CN207977350U - A kind of sound surface resonator chip-packaging structure - Google Patents

Abstract

The utility model is about a kind of encapsulating structure, a kind of sound surface resonator chip-packaging structure, including chip and substrate, periods energy converter and the reflective arrays such as the chip upper surface sputtering, it is characterized in that, reflective array is arranged in the equal periods energy converter both sides, the reflective array includes being arranged to open reflective array at left and right sides of the equal periods energy converter, the reflective array of opening in left side is referred to as first and opens reflective array, the reflective array of opening on right side is referred to as second and opens reflective array, described first opens reflective array and second to open reflective array symmetrical at left and right sides of the equal periods energy converter；Described first open reflective array and second open reflective array composition reflective array be arranged in parallel, be vertically arranged in the x direction in y-direction and periodic distribution in the x direction；Two conduction electrodes of tube socket electrode there are two tools on the substrate, the flip-chip and chip are connect with the tube socket electrode respectively.

Description

A kind of sound surface resonator chip-packaging structure

Technical field

The utility model is about a kind of encapsulating structure, espespecially a kind of sound surface resonator chip and encapsulating structure.

Background technology

Sound surface resonator widely should be in modern Intelligent life, with the arriving of intellectualization times, more intelligence Words equipment needs the tuning of sound surface resonator.Miniaturization is the development trend of smart machine application, however product at this stage It is most of to be bound using metal wire, the volume of product is thus virtually limited, a new design and encapsulation can be developed Structure minimizes device volume, and saving cost just becomes problem in the urgent need to address in industry.

Utility model content

To solve the above problems, the utility model provides a kind of sound surface resonator chip-packaging structure, design structure Equivalent circuit miniaturization optimization, and chip is no longer by volumetric constraint.

To achieve the above object, the technical solution adopted in the utility model is：

A kind of sound surface resonator chip-packaging structure, including chip and substrate, the periods such as described chip upper surface sputtering Reflective array is arranged in energy converter and reflective array, the equal periods energy converter both sides, and the reflective array includes that setting waits the periods described Reflective array is opened at left and right sides of energy converter, the reflective array of opening in left side is referred to as first and opens reflective array, the reflective array of opening on right side is claimed Make second and open reflective array, described first, which opens reflective array and second, opens reflective array and symmetrically divide at left and right sides of the equal periods energy converter Cloth；Described first open reflective array and second open reflective array composition reflective array be arranged in parallel in y-direction, be vertical in the x direction Setting and in the x direction periodic distribution；

Tool is there are two tube socket electrode on the substrate, two conduction electrodes of the flip-chip and chip respectively with it is described Tube socket electrode connects.

Preferably, the conduction electrode and the tube socket electrode are connected by silver material

It connects.Preferably, described first opens reflective array and second and opens reflective array length

Unanimously.Using the utility model has the beneficial effects that：

Common sound table resonator structure is integrated, is tested resonator knot by simulation trial and unlimited approach Structure optimizes, and carries out miniaturization improvement to its interior design scheme using equivalent-circuit model, had both ensured existing product performance in this way It is constant, and design structure can be reduced, so that new design structure is will be provided with, performance is excellent, small feature.Chip package layer adds To improve, original metal is bound into positive paster method and is changed to new anti-patch silver paste adhesion conductive method, belonging to both the above method Different encapsulation fields is under the jurisdiction of new encapsulation design structure, and the constraint to existing chip volume has been broken in the anti-realization for pasting method, It is the indispensable step of sound surface resonator miniaturization improvement.

Description of the drawings

Fig. 1 is sound surface resonator chip chips partial schematic diagram in the prior art.

Fig. 2 is the utility model sound surface resonator chip chips partial schematic diagram.

Fig. 3 is sound surface resonator chip sides schematic diagram in the prior art.

Fig. 4 is the utility model sound surface resonator chip sides schematic diagram.

Reference numeral includes：

100- chips, 110- interconnecting pieces, 120- conduction electrodes, 130- reflective arrays, the periods energy converter such as 140-, 200- welding Material, 300- pedestals, 310- tube socket electrodes.

Specific implementation mode

The utility model is described in detail below in conjunction with attached drawing.

A kind of 100 encapsulating structure of sound surface resonator chip as shown in Figure 2, Figure 4 shows, including chip 100 and substrate, the core Periods energy converter 140 and the reflective arrays 130 such as the sputtering of 100 upper surface of piece, it is described to wait 140 both sides of periods energy converter that reflective array is set 130, the reflective array 130 includes being arranged to open reflective array 130 at left and right sides of periods energy converter 140 in described wait, by left side It opens reflective array 130 and is referred to as and first open reflective array 130, the reflective array 130 of opening on right side is referred to as second and opens reflective array 130, described the One opens reflective array 130 and second to open reflective array 130 symmetrical in 140 left and right sides of equal periods energy converter；Described first Open reflective array 130 and second open reflective array 130 composition reflective array 130 be arranged in parallel, vertically set in the x direction in y-direction It sets and periodic distribution in the x direction；There are two tube socket electrode 310,100 upside-down mounting of the chip and chips for tool on the substrate 100 two conduction electrodes 120 are connect with the tube socket electrode 310 respectively.

The existing sound table resonator design of current optimization and encapsulating structure mainly pass through following two measures：

One：The miniaturization optimization of design structure equivalent circuit

As shown in Fig. 2, common sound table resonator structure is integrated, experiment is approached by simulation trial and infinitely Resonator structure is optimized, miniaturization improvement is carried out to its interior design scheme using equivalent-circuit model, both ensures original in this way Have that properties of product are constant, and design structure can be reduced, so that new design structure is will be provided with, performance is excellent, small feature.

Two：Novel inverted encapsulating structure makes chip 100 no longer by volumetric constraint

As shown in figure 4, the method referred in this patent is improved in 100 encapsulated layer of chip, by original metal binding Fixed positive paster method is changed to new anti-patch silver paste welding 200 adhesion conductive methods of material, different encapsulation neck belonging to both the above method Domain is under the jurisdiction of new encapsulation design structure, and the constraint to 100 volume of existing chip has been broken in the anti-realization for pasting method, is sound surface The indispensable step of resonator miniaturization improvement.

Chip 100 is overturn in itself, finger is partially toward lower section, and 200 materials of material are welded by chip 100 using silver paste It is connected with pedestal 300, interconnecting piece 110 is docked at conduction electrode 120.The improvement of this patent makes sound table resonator in encapsulation rank Section is more flexible, is no longer influenced by the limitation of traditional structure, to reach the miniaturization of chip 100, and is experimentally confirmed new Encapsulating structure yields can be controlled in 90% or more, be suitble to product mass production.

As shown in Figure 1, system structure is formed using REF+IDT+REF.Conventional package using metal as shown in figure 3, led Line connects chip 100, and at this time we must consider the radian of lead, thus in terms of the volume that chip 100 encapsulates There is limitation.

Preferably, the conduction electrode 120 and the tube socket electrode 310 expect 200 connection of welding material by silver.It is described First opens reflective array 130, and with second to open 130 length of reflective array consistent.

The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality It, in specific embodiments and applications can be with many changes may be made, as long as these variations are without departing from this with novel thought The design of utility model, belongs to the scope of protection of the utility model.

Claims (3)

1. a kind of sound surface resonator chip-packaging structure, including chip and substrate, the periods such as described chip upper surface sputtering change Energy device and reflective array, which is characterized in that reflective array is arranged in the equal periods energy converter both sides, and the reflective array includes being arranged in institute It states and opens reflective array at left and right sides of equal periods energy converter, the reflective array of opening in left side is referred to as first and opens reflective array, by opening for right side Reflective array is referred to as second and opens reflective array, and described first, which opens reflective array and second, opens reflective array in described equal periods energy converter or so two Side is symmetrical；Described first open reflective array and second open reflective array composition reflective array be arranged in parallel in y-direction, in the side x It is vertically arranged upwards and periodic distribution in the x direction；

Tool is there are two tube socket electrode on the substrate, two conduction electrodes of the flip-chip and chip respectively with the tube socket Electrode connects.

2. sound surface resonator chip-packaging structure according to claim 1, it is characterised in that：The conduction electrode and institute Tube socket electrode is stated to connect by silver material.

3. sound surface resonator chip-packaging structure according to claim 1, it is characterised in that：Described first opens reflective array It is consistent that reflective array length is opened with second.