of the standing wall 3c, both end surfaces 3e of the input / output terminal 3, and the side surface joined to the frame 2 of the standing wall 3c, and fired at a temperature of about 1300 ° C. . Thus, a sintered body that becomes the input / output terminal 3 having a conductor layer such as the line conductor 3a can be manufactured. On the surface of the conductor layer such as the line conductor 3a of the input / output terminal 3, a Ni layer having a thickness of 0.5 to 9 μm is formed on the surface in order to prevent oxidative corrosion, improve the wire bonding property, and further improve the solderability. Further, a metal layer such as an Au layer having a thickness of 0.5 to 5 μm is preferably deposited by a plating method.

  The input / output terminal 3 closes the mounting portion 2a of the frame 2, seals the inside and outside of the frame 2 in an airtight manner, and transmits an electric signal between the electronic component 5 placed inside and the external electric circuit. The line conductor to be conducted may be provided so as to connect the inside and outside of the frame 2. Therefore, the present invention is not limited to the above-described form. For example, the whole is a rectangular parallelepiped shape, and the line conductor 3a is formed from one side to the other side in the inside, and both ends of the line conductor 3a are exposed. It may be a thing.

  The input / output terminal 3 may have a bar shape (linear shape) as shown in FIG. 4B in addition to the U-shaped shape as shown in FIG. . In the case of a rod shape as shown in FIG. 4B, the side surface shape of both outer side surfaces 2c of the mounting portion 2a provided on the frame body 2 is not a quadrangle shape as shown in FIG. To do.

  Further, as shown in FIG. 1, the pair of opposed end surfaces 3 e where the input / output terminal 3 is located at two corners is formed of a pair of opposed outer surfaces 2 c including the two corners of the frame 2. A portion that is flush or is located between the outer side surface 2c and the inner side surface 2d of the frame 2 and that is along the attachment portion 2a of the end surface 3e of the input / output terminal 3 and a portion along the base body 1 When the metal layer 3d is attached to the both ends 3e of the input / output terminal 3, the metal layer 3d may be formed along at least the base 1 and the frame 2. For example, the configuration may be such that it is provided on almost the entire end faces 3e of the input / output terminal 3 as shown in FIG. 1, and the end faces 3e of the input / output terminal 3 as shown in FIG. The configuration may be applied only to the portion along the portion and the portion along the joint portion between the both end faces 3e of the input / output terminal 3 and the frame 2.

  Preferably, as shown in FIG. 6, the metal layer 3d of the input / output terminal 3 is formed by forming a standing wall portion 3c on a flat plate portion 3b having a square shape in plan view and having a line conductor 3a formed on the upper surface. Is a ridge between the end surface 3e of the flat plate portion 3b of the input / output terminal 3 and the upper surface of the flat plate portion 3b of the input / output terminal 3 exposed to the outside of the frame 2, and a side surface 3f exposed to the outside of the standing wall portion 3c. It is preferable that the ridge portion between the end surface 3e and the end surface 3e is attached to the entire surface of the end surface 3e excluding a portion close to the line conductor 3a. Thus, even if the line conductor 3a is provided in the vicinity of the end face 3e of the flat plate portion 3b, an electrical short circuit does not occur in the metal layer 3d of the end face 3e, and between the line conductor 3a and the metal layer 3d. An appropriate capacity component can be provided.

  Further, as shown in FIG. 7, the input / output terminal 3 has a pair of opposed end surfaces 3 e positioned at two corners, than a pair of opposed outer surfaces 2 c including the two corners of the frame 2. When the metal layer 3d is attached to the portion that is positioned outside and the portion that is fitted into the upper frame body 2 and the portion that is located outside the pair of outer surfaces 2c on the upper surface. The metal layer 3d applied to the upper surface of the input / output terminal 3 is formed at least at a portion fitted into the frame body 2 on the upper surface and a portion positioned on the outer side of the pair of outer side surfaces 2c on the upper surface.

  Further, the input / output terminal 3 has a pair of opposed end surfaces 3e positioned at two corners positioned outside a pair of opposed outer surfaces 2c including the two corners of the frame 2. The side surface 3f of the standing wall portion 3c formed so as to cross the line conductor 3b on the upper surface of the flat plate portion 3b as shown in FIG. The metal layer 3d is also deposited on the upper surface portion of the standing wall portion 3c which is formed outside the outer surface 2e of the frame body 2 and is located outside the outer surface 2e of the frame body 2. It is good to have a form. With this configuration, it is possible to effectively prevent the brazing material from spreading on each exposed surface of the input / output terminal 3 and forming a brazing material pool, and due to a difference in thermal expansion from the brazing material in which the input / output terminal 3 is accumulated. It is possible to more effectively prevent breakage due to stress due to cracks.

  Similarly, the side surface of the input / output terminal 3 joined to the frame 2 (the back side of the notch in which the input / output terminal 3 of the frame 2 is fitted, that is, the surface where the electronic component 5 is provided) and the input / output terminal It is preferable that the metal layer 3d is also formed on the outer surface of the lower surface of the frame body 2 on the lower surface to be joined to the substrate 1 of the third body.

  The metal layer 3d may be deposited on the entire upper surface of the standing wall 3c, or from the joint of the upper surface of the standing wall 3c with the frame 2 to the outside of the outer surface 2c of the frame 2. It may be formed by being partially attached to and not formed up to the end of the upper surface of the standing wall 3c. Of the brazing material joining the frame body 2 and the upper surface of the standing wall portion 3c, the metal layer 3d is sufficiently wetted and spread by the metal layer 3d even if excess brazing material flows out from the outer surface of the frame body 2. A width that does not form a pool is sufficient, and it is not always necessary to cover the entire surface up to the end of the upper surface of the standing wall 3c.

  Further, the inner side surface of the standing wall portion 3c and the inner side surface 2d of the frame body 2 are substantially the same surface, and the thickness between the inner side surface and the outer side surface of the package of the standing wall portion 3c is made thicker than the thickness of the frame body 2. Thus, the end surface 3e of the standing wall 3c (input / output terminal 3) is formed so as to be located outside the outer surface 2c of the frame body 2, and the metal layer 3d is wider on the upper surface than the thickness of the frame body 2. The metal layer 3d may be formed so that the metal layer 3d is attached to the outside of the outer surface of the frame 2. Furthermore, the inner side surface of the standing wall portion 3c is located between the inner side surface 2d and the outer side surface 2c of the frame body 2 and the thickness of the standing wall portion 3c is substantially the same as or slightly thinner than the thickness of the frame body 2. The end surface 3e of 3c may be formed so as to be positioned outside the outer surface 2c of the frame 2, and the metal layer 3d may be attached to the upper surface of the frame 2 to the outside of the outer surface 2c of the frame 2. .

  Thus, when the inner wall of the standing wall 3c is formed so as to be outside the inner wall of the frame 2, the width of the flat plate 3b that forms the line conductor 3d of the input / output terminal 3 is increased. The width of each of the line conductors 3a on the upper surface of the base 1 can be increased, or the width between the line conductors 3a can be increased.

  In addition, when the end surface 3 e of the input / output terminal 3 is positioned outside the outer surface 2 c of the frame body 2, the metal layer 3 d may be attached to the end surface 3 e of the input / output terminal 3. With this configuration, the area of the metal layer 3d of the input / output terminal 3 can be expanded, and the ground potential for the line conductor 3a can be further strengthened. Even if the signal transmitted through the line conductor 3a has a high frequency, the transmission loss generated in the high frequency signal can be further reduced, and the high frequency signal can be transmitted very efficiently. Further, when the metal layer 3d on the upper surface of the input / output terminal 3 is attached so as to be connected to the metal layer 3d on the end surface 3e, the excess brazing material can be spread also on the metal layer 3d on the end surface 3e. Therefore, the width of the metal layer 3d on the upper surface may be narrow.

  Furthermore, in this case, the metal layer 3d applied to the both end faces 3e of the input / output terminal 3 only needs to be formed along at least the base body 1 and the frame body 2. For example, the configuration may be such that it is provided on almost the entire end faces 3e of the input / output terminal 3 as shown in FIG. 1, and the end faces 3e of the input / output terminal 3 as shown in FIG. The configuration may be applied only to the portion along the portion and the portion along the joint portion between the both end faces 3e of the input / output terminal 3 and the frame 2.

  Further, the metal layer 3d of the input / output terminal 3 formed by forming the standing wall portion 3c on the flat plate portion 3b having a rectangular shape in plan view and having the line conductor 3a formed on the upper surface thereof is a flat plate of the input / output terminal 3. A ridge between the end surface 3e of the portion 3b and the upper surface of the flat plate portion 3b of the input / output terminal 3 exposed to the outside of the frame 2, and a ridge between the side surface 3f and the end surface 3e exposed to the outside of the standing wall 3c It is preferable to be attached to the entire surface of the end face 3e excluding a part of the flat plate part 3b side, that is, a part close to the line conductor 3a. Thus, even if the line conductor 3a is provided in the vicinity of the end face 3e of the flat plate portion 3b, an electrical short circuit does not occur in the metal layer 3d of the end face 3e, and between the line conductor 3a and the metal layer 3d. An appropriate capacity component can be provided.

  In the package of the present invention, preferably, as shown in FIG. 9, the input / output terminal 3 has a line conductor 3 a formed on the upper surface and the lower surface of the flat plate portion 3 b in a portion exposed to the outside of the frame body 2. Is good. With this configuration, even when a large number of line conductors 3 a connected to the electronic component 5 are provided on the upper surface of the flat plate portion 3 b of the input / output terminal 3 inside the frame body 2, the input / output terminal is provided outside the frame body 2. A part of the line conductors 3a formed on the upper surface of the line 3 is routed to the lower surface via the internal wiring, and the number of the line conductors 3a respectively disposed on the upper surface or the lower surface of the frame 2 of the input / output terminal 3 is 2, the number of line conductors 3 a arranged on the upper surface of the input / output terminal 3 on the inside can be reduced. Therefore, the width of the line conductor 3a outside the frame 2 of the input / output terminal 3 can be increased, and the interval between the adjacent line conductors 3a can be increased.

  On the outside of the frame 2, even when the lead terminals 7 are joined to the individual line conductors 3 a via a conductive adhesive such as a brazing material, the joining area between the line conductors 3 a and the lead terminals 7 is sufficient. In addition, the lead terminal 7 can be firmly attached to the input / output terminal 3.

  Further, even if the lead terminal 7 is joined to the line conductor 3a through a conductive adhesive such as a brazing material, the conductive adhesive such as a brazing material melted between the adjacent line conductors 3a is bonded by the surface tension. It is possible to prevent the adjacent line conductors 3a from being electrically short-circuited.

  Although not shown, if a ground metal layer is formed between the line conductor 3a on the upper surface of the flat plate portion 3b and the line conductor 3a on the lower surface, the line conductor 3a on the upper surface and the line conductor 3a on the lower surface are formed. In addition to avoiding crosstalk of electrical signals therebetween, this ground metal layer acts as a ground conductor layer of each line conductor 3a, and each line conductor 3a operates as a microstrip line. Therefore, the high frequency signal can be transmitted to the line conductor 3a satisfactorily.

  As a result of the above, the input / output terminal 3 is also provided in a miniaturized and integrated package in which a large number of line conductors 3a connected to the electronic component 5 are finely provided on the upper surface of the input / output terminal 3 inside the frame 2. The width of the line conductor 3a sufficient for connection to the external electric circuit board can be secured on the outside of the frame 2.

  Further, the line conductor 3 a formed on the upper surface of the flat plate portion 3 b of the input / output terminal 3 is electrically connected to the wiring conductor formed on one main surface of the external electric circuit board and formed on the lower surface of the input / output terminal 3. The line conductor 3a thus formed can be electrically connected to a wiring conductor formed on one main surface of the external electric circuit board, and workability when the package is mounted on the external electric circuit board can be improved. Further, by attaching the lead terminals 7 to the line conductors 3a formed on the upper and lower surfaces of the input / output terminals 3, the external electric circuit board can be sandwiched between the upper and lower lead terminals 7, and the external electric power of the package The workability of mounting on wiring conductors formed on the upper and lower surfaces of the circuit board can be made extremely efficient.

  Further, when the line conductor 3a is formed on the upper surface and the lower surface of the flat plate portion 3b, the base body 1 is not provided below the portion of the input / output terminal 3 located outside the frame body 2 in FIG. It is good. With this configuration, even if the input / output terminal 3 is provided at the lower end of the frame body 2, the line conductor 3a and the base body 1 do not cause an electrical short circuit. Further, it is possible to prevent the base body 1 from becoming an obstacle when the package is mounted on the external electric circuit board.

  Alternatively, an insulator similar to the standing wall 3 may be joined to the lower surface of the flat plate portion 3b so that the line conductor 3a formed on the lower surface of the flat plate portion 3b and the base 1 do not cause an electrical short circuit. Good.

  In such a configuration of the input / output terminal 3, the metal layer 3 d deposited on the end face 3 e of the input / output terminal 3 is a flat plate of the input / output terminal 3 exposed to the end face 3 e of the input / output terminal 3 and the outside of the frame 2. In the vicinity of the ridge between the upper surface and the lower surface of the portion 3b and the portion of the ridge between the side surface 3f exposed to the outside of the standing wall portion 3c and the end surface 3e on the flat plate portion 3b side, that is, the line conductor 3a. It is preferable that it is attached to the entire end face 3e excluding the portion where the part is located. With this configuration, even when the input / output terminal 3 is reduced in size and integrated and the line conductor 3a is formed in a portion close to the end face 3e of the input / output terminal 3, the line conductor 3a and the end face 3e of the input / output terminal 3 are formed. Without causing an electrical short circuit with the deposited metal layer 3d, the area of the metal layer 3d deposited on the end face 3e of the input / output terminal 3 is maximized, and grounding to the line conductor 3a is performed. The potential can be very strong. Therefore, even if a high-frequency signal is transmitted to the line conductor 3a, it is possible to effectively prevent transmission loss such as reflection loss and transmission loss and transmit the high-frequency signal extremely efficiently.

  Preferably, the pair of end faces 3e facing each other where the input / output terminal 3 is located at the two corners are flush with the pair of opposite outer faces 2c including the two corners of the frame 2. Or the metal layer 3d at a position along the attachment portion 2a of the end face 3e of the input / output terminal 3 and at a position along the base body 1 between the outer surface 2c and the inner surface 2d of the frame body 2. When the metal layer 3d on both end faces 3e of the input / output terminal 3 is formed with a plurality of grooves extending in a direction perpendicular to the outer periphery of the end face 3e of the input / output terminal 3. It is good to be. Similarly, the pair of opposite end surfaces 3e where the input / output terminals 3 are located at the two corners are located outside the pair of opposite outer surfaces 2c including the two corners of the frame 2. In the case where the metal layer 3d is attached to a portion that is fitted into the frame body 2 on the upper surface and a portion that is located outside the pair of outer surfaces 2c on the upper surface, the input / output terminal 3 The metal layer 3d of the both end faces 3e is preferably formed with a plurality of grooves extending in the direction perpendicular to the outer periphery of the end face 3e of the input / output terminal 3 on the surface. As a result, the brazing material that has flowed outward from the joint between the input / output terminal 3 and the base body 1 and the frame body 2 can be very well wetted and spread along the groove by capillary action. Can be more effectively prevented.

  Such a groove has a width and depth of about 1 to 500 μm. For example, after printing a metal paste to be the metal layer 3d, the groove is pressed with a mold, or rubbed in a certain direction with abrasive paper having a high surface roughness. It can produce by this method.

  The package of this invention is comprised by the above structure. In such a package, the input / output terminal 3 is outside the pair of end faces 3e facing each other located at two corners and / or the outer surface 2c of the frame 2 on the upper surface of the standing wall 3c of the input / output terminal 3. A metal layer 3d is deposited on the substrate. As a result, for example, as shown in FIGS. 3A and 3B, the brazing material for joining the input / output terminals 3 to the base 1 and the frame body 2 flows on the surface of the metal layer 3d. 3 does not accumulate in the portion along the mounting portion 2a of the both end faces 3e. For this reason, after the input / output terminal 3 is fixed to the base body 1 and the frame body 2 by brazing, the input / output terminal 3 and the brazing body are connected to the end face 3e of the input / output terminal 3 near the joint portion between the base body 1 and the frame body 2. The stress due to the difference in thermal expansion from the material does not act greatly.

  As a result, it is possible to effectively prevent breakage such as cracks in the input / output terminal 3, airtightly shut the inside and outside of the package, and disconnect the line conductor 3 a formed on the input / output terminal 3. It is possible to prevent the electronic component from being housed and to make the electronic component storage package capable of operating normally and stably over a long period of time.

  Further, the end face 3e of the input / output terminal 3 and / or the metal layer 3d deposited on the upper surface of the input / output terminal 3 functions as a ground potential for the line conductor 3a, and transmits a high-frequency signal to the line conductor 3a. However, transmission loss such as reflection loss and transmission loss can be suppressed, and high-frequency signals can be transmitted efficiently.

  The line conductor 3a forms a microstrip structure with the base 1 or the conductive metallization layer on the lower surface of the input / output terminal 3, and the width and the material of the flat portion 3b of the input / output terminal 3 and the thickness of the line conductor 3a. By making it appropriate, the high-frequency transmission characteristics are improved. Preferably, the line widths of the line conductors 3a inside and outside the frame body 2 of the standing wall 3c and the line widths of the line conductors 3a sandwiched between the standing walls 3c are different from each other.

  Further, as shown in FIG. 6, the metal layer 3 d of the input / output terminal 3 includes the end surface 3 e of the flat plate portion 3 b of the input / output terminal 3 and the upper surface of the flat plate portion 3 b of the input / output terminal 3 exposed to the outside of the frame 2. Are attached to the entire surface of the end surface 3e excluding the flat plate portion 3b side of the ridge portion between and the ridge portion between the end surface 3e and the side surface 3f of the standing wall portion 3c. As a result, the area of the metal layer 3d deposited on the end face 3e of the input / output terminal 3 is maximized, the input / output terminal 3 is miniaturized and integrated, and the line conductor 3a becomes the end face of the input / output terminal 3. Even when it is formed in a portion close to 3e, an electrical short circuit is not caused between the line conductor 3a and the metal layer 3d attached to the end face 3e of the input / output terminal 3. Therefore, the input / output terminal 3 can be reduced in size and integrated, and the ground potential for the line conductor 3a can be made very strong.

  Specifically, as shown in FIG. 6, a ridge portion between the upper surface of the flat plate portion 3b located outside the frame body 2 and the end surface 3e, and a side surface 3f located outside the frame body 2 of the standing wall portion 3c, The flat plate portion 3b side of the ridge between the end surface 3e is a non-formed portion of the metal layer 3d, and the metal layer 3d is deposited on the entire end surface 3e of the input / output terminal 3 excluding this portion. As a result, even when the line conductor 3a is formed close to the end face 3e of the flat plate portion 3b, it is possible to prevent an electrical short circuit from occurring between the line conductor 3a and the metal layer 3d (ground conductor). Become.

  In recent years, the size of packages has been reduced, and the integration of mounting a large number of electronic components 5 accommodated in the package or mounting a large-scale integrated component has been progressing. With the downsizing and integration of this package, the number of line conductors 3a has increased, and the number of line conductors 3a has been increased to close to the end face 3e of the input / output terminal 3. In such a case, the non-formation region of the metal layer 3d at the ridge has a configuration that can effectively prevent an electrical short circuit from occurring between the line conductor 3a and the metal layer 3d (ground conductor).

  The width of the non-formed part of the metal layer 3d is preferably about 0.05 mm to 0.2 mm. With this configuration, transmission loss such as reflection loss and transmission loss can be effectively suppressed, high-frequency signals can be transmitted efficiently, and an electrical short circuit occurs between the line conductor 3a and the metal layer 3d. Can be effectively prevented. If the width of the non-formed portion of the metal layer 3d is less than 0.05 mm, the width of the non-formed portion is too narrow, and when the conductor paste that becomes the line conductor 3a and the metal layer 3d is printed and applied, the line conductor 3a and In some cases, the conductive paste that becomes the metal layer 3d may bleed and an electrical short circuit may occur between the line conductor 3a and the metal layer 3d. If the width of the non-formed portion of the metal layer 3d increases beyond 0.2 mm, the width of the non-formed portion becomes too large, and the area of the metal layer 3d becomes smaller than the total area of the end face 3e of the input / output terminal 3. Since this tends to occur, the ground potential cannot be sufficiently strengthened, and transmission loss such as reflection loss and transmission loss is likely to occur.

  As described above, in a package that is recently downsized and the internal electronic component 5 is integrated on a large scale, transmission loss such as reflection loss and transmission loss occurs even if a high-frequency signal is transmitted to the line conductor 3a. Is effectively prevented, and a high-frequency signal can be transmitted extremely efficiently.

  As shown in FIGS. 1 to 9, an electronic component 5 such as a semiconductor element, a piezoelectric vibrator, or an optical element is placed on the mounting portion 1 a of the package having the above structure, such as lead (Pb) -tin (Sn) or Au—. After mounting and fixing with Sn or the like solder, the electrode of the electronic component 5 and the portion inside the frame body 2 of the line conductor 3a are electrically connected by an electrical connection means 6 such as a bonding wire. A lid body 4 made of a metal such as Fe-Ni-Co alloy or ceramics is attached to the upper surface by a soldering method or a welding method, and the electronic component 5 is hermetically sealed to provide an electronic device as a product. .

  The electronic component 5 is mounted on a circuit board made of an insulator such as aluminum nitride (AlN) (not shown) or mounted on a thermoelectric conversion cooling device using a Peltier element ( (Not shown) may be placed and fixed on the placing portion 1a. With such a configuration, heat generated from the electronic component 5 can be efficiently dissipated to the outside, and it is possible to effectively prevent the electronic component 5 from rising in temperature and malfunctioning.

  Furthermore, the line conductor 3a outside the frame 2 is soldered to a lead terminal made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy, or a bonding wire is connected, whereby the line conductor 3a. Are electrically connected to the external electric circuit board. As a result, the external electric circuit board and the electronic component 5 are electrically connected to each other via the line conductor 3a and the electric connection means 6 to receive an electric signal from the external electric circuit board or to the external electric circuit board. The electronic component 5 is activated by transmitting.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. Therefore, the above-described embodiment is merely an example in all respects, and the scope of the present invention is shown in the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the scope of the claims are within the scope of the present invention.

1 is an exploded perspective view showing an electronic component storage package and an electronic device according to a first embodiment of the present invention. FIG. 2A is a plan view of the electronic component storage package of FIG. 1, and FIG. 2B is a plan view of the electronic component storage package and the electronic device according to the second embodiment of the present invention. FIG. 3A is a front view of the electronic component storage package of FIG. 2A, and FIG. 3B is a front view of the electronic component storage package of FIG. FIG. 4A is a perspective view of an input / output terminal fitted and joined to the electronic component storage package of FIG. 1, and FIG. 4B is a diagram showing another input / output terminal fitted and joined to the electronic component storage package of the present invention. FIG. It is a disassembled perspective view which shows the electronic component storage package and electronic device of the 3rd Embodiment of this invention. It is a disassembled perspective view which shows the electronic component storage package and electronic device of the 4th Embodiment of this invention. It is a disassembled perspective view which shows the electronic component storage package and electronic device of the 5th Embodiment of this invention. It is a disassembled sectional view which shows the electronic component storage package and electronic device of the 6th Embodiment of this invention. It is a disassembled sectional view which shows the electronic component storage package and electronic device of the 7th Embodiment of this invention. It is a disassembled perspective view which shows the conventional package for electronic component accommodation, and an electronic apparatus.

Explanation of symbols

1: Base 1a: Placement part 2: Frame 2a: Mounting part 2c: Outer side 2d: Inner side 3: Input / output terminal 3a: Line conductor 3d: Metal layer 3e: End face 4: Lid 5: Electronic component

Claims (7)

A metal base on which an electronic component mounting portion is formed on the upper main surface, a pair of outer surfaces provided on the upper main surface of the base so as to surround the mounting portion , and facing each other; A rectangular metal frame having an input / output terminal mounting portion that is included in each of the lower portions of the pair of outer side surfaces and that is cut out between two adjacent corner portions, and fitted to the mounting portion The input / output terminal made of an insulator having a line conductor that electrically conducts the inside and outside of the frame body,
In the input / output terminal, a pair of end faces parallel to the pair of outer surfaces and facing each other are flush with the pair of outer surfaces, or between the outer surface and the inner surface of the frame body. Located in between
A package for storing an electronic component, wherein a metal layer is attached to a portion along the mounting portion and a portion along the base of the end face of the input / output terminal. A metal base on which an electronic component mounting portion is formed on the upper main surface, a pair of outer surfaces provided on the upper main surface of the base so as to surround the mounting portion , and facing each other; A rectangular metal frame having an input / output terminal mounting portion that is included in each of the lower portions of the pair of outer side surfaces and that is cut out between two adjacent corner portions, and fitted to the mounting portion The input / output terminal made of an insulator having a line conductor that electrically conducts the inside and outside of the frame body,
The input / output terminal has a pair of end faces that are parallel to the pair of outer surfaces and are opposed to each other, and are located outside the pair of outer surfaces,
A package for storing an electronic component, wherein a metal layer is attached to a portion of the upper surface fitted into the frame body and a portion of the upper surface located outside the pair of outer side surfaces. 3. The electronic component storage package according to claim 1, wherein the metal layer is attached to substantially the entire end face of the input / output terminal. 4. The metal layer is attached only to a portion along the joint portion of the end face of the input / output terminal with the base body and a joint portion of the end face of the input / output terminal to the frame body. The electronic component storage package according to claim 1, wherein the electronic component storage package is provided. The input / output terminal is formed by forming a standing wall portion on a flat plate portion having a quadrangular shape in plan view and having the line conductor formed on an upper surface, and the metal layer is formed with the end surface of the input / output terminal. The electronic component housing according to claim 1, wherein the electronic component housing is attached to the entire surface of the end surface excluding a ridge portion between the flat plate portion exposed to the outside of the frame body and the upper surface. For package. The input / output terminal has a quadrangular shape in plan view, and is formed by forming a standing wall portion on a flat plate portion on which the line conductor is formed on an upper surface and a lower surface, and the metal layer is formed of the input / output terminal. 3. The entire surface of the end surface excluding a ridge portion between the upper surface and the lower surface of the flat plate portion exposed to the outer side of the end surface and the frame body. Package for electronic component storage as described in 1. An electronic component storage package according to any one of claims 1 to 6 , an electronic component mounted on the mounting portion and electrically connected to the line conductor, and an upper surface of the frame body An electronic device comprising an attached lid.

Images