CN106643898B - A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method - Google Patents
A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method Download PDFInfo
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- CN106643898B CN106643898B CN201611219222.8A CN201611219222A CN106643898B CN 106643898 B CN106643898 B CN 106643898B CN 201611219222 A CN201611219222 A CN 201611219222A CN 106643898 B CN106643898 B CN 106643898B
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- sensor
- temperature
- sensor chip
- pressure
- humidity
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/22—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/25—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons
- G01L1/255—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons using acoustic waves, or acoustic emission
Abstract
The invention discloses a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods, pass through integration packaging surface acoustic wave temperature, pressure sensor structure, integration packaging surface acoustic wave temperature, humidity, pressure sensor structure, decoupling surface acoustic wave temperature, humidity, pressure sensor signal three parts are completed.This method can solve the problems such as traditional packaging method needs the extraneous influence for providing more interface, lead complexity, the interference of more physical quantitys to sensor chip test result, improve the accuracy of measurement result.
Description
Technical field
The present invention relates to a kind of sensor packaging methods, especially a kind of surface acoustic wave multi-parameter sensor integration packaging side
Method.
Background technology
Currently, needing simultaneously to measure temperature, pressure, humidity these three physical quantitys in various application occasions, tradition
Test method need respectively that temperature in use sensor, pressure sensor, humidity sensor carry out these three physical quantitys respectively
It measures, in structure, the interface for needing extraneous offer more, lead complexity；And actually use in, temperature, humidity, pressure these three
The sensor that physical quantity completes encapsulation has cross jamming, and traditional packaging method does not consider this interference to sensor core
The influence of built-in testing result causes measurement result inaccurate.It can be seen that traditional single one physical quantity sensor encapsulation cannot be satisfied together
When into trip temperature, pressure, moisture measurement requirement.
Invention content
Present invention aims at a kind of surface acoustic wave multi-parameter sensor integrated chip packaging method is provided, solve single at present
One physical quantity transducer encapsulating structure complex interfaces, and sensor the asking there are cross jamming that multiple physical quantitys complete encapsulation
Topic.
A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method, the specific steps are：
The first step, integration packaging surface acoustic wave temperature, pressure sensor structure
Surface acoustic wave temperature, pressure sensor structure, including：Sensor base, signal pins, pressure deformation diaphragm, pressure
Sensor chip, temperature sensor chip, sensor upper cover, wire leads and non-conductive adhesive.Wherein, pressure sensor core
Piece is placed in pressure deformation center position, to obtain maximum sensitive deformation；Pressure deformation diaphragm by pasting, laser welding
Bonding pattern is fixed on the inside of sensor upper cover, and needs to ensure the sealing performance at bonding；Temperature sensor chip is placed in
The center of sensor base changes the influence measured temperature with isolated pressure；Sensor base uses iron cobalt nickel alloy
Material makes；Pressure sensor chip draws two one metal wire leads, is connected respectively in two signal pins；Temperature sensor
Chip draws two one metal wire leads, is connected respectively in two signal pins；Two signal pins are respectively through sensor base
On two wiring holes in be pierced by, and two are filled between signal pins and sensor base with non-conductive adhesive, ensure leakproofness
Energy；Sensor base is fixed with sensor upper cover by laser welding bonding pattern, ensures weld sealing performance.
Second step, integration packaging surface acoustic wave temperature, humidity, pressure sensor structure
Humidity sensor chip and the temperature of protective cover and integration packaging, pressure sensor structure are subjected to integrated envelope
Dress.Wherein protective cover is made of iron cobalt nickel alloy material, is porous structure.Humidity sensor chip is by pasting, swashing
The mode of photocoagulation bonding is fixed in sensor base, and humidity sensor chip is placed in sensor base and temperature sensing
The opposite side of device chip mounting surface.Signal pins are processed into L shapes, are used in combination two one metal wire leads by humidity sensor chip point
It is not connected in two signal pins.Two wiring holes are set on protective cover, two signal pins are protected from metal respectively
It is drawn in wiring hole on shield, two are filled between signal pins and protective cover with non-conductive adhesive.Protective cover is adopted
It is fixed in sensor base with the mode pasted, laser welding is bonded, forms final surface acoustic wave temperature, humidity, pressure
Sensor integration encapsulating structure.
Third walks, decoupling surface acoustic wave temperature, humidity, pressure sensor signal
The surface acoustic wave temperature of integration packaging, humidity, pressure sensor integrated encapsulation structure, wherein temperature sensor core
Piece, humidity sensor chip nevertheless suffer from testing pressureInfluence；Pressure sensor chip, humidity sensor chip are waited for
Testing temperatureInfluence；But pressure sensor chip, temperature sensor chip will not be waited for measuring moistureInfluence.If pressure
Sensor chip exports, temperature sensor chip output be, humidity sensor chip output be, then testing temperature is waited for, wait for measuring moisture, testing pressureRelational expression is：
（1）
（2）
（3）
Pressure coefficient（）, temperature coefficient（）, humidity coefficient（）
It is obtained by sensor calibration.Test obtains sensor output、、Afterwards, pass through simultaneous solution formula（1）, formula
（2）, formula（3）Obtain external environment at this time waits for testing temperature, wait for measuring moisture, testing pressureExact value.
So far, the integration packaging of surface acoustic wave multi-parameter sensor is completed.
This method can solve the problems, such as that traditional packaging method needs extraneous more interface, the lead of providing complicated,
The porous structure that iron cobalt nickel alloy material makes can barrier liquid and dust pollute humidity sensor chip, integration packaging
Structure considers influence of more physical quantitys interference to sensor chip test result, improves the accuracy of measurement result.
Description of the drawings
Surface acoustic wave temperature, the envelope of pressure sensor in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 1
Fill schematic diagram；
Surface acoustic wave temperature, humidity, pressure sensing in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 2
The integration packaging schematic diagram of device；
Surface acoustic wave temperature, humidity, pressure sensing in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 3
The integration packaging side schematic view of device；
The forward direction and side schematic view of signal pins in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 4.
1. 4. pressure sensor chip of sensor base 2. signal pins, 3. pressure deformation diaphragm, 5. temperature sensor
Chip
6. 9. humidity sensor chip of sensor upper cover 7. wire leads, 8. non-conductive adhesive, 10. protective cover.
Specific implementation mode
A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method, the specific steps are：
The first step, integration packaging surface acoustic wave temperature, pressure sensor structure
Surface acoustic wave temperature, pressure sensor structure, including：Sensor base 1, signal pins 2, pressure deformation diaphragm 3,
Pressure sensor chip 4, temperature sensor chip 5, sensor upper cover 6, wire leads 7 and non-conductive adhesive 8.Wherein, pressure
Sensor chip 4 is placed in 3 center of pressure deformation diaphragm, to obtain maximum sensitive deformation；Pressure deformation diaphragm 3 passes through viscous
Patch, laser welding bonding pattern be fixed on the inside of sensor upper cover 6, and need ensure bonding at sealing performance；Temperature
Sensor chip 5 is placed in the center of sensor base 1, changes the influence measured temperature with isolated pressure；Sensor bottom
Seat 1 is made of iron cobalt nickel alloy material；Pressure sensor chip 4 draws two one metal wire leads 7, is connected respectively to two letters
On number pin 2；Temperature sensor chip 5 draws two one metal wire leads 7, is connected respectively in two signal pins 2；Two letters
Number pin 2 in two wiring holes in sensor base 1 respectively through being pierced by, and between two signal pins 2 and sensor base 6
It is filled with non-conductive adhesive 8, ensures sealing performance；Sensor base 1 is solid by laser welding bonding pattern with sensor upper cover 6
It is fixed, ensure weld sealing performance.
Second step, integration packaging surface acoustic wave temperature, humidity, pressure sensor structure
Humidity sensor chip 9 and protective cover 10 are collected with the temperature of integration packaging, pressure sensor structure
At encapsulation.Wherein protective cover 9 is made of iron cobalt nickel alloy material, is porous structure.Humidity sensor chip 9 passes through viscous
Patch, the mode of laser welding bonding are fixed in sensor base 1, and humidity sensor chip 9 be placed in sensor base 1 with
The opposite side of 5 mounting surface of temperature sensor chip.Signal pins 2 are processed into L shapes, are used in combination two one metal wire leads 7 by humidity
Sensor chip 9 is connected respectively in two signal pins 2.Two wiring holes are set on protective cover 10, by two signals
Pin 2 is drawn from the wiring hole on protective cover 10 respectively, is led with non-between two signal pins 2 and protective cover 10
Electric glue 8 is filled.Protective cover 10 is formed final using pasting, being fixed in sensor base 1 by the way of laser welding bonding
Surface acoustic wave temperature, humidity, pressure sensor integrated encapsulation structure.
Third walks, decoupling surface acoustic wave temperature, humidity, pressure sensor signal
The surface acoustic wave temperature of integration packaging, humidity, pressure sensor integrated encapsulation structure, wherein temperature sensor chip
5, humidity sensor chip 9 nevertheless suffers from testing pressureInfluence；Pressure sensor chip 4, humidity sensor chip 9 by
Wait for testing temperatureInfluence；But pressure sensor chip 4, temperature sensor chip 5 will not be waited for measuring moistureInfluence.If
Pressure sensor chip 4 exports, temperature sensor chip 5 output be, humidity sensor chip 9 output be, then
Wait for testing temperature, wait for measuring moisture, testing pressureRelational expression is：
（1）
（2）
（3）
Pressure coefficient（）, temperature coefficient（）, humidity coefficient（
）It is obtained by sensor calibration.Test obtains sensor output、、Afterwards, pass through simultaneous solution formula（1）, formula
（2）, formula（3）Obtain external environment at this time waits for testing temperature, wait for measuring moisture, testing pressureExact value.
So far, the integration packaging of surface acoustic wave multi-parameter sensor is completed.
Claims (1)
1. a kind of surface acoustic wave multi-parameter sensor integrated encapsulation method, it is characterised in that the specific steps are：
The first step, integration packaging surface acoustic wave temperature, pressure sensor structure
Surface acoustic wave temperature, pressure sensor structure, including：Sensor base（1）, signal pins（2）, pressure deformation diaphragm
（3）, pressure sensor chip（4）, temperature sensor chip（5）, sensor upper cover（6）, wire leads（7）And non-conductive adhesive
（8）；Wherein, pressure sensor chip（4）It is placed in pressure deformation diaphragm（3）Center, to obtain maximum sensitive deformation；Pressure
Deformation diaphragm（3）It is fixed on sensor upper cover by the bonding pattern of stickup, laser welding（6）Inside, and need ensure key
Sealing performance at conjunction；Temperature sensor chip（5）It is placed in sensor base（1）Center, with isolated pressure variation pair
The influence that temperature measures；Sensor base（1）It is made of iron cobalt nickel alloy material；Pressure sensor chip（4）Draw two
Wire leads（7）, it is connected respectively to two signal pins（2）On；Temperature sensor chip（5）Draw two one metal wire leads
（7）, it is connected respectively to two signal pins（2）On；Two signal pins（2）Respectively through sensor base（1）On two connect
It is pierced by string holes, and two signal pins（2）With sensor base（1）Between use non-conductive adhesive（8）Filling ensures leakproofness
Energy；Sensor base（1）With sensor upper cover（6）It is fixed by laser welding bonding pattern, ensures weld sealing performance；
Second step, integration packaging surface acoustic wave temperature, humidity, pressure sensor structure
By humidity sensor chip（9）And protective cover（10）Collected with the temperature of integration packaging, pressure sensor structure
At encapsulation；Wherein protective cover（10）It is made of iron cobalt nickel alloy material, is porous structure；Humidity sensor chip（9）
It is fixed on sensor base pasting, by way of laser welding bonding（1）On, and humidity sensor chip（9）It is placed in sensing
Device pedestal（1）Upper and temperature sensor chip（5）The opposite side of mounting surface；Signal pins（2）L shapes are processed into, are used in combination two
Wire leads（7）By humidity sensor chip（9）It is connected respectively to two signal pins（2）On；Protective cover（10）On
Two wiring holes are set, by two signal pins（2）Respectively from protective cover（10）On wiring hole in draw, two signals
Pin（2）With protective cover（10）Between use non-conductive adhesive（8）Filling；Protective cover（10）Using stickup, laser welding
The mode of bonding is fixed on sensor base（1）On, form the integrated envelope of final surface acoustic wave temperature, humidity, pressure sensor
Assembling structure；
Third walks, decoupling surface acoustic wave temperature, humidity, pressure sensor signal
The surface acoustic wave temperature of integration packaging, humidity, pressure sensor integrated encapsulation structure, wherein temperature sensor chip（5）,
Humidity sensor chip（9）Nevertheless suffer from testing pressureInfluence；Pressure sensor chip（4）, humidity sensor chip（9）
Waited for testing temperatureInfluence；But pressure sensor chip（4）, temperature sensor chip（5）It will not be waited for measuring moisture's
It influences；If pressure sensor chip（4）Output is, temperature sensor chip（5）Output is, humidity sensor chip（9）
Output is, then testing temperature is waited for, wait for measuring moisture, testing pressureRelational expression is：
（1）
（2）
（3）
Include pressure coefficient by sensor calibration acquisition, wherein, temperature coefficient, whereinWith
And humidity coefficient, wherein；Test obtains sensor output、、Afterwards, pass through simultaneous solution formula
（1）, formula（2）, formula（3）Obtain external environment at this time waits for testing temperature, wait for measuring moisture, testing pressureIt is accurate
Value；
So far, the integration packaging of surface acoustic wave multi-parameter sensor is completed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201611219222.8A CN106643898B (en) | 2016-12-26 | 2016-12-26 | A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method |
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| CN201611219222.8A CN106643898B (en) | 2016-12-26 | 2016-12-26 | A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method |
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| CN106643898A CN106643898A (en) | 2017-05-10 |
| CN106643898B true CN106643898B (en) | 2018-11-09 |
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| CN107179099B (en) * | 2017-07-11 | 2023-10-27 | 安费诺(常州)连接系统有限公司 | Sensor structure and manufacturing method thereof |
| CN111384461A (en) * | 2018-12-29 | 2020-07-07 | 中信国安盟固利动力科技有限公司 | Multi-parameter integrated device of ion battery and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5757250A (en) * | 1995-03-06 | 1998-05-26 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave module with thin film for wave transmission velocity differentiation |
| CN101008586A (en) * | 2007-01-29 | 2007-08-01 | 北京交通大学 | Wireless accessed surface acoustic wave sensors |
| CN102798403A (en) * | 2012-08-21 | 2012-11-28 | 江苏物联网研究发展中心 | MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof |
| CN105577136A (en) * | 2014-11-05 | 2016-05-11 | 天津威盛电子有限公司 | Surface acoustic wave element and method of manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060055531A1 (en) * | 2004-09-14 | 2006-03-16 | Honeywell International, Inc. | Combined RF tag and SAW sensor |
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2016
- 2016-12-26 CN CN201611219222.8A patent/CN106643898B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5757250A (en) * | 1995-03-06 | 1998-05-26 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave module with thin film for wave transmission velocity differentiation |
| CN101008586A (en) * | 2007-01-29 | 2007-08-01 | 北京交通大学 | Wireless accessed surface acoustic wave sensors |
| CN102798403A (en) * | 2012-08-21 | 2012-11-28 | 江苏物联网研究发展中心 | MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof |
| CN105577136A (en) * | 2014-11-05 | 2016-05-11 | 天津威盛电子有限公司 | Surface acoustic wave element and method of manufacturing the same |
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