JP5274434B2 - Electronic component storage package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for storing an electronic component ensuring a junction strength of a frame-like metallized layer, and an insulating property between a connection wiring conductor and the frame-like metallized layer. <P>SOLUTION: The package for storing an electronic component includes an insulating substrate 101 on which the frame-like metallized layer surrounding a mount section 102 of an electronic component is formed, a metal frame body 106 brazed to the frame-like metallized layer, and the connection wiring conductor 103 close to an inner periphery of the frame-like metallized layer. The frame-like metallized layer comprises a first frame-like metallized layer 104 that is deposited on the insulating substrate 101 and includes the inner periphery close to an outer periphery of the mount section 102 and a second frame-like metallized layer 105 that is deposited from an upper surface of the insulating substrate 101 to an upper surface of the first frame-like metallized layer 104 along the outer periphery of the first frame-like metallized layer 104 and is thicker than the first frame-like metallized layer 104. The frame-like metallized layer comprising the first and second frame-like metallized layers 104, 105 is thick, thus increasing the junction strength. The first metallized layer 104 is thin, thus ensuring the insulation property. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component storage package in which a metallized layer surrounding a mounting part is attached to an upper surface of an insulating substrate having a mounting part for storing an electronic component, and a metal frame is brazed to the metallized layer. Is.

  Conventionally, as an electronic component storage package used for mounting an electronic component such as a crystal resonator or a semiconductor element, a package having a structure as shown in FIG. 3 is used (see, for example, Patent Document 1). . FIG. 3A is a plan view showing an example of a conventional electronic component storage package, and FIG. 3B is a cross-sectional view taken along line BB ′ of FIG. ) Is an enlarged cross-sectional view of the main part showing the main part of FIG. The electronic component storage package shown in FIG. 3 includes an insulating substrate 201 having an electronic component (not shown) mounting portion 202 on the upper surface, and a frame-shaped metallization that surrounds the mounting portion 202 and is attached to the upper surface of the insulating substrate 201. Layer 204, metal frame 206 brazed to frame-like metallized layer 204, connection wiring conductor 203 formed on mounting portion 202 to which electronic components are electrically connected, and lower surface of insulating substrate 201 from mounting portion 202 It is basically composed of a wiring conductor (not shown) formed over the same.

  In such an electronic component storage package, a lid (not shown) is joined to the upper surface of the metal frame 206 by a joining method such as seam welding, so that the electronic components mounted on the mounting portion 202 are hermetically sealed. Stopped.

  In this example, a spacer metallization layer 205 having a narrower width than the frame-shaped metallization layer 204 is attached to the upper surface of the frame-shaped metallization layer 204. This metallized layer 205 secures a certain space between the frame-like metallized layer 204 and the metal frame 206, and forms a pool of brazing material 207 in this space to increase the brazing strength of the metal frame 206. Is to do.

  Further, the connection wiring conductor 203 formed on the mounting portion 202 may be formed close to the inner periphery of the frame-like metallized layer 204 depending on the shape of the electronic component and the position of the electrode. For example, when the electronic component is a crystal resonator (not shown), the pair of electrodes of the crystal resonator is formed at the end of the lower surface of the rectangular plate-shaped main body (crystal plate). In order to easily and surely connect such electrodes to the connection wiring conductor 203, the connection wiring conductor 203 is formed at the corner of the rectangular mounting portion 202, and the frame-shaped metallized layer 204 is formed. It is close to the inner circumference.

  The insulating substrate 201 of such an electronic component storage package is manufactured by, for example, a ceramic green sheet lamination method. That is, on the upper surface of the ceramic green sheet that becomes the insulating substrate 201 having the mounting portion 202, a metal paste that becomes the frame-like metallization layer 204 and a metal paste that becomes the metallization layer 205 for the spacer are sequentially screened so as to surround the mounting portion 202. It is manufactured by firing after printing by a printing method or the like. The frame-like metallized layer 204 is deposited with a thickness of about 20 to 30 μm, for example, in order to ensure bonding strength (so-called metallized strength) to the insulating substrate 201. An electronic component storage package is manufactured by brazing the metal frame 206 to the frame-shaped metallized layer 204 (metallized layer 205) using a brazing material 207 such as silver brazing.

JP-A-9-139439

  However, in recent years, since the electronic component storage package has been reduced in size in accordance with the downsizing of the electronic component, the insulating property between the connection wiring conductor 203 to which the electronic component is connected and the frame-like metallized layer 204 is increased. There was a problem that it was becoming difficult to secure. This is because the metal paste that becomes the frame-like metallized layer 204 spreads in the lateral direction after printing (so-called bleeding occurs). When such blurring occurs, there is a possibility that the insulation between the inner periphery of the frame-shaped metallized layer 204 and the connection wiring conductor 203 that are originally close to each other may be reduced or an electrical short circuit may occur. If insulation degradation or a short circuit occurs between the frame-shaped metallized layer 204 and the connection wiring conductor 203, for example, the potential of the connection wiring conductor 203 fluctuates, and an appropriate signal does not act on the crystal unit, resulting in oscillation failure. Will occur.

  For such a problem, for example, it is conceivable to reduce the printing thickness of the metal paste to be the frame-like metallized layer 204 (for example, about 10 μm). However, when the printed thickness of the metal paste, that is, the thickness of the frame-like metallized layer 204 is reduced in this way, the bonding strength of the frame-like metallized layer 204 to the insulating substrate 201 may be lowered. Then, there is a high possibility that the frame-like metallized layer 204 is peeled off from the insulating substrate 201 due to stress such as thermal stress when the metal frame 206 is brazed to the frame-like metallized layer 204 (and the metallized layer 205).

  The present invention has been devised in view of such problems, and its purpose is to connect electronic components while ensuring high bonding strength of the frame metallized layer to the insulating substrate even if the insulating substrate is downsized. An object of the present invention is to provide an electronic component storage package that can ensure insulation between a connection wiring conductor and a frame-like metallized layer.

The electronic component storage package of the present invention has an electronic component mounting portion at the center of the upper surface, and an insulating substrate in which a frame-shaped metallization layer surrounding the mounting portion is formed on the outer peripheral portion of the upper surface; An electronic component comprising: a metal frame brazed to a metallized layer; and a connection wiring conductor formed on the mounting portion adjacent to the inner periphery of the frame-shaped metallized layer and electrically connected to the electronic component A storage package, wherein the frame-shaped metallization layer is directly attached to the upper surface of the insulating substrate, and an inner periphery thereof is close to an outer periphery of the mounting portion, and the first frame-shaped metallization layer, A second layer thicker than the first frame-shaped metallization layer is deposited from the upper surface of the insulating substrate along the outer periphery of the one-frame-shaped metallization layer to the outer portion in the width direction of the upper surface of the first frame-shaped metallization layer. Consists of a framed metallization layer The features.

  According to the electronic component storage package of the present invention, in the above-described configuration, the second frame-shaped metallized layer is formed on a portion directly attached to the upper surface of the insulating substrate and on the first frame-shaped metallized layer. A reservoir of brazing material is formed between at least one of the portions not covered with the two-frame metallized layer and the metal frame.

According to the electronic component storage package of the present invention, the frame-shaped metallization layer is directly attached to the upper surface of the insulating substrate, and the first frame-shaped metallization layer whose inner periphery is close to the outer periphery of the mounting portion; A second frame shape thicker than the first frame-shaped metallization layer deposited from the upper surface of the insulating substrate along the outer periphery of the first frame-shaped metallization layer to the outer portion in the width direction of the upper surface of the first frame-shaped metallization layer Since it consists of a metallized layer and the first frame-shaped metallized layer is relatively thin, it is possible to prevent the metal paste that becomes the first frame-shaped metallized layer from spreading laterally after printing. Therefore, even if the insulating substrate is reduced in size, it is possible to ensure insulation between the connection wiring conductor to which the electronic component is connected and the inner periphery of the first frame-like metallized layer.

  In addition, since the frame-shaped metallized layer has a second frame-shaped metallized layer that is thicker than the first frame-shaped metallized layer on the upper surface of the first frame-shaped metallized layer, the bonding strength to the insulating substrate is ensured. Can secure a sufficient thickness.

  According to the electronic component storage package of the present invention, in the above-described configuration, the second frame metallization layer on the portion directly attached to the top surface of the insulating substrate and the second frame of the first frame metallization layer. When a brazing material pool is formed between at least one of the portions not covered with the metalized metallization layer and the metal frame, the brazing material pool further strengthens the metal frame. It can be brazed to the frame metallization layer.

(A) is a top view which shows an example of embodiment of the electronic component storage package of this invention, (b) is sectional drawing in the AA 'line of (a), (c) is (b) It is a principal part expanded sectional view which expands and shows the principal part of FIG. (A)-(c) is the principal part expanded sectional view which shows the other example of embodiment of the electronic component storage package of this invention, respectively. (A) is a top view which shows an example of the conventional electronic component storage package, (b) is sectional drawing in the BB 'line of (a), (c) is the principal part of (b). It is a principal part expanded sectional view expanded and shown.

  The electronic component storage package of the present invention will be described with reference to the accompanying drawings. In the example of this embodiment, a case where a crystal resonator is housed as an electronic component will be described as an example.

  FIG. 1A is a plan view showing an example of an embodiment of an electronic component storage package according to the present invention, and FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. FIG. 1C is an enlarged cross-sectional view of the main part showing the main part of FIG. In FIG. 1, 101 is an insulating substrate, 102 is a mounting portion for an electronic component (not shown), 103 is a connection wiring conductor for electrically connecting the electronic component, 104 is a first frame-like metallized layer, and 105 is a second layer. A frame-like metallized layer 106 is a metal frame. An electronic component storage package is mainly composed of the insulating substrate 101 including the connection wiring conductor 103, the first frame-like metallized layer 104, and the second frame-like metallized layer 105 and the metal frame 106. In FIG. 1A, the metal frame 106 is omitted for easy viewing.

  The insulating substrate 101 is made of a ceramic material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, or a glass-ceramic sintered body. For example, the length of one side in a plan view is about 1.6 to 10 mm. The plate has a rectangular shape with a thickness of about 0.4 to 2 mm. The insulating substrate 101 is configured by laminating insulating layers (not shown) made of a ceramic material as necessary, and the insulating layer may be one layer or two or more layers.

  In addition, the insulating substrate 101 has a mounting portion 102 such as a square shape for mounting electronic components on the upper surface. If such an insulating substrate 101 is made of an aluminum oxide sintered body, an appropriate organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide. Then, a plurality of ceramic green sheets are obtained by making them into a sheet shape by a sheet forming method such as a doctor blade method or a roll calender method, and then suitable for the ceramic green sheets. It is manufactured by punching and laminating up and down and firing the laminate at a high temperature.

  As the insulating substrate 101, a plurality of regions (not shown), each of which becomes such an insulating substrate 101, are manufactured in a so-called multi-chip substrate in which the ceramic mother substrate is arranged vertically and horizontally, and this is formed at the boundary of the regions. You may manufacture by the method of cut | disconnecting and dividing | segmenting into a piece.

  In addition, a pair of connection wiring conductors 103 are formed at the corners of the mounting portion 102 of the insulating substrate 101. The connection wiring conductor 103 functions as a connection conductor for connecting an electrode of a crystal resonator that is an electronic component mounted on the mounting portion 102. A crystal resonator (not shown) is usually rectangular in shape, and a pair of electrodes (not shown) for connection are formed at the corners of the main surface. The connection wiring conductor 103 is formed at the corner of the mounting portion 102 so that it can be easily and reliably performed.

  Each electrode of the electronic component and the connection wiring conductor 103 are connected via a conductive connection material such as solder or a conductive adhesive. That is, the electronic component is positioned on the mounting portion 102 so that the electrode formed at the corner of the main surface of the electronic component faces the connection wiring conductor 103, and is previously attached to the electrode and the connection wiring conductor 103. If the conductive connecting material is heated and melted or cured, the electrode of the electronic component and the connection wiring conductor 103 are connected.

  Note that the connection wiring conductor 103 is described as an example in which a crystal resonator is used as an electronic component in the example of this embodiment, and thus a pair of connection wiring conductors 103 is formed as described above. In the case of storing a component, the shape, the number, etc. may be changed according to the arrangement of the electrodes of the electronic component. Examples of such electronic components include piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, semiconductor elements, capacitive elements, resistors, and the like. Even in the case of these electronic components, for example, the connection wiring conductor 103 has a first frame shape in order to increase the number of connection wiring conductors 103 corresponding to the multi-functionality of the electronic components and to reduce the size of the electronic component storage package. It is formed close to the inner periphery of the metallized layer 104.

  The connection wiring conductor 103 is electrically led to the outer surface of the insulating substrate 101 via a wiring conductor (not shown) formed from the connection wiring conductor 103 to the outer surface of the insulating substrate 101, for example. The wiring conductor is a portion that functions as a conductive path for electrically connecting each electrode of the electronic component mounted on the mounting portion 102 to an external electric circuit (not shown). By connecting the portion of the wiring conductor formed on the outer surface of the insulating substrate 101 to an external electric circuit via solder or the like, the electrode of the electronic component is connected to the external electric circuit via the connection wiring conductor 103 and the wiring conductor. Electrically connected.

  The connection wiring conductor 103 and the wiring conductor prevent oxidative corrosion of the connection wiring conductor 103 and the wiring conductor, and also connect the connection wiring conductor 103 and the electrode of the electronic component, and connect the wiring conductor and an external electric circuit. In order to make it easier and stronger, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surfaces. Good.

  The connection wiring conductor 103 and the wiring conductor are made of, for example, a metallized layer of tungsten, molybdenum, manganese, copper, silver, or the like, and paste of such a metal material is applied to a ceramic green sheet serving as an insulating layer constituting the insulating substrate 101. It is formed by printing in a predetermined pattern and firing simultaneously with the insulating substrate 101.

  Further, on the upper surface of the insulating substrate 101, a first frame-shaped metallized layer 104 and a second frame-shaped metallized layer 105 made of a metallized layer of tungsten, molybdenum, manganese, copper, silver or the like so as to surround the mounting portion 102 are covered. It is worn. The first frame-like metallized layer 104 and the second frame-like metallized layer 105 are formed by a method of printing a metal paste produced using these metal materials in a predetermined pattern, like the connection wiring conductor 103 and the wiring conductor. Can do. These specific forming methods will be described later.

  The first and second frame-like metallized layers 104 and 105 constitute a frame-like metallized layer (no symbol) that is a base metal layer for brazing the metal frame 106, and the metal frame 106 is added to the frame-like metallized layer. The electronic component storage package is configured by brazing.

  Then, by mounting an electronic component on the mounting portion 102 of the insulating substrate 101 and connecting the electrode of the electronic component to the connection wiring conductor 103 with a conductive adhesive or the like, the lid is bonded to the upper surface of the metal frame 106 An electronic component is hermetically sealed in a container including the lid, the metal frame 106, and the insulating substrate 101, and an electronic device (a crystal oscillator or the like) (not shown) is formed.

  The metal frame 106 is made of a metal material such as an iron-nickel alloy or an iron-nickel-cobalt alloy, and functions as a metal member for joining the lid to the insulating substrate 101. The metal frame 106 has, for example, a rectangular frame shape with a thickness of about 0.1 to 0.5 mm and a width of about 0.15 to 0.45 mm. Further, as a method of brazing the metal frame 106 to the frame-like metallized layer, for example, a silver brazing having a thickness of 20 to 50 μm is previously applied to the lower surface of the metal frame 106, and this silver brazing is applied. A method of placing the lower surface on the frame-like metallized layer and heating them with an electric furnace or the like while temporarily fixing them with a carbon jig or the like can be mentioned. By this method, the lid and the metallized layer can be easily and tightly brazed with good airtightness.

  The lid is made of a metal material such as an iron-nickel alloy or iron-nickel-cobalt alloy, a ceramic material, or a resin material, and is metalized by a joining method such as a brazing method or a welding method (for example, seam welding or electron beam welding). The frame body 106 is joined. When the lid is made of a ceramic material or a resin material, in order to be able to join the first and second frame-like metallized layers 104 and 105 by a brazing method or a welding method, The metal layer is preferably formed by a metallizing method, a plating method, a metal body embedding method, or the like. The shape of the lid is, for example, a rectangular flat plate shape or a quadrangular shape having a recess on the lower surface.

  The brazing material 107 is, for example, a silver brazing based on a silver-copper eutectic composition (for example, 71 to 73 mass% silver-27 to 29 mass% copper, JIS name: BAg-8). In the case of BAg-8, the melting point is about 780 ° C. By using such a brazing material 107, the metal frame body 106 can be brazed to the frame-like metallized layer in a heat treatment of about 800 to 850 ° C. The brazing material 107 may be added with a metal element such as tin and zinc in order to adjust wettability, melting temperature, and the like according to the size, shape, application, and the like of the insulating substrate 101.

In the electronic component storage package of the present invention, as shown in detail in FIG. 1 (c), the frame-like metallized layer is directly attached to the upper surface of the insulating substrate 101, and the inner periphery is close to the outer periphery of the mounting portion 102. The first frame-like metallized layer 104 extending along the outer periphery of the first frame-like metallized layer 104 and the outer surface of the first frame-like metallized layer 104 from the upper surface of the first frame-like metallized layer 104 to the outer side in the width direction. The second frame metallization layer 105 is thicker than the first frame metallization layer 104.

  According to this configuration, the relatively thin first frame-shaped metallization layer 104 is attached along the outer periphery of the mounting portion 102, so that the first frame-shaped metallization layer 104 is printed on the metal paste that becomes the first frame-shaped metallization layer 104. Occurrence of bleeding or the like is effectively suppressed. Even if the connection wiring conductor 103 is formed on the outer periphery of the mounting portion 102 in the vicinity of the inner periphery of the first frame-like metallized layer 104, the first frame-like metallized layer 104 can be formed by downsizing the insulating substrate 101 or the like. Even if the connection wiring conductor 103 is further closer, a gap (gap 109) between the inner periphery of the first frame-like metallized layer 104 (frame-like metallization layer) and the connection wiring conductor 103 can be secured, Insulation between the first frame-like metallized layer 104 and the connection wiring conductor 103 can be ensured.

  That is, since the first frame-like metallized layer 104 formed on the inner periphery in the vicinity of the connection wiring conductor 103 is relatively thin, bleeding of the metal paste that becomes the first frame-like metallization layer 104 is suppressed, and the connection wiring A gap 109 can be ensured between the conductor 103 and the inner periphery of the first frame-like metallized layer 104, thereby ensuring insulation.

  Further, a second frame-shaped metallized layer 105 thicker than the first frame-shaped metallized layer 104 extends from the upper surface of the insulating substrate 101 along the outer periphery of the upper surface of the first frame-shaped metallized layer 104 to the upper surface of the first frame-shaped metallized layer 104. Therefore, the frame-shaped metallized layer can have a sufficient thickness for increasing the bonding strength to the insulating substrate 101. As a result, even if the insulating substrate 101 is downsized, the insulating property between the first frame-like metallized layer 104 and the connection wiring conductor 103 is ensured while ensuring high bonding strength of the frame-like metallized layer to the insulating substrate 101. It is possible to provide a package for storing electronic components.

  The thickness of each of the first and second frame-like metallization layers 104 and 105 constituting the frame-like metallization layer is, for example, that the thickness of the first frame-like metallization layer 104 is about 5 to 10 μm. The thickness of 105 is about 15 to 30 μm.

  In addition, if the insulating substrate 101 is a quadrangular shape having a length of one side of about 2.0 to 5.0 mm in plan view, which is often used as a package for storing a crystal resonator as an electronic component, a frame-shaped metallization is used. The width of the layer (the total width of the first and second frame-like metallized layers 104 and 105 in plan view) is about 0.2 to 0.5 mm. In addition, the second frame-shaped metallized layer 105 covers the first frame-shaped metallized layer 104, for example, at a portion outside the center in the width direction of the first frame-shaped metalized layer 104. When the width of the frame-shaped metallized layer is about 0.2 to 0.5 mm, the width of the first frame-shaped metallized layer 104 is set to about 0.1 to 0.3 mm, and the width of the second frame-shaped metallized layer 105 is about 0.15 to 0.4 mm. What is necessary is just to set to a grade.

  The frame-shaped metallized layer includes a portion in which the first frame-shaped metallized layer 104 is covered by the second frame-shaped metallized layer 105, a portion outside the portion (a portion having only the second frame-shaped metalized layer 105), and an inner side. Since the thickness is different from this portion (the portion having only the first frame-like metallized layer 104), a step corresponding to the difference in thickness is generated.

  As a method for forming such a frame-shaped metallized layer, first, a metal paste that becomes the first frame-shaped metallized layer 104 is relatively thin with a frame-shaped pattern whose inner periphery is close to the outer periphery of the mounting portion 102. Printing (for example, at about 10 μm), and then the inner periphery covers the outer periphery of the upper surface of the first frame-like metallized layer 104 and the outer periphery covers the portion along the outer periphery of the upper surface of the insulating substrate 101 What is necessary is just to print the metal paste used as the 2nd frame-shaped metallization layer 105 by a frame-like pattern comparatively thickly (for example, about 25 micrometers).

  Here, when printing the metal paste that becomes the first frame-shaped metallized layer 104, if the metal paste that becomes the connection wiring conductor 103 is printed at the same time, the first frame-shaped metallization layer 104 and the connection wiring conductor 103 are mutually connected. It is easy to increase the positional accuracy. Further, when the metal paste to be the first frame-like metallized layer 104 and the metal paste to be the connection wiring conductor 103 are printed at the same time, it is easy to print each metal paste with the same thickness. In addition, the thickness of the connection wiring conductor 103 can be made as thin as the first frame-like metallized layer 104. Further, bleeding of the metal paste that becomes the connection wiring conductor 103 can be effectively suppressed. Therefore, it is advantageous for more effectively suppressing an electrical short circuit between the first frame-like metallized layer 104 and the connection wiring conductor 103.

  The exposed surfaces of the metal frame 106, the brazing material 107, and the first and second frame-like metallized layers 104 and 105 are effectively prevented from being oxidized and corroded, and the metal frame 106 for sealing is used. In order to make it easy to join the lid and the lid, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.3 to 3 μm are sequentially deposited.

  In this example, it may be necessary to secure a certain thickness for the connection wiring conductor 103 in order to avoid the quartz crystal resonator, which is an electronic component, coming into contact with the upper surface (mounting portion 102) of the insulating substrate 101. . In such a case, a metallized layer (not shown) that serves as a support for the crystal resonator may be attached to the center of the upper surface of the connection wiring conductor 103 or the like.

  The metallized layer that becomes the support base is formed, for example, by printing the metal paste for the metallization layer that becomes the support base at the same time when the metal paste that becomes the second frame-shaped metallization layer 105 is printed. Can do. As the metal paste for the metallized layer serving as the support base, the same metal paste as that for the connection wiring conductor 103 can be used. Note that the metallized layer serving as a support is preferably formed so that the outer periphery thereof is located inside the outer periphery of the connection wiring conductor 103, such as the central portion of the upper surface of the connection wiring conductor 103 as described above. This is to prevent the insulation between the connection wiring conductor 103 and the first frame-like metallized layer 104 from being lowered by the metal paste when the metal paste for the metallized layer serving as the support spreads. It is.

  Furthermore, the width of the frame-shaped metallized layer can be adjusted by changing the width of the portion of the first frame-shaped metallized layer 104 that is covered by the second frame-shaped metallized layer 105. In addition, the width of the portion of the first frame-shaped metallized layer 104 that is not covered with the second frame-shaped metallized layer 105 and the width of the portion of the second frame-shaped metalized layer 105 that is directly attached to the insulating substrate 101 are also adjusted. You can also It should be noted that when adjusting these widths, it is desirable to consider the stability when positioning the metal frame 106 on the frame-like metallized layer.

  Here, specifically, the insulating substrate 101 made of an aluminum oxide sintered body and having a rectangular plate shape of 2.0 mm × 2.5 mm in plan view is made of an iron-nickel-cobalt alloy and has a thickness of 0.25 mm. The effect will be described with reference to an example of an electronic component storage package manufactured by brazing a metal frame 106 having a width of 0.3 mm.

  In this example, the first and second frame-like metallization layers 104 and 105 constituting the frame-like metallization layer are both made of tungsten and formed by co-firing tungsten metal paste with the insulating substrate 101. . The thickness of the first frame-shaped metallized layer 104 was set to about 10 μm, and the thickness of the second frame-shaped metalized layer 105 was set to about 25 μm. The width of the first frame-like metallized layer 104 is about 0.2 mm, the width of the second frame-like metallized layer 105 is about 0.35 mm, and the width of the second frame-like metallized layer 105 is about 0.15 mm. The width of the frame-shaped metallization layer was about 0.4 mm, applied to the upper surface of the frame-shaped metallization layer 104. The distance between the first frame-like metallized layer 104 and the connection wiring conductor 103 is set to 0.3 mm, and the second frame-like metallized layer 105 has a pattern in which the outer periphery is 0.1 mm away from the outer periphery of the insulating substrate 101. Set to. Then, the metal frame 106 was brazed to the frame metallized layer by using B-Ag8 brazing (silver brazing) as the brazing material 107 and heating to about 850 ° C. in an electric tunnel furnace (reducing atmosphere).

For the electronic component storage package of this example, an electrical resistance meter (manufactured by Yokogawa Hewlett-Packard Company) is used to determine whether insulation between the first frame-like metallized layer 104 and the connection wiring conductor 103 is ensured. And inspected. The measurement environment was a room temperature of 25 ± 5 ° C., a relative humidity of 40 to 70%, and a DC voltage of 100 V was applied for measurement. In this measurement, a product having an electrical resistance between the frame-like metallized layer 104 and the connection wiring conductor 103 of less than 1 × 10 ⁶ Ω was judged as having no insulation. As a result, in the inspected about 1000 electronic component storage packages, the electrical resistance between the frame-like metallized layer (first frame-like metallized layer 104) and the connection wiring conductor 103 is 1 × 10 ⁶ Ω or more, Insulation was ensured. In the case of a conventional electronic component storage package (for example, the example shown in FIG. 3), for example, the thickness of the frame-shaped metallized layer (204) is about 25 μm, and the inner periphery of the frame-shaped metallized layer and the connection wiring conductor ( 203), the electrical resistance between the frame-like metallized layer (204) and the connection wiring conductor (203) is about 0.5%. Some of them were less than 1 × 10 ⁶ Ω, and insulation was not ensured.

  In addition, with respect to the electronic component storage package of this example, after a lid made of an iron-nickel-cobalt alloy was joined to the metal frame 106 by the seam welding method, a test for mechanically peeling the lid from the metal frame 106 was performed. I did it. As a result, in the tested 200 electronic component storage packages, the first and second frame-like metallized layers 104 and 105 did not peel off. As a comparative example, an electronic component storage package (not shown) in which a frame-like metallized layer is attached to an insulating substrate with only a metallized layer having a thickness of about 10 μm is manufactured, and a lid is formed as in the above example. The test which peels after bonding was done. As a result, in two of the 200 electronic component storage packages tested, partial peeling occurred on the outer peripheral portion of the frame-shaped metallized layer. In this mechanical peeling test, after the lid was joined to the metal frame 106, the electronic component storage package was mounted on the glass epoxy board with solder, and the solder was about φ0.5 mm on the lid. This is a test method in which an aluminum wire is joined, the wire is pulled with a push-pull gauge, and stress is applied so as to mechanically peel off the lid.

  Further, according to the electronic component storage package of the present invention, in the above-described configuration, the second frame metallization layer 105 on the portion directly attached to the upper surface of the insulating substrate 101 and the first frame metallization layer 104. In the case where a brazing material reservoir 108 is formed between at least one of the portions not covered with the second frame-like metallized layer 105 and the metal frame body 106, The metal frame 106 can be brazed to the frame-like metallized layer (first and second frame-like metallized layers 104, 105) even more firmly.

  The brazing material reservoir 108 is formed at the step portion of the frame-like metallization layer generated by the structure in which the first frame-like metallization layer 104 is partially covered with the second frame-like metallization layer 105 described above. Yes. For example, as shown in FIGS. 2 (a) and 2 (b), the brazing material reservoir 108 is formed on the portion (outer step) directly attached to the upper surface of the insulating substrate 101 of the second frame-like metallized layer 105. Or the brazing material reservoir 108 is not formed on only one of the first frame-shaped metallized layers 104 that is not covered with the second frame-shaped metallized layer 105 (inner step) (for example, Compared to the example shown in FIG. 2 (c), the brazing strength of the metal frame 106 to the frame-like metallized layer can be increased. 2A to 2C are main part enlarged cross-sectional views showing other examples of the embodiment of the electronic component storage package of the present invention. In FIG. 2, the same parts as those in FIG. Also in the example shown in FIG. 2C, the effect of ensuring the insulation (gap 109) between the inner periphery of the frame-like metallized layer and the connection wiring conductor 103 and the bonding strength of the frame-like metallized layer to the insulating substrate 101 are increased. Effect can be obtained.

  In addition, when the brazing material pool 108 is formed on both the outer step and the inner step, the strength of joining the metal frame 106 can be further effectively increased.

  In order to form such a reservoir 108 of brazing material between the metal frame 106 and the frame-like metallized layer, the metal frame 106 must be positioned on the outer step or the inner step, It is necessary that the frame 106 has a width that allows the frame 106 to be positioned at such a portion.

  Such a brazing material reservoir 108 can also be formed in the above-described conventional electronic component storage package, but the electronic component storage package of the present invention has the following excellent effects. Have.

  That is, according to the conventional technique, it is necessary to print the metal paste that becomes the metallization layer for the spacer on the metal paste that becomes the frame-shaped metallization layer of the conventional technique printed relatively thickly. Variations in thickness tend to occur in the metal paste that becomes the metallized layer. This is because a step is generated on the surface of the ceramic green sheet by the amount of the printed metal paste that becomes the frame-like metallized layer, so that the plate making (plate surface) and the printing material for printing the metal paste that becomes the metallized layer for the spacer are used. This is because the distance between the metal paste and the metal paste that becomes the frame-shaped metallized layer of the prior art is likely to vary. In this case, since the width of the metallization layer for the spacer is narrow, there is a tendency that the variation in the printing thickness according to the variation in the distance between the plate making and the printing material tends to increase.

  On the other hand, according to the electronic component storage package of the present invention, the first frame-shaped metallized layer 104 is relatively thin, for example, about 5 to 10 μm. It is possible to effectively suppress variation in the distance between the paste and the ceramic green sheet. Therefore, variations in the thickness of the second frame-like metallized layer 105 and the thickness as the frame-like metallized layer can be reduced.

  Further, since the second frame metallization layer 105 is thicker than the first frame metallization layer 104, the thickness of the outer metallization layer can be increased, and the bonding strength to the insulating substrate 101 at the outer periphery of the frame metallization layer is increased. There is an effect to. In this case, after a lid (not shown) made of a metal material is welded to the upper surface of the metal frame 106 by, for example, a seam weld method, the first and second frames are contracted by contraction of the metal frame 106 and the lid. Even if thermal stress is applied to the outer peripheral portions of the metallized layers 104 and 105, the thermal stress is favorably absorbed by the brazing material reservoir 108 and the thick part of the second frame metallized layer 105. Therefore, it is possible to effectively prevent the first and second frame metallization layers 104 and 105 from peeling from the insulating substrate 101 and the second frame metallization layer 105 from peeling from the first frame metallization layer 104. it can.

  Further, since the thickness of the brazing material reservoir 108 formed on the outer step near the outer periphery of the insulating substrate 101 can be made relatively thin, the brazing material 107 can be scattered or flowed out to the outer peripheral side surface of the wiring substrate 101 or the like. It is advantageous in suppressing the above. By suppressing scattering and flow-out of the brazing material 107, for example, an electrical short circuit between the wiring conductor formed on the outer surface or the outer periphery of the lower surface of the insulating substrate 101 and the frame metallization layer (second frame metallization layer 105). Can be more effectively prevented.

  Further, for example, as shown in FIG. 2A, when the width of the outer step is wider than the width of the inner step, the frame-shaped metallization caused by the thermal stress particularly when the lid is joined to the metal frame 106. A sufficient width of the brazing material 107 can be ensured for suppressing peeling of the outer periphery of the layer.

  That is, after the lid made of a metal material is welded to the upper surface of the metal frame 106 by, for example, the seam weld method, the first and second frame-like metallized layers 104 and 105 are particularly affected by contraction of the metal frame 106 and the lid. Even if thermal stress is applied to the outer peripheral portion, the thermal stress is satisfactorily absorbed by the brazing material reservoir 108 and the second frame-like metallized layer 105 that are widely formed on the outer step. Therefore, it is possible to more effectively prevent the outer peripheral portion and the like of the second frame-like metallized layer 105 from peeling off from the insulating substrate 101.

  Note that the brazing of the metal frame 106 to the insulating substrate 101 is performed as follows, for example, in the case where the insulating substrate 101 is manufactured in the form of the multi-chip substrate described above.

  First, a notch for positioning (not shown) is formed on the outer side of a mother board (not shown) in which a plurality of regions to be the insulating substrate 101 are arranged vertically and horizontally.

  Next, a positioning pin is provided at a position corresponding to the notch on the main surface, and a plurality of holes each corresponding to the outer shape of the metal frame 106 correspond to the above region on the main surface. A brazing jig (not shown) such as a plate shape arranged in a row is prepared.

  Then, after putting the metal frame 106 in each hole of the jig, the mother board is placed on the jig and the positioning pins are inserted into the notches, and these are placed in the furnace with the brazing material 107. Brazing is performed by heating to a brazing temperature (about 750 to 900 ° C. in the case of silver-copper brazing). In this case, a brazing material 107 may be preliminarily attached to the surface of the metal frame 106 to be brazed to the insulating substrate 101 in the form of a film. The jig is made of a material having good heat resistance and a low thermal expansion coefficient, such as carbon.

  Through the above steps, the metal frame 106 is brazed to the first frame-like metallized layer 104 and the second frame-like metallized layer 105 of the insulating substrate 101.

  It should be noted that the present invention is not limited to the above embodiments, and various modifications may be made without departing from the gist of the present invention. For example, in this example, the connection wiring conductor 103 formed in the mounting portion 102 of the insulating substrate 101 is formed as a pair of connection wiring conductors 103. According to the form of the electronic component accommodated in the mounting portion 102, The shape and number of the connection wiring conductors 103 formed in the mounting portion 102 may be changed.

101 ・ ・ ・ Insulating substrate
102 ・ ・ ・ Mounting part
103 ・ ・ ・ Connection wiring conductor
104 ... 1st frame-shaped metallization layer
105 ... 2nd frame metallization layer
106 ・ ・ ・ Metal frame
107 ... brazing material
108 ... Holding of brazing material
109 ... Gap

Claims (2)

An insulating substrate having an electronic component mounting portion at the center of the upper surface, and a frame-shaped metallization layer surrounding the mounting portion on the outer periphery of the upper surface, and a metal frame brazed to the frame-shaped metallization layer And a mounting wiring conductor formed on the mounting portion in the vicinity of the inner periphery of the frame-shaped metallization layer, to which the electronic component is electrically connected, The metallized layer is directly attached to the upper surface of the insulating substrate, and a first frame-like metallized layer whose inner circumference is close to the outer circumference of the mounting portion, and along the outer circumference of the first frame-like metallized layer And a second frame metallization layer thicker than the first frame metallization layer, which is deposited from the upper surface of the insulating substrate to the outer portion in the width direction of the upper surface of the first frame metallization layer. Electronic component storage package .   At least one of a portion of the second frame metallization layer directly attached to the upper surface of the insulating substrate and a portion of the first frame metallization layer not covered with the second frame metallization layer. 2. The electronic component storage package according to claim 1, wherein a brazing material reservoir is formed between the metal frame and the metal frame.

Images