CN208014686U - A kind of encapsulating structure of sensing chip - Google Patents
A kind of encapsulating structure of sensing chip Download PDFInfo
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- CN208014686U CN208014686U CN201721771060.9U CN201721771060U CN208014686U CN 208014686 U CN208014686 U CN 208014686U CN 201721771060 U CN201721771060 U CN 201721771060U CN 208014686 U CN208014686 U CN 208014686U
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- sensing chip
- substrate
- polar region
- induction zone
- cathode area
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Abstract
The utility model discloses a kind of encapsulating structure of sensing chip, including sensing chip, sensing chip includes induction zone and positive polar region and cathode area, wherein positive polar region and cathode area are vertical with induction zone；Induction zone is arranged upward, and positive polar region and cathode area are respectively fixedly connected with a clamping plate, and positive polar region and cathode area are electrically connected with clamping plate；It is fixedly connected with substrate below two clamping plates, clamping plate is connect with electrical property of substrate；Substrate forms sealing space by box dam glue sticking transparent cover plate, the wherein inside of box dam glue, transparent cover plate and substrate, and two clamping plates and sensing chip are located in the sealing space, and has gap between transparent cover plate and induction zone.It can realize and existing new structural that chip of wound is packaged.
Description
Technical field
The utility model belongs to technical field of semiconductor encapsulation；More particularly to a kind of encapsulating structure of sensing chip.
Background technology
Conventional sensing chip, pad and induction zone are located at same surface, therefore make sensing core by lead key closing process
Piece is connected with electrical property of substrate.Currently, a kind of new structural sensing chip, the anode and cathode of the chip are located at chip phase
On corresponding two surfaces, the induction zone of the chip is located at other two opposite vertical plane, therefore existing wire bonding work
Skill cannot achieve the electric connection of such sensing chip, need to design a kind of novel encapsulation knot for such sensing chip
Structure, and complete its encapsulation.
Utility model content
The utility model provides a kind of encapsulating structure of sensor chip；It can realize to existing new structural sensing
Chip is packaged.
The technical solution of the utility model is：A kind of encapsulating structure of sensing chip, including sensing chip, sensing chip packet
Induction zone, positive polar region and cathode area are included, wherein positive polar region and cathode area are vertical with induction zone；Induction zone is arranged upward, positive polar region
It is respectively fixedly connected with a clamping plate with cathode area, and positive polar region and cathode area are electrically connected with clamping plate；The lower section of two clamping plates is solid
Surely it is connected with substrate, clamping plate is connect with electrical property of substrate；Substrate passes through box dam glue sticking transparent cover plate, wherein box dam glue, transparency cover
The inside of plate and substrate forms sealing space, and two clamping plates and sensing chip are located in the sealing space, and transparent cover plate and sense
Answering has gap between area.
Further, the utility model is also characterized by：
Wherein induction zone is flushed with the upper surface of two clamping plates.
Two of which clamping plate is Nian Jie with positive polar region and cathode area respectively by conducting resinl.
Its middle clamp plate is evenly arranged with multiple metal salient points on one side, and clamping plate passes through metal salient point and positive polar region and cathode area
Welding.
The bottom of its middle clamp plate is fixedly connected by welding compound with substrate.
Gap is equipped with wherein between the bottom surface and substrate of sensing chip.
Compared with prior art, the utility model has the beneficial effects that：The positive and negative of sensing chip is drawn by clamping plate
Pole simplifies processing step, and induction zone is upward, and induction zone has gap later with transparent cover plate, improves inductive effects；
The sealing space that box dam glue, transparent cover plate and substrate are formed protects sensing chip, prevent it by the pollution of working environment and
It influences.
Further, when induction zone is flushed with the upper surface of two clamping plates, the induction range of induction zone is by clamping plate
Influence it is minimum.
Further, clamping plate and sensing chip are pasted by conducting resinl, or by way of metal salient point and welding
Realize the connection of clamping plate and sensing chip；Two ways can realize the electric connection of clamping plate and sensing chip.
Further, the bottom of sensing chip is not contacted with substrate, therefore sensing chip is in above-mentioned sealing space
Portion is vacantly set up, therefore its working environment is stablized, reliably.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model encapsulating structure；
Fig. 2 is the structural schematic diagram of sensing chip in the utility model；
Fig. 3 is another structural schematic diagram of the utility model encapsulating structure；
Fig. 4 is another structural schematic diagram of the utility model encapsulating structure；
Fig. 5 is the process schematic of the embodiment 1 of packaging method in the utility model；
Fig. 6 is the process schematic of the embodiment 1 of packaging method in the utility model；
Fig. 7 is the process schematic of the embodiment 2 of packaging method in the utility model；
Fig. 8 is the process schematic of the embodiment 2 of packaging method in the utility model.
In figure：1 is substrate；2 be box dam glue；3 be transparent cover plate；4 be sensing chip；5 be first clamping plate；6 be the second folder
Plate；7 be conducting resinl；8 be welding compound；9 be induction zone；10 be positive polar region；11 be cathode area；12 be metal salient point.
Specific implementation mode
The technical solution of the utility model is further illustrated in the following with reference to the drawings and specific embodiments.
The utility model provides a kind of encapsulating structure of sensing chip, as shown in Fig. 2, the sensing chip 4 includes induction
Area 9, positive polar region 10 and cathode area 11, wherein induction zone 9 are horizontally disposed, and induction zone 9 hangs down with positive polar region 10 and cathode area 11
Directly, and positive polar region 10 and cathode area 11 are oppositely arranged.As shown in Figure 1, the encapsulating structure is：Induction zone 9 is arranged upward, positive polar region
10 and cathode area 11 got up respectively by 7 fixed bonding of conducting resinl with first clamping plate 5 and second clamping plate 6, wherein induction zone 9 be arranged
Between two clamping plates；First clamping plate 5 is fixedly connected on substrate 1 with the bottom of second clamping plate 6 by welding compound 8；Wherein just
Polar region 10 by conducting resinl 7, first clamping plate 5 and welding compound 8 and substrate 1 can electrical communication, cathode area 11 by conducting resinl 7,
Second clamping plate 6 and welding compound 8 being capable of electrical communications with substrate 1；Two clamping plates and in-between sensing chip 4 are surrounded on substrate 1
It is provided with box dam glue 2,2 fixed bonding substrate 1 of box dam glue and transparent cover plate 3, wherein transparent cover plate 3 are arranged on the 9 of induction zone
Side, wherein forms sealing space between substrate 1, box dam glue 2 and transparent cover plate 3, be two clamping plates and sensing core in sealing space
Piece 4, wherein sensing chip 4 are not contacted with substrate 1, i.e., have certain interval between the bottom surface of sensing chip 4 and substrate 1, and
There is certain interval between box dam glue 2 and two clamping plates, there is certain interval between transparent cover plate 3 and induction zone 9.
Preferably, as shown in figure 3, the face that first clamping plate 5 and second clamping plate 6 are connect with positive polar region 10 and cathode area 11
On be evenly distributed with multiple metal salient points 12, and metal salient point 12 and positive polar region 10 or cathode area 11 are consolidated by welding manner
Surely it connects；
Preferably, as shown in figure 4, induction zone 9 is flushed with the upper surface of first clamping plate 5 and second clamping plate 6.
Preferably, first clamping plate 5 and second clamping plate 6 select copper coin, silver plate, plating alsifilm, copper facing silicon chip, gold-plated silicon chip or
One or both of silver-plated silicon chip.
Preferably, welding compound 8 is one kind in conductive silver paste or tin cream.
Preferably, transparent cover plate 3 is media or the preferable media of other light transmissions such as transparent plastics or glass.
The packaging method of the utility model sensing chip encapsulating structure, includes the following steps：
Step S1, as shown in figure 5, by conductive adhesive by the positive polar region 10 of sensing chip 4 and cathode area 11 respectively with
One Boards wall connects, and the induction zone 9 of sensing chip 4 is made to be arranged upward；As shown in fig. 7, clamping plate with
It is uniformly arranged multiple metal salient points 12 on the face that positive polar region 10 and cathode area 11 connect, and is pressed from both sides first by metal salient point 12
Plate 5 and positive polar region 10 and second clamping plate 6 and cathode area 11 are welded；Two of which clamping plate is copper coin, silver plate, plating alsifilm, plating
One or both of copper silicon chip, gold-plated silicon chip or silver-plated silicon chip.
The bottom of two clamping plates is fixedly connected with the interposition of substrate 1 by step S2 as shown in Fig. 6 or 8 by welding compound 8
It sets, and makes to be equipped with gap between sensing chip 4 and substrate 1, is i.e. the bottom surface of sensing chip 4 is not contacted with the surface of substrate 1；Its
Middle welding compound 8 is one kind in conductive silver paste or tin cream.
Step S3 surrounds two clamping plates and a corral dam glue 7, and higher than two folders of the height of box dam glue 7 is arranged on substrate 1
Then the height of plate is bonded transparent cover plate 3 on box dam glue 7, and ensure shape between box dam glue 7, substrate 1 and transparent cover plate 3
At the sealing space for accommodating two clamping plates and sensing chip 4；Sensing chip encapsulating structure is obtained after the solidification of box dam glue 7.
The sensing chip encapsulating structure during encapsulation, two clamping plates can select simultaneous selection for copper coin, silver plate,
Copper facing silicon plate, plating gold silicon plate or silver-plated silicon plate or two clamping plates are above-mentioned two different planks；Transparent cover plate 3 is transparent
Plastics, transparent acrylic board, glass or the good medium of other translucency；And can by the induction zone 9 of sensing chip 4 with
The upper surface of two clamping plates is set as flushing, and finally obtains the encapsulating structure of sensing chip as shown in Figure 4.
Claims (6)
1. a kind of encapsulating structure of sensing chip, including sensing chip (4), sensing chip (4) includes induction zone (9), positive polar region
(10) and cathode area (11), wherein positive polar region (10) and cathode area (11) are vertical with induction zone (9)；It is characterized in that, induction zone
(9) it is arranged upward, positive polar region (10) and cathode area (11) are respectively fixedly connected with a clamping plate, and positive polar region (10) and cathode area
(11) it is electrically connected with clamping plate；Substrate (1) is fixedly connected with below two clamping plates, clamping plate is electrically connected with substrate (1)；Substrate
(1) transparent cover plate (3) is bonded by box dam glue (2), the inside of wherein box dam glue (2), transparent cover plate (3) and substrate (1) is formed
Sealing space, two clamping plates and sensing chip (4) are located in the sealing space, and have between transparent cover plate (3) and induction zone (9)
There is gap.
2. the encapsulating structure of sensing chip according to claim 1, which is characterized in that the induction zone (9) and two folders
The upper surface of plate flushes.
3. the encapsulating structure of the sensing chip according to claims 1 or 2 any one, which is characterized in that described two folders
Plate is Nian Jie with positive polar region (10) and cathode area (11) respectively by conducting resinl (7).
4. the encapsulating structure of the sensing chip according to claims 1 or 2 any one, which is characterized in that the clamping plate
It is evenly arranged with multiple metal salient points (12) on one side, clamping plate is welded by metal salient point (12) and positive polar region (10) and cathode area (11)
It connects.
5. the encapsulating structure of sensing chip according to claim 1, which is characterized in that the bottom of the clamping plate passes through welding
Agent (8) is fixedly connected with substrate (1).
6. the encapsulating structure of sensing chip according to claim 1, which is characterized in that the bottom surface of the sensing chip (4)
Gap is equipped between substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721771060.9U CN208014686U (en) | 2017-12-18 | 2017-12-18 | A kind of encapsulating structure of sensing chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721771060.9U CN208014686U (en) | 2017-12-18 | 2017-12-18 | A kind of encapsulating structure of sensing chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208014686U true CN208014686U (en) | 2018-10-26 |
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ID=63880112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721771060.9U Active CN208014686U (en) | 2017-12-18 | 2017-12-18 | A kind of encapsulating structure of sensing chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208014686U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946269A (en) * | 2017-12-18 | 2018-04-20 | 华天科技（西安）有限公司 | The encapsulating structure and its method for packing of a kind of sensing chip |
-
2017
- 2017-12-18 CN CN201721771060.9U patent/CN208014686U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107946269A (en) * | 2017-12-18 | 2018-04-20 | 华天科技（西安）有限公司 | The encapsulating structure and its method for packing of a kind of sensing chip |
| CN107946269B (en) * | 2017-12-18 | 2024-03-26 | 华天科技（西安）有限公司 | Packaging structure and packaging method of sensing chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Huatian Science and Technology (Nanjing) Co.,Ltd. Assignor: HUATIAN TECHNOLOGY (XI'AN) Co.,Ltd. Contract record no.: X2021610000004 Denomination of utility model: A packaging structure of sensor chip Granted publication date: 20181026 License type: Common License Record date: 20210526 |
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| EE01 | Entry into force of recordation of patent licensing contract |