JP2003344712A - Method of manufacturing package for optical communication - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a package for optical communication by which a light-transmissive member is easily and securely joined to a refraction part of a metallic fixation member. <P>SOLUTION: The method of manufacturing the package 10 for optical communication is for forming a through hole 19 communicating with a cavity part 14 in a frame body 14, joining the metallic fixation member 20 having the refraction part 23 in its insertion hole 21 to the through hole 19, and joining the light-transmissive member 22 to the refraction part 23. The method includes: a process of forming a small- diameter hole 26 having a first axis 25 on the one side of the insertion hole 21 and a large-diameter hole 28 having a second axis with an angle to the first axis 25 on the other side and mounting the light-transmissive member 22 on a step part 29 where the small-diameter hole 26 changes to the large-diameter hole 28; a process of preparing a fixture 33 for joining in which the shape of the surface of the connection part between a block body 31 and a press body 32 is formed of a convex spherical surface and a concave spherical surface or a convex spherical surface and a reversely conic surface; and a process of weighting the light-transmission member 22 with the press body 32 and heating and joining the light-transmissive member 22 to the step part 29 while pressing the member 22 by the block body 31. <P>COPYRIGHT: (C)2004,JPO

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a method for manufacturing an optical communication package for accommodating a semiconductor element for optical communication, and more particularly, to a method for manufacturing an optical fiber. The present invention relates to a method for manufacturing an optical communication package including a light-transmitting member facing the same. 2. Description of the Related Art An optical communication package for accommodating a semiconductor element for optical communication that uses a light wave from a light emitting element such as a laser diode as a carrier wave has a main body made of ceramic or metal. There is something. As shown in FIG.
For example, in the optical communication package 50 whose main body is made of metal, the bottom body 51 is a metal member having excellent heat dissipation properties, and the frame 52 and the seal ring 53 connected to the upper outer periphery of the frame 52 are made of ceramic and heat. It is formed of a metal member having a similar expansion coefficient. A cavity 5 for mounting a semiconductor element inside the bottom 51, the frame 52 and the seal ring 53.
4 is formed. In the optical communication package 50, a feed-through board 55 made of ceramic is joined to a window frame-shaped cutout portion formed on opposing side walls of the frame body 52. The feed-through board 55 includes conductor wiring patterns 56 and 56a formed to be conductive from the cavity portion 54 side to the outside of the frame 52. An external connection terminal 57 is brazed to the outer conductor wiring pattern 56a. The optical communication package 50 has a through hole 58 formed in one side wall adjacent to a side wall of the frame 52 to which the feed-through substrate 55 is joined, and an insertion hole 5 in the center.
9 and a metal fixing member 60 is inserted and brazed. In the insertion hole 59, a light transmitting member 61 for passing an optical signal and closing the insertion hole 59 to keep the cavity portion 54 airtight is joined. The translucent member 61 is joined at an angle with respect to the axis of the insertion hole 59 so that the reflected light of the optical signal from the semiconductor element is not returned to the semiconductor element. [0005] As shown in FIG. 5, a method of joining the translucent member 61 into the insertion hole 59 of the metal fixing member 60 is as follows.
The insertion hole 59 is changed from the large-diameter hole 62 to the small-diameter hole 63, and the step portion 64 is formed by providing an angle α between the axis of the large-diameter hole 62 and the axis of the small-diameter hole 63. The translucent member 61 is placed on the step portion 64 via a low-temperature brazing filler metal, can be inserted along the large-diameter hole 62, and has a block body 65 whose tip abuts the translucent member 61, A pressing body 66 that is provided separately from the body 65 and applies a load to the block body 65 in the horizontal direction.
The metal fixing member 60 is heated while being pressed by a bonding jig 67 having the surface shape of each of the connection portions with a vertical plane.
Brazed. In this optical communication package 50, a semiconductor element is mounted in a cavity 54, and the semiconductor element is connected to a conductor wiring pattern 56 on the cavity 54 side of the feedthrough substrate 55 by a bonding wire or the like. 57 and the semiconductor element are made conductive. After the optical fiber member is connected to the metal fixing member 60, a lid 68 made of metal or the like is joined to the upper surface of the seal ring 53 by brazing or welding to form an optical semiconductor module. The module is fixed to a board or the like with a screw or the like through a fixing hole 69. However, the conventional method for manufacturing an optical communication package as described above has the following problems. (1) The translucent member joined to the insertion hole of the metal fixing member joined to the through hole formed in the frame of the optical communication package is blocked by a load from the pressing body of the joining jig. When the translucent member is pressed against the step portion through the body, it cannot move on the connection surface between the pressing body and the block body,
Unevenness occurs in the pressing, and it is not possible to apply pressure uniformly over the entire circumference of the step. Therefore, a partial lift is generated between the translucent member and the stepped portion, thereby causing a bonding failure. (2) Since the axis of the block body of the joining jig is manufactured with a determined angle with respect to the horizontal direction, the alignment in the rotational direction when the block body is brought into contact with the translucent member is performed. Is difficult and it takes time to make accurate contact. The present invention has been made in view of the above circumstances, and provides a method for manufacturing an optical communication package that easily and surely joins a light-transmitting member to a bending portion in an insertion hole of a metal fixing member. With the goal. According to the present invention, there is provided a method of manufacturing an optical communication package according to the present invention, wherein a cavity for mounting a semiconductor element for optical communication is made of a metal frame. And a bottom body, a through hole communicating with the cavity portion is formed in the side surface of the frame body, and a cylindrical metal fixing member having a bending portion whose axis changes in the middle of the insertion hole is joined to the through hole. In addition, in a method for manufacturing an optical communication package in which a light transmitting member for making the insertion hole face the tip of the optical fiber is joined to the bending portion using a joining jig, one side of the insertion hole of the metal fixing member penetrates. The insertion hole is formed by a small-diameter hole having a first axis which is the same as the axis of the hole, and the other side of the insertion hole is formed by a large-diameter hole having a second axis having an angle with respect to the first axis. From small hole formed to large hole A first step of placing the translucent member on the step portion through the low-temperature brazing material, a block body abutting on the translucent member, and a pressing body that is provided separately from the block body and weights the block body. The surface shape of each of the connection parts is a convex spherical surface and a concave spherical surface,
Alternatively, a second step of preparing a joining jig composed of a convex spherical surface and a concave conical surface, and weighting the block body with a pressing body, heating the light-transmissive member while uniformly pressing it with the block body, and joining the step to the step portion A third step of performing As a result, the connection surface between the pressing body and the block body slides and moves, so that the weight from the pressing body can uniformly press the light transmitting member via the block body, and the light transmitting member can be easily and surely pressed. It can be joined to a metal fixing member. In addition, since the connection surface between the pressing body and the block body is in point contact, and the external shape of the block body has no directionality, it does not require any special alignment work of the joining jig, so that the optical communication system can be used for optical communication. A package can be made. [0008] Next, an embodiment of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. FIGS. 1A and 1B are plan views of an optical communication package manufactured by a method for manufacturing an optical communication package according to an embodiment of the present invention.
2A to 2C are explanatory views of a method of manufacturing the same optical communication package, and FIG. 3 is an explanatory view of another method of manufacturing the same optical communication package. As shown in FIGS. 1A and 1B, an optical communication package 10 manufactured by a method for manufacturing an optical communication package according to an embodiment of the present invention includes a metal frame 11.
And a fixing hole 1 to be attached to a board etc.
2 is provided with a cavity 14 for mounting a semiconductor element for optical communication by brazing and joining a metal bottom body 13 provided with the semiconductor element 2 with a high-temperature brazing material. A window frame-shaped notch communicating with the cavity 14 is provided on the opposite side surface of the frame 11, and a feed-through substrate 15 made of ceramic is provided on the inner peripheral wall surface of the window frame-shaped notch. It is brazed with material. A ring-shaped metal seal ring 16 is brazed to the upper surfaces of the frame 11 and the feed-through board 15 with a high-temperature brazing material.
The feed-through board 15 includes a conductor wiring pattern 17,
17a is formed, and the conductor wiring pattern 17 on the cavity portion 14 side is connected to the semiconductor element via a bonding wire or the like. Further, an external connection terminal 18 made of a metal member for making an electrical connection from the outside is brazed and joined to the conductor wiring pattern 17a outside the frame body 11 with a high-temperature brazing material in a butterfly shape. On one side surface of the frame body 11 to which the feed-through board 15 is not joined, a through-hole 19 communicating with the cavity 14 is provided. The member 20 is inserted and joined to the frame 11 with a brazing material, a resin, or the like. Metal fixing member 20
Has a bending portion whose axis changes in the middle of the insertion hole 21, and a light transmitting member 22 for facing the tip of an optical fiber (not shown) is formed on the bending portion at a low temperature made of wax, solder, or the like. Joined with brazing material. Next, a method of manufacturing the optical communication package 10 according to one embodiment of the present invention will be described. Cutting metal lumps such as KV (Fe-Ni-Co alloy, trade name "Kovar") whose thermal expansion coefficient is close to that of ceramics, 42 alloy (Fe-Ni alloy), or pipe shape The formed member is sliced and then pressed and bent to form the frame 11. On the other hand, a bottom body 13 having a fixing hole 12 for mounting to a mounting member such as a board with a screw is Cu-W (porous tungsten impregnated with copper or the like) which is excellent in radiating heat generated from a semiconductor element. ) Or a metal plate such as Cu-Mo-Cu (joining plate having a three-layer structure of copper-molybdenum-copper). Further, a seal ring 16 for connecting to the upper outer periphery of the frame body 11 is formed by punching a metal plate made of KV, 42 alloy or the like. The frame body 11 and the bottom body 13 or the frame body 11 and the seal ring 16 are heated, for example, with a high-temperature brazing material such as Ag-Cu brazing sandwiched between joining portions and brazed.
A cavity 14 for mounting a semiconductor element such as a laser diode or a photodiode for optical communication is formed therein. A window frame-shaped notch communicating with the cavity portion 14 is formed on the opposing side surfaces of the frame body 11, and a feed-through board 15 made of ceramic is formed in the window frame-shaped notch. A high-temperature brazing material such as Ag-Cu brazing is sandwiched between the joints and heated to be brazed. The seal ring 16 is brazed after or at the same time that the feed-through board 15 is joined to the frame 11. The feed-through substrate 15 is formed of a ceramic wiring sheet made of a ceramic such as alumina (Al ₂ O ₃ ) as an insulator, and conductor wiring patterns 17 and 17a made of a refractory metal such as tungsten or molybdenum.
Is formed, and the ceramic green sheets are laminated and fired. Note that the conductor wiring pattern is also formed on the outer peripheral portion of the feed-through board 15 which comes into contact with the window frame-shaped notch, whereby the feed-through board 15 is fitted into the window frame-shaped notch and brazed. It is possible to join. The external connection terminal 18 abuts on the conductor wiring pattern 17a outside the frame 11 in a butterfly shape, and is brazed and joined with a high-temperature brazing material such as Ag-Cu brazing. On the other hand, the conductor wiring pattern 1 in the cavity 14
Reference numeral 7 is used to connect the semiconductor device with a bonding wire or the like. Next, the joining of the translucent member 22 to the metal fixing member 20 will be described with reference to FIGS. First, as a first step, as shown in FIG. 2A, a substantially circular through hole communicating with the cavity portion 14 is formed in one side surface of the frame body 11 to which the feedthrough substrate 15 is not joined. A metal fixing member 20 made of a cylindrical KV or a 42 alloy having a bending portion 23 whose axis changes in the middle of an insertion hole 21 serving as an entrance and exit of light of an optical fiber is formed of Ag-Cu solder. , A low-temperature brazing material such as Au-Sn brazing, solder, or a joining material 24 such as resin. The insertion hole 21 of the metal fixing member 20 has a small-diameter hole 26 in which the first axis 25 is substantially the same as the axis of the through-hole 19 in one opening, and a first axis in the other opening. 25 is formed by a large-diameter hole 28 having a second axis 27 having an angle α with respect to 25. The metal fixing member 20 is provided with a small-diameter hole 26 in a bending portion 23 which is an intersection of the first axis 25 and the second axis 27.
A large-diameter hole 28 forms a step 29. Then, as shown in FIG. 2B, a translucent member 22 made of a flat lens such as optical glass or the like is attached to the stepped portion 29 at the joining portion with an Au-Sn brazing material, an Au-Ge brazing material, or a soldering material. The low-temperature brazing material 30 made of, for example, is interposed therebetween. Next, as shown in FIG. 2 (C), as a second step, a block body 31 abutting on the light transmitting member 22 is formed.
Pressing body 32 provided separately from block body 31
A joining jig 33 prepared using a metal member such as stainless steel having a convex spherical surface and a concave spherical surface for each of the connection portions is prepared. Then, as a third step, the block body 31 is weighted by the pressing body 32 provided with a gravitational force by an Inconel coil spring or the like, and the translucent member 22 is heated while being pressed by the block body 31, and the low-temperature brazing material 30 is applied to the step portion 29. And brazing. As a result, in the insertion hole 21 of the metal fixing member 20, a light transmitting member 22 for passing the optical signal and closing the insertion hole 21 and keeping the cavity portion 14 airtight is joined, and at the same time, the insertion hole 21 is formed. Refraction part 23 inside
Thus, the axis of the insertion hole 21 can be changed, and the reflected light of the optical signal from the semiconductor element cannot be returned to the semiconductor element. In addition, the block 3 of the joining jig 33
As for the respective surface shapes of the connection portions of the block 1 and the pressing body 32, the connection surface of the block body 31 may be a convex spherical surface, and the connecting surface of the pressing body 32 may be a concave spherical surface. Next, as shown in FIG. 3, a joining jig 33a for joining the translucent member 22 to the step portion 29 of the metal fixing member 20 includes a block body 31a which comes into contact with the translucent member 22. The surface shape of each connection portion of the pressing body 32 provided separately from the block body 31a may have a convex spherical surface and a concave conical surface. Further, the connecting portion surface of the block body 31a may be a concave conical surface, and the connecting portion surface of the pressing body 32 may have a convex spherical surface. According to a first aspect of the present invention, there is provided a method for manufacturing an optical communication package, wherein one side of an insertion hole is formed by a small diameter hole having a first axis which is the same as the axis of the through hole, and the other of the insertion hole. A low-temperature brazing material is formed on a step formed by a large-diameter hole having a second axis having an angle with respect to the first axis and having a second axis formed from a small-diameter hole formed in the refraction portion to a large-diameter hole. The step of mounting via, the pressing portion that comes into contact with the translucent member, the shape of the connection surface of each of the weighted portions that are provided separately from the pressing portion and that weights the pressing portion is a convex spherical surface and a concave spherical surface, or A step of preparing a joining jig composed of a convex spherical surface and a concave conical surface, and a step of applying pressure to the pressing portion with a weight portion, heating the light-transmissive member while uniformly pressing the pressing member with the pressing portion, and joining the translucent member to the step portion. The surface of the connecting part between the pressing body and the block body slides and moves, so that it has translucency. The member can be pressed uniformly, and the light transmitting member can be easily and reliably joined to the metal fixing member.
Also, the connection surface between the pressing body and the block body is in point contact,
The external shape of the block body has no directionality, and the positioning of the joining jig can be easily performed.

BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A and 1B are plan views of an optical communication package manufactured by a method for manufacturing an optical communication package according to an embodiment of the present invention, and FIGS. FIG. FIGS. 2A to 2C are diagrams illustrating a method of manufacturing the optical communication package. FIG. 3 is an explanatory diagram of another manufacturing method of the optical communication package. FIG. 4 is a perspective view of an optical communication package manufactured by a conventional method for manufacturing an optical communication package. FIG. 5 is an explanatory diagram of a conventional method for manufacturing an optical communication package. [Description of Signs] 10: Optical communication package, 11: Frame, 12: Fixing hole, 13: Bottom, 14: Cavity, 15: Feedthrough board, 16: Seal ring, 17, 17a: Conductor wiring Pattern, 18: external connection terminal, 19: through hole, 2
0: metal fixing member, 21: insertion hole, 22: translucent member, 23: bending portion, 24: joining material, 25: first axis,
26: small diameter hole, 27: second axis, 28: large diameter hole, 2
9: stepped portion, 30: low-temperature brazing material, 31, 31a: holding portion, 32: weighted portion, 33, 33a: joining jig,

Claims (1)

Claims: 1. A cavity for mounting a semiconductor element for optical communication therein is formed by a metal frame and a bottom,
A through hole communicating with the cavity portion is formed in a side surface portion of the frame, and a cylindrical metal fixing member having a bending portion whose axis changes in the middle of the insertion hole is joined to the through hole.
In the method for manufacturing an optical communication package in which a translucent member for making the insertion hole face the tip of an optical fiber is joined to the bending portion using a joining jig, one of the insertion holes of the metal fixing member is provided. The side is formed by a small diameter hole having a first axis which is the same as the axis of the through hole, and the other side of the insertion hole is formed by a large diameter hole having a second axis having an angle with respect to the first axis. A first step of placing the translucent member via a low-temperature brazing material on a step formed from the small-diameter hole to the large-diameter hole formed in the refraction portion.
Step, the block body abutting on the translucent member, the surface shape of each of the connection portion of the pressing body that is provided separately from the block body and weights the block body is a convex spherical surface and a concave spherical surface, or A second step of preparing the joining jig composed of a convex spherical surface and a concave conical surface, and heating the block body by pressing the block body with the pressing body while uniformly pressing the translucent member with the block body. A method for manufacturing an optical communication package, comprising a third step of bonding to the step portion.