CN217900885U - Sensor shell - Google Patents
Sensor shell Download PDFInfo
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- CN217900885U CN217900885U CN202221340189.5U CN202221340189U CN217900885U CN 217900885 U CN217900885 U CN 217900885U CN 202221340189 U CN202221340189 U CN 202221340189U CN 217900885 U CN217900885 U CN 217900885U
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- cavity
- sensor housing
- casing
- baffle
- housing
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Abstract
The utility model relates to a sensor housing, including first casing and second casing, be provided with the baffle in the second casing, the baffle is first cavity and second cavity with second casing internal partitioning, and first cavity is inside to be used for placing circuit board, and baffle upper portion is provided with a plurality of holding recesses, is provided with the through-hole that is linked together with the external world on the second cavity, and the second cavity is used for holding wire or contact pin, fills sealed glue in the second cavity, and first casing closing cap is on second casing upper portion. The utility model discloses a sensor housing not only has better sealed effect, the product dismouting and the maintenance of also being convenient for simultaneously to the processing cost has effectively been reduced.
Description
Technical Field
The utility model relates to a sensor technical field especially indicates a sensor housing.
Background
In a slightly large electronic device, waterproofing is generally achieved by providing a gasket, but in the case of a vehicle sensor, it is difficult to seal the sensor by using the gasket because of the requirement for miniaturization, and in the case of a vehicle sensor, the dustproof and waterproof grade is generally required to be equal to or higher than ip 67 because of a severe working environment. However, the glue-pouring sealing method has the following defects: on one hand, the inner cavity of the whole shell is required to be filled with glue, so that the used glue amount is large, and the processing cost of the product is high; on the other hand, the pouring sealant is in direct contact with the integrated circuit inside the sensor and is difficult to remove after pouring, so that electronic components cannot be repaired after a product fails, and product maintenance is not facilitated.
Therefore, the existing sensor shell packaging structure is inconvenient for product maintenance and high in processing cost, and cannot meet the processing requirement.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model discloses the technical problem that will solve lies in overcoming sensor housing packaging structure among the prior art, the product maintenance of being not convenient for and the higher defect of processing cost.
In order to solve the technical problem, the utility model provides a sensor housing, including first casing and second casing, be provided with the baffle in the second casing, the baffle will second casing internal partitioning is first cavity and second cavity, the inside circuit board that is used for placing of first cavity, baffle upper portion is provided with a plurality of holding recesses, be provided with the through-hole that is linked together with the external world on the second cavity, the second cavity is used for holding wire or contact pin, fill sealed glue in the second cavity, first casing closing cap is in second casing upper portion.
In an embodiment of the present invention, the second housing and the first housing are fixed by dispensing.
In an embodiment of the present invention, a plurality of mounting bosses are disposed inside the first chamber, and the mounting bosses are all fixed to the circuit board by bolts.
In an embodiment of the present invention, the mounting bosses are disposed on both sides of the partition plate.
In an embodiment of the present invention, the partition board includes a main body board, the side boards are disposed on both sides of the main body board, and the main body board is provided with a plurality of accommodating grooves.
In an embodiment of the present invention, the plurality of receiving grooves are uniformly arranged along the length direction of the main body plate.
In an embodiment of the present invention, a plurality of ear plates are disposed on the outer wall of the second housing, and the ear plates are all provided with mounting holes.
In an embodiment of the present invention, the ear plate and the housing are integrally formed.
In an embodiment of the invention, the volume of the first chamber is larger than the volume of the second chamber.
In an embodiment of the present invention, the through hole is circular.
Compared with the prior art, the technical scheme of the utility model have following advantage:
sensor housing, not only have better sealed effect, the product dismouting and the maintenance of also being convenient for simultaneously to the processing cost has effectively been reduced.
Drawings
In order to make the content of the present invention more clearly understood, the present invention will be described in further detail with reference to the following embodiments of the present invention, in conjunction with the accompanying drawings.
Fig. 1 is a schematic view of the internal structure of a second housing of the sensor housing of the present invention;
fig. 2 is a schematic structural view of a first housing of the sensor housing of the present invention;
the specification reference numbers indicate: 1. a first housing; 2. a second housing; 21. a partition plate; 211. a main body plate; 212. a side plate; 213. an accommodating groove; 22. a first chamber; 23. a second chamber; 24. mounting a boss; 25. a through hole; 26. an ear plate; 261. mounting holes;
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1-2, the embodiment relates to a sensor housing, including a first housing 1 and a second housing 2, a partition 21 is provided in the second housing 2, the partition 21 divides the inside of the second housing 2 into a first chamber 22 and a second chamber 23, the first chamber 22 is used for placing a circuit board, the upper portion of the partition 21 is provided with a plurality of accommodating grooves 213, the second chamber 23 is provided with a through hole 25 communicated with the outside, the second chamber 23 is used for accommodating a lead or a pin of a sensor, the second chamber 23 is filled with a sealant, and the first housing 1 is covered on the upper portion of the second housing 2.
According to the structure, the interior of the second shell 2 is divided into the first cavity 22 and the second cavity 23 through the partition plate 21, the circuit board is placed in the first cavity 22, and the sealant is filled in the second cavity 23, so that the circuit board is separated from the sealant, the sealant does not need to be filled in the whole second shell 2, the direct contact between the sealant and the integrated circuit board in the sensor can be effectively avoided, the electronic components in the shell are convenient to disassemble and maintain after the electronic components are broken down, the sealant consumption is reduced, and the processing cost is saved; meanwhile, the structure can effectively meet the sealing requirement of the sensor, and a good dustproof and waterproof effect is achieved.
In one embodiment, the second housing 2 and the first housing 1 are fixed by dispensing. For example, the second housing 2 and the first housing 1 may be fixed by dispensing on the inner edge of the second housing 2 and then covering the first housing 1.
In one embodiment, a plurality of mounting bosses 24 are disposed inside the first chamber 22, and the mounting bosses 24 are fixed to the circuit board by bolts, so as to ensure the mounting stability of the circuit board.
In one embodiment, the two sides of the partition board 21 are respectively provided with a mounting boss 24, so as to better ensure the mounting stability of the circuit board and facilitate the welding of the sensor lead or the contact pin with the circuit board.
In one embodiment, the partition 21 includes a main body plate 211, a side plate 212 is disposed on each side of the main body plate 211, and a plurality of receiving grooves 213 are disposed on the main body plate 211.
In one embodiment, the plurality of receiving grooves 213 are uniformly arranged along the length direction of the main body plate 211 to ensure wiring uniformity. The number of grooves depends on the number of electrical lines connected externally to the sensor.
In one embodiment, a plurality of ear plates 26 are disposed on the outer wall of the second housing 2, and each ear plate 26 is provided with a mounting hole 261 to facilitate the fixing of the second housing 2 and other devices.
In one embodiment, the ear plate 26 and the housing are integrally formed.
In one embodiment, the volume of the first chamber 22 is greater than the volume of the second chamber 23.
In one embodiment, the through-hole 25 is circular. The shape of the through hole 25 is not limited to the above shape and can be adapted to the shape of the sensor wire or the connector, and the through hole 25 is circular for a lead type sensor and the through hole 25 is adapted to the shape of the connector for a connector type sensor so that the pin can pass therethrough and the connector can be fixed by being inserted.
In one embodiment, the second housing 2 is rectangular or circular, and the first housing 1 is also circular or rectangular, and the shape thereof can be designed according to actual requirements.
In one embodiment, the receiving groove 213 may be in the form of an open groove or a hole.
The conventional vehicle sensor is classified into a lead type and a connector type according to the type of connection with the outside.
In the lead-type sensor, the sensor case is used in a method comprising: the circuit board is firstly installed in the first cavity 22 of the second shell 2, then the sheath wires with the wire skin peeled off penetrate into the second cavity 23 from the through holes 25, the wires penetrate through the accommodating grooves 213 one by one, then the wires are welded with the circuit board, then the second cavity 23 is filled with sealant, finally, glue is dispensed on the inner edge of the second shell 2, the first shell 1 is covered, and therefore integral sealing is achieved.
In the case of the connector type sensor, the sensor housing is used in the following manner: firstly, the circuit board is installed in the first cavity 22 of the second shell 2, then the connector pins penetrate into the second cavity 23 from the through holes 25, the pins penetrate through the accommodating grooves 213 one by one, then the pins and the circuit board are welded, then the second cavity 23 is filled with sealant, finally, glue is dispensed on the inner edge of the second shell 2, and the first shell 1 is covered, so that integral sealing is realized.
The sensor shell of the embodiment has a good sealing effect, is convenient to disassemble, assemble and maintain, effectively reduces the processing cost, and can effectively meet the processing requirements.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious changes and modifications can be made without departing from the scope of the invention.
Claims (10)
1. A sensor housing, characterized by: including first casing and second casing, be provided with the baffle in the second casing, the baffle will second casing internal partitioning is first cavity and second cavity, the circuit board is used for placing in first cavity inside, baffle upper portion is provided with a plurality of holding recesses, be provided with the through-hole that is linked together with the external world on the second cavity, the second cavity is used for holding wire or contact pin, fill sealed glue in the second cavity, first casing closing cap is in second casing upper portion.
2. The sensor housing of claim 1, wherein: the second shell and the first shell are fixed through dispensing.
3. The sensor housing of claim 1, wherein: a plurality of mounting bosses are arranged in the first cavity and fixed with the circuit board through bolts.
4. The sensor housing of claim 3, wherein: the mounting bosses are arranged on two sides of the partition plate.
5. The sensor housing of claim 1, wherein: the baffle includes the main part board, the both sides of main part board all are provided with the curb plate, be provided with a plurality ofly on the main part board the holding recess.
6. The sensor housing of claim 5, wherein: a plurality of the holding grooves are uniformly arranged along the length direction of the main body plate.
7. The sensor housing of claim 1, wherein: the outer wall of the second shell is provided with a plurality of ear plates, and the ear plates are provided with mounting holes.
8. The sensor housing of claim 7, wherein: the ear plate and the shell are integrally formed.
9. The sensor housing of claim 1, wherein: the volume of the first chamber is greater than the volume of the second chamber.
10. The sensor housing of claim 1, wherein: the through hole is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221340189.5U CN217900885U (en) | 2022-05-31 | 2022-05-31 | Sensor shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221340189.5U CN217900885U (en) | 2022-05-31 | 2022-05-31 | Sensor shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217900885U true CN217900885U (en) | 2022-11-25 |
Family
ID=84111648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221340189.5U Active CN217900885U (en) | 2022-05-31 | 2022-05-31 | Sensor shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217900885U (en) |
-
2022
- 2022-05-31 CN CN202221340189.5U patent/CN217900885U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |