CN206524320U - A kind of encapsulating structure for the miniaturization temp probe for detecting body temperature - Google Patents
A kind of encapsulating structure for the miniaturization temp probe for detecting body temperature Download PDFInfo
- Publication number
- CN206524320U CN206524320U CN201720062890.8U CN201720062890U CN206524320U CN 206524320 U CN206524320 U CN 206524320U CN 201720062890 U CN201720062890 U CN 201720062890U CN 206524320 U CN206524320 U CN 206524320U
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- CN
- China
- Prior art keywords
- packaging body
- temperature sense
- sense chip
- miniaturization
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims abstract description 21
- 230000036760 body temperature Effects 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 claims abstract description 35
- 230000036413 temperature sense Effects 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000000919 ceramic Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 4
- 235000012771 pancakes Nutrition 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 8
- 230000006698 induction Effects 0.000 abstract description 7
- 238000010276 construction Methods 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Measuring And Recording Apparatus For Diagnosis (AREA)
Abstract
The utility model discloses a kind of encapsulating structure for the miniaturization temp probe for detecting body temperature, including temperature sense chip and 2 signal wires, two surfaces of temperature sense chip are respectively arranged with a bonding wire piece, all surface of the temperature sense chip in addition to bonding wire piece is attached with a ceramic film, the inner end of 2 signal wires is fixed on corresponding bonding wire piece by wicking technique, the outer rim of temperature sense chip is coated with environment-friendly resin layer, the outer rim of environment-friendly resin layer is coated with packaging body, packaging body is in flat pattern, and 2 signal wires are laterally passed from the side surface of packaging body.The utility model is simple in construction, temperature sense chip is in flat pattern, the thickness of the packaging body on temperature sense chip top layer is less than 0.2mm, skin and body other parts can be conveniently affixed on, test more rapidly, improves induction precision, and volume is smaller, thickness is smaller, can be arranged in the medical detection probe of miniaturization.
Description
Technical field
The utility model is related to temp probe technical field, more particularly, to a kind of miniaturization temp probe for detecting body temperature
Encapsulating structure.
Background technology
In the prior art, the encapsulating structure of temp probe of detection body temperature is, the surface of temperature sense chip directly into
Type wraps up a packaging body, the shape of packaging body close to tadpole shape ellipsoid body, packaging body the widest part a diameter of 2.5~
3mm, and the thickness that temperature sense chip is being located at the packaging body outside packaging body the widest part, temperature sense chip is very big, it is whole
Body volume also than larger, reduces induction precision.On the other hand, the volume of medical body temperature detection probe is less and less, to miniature
Changing the installing space inside development, temperature check probe becomes very small, it is desirable to detect the maximum gauge of the temp probe of body temperature
In below 2.0mm, it is evident that the temp probe of the detection body temperature of existing encapsulating structure can not be arranged on the medical of miniaturization
In detection probe, it is therefore necessary to improved.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of miniaturization temperature for detecting body temperature
The encapsulating structure of probe, it is simple in construction, improves induction precision, and volume is smaller, and the medical detection that can be arranged on miniaturization is visited
In head.
To achieve these goals, the technical scheme that the utility model is used is.
A kind of encapsulating structure for the miniaturization temp probe for detecting body temperature, including temperature sense chip and 2 signal wires, temperature
Two surfaces of degree induction chip are respectively arranged with a bonding wire piece, and all surface of the temperature sense chip in addition to bonding wire piece adheres to
There is a ceramic film, the inner end of 2 signal wires is fixed on outside corresponding bonding wire piece, temperature sense chip by wicking technique
The inner end of edge and signal wire is coated with environment-friendly resin layer and forms encapsulating structure in one, and the outer rim of environment-friendly resin layer is coated with
Packaging body, packaging body is in flat pattern, and 2 signal wires are laterally passed from the side surface of packaging body.
In further technical scheme, the upper and lower surface of the temperature sense chip is respectively parallel to the upper of the packaging body
Lower surface, temperature sense chip is positioned close to the position at the edge of packaging body.
In further technical scheme, the thickness of the packaging body is 1.6~1.7mm, the temperature sense chip it is upper
The thickness of the packaging body on lower two sides is 0.15~0.2mm.
In further technical scheme, the profile of the top view of the packaging body is close circular or oval.
After said structure, the utility model is compared to the prior art advantageously：The utility model structure
Simply, temperature sense chip is in flat pattern, and the thickness of the packaging body on temperature sense chip top layer is less than 0.2mm, can conveniently paste
In skin and body other parts, test more rapidly, improves induction precision, and volume is smaller, and thickness is smaller, can be arranged on micro-
In the medical detection probe of type.
Brief description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is internal structure schematic diagram of the present utility model.
In figure：1st, temperature sense chip 2, signal wire 3, bonding wire piece 4, environment-friendly resin layer 5, packaging body.
Embodiment
As described below is only preferred embodiment of the present utility model, does not therefore limit protection model of the present utility model
Enclose.
Embodiment, as shown in Fig. 1 to Fig. 2, a kind of encapsulating structure for the miniaturization temp probe for detecting body temperature, including temperature
Induction chip 1 and 2 signal wires 2, two surfaces of temperature sense chip 1 are respectively arranged with a bonding wire piece 3, temperature sense chip 1
All surface in addition to bonding wire piece 3 is attached with a ceramic film, and the inner end of 2 signal wires 2 is fixed by wicking technique
In corresponding bonding wire piece 3, in wicking, ceramic film will not adhere tin liquor, and the inner end of bonding wire piece 3 and signal wire 2 can glue
Upper tin liquor, then completes electrical connection after tin liquor cooled and solidified, and such a structure makes it not need bonding wire operation, reduces cost, also disappear
The problem of rosin joint being likely to occur except bonding wire operation.
The outer rim of temperature sense chip 1 and the inner end of signal wire 2 are coated with environment-friendly resin layer 4 and are formed in one and encapsulated
Structure, the outer rim of environment-friendly resin layer 4 is coated with 5,2 signal wires 2 of packaging body and laterally passed from the side surface of packaging body 5.Encapsulation
Body 5 is in flat pattern, and the profile of the top view of packaging body 5 is close to circular or ellipse, and the upper and lower surface of temperature sense chip 1 is divided
Not parallel to the upper and lower surface of packaging body 5, temperature sense chip 1 is positioned close to the position at the edge of packaging body 5.Packaging body 5
Thickness be 1.6~1.7mm, the thickness of the packaging body 5 of the upper and lower surface of temperature sense chip 1 is 0.15~0.2mm.
The utility model is simple in construction, and temperature sense chip 1 is in flat pattern, the packaging body 5 on the top layer of temperature sense chip 1
Thickness be less than 0.2mm, can conveniently be affixed on skin and body other parts, test more rapidly, improves induction precision, and volume is more
Small, thickness is smaller, can be arranged in the medical detection probe of miniaturization.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality
With new thought, it will change in specific embodiments and applications, this specification content should not be construed as
To limitation of the present utility model.
Claims (4)
1. a kind of encapsulating structure for the miniaturization temp probe for detecting body temperature, including temperature sense chip (1) and 2 signal wires
(2), two surfaces of temperature sense chip (1) are respectively arranged with a bonding wire piece (3), it is characterised in that：Temperature sense chip (1) is removed
All surface beyond bonding wire piece (3) is attached with a ceramic film, and the inner end of 2 signal wires (2) is solid by wicking technique
Due to corresponding bonding wire piece (3), the outer rim of temperature sense chip (1) and the inner end of signal wire (2) are coated with an environment-friendly resin
Layer (4) and form encapsulating structure in one, the outer rim of environment-friendly resin layer (4) is coated with packaging body (5), and packaging body (5) is in pancake
Shape, 2 signal wires (2) laterally pass from the side surface of packaging body (5).
2. a kind of encapsulating structure of miniaturization temp probe for detecting body temperature according to claim 1, it is characterised in that：Institute
The upper and lower surface for stating temperature sense chip (1) is respectively parallel to the upper and lower surface of the packaging body (5), temperature sense chip (1)
It is positioned close to the position at the edge of packaging body (5).
3. a kind of encapsulating structure of miniaturization temp probe for detecting body temperature according to claim 2, it is characterised in that：Institute
The thickness for stating packaging body (5) is 1.6~1.7mm, the thickness of the packaging body (5) of the upper and lower surface of the temperature sense chip (1)
For 0.15~0.2mm.
4. a kind of encapsulating structure of miniaturization temp probe for detecting body temperature according to claim 3, it is characterised in that：Institute
The profile for stating the top view of packaging body (5) is close circular or oval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720062890.8U CN206524320U (en) | 2017-01-19 | 2017-01-19 | A kind of encapsulating structure for the miniaturization temp probe for detecting body temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720062890.8U CN206524320U (en) | 2017-01-19 | 2017-01-19 | A kind of encapsulating structure for the miniaturization temp probe for detecting body temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206524320U true CN206524320U (en) | 2017-09-26 |
Family
ID=59890063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720062890.8U Expired - Fee Related CN206524320U (en) | 2017-01-19 | 2017-01-19 | A kind of encapsulating structure for the miniaturization temp probe for detecting body temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206524320U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111157040A (en) * | 2019-12-23 | 2020-05-15 | 上海中车通达智慧物流有限公司 | Temperature and humidity detection system and method |
-
2017
- 2017-01-19 CN CN201720062890.8U patent/CN206524320U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111157040A (en) * | 2019-12-23 | 2020-05-15 | 上海中车通达智慧物流有限公司 | Temperature and humidity detection system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170926 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |