WO2012045214A1 - Ceramic packaging base having convex platforms - Google Patents

Ceramic packaging base having convex platforms Download PDF

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Publication number
WO2012045214A1
WO2012045214A1 PCT/CN2010/078165 CN2010078165W WO2012045214A1 WO 2012045214 A1 WO2012045214 A1 WO 2012045214A1 CN 2010078165 W CN2010078165 W CN 2010078165W WO 2012045214 A1 WO2012045214 A1 WO 2012045214A1
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WO
WIPO (PCT)
Prior art keywords
package
ceramic
boss
support
convex platforms
Prior art date
Application number
PCT/CN2010/078165
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French (fr)
Chinese (zh)
Inventor
邱基华
刘建伟
Original Assignee
潮州三环（集团）股份有限公司
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Publication date
Application filed by 潮州三环（集团）股份有限公司 filed Critical 潮州三环（集团）股份有限公司
Publication of WO2012045214A1 publication Critical patent/WO2012045214A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the utility model belongs to a semiconductor package carrier, in particular to a ceramic package base with a boss.
  • the existing ceramic package base includes a package substrate; a circuit layout layer on the package substrate, including at least one metal paste region disposed on the package substrate; and a package sidewall layer located on the circuit layout layer
  • the inner surface of the ceramic package base cavity is defined on the circumference; at least two support layers are disposed on both sides of the circuit layout layer exposed from the side wall layer of the package to support the crystal; the support layer is also It can be composed of a metal paste boss disposed on the circuit layout layer; a cover supporting layer is located on the package sidewall layer.
  • the disadvantage of the prior art is that the supporting layer for supporting the crystal is formed by punching the shaped cavity by ceramics, the process is complicated, and the number of layers of the laminated layer is increased, which does not conform to the trend of miniaturization of the chip type crystal element; or the supporting layer is composed of
  • the metal paste is directly printed on the boss, and the process is relatively simple.
  • the metal paste is a conductor
  • the one end of the bump supports the crystal, and may contact the electrode on the crystal to cause an increase in parasitic capacitance, which adversely affects electrical properties.
  • the technical solution of the present invention is: a ceramic package base with a boss, comprising a package substrate and a plurality of support bosses disposed on the package substrate, wherein the support protrusions electrically connected to the electrodes
  • the table is a metal supporting boss, and the other supporting bosses are insulating supporting bosses, and the metal supporting bosses and the insulating supporting bosses are printed on the package substrate.
  • part of the support bosses are formed of an insulating material, which can effectively avoid the contact of the silver layer coated on the crystal surface supported by the crystal, thereby increasing the parasitic capacitance and improving the electrical performance of the device.
  • the insulating support boss is a ceramic support boss.
  • a package fixing layer is further disposed on the package substrate.
  • the package fixing layer includes a package sidewall layer and a cover supporting layer which are sequentially disposed on the package substrate.
  • the support boss used as the electrode is prepared by printing a ceramic slurry, and the process is greatly simplified compared to the production of the support boss by the laminated ceramic or dry press molding, which simplifies the lamination process and at the same time the mold cost. It is also greatly reduced, that is, no cavity forming die or dry pressing die; and the performance can fully reach the level of the previous method, and due to the reduction of the stacking of the ceramic layer, the overall thickness of the product can be ensured under the premise of ensuring the packaging requirements. Greatly thinned, in line with the development trend of today's electronic components miniaturization.
  • FIG. 1 is a schematic structural view of a ceramic package base with a boss according to the present invention
  • FIG. 2 is another schematic structural view of a ceramic package base with a boss according to the present invention.
  • FIG. 3 is a schematic cross-sectional structural view of a ceramic package base with a boss according to the present invention.
  • Figure 4 is a schematic view showing the structure of the support boss of the present invention.
  • the utility model discloses a ceramic package base with a boss, comprising a package substrate 1 and a plurality of support bosses 2 and 3 disposed on the package substrate 1 , and a part of the support bosses 2 is The metal material is formed, and the other support bosses 3 are formed of an insulating material.
  • the metal support boss 2 is determined according to the needs of the circuit, according to the size of the package chip to determine its position and metal material.
  • the other supporting bosses 3 are formed of an insulating material, which can effectively avoid the contact of the silver layer coated on the crystal surface supported by the crystal, thereby increasing the parasitic capacitance and improving the electrical performance of the device.
  • the insulating material is a ceramic material.
  • the ceramic support boss 3 is printed on the package substrate 1, and the metal support boss 2 is printed on the package substrate 1.
  • the package substrate 1 further includes a package fixing layer, and the package fixing layer includes a package sidewall layer 41 and a cover supporting layer 42 which are sequentially disposed on the package substrate.
  • the package fixing layer includes a package sidewall layer 41 and a cover supporting layer 42 which are sequentially disposed on the package substrate.

Abstract

A ceramic packaging base having convex platforms is provided, which includes a packaging base body(1) and multiple supporting convex platforms(2,3) provided on the packaging base body(1), wherein, parts of supporting convex platforms are insulating convex platforms (3), and other parts of supporting convex platforms are metallic convex platforms (2). The insulating convex platforms (3) are made of ceramic material formed on the packaging base body (1) by printing process. Using the ceramic packaging base, stack of ceramic layers can be effectively decreased and electrical performance can be effectively improved.

Description

带凸台的陶瓷封装基座Ceramic package base with boss
技术领域 Technical field
本实用新型属于半导体封装载体，尤其涉及一种带凸台的陶瓷封装基座。 The utility model belongs to a semiconductor package carrier, in particular to a ceramic package base with a boss.
背景技术 Background technique
现有的陶瓷封装基座包括一封装基底；一线路布局层，位于该封装基底之上，包括设置于该封装基底上的至少一个金属浆料区；一封装侧壁层，位于该线路布局层四周上，界定出该陶瓷封装基座腔体之内尺寸；至少二支撑层，分设于自该封装侧壁层所显露出之该线路布局层之两侧上，以支撑晶体用；支撑层亦可由设置于该线路布局层的金属浆料凸台构成；一盖体支撑层，位于该封装侧壁层上。 The existing ceramic package base includes a package substrate; a circuit layout layer on the package substrate, including at least one metal paste region disposed on the package substrate; and a package sidewall layer located on the circuit layout layer The inner surface of the ceramic package base cavity is defined on the circumference; at least two support layers are disposed on both sides of the circuit layout layer exposed from the side wall layer of the package to support the crystal; the support layer is also It can be composed of a metal paste boss disposed on the circuit layout layer; a cover supporting layer is located on the package sidewall layer.
现有技术的缺点是：支撑晶体用的支撑层由陶瓷冲制异形腔而成，工艺复杂，增加了叠层的层数，不符合片式晶体元件向小型化发展的趋势；或者支撑层由金属浆料直接印刷凸台而成，工艺相对简单，但由于金属浆料是导体，一端凸台支撑晶体时可能与晶体上的电极接触而导致寄生电容增大，对电性能造成不良影响。 The disadvantage of the prior art is that the supporting layer for supporting the crystal is formed by punching the shaped cavity by ceramics, the process is complicated, and the number of layers of the laminated layer is increased, which does not conform to the trend of miniaturization of the chip type crystal element; or the supporting layer is composed of The metal paste is directly printed on the boss, and the process is relatively simple. However, since the metal paste is a conductor, the one end of the bump supports the crystal, and may contact the electrode on the crystal to cause an increase in parasitic capacitance, which adversely affects electrical properties.
实用新型内容 Utility model content
针对现有技术的缺点，本实用新型的目的是提供一种有效减少陶瓷层的堆叠及提高电性能的带凸台的陶瓷封装基座。 In view of the disadvantages of the prior art, it is an object of the present invention to provide a ceramic package base with a boss that effectively reduces the stacking of ceramic layers and improves electrical performance.
为实现上述目的，本实用新型的技术方案为：一种带凸台的陶瓷封装基座，包括封装基底以及多个设置于封装基底之上的支撑凸台，其中，与电极电连接的支撑凸台为金属支撑凸台，其它支撑凸台为绝缘支撑凸台，金属支撑凸台及绝缘支撑凸台通过在封装基底上印刷而成。 In order to achieve the above object, the technical solution of the present invention is: a ceramic package base with a boss, comprising a package substrate and a plurality of support bosses disposed on the package substrate, wherein the support protrusions electrically connected to the electrodes The table is a metal supporting boss, and the other supporting bosses are insulating supporting bosses, and the metal supporting bosses and the insulating supporting bosses are printed on the package substrate.
本方案中，部分支撑凸台采用绝缘材料形成，能有效避免其所支撑的晶体表面涂布的银层接触而导致寄生电容增大，提高了器件的电性能。 In this solution, part of the support bosses are formed of an insulating material, which can effectively avoid the contact of the silver layer coated on the crystal surface supported by the crystal, thereby increasing the parasitic capacitance and improving the electrical performance of the device.
进一步地，该绝缘支撑凸台为陶瓷支撑凸台。 Further, the insulating support boss is a ceramic support boss.
进一步地，该封装基底上还设有封装固定层。 Further, a package fixing layer is further disposed on the package substrate.
具体地，该封装固定层包括依次设于封装基底上的封装侧壁层及盖体支撑层。 Specifically, the package fixing layer includes a package sidewall layer and a cover supporting layer which are sequentially disposed on the package substrate.
与现有技术相比较，本实用新型的效果在于， Compared with the prior art, the effect of the utility model is that
将除作为电极用途的支撑凸台以印刷陶瓷浆料的方法来制作，相比之于以叠层陶瓷或干压成型制作支撑凸台，工艺上大大简化，简化了叠层工艺，同时模具成本也大大降低，即无腔体成型冲模或干压成型模；而性能上完全能达到之前方法制作的水平，并且由于减少了陶瓷层的堆叠，产品的整体厚度在保证封装要求的前提下还可以大大减薄，符合当今电子元器件小型化的发展趋势。 The support boss used as the electrode is prepared by printing a ceramic slurry, and the process is greatly simplified compared to the production of the support boss by the laminated ceramic or dry press molding, which simplifies the lamination process and at the same time the mold cost. It is also greatly reduced, that is, no cavity forming die or dry pressing die; and the performance can fully reach the level of the previous method, and due to the reduction of the stacking of the ceramic layer, the overall thickness of the product can be ensured under the premise of ensuring the packaging requirements. Greatly thinned, in line with the development trend of today's electronic components miniaturization.
附图说明 DRAWINGS
图1 为 本实用新型带凸台的陶瓷封装基座的一种结构示意图； 1 is a schematic structural view of a ceramic package base with a boss according to the present invention;
图2 为本实用新型带凸台的陶瓷封装基座的另一种结构示意图； 2 is another schematic structural view of a ceramic package base with a boss according to the present invention;
图3 为本实用新型带凸台的陶瓷封装基座的剖面结构示意图； 3 is a schematic cross-sectional structural view of a ceramic package base with a boss according to the present invention;
图4 为本实用新型支撑凸台的结构示意图 Figure 4 is a schematic view showing the structure of the support boss of the present invention
具体实施方式 detailed description
以下结合实施例及附图对本实用新型进行详细的描述。 The present invention will be described in detail below with reference to the embodiments and the accompanying drawings.
实施例1 Example 1
如图1所示，本实用新型公开了一种带凸台的陶瓷封装基座，包括封装基底1以及多个设置于封装基底1之上的支撑凸台2、3，部分支撑凸台2为金属材料形成，其他支撑凸台3为绝缘材料形成。其中，金属支撑凸台2是根据电路的需要，按封装芯片的尺寸来决定其位置及金属材质的。 As shown in FIG. 1 , the utility model discloses a ceramic package base with a boss, comprising a package substrate 1 and a plurality of support bosses 2 and 3 disposed on the package substrate 1 , and a part of the support bosses 2 is The metal material is formed, and the other support bosses 3 are formed of an insulating material. Among them, the metal support boss 2 is determined according to the needs of the circuit, according to the size of the package chip to determine its position and metal material.
本方案中，其他支撑凸台3采用绝缘材料形成，能有效避免其所支撑的晶体表面涂布的银层接触而导致寄生电容增大，提高了器件的电性能。 In the present solution, the other supporting bosses 3 are formed of an insulating material, which can effectively avoid the contact of the silver layer coated on the crystal surface supported by the crystal, thereby increasing the parasitic capacitance and improving the electrical performance of the device.
进一步地，该绝缘材料为陶瓷材料。 Further, the insulating material is a ceramic material.
进一步地，该陶瓷支撑凸台3在位于封装基底1上印刷而成，该金属支撑凸台2在位于封装基底1上印刷而成。 Further, the ceramic support boss 3 is printed on the package substrate 1, and the metal support boss 2 is printed on the package substrate 1.
具体地，该封装基底1上还设有封装固定层，该封装固定层包括依次设于封装基底上的封装侧壁层41及盖体支撑层42。这样的结构，使得封装基座的结构更加牢固。 Specifically, the package substrate 1 further includes a package fixing layer, and the package fixing layer includes a package sidewall layer 41 and a cover supporting layer 42 which are sequentially disposed on the package substrate. Such a structure makes the structure of the package base more secure.

Claims (4)

  1. 一种带凸台的陶瓷封装基座，包括封装基底以及多个设置于封装基底之上的支撑凸台，其特征在于：与电极电连接的支撑凸台为金属支撑凸台，其它支撑凸台为绝缘支撑凸台，金属支撑凸台及绝缘支撑凸台通过在封装基底上印刷而成。A ceramic package base with a boss, comprising a package base and a plurality of support bosses disposed on the package base, wherein the support boss electrically connected to the electrodes is a metal support boss, and the other support bosses The insulating support bosses, the metal support bosses and the insulating support bosses are printed on the package substrate.
  2. 根据权利要求1所述的带凸台的陶瓷封装基座，其特征在于，该绝缘支撑凸台为陶瓷支撑凸台。The ceramic package base with a boss according to claim 1, wherein the insulating support boss is a ceramic support boss.
  3. 根据权利要求1或2所述的带凸台的陶瓷封装基座，其特征在于，该封装基底上还设有封装固定层。The ceramic package base with a boss according to claim 1 or 2, wherein the package substrate is further provided with a package fixing layer.
  4. 根据权利要求3所述的带凸台的陶瓷封装基座，其特征在于，该封装固定层包括依次设于封装基底上的封装侧壁层及盖体支撑层。The bumper-attached ceramic package base according to claim 3, wherein the package fixing layer comprises a package sidewall layer and a cover support layer which are sequentially disposed on the package substrate.
PCT/CN2010/078165 2010-10-08 2010-10-27 Ceramic packaging base having convex platforms WO2012045214A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201020552631.1 2010-10-08
CN 201020552631 CN201812808U (en) 2010-10-08 2010-10-08 Ceramic packaging base with boss

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WO2012045214A1 true WO2012045214A1 (en) 2012-04-12

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011157171A2 (en) * 2011-06-03 2011-12-22 华为技术有限公司 Insulating ring for packaging, insulating ring assembly and package
CN102956508B (en) * 2012-11-29 2015-06-24 中国电子科技集团公司第十三研究所 Laminating process and positioning tool of ceramic packaging shell with boss structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255851A (en) * 1995-03-17 1996-10-01 Toshiba Corp Semiconductor package
US20030124829A1 (en) * 1999-12-15 2003-07-03 Pace Benedict G. Interconnection method entailing protuberances formed by melting metal over contact areas
CN101132169A (en) * 2007-09-19 2008-02-27 杨绍华 Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof
CN201130926Y (en) * 2007-09-19 2008-10-08 杨绍华 Ceramic packing piece for SMD crystal resonator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08255851A (en) * 1995-03-17 1996-10-01 Toshiba Corp Semiconductor package
US20030124829A1 (en) * 1999-12-15 2003-07-03 Pace Benedict G. Interconnection method entailing protuberances formed by melting metal over contact areas
CN101132169A (en) * 2007-09-19 2008-02-27 杨绍华 Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof
CN201130926Y (en) * 2007-09-19 2008-10-08 杨绍华 Ceramic packing piece for SMD crystal resonator

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