CN102281042A - Frequency device and packaging method thereof - Google Patents
Frequency device and packaging method thereof Download PDFInfo
- Publication number
- CN102281042A CN102281042A CN201110123707.8A CN201110123707A CN102281042A CN 102281042 A CN102281042 A CN 102281042A CN 201110123707 A CN201110123707 A CN 201110123707A CN 102281042 A CN102281042 A CN 102281042A
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- Prior art keywords
- cover plate
- pedestal
- frequency device
- base
- crystal
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000013078 crystal Substances 0.000 claims abstract description 53
- 238000005520 cutting process Methods 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims abstract description 22
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims abstract description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 48
- 239000003292 glue Substances 0.000 claims description 42
- 238000012856 packing Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 210000001624 hip Anatomy 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 239000000919 ceramic Substances 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000000084 colloidal system Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
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- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Abstract
The invention provides a frequency device and a packaging method thereof. The method comprises the following steps of: fixture of crystals, compression and seal of a cover plate, detection of gas tightness, test and cutting. The frequency device comprises a base and a cover plate; the base is equipped with a silver-plated electrode crystal chip which is arranged on an interior electrode in the base via conductive adhesive; the interior electrode is connected with an exterior electrode of the base via a line; the base comprises a crystal surface and a sealing surface around the crystal surface; the cover plate comprises a container surface and a process surface around the container surface; the container surface is of a box shape while the crystal surface is of a flat shape; the container surface is clamped with the crystal surface; an adhesive conducting surface is matched with the sealing surface; and the base is sealed with the cover plate via the sealing surface and the adhesive conducting surface. According to the invention, the base and an upper cover are made by an easily-obtained medium instead of integrated ceramic with high cost or other mediums so that the production cost is saved. The connecting mode of plates has the advantages of bringing convenience for the automated production, reducing the manual labor and greatly improving the productivity.
Description
Technical field
The present invention relates to communication and electronic technology field, relate in particular to a kind of method for packing of crystal oscillator and the crystal oscillator (being crystal oscillator) that obtains by this method for packing.
Background technology
Number of patent application is: CN200820059640, CN200820059641.4, CN200820059312.X, CN200820153661.8, CN200920067387.7, CN200920068666.5 etc. introduce a kind of crystal oscillator respectively, its common characteristic is: what the base of crystal oscillator adopted is ceramic material, utilize pottery as submount material, a restriction to the crystal oscillator maximum is inconvenient suitability for industrialized production, because pottery is unfavorable for cutting, so in the process of producing, need single assembling, greatly reduce production efficiency.All the time, all be that as if people have formed a kind of gesture thinking of being used to so with the base of pottery as crystal oscillator, think that the base of crystal oscillator just should be with pottery, just can reach its effect with pottery.
Fig. 1 is a crystal oscillator exploded view in the prior art, and 101 is electrode pin among the figure, and 102 is base, and 103 is crystal cartridge, and 104 is crystal, and 105 is top cover, and the crystal oscillator of Fig. 1 is to adopt the mode of monolithic production to make, and its production process is as follows:
Solid crystalline substance → the bonding wire of a wafer plated electrode → glue → fine setting → cover plate press seal → airtight leak detection → test → packing, above production process is the production process of each Dan Pin, all produce like this for each Dan Pin, its manual composition increases greatly, is unfavorable for the reduction of industrial production cost.
Summary of the invention
In order to solve crystal oscillator manufacture order product operation in the prior art, production cost height, inefficient problem the invention provides method for packing and this frequency device of a kind of frequency device (being crystal oscillator).
A kind of frequency device, comprise the base and cover plate, pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connecting the pedestal outer electrode, described pedestal comprises crystal face and is positioned at crystal face sealing surface all around, described cover plate comprises vessel faces and is positioned at the vessel faces glue face of leading all around, described vessel faces is the box body formula, described crystal face is flat, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface with lead the glue face with base and cover plate involution.
Existing frequency device is to cooperate dull and stereotyped lid in the end of ceramic box body, frequency device of the present invention is the cover plate that dull and stereotyped pedestal cooperates box body, the base and cover plate of She Zhiing lays the foundation for producing in flakes like this, because dull and stereotyped pedestal in flakes makes the industrialization of whole production technology, brush coating, fixed crystal, involution, test, cutting in flakes, do not need as traditional monolithic production, to carry out the manual operation in each step, saved time and manpower greatly.In addition, pedestal is flat structure, reduce greatly for the requirement of production environment because flat structure, can adopt wind or similarly mode remove dust on the pedestal, and the pedestal of box body formula can not be done like this.
As a further improvement on the present invention, the described glue face of leading is the inclined plane, and the described glue face of leading is provided with and leads the glue hole.
Lead being provided with of glue hole and can make the saturated gluing of sealing surface, i.e. abundant gluing, unnecessary glue overflows by leading the glue hole, so not only abundant involution but also can not pollute frequency device inside.
As a further improvement on the present invention, the material of described base and cover plate is circuit board, metallic plate, glass plate or resin.
Than the base of ceramic of prior art, the material of base and cover plate of the present invention has been saved production cost greatly.Because all be to use base of ceramic all the time, so those skilled in the art has just produced mindset, thinking just should be with pottery as pedestal.
The present invention has brought by single product and has produced the leap (because base of ceramic is not easy to cutting) of producing in batches owing to the variation of base material, this batch process, and promptly the connecting plate mode is convenient to automated production, and the minimizing hand labour greatly increases productivity.The miniaturization of ceramic base is what be difficult to realize, and the variation of material of the present invention also is the miniaturization of the product condition of providing convenience.
As a further improvement on the present invention, described pedestal is pedestal in flakes.Described pedestal can be arranged, is convenient to cutting like this, but is not limited to arranged.
As a further improvement on the present invention, described cover plate is cover plate in flakes.
As a further improvement on the present invention, on the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.
As a further improvement on the present invention, described cutting groove is: the triangular apex place that the adjacent glue face of leading forms is provided with cutting groove.
Leg-of-mutton projection is set, like this, in cutting, can cut along vertex of a triangle, leg-of-mutton inside generally is provided with glue or colloid, like this, after the cutting, prevent that glue or colloid are penetrated into protruding enclosure interior, influence the quality of finished product.
Above-mentioned triangular hill is preferred a kind of execution mode, but is not restricted to this, after the cutting, prevents that glue or colloid are penetrated into protruding enclosure interior, and the similar setting that influences the quality of finished product can.Overall design philosophy be exactly between protruding housing and pedestal, form airtight in, make glue or analog can not infiltrate the confined space that protruding housing and pedestal form, assurance product quality.
The place, summit of the triangular hill that further is provided with on the leg-of-mutton in the above basis is provided with depressed part, when cutting, cut along depressed part, so not only reached and prevented that glue or colloid are penetrated into protruding enclosure interior, influence the effect of the quality of finished product, and be more conducive to cutting.
As a further improvement on the present invention, described cutting groove is: the adjacent glue face of leading is provided with cutting groove as the place, trapezoidal summit that two waists form.
Be selectable shape above, but be not to be confined to this several shapes, even can be irregular shape, so long as it is just passable to reach the purpose that is beneficial to cutting.
A kind of method for packing of frequency device may further comprise the steps:
The pedestal assembling procedure, pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connected the pedestal outer electrode, described pedestal comprises crystal face and is positioned at crystal face sealing surface all around, described crystal face is flat, and described pedestal is formula pedestal in flakes;
Cover plate press seal operation, described cover plate comprise vessel faces and are positioned at the vessel faces glue face of leading all around that described vessel faces is the box body formula, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface and lead the glue face with base and cover plate involution, described cover plate is formula cover plate in flakes;
Airtight leak detection operation;
Test step;
Cutting action cuts down each frequency device monomer.
As a further improvement on the present invention, brush coating seals between described pedestal and the cover plate.
The invention has the beneficial effects as follows: the present invention adopts the circuit board that obtains easily as submount material, has replaced cutting and ceramic base that cost is higher, has saved production cost.Use the connecting plate mode; The connecting plate mode is convenient to automated production, reduces hand labour, greatly increases productivity.
[description of drawings]
Fig. 1 is crystal oscillator STRUCTURE DECOMPOSITION figure in the prior art;
Fig. 2 is the assembly drawing of Fig. 1;
Fig. 3 is pedestal in the method for packing of a kind of frequency device of the present invention, structure of cover plate schematic diagram;
Fig. 4 is the assembly drawing of Fig. 3;
Fig. 5 is the pedestal, cover plate press seal among Fig. 3, the structural representation of the Dan Pin after the cutting;
Fig. 6 is the structural representation of another angle of Fig. 5;
Fig. 7 is the STRUCTURE DECOMPOSITION figure of plug-in unit crystal oscillator of the present invention (one type);
Fig. 8 is a kind of cutting groove structural representation of the present invention;
Fig. 9 is an another kind of cutting groove structural representation of the present invention;
Figure 10 is the schematic diagram of the another kind of structure of cover plate of the present invention;
Figure 11 is the structural representation of the base and cover plate of Dan Pin.
[embodiment]
The present invention is further described below in conjunction with description of drawings and embodiment.
Embodiment 1:
A kind of frequency device, comprise pedestal 202 and cover plate 205, pedestal is provided with silver-plated electrode crystal chip 204, with conducting resinl chip is sticked together on base interior electrode 201, the internal electrode circuit is connecting the pedestal outer electrode, described pedestal comprises crystal face 302 and is positioned at crystal face sealing surface 305 all around, described cover plate comprises vessel faces 301 and is positioned at the vessel faces glue face 303 of leading all around, described vessel faces is the box body formula, described crystal face is flat, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface with lead the glue face with base and cover plate involution.The described glue face of leading is the inclined plane, and the described glue face of leading is provided with and leads glue hole 304.The material of described base and cover plate is circuit board, metallic plate, glass plate or resin.
Embodiment 2:
On the basis of embodiment 1, described pedestal is pedestal in flakes.
Embodiment 3:
As shown in Figure 8, on the basis of embodiment 1 or 2, described cover plate is cover plate in flakes.On the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.Described cutting groove is: the triangular apex place that the adjacent glue face of leading forms is provided with cutting groove.
Embodiment 4: as shown in Figure 9, on the basis of embodiment 1 or 2, described cover plate is cover plate in flakes.On the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.Described cutting groove is: the adjacent glue face of leading is provided with cutting groove as the place, trapezoidal summit that two waists form.
A kind of method for packing of frequency device may further comprise the steps:
The pedestal assembling procedure, pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connected the pedestal outer electrode, described pedestal comprises crystal face and is positioned at crystal face sealing surface all around, described crystal face is flat, and described pedestal is formula pedestal in flakes;
Cover plate press seal operation, described cover plate comprise vessel faces and are positioned at the vessel faces glue face of leading all around that described vessel faces is the box body formula, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface and lead the glue face with base and cover plate involution, described cover plate is formula cover plate in flakes;
Airtight leak detection operation;
Test step;
Cutting action cuts down each frequency device monomer.
Brush coating seals between described pedestal and the cover plate.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. frequency device, comprise the base and cover plate, it is characterized in that: pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connecting the pedestal outer electrode, described pedestal comprises crystal face (302) and is positioned at crystal face sealing surface (305) all around, described cover plate comprises vessel faces (301) and is positioned at the vessel faces glue face of leading (303) all around, described vessel faces is the box body formula, described crystal face is flat, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface with lead the glue face with base and cover plate involution.
2. a kind of frequency device according to claim 1 is characterized in that: the described glue face of leading is the inclined plane, and the described glue face of leading is provided with and leads glue hole (304).
3. a kind of frequency device according to claim 1 is characterized in that: the material of described base and cover plate is circuit board, metallic plate, glass plate or resin.
4. according to any described a kind of frequency device of claim 1 to 3, it is characterized in that: described pedestal is pedestal in flakes.
5. according to any described a kind of frequency device of claim 1 to 3, it is characterized in that: described cover plate is cover plate in flakes.
6. a kind of frequency device according to claim 5 is characterized in that: on the described cover plate in flakes, be provided with cutting groove between the adjacent cover plate.
7. a kind of frequency device according to claim 6 is characterized in that: described cutting groove is: the triangular apex place that the adjacent glue face of leading forms is provided with cutting groove.
8. a kind of frequency device according to claim 6 is characterized in that: described cutting groove is: the adjacent glue face of leading is provided with cutting groove as the place, trapezoidal summit that two waists form.
9. the method for packing of a frequency device is characterized in that, may further comprise the steps:
The pedestal assembling procedure, pedestal is provided with silver-plated electrode crystal chip, with conducting resinl chip is sticked together on the base interior electrode, the internal electrode circuit is connected the pedestal outer electrode, described pedestal comprises crystal face and is positioned at crystal face sealing surface all around, described crystal face is flat, and described pedestal is formula pedestal in flakes;
Cover plate press seal operation, described cover plate comprise vessel faces and are positioned at the vessel faces glue face of leading all around that described vessel faces is the box body formula, vessel faces and crystal face fasten, lead the glue face and cooperate with sealing surface, by sealing surface and lead the glue face with base and cover plate involution, described cover plate is formula cover plate in flakes;
Airtight leak detection operation;
Test step;
Cutting action cuts down each frequency device monomer.
10. the method for packing of a kind of frequency device according to claim 9, it is characterized in that: brush coating seals between described pedestal and the cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110123707.8A CN102281042A (en) | 2011-05-13 | 2011-05-13 | Frequency device and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110123707.8A CN102281042A (en) | 2011-05-13 | 2011-05-13 | Frequency device and packaging method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102281042A true CN102281042A (en) | 2011-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110123707.8A Pending CN102281042A (en) | 2011-05-13 | 2011-05-13 | Frequency device and packaging method thereof |
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| Country | Link |
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| CN (1) | CN102281042A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004166213A (en) * | 2002-09-20 | 2004-06-10 | Murata Mfg Co Ltd | Surface acoustic wave device, and communication apparatus |
| CN201365231Y (en) * | 2009-03-10 | 2009-12-16 | 台晶(宁波)电子有限公司 | Metallic packaging crystal oscillator |
| CN101997510A (en) * | 2010-10-18 | 2011-03-30 | 台晶(宁波)电子有限公司 | Manufacturing method of wafer level encapsulating structure for through-hole vibrator device |
| CN202059379U (en) * | 2011-05-13 | 2011-11-30 | 李东 | Frequency device |
-
2011
- 2011-05-13 CN CN201110123707.8A patent/CN102281042A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004166213A (en) * | 2002-09-20 | 2004-06-10 | Murata Mfg Co Ltd | Surface acoustic wave device, and communication apparatus |
| CN201365231Y (en) * | 2009-03-10 | 2009-12-16 | 台晶(宁波)电子有限公司 | Metallic packaging crystal oscillator |
| CN101997510A (en) * | 2010-10-18 | 2011-03-30 | 台晶(宁波)电子有限公司 | Manufacturing method of wafer level encapsulating structure for through-hole vibrator device |
| CN202059379U (en) * | 2011-05-13 | 2011-11-30 | 李东 | Frequency device |
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Application publication date: 20111214 |