CN217693938U

CN217693938U - Controller

Info

Publication number: CN217693938U
Application number: CN202221032589.XU
Authority: CN
Inventors: 刘双林
Original assignee: TIANJIN SANTROLL ELECTRIC SCIENCE & TECHNOLOGY CO LTD
Current assignee: TIANJIN SANTROLL ELECTRIC SCIENCE & TECHNOLOGY CO LTD
Priority date: 2022-04-29
Filing date: 2022-04-29
Publication date: 2022-10-28
Anticipated expiration: 2032-04-29

Abstract

The utility model relates to an electric bicycle field specifically discloses a controller, pass through connection structure with the heat dissipation shell with integrated interface spare and be connected and will install the notch that leads to the groove and seal, and enclose to become and be cyclic annular and the open point of top and glue the mouth, when gluing through point gum mouth to integrated interface spare and heat dissipation shell junction packing, under the effect of blockking of the circumference side of point gum mouth, sealed glue is difficult for overflowing, but along the point gum mouth downwards flow in the junction between integrated interface spare and the heat dissipation shell, thereby realize the sealed of the junction between integrated interface spare and the heat dissipation shell.

Description

Controller

Technical Field

The utility model relates to an electric bicycle technical field especially relates to a controller.

Background

The controller is used as a control center part of the electric bicycle and plays an important role in vehicle driving, energy management and panel display lamps. However, the miniaturization and lightness of the electric bicycle are the main development direction of the electric bicycle, which requires the controller to continuously reduce the volume and the production cost while ensuring the normal heat dissipation performance.

The controller comprises a heat dissipation shell and a circuit board assembly, two ends of the heat dissipation shell are arranged in an open mode, and a mounting through groove is formed in the front side of the heat dissipation shell; the circuit board assembly comprises an integrated interface piece and a circuit board, wherein one opening of the heat dissipation shell is closed by a first end plate, the other opening of the heat dissipation shell is closed by a second end plate, and the integrated interface piece is connected with the heat dissipation shell and closes a notch of the installation through groove; the circuit board is positioned in an installation space formed by connecting the two end plates, the integrated interface piece and the heat dissipation shell.

In order to protect the circuit board from water and dust, a sealant is usually filled at the joint between the integrated interface and the heat dissipation housing. Specifically, the heat dissipation shell is connected with the integrated interface piece to seal the notch of the installation through groove, and one opening of the heat dissipation shell is sealed by the first end plate; filling sealant into the connecting position between the heat dissipation shell and the integrated interface piece; and then, filling glue into the installation space from the other opening, and finally plugging the other opening of the heat dissipation shell by using the second end plate.

When sealant is filled at the connecting position between the heat dissipation shell and the integrated interface piece, the sealant filled to the connecting position between the heat dissipation shell and the integrated interface piece is easy to overflow from the side of the second end plate because the second end plate is not installed.

Therefore, a controller is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a controller can solve to sealed glue leakage's problem when the hookup location encapsulating between heat dissipation shell and the integrated interface spare.

To achieve the purpose, the utility model adopts the following technical proposal:

a controller, comprising:

the heat dissipation shell is provided with installation through grooves, and two ends of each installation through groove respectively extend to the opening end surfaces of the two openings;

a circuit board assembly including an integrated interface;

the two connecting structures are respectively positioned on two opposite sides of the notch of the mounting through groove;

the two end plates are connected with the heat dissipation shell and are respectively used for closing the two openings;

the integrated interface piece passes through connection structure with the heat dissipation shell is connected and will the notch of installation logical groove is sealed to enclose into and be annular and the open some jiao kou in top, be used for to integrated interface piece with sealed glue is filled to the junction between the heat dissipation shell.

As a preferable technical solution of the above controller, the connection structure includes an insertion groove and an insertion block, one of the insertion groove and the insertion block is disposed on the heat dissipation housing, and the other is disposed on the integrated interface.

As a preferred technical scheme of the above controller, a baffle is convexly arranged on the upper surface of the insertion block outside the insertion groove, and the baffle and the opening end face of the insertion groove are arranged at intervals;

the heat dissipation shell or the integrated interface piece which forms the plug-in block is convexly provided with a rubber baffle plate, and the rubber baffle plate, the baffle plate, one of the end plates and the opening end surface of the plug-in groove are sequentially connected in the circumferential direction to form the dispensing opening.

As a preferred technical solution of the above controller, the rubber stopper is disposed on the integrated interface, and the rubber stopper abuts against the opening of the heat dissipation housing.

As a preferred technical solution of the above controller, the heat dissipation housing is provided with an avoidance groove inserted into the rubber blocking plate.

As a preferable technical solution of the controller, a sealing member is provided between the end plate and the heat dissipation housing.

As a preferred technical solution of the above controller, a sealed chamber is defined by the heat dissipation housing, the integrated interface member, and the two end plates, and the chamber is filled with a sealant.

As a preferred technical solution of the above controller, the integrated interface includes:

a bottom plate connected with the heat dissipation housing to close the notch;

and one end of the interface terminal penetrates through the bottom plate and then is positioned outside the heat dissipation shell.

As a preferred technical solution of the above controller, the heat dissipation housing is provided with line cards in one-to-one correspondence with the interface terminals, and is used for clamping external connection harnesses connected with the interface terminals.

As a preferred technical solution of the above controller, a reinforcing rib is disposed at a connection position of the line card and the heat dissipation housing.

The utility model discloses beneficial effect: the utility model provides a controller, be connected integrated interface spare through connection structure and heat dissipation shell and will install the notch that leads to the groove and seal, and enclose to be annular and the open point gum mouth in top, when filling sealed glue through the point gum mouth to integrated interface spare and the junction between the heat dissipation shell, under the effect of blockking of the circumference side of point gum mouth, sealed glue is difficult for overflowing, but the junction between integrated interface spare and the heat dissipation shell flows in downwards along the point gum mouth, thereby realize the sealed of the junction between integrated interface spare and the heat dissipation shell.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a controller provided in an embodiment of the present invention;

FIG. 2 is an exploded view of FIG. 1;

fig. 3 is a schematic view illustrating a connection between a heat dissipation casing and two end plates according to an embodiment of the present invention;

FIG. 4 is an enlarged partial schematic view at A of FIG. 1;

FIG. 5 is an enlarged partial schematic view at B in FIG. 2;

fig. 6 is a partially enlarged schematic view at C in fig. 2.

In the figure:

1. a heat dissipation housing; 11. installing a through groove; 12. inserting grooves; 121. an open end face; 13. a line card; 14. reinforcing ribs;

2. a circuit board assembly; 21. an integrated interface piece; 211. a base plate; 2111. an insertion block; 2112. a glue blocking plate; 2113. a baffle plate; 212. an interface terminal; 22. a circuit board body;

3. a first end plate; 4. a second end plate; 41. an avoidance groove;

10. and (6) dispensing the glue port.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

As shown in fig. 1 to 6, the present embodiment provides a controller, which includes a heat dissipation housing 1, a circuit board assembly 2, and two connection structures, wherein two ends of the heat dissipation housing 1 are open, and one of the two openings forms a glue filling opening; the top wall of the heat dissipation shell 1 is provided with a through installation groove 11, and two ends of the through installation groove 11 extend to two open end faces respectively. The circuit board assembly 2 comprises a circuit board body 22 and an integrated interface part 21 arranged on the circuit board body 22, the two connecting structures are respectively positioned at two opposite sides of a notch of the installation through groove 11, the integrated interface part 21 is connected with the heat dissipation shell 1 through the connecting structures and seals the notch of the installation through groove 11, each opening of the heat dissipation shell 1 and a port of the installation through groove 11 positioned at the same end with the opening are respectively sealed through an end plate, thereby forming a sealed cavity, and the circuit board body 22 is arranged in the cavity.

In order to carry out dustproof and waterproof to circuit board body 22, the cavity is filled with sealant, a sealing element is arranged between each end plate and heat dissipation shell 1, and the sealing element is filled at the connecting position between heat dissipation shell 1 and integrated interface 21, so that a closed space is formed in the cavity. The two end plates are respectively marked as a first end plate 3 and a second end plate 4, and the installation process of the controller is as follows:

the heat dissipation shell 1 and the integrated interface piece 21 are connected and the notch of the installation through groove 11 is sealed, one of the openings of the heat dissipation shell 1 is sealed by the first end plate 3, the other opening forms a glue filling opening, then sealant is filled into the cavity from the glue filling opening, and then the glue filling opening is sealed by the second end plate 4.

When filling sealed glue to the junction between heat dissipation shell 1 and integrated interface spare 21, because the encapsulating mouth is not blocked, sealed glue can be excessive from the encapsulating mouth place side, for this reason, this embodiment improves the connection of integrated interface spare 21 and heat dissipation shell 1, when making integrated interface spare 21 be connected with heat dissipation shell 1 through connection structure, when the notch that will install logical groove 11 is sealed, enclose into and be cyclic annular and the open point mouth 10 in top for fill sealed glue to the junction between integrated interface spare 21 and the heat dissipation shell 1.

Because the dispensing opening 10 is open at the top and is annular, when sealant is filled in the connection position between the integrated interface piece 21 and the heat dissipation shell 1 through the dispensing opening 10, the sealant is not easy to overflow under the blocking effect of the circumferential side surface of the dispensing opening 10, but flows downwards into the connection position between the integrated interface piece 21 and the heat dissipation shell 1 along the dispensing opening 10, so that the connection position between the integrated interface piece 21 and the heat dissipation shell 1 is sealed.

Optionally, the integrated interface 21 includes a bottom plate 211 and a plurality of interface terminals 212, the bottom plate 211 is connected to the heat dissipation housing 1 to close the notches of the installation through slots 11, one end of the interface terminal 212 penetrates through the bottom plate 211 and is located outside the heat dissipation housing 1 for connecting an external wiring harness, and the other end of the interface terminal 212 is placed in the cavity and welded to the circuit board body 22 through pins. The bottom plate 211 is connected with the heat dissipation shell 1 and is filled with sealed glue at the junction between the two, not only can prevent when encapsulating through the encapsulating mouth that the bottom plate 211 leaks gluey with the 1 junction of heat dissipation shell, can also make the bottom plate 211 fixed more firm with the heat dissipation shell 1, and then make the difficult not hard up of interface terminal 212, controller stability is better.

Optionally, the notch of the installation through slot 11 is substantially L-shaped, and the notch is located at the edge of the top of the heat dissipation housing 1, which is equivalent to only half or part of the top plate of the heat dissipation housing 1; the plane where the interface terminal 212 is located is lower than the top surface of the heat dissipation shell 1, the bottom plate 211 is L-shaped, and the L-shaped bottom plate 211 is matched with the L-shaped notch in shape, so that the overall appearance of the controller is stepped, and the size of the controller is reduced. It can be understood that, compared to the controller with a step shape as a whole, the interface terminal 212 is located at one end above the bottom plate 211, and located at the secondary top of the controller, which is equivalent to the heat dissipation housing 1 forming a half-enclosed structure at one side of the interface terminal 212, and has a certain protection effect on the interface terminal 212. The whole appearance of controller is the echelonment structure, has reduced the volume of controller.

Optionally, the connection structure includes a plug-in slot 12 and a plug-in block 2111, one of the plug-in slot 12 and the plug-in block 2111 is disposed on the heat dissipation housing 1, and the other is disposed on the integrated interface 21. Illustratively, the socket 12 is disposed on the heat sink housing 1, and the socket block 2111 is disposed on the integrated interface 21. In other embodiments, the insertion slot 12 may be disposed on the integrated interface 21, and the insertion block 2111 may be disposed on the heat dissipation housing 1.

Specifically, two opposite ends of the bottom plate 211 are respectively provided with an insertion block 2111, the heat dissipation housing 1 is provided with insertion grooves 12 corresponding to the insertion blocks 2111 one to one, the upper surface of the insertion block 2111 located outside the insertion groove 12 is convexly provided with a baffle 2113, and the baffle 2113 and the opening end surface 121 of the insertion groove 12 are arranged at intervals; the bottom plate 211 is provided with a glue blocking plate 2112 in a protruding manner, the glue blocking plate 2112 is arranged at one end of the baffle 2113 and is connected with the baffle 2113, and the glue blocking plate 2112 abuts against the opening end face of the heat dissipation shell 1, so that the glue blocking plate 2112, the baffle 2113, the first end plate 3 and the opening end face 121 of the plug-in slot 12 are sequentially connected in a circumferential direction to enclose the dispensing opening 10.

In this embodiment, the upper surface of the bottom plate 211 is higher than the upper surface of the insertion block 2111, so that the side of the bottom plate 211 connected to the insertion block 2111 forms the above-mentioned baffle 2113.

When the inserting block 2111 is inserted into the inserting groove 12, the baffle 2113 and the opening end surface 121 of the inserting groove 12 have an interval to form a long-strip-shaped gap, the first end plate 3 and the glue blocking plate 2112 respectively abut against the opening end surfaces at the two ends of the gap, that is, the first end plate 3 and the glue blocking plate 2112 abut against the opening end surfaces at the two ends of the heat dissipating housing 1, respectively, thereby enclosing the glue dispensing opening 10 with an open top. During dispensing, sealant is filled between the interface between the baffle 2113 and the insertion groove 12 from the gap, so that the sealant can be effectively prevented from overflowing.

In order to avoid interference of the glue blocking plate 2112 on the second end plate 4 when the second end plate 4 is installed, an avoiding groove 41 inserted into the glue blocking plate 2112 is provided on the heat dissipation housing 1.

Optionally, the heat dissipation housing 1 is made of a material with good heat conductivity, such as aluminum, so that the heat dissipation housing 1 can rapidly conduct out heat generated by each component when the controller operates.

Optionally, a plurality of posts are disposed on the bottom plate 211, and the integrated interface 21 can be positioned by inserting the posts into the circuit board body 22. Illustratively, the number of pillars is four, and the pillars are distributed at four end points of the bottom plate 211.

Optionally, the two end plates are both punched metal plates, so that the structural strength is high, a better protection effect can be achieved, and the service life of the controller can be prolonged; the sealing element is made of EVA foam or a silica gel pad, which plays a good role in sealing and water blocking so as to protect internal elements of the heat dissipation shell 1. In addition, the sealing element can also be made of other materials which can play a role of waterproof sealing, and the shape of the sealing element only needs to be satisfied to seal the end part of the installation through groove 11. The end plate and the seal member can be fixed together to the end of the heat radiation housing 1 by a fastener such as a bolt.

Optionally, each end plate is provided with a plurality of mounting holes. Preferably, the mounting hole is a long hole, which facilitates the mounting of the controller to the electric bicycle and other vehicles or products by using fasteners such as bolts. The slot hole can also be matched with mounting holes with different intervals on the electric bicycle, so that the mounting application range of the controller can be expanded.

Optionally, the heat dissipation housing 1 is provided with line cards 13 corresponding to the interface terminals 212 one to one, and the external wire harnesses connected to each interface terminal 212 may be clamped in the line cards 13 to prevent confusion of the external wire harnesses. Optionally, reinforcing ribs 14 are provided at the connection positions of the line card 13 and the heat dissipation housing 1 to improve the structural strength of the line card 13. In this embodiment, the heat dissipation housing 1, the line card 13, and the reinforcing ribs 14 are integrally formed.

In addition, the foregoing is only the preferred embodiment of the present invention and the technical principles applied thereto. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious modifications, rearrangements and substitutions without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A controller, comprising:

the heat dissipation device comprises a heat dissipation shell (1), wherein two opposite ends of the heat dissipation shell (1) are open, a mounting through groove (11) is formed in the heat dissipation shell (1), and two ends of the mounting through groove (11) respectively extend to the open end faces of the two openings;

a circuit board assembly (2) comprising an integrated interface piece (21);

the two connecting structures are respectively positioned on two opposite sides of the notch of the mounting through groove (11);

the two end plates are connected with the heat dissipation shell (1) and are respectively used for closing the two openings;

the heat dissipation device is characterized in that the integrated interface piece (21) is connected with the heat dissipation shell (1) through the connecting structure and closes the notch of the installation through groove (11), and a glue dispensing opening (10) which is annular and has an opening at the top is formed in a surrounding mode and is used for filling sealant into the connection position between the integrated interface piece (21) and the heat dissipation shell (1).

2. The controller of claim 1, wherein the connection structure comprises a socket (12) and a socket block (2111), one of the socket (12) and the socket block (2111) being disposed on the heat dissipation housing (1) and the other being disposed on the integrated interface (21).

3. The controller according to claim 2, characterized in that a baffle plate (2113) is convexly arranged on the upper surface of the insertion block (2111) outside the insertion groove (12), and the baffle plate (2113) is arranged at a distance from the opening end surface (121) of the insertion groove (12);

and a glue blocking plate (2112) is convexly arranged on the heat dissipation shell (1) or the integrated interface component (21) forming the insertion block (2111), and the glue blocking plate (2112), the baffle plate (2113), one of the end plates and the opening end surface (121) of the insertion groove (12) are sequentially connected in the circumferential direction to form the dispensing opening (10).

4. A controller according to claim 3, wherein the glue stop (2112) is provided on the integrated interface (21), the glue stop (2112) abutting the opening of the heat sink housing (1).

5. The controller according to claim 4, characterized in that the heat dissipation shell (1) is provided with an avoiding groove (41) inserted with the glue baffle plate (2112).

6. A control according to claim 5, characterised in that a seal is provided between the end plate and the heat-dissipating housing (1).

7. The controller according to claim 5, characterized in that the heat dissipation housing (1), the integrated interface member (21) and the two end plates enclose a sealed chamber, and the chamber is filled with a sealant.

8. A controller according to any of claims 1 to 7, wherein the integrated interface (21) comprises:

the bottom plate (211), the said bottom plate (211) couples to said heat-dissipating outer casing (1) in order to close the said notch;

and one end of each interface terminal (212) penetrates through the bottom plate (211) and then is positioned outside the heat dissipation shell (1).

9. The controller according to claim 8, wherein the heat dissipation housing (1) is provided with line cards (13) corresponding to the interface terminals (212) one by one, for clamping external wiring harnesses connected to the interface terminals (212).

10. A controller according to claim 9, characterized in that the line card (13) is provided with reinforcing ribs (14) at the connection locations with the heat sink housing (1).