CN102413409A - Micro-electromechanical systems (MEMS) microphone - Google Patents
Micro-electromechanical systems (MEMS) microphone Download PDFInfo
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- CN102413409A CN102413409A CN2011104248248A CN201110424824A CN102413409A CN 102413409 A CN102413409 A CN 102413409A CN 2011104248248 A CN2011104248248 A CN 2011104248248A CN 201110424824 A CN201110424824 A CN 201110424824A CN 102413409 A CN102413409 A CN 102413409A
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- mems microphone
- microphone
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- 239000000758 substrate Substances 0.000 claims description 65
- 238000007789 sealing Methods 0.000 claims description 3
- 230000035939 shock Effects 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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Abstract
The invention discloses a micro-electromechanical systems (MEMS) microphone, which comprises an outer encapsulation structure formed by a first base plate and a housing, wherein an MEMS chip is mounted in the encapsulation structure, and the surface of the encapsulation structure is provided with a sound incoming hole communicated with the MEMS chip; and the first base plate is a flexible base plate, at least one layer of second base plate is fixed at one side of the first base plate outside the encapsulation structure, a connection layer connected with the second base plate is arranged on the edge of the first base plate, and the first base plate body is suspended above the second base plate; and the first base plate and the second base plate are electrically connected, and the first base plate and the second base plate are electrically communicated with the internal and external circuits of the MEMS microphone. Compared with the prior art, by using the MEMS microphone provided by the invention, the impact of mechanical shock on the product structure and performance of the MEMS microphone can be effectively reduced, the shock-resistant and impact-resistant abilities and the reliability of the product are improved, and the anti-interference performance of the product is enhanced.
Description
Technical field
The present invention relates to a kind of MEMS microphone, especially relate to a kind of shockproof, shock proof MEMS microphone.
Background technology
Along with the fast development of telecommunications product, the user also improves requirement of products day by day, and the competition between the consumer electronics communication product is also fierce day by day.
In order to improve competitiveness of product, it is not enough only paying attention to function, and reliability of products also is an important aspect.In the use of consumer electronics communication product, it is inevitable being given a shock.The mechanical shock that directly acts on microphone chip not only can exert an influence to speech quality, also can cause damage to microphone chip, has influenced the life-span and the performance of product.And general MEMS microphone packaging scheme only relates to the functional domain of microphone, and shockproof, the shock resistance that almost do not relate to microphone are handled.
Therefore, be necessary to provide a kind of microphone packaging scheme of raising microphone reliability, especially shock resistance.
Summary of the invention
Technical problem to be solved by this invention provides a kind of shock proof MEMS microphone packaging scheme.
The present invention adopts following technical scheme to achieve these goals:
A kind of MEMS microphone; Comprise the outer enclosure structure that forms by first substrate and shell; In the inside of said encapsulating structure the MEMS chip is installed; Said encapsulating structure surface is provided with the sound hole that is communicated with said MEMS chip, and: said first substrate is a flexible substrate, and outside said first substrate, one side of said encapsulating structure is fixed with one deck second substrate at least; The edge of said first substrate is provided with the articulamentum that is connected with said second substrate, and said first substrate body is hung on said second substrate top; Be electrically connected the inside and outside circuit of said MEMS microphone between said first substrate and second substrate.
As a kind of optimized technical scheme, said articulamentum is a conducting resinl, and said first substrate is connected through said conducting resinl with second substrate.
As a kind of optimized technical scheme, said first substrate and said second substrate are respectively equipped with plated-through hole, and said plated-through hole is electrically connected with said conducting resinl.
As a kind of optimized technical scheme, said MEMS microphone is square, and said intermediate layer is arranged on four bights of said first substrate.
As a kind of optimized technical scheme, said intermediate layer is the loop configuration of sealing.
As a kind of optimized technical scheme, said sound hole is arranged on said first substrate, and said second substrate is provided with the through hole that is communicated with said sound hole.
Said intermediate layer and said first flexible substrate constitute the spring beam structure.When external shock, mechanical shock is at first passed on the said spring beam structure, through buffering, acts on the MEMS microphone chip, thereby has significantly reduced the impact that directly acts on chip, has improved the impact resistance of product.Said annular intermediate layer forms the relative closure district, has promoted the product anti-jamming capacity.
Therefore, with respect to prior art, anti-interference, shock proof advantage that the present invention has.
Description of drawings
Fig. 1 is the cutaway view of the embodiment of the invention one MEMS microphone;
Fig. 2 be the embodiment of the invention one MEMS microphone A-A to cutaway view;
Fig. 3 is the cutaway view of the embodiment of the invention two MEMS microphones;
Fig. 4 be the embodiment of the invention two MEMS microphone A-A to cutaway view.
Embodiment
Below in conjunction with accompanying drawing, specify concrete structure of the present invention:
Embodiment one:
See also Fig. 1; MEMS microphone of the present invention comprises: the outer enclosure structure that is formed by first substrate 12 and shell 6; MEMS chip 4 and asic chip 5 are installed in the inside of said encapsulating structure; Said encapsulating structure surface is provided with the sound hole 7 that is communicated with MEMS chip 4, and first substrate 12 is a flexible substrate; Outside first substrate, 12 1 sides of said encapsulating structure are fixed with second substrate 11; The edge of first substrate 12 is provided with the intermediate layer 2 that is connected with second substrate 11; First substrate 12 is hung on second substrate, 11 tops, and interval 3 is arranged between first substrate 12 and second substrate 11; Be electrically connected first substrate 12 and the inside and outside circuit of the said MEMS microphone of second substrate, 11 electric connections through intermediate layer 2 between first substrate 12 and second substrate 13.
Be respectively arranged with plated-through hole 8 on first substrate 12 and second substrate 11, plated-through hole 8 is electrically connected with intermediate layer 2.
Present embodiment MEMS microphone is square, and intermediate layer 2 is arranged on four bights of first substrate 12, makes substrate 12 bodies of winning be hung on said second substrate 11 tops.For square MEMS microphone, except that realizing above-mentioned implementation result, design more easy.
Because first substrate 12 is a flexible substrate; Itself and intermediate layer 2 have constituted the spring beam structure; Thereby make contingent mechanical shock be passed to MEMS chip 4 and asic chip 5 again through said spring beam structure earlier, improved the impact resistance of MEMS microphone of the present invention.
Embodiment two:
Present embodiment is the improvement project of embodiment one, and like Fig. 3 and shown in Figure 4, intermediate layer 2 is made as loop configuration, makes the interval 3 between first substrate 12 and second substrate 11 become relative closed area, and first substrate, 12 bodies are hung on said second substrate 11 tops.First substrate 12 is provided with sound hole 71, the second substrates 11 and is provided with the through hole 72 that is communicated with sound hole 71.
As a kind of embodiment preferred, the intermediate layer 2 in the present embodiment is the loop configuration of sealing.On this basis that has impact resistance at the MEMS microphone, also possessed good anti-interference.
More than be merely case study on implementation of the present invention, be not limited to the present invention,, all should include in the protection range of putting down in writing in claims as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed.
Claims (7)
1. MEMS microphone; Comprise the outer enclosure structure that forms by first substrate and shell; In the inside of said encapsulating structure the MEMS chip is installed; Said encapsulating structure surface is provided with the sound hole that is communicated with said MEMS chip, and it is characterized in that: said first substrate is a flexible substrate, and outside said first substrate, one side of said encapsulating structure is fixed with one deck second substrate at least; The edge of said first substrate is provided with the articulamentum that is connected with said second substrate, and said first substrate body is hung on said second substrate top; Be electrically connected the inside and outside circuit of said MEMS microphone between said first substrate and second substrate.
2. MEMS microphone according to claim 1 is characterized in that:
Said articulamentum is a conducting resinl; Said first substrate and second substrate are electrically connected through said conducting resinl.
3. MEMS microphone according to claim 2 is characterized in that:
Be respectively arranged with plated-through hole on said first substrate and said second substrate, said plated-through hole is electrically connected with said conducting resinl.
4. MEMS microphone according to claim 1 is characterized in that:
Said MEMS microphone is square.
5. MEMS microphone according to claim 4 is characterized in that:
Said MEMS microphone is square, and said intermediate layer is arranged on four bights of said first substrate.
6. MEMS microphone according to claim 1 is characterized in that:
Said intermediate layer is the loop configuration of sealing.
7. MEMS microphone according to claim 6 is characterized in that:
Said sound hole is arranged on said first substrate, and said second substrate is provided with the through hole that is communicated with said sound hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110424824.8A CN102413409B (en) | 2011-12-17 | 2011-12-17 | Mems microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110424824.8A CN102413409B (en) | 2011-12-17 | 2011-12-17 | Mems microphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102413409A true CN102413409A (en) | 2012-04-11 |
| CN102413409B CN102413409B (en) | 2015-09-30 |
Family
ID=45915203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110424824.8A Active CN102413409B (en) | 2011-12-17 | 2011-12-17 | Mems microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102413409B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016165359A1 (en) * | 2015-04-16 | 2016-10-20 | 歌尔声学股份有限公司 | Encapsulation structure for integrated sensor |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101237719A (en) * | 2007-12-28 | 2008-08-06 | 深圳市豪恩电声科技有限公司 | A silicon capacitance microphone and its making method |
| CN201226593Y (en) * | 2008-06-23 | 2009-04-22 | 东莞泉声电子有限公司 | Silicon microphone capable of being welding on two sides |
| CN201226592Y (en) * | 2008-06-23 | 2009-04-22 | 东莞泉声电子有限公司 | Silicon microphone packaged by flexible circuit board |
| CN201846473U (en) * | 2010-10-11 | 2011-05-25 | 歌尔声学股份有限公司 | Silicon microphone |
| US20110293126A1 (en) * | 2010-06-01 | 2011-12-01 | Omron Corporation | Microphone |
-
2011
- 2011-12-17 CN CN201110424824.8A patent/CN102413409B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101237719A (en) * | 2007-12-28 | 2008-08-06 | 深圳市豪恩电声科技有限公司 | A silicon capacitance microphone and its making method |
| CN201226593Y (en) * | 2008-06-23 | 2009-04-22 | 东莞泉声电子有限公司 | Silicon microphone capable of being welding on two sides |
| CN201226592Y (en) * | 2008-06-23 | 2009-04-22 | 东莞泉声电子有限公司 | Silicon microphone packaged by flexible circuit board |
| US20110293126A1 (en) * | 2010-06-01 | 2011-12-01 | Omron Corporation | Microphone |
| CN201846473U (en) * | 2010-10-11 | 2011-05-25 | 歌尔声学股份有限公司 | Silicon microphone |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016165359A1 (en) * | 2015-04-16 | 2016-10-20 | 歌尔声学股份有限公司 | Encapsulation structure for integrated sensor |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102413409B (en) | 2015-09-30 |
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| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |