CN201226592Y - Silicon microphone packaged by flexible circuit board - Google Patents
Silicon microphone packaged by flexible circuit board Download PDFInfo
- Publication number
- CN201226592Y CN201226592Y CNU2008200495593U CN200820049559U CN201226592Y CN 201226592 Y CN201226592 Y CN 201226592Y CN U2008200495593 U CNU2008200495593 U CN U2008200495593U CN 200820049559 U CN200820049559 U CN 200820049559U CN 201226592 Y CN201226592 Y CN 201226592Y
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- base plate
- soft base
- plate portion
- wiring board
- framework
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Abstract
The utility model relates to a silicon microphone sealed with a flexible circuit board; the silicon microphone comprises a hard framework, a hard circuit board, a flexibly circuit board, a silicon microphone chip and an integrated IC. The bendable flexible circuit board seals the upper end face and the lower end face of the framework; a circuit structure on an upper soft substrate and a circuit structure of a lower soft substrate are directly connected in the integrated flexible circuit board, the connection effect is more stable, and the product sealing is convenient and neat. In particular, more than one microphone unit can be sealed at the same time and the required single silicon microphone unit can be separated to realize batched sealing and separation, so that the production efficiency is quickly improved, the cost is greatly reduced and the market competitiveness is improved. In addition, the silicon microphone chip, the integrated IC and other internal elements and parts are fixed on the hard circuit board, and the flexible circuit board is wrapped outside; because the hard circuit board is not easy to deform, the loosening of the elements and the parts can be prevented, to ensure the stability of the product performance.
Description
Technical field
The utility model relates to the silicon microphone art, refers in particular to a kind of stable performance, is convenient to encapsulation, and is suitable for the silicon microphone of the Flexible Printed Circuit encapsulation of high efficiency production in enormous quantities.
Background technology
As everyone knows, the structure of the silicon microphone of tradition can be with reference to shown in Figure 1, specifically comprise the framework 10 of upper and lower side opening ', last hard substrate 21 ', following hard substrate 22 ', silicon wheat chip 30 ' and integrated IC40 ', go up hard substrate 21 ' and hard substrate 22 ' be encapsulated in respectively framework 10 ' upper and lower side opening down, form a ccontaining cavity 50 ', silicon wheat chip 30 ' and integrated IC40 ' be located at this ccontaining cavity 50 ' in, and be mounted on down on hard substrate 22 ' inner surface, be positioned at silicon wheat chip 30 ' the below be provided with hole 60 ', upper substrate 21 ' with infrabasal plate 22 ' on all be placed with corresponding circuit structure, and go up hard substrate 21 ' with time hard substrate 22 ' between circuit structure between by pass aforementioned ccontaining cavity 50 ' lead-in wire 70 ' be connected, yet, facts have proved, the wiring complexity of this kind lead-in wire 70 ' connected mode, entanglement, and packaging efficiency is low.
The utility model content
The utility model is at the defective of prior art existence, and main purpose provides a kind of stable performance, is convenient to encapsulation, and is suitable for the silicon microphone of the Flexible Printed Circuit encapsulation of high efficiency production in enormous quantities.
For achieving the above object, the utility model adopts following technical scheme:
A kind of silicon microphone of novel Flexible Printed Circuit encapsulation comprises
One stereoplasm frame, the upper and lower side opening of this framework;
One hard wiring board, this hard wiring board is packaged in the lower ending opening place of aforesaid frame, and the upper and lower surface of hard wiring board is provided with pad structure;
One Flexible Printed Circuit, the following soft base plate portion that this Flexible Printed Circuit is extended by one, kink and last soft base plate portion form, wherein, be provided with pad structure on the surfaces externally and internally of following soft base plate portion and last soft base plate portion, this time soft base plate portion electrically is fixed on the lower surface of aforementioned hard wiring board, and in being formed with a gap between soft base plate portion and the hard wiring board down, soft base plate portion is covered in the upper end open place of aforesaid frame on this, and kink then is coated on framework one outside portion;
Reach upward formation one ccontaining cavity between the soft base plate portion in framework, hard wiring board, silicon wheat chip is positioned at this ccontaining cavity, and the inner surface of this silicon wheat chip and hard wiring board electrically connects;
Simultaneously also be provided with a through hole on the hard wiring board, this through hole is communicated between aforementioned ccontaining cavity and the gap, this silicon wheat chip be arranged at this through hole directly over;
In descending soft base plate portion or last soft base plate to be provided with hole, this hole is communicated between aforementioned gap or the ccontaining cavity and the external world.
Has a conductive adhesive layer between the upper surface of described upward soft base plate portion and framework.
Has a conductive adhesive layer between the lower surface of described hard wiring board and framework.
The inner surface of described framework is provided with conductive layer.
The utility model is compared with technology with existing, its beneficial effect is, adopt bent Flexible Printed Circuit to finish the encapsulation of framework upper and lower end face, circuit structure on the last soft base plate directly is connected in the Flexible Printed Circuit of one with circuit structure on the following soft base plate, the lead-in wire connected mode of passing ccontaining cavity that has replaced tradition, it is more stable not only to connect effect, and the product encapsulation is convenient, smooth.Especially, a silicon microphone unit more than the utility model can be encapsulated simultaneously, and then be partitioned into required single silicon microphone unit, encapsulation is in batches cut apart in batches, and production efficiency is rapidly improved, and then can reduce cost greatly, improve the market competitiveness.In addition, it is fixed in inner components and parts such as silicon wheat chip, integrated IC on the hard wiring board, is covered with Flexible Printed Circuit in external packets again, because the hard wiring board is not yielding, mat and can effectively avoid components and parts loosening is to guarantee the stability of properties of product.
Description of drawings
Fig. 1 is the assembling sectional view of the silicon microphone of prior art;
Fig. 2 is the assembling sectional view of first kind of embodiment of the utility model;
The complete sectional view of encapsulation state not among Fig. 3 Fig. 2;
Encapsulation layout viewing when Fig. 4 produces in batches for first kind of embodiment of the utility model.
Fig. 5 is the assembling sectional view of second kind of embodiment of the utility model;
The accompanying drawing identifier declaration:
10 ', framework 21 ', go up hard substrate
22 ', down hard substrate 30 ', silicon wheat chip
40 ', integrated IC 50 ', ccontaining cavity
60 ', sound hole 70 ', the lead-in wire
10, stereoplasm frame 11, conductive layer
20, hard wiring board 21, perforation
30, Flexible Printed Circuit 31, following soft base plate portion
32, kink 33, last soft base plate portion
40, silicon wheat chip 50, integrated IC
61, conducting resinl 70, gap
80, ccontaining cavity 91, sound hole
92, sound hole A1 (A2), line of cut
B, pad 100, silicon microphone unit
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiment:
Demonstrated concrete structure with reference to Fig. 2, comprised stereoplasm frame 10, hard wiring board 20, Flexible Printed Circuit 30, silicon wheat chip 40 and integrated IC50 as first kind of embodiment of the utility model.
Wherein, the upper and lower side opening of this framework 10, be provided with on the inner surface of framework 10 and be coated with conductive layer 11, this hard wiring board 20 is packaged in the lower ending opening place of aforesaid frame 10, preferably adopt conducting resinl 61 bonding between hard wiring board 20 and the framework 10, this conducting resinl 61 is electrically connected with conductive layer 11 on aforesaid frame 10 inner surfaces, forms shield effectiveness with this.In addition, this hard wiring board 20 is a double sided board, and its upper and lower surface is provided with pad B structure.
The following soft base plate portion 31 that this Flexible Printed Circuit 30 is extended by one, kink 32 and last soft base plate portion 33 form, wherein, be provided with pad B structure on the surfaces externally and internally of last soft base plate portion 33 and following soft base plate portion 31, this time soft base plate portion 31 electrically is welded on the lower surface of aforementioned hard wiring board 20 by tin cream 62, and in being formed with a gap 70 between soft base plate portion 33 and the hard wiring board 20 down.Should go up the upper end open place that soft base plate portion 33 is covered in aforesaid frame 10, kink 32 then is coated on framework 10 1 outside portions, and goes up between soft base plate portion 33 and the framework 10 bonding by conducting resinl 61.
By this, reach upward formation one ccontaining cavity 80 between the soft base plate portion 33 in framework 10, hard wiring board 20, components and parts such as silicon wheat chip 40 and integrated IC50 are positioned at this ccontaining cavity 80, and electrically be fixed on the inner surface of aforementioned hard wiring board 20, the hard wiring board 20 under the silicon wheat chip 40 is provided with perforation 21.Simultaneously, be provided with hole 91 in following soft base plate portion 31, this hole 91 is communicated between the aforementioned gap 70 and the external world.
The concrete assembling process of present embodiment can be with reference to Fig. 3 to Fig. 2, mount silicon wheat chip 40 and integrated IC50 prior to hard wiring board 20 upper surfaces, by insulating cement 80 stereoplasm frame 10 is sticked at hard wiring board 20 upper surfaces thereupon, then will descend soft base plate portion 31 to be welded in the bottom surface of hard wiring board 20 by tin cream 62, upwards bend Flexible Printed Circuit 30 then, be covered in the upper surface of stereoplasm frame 10 until last soft base plate portion 33, equally, cling by insulating cement 80 between last soft base plate portion 33 and stereoplasm frame 10 upper surfaces, by this, finish the assembling of whole silicon microphone 100.
In the actual production, a plurality of aforementioned silicon microphones unit 100 can be carried out operation simultaneously, with reference to Fig. 4, promptly prior to mounting silicon wheat chips 40 and the integrated IC50 of organizing in the big following soft base plate portion 31 of opening a plurality of arrays on the Flexible Printed Circuit 30 more, then be stained with the hardboard framework 10 of respective numbers, and then a plurality of soft base plate portions 33 of going up of connecting together of bending, and soft base plate portion 33 on these all clinged with corresponding hardboard framework 10, so can disposablely finish the operation of the silicon microphone unit 100 of a plurality of arrays, line of cut A1 between each silicon microphone unit 100 at last, A2 cuts, and is partitioned into required single silicon microphone 100.
Demonstrated concrete structure as second kind of embodiment of the utility model with reference to Fig. 5, the difference of present embodiment and previous embodiment is that this hole 92 is arranged at soft base plate portion 33, and this hole 92 is communicated between the ccontaining cavity 80 and the external world.
Of the present utility model focusing on, adopt bent Flexible Printed Circuit to finish the encapsulation of framework upper and lower end face, circuit structure on the last soft base plate directly is connected in the Flexible Printed Circuit of one with circuit structure on the following soft base plate, the lead-in wire connected mode of passing ccontaining cavity that has replaced tradition, it is more stable not only to connect effect, and the product encapsulation is convenient, smooth.Especially, a silicon microphone unit more than the utility model can be encapsulated simultaneously, and then be partitioned into required single silicon microphone unit, encapsulation is in batches cut apart in batches, and production efficiency is rapidly improved, and then can reduce cost greatly, improve the market competitiveness.In addition, it is fixed in inner components and parts such as silicon wheat chip, integrated IC on the hard wiring board, is covered with Flexible Printed Circuit in external packets again, because the hard wiring board is not yielding, mat and can effectively avoid components and parts loosening is to guarantee the stability of properties of product.
The above only is the preferred embodiment of the silicon microphone of a kind of Flexible Printed Circuit encapsulation of the utility model, is not that technical scope of the present utility model is imposed any restrictions.So every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.
Claims (4)
1, a kind of silicon microphone of novel Flexible Printed Circuit encapsulation is characterized in that: comprise
One stereoplasm frame, the upper and lower side opening of this framework;
One hard wiring board, this hard wiring board is packaged in the lower ending opening place of aforesaid frame, and the upper and lower surface of hard wiring board is provided with pad structure;
One Flexible Printed Circuit, the following soft base plate portion that this Flexible Printed Circuit is extended by one, kink and last soft base plate portion form, wherein, be provided with pad structure on the surfaces externally and internally of following soft base plate portion and last soft base plate portion, this time soft base plate portion electrically is fixed on the lower surface of aforementioned hard wiring board, and in being formed with a gap between soft base plate portion and the hard wiring board down, soft base plate portion is covered in the upper end open place of aforesaid frame on this, and kink then is coated on framework one outside portion;
Reach upward formation one ccontaining cavity between the soft base plate portion in framework, hard wiring board, silicon wheat chip is positioned at this ccontaining cavity, and the inner surface of this silicon wheat chip and hard wiring board electrically connects;
Simultaneously also be provided with a through hole on the hard wiring board, this through hole is communicated between aforementioned ccontaining cavity and the gap, this silicon wheat chip be arranged at this through hole directly over;
In descending soft base plate portion or last soft base plate to be provided with hole, this hole is communicated between aforementioned gap or the ccontaining cavity and the external world.
2, the silicon microphone of novel Flexible Printed Circuit encapsulation according to claim 1 is characterized in that: have a conductive adhesive layer between the upper surface of described upward soft base plate portion and framework.
3, the silicon microphone of novel Flexible Printed Circuit encapsulation according to claim 1 is characterized in that: have a conductive adhesive layer between the lower surface of described hard wiring board and framework.
4, the silicon microphone of novel Flexible Printed Circuit encapsulation according to claim 1, it is characterized in that: the inner surface of described framework is provided with conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200495593U CN201226592Y (en) | 2008-06-23 | 2008-06-23 | Silicon microphone packaged by flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200495593U CN201226592Y (en) | 2008-06-23 | 2008-06-23 | Silicon microphone packaged by flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201226592Y true CN201226592Y (en) | 2009-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200495593U Expired - Fee Related CN201226592Y (en) | 2008-06-23 | 2008-06-23 | Silicon microphone packaged by flexible circuit board |
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| Country | Link |
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| CN (1) | CN201226592Y (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102413409A (en) * | 2011-12-17 | 2012-04-11 | 歌尔声学股份有限公司 | Micro-electromechanical systems (MEMS) microphone |
| CN102421053A (en) * | 2011-12-17 | 2012-04-18 | 歌尔声学股份有限公司 | Micro-electromechanical system (MEMS) microphone |
| CN101998753B (en) * | 2009-08-24 | 2012-12-12 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| TWI475893B (en) * | 2009-12-07 | 2015-03-01 | Hosiden Corp | Microphone |
| WO2016179896A1 (en) * | 2015-05-08 | 2016-11-17 | 中兴通讯股份有限公司 | Seal structure of microphone and electronic device |
| CN107343249A (en) * | 2016-04-28 | 2017-11-10 | 意法半导体股份有限公司 | The device of more EM equipment modules including the module and the method for manufacturing the module |
| CN108307584A (en) * | 2017-01-13 | 2018-07-20 | 株式会社村田制作所 | Component module |
| CN108882564A (en) * | 2018-08-03 | 2018-11-23 | 江苏普诺威电子股份有限公司 | 6 layers of microphone burying capacitance circuit board manufacture craft of embedded chip |
-
2008
- 2008-06-23 CN CNU2008200495593U patent/CN201226592Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101998753B (en) * | 2009-08-24 | 2012-12-12 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| TWI475893B (en) * | 2009-12-07 | 2015-03-01 | Hosiden Corp | Microphone |
| CN102413409A (en) * | 2011-12-17 | 2012-04-11 | 歌尔声学股份有限公司 | Micro-electromechanical systems (MEMS) microphone |
| CN102421053A (en) * | 2011-12-17 | 2012-04-18 | 歌尔声学股份有限公司 | Micro-electromechanical system (MEMS) microphone |
| WO2016179896A1 (en) * | 2015-05-08 | 2016-11-17 | 中兴通讯股份有限公司 | Seal structure of microphone and electronic device |
| CN107343249A (en) * | 2016-04-28 | 2017-11-10 | 意法半导体股份有限公司 | The device of more EM equipment modules including the module and the method for manufacturing the module |
| CN107343249B (en) * | 2016-04-28 | 2019-12-31 | 意法半导体股份有限公司 | Multi-device module, apparatus including the same, and method of manufacturing the same |
| CN108307584A (en) * | 2017-01-13 | 2018-07-20 | 株式会社村田制作所 | Component module |
| CN108882564A (en) * | 2018-08-03 | 2018-11-23 | 江苏普诺威电子股份有限公司 | 6 layers of microphone burying capacitance circuit board manufacture craft of embedded chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20140623 |
|
| EXPY | Termination of patent right or utility model |