JP4874177B2 - Connection terminal, package using the same, and electronic device - Google Patents

Connection terminal, package using the same, and electronic device Download PDF

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JP4874177B2
JP4874177B2 JP2007169903A JP2007169903A JP4874177B2 JP 4874177 B2 JP4874177 B2 JP 4874177B2 JP 2007169903 A JP2007169903 A JP 2007169903A JP 2007169903 A JP2007169903 A JP 2007169903A JP 4874177 B2 JP4874177 B2 JP 4874177B2
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shield member
connection terminal
conductor
line conductor
wall portion
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JP2009010149A (en
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真広 辻野
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Kyocera Corp
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Description

本発明は、接続端子及びにこれを用いたパッケージ並びに電子装置に関する。   The present invention relates to a connection terminal, a package using the connection terminal, and an electronic device.

従来、電子部品をパッケージ内部に気密封止して収納した電子装置の一例を図７に示す。   Conventionally, an example of an electronic device in which electronic components are hermetically sealed in a package is shown in FIG.

図７において、パッケージを構成する部材は、基体１０１と、枠体１０２と、枠体１０２に形成された入出力端子１０３とを具備する。   In FIG. 7, a member constituting the package includes a base 101, a frame body 102, and an input / output terminal 103 formed on the frame body 102.

基体１０１は、金属製であり、上側主面に電子部品１０５の載置部１０１ａが形成される。   The base 101 is made of metal, and a placement portion 101a for the electronic component 105 is formed on the upper main surface.

枠体１０２は、四角枠状の金属部材１０２ａと入出力端子１０３から成り、基体１０１の上側主面に載置部１０１ａを囲繞するように設けられる。   The frame body 102 includes a rectangular frame-shaped metal member 102 a and an input / output terminal 103, and is provided on the upper main surface of the base body 101 so as to surround the mounting portion 101 a.

入出力端子１０３は、絶縁体から成り、枠体１０２の内外を電気的に導通する線路導体１０３ａを有する。   The input / output terminal 103 is made of an insulator, and has a line conductor 103 a that is electrically connected to the inside and outside of the frame body 102.

入出力端子１０３の取付部１０２ｂは、入出力端子１０３が嵌着され、金属部材１０２ａの下部の隣接する２つの角部間が切り欠かれて成る。   The mounting portion 102b of the input / output terminal 103 is formed by fitting the input / output terminal 103 and notching between two adjacent corners at the bottom of the metal member 102a.

入出力端子１０３は、２つの角部に位置する互いに対向する一対の端面１０３ｅの取付部１０２ａに沿った部位および基体１０１に沿った部位に金属層１０３ｄが被着されている（例えば、特許文献１参照）。   In the input / output terminal 103, a metal layer 103d is attached to a portion along the attachment portion 102a and a portion along the base body 101 of a pair of opposite end surfaces 103e located at two corners (for example, Patent Documents). 1).

このように入出力端子１０３の端面に金属層１０３ｄが被着されることにより、金属層１０３ｄが線路導体１０３ａに対する接地電位として機能するようになる。
特開２００６−６６８６７号公報 Thus, the metal layer 103d is deposited on the end face of the input / output terminal 103, so that the metal layer 103d functions as a ground potential for the line conductor 103a.
JP 2006-66867 A

しかしながら、従来のパッケージにおける金属層１０３ｄは、枠体１０２を構成する金属部材１０２ａおよび金属製の基体１０１と同一電位の接地導体、いわゆるケースグランドとなっており、このようなケースグランドにおいては、接地電位に外部からの電磁波ノイズが吸収されるため、金属層１０３ｄの接地電位が不安定となる場合があった。   However, the metal layer 103d in the conventional package is a ground conductor having the same potential as the metal member 102a constituting the frame body 102 and the metal base 101, that is, a so-called case ground. Since electromagnetic wave noise from the outside is absorbed by the potential, the ground potential of the metal layer 103d may become unstable.

また、近年、電子部品がより高周波の電気信号で作動するようになってきており、線路導体１０３ａを伝送する電気信号も高周波化している。線路導体１０３ａを伝送する電気信号が高周波となると、接地電位が不安定である場合、反射損失等の伝送損失が大きくなり高周波信号を効率良く伝送できない問題点があった。   In recent years, electronic components have come to operate with higher-frequency electrical signals, and electrical signals transmitted through the line conductor 103a have also been increased in frequency. When the electric signal transmitted through the line conductor 103a has a high frequency, when the ground potential is unstable, a transmission loss such as a reflection loss increases, and there is a problem that the high-frequency signal cannot be transmitted efficiently.

本発明は、上記問題点に鑑みてなされたものであり、その目的は電磁波による影響を抑制し、且つ接地電位を安定化させることのできる接続端子及びこれを用いたパッケージ並びに電子装置を提供することにある。   The present invention has been made in view of the above problems, and an object thereof is to provide a connection terminal capable of suppressing the influence of electromagnetic waves and stabilizing the ground potential, a package using the connection terminal, and an electronic device. There is.

上記の課題を解決するために、請求項１に記載の接続端子は、誘電体からなる平板部と、誘電体からなるとともに、該平板部上に所定周波数の電気信号が伝送される線路導体を介して接合された立壁部と、前記立壁部に設けられた第１シールド部材と、前記第１シールド部材と前記線路導体との間に配されるとともに、前記第１シールド部材と電気的に絶縁され、外部回路と電気的に接続するための第１接地導体と、を具備してなるものである。   In order to solve the above-mentioned problem, the connection terminal according to claim 1 includes a flat plate portion made of a dielectric, and a line conductor that is made of a dielectric and that transmits an electric signal of a predetermined frequency on the flat plate portion. And a first shield member provided on the standing wall, the first shield member disposed between the first shield member and the line conductor, and electrically insulated from the first shield member. And a first ground conductor for electrically connecting to an external circuit.

また、請求項２に記載の接続端子は、請求項１に記載の接続端子であって、前記第１シールド部材と前記第１接地導体との距離は前記周波数の波長よりも短いことを特徴とするものである。   The connection terminal according to claim 2 is the connection terminal according to claim 1, wherein a distance between the first shield member and the first ground conductor is shorter than a wavelength of the frequency. To do.

また、請求項３に記載の接続端子は、請求項１又は請求項２に記載の接続端子であって、前記第１接地導体は、前記立壁部の誘電体を介して前記線路導体と対向する部位に積層されていることを特徴とするものである。   The connection terminal according to claim 3 is the connection terminal according to claim 1 or 2, wherein the first grounding conductor faces the line conductor via a dielectric of the standing wall portion. It is characterized by being laminated on the part.

また、請求項４に記載の接続端子は、請求項１乃至請求項３のいずれかに記載の接続端子であって、前記第１接地導体は、前記立壁部の前記線路導体を横切る壁面に設けられていることを特徴とするものである。

The connection terminal according to claim 4 is the connecting terminal according to any one of claims 1 to 3, wherein the first grounding conductor, the wall surface transverse to the front SL line conductor of the standing wall portion Is provided.

また、請求項５に記載の接続端子は、上記いずれかに記載の接続端子であって、前記第１シールド部材は、前記立壁部の前記線路導体を横切る壁面に設けられていることを特徴とするものである。

Further, that the connection terminal according to claim 5, said a connecting terminal according to either the first shield member is provided on a wall surface transverse to the front SL line conductor of the standing wall portion It is a feature.

また、請求項６に記載の接続端子は、上記の接続端子であって、前記第１接地導体及び前記第１シールド部材は、前記側面に設けられた切欠部に被覆されたキャスタレーションによって形成されていることを特徴とするものである。

The connection terminal according to claim 6 is the connection terminal described above , wherein the first ground conductor and the first shield member are formed by a castellation covered with a notch provided in the side surface. It is characterized by that.

また、請求項７に記載の接続端子は、上記いずれかに記載の接続端子であって、前記平板部上に、前記線路導体と隣り合って配された第２接地導体を備えたことを特徴とするものである。

The connection terminal according to claim 7, said a connecting terminal according to any one, characterized in that on said plate, comprising a second grounding conductor disposed adjacent to the said line conductor It is what.

また、請求項８に記載の接続端子は、上記いずれかに記載の接続端子であって、前記立壁部の上面に第２シールド部材が設けられていることを特徴とするものである。

A connection terminal according to an eighth aspect of the present invention is the connection terminal according to any one of the above , wherein a second shield member is provided on an upper surface of the standing wall portion.

また、請求項９に記載の接続端子は、上記記載の接続端子であって、前記第２シールド部材と前記第１シールド部材とは、前記立壁部内部に設けられたビアホールにより導通してなることを特徴とするものである。

The connection terminal according to claim 9 is the connection terminal described above, wherein the second shield member and the first shield member are electrically connected by a via hole provided in the standing wall portion. It is characterized by.

また、請求項１０に記載の接続端子は、上記いずれかに記載の接続端子であって、前記立壁部の誘電体はセラミックスであることを特徴とするものである。

The connection terminal according to claim 1 0, the a connection terminal according to any dielectric of the vertical wall portion is characterized in that a ceramic.

請求項１１に記載のパッケージは、上面にキャビティの開口を有するとともに、壁部に前記キャビティに通じる開口部を有した容器体と、前記開口部に、前記線路導体が前記壁部の内外を電気的に導通するように接合された上記いずれかに記載の接続端子とを備えているものである。

The package of claim 1 1, which has an opening of the cavity on the upper surface, the container body having an opening communicating with the cavity in the wall, before Symbol opening, said line conductor of said wall portion and out which is a shall have a connection terminal according to any one of the above joined so as to be electrically conductive.

請求項１２に記載の電子装置は、上記記載のパッケージと、前記キャビティ内部に搭載された電子素子と、前記キャビティの前記開口を塞ぐように前記容器体に接合された蓋体と、を具備してなるものである。

Electronic device according to claim 1 2, comprising: a package described above, an electronic device mounted within said cavity, and a lid joined to said container body so as to close the opening of the cavity It is made.

本発明の接続端子は、誘電体からなる平板部と、誘電体からなるとともに、該平板部上に所定周波数の電気信号が伝送される線路導体を介して接合された立壁部と、前記立壁部に設けられた第１シールド部材と、前記第１シールド部材と前記線路導体との間に配されるとともに、前記第１シールド部材と電気的に絶縁され、外部回路と電気的に接続するための第１接地導体と、を具備してなることから、線路導体を伝搬する電気信号が１０ＧＨｚを超えるような高周波電気信号の場合にインピーダンス値が増加した場合であっても、外部ノイズが線路導体を伝搬する電気信号に及ぼす影響を第１シールド部材で抑制できるとともに、第１シールド部材と第１接地導体とは電気的に絶縁していることから第１接地導体は外部ノイズの影響を受けにくく、安定した接地電位を維持できる。それゆえ、インピーダンス特性の整合性を維持することができる。   The connection terminal of the present invention includes a flat plate portion made of a dielectric, an upright wall portion made of a dielectric material, and joined to the flat plate portion via a line conductor that transmits an electric signal having a predetermined frequency. A first shield member provided on the first shield member, and disposed between the first shield member and the line conductor, electrically insulated from the first shield member, and electrically connected to an external circuit And the first ground conductor, so that even if the impedance value increases in the case of a high-frequency electrical signal in which the electrical signal propagating through the line conductor exceeds 10 GHz, external noise is applied to the line conductor. The influence on the propagating electrical signal can be suppressed by the first shield member, and since the first shield member and the first ground conductor are electrically insulated, the first ground conductor is affected by external noise. Kuku, it is possible to maintain a stable ground potential. Therefore, the consistency of impedance characteristics can be maintained.

また、前記第１シールド部材と前記第１接地導体との距離は前記周波数の波長よりも短いことが好ましく、線路導体を伝搬する周波数に起因した電界が、第１シールド部材と線路導体との間に発生しても、第１接地導体と第１シールド部材との距離は線路導体を伝搬する周波数の波長よりも短いことから、第１接地導体と第１シールド部材とで囲まれる空間内で上記電界が共振することを抑制できる。すなわち、第１接地導体と第１シールド部材とで囲まれる空間内を、線路導体を伝搬する周波数よりも高い周波数で共振するようにしたことから、上記電界の共振によって生じたノイズが線路導体へ加わることを抑制できる。   The distance between the first shield member and the first ground conductor is preferably shorter than the wavelength of the frequency, and an electric field caused by a frequency propagating through the line conductor is between the first shield member and the line conductor. Even if it occurs, the distance between the first ground conductor and the first shield member is shorter than the wavelength of the frequency propagating through the line conductor. Resonance of the electric field can be suppressed. That is, since the space surrounded by the first ground conductor and the first shield member is resonated at a frequency higher than the frequency propagating through the line conductor, noise generated by the resonance of the electric field is transmitted to the line conductor. It can suppress joining.

また、前記第１接地導体は、前記立壁部の誘電体を介して前記線路導体と対向する部位に積層されていることが好ましく、線路導体から発生した電界を効果的に第１接地導体に導くことができるとともに、第１シールド部材に帯電した電荷が第１接地導体を介して線路導体に与える影響を抑制することができる。   Further, the first ground conductor is preferably laminated at a portion facing the line conductor via the dielectric of the standing wall portion, and the electric field generated from the line conductor is effectively guided to the first ground conductor. In addition, the influence of the electric charge charged on the first shield member on the line conductor via the first ground conductor can be suppressed.

また、前記第１接地導体は、前記立壁部のうち前記線路導体の線路方向と交わる側面に設けられていることが好ましく、線路導体を伝搬する所定周波数の電気信号が立壁部の内部に放出された場合であっても、立壁部のうち線路導体の線路方向と交わる側面で反射させて閉じ込めることができるため、伝送損失を抑制することができる。   The first ground conductor is preferably provided on a side surface of the standing wall portion that intersects the line direction of the line conductor, and an electric signal having a predetermined frequency propagating through the line conductor is emitted into the standing wall portion. Even in this case, since it can be reflected and confined by the side surface of the standing wall portion that intersects the line direction of the line conductor, transmission loss can be suppressed.

また、前記第１シールド部材は、前記立壁部のうち前記線路導体の線路方向と交わる側面に設けられていることが好ましく、立壁部のうち線路導体の線路方向と交わる側面で電磁遮蔽効果（シールド効果）が得られるため、インピーダンス整合を効果的に得ることができる。それゆえ、安定した所定周波数の電気信号を得ることができる。   The first shield member is preferably provided on a side surface of the standing wall portion that intersects the line direction of the line conductor, and an electromagnetic shielding effect (shield) is provided on the side surface of the standing wall portion that intersects the line direction of the line conductor. Therefore, impedance matching can be obtained effectively. Therefore, a stable electric signal having a predetermined frequency can be obtained.

また、前記第１接地導体及び前記第１シールド部材は、前記側面に設けられた切欠部に被覆されていることが好ましく、切欠部を形成することにより側面を正面視したときに、第１接地導体及び第１シールド部材が同一面積である場合であっても、その表面積は切欠部を有していないよりも切欠部を有する方が広く形成できるため、より効果的に電磁遮蔽効果（シールド効果）や、線路導体を伝搬する所定周波数の電気信号の閉じ込め効果を得ることができる。   The first grounding conductor and the first shield member are preferably covered with a notch provided on the side surface, and the first grounding is formed when the side surface is viewed from the front by forming the notch. Even when the conductor and the first shield member have the same area, the surface area of the conductor and the first shield member can be formed wider with the cutout than without the cutout, so that the electromagnetic shielding effect (shielding effect) can be more effectively achieved. ) Or a confinement effect of an electric signal having a predetermined frequency propagating through the line conductor.

また、前記切欠部の形状は前記立壁部を上面視して矩形または扇形であり、複数の前記切欠部に挟まれた前記立壁部のエッジ部は、鈍角であることが好ましく、エッジ部に応力が加わった場合であっても、複数の切欠部に挟まれた立壁部のエッジ部は鈍角であるため、応力を効果的に分散させてエッジ部に応力集中が生じることを抑制できる。   The shape of the notch is rectangular or fan-shaped when the standing wall is viewed from above, and the edge of the standing wall sandwiched between the plurality of notches is preferably obtuse, and stress is applied to the edge. Even in the case of adding, since the edge portion of the standing wall portion sandwiched between the plurality of notches has an obtuse angle, it is possible to effectively disperse the stress and suppress the stress concentration from occurring at the edge portion.

また、前記側面に設けられた前記第１シールド部材及び前記第１接地導体は、キャスタレーションによって形成されてなることが好ましく、第１シールド部材及び第１接地導体がキャスタレーションによって切欠部に均一な厚みで被覆することができるため、接続端子に熱が加わった場合であっても、第１シールド部材及び第１接地導体の厚みが異なる部位において、その熱膨張によって接続端子に局所的に応力が加わることを抑制できる。   In addition, the first shield member and the first ground conductor provided on the side surface are preferably formed by castellation, and the first shield member and the first ground conductor are uniformly formed in the notch by castellation. Since it can be coated with a thickness, even when heat is applied to the connection terminal, stress is locally applied to the connection terminal due to the thermal expansion of the first shield member and the first ground conductor at different portions. It can suppress joining.

また、前記平板部上に、前記線路導体と隣り合って配された第２接地導体を備えたことが好ましく、線路導体を伝搬する所定周波数の電気信号を平板部上面方向に対しても反射させて閉じ込めることができるため、より伝送損失を抑制することができる。   Further, it is preferable that a second ground conductor arranged adjacent to the line conductor is provided on the flat plate portion, and an electric signal having a predetermined frequency propagating through the line conductor is reflected also in the upper surface direction of the flat plate portion. Transmission loss can be further suppressed.

また、前記立壁部の上面に第２シールド部材が設けられていることが好ましく、立壁部の上面でも電磁遮蔽効果（シールド効果）が得られるため、インピーダンス整合を一層効果的に得ることができる。   Further, it is preferable that a second shield member is provided on the upper surface of the standing wall portion, and an electromagnetic shielding effect (shielding effect) is obtained even on the upper surface of the standing wall portion, so that impedance matching can be obtained more effectively.

また、前記第２シールド部材と前記第１シールド部材とは、前記立壁部内部に設けられたビアホールにより導通してなることが好ましく、後に電子装置とするために、立壁部上に蓋体をロウ材等で接合する場合においても、立壁部のうち線路導体の線路方向と交わる側面と上面との間は誘電体が露出しているため上記側面にロウ材が流れ出しにくく、電子装置製造の面で作業性が向上するため好ましい。   Further, the second shield member and the first shield member are preferably made conductive by a via hole provided inside the standing wall portion, and a lid is placed on the standing wall portion to be an electronic device later. Even in the case of joining with a material etc., the dielectric material is exposed between the side surface of the standing wall portion that intersects the line direction of the line conductor and the upper surface, so that the brazing material does not easily flow out to the side surface, and in terms of manufacturing the electronic device This is preferable because workability is improved.

また、前記立壁部の誘電体はセラミックスであることが好ましく、樹脂やガラス等の他の誘電体材料に比べ気密信頼性が高いセラミックスを用いることで立壁部の内外の気密信頼性を向上することができる。   In addition, the dielectric of the standing wall is preferably a ceramic, and the hermetic reliability inside and outside the standing wall is improved by using a ceramic having higher hermetic reliability than other dielectric materials such as resin and glass. Can do.

本発明のパッケージは、請求項１乃至請求項１２のいずれかに記載の接続端子と、キャビティを有する基体の壁部に前記キャビティに通じる開口部を有した容器体と、を備え、前記開口部に前記接続端子が接合されてなるものであり、インピーダンス特性の整合性を維持し、線路導体を伝搬する電気信号を信頼性の高いものにすることができる。   A package of the present invention includes the connection terminal according to any one of claims 1 to 12, and a container body having an opening communicating with the cavity on a wall portion of a base body having the cavity, and the opening. The connection terminals are joined to each other, maintaining the consistency of impedance characteristics and making the electric signal propagating through the line conductor highly reliable.

本発明の電子装置は、請求項１３に記載のパッケージと、前記キャビティ内部に搭載された電子素子と、前記壁部上面に接合された蓋体と、を具備してなることから、インピーダンス特性の整合性を維持し、線路導体を伝搬する電気信号が信頼性の高いものとすることができる。また、当該パッケージ周囲に他の電子装置が載置している場合であっても、パッケージ内部の電子素子が発生する電界は、第１シールド部材及び第１接地導体で吸収されるため、他の電子装置に悪影響を与えることを抑制することができる。   An electronic device according to the present invention includes the package according to claim 13, an electronic element mounted inside the cavity, and a lid bonded to the upper surface of the wall portion. It is possible to maintain consistency and make the electrical signal propagating through the line conductor highly reliable. Further, even when other electronic devices are placed around the package, the electric field generated by the electronic elements inside the package is absorbed by the first shield member and the first ground conductor. An adverse effect on the electronic device can be suppressed.

本発明の他のパッケージは、基板と、誘電体からなるとともに、前記基板上面の周囲を囲うようにして接合された平板部と、誘電体からなるとともに、前記平板部上に所定周波数の電気信号が伝送される線路導体を介して接合された立壁部と、を有する枠体と、を備え、前記枠体は、前記立壁部に設けられた第１シールド部材と、前記第１シールド部材と前記線路導体との間に配されるとともに、前記第１シールド部材と電気的に絶縁され、外部回路と電気的に接続するための第１接地導体とを有することにより、インピーダンス特性の整合性を維持し、線路導体を伝搬する電気信号を信頼性の高いものにすることができる。   Another package of the present invention comprises a substrate, a dielectric, a flat plate portion joined so as to surround the periphery of the upper surface of the substrate, a dielectric, and an electric signal having a predetermined frequency on the flat plate portion. A frame having a standing wall portion joined via a line conductor that transmits the first shield member, the first shield member, and the first shield member provided on the standing wall portion. Maintaining consistency of impedance characteristics by having a first ground conductor disposed between the line conductor and electrically insulated from the first shield member and electrically connected to an external circuit In addition, the electrical signal propagating through the line conductor can be made highly reliable.

また、本発明の他のパッケージは、誘電体からなる基板と、誘電体からなるとともに、前記基板上面の周囲を囲うように設けられ、且つ所定周波数の電気信号が伝送される線路導体を介して接合された枠体と、を備え、前記枠体は、その表面に設けられた第１シールド部材と、前記第１シールド部材と前記線路導体との間に配されるとともに、前記第１シールド部材と電気的に絶縁され、外部回路と電気的に接続するための第１接地導体とを有することにより、インピーダンス特性の整合性を維持し、線路導体を伝搬する電気信号を信頼性の高いものにすることができる。   Another package of the present invention includes a substrate made of a dielectric, and a line conductor that is made of a dielectric and is provided so as to surround the periphery of the upper surface of the substrate and through which an electric signal having a predetermined frequency is transmitted. And a first shield member provided on a surface of the frame member, and the first shield member is disposed between the first shield member and the line conductor. And having a first grounding conductor for electrical connection with an external circuit, maintaining impedance characteristic matching and making the electrical signal propagating through the line conductor highly reliable can do.

本発明の他の電子装置は、請求項１５又は請求項１６に記載のパッケージと、前記基板上であって前記枠体で囲まれた領域に載置された電子素子と、前記枠体上面に接合された蓋体と、を具備してなることから、インピーダンス特性の整合性を維持し、線路導体を伝搬する電気信号が信頼性の高いものとすることができる。さらに、当該パッケージ周囲に他の電子装置が載置している場合であっても、パッケージ内部の電子素子が発生する電界は、第１シールド部材及び第１接地導体で吸収されるため、他の電子装置に悪影響を与えることを抑制することができる。   Another electronic device according to the present invention includes a package according to claim 15 or claim 16, an electronic element placed on a region of the substrate surrounded by the frame, and an upper surface of the frame. Therefore, it is possible to maintain the consistency of the impedance characteristics and to make the electrical signal propagating through the line conductor highly reliable. Furthermore, even when other electronic devices are placed around the package, the electric field generated by the electronic elements inside the package is absorbed by the first shield member and the first ground conductor, so that An adverse effect on the electronic device can be suppressed.

本発明の接続端子及びこれを用いたパッケージ並びに電子装置について、以下に詳細に説明する。   A connection terminal, a package using the connection terminal, and an electronic device using the connection terminal of the present invention will be described in detail below.

図１（ａ）、図１（ｂ）は本発明の電子装置の一例を示す斜視図である。また、図２は図１（ａ）、図１（ｂ）のＸ−Ｘ’線における断面図である。   FIG. 1A and FIG. 1B are perspective views showing an example of an electronic device of the present invention. FIG. 2 is a cross-sectional view taken along line X-X ′ in FIGS. 1 (a) and 1 (b).

図１中、１は基体、２は枠体、３は接続端子、４は蓋体、５は電気素子、６は電気的接続手段、７は熱電変換冷却装置から成る基台、１１〜１３は接地導体、２１〜２３はシールド部材、１００はシールリング、３００はシールド用部材である。   In FIG. 1, 1 is a base body, 2 is a frame body, 3 is a connection terminal, 4 is a lid body, 5 is an electrical element, 6 is an electrical connection means, 7 is a base comprising a thermoelectric conversion cooling device, 11 to 13 are Ground conductors 21 to 23 are shield members, 100 is a seal ring, and 300 is a shield member.

例えば、主に基体１、枠体２、接続端子３で構成したパッケージのキャビティ内部に電子素子５を収納して、枠体２上に蓋体４を接合することで電子装置とすることができる。なお、図面に施したクロスハッチング線は、金属の層が形成されている部分であることを示し、その領域が断面領域を示すものではない。   For example, the electronic device 5 can be housed in the cavity of a package mainly composed of the base body 1, the frame body 2, and the connection terminals 3, and the lid body 4 can be joined to the frame body 2 to obtain an electronic device. . In addition, the cross hatching line given to drawing shows that it is a part in which the metal layer is formed, and the area | region does not show a cross-sectional area | region.

＜接続端子＞
接続端子３は、例えば長方形の誘電体から成る平板部３ｂの上面の一方の長辺から他方の長辺にかけてタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ）等のメタライズ層によって所定周波数の電気信号が伝送される線路導体３ａが形成され、この平板部３ｂ上に線路導体３ａを介して誘電体からなる立壁部３ｃが形成されている。 <Connection terminal>
The connection terminal 3 has a predetermined frequency by a metallized layer such as tungsten (W), molybdenum (Mo), manganese (Mn) from one long side to the other long side of the upper surface of the flat plate portion 3b made of, for example, a rectangular dielectric. A line conductor 3a for transmitting an electric signal is formed, and a standing wall portion 3c made of a dielectric is formed on the flat plate portion 3b via the line conductor 3a.

線路導体３ａは、例えば、Ｗ，Ｍｏ等の粉末に有機溶剤、溶媒を添加混合して得た金属ペーストを、平板部３ｂとなるセラミック生成形体の上面に、予め従来周知のスクリーン印刷法により所定パターンに印刷塗布しておき、焼成することにより形成される。   For the line conductor 3a, for example, a metal paste obtained by adding and mixing an organic solvent and a solvent to a powder of W, Mo or the like is preliminarily formed on the upper surface of the ceramic generating body to be the flat plate portion 3b by a conventionally known screen printing method. It is formed by printing and applying to a pattern and baking.

平板部３ｂおよび立壁部３ｃは、アルミナ（Ａｌ２Ｏ３）質セラミックス，窒化アルミニウム（ＡｌＮ）質セラミックス，ムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）質セラミックス等の誘電体から成り、好ましくは、セラミックグリーンシート積層法によって形成されるのがよい。すなわち、樹脂やガラス等の他の誘電体材料に比べ気密信頼性が高いセラミックスを用いることで接続端子３内外の気密信頼性を向上することができる。 The flat plate portion 3b and the standing wall portion 3c are made of a dielectric such as alumina (Al 2 O 3 ) ceramic, aluminum nitride (AlN) ceramic, mullite (3Al 2 O 3 · 2SiO 2 ) ceramic, and preferably ceramic. It may be formed by a green sheet lamination method. That is, the hermetic reliability inside and outside the connection terminal 3 can be improved by using ceramics having higher hermetic reliability than other dielectric materials such as resin and glass.

例えば、接続端子３がＡｌ２Ｏ３質焼結体の場合は、Ａｌ２Ｏ３，酸化珪素（ＳｉＯ２），酸化マグネシウム（ＭｇＯ），酸化カルシウム（ＣａＯ）等の原料粉末に適当な有機バインダ，溶剤，可塑剤，分散剤等を混合添加してペースト状とし、ドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート（セラミック生シート）を形成する。しかる後に、平板部３ｂの上面に線路導体３ａとなるＷ，Ｍｏ，Ｍｎ等の金属粉末に適当なバインダ，溶剤を混合してなる導体ペーストを、セラミックグリーンシートの所定位置にスクリーン印刷法等によって所定パターンに印刷塗布することによって、平板部３ｂの上面に線路導体３ａとなる導体ペースト層を形成する。さらに、平板部３ｂ上に導電ペーストを介して立壁部３ｃをドクターブレード法やカレンダーロール法を採用することによってセラミックグリーンシート（セラミック生シート）を形成する。 For example, when the connection terminal 3 is an Al 2 O 3 sintered body, an organic binder suitable for raw material powders such as Al 2 O 3 , silicon oxide (SiO 2 ), magnesium oxide (MgO), calcium oxide (CaO), etc. A ceramic green sheet (green ceramic sheet) is formed by mixing and adding a solvent, a plasticizer, a dispersant and the like to form a paste and adopting a doctor blade method or a calender roll method. After that, a conductor paste prepared by mixing an appropriate binder and solvent with metal powder such as W, Mo, Mn and the like that becomes the line conductor 3a on the upper surface of the flat plate portion 3b is applied to a predetermined position of the ceramic green sheet by a screen printing method or the like. A conductor paste layer to be the line conductor 3a is formed on the upper surface of the flat plate portion 3b by printing and applying a predetermined pattern. Further, a ceramic green sheet (ceramic green sheet) is formed on the flat plate portion 3b by adopting a doctor blade method or a calendar roll method for the standing wall portion 3c through a conductive paste.

このセラミックグリーンシートに平板部３ｂおよび立壁部３ｃの外形と成る適当な打ち抜き加工を施した後に、このグリーンシートを複数枚積層し、約１６００℃の温度で焼成することによって接続端子３が作製される。   The ceramic green sheet is subjected to an appropriate punching process that forms the outer shape of the flat plate portion 3b and the standing wall portion 3c, and then a plurality of the green sheets are laminated and fired at a temperature of about 1600 ° C. to produce the connection terminal 3. The

セラミックグリーンシート積層法によって形成されることによって、容易に所定形状の接続端子３を形成することができ、製造効率の良い接続端子３を提供することができる。   By forming by the ceramic green sheet laminating method, the connection terminal 3 having a predetermined shape can be easily formed, and the connection terminal 3 with high manufacturing efficiency can be provided.

ここで、本発明の特徴部分は、この接続端子３に第１シールド部材２１及び第１接地導体１１を備える点にあるため、以下に詳細に説明する。   Here, the characteristic part of the present invention is that the connection terminal 3 is provided with the first shield member 21 and the first ground conductor 11, and will be described in detail below.

（第１シールド部材）
第１シールド部材２１は、立壁部３ｃに設けられており、立壁部３ｃの内外を電磁遮蔽（シールド）することができる。すなわち、第１シールド部材２１でパッケージ外部から内部に侵入しようとする電磁波を吸収し、パッケージ内部に収納された電子素子５が電磁波により誤作動等するのを防止することができる。また、第１シールド部材２１は、線路導体３ａ及び後述する第１接地導体１１乃至第３接地導体１３と絶縁された状態で設けられていることから、第１シールド部材２１で吸収された電磁波が線路導体３ａおよび第１接地導体１１乃至第３接地導体１３にノイズとして載ってしまうことを防止できる。 (First shield member)
The first shield member 21 is provided on the standing wall 3c and can electromagnetically shield (shield) the inside and outside of the standing wall 3c. In other words, the first shield member 21 can absorb electromagnetic waves that are about to enter the inside from the outside of the package, and the electronic element 5 housed inside the package can be prevented from malfunctioning due to the electromagnetic waves. Further, since the first shield member 21 is provided in a state of being insulated from the line conductor 3a and the first ground conductor 11 to the third ground conductor 13 described later, the electromagnetic waves absorbed by the first shield member 21 are provided. It is possible to prevent the noise from being placed on the line conductor 3a and the first ground conductor 11 to the third ground conductor 13 as noise.

具体的には、第１シールド部材２１は、立壁部３ｃのうち線路導体３ａの線路方向と交わる側面に設けられていることが好ましく、立壁部３ｃのうち、特に外部からの電磁波の影響を受け易い線路導体３ａの線路方向と交わる側面で電磁遮蔽効果（シールド効果）が得られるため、インピーダンス整合を効果的に得ることができる。それゆえ、安定した所定周波数の電気信号を得ることができる。   Specifically, the first shield member 21 is preferably provided on a side surface of the standing wall portion 3c that intersects the line direction of the line conductor 3a. The first shielding member 21 is particularly affected by electromagnetic waves from the outside in the standing wall portion 3c. Since an electromagnetic shielding effect (shielding effect) is obtained at the side surface of the line conductor 3a that easily crosses the line direction, impedance matching can be effectively obtained. Therefore, a stable electric signal having a predetermined frequency can be obtained.

なお、立壁部３ｃの上面に、さらに第２シールド部材２２が設けられていることが好ましく、立壁部３ｃの上面でも電磁遮蔽効果（シールド効果）が得られるため、インピーダンス整合を一層効果的に得ることができる。   In addition, it is preferable that the second shield member 22 is further provided on the upper surface of the standing wall portion 3c, and an electromagnetic shielding effect (shielding effect) is obtained even on the upper surface of the standing wall portion 3c, so that impedance matching can be obtained more effectively. be able to.

また、接続端子３の誘電体が露出する部分には、シールド用部材３００が線路導体３ａや接地導体１１〜１３と接続しないようにして設けられていることが好ましく、誘電体が露出する箇所での電磁遮蔽効果（シールド効果）を得られ、インピーダンス整合をより効果的に得ることができる。このシールド用部材３００はシールド部材２１〜２３と接続するようにして設けられていても良い。   In addition, it is preferable that the shield member 300 is provided so as not to be connected to the line conductor 3a and the ground conductors 11 to 13 at the portion where the dielectric of the connection terminal 3 is exposed. The electromagnetic shielding effect (shielding effect) can be obtained, and impedance matching can be obtained more effectively. The shield member 300 may be provided so as to be connected to the shield members 21 to 23.

また、第１シールド部材２１乃至第３シールド部材２３は、線路導体３ａと同様にＷ，Ｍｏ，Ｍｎ等のメタライズ層を従来周知のスクリーン印刷等によって形成してもよいし、後述するキャスタレーションにより形成してもよい。   In addition, the first shield member 21 to the third shield member 23 may be formed with a metallized layer such as W, Mo, Mn or the like by a conventionally known screen printing or the like as in the case of the line conductor 3a. It may be formed.

（第１接地導体）
第１接地導体１１は、第１シールド部材２１と線路導体３ａとの間に配されるとともに、第１シールド部材２１と電気的に絶縁され、外部回路と電気的に接続するためのものである。すなわち、第１接地導体１１に外部回路から接地電位を供給することで、従来技術で示したパッケージにおけるケースグランドのように、接地電位に電磁波によるノイズが載ることを防止することができる。その結果、線路導体３ａを伝送する電気信号に反射損失等の伝送損失が発生するのを防止でき、電気信号を効率良く伝送できる。 (First grounding conductor)
The first ground conductor 11 is disposed between the first shield member 21 and the line conductor 3a, is electrically insulated from the first shield member 21, and is electrically connected to an external circuit. . That is, by supplying a ground potential to the first ground conductor 11 from an external circuit, it is possible to prevent noise due to electromagnetic waves from being placed on the ground potential as in the case ground in the package shown in the prior art. As a result, transmission loss such as reflection loss can be prevented from occurring in the electrical signal transmitted through the line conductor 3a, and the electrical signal can be transmitted efficiently.

具体的には、第１接地導体１１は、立壁部３ｃの誘電体を介して線路導体３ａと対向する部位に積層されていることが好ましく、線路導体３ａから発生した電界を効果的に第１接地導体１１に導くことができるとともに、第１シールド部材２１に帯電した電荷が第１接地導体１１を介して線路導体３ａに与える影響を抑制することができる。   Specifically, the first ground conductor 11 is preferably laminated at a portion facing the line conductor 3a through the dielectric of the standing wall portion 3c, and the first electric field generated from the line conductor 3a is effectively first. While being able to guide to the grounding conductor 11, the influence which the electric charge charged to the 1st shield member 21 has on the line conductor 3a via the 1st grounding conductor 11 can be suppressed.

また、第１接地導体１１は、立壁部３ｃのうち線路導体３ａの線路方向と交わる側面に設けられていることが好ましく、線路導体３ａを伝搬する所定周波数の電気信号が立壁部３ｃの内部に放出された場合であっても、立壁部３ｃのうち線路導体３ａの線路方向と交わる側面で反射させて閉じ込めることができるため、伝送損失を抑制することができる。   The first ground conductor 11 is preferably provided on a side surface of the standing wall portion 3c that intersects the line direction of the line conductor 3a, and an electric signal having a predetermined frequency propagating through the line conductor 3a is placed inside the standing wall portion 3c. Even in the case of being emitted, since it can be reflected and confined on the side surface of the standing wall 3c that intersects the line direction of the line conductor 3a, transmission loss can be suppressed.

なお、平板部３ｂ上に、さらに線路導体３ａと隣り合って配された第２接地導体１２を備えることが好ましく、線路導体３ａを伝搬する所定周波数の電気信号を平板部３ｂ上面方向に対しても反射させて閉じ込めることができるため、より伝送損失を抑制することができる。   In addition, it is preferable to further include a second ground conductor 12 disposed adjacent to the line conductor 3a on the flat plate portion 3b, and an electric signal having a predetermined frequency propagating through the line conductor 3a is directed to the upper surface direction of the flat plate portion 3b. Can also be reflected and confined, so that transmission loss can be further suppressed.

また、第１接地導体１１乃至第３接地導体１３は、線路導体３ａと同様にＷ，Ｍｏ，Ｍｎ等のメタライズ層を従来周知のスクリーン印刷等によって形成してもよいし、後述するキャスタレーションにより形成してもよい。   In addition, the first ground conductor 11 to the third ground conductor 13 may be formed by forming a metallized layer such as W, Mo, Mn or the like by conventional screen printing or the like as in the case of the line conductor 3a. It may be formed.

さらに、外部回路（不図示）とは、本発明に係る電子装置内部に搭載されるＩＣ等の電子素子５に設けられた接地部位と、他の電子装置に搭載された電子素子、又は電子装置が搭載される基板に設けられた接地部位とを電気的に接続するものである。   Furthermore, an external circuit (not shown) refers to a grounded portion provided in an electronic element 5 such as an IC mounted inside the electronic device according to the present invention and an electronic element or electronic device mounted in another electronic device. Is electrically connected to a grounded portion provided on a substrate on which the is mounted.

以上、本発明において第１シールド部材２１と第１接地導体１１とを備えることにより、線路導体３ａを伝搬する電気信号が１０ＧＨｚを超えるような高周波電気信号の場合にインピーダンス値が増加した場合であっても、外部ノイズが線路導体３ａを伝搬する電気信号に及ぼす影響を第１シールド部材２１で抑制できるとともに、第１シールド部材２１と第１接地導体１１とは電気的に絶縁していることから第１接地導体１１は外部ノイズの影響を受けにくく、安定した接地電位を維持できる。それゆえ、インピーダンス特性の整合性を維持することができる。   As described above, the provision of the first shield member 21 and the first ground conductor 11 in the present invention is a case where the impedance value increases in the case of a high-frequency electrical signal in which the electrical signal propagating through the line conductor 3a exceeds 10 GHz. However, the influence of the external noise on the electric signal propagating through the line conductor 3a can be suppressed by the first shield member 21, and the first shield member 21 and the first ground conductor 11 are electrically insulated. The first ground conductor 11 is less susceptible to external noise and can maintain a stable ground potential. Therefore, the consistency of impedance characteristics can be maintained.

また、第１シールド部材２１と第１接地導体１１との距離は線路導体３ａに伝送される所定周波数の電気信号の波長よりも短いことが好ましく、線路導体３ａを伝搬する周波数に起因した電界が、第１シールド部材２１と線路導体３ａとの間に発生しても、第１接地導体１１と第１シールド部材２１との距離は線路導体３ａを伝搬する周波数の波長よりも短いことから、第１接地導体１１と第１シールド部材２１とで囲まれる空間内で上記電界が共振することを抑制できる。すなわち、第１接地導体１１と第１シールド部材２１とで囲まれる空間内を、線路導体３ａを伝搬する周波数よりも高い周波数で共振するようにしたことから、上記電界の共振によって生じたノイズが線路導体３ａへ加わることを抑制できる。   Further, the distance between the first shield member 21 and the first ground conductor 11 is preferably shorter than the wavelength of the electrical signal having a predetermined frequency transmitted to the line conductor 3a, and the electric field due to the frequency propagating through the line conductor 3a is reduced. Even if it occurs between the first shield member 21 and the line conductor 3a, the distance between the first ground conductor 11 and the first shield member 21 is shorter than the wavelength of the frequency propagating through the line conductor 3a. It is possible to suppress the resonance of the electric field in the space surrounded by the first ground conductor 11 and the first shield member 21. That is, since the space surrounded by the first ground conductor 11 and the first shield member 21 is resonated at a frequency higher than the frequency propagating through the line conductor 3a, noise generated by the resonance of the electric field is generated. It can suppress adding to the line conductor 3a.

（切欠部の形成方法）
ここで、第１シールド部材２１及び第１接地導体１１の形成方法について以下に詳細に説明する。 (Formation method of notch)
Here, a method for forming the first shield member 21 and the first ground conductor 11 will be described in detail below.

図３（ａ）、図３（ｂ）は本発明に係る実施の形態の他の例を示し、切欠部の要部拡大斜視図である。   3 (a) and 3 (b) show another example of the embodiment according to the present invention and are enlarged perspective views of the main part of the notch.

図３（ａ）において、３ｃは立壁部、２１は切欠部に設けられた第１シールド部材、２２は立壁部上面に設けられた第２シールド部材、２３は、立壁部に積層された第３シールド部材である。若しくは、１１は切欠部に設けられた第１接地導体、１２は第２接地導体、１３は立壁部３ｃ、若しくは平板部３ｂに積層された第３接地導体であってもよい。   In FIG. 3A, 3c is a standing wall portion, 21 is a first shield member provided in the notch portion, 22 is a second shield member provided on the top surface of the standing wall portion, and 23 is a third layer laminated on the standing wall portion. It is a shield member. Alternatively, 11 may be a first ground conductor provided in the cutout portion, 12 may be a second ground conductor, and 13 may be a third ground conductor laminated on the standing wall portion 3c or the flat plate portion 3b.

図３（ａ）に示すように、第１シールド部材２１及び第１接地導体１１は、立壁部３ｃのうち線路導体３ａの線路方向と交わる側面に設けられた切欠部に被覆されていることが好ましく、切欠部を形成することにより側面を正面視したときに、第１接地導体１１及び第１シールド部材２１が同一面積である場合であっても、その表面積は切欠部を有していないよりも切欠部を有する方が広く形成できるため、より効果的に電磁遮蔽効果（シールド効果）や、線路導体３ａを伝搬する所定周波数の電気信号の閉じ込め効果を得ることができる。   As shown to Fig.3 (a), the 1st shield member 21 and the 1st grounding conductor 11 are coat | covered by the notch part provided in the side surface which intersects the line direction of the line conductor 3a among the standing wall parts 3c. Preferably, even when the first ground conductor 11 and the first shield member 21 have the same area when the side surface is viewed from the front by forming the notch portion, the surface area thereof does not have the notch portion. Since the one having the cutout portion can be formed more widely, the electromagnetic shielding effect (shielding effect) and the confinement effect of the electric signal having a predetermined frequency propagating through the line conductor 3a can be obtained more effectively.

図３（ｂ）において、３０はビアホール、２１は第１シールド部材、２２は第２シールド部材、２３は第３シールド部材である。   In FIG. 3B, 30 is a via hole, 21 is a first shield member, 22 is a second shield member, and 23 is a third shield member.

図３（ｂ）に示すように、第２シールド部材２２と第１シールド部材２１とは、立壁部内部に設けられたビアホール３０により導通してなることが好ましく、後に電子装置とするために、立壁部３ｃ上に蓋体４をロウ材等で接合する場合においても、立壁部３ｃのうち線路導体３ａの線路方向と交わる側面と上面との間には、誘電体が露出しているため上記側面にロウ材が流れ出しにくく、電子装置製造の面で作業性が向上する。   As shown in FIG.3 (b), it is preferable that the 2nd shield member 22 and the 1st shield member 21 become conductive by the via hole 30 provided in the standing wall part, and in order to make an electronic device later, Even when the lid 4 is joined to the standing wall 3c with a brazing material or the like, the dielectric is exposed between the side surface of the standing wall 3c that intersects the line direction of the line conductor 3a and the upper surface. The brazing material does not easily flow out to the side surface, and workability is improved in terms of manufacturing an electronic device.

また、切欠部の形状は立壁部３ｃを上面視して矩形または扇形であり、複数の切欠部に挟まれた立壁部３ｃのエッジ部は、鈍角であることが好ましく、エッジ部に応力が加わった場合であっても、複数の切欠部に挟まれた立壁部３ｃのエッジ部は鈍角であるため、応力を効果的に分散させてエッジ部に応力集中が生じることを抑制できる。   The shape of the notch is rectangular or fan-shaped when the standing wall 3c is viewed from above, and the edge of the standing wall 3c sandwiched between the plurality of notches is preferably obtuse and stress is applied to the edge. Even in this case, since the edge portion of the standing wall portion 3c sandwiched between the plurality of notches has an obtuse angle, it is possible to effectively disperse the stress and suppress the stress concentration from occurring at the edge portion.

さらに、この切欠部は立壁部３ｃのうち線路導体３ａの線路方向と交わる側面に設けられた第１シールド部材２１及び第１接地導体１１は、キャスタレーションによって形成されてなることが好ましく、第１シールド部材２１及び第１接地導体１１がキャスタレーションによって切欠部に均一な厚みで被覆することができるため、接続端子３に熱が加わった場合であっても、第１シールド部材２１及び第１接地導体１１の厚みが異なる部位において、その熱膨張により接続端子３に局所的に応力が加わることを抑制できる。   Furthermore, it is preferable that the first shield member 21 and the first ground conductor 11 provided on the side surface of the standing wall portion 3c intersecting the line direction of the line conductor 3a are formed by castellation. Since the shield member 21 and the first ground conductor 11 can cover the cutout portion with a uniform thickness by castellation, even when heat is applied to the connection terminal 3, the first shield member 21 and the first ground conductor 11 are covered. In the part where the thickness of the conductor 11 differs, it can suppress that a stress is locally applied to the connection terminal 3 by the thermal expansion.

またさらに、立壁部３ｃのうち線路導体３ａの線路方向と交わる側面を平面視したときに、ビアホール３０は、第１シールド部材２１が形成されていない部位に設けることにより、より一層電磁遮蔽効果（シールド効果）を得ることができるため好ましい。   Furthermore, when the side surface of the standing wall 3c that intersects the line direction of the line conductor 3a is viewed in plan, the via hole 30 is provided in a portion where the first shield member 21 is not formed, thereby further improving the electromagnetic shielding effect ( (Shielding effect) can be obtained, which is preferable.

ここで、キャスタレーションによって、第１シールド部材２１及び第１接地導体１１を形成する手順を図４（ａ）〜（ｃ）に基づいて説明する。   Here, the procedure for forming the first shield member 21 and the first ground conductor 11 by castellation will be described with reference to FIGS.

まず、図４（ａ）に示すように、立壁部３ｃとなるセラミックグリーンシート３０に例えば四角形状の貫通穴３３を金型にて打ち抜き形成する。   First, as shown in FIG. 4A, for example, a rectangular through hole 33 is punched and formed in a ceramic green sheet 30 to be the standing wall 3c with a mold.

次に、図４（ｂ）に示すように、貫通穴３３裏面から貫通穴３３内部を吸引した状態で、セラミックグリーンシート３０表面側からスクリーン印刷等で貫通穴３３内部に導体ペーストを垂れ込ませ、貫通穴３３の内面全体にキャスタレーション導体と成るＷ，Ｍｏ，Ｍｎ等の金属粉末に適当なバインダ，溶剤を混合してなる導体ペースト３３ａを付着させる。   Next, as shown in FIG. 4B, in a state where the inside of the through hole 33 is sucked from the back surface of the through hole 33, the conductor paste is dripped into the through hole 33 by screen printing or the like from the surface side of the ceramic green sheet 30. Then, a conductor paste 33a formed by mixing an appropriate binder and solvent with metal powder such as W, Mo, Mn and the like serving as a castellation conductor is attached to the entire inner surface of the through hole 33.

最後に、図４（ｃ）に示すように、四角形状の貫通穴３３を切断して貫通穴３３を２分割するとともに立壁部３ｃの外形形状となるように金型にて打ち抜き形成してキャスタレーションを形成することができる。   Finally, as shown in FIG. 4C, the through-hole 33 having a rectangular shape is cut to divide the through-hole 33 into two parts, and the caster is formed by punching with a die so as to have the outer shape of the standing wall 3c. Can be formed.

なお、キャスタレーションの形成は立壁部３ｃに限られるものではなく、同様の手法により平板部３ｂに設けてもよい。   The formation of the castellation is not limited to the standing wall portion 3c, but may be provided on the flat plate portion 3b by a similar method.

以上のようにして、形成されたキャスタレーションが形成されたセラミックグリーンシートを、例えば図５に示す分解斜視図ように各部材を積層させることにより、本発明に係る接続端子を形成することができる。なお、図５では図示していないが、立壁部３ｃにおいて、第１接地導体１１はセラミックグリーンシート上に線状に設けられているが、セラミックグリーンシート上の略全面に設けられてもよい。また、立壁部３ｃにおいて、シールド部材はキャスタレーションが形成されたセラミックグリーンシートの下面の略全面に設けられてもよい。   The connection terminals according to the present invention can be formed by laminating the ceramic green sheets formed with the castellations formed as described above, for example, as shown in the exploded perspective view of FIG. . Although not shown in FIG. 5, in the standing wall 3c, the first ground conductor 11 is linearly provided on the ceramic green sheet, but may be provided on substantially the entire surface of the ceramic green sheet. Further, in the standing wall 3c, the shield member may be provided on substantially the entire lower surface of the ceramic green sheet on which the castellation is formed.

＜パッケージ＞
次に、上述した接続端子３を用いたパッケージについて以下に説明する。 <Package>
Next, a package using the connection terminal 3 described above will be described below.

本発明に係るパッケージの一実施形態は、上述した接続端子３と、キャビティを有する基体の壁部２（枠体）の部分にこのキャビティに通じる開口部を有した容器体とを備え、この開口部に接続端子３が接合されてなるものである。   One embodiment of the package according to the present invention includes the connection terminal 3 described above, and a container body having an opening communicating with the cavity in a portion of the wall portion 2 (frame body) of the base body having the cavity. The connection terminal 3 is joined to the part.

このような構成によれば、インピーダンス特性の整合性を維持し、線路導体３ａを伝搬する電気信号を信頼性の高いものにすることができる。   According to such a configuration, the consistency of impedance characteristics can be maintained, and the electrical signal propagating through the line conductor 3a can be made highly reliable.

容器体は、ステンレス鋼（ＳＵＳ），銅（Ｃｕ），銅（Ｃｕ）−タングステン（Ｗ），銅（Ｃｕ）−モリブデン（Ｍｏ），鉄（Ｆｅ）−ニッケル（Ｎｉ）−コバルト（Ｃｏ）合金等の金属から成る。   Container body is stainless steel (SUS), copper (Cu), copper (Cu) -tungsten (W), copper (Cu) -molybdenum (Mo), iron (Fe) -nickel (Ni) -cobalt (Co) alloy Made of metal.

この容器体は、金属のインゴットを圧延加工やプレス加工，切削加工等の金属加工を施すことにより所定形状に一体成形してもよいし、容器体の底部を成す基板１と壁部２（枠体）とを別々に準備し、この基板１の上面に銀（Ａｇ）−銅（Ｃｕ）ロウ等のロウ材を介して壁部２（枠体）を接合してもよい。この場合、壁部２（枠体）と基板１との接合は基板１上面と壁部２（枠体）の下面とを、基板１上面に敷設したプリフォーム状のＡｇ−Ｃｕロウ等のロウ材を介して接合される。   The container body may be integrally formed into a predetermined shape by subjecting a metal ingot to metal processing such as rolling, pressing, or cutting, and the substrate 1 and the wall 2 (frame) forming the bottom of the container body. And the wall 2 (frame) may be joined to the upper surface of the substrate 1 via a brazing material such as silver (Ag) -copper (Cu) brazing. In this case, the wall portion 2 (frame body) and the substrate 1 are joined together by soldering a preform-like Ag—Cu solder or the like in which the upper surface of the substrate 1 and the lower surface of the wall portion 2 (frame body) are laid on the upper surface of the substrate 1. Joined through the material.

壁部２（枠体）には、電子素子５と外部回路とを電気的に接続する接続端子３を挿着するための開口部が形成される。   The wall 2 (frame) is formed with an opening for inserting a connection terminal 3 for electrically connecting the electronic element 5 and an external circuit.

なお、例えば電子素子５として半導体レーザ（ＬＤ），フォトダイオード（ＰＤ）等の電子素子５を収納する場合のパッケ−ジにおいては、壁部２（枠体）の一部に電子素子５と光結合するための光伝送路である光信号入出力窓が形成されている。   For example, in a package in which an electronic element 5 such as a semiconductor laser (LD) or a photodiode (PD) is accommodated as the electronic element 5, the electronic element 5 and the optical element 5 are part of the wall 2 (frame body). An optical signal input / output window, which is an optical transmission path for coupling, is formed.

また、容器体は、その表面に耐蝕性に優れかつロウ材との濡れ性に優れる金属、具体的には厚さ０．５〜９μｍのＮｉ層と、厚さ０．５〜５μｍの金（Ａｕ）層とを順次メッキ法により被着させておくのがよく、容器体が酸化腐食するのを有効に防止できるとともに、容器体上面に電子素子５を強固に接着固定することができる。   Further, the container body has a metal having excellent corrosion resistance and wettability with the brazing material on its surface, specifically, a Ni layer having a thickness of 0.5 to 9 μm and a gold ( The Au) layer is preferably sequentially deposited by a plating method, and the container body can be effectively prevented from being oxidized and corroded, and the electronic element 5 can be firmly bonded and fixed to the upper surface of the container body.

＜電子装置＞
最後に、上述したパッケージを用いた電子装置について以下に説明する。 <Electronic device>
Finally, an electronic device using the above-described package will be described below.

本発明に係るパッケージは、上述したパッケージと、キャビティ内部に搭載された電子素子５と、壁部２（枠体）上面に接合された蓋体４と、を具備してなるものである。   The package according to the present invention includes the above-described package, the electronic element 5 mounted inside the cavity, and the lid body 4 joined to the upper surface of the wall 2 (frame body).

このような構成によれば、インピーダンス特性の整合性を維持し、線路導体３ａを伝搬する電気信号が信頼性の高いものとすることができる。また、当該電子装置の周囲に他の電子装置が載置されている場合であっても、パッケージ内部の電子素子が発生する電界は、第１シールド部材及び第１接地導体で吸収されるため、他の電子装置に悪影響を与えることを抑制することができる。   According to such a configuration, the consistency of impedance characteristics can be maintained, and the electrical signal propagating through the line conductor 3a can be made highly reliable. Further, even when another electronic device is placed around the electronic device, the electric field generated by the electronic element inside the package is absorbed by the first shield member and the first ground conductor. It is possible to suppress adverse effects on other electronic devices.

＜他の実施形態＞
以下、本発明に係る他の実施形態について説明する。 <Other embodiments>
Hereinafter, other embodiments according to the present invention will be described.

例えば、図６（ａ）に示すように、基板１と、誘電体からなるとともに、基板１の周囲を囲うようにして接合された平板部３ｂと、誘電体からなるとともに、平板部３ｂ上に所定周波数の電気信号が伝送される線路導体３ａを介して接合された立壁部３ｃと、を有する枠体２と、を備え、枠体２は、立壁部３ｃに設けられた第１シールド部材２１と、第１シールド部材２１と電気的に絶縁されるとともに、外部回路と電気的に接続され、且つ、第１シールド部材２１と線路導体３ａとの間に配された第１接地導体１１とを有するパッケージとしてもよい。   For example, as shown in FIG. 6A, a flat plate portion 3b composed of a substrate 1 and a dielectric and joined so as to surround the periphery of the substrate 1, and a dielectric, and on the flat plate portion 3b. A frame body 2 having a standing wall portion 3c joined via a line conductor 3a through which an electrical signal of a predetermined frequency is transmitted. The frame body 2 is a first shield member 21 provided on the standing wall portion 3c. And a first grounding conductor 11 that is electrically insulated from the first shield member 21 and electrically connected to an external circuit and disposed between the first shield member 21 and the line conductor 3a. It is good also as a package which has.

このような構成によれば、基板１の周囲に平板部３ｂが位置するため、基板１と平板部３ｂとの位置合わせが容易になる。また、上述したように、インピーダンス特性の整合性を維持し、線路導体３ａを伝搬する電気信号を信頼性の高いものにすることができる。   According to such a configuration, since the flat plate portion 3b is positioned around the substrate 1, alignment between the substrate 1 and the flat plate portion 3b is facilitated. Further, as described above, it is possible to maintain the consistency of the impedance characteristics and make the electrical signal propagating through the line conductor 3a highly reliable.

また、図６（ｂ）に示すように、基板１と、誘電体からなるとともに、基板１上面の周囲を囲うようにして接合された平板部３ｂと、誘電体からなるとともに、平板部３ｂ上に所定周波数の電気信号が伝送される線路導体３ａを介して接合された立壁部３ｃと、を有する枠体２と、を備え、枠体２は、立壁部３ｃに設けられた第１シールド部材２１と、
第１シールド部材２１と線路導体３ａとの間に配されるとともに、第１シールド部材２１と電気的に絶縁され、外部回路と電気的に接続するための第１接地導体１１とを有するパッケージとしてもよい。 Further, as shown in FIG. 6B, a flat plate portion 3b made of a substrate 1 and a dielectric, and joined so as to surround the periphery of the upper surface of the substrate 1, and a dielectric, and on the flat plate portion 3b. And a frame body 2 having a standing wall portion 3c joined via a line conductor 3a to which an electrical signal having a predetermined frequency is transmitted. The frame body 2 is a first shield member provided on the standing wall portion 3c. 21 and
As a package that is disposed between the first shield member 21 and the line conductor 3a and that is electrically insulated from the first shield member 21 and has a first ground conductor 11 for electrical connection with an external circuit. Also good.

このような構成によれば、基板１上の周囲に平板部３ｂを位置合わせすることができるため、基板１と平板部３ｂとの位置合わせが容易になる。また、上述したように、インピーダンス特性の整合性を維持し、線路導体３ａを伝搬する電気信号を信頼性の高いものにすることができる。   According to such a configuration, since the flat plate portion 3b can be aligned around the substrate 1, the alignment between the substrate 1 and the flat plate portion 3b is facilitated. Further, as described above, it is possible to maintain the consistency of the impedance characteristics and make the electrical signal propagating through the line conductor 3a highly reliable.

さらに、図６（ｃ）に示すように、誘電体からなる基板１と、誘電体からなるとともに、基板１上面の周囲を囲うように設けられ、且つ所定周波数の電気信号が伝送される線路導体３ａを介して接合された枠体２と、を備え、枠体２は、その表面に設けられた第１シールド部材２１と、第１シールド部材２１と線路導体３ａとの間に配されるとともに、第１シールド部材２１と電気的に絶縁され、外部回路と電気的に接続するための第１接地導体１１とを有するパッケージとしてもよい。   Further, as shown in FIG. 6C, a substrate 1 made of a dielectric, and a line conductor made of a dielectric and provided so as to surround the periphery of the upper surface of the substrate 1, and an electric signal having a predetermined frequency is transmitted. A frame 2 joined via 3a, and the frame 2 is disposed between the first shield member 21 provided on the surface thereof, the first shield member 21 and the line conductor 3a. The first shield member 21 may be a package having the first ground conductor 11 that is electrically insulated from the first shield member 21 and electrically connected to an external circuit.

このような構成によれば、上述した基板１を別途用意しなくとも、パッケージを構成することができるため、製造コストを下げることができる。また、上述したように、インピーダンス特性の整合性を維持し、線路導体３ａを伝搬する電気信号を信頼性の高いものにすることができる。   According to such a configuration, since the package can be configured without separately preparing the substrate 1 described above, the manufacturing cost can be reduced. Further, as described above, it is possible to maintain the consistency of the impedance characteristics and make the electrical signal propagating through the line conductor 3a highly reliable.

以上のような、本発明の他の実施形態に係るパッケージを用いることにより、電子装置を構成することができる。すなわち、本発明の他の実施形態に係るパッケージと、基板１上であって枠体２で囲まれた領域に載置された電子素子５と、枠体２上面に接合された蓋体４と、を具備してなるものである。   By using the package according to another embodiment of the present invention as described above, an electronic device can be configured. That is, a package according to another embodiment of the present invention, an electronic element 5 placed on a region of the substrate 1 surrounded by the frame 2, and a lid 4 joined to the upper surface of the frame 2 Are provided.

このような構成によれば、インピーダンス特性の整合性を維持し、線路導体３ａを伝搬する電気信号が信頼性の高いものとすることができる。さらに、当該パッケージ周囲に他の電子装置が載置している場合であっても、パッケージ内部の電子素子５が発生する電界は、第１シールド部材２１及び第１接地導体１１で吸収されるため、他の電子装置に悪影響を与えることを抑制することができる。   According to such a configuration, the consistency of impedance characteristics can be maintained, and the electrical signal propagating through the line conductor 3a can be made highly reliable. Furthermore, even when another electronic device is placed around the package, the electric field generated by the electronic element 5 inside the package is absorbed by the first shield member 21 and the first ground conductor 11. It is possible to suppress adverse effects on other electronic devices.

なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等支障ない。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

（ａ）、（ｂ）は本発明に係る実施の形態の一例を示す斜視図である。(A), (b) is a perspective view which shows an example of embodiment which concerns on this invention. 図１（ａ）、図１（ｂ）のＸ−Ｘ’線における断面図である。It is sectional drawing in the X-X 'line | wire of Fig.1 (a) and FIG.1 (b). （ａ）は本発明の一実施形態を示す要部拡大斜視図であり、（ｂ）は本発明の他の実施の形態を示す要部拡大斜視図である。(A) is a principal part expansion perspective view which shows one Embodiment of this invention, (b) is a principal part expansion perspective view which shows other embodiment of this invention. 本発明の接続端子に係る製造工程を示し、（ａ）〜（ｃ）は立壁部となるセラミックグリーンシートの平面図である。The manufacturing process which concerns on the connection terminal of this invention is shown, (a)-(c) is a top view of the ceramic green sheet used as a standing wall part. 本発明の接続端子に係る積層順序を示す分解斜視図である。It is a disassembled perspective view which shows the lamination | stacking order which concerns on the connection terminal of this invention. （ａ）〜（ｃ）は本発明のパッケージに係る他の実施形態を示す図である。(A)-(c) is a figure which shows other embodiment which concerns on the package of this invention. 従来の電子装置の例を示す図である。It is a figure which shows the example of the conventional electronic device.

符号の説明Explanation of symbols

１：基板
１ａ：載置部
２：壁部（枠体）
３：接続端子
３ａ：線路導体
３ｂ：平板部
３ｃ：立壁部
４：蓋体
５：電子素子
６：電気的接続手段
７：基台
１１：第１接地導体
１２：第２接地導体
１３：第３接地導体
２１：第１シールド部材
２２：第２シールド部材
２３：第３シールド部材
３０：ビアホール
１００：シールリング
３００：シールド用部材 1: Substrate 1a: Placement part 2: Wall part (frame body)
3: Connection terminal 3a: Line conductor 3b: Flat plate portion 3c: Standing wall portion 4: Cover body 5: Electronic element 6: Electrical connection means 7: Base 11: First ground conductor 12: Second ground conductor 13: Third Ground conductor 21: First shield member 22: Second shield member 23: Third shield member 30: Via hole 100: Seal ring 300: Shield member

Claims (12)

誘電体からなる平板部と、
誘電体からなるとともに、該平板部上に所定周波数の電気信号が伝送される線路導体を介して接合された立壁部と、
前記立壁部に設けられた第１シールド部材と、
前記第１シールド部材と前記線路導体との間に配されるとともに、前記第１シールド部材と電気的に絶縁され、外部回路と電気的に接続するための第１接地導体と、
を具備してなる接続端子。 A flat plate portion made of a dielectric;
A standing wall portion made of a dielectric material and joined to the flat plate portion via a line conductor that transmits an electric signal of a predetermined frequency;
A first shield member provided on the standing wall;
A first grounding conductor disposed between the first shield member and the line conductor, electrically insulated from the first shield member, and electrically connected to an external circuit;
A connection terminal comprising: 前記第１シールド部材と前記第１接地導体との距離は前記周波数の波長よりも短いことを特徴とする請求項１に記載の接続端子。 The connection terminal according to claim 1, wherein a distance between the first shield member and the first ground conductor is shorter than a wavelength of the frequency. 前記第１接地導体は、前記立壁部の誘電体を介して前記線路導体と対向する部位に積層されていることを特徴とする請求項１又は請求項２に記載の接続端子。 3. The connection terminal according to claim 1, wherein the first ground conductor is laminated on a portion facing the line conductor via a dielectric of the standing wall portion. 前記第１接地導体は、前記立壁部の前記線路導体を横切る壁面に設けられていることを特徴とする請求項１乃至請求項３のいずれかに記載の接続端子。 Said first ground conductor, a connection terminal according to any one of claims 1 to 3, characterized in that provided in the wall surface crossing the line conductors of the vertical wall portion. 前記第１シールド部材は、前記立壁部の前記線路導体を横切る壁面に設けられていることを特徴とする請求項１乃至請求項４のいずれかに記載の接続端子。 Wherein the first shield member, a connection terminal according to any one of claims 1 to 4, characterized in that provided in the wall surface transverse to the front SL line conductor of the vertical wall portion. 前記第１接地導体及び前記第１シールド部材は、前記壁面に設けられた切欠部に被覆されたキャスタレーションによって形成されていることを特徴とする請求項４又は請求項５に記載の接続端子。 It said first ground conductor and said first shield member, a connection terminal according to claim 4 or claim 5, characterized in that it is formed by castellations coated on the notch portion provided in the wall surface . 前記平板部上に、前記線路導体と隣り合って配された第２接地導体を備えたことを特徴とする請求項１乃至請求項６のいずれかに記載の接続端子。 On said plate, the connection terminal according to any one of claims 1 to 6, characterized in that a second ground conductor disposed adjacent to the line conductor. 前記立壁部の上面に第２シールド部材が設けられていることを特徴とする請求項１乃至請求項７のいずれかに記載の接続端子。 Connection terminal according to any one of claims 1 to 7, characterized in that the second shielding member is provided on the upper surface of the vertical wall portion. 前記第２シールド部材と前記第１シールド部材とは、前記立壁部内部に設けられたビアホールにより導通してなることを特徴とする請求項８に記載の接続端子。 The connection terminal according to claim 8 , wherein the second shield member and the first shield member are electrically connected by a via hole provided in the standing wall portion. 前記立壁部の誘電体はセラミックスであることを特徴とする請求項１乃至請求項９のいずれかに記載の接続端子。 Connection terminal according to any one of claims 1 to 9, wherein the dielectric of the vertical wall portion is ceramic. 上面にキャビティの開口を有するとともに、壁部に前記キャビティに通じる開口部を有した容器体と、
前記開口部に、前記線路導体が前記壁部の内外を電気的に導通するように接合された請求項１乃至請求項１０のいずれかに記載された接続端子と
を備えたパッケージ。 A container body having an opening of the cavity on the upper surface and an opening leading to the cavity on the wall;
The connection terminal according to any one of claims 1 to 10, wherein the line conductor is joined to the opening so as to be electrically connected to the inside and outside of the wall.
Package with. 請求項１１に記載のパッケージと、
前記キャビティ内部に搭載された電子素子と、
前記キャビティの前記開口を塞ぐように前記容器体に接合された蓋体と、
を具備してなる電子装置。
A package according to claim 11 ;
An electronic element mounted inside the cavity;
A lid joined to the container so as to close the opening of the cavity ;
An electronic device comprising:
JP2007169903A 2007-06-28 2007-06-28 Connection terminal, package using the same, and electronic device Expired - Fee Related JP4874177B2 (en)

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CA2993930C (en) * 2015-07-28 2020-07-07 Nippon Telegraph And Telephone Corporation Optical module
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JP2004349568A (en) * 2003-02-17 2004-12-09 Kyocera Corp Input/output terminal and package for housing semiconductor element, and semiconductor device
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