CN206370419U - Many pin surface mount elements - Google Patents
Many pin surface mount elements Download PDFInfo
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- CN206370419U CN206370419U CN201720030083.8U CN201720030083U CN206370419U CN 206370419 U CN206370419 U CN 206370419U CN 201720030083 U CN201720030083 U CN 201720030083U CN 206370419 U CN206370419 U CN 206370419U
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- chip
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Abstract
The utility model discloses a kind of many pin surface mount elements.The surface mount elements include combined chip, the combined chip includes more than two single-chips, the upper and lower surface of the combined chip is respectively welded Top electrode and bottom electrode, the Top electrode and the number of bottom electrode are identical with the number of the single-chip, epoxy resin covers the part of whole and described electrodes of the combined chip, the outer end of the electrode is located at the outside of the epoxy resin.The surface mount elements are suitable to mass production and manufacture；By arranging in pairs or groups, different pins is used, achievable different function and application；It is adapted to the chip package of different-thickness chip or different structure, improves the compatibility of encapsulating structure and method.
Description
Technical field
The utility model is related to base electronic component technical field, more particularly to a kind of many pin surface mount elements.
Background technology
The paster protection element power of the various encapsulation forms of conventional semiconductor chip is all smaller, and highest is also with regard to 8KW, resistance to electricity
Stream impact is from tens amperes to hundreds of amperes, and plug-in element can reach tens KW even more highs, and resistance to electric current can reach
To several kiloamperes even tens kiloamperes.
Traditional piezo-resistance, because the thickness of silver strip is corresponding with its specification, and will use traditional TVS paster frame-types
A kind of encapsulation, framework can only do a specification, and develop a series specification product, and relative exploitation input cost is high.
Industry knows that TVS pipe through-current capability is raised and reduced with temperature, and traditional high power semi-conductor component is generally deposited
Poor in heat-sinking capability, by surge impact, heating can not radiate in element internal accumulation, short time, device temperature liter after impact
Height, so that device tolerance impact capacity reduction, it is impossible to bear the short time repeatedly big surge impact the problems such as.Market to high-performance from
Dynamicization paster high-power type device requirement is gradually to form trend.
Utility model content
Technical problem to be solved in the utility model is to provide one kind and is suitable for batch production, powerful, versatility
Strong many pin surface mount elements.
In order to solve the above technical problems, technical solution adopted in the utility model is：A kind of many pin surface mount elements, its
It is characterised by：Including combined chip, the combined chip includes more than two single-chips, the upper and lower table of the combined chip
Face is respectively welded Top electrode and bottom electrode, and the number of the Top electrode and bottom electrode is identical with the number of the single-chip, ring
Oxygen tree fat covers the part of whole and described electrodes of the combined chip, the outer end of the electrode is located at the epoxy
The outside of resin.
Further technical scheme is：Single-chip is conjoined structure or Split type structure in the combined chip.
Further technical scheme is：The single-chip is that the transient state that silicon materials or carbofrax material make suppresses two poles
Pipe TVS, avalanche silicon diode ABD, crystalline substance lock body killer tube TSS or the piezo-resistance MOV made for metal oxide materials.
Further technical scheme is：The Top electrode and the making material of bottom electrode are copper, copper steel, iron or iron nickel,
Further technical scheme is：The surface of the Top electrode and bottom electrode is provided with tin, silver, nickel or layer gold.
It is using the beneficial effect produced by above-mentioned technical proposal：The surface mount elements are suitable to mass production and system
Make；By arranging in pairs or groups, different pins is used, achievable different function and application；Suitable different-thickness chip or different structure
Chip package, improves the compatibility of encapsulating structure and method.
Brief description of the drawings
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Fig. 1 is the decomposed structural representation of the utility model preferably discrete component；
Fig. 2 a-2c preferably weld mould and filling plane under graphite cake for the utility model and put diagram；
Fig. 3 a-3c are that the utility model preferably welds mould diagram on graphite cake；
Fig. 4 a-4c are that the utility model preferably welds the cooperation of graphite cake upper and lower mould, enter stokehold diagram；
Fig. 5 a-5b are the configuration diagram of semi-finished elements after the utility model is preferably welded；
Fig. 6 a-6b are the configuration diagram that the utility model preferably encapsulates semi-finished elements after epoxy resin；
Fig. 7 is the utility model preferably finished product structure perspective view;
Fig. 8 a-8c are three kinds of structural representations of element described in the utility model；
Fig. 9 a are the structural representation of the utility model preferably connected combination chip；
Fig. 9 b are the structural representation that the utility model preferably separates combined chip；
Figure 10 a are the utility model preferably underframe electrode and the structural representation of upper frame electrode；
Figure 10 b-10d are the structural representation of the utility model preferably single electrode；
Wherein：1a, bottom electrode 1b, Top electrode 2, solder 3, combined chip 3a, single-chip 4, lower mould 5, upper mould 6, asphalt mixtures modified by epoxy resin
Fat 7a, underframe electrode 7b, upper frame electrode.
Embodiment
With reference to the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out clear
Chu, it is fully described by, it is clear that described embodiment is only a part of embodiment of the present utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
Many details are elaborated in the following description in order to fully understand the utility model, but this practicality is new
Type can also be different from other manner described here using other implement, and those skilled in the art can be without prejudice to this reality
With doing similar popularization in the case of new intension, therefore the utility model is not limited by following public specific embodiment.
Embodiment one
As shown in Figure 1 and Figure 7, the utility model embodiment discloses a kind of many pin surface mount elements, including combined chip
3, the combined chip 3 includes more than two single-chip 3a.The upper and lower surface of the combined chip 3 is respectively welded electricity
Pole 1b and bottom electrode 1a, the Top electrode 1b and bottom electrode 1a number are identical with the number of the single-chip 3a.Epoxy resin 6
The part of whole and described electrodes of the combined chip 3 is covered, the outer end of the electrode is located at the epoxy resin 6
Outside.
It is preferred that, in the combined chip 3 single-chip 3a be conjoined structure or Split type structure, which kind of specifically used structure
Single-chip 3a, can be selected according to actual needs.It is preferred that, the single-chip 3a can be double pin chips, have,
Transient Suppression Diode TVS, avalanche silicon diode ABD, the brilliant lock body killer tube that can be made for silicon materials or carbofrax material
The TSS or piezo-resistance MOV made for metal oxide materials.Furthermore, it is necessary to explanation, the Top electrode 1b and bottom electrode
1a body making material is metal conductive materials, such as copper, copper steel, iron or iron nickel, its surface can be through tin, silver, nickel, Jin Dengbiao
Face is handled.
A kind of TVS preparation method, methods described comprises the following steps：
The first step, in the lower mould 4 of graphite cake（As shown in figs. 2 a-2 c）On put underframe electrode 7a（As shown in Figure 10 a）；
Second step, solder sheet 2 is loaded by solder sheet screen tray；3rd step, the single-chip 3a of disjunctor is loaded by chip screen tray（Such as Fig. 7
With shown in 9a）；4th step, solder sheet 2 is loaded by solder sheet screen tray；5th step, puts frame electrode 7b（Such as Figure 10 a institutes
Show）；6th step, a small amount of scaling powder is applied to the upper mould 5 of graphite cake（As shown in figs 3 a-3 c）Afterwards, mould on graphite cake 5 is covered under
On mould 4, the filling into stokehold is completed（As depicted in figure 4 a-4 c）；7th step, will complete the graphite cake of filling, by setting temperature
Write music the continuous tunnel furnace of line, be welded into the semi-finished product A of electrical connection（As shown in Fig. 5 a-5b）；8th step, by the semi-finished product A after welding,
Put in heat pressing and molding mold, encapsulate epoxy resin outer layer, obtain semi-finished product B（As shown in Fig. 6 a-6b）；9th step, will be partly
Finished product B obtains product for clubfoot finished product C by automatic machinery rib cutting, clubfoot（As shown in Fig. 7,8a-8c）.Figure 10 b-10d are
The structural representation of single electrode in the utility model embodiment.
Benefit, first, product structure is simple, and automation equipment production can be used in frame electrode, single-chip and solder；The
Two, it is connected to according to such as Fig. 7 and 8a-8c finished product in circuit, wherein a pin and c pin, b pin and d pin can be connected respectively to independent
In the circuit that TVS products need to be used, the protection of two circuits of only one TVS product support so can be achieved, can be better than tradition
Single TVS product correspondence support a circuit protection, the product can greatly save the space of adjacent circuit, when only needing one
When TVS works, only corresponding a pair of pins is connected.Reach that the pin pairing of same benefit also has：A pin and d pin, b
Pin and c pin；3rd, be connected to according to the finished product of such as figure in circuit, when TVS products be unidirectional product, product cathode line one side
When two pin a pin and b pin are shorted, circuit loop connects another side pin c pin and d pin respectively, you can make the unidirectional TVS productions
Product serve as two-way TVS products；4th, when pin short circuit of the finished product with one side, i.e. a pin and b pin, c pin and d pin distinguishes short circuit
After be connected in a circuit, you can strengthen the original through-current capability of the chip.
A kind of TVS preparation method, methods described comprises the following steps：The first step, under being put on the lower mould 4 of graphite cake
Frame electrode 7a（As shown in Figure 10 a）；Second step, solder is put by point gum machine on underframe electrode 7a and upper frame electrode 7b
Tin cream（As shown in Figure 10 a）；3rd step, by automating single-chip 3a of the die bond equipment separation fixed to the lower frame for having tin cream
On frame electrode 7a；Under 4th step, the graphite cake after the upper frame electrode 7b upset lids for having tin cream are loaded to the 3rd step on mould 4；
5th step, mould on graphite cake 5 is covered on lower mould 4, completes the filling into stokehold, as depicted in figure 4 a-4 c；6th step, will be completed
The graphite cake of filling, by setting the continuous tunnel furnace of temperature curve, is welded into the semi-finished product A of electrical connection；7th step, after welding
Semi-finished product A, put in heat pressing and molding mold, encapsulate epoxy resin outer layer, obtain semi-finished product B；8th step, by semi-finished product B
Product is obtained for clubfoot finished product C by shearing die rib cutting, clubfoot.
Benefit, first, product structure is simple, and automation equipment production can be used in frame electrode, single-chip and solder；The
Two, it is connected to according to such as Fig. 7 and 8a-8c finished product in circuit, wherein a pin and c pin, b pin and d pin can be connected respectively to independent
In the circuit that TVS products need to be used, the protection of two circuits of only one TVS product support so can be achieved, can be better than tradition
Single TVS product correspondence support a circuit protection, the product can greatly save the space of adjacent circuit, when only needing one
When TVS works, only corresponding a pair of pins is connected.Reach that the pin pairing of same benefit also has：A pin and d pin, b
Pin and c pin；3rd, be connected to according to the finished product of such as figure in circuit, when TVS products be unidirectional product, product cathode line one side
When two pin a pin and b pin are shorted, circuit loop connects another side pin c pin and d pin respectively, you can make the unidirectional TVS productions
Product serve as two-way TVS products；4th, when pin short circuit of the finished product with one side, i.e. a pin and b pin, c pin and d pin distinguishes short circuit
After be connected in a circuit, you can strengthen the original through-current capability of the chip.
It should be noted that three kinds of embodiment two and embodiment, the underframe electrode 7a and upper frame electrode 7b include
With the number identical electrode group of combined chip 3, every group of electrode pair answers of single electrode in a combined chip, every group of electrode
Number is identical with the number of single-chip 3a in combined chip.Single-chip 3a left-right situs sets or arranged up and down in the combined chip 3
Row are set, during left-right situs, and single-chip 3a is disjunctor or separate form；When being arranged above and below, between single-chip 3a and single-chip 3a
It is attached by solder.
Claims (5)
1. a kind of many pin surface mount elements, it is characterised in that：Including combined chip（3）, the combined chip（3）Including two with
On single-chip（3a）, the combined chip（3）Upper and lower surface be respectively welded Top electrode（1b）And bottom electrode（1a）, institute
State Top electrode（1b）And bottom electrode（1a）Number and the single-chip（3a）Number it is identical, epoxy resin（6）By described group
Close chip（3）Whole and described electrodes part covering, make the electrode outer end be located at the epoxy resin（6）It is outer
Side.
2. many pin surface mount elements as claimed in claim 1, it is characterised in that：The combined chip（3）Middle single-chip（3a）
For conjoined structure or Split type structure.
3. many pin surface mount elements as claimed in claim 1, it is characterised in that：The single-chip（3a）For silicon materials or carbonization
Silicon materials make Transient Suppression Diode TVS, avalanche silicon diode ABD, crystalline substance lock body killer tube TSS or be metal oxide material
Expect the piezo-resistance MOV made.
4. many pin surface mount elements as claimed in claim 1, it is characterised in that：The Top electrode（1b）And bottom electrode（1a）'s
Making material is copper, copper steel, iron or iron nickel.
5. many pin surface mount elements as claimed in claim 4, it is characterised in that：The Top electrode（1b）And bottom electrode（1a）'s
Surface is provided with tin, silver, nickel or layer gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720030083.8U CN206370419U (en) | 2017-01-11 | 2017-01-11 | Many pin surface mount elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720030083.8U CN206370419U (en) | 2017-01-11 | 2017-01-11 | Many pin surface mount elements |
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| Publication Number | Publication Date |
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| CN206370419U true CN206370419U (en) | 2017-08-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783782A (en) * | 2017-01-11 | 2017-05-31 | 广东百圳君耀电子有限公司 | Many pin surface mount elements and preparation method thereof |
-
2017
- 2017-01-11 CN CN201720030083.8U patent/CN206370419U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783782A (en) * | 2017-01-11 | 2017-05-31 | 广东百圳君耀电子有限公司 | Many pin surface mount elements and preparation method thereof |
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