CN206117605U - Crystal oscillator's packaging structure - Google Patents
Crystal oscillator's packaging structure Download PDFInfo
- Publication number
- CN206117605U CN206117605U CN201621175544.2U CN201621175544U CN206117605U CN 206117605 U CN206117605 U CN 206117605U CN 201621175544 U CN201621175544 U CN 201621175544U CN 206117605 U CN206117605 U CN 206117605U
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- China
- Prior art keywords
- pcb board
- crystal oscillator
- base
- encapsulating structure
- chip
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Abstract
The utility model provides a crystal oscillator's packaging structure, including encapsulating shell and wafer, the wafer encapsulation is in the encapsulating shell, the encapsulating shell includes metal cap and base, its characterized in that, the base is the PCB board, be provided with two electrodes on the PCB board, the wafer bonds on two electrodes, the PCB flange is provided with the open slot along the symmetric position, the electrode draw forth the foot extended to the PCB board through the open slot the back, the metal cap passes through glue and bonds on the PCB board, the utility model discloses crystal oscillator's packaging structure's base adopts the PCB board to replace traditional metab, preparation cost reduction, and can encapsulate a plurality of crystal oscillators simultaneously on a PCB board, preparation simple process, and it is efficient.
Description
Technical field
This utility model is related to a kind of encapsulating structure of crystal oscillator, belongs to crystal oscillator encapsulation technology field.
Background technology
Crystal oscillator（Abbreviation crystal oscillator）Have tens every year in our domestic market demands, add foreign countries, have on
The market of 10000000000.It is commonly used on colour TV, refrigerator, mobile phone, computer and most of electronic product.As shown in figure 1, existing skill
The base 3 of the crystal oscillator of art production is metab, and the above is metal cap 2, is discharged by electric capacity metal cap 2 is bonding with base 3
Together, chip 1 is packaged with metab and metal cap 2, chip 1 is connected with metab by two spring leafs 6, metal
Two electrode holes are provided with base, two metal lead-outs of string in hole, metal lead-outs are electrode 4, electrode 4 and spring leaf 6
Electrode 4 and metab are sintered to fix in electrode hole, while being lined with felt pad under metab by connection with insulating glass pearl 7
Piece 8, prevents metal lead-outs short-circuit with base 3 after bending.
The encapsulating structure of prior art has the disadvantages that：
1st, packaging technology is less efficient, high cost：One cap sealing machine can only produce 20,000 in 12 hours one day, and equipment also has
Jing is often keeped in repair, and equipment investment is big, high, cost of labor is high to take electricity, material cost, and volume is big, customer is using also inconvenient；
2nd, insulating glass pearl fragmentation is easily made when metal lead-outs bend, cause 3 gas leakage of base, cause crystal oscillator to fail；
3rd, the easy firepower too senior general's product of electric capacity electric discharge sparking breaks or affects crystal oscillator performance.
The content of the invention
The purpose of this utility model is the defect existed for prior art, there is provided a kind of encapsulation knot of crystal oscillator
Structure, the pier replace traditional metab using pcb board, and cost of manufacture is reduced, and can be encapsulated simultaneously on one piece of pcb board
Multiple crystal oscillators, processing technology are simple, and efficiency high.
To realize above technical purpose, the technical solution adopted in the utility model is：A kind of encapsulation knot of crystal oscillator
Structure, including encapsulating shell and chip, in encapsulating shell, the encapsulating shell includes metal cap and base to the wafer package, its feature
It is that the base is pcb board, and two electrodes are provided with the pcb board, and the bonding wafer is on two electrodes, described
Pcb board edge symmetric position is provided with open slot, and the leading foot of the electrode extends to the back side of pcb board by open slot, institute
State metal cap to be bonded on pcb board by glue.
Further, multiple bases can be made simultaneously on one piece of pcb board, can complete the encapsulation of multiple crystal oscillators simultaneously.
Further, the size of the encapsulating structure of the crystal oscillator is 7.4mm*4.3mm*1.8mm.
Further, the material of the electrode is copper.
Further, pass through silver paste bonding between the chip and electrode.
From the above, it can be seen that this utility model has following beneficial effect compared with prior art：
（1）Production efficiency is high, can produce within 1 hour 40,000 per complete equipment, calculated by 12 hours within a set of one day and can produce
480000, be 24 times of original production efficiency；
（2）Cost is reduced, and pcb board is relatively low as the cost of manufacture of base, and as pcb board is insulation, it is not necessary to absolutely
Edge bead and insulation spacer, while the encapsulation of multiple crystal oscillators can be completed on one piece of pcb board simultaneously, fabrication processing simplifies,
Resulting cost can reduce original 30%；
（3）Compared with conventional art, electrode structure of the present utility model can avoid the problem for making base produce gas leakage；
（4）Because metal cap and base are to use glue bonding, therefore are not in the excessive produced crystalline substance of electric capacity electric discharge
Shake failure；
（5）The small volume of finished product, volume is 7.4mm*4.3mm*1.8mm, and client uses Miniaturizable.
Description of the drawings
Fig. 1 is the right side cross section structure diagram of the encapsulating structure of the crystal oscillator of prior art.
Fig. 2 is perspective structure schematic diagram of the present utility model.
Fig. 3 is polycrystalline substance schematic diagram of the present utility model.
Description of reference numerals：1- chips, 2- metal caps, 3- bases, 4- electrodes, 5- open slots, 6- spring leafs, 7- insulation glass
Glass pearl, 8- insulation spacers.
Specific embodiment
With reference to concrete accompanying drawing, the utility model is described in further detail.
With reference to the accompanying drawings shown in 2 and Fig. 3, a kind of encapsulating structure of crystal oscillator, including encapsulating shell and chip 1, the crystalline substance
Piece 1 is encapsulated in encapsulating shell, and the encapsulating shell includes metal cap 2 and base 3, it is characterised in that the base 3 be pcb board, institute
State, the material of the electrode 4 is copper, and the chip 1 is bonded on two electrodes 4, described
By silver paste bonding between chip 1 and electrode 4,
Pcb board edge symmetric position is provided with open slot 5, and the leading foot of the electrode 4 is extended to by open slot 5
The back side of pcb board, the metal cap 2 are bonded on pcb board by glue.
Multiple bases 3 can be made on one piece of pcb board simultaneously, the encapsulation of multiple crystal oscillators can be completed simultaneously.
The size of the encapsulating structure of the crystal oscillator is 7.4mm*4.3mm*1.8mm.
The characteristics of this utility model, is done base 3 using pcb board and replaces traditional metab, while the encapsulating structure
The size shape of electrode 4 not exclusively fix, can need to arrange according to practical application.It is possible, firstly, to reduces cost, pcb board
It is relatively low as the cost of manufacture of base；Secondly as pcb board is insulation, it is not necessary to which insulation spacer and insulating glass pearl go to prevent
Only short circuit between electrode 4 and base 3；Again, multiple bases 3 can be made simultaneously on one piece of big pcb board, you can while completing many
The encapsulation of individual crystal oscillator, greatly improves production efficiency, simplifies technological process；Finally, the encapsulating structure can make miniaturization, should
With more extensive.
Above this utility model and embodiments thereof are described, the description does not have restricted, shown in accompanying drawing
Also it is one of embodiment of the present utility model, actual structure is not limited thereto.If the ordinary skill people of this area
Member, is designed and the technical scheme without creative in the case where objective is created without departing from this utility model by its enlightenment
Similar frame mode and embodiment, all should belong to protection domain of the present utility model.
Claims (5)
1. a kind of encapsulating structure of crystal oscillator, including encapsulating shell and chip（1）, the chip（1）It is encapsulated in encapsulating shell,
The encapsulating shell includes metal cap（2）And base（3）, it is characterised in that the base（3）For pcb board, set on the pcb board
It is equipped with two electrodes（4）, the chip（1）It is bonded in two electrodes（4）On, pcb board edge symmetric position is provided with out
Mouth groove（5）, the electrode（4）Leading foot pass through open slot（5）Extend to the back side of pcb board, the metal cap（2）By glue
Water is bonded on pcb board.
2. the encapsulating structure of a kind of crystal oscillator according to claim 1, it is characterised in that：Can be same on one piece of pcb board
When make multiple bases（3）, the encapsulation of multiple crystal oscillators can be completed simultaneously.
3. the encapsulating structure of a kind of crystal oscillator according to claim 1, it is characterised in that：The crystal oscillator
The size of encapsulating structure is 7.4mm*4.3mm*1.8mm.
4. the encapsulating structure of a kind of crystal oscillator according to claim 1, it is characterised in that：The electrode（4）Material
Expect for copper.
5. the encapsulating structure of a kind of crystal oscillator according to claim 1, it is characterised in that：The chip（1）And electricity
Pole（4）Between pass through silver paste bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621175544.2U CN206117605U (en) | 2016-10-27 | 2016-10-27 | Crystal oscillator's packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621175544.2U CN206117605U (en) | 2016-10-27 | 2016-10-27 | Crystal oscillator's packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206117605U true CN206117605U (en) | 2017-04-19 |
Family
ID=58524668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621175544.2U Active CN206117605U (en) | 2016-10-27 | 2016-10-27 | Crystal oscillator's packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206117605U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107332532A (en) * | 2017-06-27 | 2017-11-07 | 袁力翼 | A kind of encapsulation preparation method of crystal oscillator |
-
2016
- 2016-10-27 CN CN201621175544.2U patent/CN206117605U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107332532A (en) * | 2017-06-27 | 2017-11-07 | 袁力翼 | A kind of encapsulation preparation method of crystal oscillator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210525 Address after: 214072 No.20 Xichang Road, Yanqiao supporting area (South District), Huishan Economic Development Zone, Wuxi City, Jiangsu Province Patentee after: Wuxi newcore Electronic Technology Co.,Ltd. Address before: 214001 2nd floor, building 11, 28 Huibei Road, Liangxi District, Wuxi City, Jiangsu Province Patentee before: WUXI YIRUI ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right |