CN201130926Y - Ceramic packing piece for SMD crystal resonator - Google Patents
Ceramic packing piece for SMD crystal resonator Download PDFInfo
- Publication number
- CN201130926Y CN201130926Y CNU200720171689XU CN200720171689U CN201130926Y CN 201130926 Y CN201130926 Y CN 201130926Y CN U200720171689X U CNU200720171689X U CN U200720171689XU CN 200720171689 U CN200720171689 U CN 200720171689U CN 201130926 Y CN201130926 Y CN 201130926Y
- Authority
- CN
- China
- Prior art keywords
- crystal
- common burning
- porcelain layer
- burning porcelain
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 47
- 239000000919 ceramic Substances 0.000 title claims abstract description 46
- 238000012856 packing Methods 0.000 title 1
- 238000007639 printing Methods 0.000 claims abstract description 4
- 229910052573 porcelain Inorganic materials 0.000 claims description 43
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model relates to a ceramic package technique for a crystal resonator, in particular to a ceramic package used for a SMD crystal resonator. The utility model is characterized in that comprising a co-fired ceramic layer and a ceramic cover plate, the ceramic layer comprises a first co-fired ceramic layer and a second co-fired ceramic layer which are folded each other, the ceramic cover plate is positioned on the upper cover of the second co-fired ceramic layer, a boss made by printing is positioned on the upper side of a first co-fired ceramic layer, the main function of the boss is to support the crystal and to make the electrode on the crystal communicating with a soldering pad on the bottom surface through a through hole on the first co-fired ceramic layer, the first co-fired ceramic layer periphery is provided with a through hole for communicating the soldering pad on the bottom surface with a resonant crystal. The ceramic package technique has the advantages of simplifying the ceramic process, reducing production cost, deleting the gas protection brazing process and the frame material, decreasing the metal plating area and the number of the through holes and the electric wiring length, and improving the electric properties of the product.
Description
Technical field
The utility model relates to a kind of ceramic packaging technology of crystal resonator, refers more particularly to a kind of SMD crystal resonator ceramic package.
Background technology
Crystal resonator mainly is plastics and metallic packaging at present, because the requirement of electronical elements surface mounting technology (SMT) and miniaturization, part has the SMD of use ceramic packaging to the high high-order product of reliability requirement, the principal element that hinders the popularization of SMD ceramic packaging is that the cost of ceramic packaging is too high, and the postorder sealing process will use parallel soldering and sealing, can make equipment investment too big like this.Existing crystal resonator configurations such as Fig. 1 are to shown in Figure 6, the common burning porcelain layer is made up of the first common burning porcelain layer (a) that is superimposed, the second common burning porcelain layer (b) and the 3rd common burning porcelain layer (c), the common burning porcelain layer is an aluminium oxide ceramics, metal turns to tungsten (W) or molybdenum (Mo), soldering one deck can cut down (Kovar) frame (6) on the 3rd common burning porcelain layer, after resonant crystal (7) installation, parallel again soldering and sealing one deck can cut down cover plate (5).It also comprises bottom surface pad (1,2,3,4) in addition, conducting resinl (8), inner via hole (9), plane conductive layer (10) and edge via (11).
The weak point of existing crystal resonator ceramic packaging structure is: its product design and complex manufacturing, the production cost height has hindered applying of SMD ceramic packaging.It is as described below to trace it to its cause: a. ceramic layer is made of three layers of common burning porcelain structure, the product design complexity, and operation is various, technology cost height.B. adopt and can cut down mount structure, need be with Ag/Cu scolder soldering, material and technology cost height under atmosphere protection.C. it is too many to be exposed to outer metal part, needs the area of electrogilding big, gold-plated cost height.D. the user must buy when using this encapsulation and can cut down cover plate, uses Parallel Seam Sealing Technology, and equipment investment reaches the production cost height greatly.
Based on the weak point of the general encapsulation technology of above-mentioned crystal resonator, the inventor has designed the utility model " a kind of SMD crystal resonator ceramic package ".
The utility model content
The utility model at above-mentioned the deficiencies in the prior art technical problem to be solved is: provide a kind of and reduce production costs, promote the popularization of SMD crystal resonator ceramic packaging, improve the reliability of crystal resonator and satisfy SMT and SMD crystal resonator ceramic package that miniaturization requires.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of SMD crystal resonator ceramic package, comprise common burning porcelain layer and ceramic cover plate, described common burning porcelain layer is made up of the first common burning porcelain layer that is superimposed and the second common burning porcelain layer, be provided with one in order to hold the cavity of crystal in the second common burning porcelain layer, be covered with one deck ceramic cover plate in the top of the second common burning porcelain layer, support crystal and the boss of the electrode on the resonant crystal in the upside of the first common burning porcelain layer being used to of being provided with that printing forms by via on the ground floor and bottom surface pad conducting, wherein boss comprises that the support rim that is used for support function and two are used to conduct electricity and the support conducting boss of support function, the main effect of support rim is exactly for resonant crystal provides oscillation space, is provided with the via that is used for conducting bottom surface pad and resonant crystal in the periphery of the first common burning porcelain layer.
The upside of the described first common burning porcelain layer also is provided with a plane conductive layer.
Described via is edge via or inner via hole.
A kind of SMD crystal resonator of the utility model with the beneficial effect of ceramic package is:
A. the crystal oscillation on the ceramic packaging adopts typography to make with boss, and common burning porcelain flaggy number reduces to 2 layers, simplification common burning porcelain technology, minimizing production cost from 3 layers.
B. remove and to cut down frame and can cut down cover plate, and use ceramic cover plate low temperature glass or resin-sealed.Reduce the atmosphere protection soldering processes and reduced and to have cut down frame material, reduced production cost.
C. design is gone up and is reduced the metal part that exposes, thereby has reduced gold-plated area, has reduced production cost.Reduced the quantity of via and the length of conducting wiring simultaneously, the product electrical property is improved.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is the front view of existing crystal resonator ceramic packaging (not with cutting down cover plate);
Fig. 2 is the cross-sectional view of existing crystal resonator;
Fig. 3 is the front view of the first common burning porcelain layer of existing crystal resonator;
Fig. 4 is the lateral side view of the first common burning porcelain layer of existing crystal resonator;
Fig. 5 is the front view of the second common burning porcelain layer of existing crystal resonator;
Fig. 6 is the front view of the 3rd common burning porcelain layer of existing crystal resonator;
Fig. 7 is the front view of the utility model embodiment one (not with ceramic cover plate);
Fig. 8 is the utility model embodiment one cross-sectional view of (comprising crystal);
Fig. 9 is the rear structure schematic diagram of the utility model embodiment one;
Figure 10 is the front view of the second common burning porcelain layer among the utility model embodiment one;
Figure 11 is the front view of the first common burning porcelain layer among the utility model embodiment one;
Figure 12 is the front view of the utility model embodiment two (not with ceramic cover plate);
Figure 13 is the utility model embodiment two cross-sectional view of (comprising crystal);
Figure 14 is the rear structure schematic diagram of the utility model embodiment two;
Figure 15 is the front view of the second common burning porcelain layer among the utility model embodiment two;
Figure 16 is the front view of the first common burning porcelain layer among the utility model embodiment two.
Embodiment
With reference to Fig. 7 to Figure 16, the utility model is to implement like this:
A kind of SMD crystal resonator ceramic package, comprise bottom surface pad 1 and bottom surface pad 2, common burning porcelain layer and ceramic cover plate 3, described common burning porcelain layer is made up of the first common burning porcelain layer a that is superimposed and the second common burning porcelain layer b, be provided with a ceramic cover plate 3 in the top of the second common burning porcelain layer b, support crystal and the boss of the electrode on the resonant crystal 4 in the upside of the first common burning porcelain layer a being used to of being provided with that printing forms by via on the ground floor and bottom surface pad conducting, wherein boss comprises that the support rim C that is used for support function and two are used to conduct electricity and the support conducting boss A of support function, B, the main effect of support rim C is exactly to provide oscillation space for resonant crystal 4, be provided with in the periphery of the first common burning porcelain layer a and be used for conducting bottom surface pad 1,2 and the via 6 of resonance crystal 4, via 6 is edge vias in the present embodiment, and it also can be inner via hole.
The upside of the first common burning porcelain layer a also is provided with a plane conductive layer 7 in the present embodiment.
The above, only be of the preferred embodiment of a kind of SMD crystal resonator of the utility model with ceramic package, be not that technical scope of the present utility model is imposed any restrictions, every foundation technical spirit of the present utility model all still belongs in the scope of the utility model technology any trickle modification, equivalent variations and modification that top embodiment did.
Claims (3)
1, a kind of SMD crystal resonator ceramic package, comprise common burning porcelain layer and ceramic cover plate, of the present utility model being characterised in that: described common burning porcelain layer is made up of the first common burning porcelain layer that is superimposed and the second common burning porcelain layer, be provided with one in order to hold the cavity of crystal in the second common burning porcelain layer, be covered with one deck ceramic cover plate in the top of the second common burning porcelain layer, support crystal and the boss of the electrode on the crystal in the upside of the first common burning porcelain layer being used to of being provided with that printing forms, be provided with the via that is used for conducting bottom surface pad and resonant crystal in the periphery of the first common burning porcelain layer by via on the ground floor and bottom surface pad conducting.
2, a kind of SMD crystal resonator ceramic package according to claim 1 is characterized in that the upside of the described first common burning porcelain layer also is provided with a plane conductive layer.
3, a kind of SMD crystal resonator ceramic package according to claim 1 is characterized in that described via is edge via or inner via hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720171689XU CN201130926Y (en) | 2007-09-19 | 2007-09-19 | Ceramic packing piece for SMD crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200720171689XU CN201130926Y (en) | 2007-09-19 | 2007-09-19 | Ceramic packing piece for SMD crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201130926Y true CN201130926Y (en) | 2008-10-08 |
Family
ID=40018794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200720171689XU Expired - Lifetime CN201130926Y (en) | 2007-09-19 | 2007-09-19 | Ceramic packing piece for SMD crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201130926Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012045214A1 (en) * | 2010-10-08 | 2012-04-12 | 潮州三环（集团）股份有限公司 | Ceramic packaging base having convex platforms |
| CN103840788A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Energy-storage-soldered ceramic packaging shell and crystal oscillator using shell |
| CN103840790A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Cold pressure welding ceramic package case and crystal oscillator using the same |
| CN103956344A (en) * | 2014-04-01 | 2014-07-30 | 中国电子科技集团公司第五十五研究所 | Ceramic pipe cap suitable for parallel sealing process and manufacturing method of ceramic pipe cap suitable for parallel sealing process |
-
2007
- 2007-09-19 CN CNU200720171689XU patent/CN201130926Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012045214A1 (en) * | 2010-10-08 | 2012-04-12 | 潮州三环（集团）股份有限公司 | Ceramic packaging base having convex platforms |
| CN103840788A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Energy-storage-soldered ceramic packaging shell and crystal oscillator using shell |
| CN103840790A (en) * | 2012-11-26 | 2014-06-04 | 苏州工业园区阳晨封装技术有限公司 | Cold pressure welding ceramic package case and crystal oscillator using the same |
| CN103956344A (en) * | 2014-04-01 | 2014-07-30 | 中国电子科技集团公司第五十五研究所 | Ceramic pipe cap suitable for parallel sealing process and manufacturing method of ceramic pipe cap suitable for parallel sealing process |
| CN103956344B (en) * | 2014-04-01 | 2017-03-08 | 中国电子科技集团公司第五十五研究所 | A kind of ceramic pipe cap of suitable Parallel Seam Sealing Technology and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHAOZHOU SANHUAN ( GROUP ) CO., LTD. Free format text: FORMER OWNER: YANG SHAOHUA Effective date: 20090327 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090327 Address after: Comprehensive building of three ring industrial city, Feng Tang, Guangdong, Chaozhou Province, China: 515646 Patentee after: Chaozhou Three-Circle (Group) Co., Ltd. Address before: Building 7, building 205, Che Kung Temple Industrial Zone, Shenzhen, Guangdong, Futian District 518000, China Patentee before: Yang Shaohua |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081008 |