CN105957846A - Optical module - Google Patents

Optical module Download PDF

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Publication number
CN105957846A
CN105957846A CN201610496308.9A CN201610496308A CN105957846A CN 105957846 A CN105957846 A CN 105957846A CN 201610496308 A CN201610496308 A CN 201610496308A CN 105957846 A CN105957846 A CN 105957846A
Authority
CN
China
Prior art keywords
substrate
optical module
conductive path
flexible pcb
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610496308.9A
Other languages
Chinese (zh)
Other versions
CN105957846B (en
Inventor
何鹏
徐海强
杨思更
张帅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to CN201610496308.9A priority Critical patent/CN105957846B/en
Publication of CN105957846A publication Critical patent/CN105957846A/en
Application granted granted Critical
Publication of CN105957846B publication Critical patent/CN105957846B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/04Refractors for light sources of lens shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3675Cooling facilitated by shape of device characterised by the shape of the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/147Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4269Cooling with heat sinks or radiation fins
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4272Cooling with mounting substrates of high thermal conductivity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/042Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Abstract

The invention relates to an optical module, and belongs to the field of optical communication. The method comprises a shell, a first substrate, a second substrate and a third substrate, wherein conductive paths are arranged on one surface of the first substrate, one surface of the second substrate and one surface of the third substrate respectively; the second substrate and/or the third substrate are in contact with the shell; the conductive path of the second substrate is connected with the conductive path of the third substrate through a first flexible circuit board; the other surface of the second substrate is in contact with the other surface of the third substrate; the conductive path of the second substrate is electrically connected with the conductive path of the first substrate; and the second substrate is not in contact with the first substrate. By the optical module, the effect of improving the heat dissipation effect of a chip is achieved; and the optical module is applied to optical communication.

Description

Optical module
Technical field
The present invention relates to optical module and manufacture field, particularly to a kind of optical module.
Background technology
Printed circuit board is (English: Printed circuit board;It is called for short: PCB), also known as printed circuit board (PCB), It is the important component part of optical module, for the electrical connection of each chip.
In correlation technique, PCB includes underlay substrate, and the plain conductor being formed on this underlay substrate and Pad, chip is by being fixed on its pin and pad solder on this pcb board, and the PCB being provided with chip leads to Usually through some connector fixed placement in the housing of optical module.
But in correlation technique, chip is to carry out dispelling the heat by the underlay substrate of PCB, and due to housing Small volume, there is certain restriction, therefore, the heat radiation of the chip on PCB in the area of dissipation of underlay substrate Effect is poor.
Summary of the invention
In order to realize improving the purpose of the radiating effect of chip, embodiments provide a kind of optical module. Described technical scheme is as follows:
Housing, first substrate, second substrate and the 3rd substrate,
The one side of the one side of described first substrate, the one side of described second substrate and described 3rd substrate sets respectively It is equipped with conductive path;
Described second substrate and/or described 3rd substrate contact with described housing;
The conductive path of described second substrate passes through the first flexible PCB with the conductive path of described 3rd substrate Connect;
The another side of described second substrate contacts with the another side of described 3rd substrate;
The conductive path of described second substrate electrically connects with the conductive path of described first substrate;
Described second substrate does not contacts with described first substrate.
In the embodiment of the present invention, owing to being provided with first substrate to the 3rd substrate totally 3 pieces of substrates, by the second base Plate and/or described 3rd substrate contact heat radiation with described housing, on the basis of by 3 pieces of substrate self-radiatings, Add the channel of more heat radiation for chip, therefore, be effectively increased the radiating effect of chip.
It should be appreciated that it is only exemplary that above general description and details hereinafter describe, can not Limit the present invention.
Accompanying drawing explanation
In order to be illustrated more clearly that embodiments of the invention, required use in embodiment being described below Accompanying drawing is briefly described, it should be apparent that, the accompanying drawing in describing below is only some enforcements of the present invention Example, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to root Other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of optical module that the present invention one exemplary embodiment provides.
Fig. 2 is the part-structure schematic diagram of a kind of optical module that the present invention one exemplary embodiment provides.
Fig. 3 is the part-structure schematic diagram of the another kind of optical module that the present invention one exemplary embodiment provides.
Fig. 4 is the expansion knot of first substrate and second substrate and the 3rd substrate in the present invention one exemplary embodiment Structure schematic diagram.
Fig. 5 is the part-structure schematic diagram of another optical module that the present invention one exemplary embodiment provides.
Fig. 6 is the part-structure schematic diagram of another optical module that the present invention one exemplary embodiment provides.
Fig. 7 is the part-structure schematic diagram of a kind of optical module that another exemplary embodiment of the present invention provides.
Accompanying drawing herein is merged in description and constitutes the part of this specification, it is shown that meet the present invention Embodiment, and for explaining the principle of the present invention together with description.
Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to this Bright it is described in further detail, it is clear that described embodiment is only some embodiments of the present invention, Rather than whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing Go out all other embodiments obtained under creative work premise, broadly fall into the scope of protection of the invention.
The embodiment of the present invention provides the structural representation of a kind of optical module 1, as it is shown in figure 1, include:
Housing 11, first substrate 12, second substrate 13 and the 3rd substrate 14.
The one side of the one side of first substrate 12, the one side of second substrate 13 and the 3rd substrate 14 is respectively arranged with Conductive path, this conductive path is usually plain conductor;Second substrate 13 and/or the 3rd substrate 14 and housing 11 contacts;The conductive path of second substrate 13 and the conductive path of the 3rd substrate 14 are by the first flexible circuit Plate 15 connects;The another side of second substrate 13 and the another side contact of the 3rd substrate 14;Second substrate 13 Conductive path electrically connect with the conductive path of first substrate 12;Second substrate 13 does not connects with first substrate 12 Touch.This first flexible PCB 15 can be by Kapton and be formed at leading on this Kapton Electric pathway is constituted.
In the embodiment of the present invention, owing to being provided with first substrate to the 3rd substrate totally 3 pieces of substrates, by 3 On the basis of block substrate self-radiating, second substrate and/or the 3rd substrate contact heat radiation with housing, for chip Add the channel of more heat radiation, therefore, be effectively increased the radiating effect of chip.
Optionally, as it is shown in figure 1, Fig. 1 assumes the plate face plate than second substrate 13 of the 3rd substrate 14 Face includes overlay area F and clear area K on the inwall of housing 11, the one side of the 3rd substrate 14, Being provided with conductive path on the F of overlay area, clear area K is not provided with conductive path, clear area K with The housing 11 of optical module contacts, and the most both can avoid electric leakage, can realize again second substrate and the 3rd substrate Effective heat radiation.
In the embodiment of the present invention, second substrate and/or the 3rd substrate are commonly referred to as directly connecing with contacting of housing Touching, such radiating effect is optimal, can be mediate contact in actual application, as contacted by conductive structure, This conductive structure is sheet metal or metal column.Further, optionally, second substrate can also include overlay area And clear area, the clear area of second substrate contacts with the housing of optical module.The embodiment of the present invention is to this not Repeat again.Second substrate 13 does not contact with first substrate 12 and refers to both plate face and do not contact, optionally, Both plate faces are parallel.
It should be noted that the conductive path of the conductive path of second substrate 13 and first substrate 12 can lead to Crossing various ways electrical connection, the embodiment of the present invention illustrates as a example by following two mode:
First kind of way: electrically connected by flexible PCB.
Concrete, as in figure 2 it is shown, Fig. 2 assumes the plate face plate than the 3rd substrate 14 of second substrate 13 Face, near the plate face of first substrate 12, is provided with support column 16 between first substrate 12 and second substrate 13, These support column 16 two ends can be fixed be connected with first substrate 12 and second substrate 13 respectively, this support column 16 Can be one or more, its number can be adjusted according to actual scene, and the embodiment of the present invention is to this not Limit.Under normal circumstances, first substrate fixed placement is in housing, and support column is arranged on this first substrate One side (being usually provided with the one side of conductive path), be used for supporting second substrate and the 3rd substrate, make Second substrate does not contacts with first substrate, and is formed for housing chip between second substrate and first substrate Semi-open cavity.The conductive path of second substrate 13 is flexible by second with the conductive path of first substrate 12 Circuit board 17 connects, and this second flexible PCB 17 can be by Kapton with to be formed at this polyamides sub- Conductive path on amine thin film is constituted.In actual application, support column 16 can pass this second flexible PCB 17 are directly connected to second substrate, it is also possible to by being connected realization and second substrate with the second flexible PCB 17 Fixing connection, this is not repeated by the embodiment of the present invention.
The second way: electrically connected by conductive pin.
Concrete, as it is shown on figure 3, Fig. 3 assumes the plate face plate than the 3rd substrate 14 of second substrate 13 Face, near the plate face of first substrate 12, is provided with conductive pin 18 between first substrate 12 and second substrate 13, These conductive pin 18 two ends are fixed be connected with first substrates 12 and second substrate 13 respectively, and this conductive pin 18 can Thinking one or more, its number can be adjusted according to actual scene, and this is not done by the embodiment of the present invention Limit.Under normal circumstances, first substrate fixed placement is in housing, and conductive pin is arranged on this first substrate Simultaneously, it is used for supporting second substrate and the 3rd substrate, makes second substrate not contact with first substrate, and second The semi-open cavity for housing chip is formed between substrate and first substrate.In Fig. 3, second substrate 13 Conductive path is electrically connected by conductive pin 18 with the conductive path of first substrate 12, this conductive pin usually gold Belong to material to make.It should be noted that for the conductive effect ensureing conductive pin, at first substrate 12 and When two substrates 13 use conductive pin to be electrically connected, the material of first substrate 12 and second substrate 13 is not gold Belonging to material, both are generally formed from a resin.
In actual application, the conductive path of second substrate 13 can also lead to the conductive path of first substrate 12 Crossing and be similar to other structures of above-mentioned conductive pin and be electrically connected, these other structures have conduction and the merit supported Can, such as adapter, the conductive pin that its position arranged is referred in Fig. 3, the embodiment of the present invention is to this Repeat no more.
In traditional optical module, PCB includes that underlay substrate, conductive path and chip are formed at this underlay substrate One side on, due to the small volume of housing, underlay substrate is horizontally set in this housing, underlay substrate There is certain restriction, the chip therefore placed in housing in fabric swatch area (i.e. arranging the area of conductive path) Number less.
Optical module in the embodiment of the present invention, shown in figure as arbitrary in Fig. 1 to Fig. 3, owing to optical module includes One substrate, second substrate and the 3rd at least 3 pieces of substrates of substrate, and the one side of first substrate, second substrate The one side of one side and the 3rd substrate is respectively arranged with conductive path, and this conductive path is used for connecting chip, therefore, The one side of the one side of first substrate, the one side of second substrate and the 3rd substrate all can arrange chip, although In horizontal direction, the area of the Free Region (arranging the region of optical module) of substrate cannot extend, but passes through The substrate superposition of in the vertical direction, it is achieved that the extension of the area of substrate Free Region, therefore, the present invention The optical module that embodiment provides can increase fabric swatch area, accommodating more chip, improves the entirety of optical module Fabric utilization.
Further, using the optical module that the embodiment of the present invention provides, its internal structure installs light and flexible.Such as Fig. 4 Shown in, Fig. 4 is the deployed configuration signal of first substrate and second substrate and the 3rd substrate in the embodiment of the present invention Figure, in Fig. 4, uses the structure of above-mentioned first kind of way to realize conductive path and first base of second substrate 13 The connection of the conductive path of plate 12, the first flexible PCB 15 and the second flexible PCB 17 can set respectively Put the both sides at second substrate 13, may generally be considered as the left and right sides in Fig. 4.When assembling, Ke Yitong Cross second substrate 13 is provided with flexible PCB one to overturn towards near first substrate 12 side, by the 3rd Substrate 14 is not provided with the one of flexible PCB and overturns towards near second substrate 13 side so that second substrate 13 one sides being not provided with flexible PCB are fitted with the one side that the 3rd substrate 14 is not provided with flexible PCB, And the conductive rubbers such as elargol can be coated at binding face, it is ensured that consolidating of second substrate 13 and the 3rd substrate 14 Determine and effectively contact.Further, as shown in Figure 4, optical module also includes: cover at second substrate 13 The 3rd flexible PCB 19 in one side, the 3rd flexible PCB 19 and the first flexible PCB 15, The structure of two flexible PCBs 17 is identical with material, first flexible PCB the 15, second flexible PCB 17 It is structure as a whole with the 3rd flexible PCB 19.So so that flexible PCB is one-body molded, simplify system Make process, by the simple first substrate and second substrate and the 3rd substrate folding and can being formed as shown in Figure 5 Hierarchical structure.Further, the first flexible PCB the 15, second flexible PCB 17 and the 3rd flexible PCB 19 when being structure as a whole, and the connection of the conductive path that it is arranged is more smoothly, and the efficiency of transmission of signal is higher.
In actual application, the number of substrate can also increase, as in figure 2 it is shown, this optical module may include that
(in Fig. 3, this flexible PCB is first flexible PCB the 15, second flexible electrical to 2 flexible PCBs The integrative-structure that road plate 17 and the 3rd flexible PCB 19 are formed), 2 second substrates and 2 the 3rd substrates, 2 flexible PCBs are symmetricly set on the both sides of first substrate, and each flexible PCB is for connecting 1 second Substrate and 1 the 3rd substrate.
Or, as shown in Figure 4, this optical module may include that 2 second substrates and 2 the 3rd substrates, the Being coated with flexible PCB on one substrate, flexible PCB extends predeterminable range to first substrate both sides respectively, It is positioned at the extension of flexible PCB of the every side of first substrate for connecting 1 second substrate and 1 the Three substrates.The above-mentioned part extending predeterminable range can be that in Fig. 4, the first flexible PCB 15, second is soft Property circuit board 17 and the 3rd flexible PCB 19 formed integrative-structure.
It should be noted that second substrate 13 and the orthographic projection on first substrate 12 of the 3rd substrate 14 are permissible It is respectively positioned in first substrate 12.So can effectively reduce substrate size expansion in the horizontal direction, with shell While the size coupling of body, increase fabric swatch area, it is achieved the utilization of Free Region maximizes.
In order to strengthen the heat radiation of chip further, as shown in Figure 6, this first flexible PCB 15 in Fig. 6, Second flexible PCB 17 and the 3rd flexible PCB (Fig. 6 does not indicates) form integrative-structure, and optical module is also May include that chip 20, in Fig. 6 respectively as a example by the first chip 201 and the second chip 202, the second base The one side of plate 13 is provided with boss 110, and the thickness of boss 110 is more than or equal to the thickness of flexible PCB, Its material is identical with the sheet material of second substrate, the flexible PCB on second substrate 13 is provided with and wears for boss The through hole (Fig. 6 does not marks) crossed, chip 20 contacts with boss 110, it is achieved effectively dissipating of this chip 20 Heat.Chip 20 directly or indirectly can contact with boss 110.In Fig. 6, the back side of the first chip 201 (namely being not provided with the one side of conductive path) is pasted onto the top of boss 110, front (Fig. 6 by elargol In identified with the one side with circle) pad (this weldering by wire and second substrate 13 of pin Dish is arranged on the 3rd flexible PCB) connect;The back side of the second chip 202 by radiator structure 203 with The tip contact of boss 110, and the pin in front is connected with the pad of first substrate 12, the second chip 202 The surface of first substrate 12 can be fitted in.
Further, as it is shown in fig. 7, optical module can also include: lens subassembly 30 and optical module (Fig. 7 Do not indicate), lens subassembly 30 forms cavity with face, conductive path place, and chip (Fig. 7 does not indicates) is positioned at In cavity.In embodiments of the present invention, optical module can be laser instrument or detector, and chip can be light core Sheet, such as laser instrument or the chip of detector.
In the embodiment of the present invention, first substrate 12 is formed from a resin, and second substrate 13 and the 3rd substrate 14 are also Can all be formed from a resin, the good heat dispersion performance of the substrate being formed from a resin.Due to metal dissipating compared with resin More preferably, second substrate 13 and the 3rd substrate 14 can also be made of metal hot property.
It should be noted that in the embodiment of the present invention, the relative position of each substrate is permissible according to practical situation Suitably adjusting, Fig. 1 to Fig. 7 of the present invention simply schematically illustrates, the base of the structure arbitrarily provided in the present invention The structure obtained by simple deformation on plinth all should contain within the scope of the present invention.
In sum, in the embodiment of the present invention, owing to being provided with first substrate to the 3rd substrate totally 3 pieces of substrates, On the basis of by 3 pieces of substrate self-radiatings, second substrate and/or the 3rd substrate contact heat radiation with housing, Add the channel of more heat radiation for chip, therefore, be effectively increased the radiating effect of chip.Further, by In by the substrate superposition of in the vertical direction, it is achieved that the extension of the area of substrate Free Region, therefore, The optical module that the embodiment of the present invention provides can increase fabric swatch area, accommodating more chip, improves optical module Overall structure utilization rate.
Term "and/or" in the present invention, a kind of incidence relation describing affiliated partner, represent permissible There are three kinds of relations, such as, A and/or B, can represent: individualism A, there is A and B simultaneously, Individualism B these three situation.It addition, character "/" herein, typically represent forward-backward correlation to as if one Plant the relation of "or".
Those skilled in the art, after considering description and putting into practice invention disclosed herein, will readily occur to this Other bright embodiment.The application is intended to any modification, purposes or the adaptations of the present invention, These modification, purposes or adaptations are followed the general principle of the present invention and include that the present invention is not disclosed Common knowledge in the art or conventional techniques means.Description and embodiments is considered only as exemplary , true scope and spirit of the invention are pointed out by claim.
It should be appreciated that the invention is not limited in accurate knot described above and illustrated in the accompanying drawings Structure, and various modifications and changes can carried out without departing from the scope.The scope of the present invention is only by appended Claim limits.

Claims (10)

1. an optical module, it is characterised in that including:
Housing, first substrate, second substrate and the 3rd substrate,
The one side of the one side of described first substrate, the one side of described second substrate and described 3rd substrate sets respectively It is equipped with conductive path;
Described second substrate and/or described 3rd substrate contact with described housing;
The conductive path of described second substrate passes through the first flexible PCB with the conductive path of described 3rd substrate Connect;
The another side of described second substrate contacts with the another side of described 3rd substrate;
The conductive path of described second substrate electrically connects with the conductive path of described first substrate;
Described second substrate does not contacts with described first substrate.
Optical module the most according to claim 1, it is characterised in that wrap in the one side of described 3rd substrate Including overlay area and clear area, described overlay area is provided with conductive path, described clear area does not sets Being equipped with conductive path, described clear area contacts with the housing of described optical module.
Optical module the most according to claim 1, it is characterised in that
It is provided with support column between described first substrate and described second substrate;
The conductive path of described second substrate passes through the second flexible PCB with the conductive path of described first substrate Connect.
Optical module the most according to claim 1, it is characterised in that the conductive path of described second substrate It is connected by the second flexible PCB with the conductive path of first substrate, described first flexible PCB and described Second flexible PCB is separately positioned on the both sides of described second substrate.
Optical module the most according to claim 3, it is characterised in that described optical module also includes: chip,
The one side of described second substrate is provided with boss, and the thickness of described boss is more than or equal to described flexible electrical The thickness of road plate, the flexible PCB on described second substrate is provided with the through hole passed for described boss, Described chip contacts with described boss.
Optical module the most according to claim 1, it is characterised in that
It is provided with conductive pin between described first substrate and described second substrate,
Described conductive pin two ends are fixing with described first substrate and described second substrate respectively to be connected, and described second The conductive path of substrate is electrically connected by described conductive pin with the conductive path of described first substrate.
7. according to the arbitrary described optical module of claim 3 to 6, it is characterised in that described optical module also wraps Including: lens subassembly and chip, described lens subassembly forms cavity, described core with face, described conductive path place Sheet is positioned in described cavity.
Optical module the most according to claim 4, it is characterised in that described optical module also includes:
The covering the 3rd flexible PCB in the one side of described second substrate, described first flexible PCB, Described second flexible PCB and described 3rd flexible PCB are structure as a whole.
Optical module the most according to claim 7, it is characterised in that described second substrate and the described 3rd Substrate orthographic projection on described first substrate is respectively positioned in described first substrate.
Optical module the most according to claim 1, it is characterised in that described first substrate is by resin-made Becoming, described second substrate and described 3rd substrate are each made of a metal or are all formed from a resin.
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US10465894B2 (en) 2019-11-05

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