CN201150132Y

CN201150132Y - PCB flexible plate integrated encapsulation silicon microphone

Info

Publication number: CN201150132Y
Application number: CNU2007201790629U
Authority: CN
Inventors: 温增丰; 郑虎鸣; 贺志坚
Original assignee: Transound Electronics Co Ltd
Current assignee: Transound Electronics Co Ltd
Priority date: 2007-12-29
Filing date: 2007-12-29
Publication date: 2008-11-12
Anticipated expiration: 2017-12-29

Abstract

The utility model relates to a silicon microphone which is integrally encapsulated with a PCB flexible plate, which comprises a framework with opened upper end and lower ends, a PCB flexible plate, a silicon microphone chip and a capacitive component. The PCB flexible plate is composed of an upper base plate part, a buckling part and a lower base plate part integrally extending in sequence, a containing empty cavity is formed between the framework and the upper base plate part and the lower base plate part, and the silicon microphone chip and the capacitive component are arranged in the containing empty cavity. The circuit structure on the upper base plate part and the circuit structure on the lower base plate part are directly connected with the integral PCB flexible plate, to replace the connecting method of the traditional leading wire passing through the containing empty cavity, therefore, not only the connecting effect is more steady, but also the encapsulation of products is convenient and flat, particularly, a plurality of silicon microphone units of the utility model can be simultaneously assembled, and then are divided into required single silicon microphone unit, the silicon microphone units can be assembled and segmented in batch, so as to quickly enhance the production efficiency, thereby to reduce the cost, and to improve the competitive power of the market.

Description

The silicon microphone of PCB soft board one encapsulation

Technical field

The utility model relates to the silicon microphone art, refers in particular to a kind of being convenient to and encapsulates, and be suitable for the silicon microphone that high efficiency is produced in enormous quantities.

Background technology

As everyone knows, the structure of the silicon microphone of tradition can be with reference to shown in Figure 1, the framework 10 that specifically comprises the upper and lower side opening, go up hard substrate 21, following hard substrate 22, silicon wheat chip 30 and capacity cell 40, go up hard substrate 21 and be encapsulated in framework 10 upper and lower side openings respectively with following hard substrate 22, form a ccontaining cavity 50, silicon wheat chip 30 and capacity cell 40 are located in this ccontaining cavity 50, and be mounted on down on hard substrate 22 inner surfaces, the below that is positioned at silicon wheat chip 30 is provided with hole 60, all be placed with corresponding circuit structure 211 on the outer surface of upper substrate 21 and infrabasal plate 22,221, and go up the circuit structure 211 between hard substrate 21 and the following hard substrate 22, connect by the lead-in wire 70 that passes aforementioned ccontaining cavity 50 between 221, yet, facts have proved the wiring complexity of this kind lead-in wire 70 connected modes, entanglement, and packaging efficiency is low.

The utility model content

The utility model is at the defective of prior art existence, and main purpose provides a kind of silicon microphone of PCB soft board one encapsulation, and its encapsulation is convenient, smooth, and is suitable for the high efficiency production in enormous quantities.

For achieving the above object, the utility model adopts following technical scheme:

A kind of silicon microphone of PCB soft board one encapsulation, the framework, PCB soft board, silicon wheat chip and the capacity cell that comprise the upper and lower side opening, this PCB soft board is provided with circuit structure, the upper substrate portion that the PCB soft board is extended successively by one, kink and infrabasal plate portion form, wherein, this upper substrate portion is encapsulated in the upper end open of aforesaid frame, and infrabasal plate portion is encapsulated in the lower ending opening of framework, and kink is coated on framework one outside portion;

Between framework and upper substrate portion and infrabasal plate portion, form a ccontaining cavity, upper substrate portion or upper substrate portion are provided with the sound hole that is communicated with between this ccontaining cavity volume and the external world, this silicon wheat chip and capacity cell are located in this ccontaining cavity, and are fixed on the inner surface of infrabasal plate.

Has an insulating cement adhesion coating between the upper and lower end face of described upper substrate portion and infrabasal plate portion and framework.

The utility model is compared with technology with existing, its beneficial effect is, adopt bent soft base plate to finish the encapsulation of framework upper and lower end face, circuit structure on the upper substrate directly is connected in the soft base plate outer surface of one with circuit structure on the infrabasal plate, the lead-in wire connected mode of passing ccontaining cavity that has replaced tradition, it is more stable not only to connect effect, and the product encapsulation is convenient, smooth, especially, a silicon microphone unit more than the utility model can be encapsulated simultaneously, and then be partitioned into required single silicon microphone unit, encapsulation is in batches cut apart in batches, and production efficiency is rapidly improved, and then reduce cost, improve the market competitiveness.

Description of drawings

Fig. 1 is the assembling sectional view of the silicon microphone of prior art;

Fig. 2 is the assembling sectional view of the utility model;

Fig. 3 is the not sectional view of complete encapsulation state of the utility model one;

Encapsulation layout viewing when Fig. 4 produces in batches for the utility model.

The accompanying drawing identifier declaration:

100, silicon microphone unit 10, framework

20, PCB soft board 21, upper substrate portion

22, infrabasal plate portion 23, kink

211 (221,231), circuit structure

30, silicon wheat chip 40, capacity cell

50, ccontaining cavity 60, sound hole

70, lead-in wire 80, insulating cement

A1 (A2), line of cut

Embodiment

The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiment:

With reference to Fig. 2 is most preferred embodiment of the present utility model, the hardboard framework 10 that specifically comprises the upper and lower side opening, PCB soft board 20, silicon wheat chip 30 and capacity cell 40, wherein, the upper substrate portion 21 that this PCB soft board 20 is extended successively by one, kink 23 and infrabasal plate portion 22 form, this upper substrate portion 21 is encapsulated in the upper end open of aforementioned hardboard framework 10, infrabasal plate portion 22 is encapsulated in the lower ending opening of hardboard framework 10, kink 23 then is positioned at a side of hardboard framework 10 outsides, kink 23 is coated on hardboard framework 10 1 outside portions, it is bonding that insulating cement 80 is all passed through in the upper and lower end face of upper substrate portion 21 and infrabasal plate portion 22 and hardboard framework 10, by this, between hardboard framework 10 and upper substrate 21 and infrabasal plate 22, form a ccontaining cavity 50.Baseplate part 21 on the PCB soft board 20, be placed with corresponding circuit structure 211 on the outer surface of infrabasal plate portion 22 and kink 23,221,231, and these circuit structures 211,221,231 connect along PCB soft board 20 outer surfaces, this silicon wheat chip 30 and capacity cell 40 are located in the aforementioned ccontaining cavity 50, and by microelectronic packaging technology commonly used, as adopt the electrode on methods such as the bonding or paster of epoxy glue and infrabasal plate portion 22 inner surfaces affixed, the below that is positioned at silicon wheat chip 30 is provided with and is communicated with this ccontaining cavity 50 and extraneous sound hole 60, and this hole 60 guarantees the introducing of extraneous acoustical signal.

The concrete encapsulation process of the utility model can be with reference to Fig. 3, Fig. 2, upper surface prior to the infrabasal plate portion 22 of PCB soft board 20 mounts silicon wheat chip 30 and capacity cell 40, by insulating cement 80 hardboard framework 10 is sticked at infrabasal plate portion 22 upper surfaces then, then upwards bend PCB soft board 20, be covered in the upper surface of hardboard framework 10 until upper substrate portion 21, equally, cling by insulating cement 80 between upper substrate portion 21 and hardboard framework 10 upper surfaces, by this, finish the assembling of whole silicon microphone 100.

In the actual production, a plurality of aforementioned silicon microphones unit 100 can be carried out operation simultaneously, with reference to Fig. 4, promptly mount many group silicon wheat chips 30 and capacity cells 40 in the infrabasal plate portion 21 prior to a plurality of arrays on one big PCB soft board 10, then be stained with the hardboard framework 10 of respective numbers, and then a plurality of upper substrate portion 22 that connects together of bending, and these upper substrate portions 22 are all clinged with corresponding hardboard framework 10, so can disposablely finish the operation of the silicon microphone unit 100 of a plurality of arrays, at last between each silicon microphone unit 100 along line of cut A1, A2 cuts, be partitioned into required single silicon microphone 100, so can realize the technology of batch process.

Of the present utility model focusing on, adopt bent PCB soft board 20 to finish the encapsulation of framework 10 upper and lower end faces, circuit structure 221 in circuit structure 211 in the upper substrate portion 21 and the infrabasal plate portion 22 directly circuit structures 231 on the kink 23 of the PCB of one soft board 20 is connected, lead-in wire 80 connected modes that replaced the ccontaining cavity 50 of passing of tradition, it is more stable not only to connect effect, and the product encapsulation is convenient, smooth, especially, a silicon microphone unit 100 more than the utility model can be carried out operation simultaneously, and then be partitioned into required single silicon microphone unit 100, reach encapsulation in batches, the effect that batch is cut apart, production efficiency is rapidly improved, and then reduce cost, improve the market competitiveness.

The above, it only is the preferred embodiment of the silicon microphone of a kind of PCB soft board of the utility model one encapsulation, be not that technical scope of the present utility model is imposed any restrictions, for example, the sound hole of the utility model not only is confined to be located on the infrabasal plate, and it also can be located at according to need and wait other position on the upper substrate.So every foundation technical spirit of the present utility model all still belongs in the scope of technical solutions of the utility model any trickle modification, equivalent variations and modification that above embodiment did.

Claims

1, a kind of silicon microphone of PCB soft board one encapsulation, it is characterized in that: the framework, PCB soft board, silicon wheat chip and the capacity cell that comprise the upper and lower side opening, this PCB soft board is provided with circuit structure, the upper substrate portion that the PCB soft board is extended successively by one, kink and infrabasal plate portion form, wherein, this upper substrate portion is encapsulated in the upper end open of aforesaid frame, and infrabasal plate portion is encapsulated in the lower ending opening of framework, and kink is coated on framework one outside portion;

2, novel silicon microphone according to claim 1 is characterized in that: have an insulating cement adhesion coating between the upper and lower end face of described upper substrate portion and infrabasal plate portion and framework.