JP6491042B2 - Optical device substrate, optical device package, optical device and projector - Google Patents

Description

  The present invention relates to an optical device base on which an optical element such as a mirror device is mounted, an optical device package including the optical base, an optical device including the optical device base, and a projector including the optical device. Is.

  2. Description of the Related Art Conventionally, an optical element storage package (hereinafter also referred to as a package) for storing optical elements in an airtight manner is made of ceramics such as an aluminum oxide sintered body, and has a recess on the top surface. There has been an insulating base having an optical element mounting portion and a glass plate mounted on the upper surface of the insulating base.

  However, the function of the optical element may be lowered by high-temperature heating when the glass plate and the insulating substrate are joined by brazing or the like.

  Therefore, an optical device base having an insulating base and a joining metal frame joined to the upper surface of the insulating base is prepared, and a glass plate and a metal frame joined to the lower surface of the glass plate are provided. The lid was prepared, and the package was formed by seam welding the metal frame for joining the optical device substrate and the metal frame of the lid (see Patent Document 1).

  According to such package formation by seam welding, compared with the conventional reflow process at the time of brazing, since the joint is only heated locally, it is possible to prevent functional degradation of the optical element.

JP 2005-203669 A

  However, in the package of Patent Document 1, since the glass plate is disposed on the upper surface of the insulating base via the metal frame and the joining metal frame, the optical element and the glass disposed on the upper surface of the insulating base are disposed. The distance to the board was likely to increase. Therefore, the reflection angle of the optical element tends to be small. Therefore, the distance between the incident light on the optical element and the reflected light is easy to approach. Therefore, when the conventional package is used for a device such as a projector, the position of the light source and the lens may overlap.

  The present invention has been made in view of the above problems, and its purpose is to increase the reflection angle of an optical element so that the position of a light source and a lens overlap when used in a device such as a projector. It is an object to provide a substrate for an optical device, an optical device, and a projector that can be prevented.

An optical device package according to one aspect of the present invention has an optical element mounting portion on an upper surface.
An edge base, and a joining metal frame that is joined to the lower surface of the insulating base and has an outer peripheral portion protruding outward from the insulating base, the upper surface of the outer peripheral portion being a lid mounting region a substrate for an optical device having a includes a glass member bonded to the frame member and the frame member, the frame-like member has been closed and a lid provided on the lid mounting region, The frame-shaped member has a square frame shape, and the upper surface of the frame-shaped member is inclined so that the frame-shaped member faces each other from one side to the other of the pair of sides facing each other. while other toward from the pair of sides, the upper surface of the frame-like member it is further inclined.

An optical device according to an aspect of the present invention includes the optical device package, in which the lid is provided in the lid mounting region of the joining metal frame, and the optical element mounting portion of the insulating base. And an optical element provided.

  A projector according to an aspect of the present invention includes the above-described optical device, a control circuit that controls driving of the optical element of the optical device, a light source that is applied to the optical element, and light reflected by the optical element. Through which the lens is transmitted.

According to the optical device package of the present invention, the outer peripheral portion of the bonding metal frame projects outward from the insulating base, and the upper surface of the outer peripheral portion has a lid mounting region. Drunk, the junction of the junction metal frame, and bonding metal frame and lid may be positioned at the lower surface side of the insulating substrate. Therefore, the distance from the upper surface of the insulating base to the glass member tends to be small. Therefore, when the optical element is disposed on the upper surface of the insulating substrate, the distance from the optical element to the glass member is also reduced, and the reflection angle of the optical element is likely to be increased. Therefore, it becomes easy to increase the distance between the incident light to the optical element and the reflected light. Therefore, when this base is used in a device such as a projector, the positions of the light source and the lens can be prevented from overlapping. In addition, since the upper surface of the optical element and the glass member are not parallel to each other, the reflected light that is generated between the lower surface of the glass member and the upper surface of the optical element is reflected repeatedly (resonance phenomenon). ) Is less likely to occur. Therefore, when an optical device in which a light emitting element is accommodated as an optical element in this optical device package is used for a projector, a ghost is less likely to occur at the edge portion of the image. Accordingly, the quality of the video is further improved.

According to the optical device of the present invention, since it has a package above optical device, can increase the reflection angle of the optical element, that resonance phenomena is hardly generated between the upper surface of the lower surface and the optical element of glass member Therefore, when this device is used in equipment such as a projector, the position of the light source and the lens can be prevented from overlapping, and ghosts are less likely to occur at the edge of the image, further improving the image quality. .

Projector according to one aspect of the present invention has the above optical device, can increase the reflection angle of the optical element, a resonance phenomenon between the upper surface of the lower surface and the optical element of glass member hardly occurs Runode, position of the light source and the lens that can be prevented overlapping, because the ghost at the edge of the image becomes further unlikely to occur, further improve the quality of the video.

(A) is a top view of the optical device substrate in the embodiment of the present invention, (b) is a longitudinal sectional view taken along line AA of the optical device substrate shown in (a), and (c) is shown in (a). It is a bottom view of the base for optical devices. (A) is a top view of the optical apparatus which has a base | substrate for optical apparatuses shown in FIG. 1, (b) is a longitudinal cross-sectional view in AA of the optical apparatus shown to (a). FIG. 3 is an enlarged view of a portion indicated by reference numeral B in the optical device shown in FIG. 2. It is a perspective view which shows the package for optical devices in embodiment of this invention. It is a longitudinal cross-sectional view which shows the structure by which the optical apparatus in embodiment of this invention is mounted in a wiring board. It is an enlarged view which shows the modification of FIG. It is a perspective view which shows the modification of FIG. It is a perspective view which shows the other modification of FIG.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones. For convenience of explanation, an orthogonal coordinate system xyz is defined, and the word “upper surface (front surface)” or “lower surface” is used with the positive side in the z direction as the upper side.

  In the description of the embodiments and the like, the same or similar configurations as those already described may be denoted by the same reference numerals and description thereof may be omitted.

  An optical device substrate according to an embodiment of the present invention will be described below with reference to FIGS.

  As shown in FIG. 1, an optical device substrate 1 according to Embodiment 1 of the present invention is bonded to an insulating substrate 11 having an optical element mounting portion on the upper surface and a lower surface of the insulating substrate 11, and an outer peripheral portion is formed. A bonding metal frame 12 protruding outward from the insulating base 11, and the upper surface of the outer peripheral portion has a lid mounting region 12a.

  The insulating base 11 has an optical element mounting portion on the upper surface. The insulating base 11 is made of, for example, a ceramic material. For example, when the insulating base 11 is made of a ceramic material, it is integrally formed by firing. As shown in FIG. 1, the optical element 2 is mounted on the optical element mounting portion on the upper surface and mounted on the insulating base 11 using a wire bonding method.

  In the example shown in FIG. 1, wiring conductors (not shown in FIGS. 1A and 1B) are provided on the upper surface, the lower surface, or the inside of the insulating base 11. The wiring conductor provided on the upper surface of the insulating base 11 is used for connection with a bonding wire of the optical element 2 mounted on the upper surface.

  As shown in FIG. 1C, the wiring conductors provided on the lower surface of the insulating base 11 are provided in a grid pattern on the inner peripheral side of the bonding metal frame 12. The wiring conductor on the lower surface is used as a connection terminal with an external wiring board (see FIG. 5).

  The wiring conductor provided in the insulating base 11 serves to connect the wiring conductors provided on the upper and lower surfaces of the insulating base 11 described above.

  Further, as in the example shown in FIG. 3, a bonding metallization layer 13 is provided on the lower surface of the insulating substrate 11. As will be described later, the joining metal frame 12 is joined to the joining metallized layer 13 via the brazing filler metal 14.

When the insulating substrate 11 is made of, for example, a ceramic material, an example thereof is an aluminum oxide (alumina: Al ₂ O ₃ ) sintered body or an aluminum nitride (AlN) sintered body. On the insulating substrate 11, the above-described wiring conductor, bonding metallization layer 13, and the like are formed.

As in the example shown in FIG. 1, the bonding metal frame 12 is bonded to the lower surface of the insulating base 11, and the outer peripheral portion protrudes outward from the insulating base 11. The upper surface of the outer peripheral portion has a lid mounting area 12a. With this configuration, when the lid 3 is disposed in the lid mounting region 12a, the joining metal frame 12 and the joining portion between the joining metal frame 12 and the lid 3 are located on the lower surface side of the insulating base 11. Will be. Therefore, the distance from the upper surface of the insulating base 11 to the glass member 33 tends to be small. Therefore, when the optical element 2 is disposed on the upper surface of the insulating base 11, the distance from the optical element 2 to the glass member 33 is also reduced, so that the optical element 2 is incident on the optical element 2 at an incident angle θ as in the example shown in FIG. Even if the reflection angle θ of light increases, the reflected light of the mirror area of the optical element 2 can be transmitted through the glass member 33 and displayed. Therefore, it becomes easy to increase the distance between the incident light to the optical element 2 and the reflected light. Therefore, when this base is used in a device such as a projector, the positions of the light source and the lens can be prevented from overlapping. In addition, it is preferable to increase the reflection angle because the degree of freedom in designing the size and position of the light source can be increased.

  Further, when the same reflection angle is sufficient, a smaller glass plate can be obtained, and the apparatus can be downsized.

  In the example shown in FIG. 1, the shape of the bonding metal frame 12 is a frame shape having a through hole at the center thereof. In addition, the upper surface of the inner peripheral portion of the bonding metal frame 12 is bonded to the outer peripheral portion of the lower surface of the insulating base 11. In the bonding metal frame 12, the outer peripheral portion that is outside the bonded portion with the insulating base 11 is located outward from the insulating base 11. A lid mounting area 12a is provided on the upper surface of the outer peripheral portion.

  Next, the manufacturing method of the base | substrate 1 for optical devices of this invention which concerns on embodiment shown in FIG. 1 is shown below.

First, if the insulating substrate 11 is made of, for example, an aluminum oxide sintered body, a raw material powder of alumina (Al ₂ O ₃ ) and silica (SiO ₂ ), calcia (CaO), magnesia (MgO), or the like. A suitable organic solvent and solvent are added and mixed to form a slurry, which is then formed into a sheet using a well-known doctor blade method or calendar roll method to obtain a ceramic green sheet (hereinafter also referred to as a green sheet). .

  Next, a conductor paste layer to be a wiring conductor and a bonding metallization layer 13 is formed to a thickness of about 10 (μm) to 20 (μm) at a predetermined position of the green sheet using a screen printing method or the like. The bonding metallized layer 13 is provided on the outer peripheral portion of the lower surface of the insulating substrate 11.

  The conductive paste is produced by kneading a metal powder having a high melting point such as tungsten (W), molybdenum (Mo), or molybdenum-manganese (Mo-Mn) alloy with an appropriate resin binder and solvent.

  Next, these green sheets are superposed and pressure-bonded to produce a laminate, and the laminate is fired at a high temperature of about 1600 (° C.) to produce the insulating substrate 11. Also, a large number of mother substrates may be manufactured.

  Next, in the insulating base 11 described above, a plating layer is provided on the bonding metallization layer 13 as necessary. Moreover, you may provide the same plating layer in the wiring conductor provided in the upper surface and lower surface of the insulation base | substrate 11. FIG. Note that the plating layer is formed of a metal material such as nickel, for example. The mother board is provided with a brazing material 14 using, for example, a silver-copper eutectic alloy in a predetermined shape on the joining metallized layer 13 using an assembly jig.

  And the metal frame 12 for joining is arrange | positioned on the solder | brazing | wax material 14 of a silver copper eutectic alloy. Further, the joining metal frame 12 is produced, for example, by forming a FeNi29Co17 alloy into a predetermined shape using a known press working method or the like. The joining metal frame 12 is used for seam weld joining to a metal frame 31 described later.

By maintaining the temperature exceeding the melting point of the brazing material 14 in a reducing atmosphere, the joining metallized layer 13 on the insulating substrate 11 and the joining metal frame 12 are joined via the brazing material 14. If necessary, a nickel plating layer or a gold plating layer is formed on the bonding metal frame 12 or the like by using a plating method to form the optical device substrate 1. The formation of the plating layer on the bonding metal frame 12 may be performed in the same process as the formation of the plating layer on the wiring conductor of the insulating substrate 11.

  When the insulating substrate 11 is made of an aluminum oxide sintered body, the insulating substrate 11 has high mechanical strength, so that warpage or the like hardly occurs and has an appropriate thermal conductivity. It becomes easy to dissipate the heat generated by 2 to the outside. Thus, when the insulating substrate 11 is an aluminum oxide sintered body, it is preferable in terms of mechanical strength, thermal conductivity, or cost.

  Further, for example, when an optical device having the optical device base 1 of the present invention is mounted on a wiring board, the lower surface of the bonding metal frame 12 is placed on the upper surface of the wiring substrate via a brazing material (not shown). By joining, the heat dissipation through the joining metal frame 12 can be improved.

  Next, an optical device package and an optical device according to an embodiment of the present invention will be described below with reference to FIGS. An optical device package 4 is formed by the optical device substrate 1 and the lid 3 of the above embodiment, and the optical element 2 is accommodated in the optical device package 4 to form the optical device 20.

  As in the example shown in FIG. 2, the optical device 20 includes the optical device base 1, the optical element 2 provided in the optical element mounting portion of the insulating base 11, and the lid mounting of the bonding metal frame 12. And a lid 3 provided in the region 12a.

  The optical element 2 is, for example, a mirror device. For example, the optical element 2 reflects light incident on the mirror device to project an image or the like on a screen. The optical element 2 may be a light emitting element such as a light emitting diode.

  As in the example shown in FIG. 2, the lid 3 is provided in the lid mounting region 12 a of the joining metal frame 12. In the example shown in FIG. 2, the lid 3 includes a frame-shaped member 32 and a glass member 33 bonded to the frame-shaped member 32.

  In the example shown in FIG. 3, the frame-shaped member 32 further includes a metal frame 31 bonded to the lower surface thereof with a bonding material 35. The lower surface of the metal frame 31 is joined to the lid mounting region 12a of the joining metal frame 12 by seam welding.

  An optical device package 4 for sealing the optical element 2 as shown in FIG. 4 is constituted by the optical device substrate 1 and the lid 3 having the above-described configuration.

  The lid 3 includes a frame member 32 and a glass member 33 joined to the frame member 32. The frame-shaped member 32 is provided on the lid mounting area 12a. The frame-shaped member 32 is provided as described above, for example, by bonding the lower surface thereof to the lid mounting region 12a, which is a part of the upper surface of the bonding metal frame 12, via the bonding material 35. The optical element 2 is sealed in a space (container) between the optical device substrate 1 and the lid 3 bonded to the optical device substrate 1.

According to the optical device package 4 as described above, since the optical device substrate 1 having the above-described configuration is provided, the bonding metal frame 12 and the bonding portion between the bonding metal frame 12 and the lid 3 are the insulating substrate 11. Therefore, the distance from the upper surface of the insulating base 11 to the glass member 33 tends to be small. Accordingly, the distance from the sealed optical element 2 to the glass member 33 is also reduced, and the distance between the incident light and the reflected light on the optical element 2 can be easily separated. For this reason, when the optical element 2 is accommodated in the optical device package 4, the positions of the light source and the lens are suppressed from overlapping. In addition, it is preferable to increase the reflection angle because the degree of freedom in designing the size and position of the light source can be increased. In addition, when the same reflection angle is sufficient, a smaller glass plate can be used, so that it is possible to provide an optical device package 4 that is advantageous in producing a smaller optical device.

  Note that the optical device package 4 in the example of the present embodiment further includes the metal frame 31 bonded to the lower surface of the frame-shaped member 32 as described above.

  The metal frame 31 has a rectangular shape in plan view, and a first through hole penetrating in the thickness direction is provided in the center portion. Further, the first through hole has, for example, a rectangular shape. The shape of the metal frame 31 is a shape that overlaps the outer periphery of the frame-shaped member 32. The first through hole has a larger outer shape than the insulating substrate 11. Therefore, the metal frame 31 surrounds the insulating base 11 in a top view.

  The metal frame 31 has a side length of, for example, 15 (mm) to 40 (mm), and the first through hole of the metal frame 31 has a side length of, for example, 10 (mm). ) To 30 (mm).

  The metal frame 31 preferably has a thermal expansion coefficient similar to that of the frame-shaped member 32, the glass member 33, and the insulating substrate 11 bonded to the upper surface thereof. The insulating substrate 11 is preferably made of a ceramic material such as an aluminum nitride sintered body or an alumina sintered body because of its excellent thermal conductivity and heat dissipation. Therefore, the metal frame 31 is made of an aluminum nitride sintered body. Or what has a thermal expansion coefficient similar to the thermal expansion coefficient of an alumina sintered compact is preferable.

For example, the metal frame 31 is preferably made of 42 alloy or FeNi29Co17 alloy. 42 alloy (coefficient of thermal expansion of about 5.0 (× 10 ⁻⁶ / ° C.)) or FeNi29Co17 alloy (coefficient of thermal expansion of about 4.8 (× 10 ⁻⁶ / ° C.)) is the thermal expansion of the aluminum nitride sintered body. Coefficient (linear thermal expansion coefficient is about 4.6 (× 10 ⁻⁶ / ° C.)) or the thermal expansion coefficient of alumina sintered body (linear thermal expansion coefficient is about 7.2 (× 10 ⁻⁶ / ° C.)) This is because they have similar thermal expansion coefficients.

  Moreover, the metal frame 31 can form a 1st through-hole in a center part using the conventionally well-known etching method or press work method.

  As shown in FIG. 1, the frame-shaped member 32 is surrounded by four side walls, has a second through hole, and has a rectangular shape in plan view. The frame member 32 is made of a material having higher rigidity than the glass member 33, for example, the same ceramic material as that of the insulating base 11. The frame-like member 32 has a side length of, for example, 8 (mm) to 27 (mm) in plan view. In the example shown in FIG. 1, the size of the second through hole is the same as that of the first through hole.

The frame-shaped member 32 is made of, for example, aluminum oxide (alumina: Al ₂ O ₃ , alumina Young's modulus: 370 (Gpa)) sintered body or aluminum nitride (AlN, aluminum nitride Young's modulus: 320 (Gpa)). A sintered body or the like, and thus the glass member 33 (D2
If a material with rigidity higher than that of 63 glass (Young's modulus: 72 (Gpa)) is used, the glass member 3
This is preferable because the stress applied to 3 can be reduced.

  Further, the frame-like member 32 may be formed with the second through-holes by stacking and stacking green sheets and punching them in the same manner as the optical device substrate 1. Then, it can be set as the frame-shaped member 32 which consists of ceramic materials by baking similarly to the base | substrate 1 for optical apparatuses.

  In the frame-shaped member 32, the lower surface of the side wall is joined to the upper surface of the metal frame 31. The glass member 33 has a rectangular parallelepiped shape (plate shape), and is provided on the upper surface of the side wall of the frame-shaped member 32 via the glass bonding material 34 so as to close the second through hole, as shown in FIG.

The lid 3 (glass member 33, frame member 32, and metal frame 31) and the insulating base 11 are preferably made of materials having similar thermal expansion coefficients. Further, the glass member 33 has a thermal expansion coefficient of, for example, 4 (× 10 ⁻⁶ / ° C.) in order to reduce the possibility of birefringence or breakage and to improve the reliability of the temperature cycle and the like. It is preferable to use a glass material having about ˜8 (× 10 ⁻⁶ / ° C.).

The glass member 33 is, for example, BK7 (manufactured by HOYA, linear thermal expansion coefficient is approximately 7.5 (× 10 ⁻⁶ / ° C.)) or D263 (manufactured by Schott, linear thermal expansion coefficient is approximately 7.2 (× 10 Using a glass material such as ⁻⁶ / ° C.), a conventionally known dicing method or laser cutting method can be used to form a rectangular shape.

  In addition, the glass member 33 has a shape in which chamfering of each cuboid ridge line is not performed in the figure, but by chamfering each cuboid ridge line on the C surface or the R surface, for example, When the glass member 33 is formed into a predetermined shape by processing the glass member 33, it is possible to reduce cracks from microcracks.

  Next, a structure in which the optical device according to the embodiment of the present invention is mounted on an external wiring board will be described with reference to FIG.

  In the example shown in FIG. 5, the above-described wiring conductor (not shown) on the lower surface of the insulating base 11 is mounted on an electrode (not shown) on the external wiring board 15. The lower surface of the bonding metal frame 12 is also bonded to the wiring board 15. The wiring conductor on the lower surface and the bonding metal frame 12 are bonded onto the wiring board 15 by a bonding material 16 made of a brazing material or the like.

  In the example shown in FIG. 5, the region exposed from the through hole of the bonding metal frame 12 on the lower surface of the insulating base 11 is lower than the region bonded to the bonding metal frame 12. Protruding portions are formed. By providing the wiring conductor on the lower surface of such a convex portion, the wiring conductor can be easily connected to the electrode on the wiring board 15 side.

  Further, when this optical apparatus is used in a device such as a projector, a processor, a memory element, or the like may be mounted on the wiring board 15.

  Further, the projector according to the present invention is reflected by the optical element, the control circuit for controlling the driving of the optical element 2 of the optical apparatus, the light source irradiated to the optical element 2, and the optical element 2. A lens that transmits light. Therefore, since the reflection angle of the optical element 2 can be increased, it is possible to prevent the positions of the light source and the lens from overlapping. Further, even when it is desired to secure the same distance between the incident light and the reflected light on the optical element 2, the position of the light source is brought closer to the optical element 2 by increasing the reflection angle of the optical element 2. Therefore, a small projector can be provided.

  Here, a method for manufacturing an optical device according to an embodiment of the present invention, such as the example shown in FIG. 2, will be described.

(1) First Step First, the lid 3 is prepared. The lid 3 includes a metal frame 31, a frame member 32, and a glass member 33.

As shown in FIGS. 2 and 3, the frame-shaped member 32 is bonded onto the metal frame 31 via the bonding material 35 with the second through hole corresponding to the first through hole of the metal frame 31. Note that the bonding material 35 is, for example, an active metal brazing material.

  When the bonding material 35 is an active metal brazing material, the paste is a silver brazing material composed of silver and copper powder, silver-copper alloy powder, or a mixed powder thereof (for example, silver: 72% by mass) Copper: 28 mass (%)) powder, active metal such as titanium, hafnium, zirconium or hydride thereof is added to and mixed with silver brazing filler in an amount of 2-5 mass (%). It is produced by adding and mixing a solvent and a solvent and kneading.

  When joining the metal frame 31 and the frame-shaped member 32 with the joining material 35 of the active metal brazing material, an active metal brazing paste is used for at least one of the joining surfaces of each member by using a well-known screen printing, for example, A predetermined pattern is printed and applied in a thickness of 30 (μm) to 50 (μm).

  Then, after placing the metal frame 31 on the frame-like member 32 so as to have a predetermined structure, the metal frame 31 is loaded in a non-oxidizing atmosphere such as a hydrogen gas atmosphere or a nitrogen gas atmosphere while applying a load. By heating for 780 (° C.) to 900 (° C.), 10 (min) to 120 (min), changing the organic solvent, solvent, and dispersant of the brazing material paste into a gas and releasing the brazing material Joining is performed. Moreover, since the metal frame 31 can suppress corrosion by providing a plated layer of nickel or the like, for example, it is preferable to provide a nickel layer or the like using a plating method after joining with the frame-like member 32.

  As shown in FIG. 2, the glass member 33 is bonded to the upper surface of the frame-shaped member 32 to which the metal frame 31 is bonded using a glass bonding material 34. As a result, the lid 3 including the metal frame 31, the frame-shaped member 32, and the glass member 33 is obtained. As the glass bonding material 34, for example, low melting point glass or the like can be used.

  The glass bonding material 34 is preferably a material having a thermal expansion coefficient comparable to that of the frame-shaped member 32 or the glass member 33. For example, when a low melting glass is used as the glass bonding material 34, the low melting glass preferably has a thermal expansion coefficient comparable to that of the frame-shaped member 32 or the glass member 33. Thereby, the stress applied to the glass member 33 is suppressed, and the glass member 33 is bonded to the frame-shaped member 32 with high bonding strength.

When the low-melting glass has a large thermal expansion coefficient, the glass bonding material 34 is obtained by adding a low thermal expansion material such as a cordierite-based compound as a filler to a thermal expansion coefficient of 4 to 8 (× 10 ^{− By controlling the} temperature to about ⁶ / ° C. or less, the stress applied to the glass member 33 can be suppressed and the bonding strength can be improved.

  The low-melting glass may be, for example, a conventionally known lead-based low-melting glass, but is preferably made of lead-free glass because of its influence on the environment. The low melting point glass is preferably made of, for example, bismuth-based lead-free glass that can be bonded at a low temperature of about 450 (° C.) or vanadium pentoxide-based lead-free glass that can be bonded at a low temperature of about 400 (° C.).

  When low-melting glass is used as the glass bonding material 34, a paste that becomes low-melting glass is formed by screen printing over the entire circumference of the outer peripheral edge of the lower main surface of the glass member 33. And after heating a paste and evaporating a solvent, the glass member 33 is mounted on the upper surface of the frame-shaped member 32 with which the metal frame 31 was joined, and it hold | maintains to the temperature which becomes more than melting | fusing point of low melting glass. What is necessary is just to melt-bond. Thereby, the lid 3 including the metal frame 31, the frame-shaped member 32, and the glass member 33 is obtained.

(2) Second Step Next, the optical device substrate 1 is prepared. The optical device substrate 1 includes an insulating substrate 11 and a bonding metal frame 12. The method for producing the optical device substrate 1 of the present invention is as described above.

(3) Third Step Next, the optical element 2 is mounted on the optical device substrate 1. For example, the optical element 2 is electrically connected to a wiring conductor on the insulating substrate 11 by a bonding wire using a wire bonding method.

(4) Fourth Step Next, the lid 3 is bonded to the optical device substrate 1.

  In this step, the outer peripheral edge of the entire circumference of the metal frame 31 of the lid 3 and the bonding metal frame 12 of the optical device substrate 1 are bonded together by seam weld bonding. In this way, the optical device includes the optical device base 1, the optical element 2 mounted on the optical device base 1, and the lid 3 bonded to the optical device base 1.

  When the lid 3 and the optical device substrate 1 are bonded by seam weld bonding as in this step, the optical element is bonded by bonding a glass substrate to the upper surface of the insulating substrate having a recess. Compared with the case of sealing (not shown), the temperature rise at the time of joining can be suppressed. Accordingly, it is possible to prevent the function of the optical element 2 from being lowered. In addition, since the optical element 2 is sealed by joining the outer peripheral edge of the metal frame 31 to the upper surface of the bonding metal frame 12 connected to the lower surface of the insulating substrate 11, the bonding metal frame 12. Since the stress at the time of bonding is relieved by the metal frame 31, the stress applied to the glass member 33 and the glass bonding material 34 having a relatively low strength is reduced, resulting in a package sealing structure with high hermetic reliability of the apparatus.

  The present invention is not limited to the above-described embodiments, and various changes and improvements can be made without departing from the scope of the present invention. Hereinafter, other embodiments will be described. Note that, in the optical device or the optical device base according to another embodiment, the same parts as those of the optical device or the optical device base according to the above-described embodiment are denoted by the same reference numerals and appropriately described. Omitted.

  FIG. 6 is an enlarged view showing a modification of FIG. In the example shown in FIG. 6, a metallized layer 36 is provided on the lower surface of the frame-shaped member 32. The formation method of the metallized layer 36 is the same as that of the bonding metallized layer 13. The metallized layer 36 of the frame-like member 32 is connected to the joining metal frame 12 by a connecting material 37 made of a low temperature brazing material or the like. With this configuration, a joining method by brazing is possible in addition to seam weld joining. When joining by brazing, the function part of the optical element 2 by a heating can be prevented by heating compared with a reflow process by locally heating a junction part using a laser beam. Further, as described above, the lower surface of the bonding metal frame 12 is bonded to an external wiring board (not shown in FIG. 6) via a brazing material, so that the bonding portion of the bonding metal frame 12 is joined. The generated brazing heat can be dissipated to the wiring board, and further, the functional degradation of the optical element 2 can be prevented.

  In the example shown in FIG. 3, the frame member 32 is described as being made of a ceramic material, but may be a metal material. Further, when the frame-shaped member 32 is a metal material, it is separate from the metal frame 31 in FIG. 3, but the frame-shaped member 32 may be integrated with the metal frame 31.

  FIG. 7 is a perspective view showing a modification of FIG. In the example shown in FIG. 7, the frame-shaped member 32 has a rectangular frame shape as in each of the above examples, but the frame-shaped member 32 extends from one side of the pair of sides facing each other to the other. The upper surface is inclined. Accordingly, the glass bonded to the upper surface of the inclined frame-shaped member 32 is also inclined.

  This modification is the same as the example of FIG. 4 except for the inclination of the upper surface of the frame-shaped member 32, and the description of the same points is omitted. Also in this modified example, as in each of the above examples, the outer peripheral portion of the bonding metal frame 12 protrudes outside the insulating base 11, and the incident light and the reflected light to the optical element 2 to be accommodated are reflected. The distance can be separated.

  In the case of the configuration as shown in FIG. 7, the upper surface of the optical element 2 and the glass member 33 are not parallel to each other. Therefore, a phenomenon (resonance phenomenon) in which reflected light generated in each of them is repeatedly reflected between the lower surface of the glass member 33 and the upper surface of the optical element 2 is less likely to occur. Therefore, when an optical device in which a light emitting element is accommodated as the optical element 2 in the optical device package 4 is used for a projector, a ghost is less likely to occur at the edge portion of the image. Accordingly, the quality of the video is further improved.

  In order to incline the upper surface of the frame-shaped member 32 as described above, for example, when the frame-shaped member 32 is made of a ceramic material, the molding die may be formed into a corresponding shape by a powder press and fired. Moreover, if the frame-shaped member 32 is a metal member, the upper side of the frame-shaped metal material used as the frame-shaped member 32 should just be cut | disconnected by a predetermined angle.

  The inclination angle of the upper surface of the frame-shaped member 32 (the angle of inclination of the upper surface of the frame-shaped member 32 with respect to the reference surface when the upper surface of the optical element 2 to be accommodated is the reference surface (0 degree)) is about 1 degree or more. If it is. That is, as long as the upper surface of the frame-shaped member 32, that is, the glass member 33 is inclined with respect to the reference surface, repeated reflection (resonance) of reflected light can be suppressed.

  Further, considering not only the prevention of resonance but also the elimination of the influence of the reflected light on the image quality, it is better to have an inclination of 5 degrees or more so that the reflected light is further away from the original position. However, when this inclination angle increases, the difference between the incident angle to the glass member 33 and the exit angle of the reflected light reflected by the element from the glass member 33 increases. Therefore, for example, when a non-reflective coating or the like is provided on the glass member 33, a difference is easily generated in the light transmission characteristics of the glass member 33 including the non-reflective coating or the like. In this case, the color tone in the captured image is likely to be affected. Therefore, the inclination angle of the upper surface of the frame-shaped member 32 is preferably 20 degrees or less. Therefore, if the image quality is taken into consideration, the inclination angle is more preferably in the range of 5 to 20 degrees.

  In addition, when the frame-shaped member 32 is rectangular when viewed from above, if the inclination is made between the long sides facing each other, the same inclination is made between the short sides facing each other. It is preferable because the height can be suppressed as compared with the case where an inclination is applied. In other words, regarding the reduction in the height, the upper surface of the frame-shaped member 32 that is rectangular when viewed from above is inclined in the long side direction when it is inclined in the short side direction. Is also preferable. In addition, when the frame-shaped member 32 is inclined in the short side direction as shown in FIG. 7, for example, the light is inclined in the long side direction and incident and reflected in the same manner as the incident light and reflected light shown in FIG. It is preferable in the following points to make it. That is, in this case, even if the frame-shaped member 32 is inclined, the inclination of the incident light and the reflected light with respect to the glass member 33 is the same angle at the time of incidence and at the time of reflection. Is preferable because it is the smallest.

FIG. 8 is a perspective view showing another modification of FIG. In the example shown in FIG. 8, the upper surface of the frame-shaped member 32 is inclined from one side of the pair of opposite sides of the frame-shaped member 32 to the other side, and another pair of the frame-shaped members 32 facing each other. The upper surface of the frame-shaped member 32 is further inclined from one side to the other side. In other words, the upper surface of the rectangular frame-shaped member 32 is inclined in the same direction in two directions orthogonal to each other. In other words, the height position of the upper surface of the rectangular frame-shaped member 32 is the highest at one corner of the frame-shaped member 32 in plan view, and the lowest at the other corner positioned diagonally thereto. . Accordingly, the glass bonded to the upper surface of the inclined frame-shaped member 32 is also inclined similarly to the upper surface of the frame-shaped member 32.

  This modification is also the same as the example of FIG. 4 except for the inclination of the upper surface of the frame-like member 32, and the description of the same points is omitted. Also in this modified example, as in each of the above examples, the outer peripheral portion of the bonding metal frame 12 protrudes outside the insulating base 11, and the incident light and the reflected light to the optical element 2 to be accommodated are reflected. The distance can be separated.

  Also in the case of the configuration as shown in FIG. 8, the upper surface of the optical element 2 and the glass member 33 are not parallel to each other. Further, in this case, the reflected light is reflected in the diagonal direction in plan view of the optical device package 4. Therefore, the phenomenon that the reflected light generated in each of them is repeatedly reflected between the lower surface of the glass member 33 and the upper surface of the optical element 2 is further less likely to occur. Therefore, when an optical device in which a light emitting element is accommodated as the optical element 2 in the optical device package 4 is used for a projector, a ghost is less likely to occur at the edge portion of the image. Therefore, also in this case, the quality of the video is further improved.

  Moreover, in the case of such a form, for example, the insulating base 11 and the lid 3 (the glass member 33) are formed at the corner portion having the highest height position as described above in the frame member 32 having a square frame shape. It is easy to secure space in the space between. For example, when the optical element 2 is a light emitting element, an element for monitoring the output of the light emitting element using reflected light can be accommodated in the space. That is, auxiliary elements such as a monitor of the optical element 2 can be easily accommodated in the optical device package 4 instead of so-called external attachment. It is easy to ensure a dimensional allowance for the accommodation. Therefore, in this case, it is possible to provide the optical device package 4 that is more effective in terms of integration of optical devices (such as downsizing and higher density).

  The inclination angle of the upper surface of the frame-shaped member 32 (the angle of the upper surface inclination of the frame-shaped member 32 with respect to the reference surface when the upper surface of the optical element 2 to be accommodated is the reference surface (0 degree)) is a pair of sides. For example, it may be set as follows between the two sides and between the other pair of sides. That is, in FIG. 8, the upper surface of the frame-shaped member 32 is inclined in two directions. Therefore, when the ratio of the vertical and horizontal directions (xy directions) in the top view of the optical element 2 accommodated in the optical device package is smaller than 1: 2, the inclination angle in the example of FIG. 7 (inclination in only one direction). At a tilt angle of about 87%, the reflected light leaves the original position as much as in the example of FIG. Therefore, the same level of resonance prevention effect can be realized with a small inclination angle.

  Therefore, it is more advantageous in suppressing the tilt angle, and it is preferable because the height of the apparatus can be prevented from increasing.

  In addition, the inclination angles may be the same or different from each other between a pair of sides and between another pair of sides. When the inclination angles are the same as each other, the upper surface of the frame-shaped member 32 is inclined in one direction from one of a pair of sides facing each other as in the example shown in FIG. The difference in stress applied to each side of the frame-shaped member 32 is reduced. For this reason, the stress applied to the optical element 2 is suppressed to be small, and the optical device package 4 can be easily obtained, which is advantageous. Further, when the inclination angles are different from each other, for example, when the dimensional difference between the long side and the short side of the optical device package 4 is large in a top view, the inclination angle on the long side (direction along the long side) is reduced. By setting the inclination angle on the short side (direction along the short side) large, it is advantageous because the height of the optical device package 4 can be suppressed.

DESCRIPTION OF SYMBOLS 1 Optical apparatus base | substrate 11 Insulating base | substrate 12 Joining metal frame 12a Lid | mounting body mounting region 13 Joining metallization layer 14 Brazing material 15 Wiring board 16 Joining material 2 Optical element 3 Lid 31 Metal frame 32 Frame-shaped member 33 Glass member 34 Glass bonding material 35 Bonding material 36 Metallized layer 37 Connection material 4 Package for optical device

Claims (3)

Insulating substrate having an optical element mounting portion on the upper surface, and is bonded to the lower surface of the insulating substrate has a bonding metal frame member outer peripheral portion is protruded outward from the insulating base, before Kigaishu The upper surface of the part includes a base for an optical device having a lid mounting area ,
A frame member and a glass member bonded to the frame member, the frame member having a lid provided on the lid mounting region;
The frame-shaped member has a square frame shape, and the upper surface of the frame-shaped member is inclined so that the frame-shaped member faces each other from one side to the other of the pair of sides facing each other. An optical device package in which the upper surface of the frame-shaped member is further inclined from one of the pair of sides to the other. The optical device package according to claim 1, wherein the lid is provided in the lid mounting region of the bonding metal frame .
An optical element provided in the optical element mounting portion of the insulating base;
An optical device. An optical device according to claim 2 ;
A control circuit for controlling the driving of the optical element of the optical device;
A light source irradiated to the optical element;
A lens through which the light reflected by the optical element passes,
Projector.

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