JP6825986B2 - Wiring boards, electronic component storage packages and electronic devices - Google Patents

Description

The present invention relates to a wiring board including a signal line through which a high frequency signal is transmitted, a package for storing electronic components, and an electronic device.

As the speed and capacity of communication devices that transmit information increase, the frequency of signal lines for information transmission is increasing. As a transmission line including such a signal line, for example, as described in Patent Document 1, a transmission line in which a ground line is arranged along the signal line is used. This transmission line is arranged on the surface of a substrate such as a ceramic plate to form a wiring board. A wiring board including a transmission line and a board is used, for example, as an input / output terminal for an electric signal in an optical communication package.

Japanese Unexamined Patent Publication No. 5-335431

In recent years, electromagnetic noise such as crosstalk noise between signal lines is likely to occur due to the fact that the frequency of signals transmitted through signal lines has been further increased and the density of transmission lines including signal lines has been increased. It has become to. Further, in a differential transmission type transmission line including a pair of signal lines in which signals having opposite phases are transmitted, crosstalk noise between the signal lines is likely to occur.

The wiring board of one embodiment of the present invention includes a signal line extending in a first direction and a pair of ground lines parallel to the signal line with the signal line sandwiched in a second direction orthogonal to the first direction. and the line, and an insulating plate having an upper surface to which the transmission line is located. In plan view, the there is a large notch than the dimension size in the first direction is definitive in the second direction to the edge of the upper surface of the insulating plate,-out each ground line is the cut of the pair of ground lines It has an end including a portion, and the line width of the ground line is widened at the end .

The electronic component storage package of one aspect of the present invention has an upper surface including a recess, and includes a substrate having an opening in a part of a side wall portion of the recess and a wiring board having the above configuration. The wiring board is arranged in the opening so that the end portion of the transmission line including the notch portion is located outside the recess.

The electronic device of one aspect of the present invention includes an electronic component storage package having the above configuration, and an electronic component housed in the recess and electrically connected to the transmission line .

According to the wiring board of one aspect of the present invention, with respect to the ground line arranged so as to sandwich the signal line, the dimension in the first direction is the dimension in the second direction at the upper end of the insulating plate to be externally connected. The possibility of crosstalk noise in the signal line is reduced because there is a larger notch and each ground line of the pair of ground lines has an end that includes the notch. .. That is, at the end of the insulating plate, there is a relatively long notch in the first direction, that is, in the direction of the line length, and the end of the ground line is close to the signal line at this notch. That is, the grounding area along the signal line becomes longer than before. Therefore, the occurrence of crosstalk noise can be reduced.

According to the electronic component storage package of one aspect of the present invention, since the wiring board having the above configuration is included, the electronic component storage package having input / output terminals effective for suppressing crosstalk noise in the signal line is provided. be able to.

According to the electronic device of one aspect of the present invention, since the electronic component storage package having the above configuration is included, it is possible to provide an electronic device effective for suppressing crosstalk noise in the input / output terminal portion.

(A) is a perspective view showing a wiring board and a package for storing electronic components according to an embodiment of the present invention, and (b) is a perspective view seen from the opposite side to (a). (A) is a plan view of the wiring board and the electronic component storage package of the embodiment of the present invention as viewed from above, (b) is a sectional view taken along line XX of (a), and (c) is Is a plan view of the wiring board and the electronic component storage package according to the embodiment of the present invention as viewed from below. (A) is a plan view of the wiring board of the embodiment of the present invention viewed from below, and (b) is a plan view showing a part of (a) in an enlarged manner. It is an exploded perspective view which shows the wiring board, the electronic component accommodating package and the electronic device of embodiment of this invention. (A) and (b) are side views which show the electronic device of embodiment of this invention, respectively. It is a top view which looked at the modification of the wiring board of embodiment of this invention from the lower side.

The wiring board, the electronic component storage package, and the electronic device according to the embodiment of the present invention will be described with reference to the accompanying drawings. It should be noted that the distinction between the upper and lower parts in the following description is for convenience of explanation, and does not limit the upper and lower parts when the wiring board, the electronic component storage package, and the electronic device are actually used. Further, in the following embodiment, a case where the signal line is a differential line will be described as an example. Even when the signal line is not a differential line, the same effect can be obtained with the same configuration as described below.

FIG. 1A is a perspective view showing a wiring board and a package for storing electronic components according to an embodiment of the present invention, and FIG. 1B is a perspective view seen from the opposite side of FIG. 1A. FIG. 2A is a plan view (hereinafter, top view) of the wiring board and the electronic component storage package according to the embodiment of the present invention as viewed from above, and FIG. 2B is X of FIG. 2A. FIG. 2C is a cross-sectional view taken along the line X, and FIG. 2C is a plan view (hereinafter, bottom view) of the wiring board and the electronic component storage package according to the embodiment of the present invention as viewed from below. FIG. 3A is a bottom view of the wiring board according to the embodiment of the present invention, and FIG. 3B is an enlarged bottom view showing a part of FIG. 3A. FIG. 4 is an exploded perspective view showing a wiring board, a package for storing electronic components, and an electronic device according to an embodiment of the present invention. 5 (a) and 5 (b) are side views showing an electronic device according to an embodiment of the present invention, respectively.

The wiring board 10 of the embodiment has a signal line 2 and a line portion 3 including a pair of ground lines 3 located so as to sandwich the signal line 2. The line portion 3 is arranged on the surface including the lower surface of the insulating plate 1 and inside. The wiring board 10 is attached to the base 11 as an input / output terminal for an electric signal to form a package 20 for storing electronic components. The electronic component 21 is housed in the electronic component storage package 20, and the electronic device 30 is configured.

The wiring board 10 is for transmitting a high frequency signal, and is used, for example, as an input / output terminal for an electric signal in the electronic component storage package 20. The insulating plate 1 of the wiring board 10 functions as an insulating substrate for arranging the signal line 2 and the ground line 3 constituting the transmission line L so as to be electrically insulated from each other.

The insulating plate 1 is, for example, a rectangular plate-shaped member when viewed from above. The shape and dimensions of the insulating plate 1 may be appropriately set according to the application of the wiring board 10. For example, the insulating plate 1 may have a flat plate shape, or may have stepped portions on the outer surface such as the upper surface and the lower surface. Further, the insulating plate 1 may include, for example, as shown in FIGS. 3 and 4, a flat plate-shaped portion 1a and a wall-shaped portion 1b arranged on at least one of an upper surface and a lower surface thereof. .. The flat plate-shaped portion of the insulating plate 1 is a portion for arranging the transmission line L including the plurality of signal lines 2 and the plurality of grounded lines 3, and the wall-shaped portion 1b is placed in the electronic component storage package 20. It is a portion having a function of closing the opening of the substrate 11 described later.

The insulating plate 1 is an insulating layer containing a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitrided sintered body, a mullite sintered body, or a glass ceramic sintered body (individual layers are not shown). ) Is formed by. The insulating layer may be one layer or a plurality of layers depending on conditions such as predetermined dimensions and mechanical strength of the insulating plate 1.

The insulating plate 1 (insulating layer) is manufactured as follows, for example, when it is made of an aluminum oxide sintered body. First, an appropriate organic binder, organic solvent, plasticizer, dispersant, etc. are added to raw material powders such as aluminum oxide (Al ₂ O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), and calcium oxide (CaO). Mix to make a slurry. Next, this slurry is molded into a band-shaped ceramic green sheet by a sheet molding technique such as the doctor blade method. Next, a plurality of green sheets are obtained by cutting the ceramic green sheet into a predetermined shape and size. Then, a plurality of these ceramic green sheets are laminated as needed and fired at a temperature of about 1300 to 1600 ° C. Thereby, the insulating plate 1 can be manufactured.

When the insulating plate 1 is stepped, a plurality of green sheets having different dimensions are laminated and fired. Thereby, the insulating plate 1 having the stepped portion according to the dimensional difference between the green sheets can be manufactured.

As shown in FIG. 3, the insulating plate 1 has a notch 5 at the end portion of the upper surface. In other words, the outer surface of the insulating plate 1 has a groove portion extending downward from the upper end at the same height as the upper surface of the insulating plate 1. The notch portion 5 is a portion where the end portion of the ground line 3 is located, as will be described later, and is a portion for bringing the end portion of the ground line 3 closer to the direction of the signal line 2. The notch portion 5 can be formed by performing a punching process to form the notch portion 5 on the outer surface of the green sheet to be the insulating plate 1.

In this case, a dummy area is provided outside the portion of the green sheet that will be the insulating plate 1, and the green sheet is punched over the dummy region so as to straddle the portion that is the upper end of the insulating plate 1. May be applied. After that, if the dummy region is removed, the insulating plate 1 having the notch portion 5 can be manufactured. The details of the notch 5 and the ground line 3 around the notch 5 will be described later.

The transmission line L has a signal line 2 and a ground line 3 as described above. The signal line 2 and the ground line 3 constituting the transmission line L extend in the direction (first direction D1) connecting the outer end of the insulating plate 1 in the electronic component storage package 20 and the opposite end. There is. The first direction D1 corresponds to the length direction of the transmission line L. The second direction D2 is defined as a direction orthogonal to the first direction D1 in top view or bottom view. The second direction D2 corresponds to the line width direction of the signal line 2 and the ground line 3. In the following, the first direction D1 and the second direction D2 may be referred to as a length direction and a line width direction.

The transmission line L including the signal line 2 and the ground line 3 is located on the lower surface of the insulating plate 1 in this embodiment. This transmission line is located outside the substrate 11 in the electronic component storage package 20. The transmission line L is electrically led out to the upper surface side of the insulating plate 1 via an internal conductor (not shown) such as a via conductor provided inside the insulating plate 1. Inside the substrate 11 in the electronic component storage package 20, a wiring conductor 7 electrically connected to the signal line 2 and the ground line 3 via an internal conductor is located on the upper surface of the insulating plate 1.

For example, an external connection terminal (not shown) such as a lead terminal is connected to the transmission line L via a brazing material or the like, and an electronic component 21 is electrically connected to the wiring conductor 7 via a bonding wire (not shown) or the like. Be connected. As a result, the electronic component 21 and the external electric circuit are electrically connected via the transmission line L or the like.

The signal line 2 is a line that transmits an electric signal such as a high frequency signal of 10 GHz or more. Each of the pair of ground lines 3 is arranged parallel to the signal line 2 in the first direction D1. Further, the pair of grounding lines 3 are located so as to sandwich the signal line 2 in the second direction D2. That is, the transmission line L is a microstrip type or strip type transmission line. In the case of the strip type transmission line L, a metallized layer (not shown) is arranged above or below the transmission line L.

In the wiring board 10 of the embodiment, a pair of signal lines 2 are arranged. The paired signal lines 2 and 2 (hereinafter, also simply referred to as signal lines 2) transmit signals having opposite phases to each other, and form a differential line.

The ground line 3 functions as a co-surface ground conductor in the microstrip type transmission line as described above. This reduces the possibility that transmission losses such as reflection loss and transmission loss will occur in the electrical signal.

As described above, in the plan view, the wiring board 10 of the embodiment has a notch 5 at the end of the upper surface of the insulating plate 1 whose dimension in the first direction D1 is larger than the dimension in the second direction D2. Each of the pair of grounding lines 3 and 3 (hereinafter, also simply referred to as grounding line 3) has an end portion 3a including a notch portion 5. In other words, for example, as shown in FIG. 3, the end 3a of the ground line 3 is located at the end of the upper surface of the insulating plate 1, and the outer side is outside in the line width direction so as to sandwich the notch 5 in between. It has spread to. Further, in other words, the ground line 3 has an apparent line width widened at the end 3a according to the dimension of the notch 5 in the second direction D2.

As described above, since the ground line 3 has the end portion 3a including the notch portion 5, the possibility of crosstalk noise occurring in the signal line 2 is reduced. That is, there is a relatively long notch 5 at the end of the insulating plate 1 in the first direction D1, and the end 3a of the ground line 3 is close to the signal line 2 at the notch 5. That is, the grounding area along the signal line 2 becomes longer than before. Therefore, the occurrence of crosstalk noise can be reduced.

In this case, the size of the notch 5 in the top view is longer in the first direction D1 than in the second direction D2. Therefore, the length of the ground contact region in the first direction D1 of the signal line can be effectively increased. As the signal line 2 approaches the end, the possibility of crosstalk increases. Therefore, the crosstalk characteristic can be improved by making the notch portion 5 formed at the end portion of the grounding line 3 larger than the end portion toward the first direction D1.
That is, it is possible to simultaneously adjust the impedance matching by the ground conductor 3 and improve the crosstalk characteristics with respect to the signal line 2 in a longer length direction.

Further, the notch portion 5 has a relatively small size in the second direction D2. Therefore, the possibility that the ground line 3 is too close to the signal line 2 is effectively reduced. As a result, the electrical insulation between the signal line 2 and the ground line 3 can be easily ensured.

With respect to the notch portion 5, the length in the first direction D1 is set to, for example, about 2 to 4 times the length in the second direction D2. Thereby, the effect of increasing the ground contact area can be easily obtained. Further, the notch portion 5 can be easily formed, which is advantageous in ensuring high productivity as the wiring board 10.

The signal line 2 and the ground line 3 are made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel or cobalt. The signal line 2 and the ground line 3 may be made of an alloy material of such a metal material, or a plurality of metal layers may be laminated on each other. The plurality of metal layers may be made of different types of metal materials from each other, or may have different thicknesses from each other.

The signal line 2 and the ground line 3 can be formed as follows, for example, when they are made of tungsten. First, a powder of a metal material such as tungsten is kneaded with an effective solvent, a binder, or the like to prepare a metal paste. Next, this metal paste is printed on the surface of the green sheet, which is the insulating layer of the insulating plate 1, in a predetermined pattern by a method such as a screen printing method. Then, it is fired at the same time as this metal paste green sheet. By the above steps, the insulating plate 1 having the signal line 2 and the ground line 3 can be manufactured.

The signal line 2 and the ground line 3 may be those in which a plating layer such as nickel or gold is further provided on the exposed surface of the metallized layer. The plating layer suppresses oxidation of the transmission line L and improves reliability. Further, the characteristics of connectivity (wetting property or bonding property of the brazing material, etc.) of the lead terminal or the bonding wire are improved.

Even if the line width of the grounding line 3 is simply widened or a non-forming part (not shown) is provided at the center of the grounding line in the line width direction without providing such a notch portion 5. , The effect of increasing the grounding area on the signal line 2 can be obtained to some extent. However, when the notch portion 5 is provided as in the wiring board 10 of the embodiment, for example, by providing a conductor layer on the surface (inner side surface) of the notch portion 5, the grounding region including the grounding line 3 is moved up and down. It can be secured larger in the direction. Therefore, the possibility of crosstalk noise occurring in the signal line 2 is effectively reduced.

In addition, in FIG. 5, in order to make the figure easy to see, only the position where the conductor layer is provided is shown, and the conductor layer itself is not shown. The conductor layer is, for example, an arc-shaped metallized layer along the surface of the notch portion 5. Such a metallized layer can be formed by the same method using, for example, the same metal material as the signal line 2 and the ground line 3. This metallized layer may also be coated with a plating layer such as nickel or gold.

As described above, the wiring board 10 and the base 11 having the above configuration constitute the electronic component storage package 20 as an example of the embodiment of the present invention. The substrate 11 has an upper surface including a recess 11a. Further, the substrate 11 has an opening 11b in a part of the side wall portion of the recess. The recess 11a is a portion constituting a container for accommodating the electronic component 21. The opening 11b is a space for arranging input / output terminals for electrically connecting the inside and outside of the recess. In the electronic device 30 of the embodiment, the wiring board 10 described above is used as an input / output terminal.

In the example shown in FIG. 4, the substrate 11 includes a flat plate-shaped base portion 12 and a frame portion 13 arranged on the upper surface of the base portion 12. The recess 11a is formed by the upper surface of the base 12 and the inner surface of the frame 13. For example, as will be described later, both the base portion 12 and the frame portion 13 are made of a metal material, and are joined to each other and integrated by a method such as brazing. The substrate 11 is not limited to such a bonded body, and may be an integral one.

In this embodiment, the base 12 is a square metal member, which is a copper-based material such as oxygen-free copper (Cu), copper-tungsten (Cu-W), copper-molybdenum (Cu-Mo) alloy, or iron-. It is made of a metal such as a nickel-copper (Fe-Ni-Co) alloy and an iron-nickel (Fe-Ni) alloy. In particular, from the viewpoint of improving the thermal conductivity of the substrate 11 and efficiently dissipating the heat generated from the electronic component 21 housed inside to the outside, a Cu-based material (Cu, an alloy containing Cu as a main component, or an alloy containing Cu as a main component, or A metal material impregnated with Cu) is advantageous.

Such a base 12 is manufactured into a predetermined shape by subjecting an ingot of a metal material as described above to metal processing such as rolling or punching. A plating layer such as nickel or gold may be adhered to the surface of the base portion 12 in order to suppress oxidative corrosion and further facilitate mounting and fixing of the electronic component 5 by brazing or the like. The plating layer can be formed by an electrolytic plating method or an electroless plating method. An example of the thickness of the plating layer is a nickel layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 5 μm.

The frame portion 13 located on the upper surface of the base portion 12 surrounds the portion of the upper surface of the base portion 12 on which the electronic component 21 is mounted. The frame portion 13 is joined to the base portion 12 by a brazing material such as silver (Ag) brazing or silver-copper (Ag-Cu) brazing material. The frame portion 13 is, for example, rectangular in top view, and has an opening 11b on one side surface on the short side. The opening 11b is a mounting portion of the wiring board 10 as an input / output terminal. The wiring board 10 is joined to the base 11 so as to close this opening. This joining is done, for example, by brazing. As a result, the electronic component storage package 20 having a container portion, which can accommodate the electronic component 21 and can be electrically connected to the outside, is formed.

In this embodiment, a circular penetrating portion 11c is provided on the side surface on the short side opposite to the opening 11b of the substrate 11. The penetrating portion 11c is, for example, a portion into which an optical conduction path through which an optical signal is transmitted is inserted. As a result, it is a package for storing an electronic part that forms an electronic device capable of transmitting and receiving an optical signal to and from the outside through the penetrating part 11c. The penetrating portion 11c can be formed at a predetermined position on the substrate 11 by, for example, the same metal processing as described above.

As described above, as one embodiment of the present invention, the electronic component storage package 20 having the above configuration and the electronic component 21 housed in the recess 11a and electrically connected to the line portion L are used. Electronic device 30 is configured. The electronic component 21 is hermetically sealed by, for example, a lid (not shown) joined to the frame 22 so as to close the recess 11a. That is, the electronic component 21 is airtightly housed in the container composed of the recess 11a of the substrate 11, the wiring board 10 (input / output terminal), and the lid. The frame body 22 has a function of facilitating the joining between the base 11 (frame portion 13) and the lid body. The frame body 22 can be manufactured by the same method using, for example, the same metal material as the substrate 11. Further, the base 11, the frame 22 and the lid are joined by a brazing material such as silver brazing or gold-tin brazing.

Examples of the electronic component 21 housed in the electronic component storage package 20 include an optical semiconductor element such as a semiconductor laser (LD) and / or a photodiode (PD), a semiconductor integrated circuit element, various sensor elements, and a microelectronic machine. Mechanical elements (so-called MEMS elements) and the like can be mentioned. When the electronic component 21 is an optical semiconductor element, a cylindrical optical fiber mounting member may be fitted and fixed to the penetrating portion 11c by brazing or the like. An electronic device having a penetrating portion 11c and accommodating an optical semiconductor element is, for example, an optical transmission device, used as an optical transceiver, and used as a component in optical transmission equipment such as various routers.

According to such an electronic device 30, since the wiring board 10 having the above configuration is included, it is possible to provide the electronic device 30 in which the generation of crosstalk noise in the signal line 2 is effectively reduced. Further, it is possible to provide an electronic device 30 which can effectively reduce signal deterioration and easily transmit an optically transmitted signal as an electric signal to the outside.

FIG. 6 is a plan view of a modified example of the wiring board 10 according to the embodiment of the present invention as viewed from below. FIG. 6 can also be regarded as a modification of FIG. In FIG. 6, the same parts as those in FIGS. 1 to 5 are designated by the same reference numerals.

In the example shown in FIG. 6, the notch portion 5 includes a rectangular portion in a plan view (bottom view). That is, the plurality of notches 5 include those having an oval shape in the bottom view. When the rectangular notch 5 (5A) is included in the plurality of notches 5, it is easy to match with the embodiment in the calculation of the impedance between the signal line 2 and the ground line 3, and the impedance can be finely adjusted. It will be easy.

When the plurality of cutouts 5 include a partially oval shape (a shape in which the oval is cut at the central portion in the longitudinal direction) in the bottom view, the transmission lines L are arranged at high density. , Crosstalk noise can be reduced, and the width of the ground line 3 with respect to the signal line 2 can be easily kept constant. Therefore, it is easy to keep the impedance between the signal line 2 and the ground line 3 in the first direction D1 constant.

Further, in the example shown in FIG. 6, the wiring board 10 has a notch portion when the transmission line L includes a plurality of signal lines 2 and a plurality of pairs of ground lines 3 arranged in the second direction D2. Reference numeral 5 denotes a partial oval shape at the central portion of the arrangement of the ground line 3, and a rectangular shape at both end portions of the arrangement.

By forming the ground line 3 arranged between different signal lines (differential signals) into a partially oval shape, the impedance of one signal line 2 and the ground line 3 and the impedance of the other signal line 2 and the ground line 3 are formed. It becomes easy to make the impedance with and constant constant. Further, at both ends where the influence of external noise may be large, by making the notches at both ends of the array rectangular, it is possible to suppress the ingress of external noise from the outside and give it to the signal line 2. The impact can be reduced.

In each of the above embodiments, the wiring board 10 further has a ground via conductor 6 having an end portion connected to the ground line 3 at a position away from the notch portion 5. At this time, in the second direction D2, the dimension of the grounding via conductor 6 at the connection portion with the grounding line 3 and the dimension of the notch portion 5 are the same as each other. The grounding via conductor 6 has a function of electrically connecting the grounding conductor layer (not shown) arranged inside or the upper surface of the insulating plate 1 and the grounding line 3. This electrical connection further stabilizes the ground potential of 3 on the ground line. This more effectively increases the ground contact area, which is effective in reducing crosstalk noise.

Further, in the second direction D2, the dimensions of the grounding via conductor 6 at the connection portion with the grounding line 3 and the dimensions of the notch portion 5 are the same as each other, so that the grounding via conductor 6 and the notch portion are formed from the signal line. The distances to the ends of 5 on the signal line side are about the same as each other. As a result, the impedance between the signal line 2 and the ground line 3 in the first direction D1 becomes constant, and the transmission loss of the high frequency signal can be minimized. Therefore, the variation in the characteristic impedance in the signal line 2 is effectively suppressed. Therefore, the wiring board 10 has a transmission line L that is advantageous for transmitting high-frequency signals.

Further, by arranging the ground via conductor 6 and the notch 5 in the center of the second direction D2 of the ground line 3, one signal line 2 is provided between different signal lines located on both sides of the ground line 3. By matching the impedance between the and the ground line 3 with the impedance between the other signal line 2 and the ground line 3, the transmission loss between the signal lines in the array can be kept constant.

1 ... Insulation plate
2 ... Signal line
3 ... Ground line L ... Transmission line
5 ... Notch 6 ... Ground via conductor 7 ... Wiring conductor
10 ... Wiring board
11 ... Hypokeimenon
11a ... concave
11b ... Opening
11c ... Penetration
12 ... base
13 ... Frame
20 ... Package for storing electronic components
21 ... Electronic components
22 ... Frame
30 ... Electronic device D1 ... 1st direction D2 ... 2nd direction

Claims (7)

A transmission line including a signal line extending in the first direction and a pair of ground lines parallel to the signal line sandwiching the signal line in a second direction orthogonal to the first direction, and an upper surface on which the transmission line is located. Equipped with an insulating plate to have
In plan view, the there is a large notch than the dimension size in the first direction is definitive in the second direction to the edge of the upper surface of the insulating plate,-out each ground line is the cut of the pair of ground lines It has an end including a part ,
A wiring board in which the line width of the ground line is widened at the end . The wiring board according to claim 1 , wherein the outer side of the end of the grounding line extends outward in the line width direction so as to sandwich the notch . The transmission line includes a plurality of the signal lines arranged in the second direction and a plurality of pairs of the ground lines.
The wiring board according to claim 1 or 2, wherein the cutout portion has a partial oval shape at the central portion of the arrangement of the grounding lines and a rectangular shape at both end portions of the arrangement. A ground via conductor having an end portion connected to the ground line at a position away from the notch portion is further provided, and in the second direction, the dimensions of the ground via conductor at the connection portion with the ground line and the above. The wiring board according to any one of claims 1 to 3, wherein the dimensions of the cutouts are the same as each other. The wiring board according to any one of claims 1 to 4, further comprising a conductor layer located on the surface of the insulating plate in the cutout portion. A substrate having an upper surface including a recess and having an opening in a part of the side wall portion of the recess.
An electronic component according to any one of claims 1 to 5, wherein an end portion of the transmission line including the notch portion of the transmission line is arranged outside the recess in the opening portion. Storage package. And the electronic component storing package according to 請Motomeko 6,
An electronic device that is housed in the recess and includes an electronic component that is electrically connected to the transmission line .

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