CN106643898A - Surface acoustic wave multiparameter sensor integration packaging method - Google Patents
Surface acoustic wave multiparameter sensor integration packaging method Download PDFInfo
- Publication number
- CN106643898A CN106643898A CN201611219222.8A CN201611219222A CN106643898A CN 106643898 A CN106643898 A CN 106643898A CN 201611219222 A CN201611219222 A CN 201611219222A CN 106643898 A CN106643898 A CN 106643898A
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- Prior art keywords
- sensor
- temperature
- sensor chip
- pressure
- humidity
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/22—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using measurement of acoustic effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/25—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons
- G01L1/255—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons using acoustic waves, or acoustic emission
Abstract
The invention discloses a surface acoustic wave multiparameter sensor integration packaging method. The method comprises the following three steps: integration packaging of surface acoustic wave temperature and pressure sensor structures; integration packaging of the surface acoustic wave temperature, humidity and pressure sensor structures; decoupling of surface acoustic wave temperature, humidity and pressure sensor signals. The method can help solve a problem that sensor chip test results are impacted by requirement of multiple interfaces provided by outside, complex leading wires and much physical quantity interference via a conventional packaging method; accuracy of test results can be improved.
Description
Technical field
The present invention relates to a kind of sensor packaging method, particularly a kind of surface acoustic wave multi-parameter sensor integration packaging side
Method.
Background technology
At present, need simultaneously to measure temperature, pressure, humidity these three physical quantitys in various application occasions, tradition
Method of testing need respectively to carry out these three physical quantitys respectively using temperature sensor, pressure sensor, humidity sensor
Measurement, in structure, the interface for needing extraneous offer more, lead is complicated；And it is actually used in, temperature, humidity, pressure these three
Physical quantity has cross jamming to the sensor that encapsulation is completed, and traditional method for packing does not consider this interference to sensor core
The impact of built-in testing result, causes measurement result inaccurate.It can be seen that traditional single one physical quantity sensor encapsulation cannot meet same
When enter the requirement of trip temperature, pressure, moisture measurement.
The content of the invention
Present invention aim at providing a kind of surface acoustic wave multi-parameter sensor integrated chip method for packing, solve single at present
One physical quantity transducer encapsulating structure complex interfaces, and there is asking for cross jamming to the sensor that encapsulation is completed in multiple physical quantitys
Topic.
A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method, it is concretely comprised the following steps：
The first step, integration packaging surface acoustic wave temperature, pressure sensor structure
Surface acoustic wave temperature, pressure sensor structure, including：Sensor base, signal pins, pressure deformation diaphragm, pressure are passed
Lid, wire leads and non-conductive adhesive on sensor chip, temperature sensor chip, sensor.Wherein, pressure sensor chip is put
In pressure deformation its center position, to obtain the deformation of maximum sensitivity；Pressure deformation diaphragm is by pasting, the bonding of laser welding
Mode fixes the inner side covered on a sensor, and needs to ensure the sealing property at bonding；Temperature sensor chip is placed in sensing
The center of device base, is changed on thermometric impact with isolated pressure；Sensor base adopts iron cobalt nickel alloy material
Make；Pressure sensor chip draws two one metal wire leads, is connected respectively in two signal pins；Temperature sensor chip
Two one metal wire leads are drawn, is connected respectively in two signal pins；In two signal pins difference Jing sensor bases
Pass in two wiring holes, and two are filled between signal pins and sensor base with non-conductive adhesive, it is ensured that sealing property；Pass
Cover on sensor base and sensor and fixed by laser welding bonding pattern, it is ensured that weld sealing property.
Second step, integration packaging surface acoustic wave temperature, humidity, pressure sensor structure
The temperature of humidity sensor chip and protective cover and integration packaging, pressure sensor structure are carried out into integration packaging.
Wherein protective cover is made using iron cobalt nickel alloy material, is loose structure.Humidity sensor chip is by pasting, Laser Welding
The mode for connecing bonding is fixed in sensor base, and humidity sensor chip is placed in sensor base and temperature sensor core
The relative side of piece mounting surface.Signal pins are processed into L shapes, and are respectively connected humidity sensor chip with two one metal wire leads
It is connected in two signal pins.Two wiring holes are set on protective cover, by two signal pins respectively from protective cover
On wiring hole in draw, two are filled between signal pins and protective cover with non-conductive adhesive.Protective cover is using viscous
Patch, the mode of laser welding bonding are fixed in sensor base, form final surface acoustic wave temperature, humidity, pressure sensing
Device integrated encapsulation structure.
3rd step, decoupling surface acoustic wave temperature, humidity, pressure sensor signal
It is the surface acoustic wave temperature of integration packaging, humidity, pressure sensor integrated encapsulation structure, wherein temperature sensor chip, wet
Degree sensor chip nevertheless suffers from testing pressureImpact；Pressure sensor chip, humidity sensor chip are treated thermometric
DegreeImpact；But pressure sensor chip, temperature sensor chip will not be treated measuring moistureImpact.If pressure sensing
Device chip is output as, temperature sensor chip is output as, humidity sensor chip is output as, then testing temperature is treated、
Treat measuring moisture, testing pressureRelational expression is：
（1）
（2）
（3）
Pressure coefficient（）, temperature coefficient（）, humidity coefficient（）
Obtained by sensor calibration.Test obtains sensor output、、Afterwards, by simultaneous solution formula（1）, formula
（2）, formula（3）Obtain now external environment treats testing temperature, treat measuring moisture, testing pressureExact value.
So far, the integration packaging of surface acoustic wave multi-parameter sensor is completed.
This method can solve the problem that traditional method for packing needs the complicated problem of the more interface of extraneous offer, lead, its
Iron cobalt nickel alloy material make loose structure can barrier liquid and dust pollution humidity sensor chip, its integration packaging
Structure considers impact of many physical quantity interference to sensor chip test result, improves the accuracy of measurement result.
Description of the drawings
Surface acoustic wave temperature, the envelope of pressure sensor in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 1
Dress schematic diagram；
Surface acoustic wave temperature in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 2, humidity, pressure sensor
Integration packaging schematic diagram；
Surface acoustic wave temperature in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 3, humidity, pressure sensor
Integration packaging side schematic view；
The positive and side schematic view of signal pins in a kind of surface acoustic wave multi-parameter sensor integrated encapsulation methods of Fig. 4.
1. the temperature of 2. signal pins of sensor base, 3. pressure deformation diaphragm, 4. pressure sensor chip 5. is passed
Sensor chip
6. the protective cover of 7. wire leads of lid, 8. non-conductive adhesive, 9. humidity sensor chip 10. on sensor.
Specific embodiment
A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method, it is concretely comprised the following steps：
The first step, integration packaging surface acoustic wave temperature, pressure sensor structure
Surface acoustic wave temperature, pressure sensor structure, including：Sensor base 1, signal pins 2, pressure deformation diaphragm 3, pressure
Lid 6, wire leads 7 and non-conductive adhesive 8 on sensor chip 4, temperature sensor chip 5, sensor.Wherein, pressure sensing
Device chip 4 is placed in the center of pressure deformation diaphragm 3, to obtain the deformation of maximum sensitivity；Pressure deformation diaphragm 3 is by pasting, swashing
The bonding pattern of photocoagulation fixes the inner side of lid 6 on a sensor, and needs to ensure the sealing property at bonding；Temperature sensor
Chip 5 is placed in the center of sensor base 1, is changed on thermometric impact with isolated pressure；Sensor base 1 is adopted
Iron cobalt nickel alloy material makes；Pressure sensor chip 4 draws two one metal wire leads 7, is connected respectively to two signal pins 2
On；Temperature sensor chip 5 draws two one metal wire leads 7, is connected respectively in two signal pins 2；Two signal pins 2
Pass in two wiring holes in Jing sensor bases 1 respectively, and led with non-between two signal pins 2 and sensor base 6
Electric glue 8 is filled, it is ensured that sealing property；Sensor base 1 is fixed with lid on sensor 6 by laser welding bonding pattern, it is ensured that
Weld sealing property.
Second step, integration packaging surface acoustic wave temperature, humidity, pressure sensor structure
The temperature of humidity sensor chip 9 and protective cover 10 and integration packaging, pressure sensor structure are carried out into integrated envelope
Dress.Wherein protective cover 9 is made using iron cobalt nickel alloy material, is loose structure.Humidity sensor chip 9 by paste,
The mode of laser welding bonding is fixed in sensor base 1, and humidity sensor chip 9 is placed in sensor base 1 with temperature
The relative side of the degree mounting surface of sensor chip 5.Signal pins 2 are processed into L shapes, and are passed humidity with two one metal wire leads 7
Sensor chip 9 is connected respectively in two signal pins 2.Two wiring holes are set on protective cover 10, two signals are drawn
Draw in the wiring hole respectively from protective cover 10 of pin 2, with non-conductive between two signal pins 2 and protective cover 10
Glue 8 is filled.Protective cover 10 is fixed in sensor base 1 by the way of stickup, laser welding bonding, is formed final
Surface acoustic wave temperature, humidity, pressure sensor integrated encapsulation structure.
3rd step, decoupling surface acoustic wave temperature, humidity, pressure sensor signal
It is the surface acoustic wave temperature of integration packaging, humidity, pressure sensor integrated encapsulation structure, wherein temperature sensor chip 5, wet
Degree sensor chip 9 nevertheless suffers from testing pressureImpact；Pressure sensor chip 4, humidity sensor chip 9 are subject to be measured
TemperatureImpact；But pressure sensor chip 4, temperature sensor chip 5 will not be treated measuring moistureImpact.If pressure
Sensor chip 4 is output as, temperature sensor chip 5 is output as, humidity sensor chip 9 is output as, then it is to be measured
Temperature, treat measuring moisture, testing pressureRelational expression is：
（1）
（2）
（3）
Pressure coefficient（）, temperature coefficient（）, humidity coefficient（）
Obtained by sensor calibration.Test obtains sensor output、、Afterwards, by simultaneous solution formula（1）, formula
（2）, formula（3）Obtain now external environment treats testing temperature, treat measuring moisture, testing pressureExact value.
So far, the integration packaging of surface acoustic wave multi-parameter sensor is completed.
Claims (1)
1. a kind of surface acoustic wave multi-parameter sensor integrated encapsulation method, it is characterised in that concretely comprise the following steps：
The first step, integration packaging surface acoustic wave temperature, pressure sensor structure
Surface acoustic wave temperature, pressure sensor structure, including：Sensor base（1）, signal pins（2）, pressure deformation diaphragm
（3）, pressure sensor chip（4）, temperature sensor chip（5）, cover on sensor（6）, wire leads（7）And non-conductive adhesive
（8）；Wherein, pressure sensor chip（4）It is placed in pressure deformation diaphragm（3）Center, to obtain the deformation of maximum sensitivity；Pressure
Deformation diaphragm（3）Fixed by the bonding pattern of stickup, laser welding and covered on a sensor（6）Inner side, and need ensure key
Sealing property at conjunction；Temperature sensor chip（5）It is placed in sensor base（1）Center, with isolated pressure change it is right
Thermometric impact；Sensor base（1）Made using iron cobalt nickel alloy material；Pressure sensor chip（4）Draw two
Wire leads（7）, it is connected respectively to two signal pins（2）On；Temperature sensor chip（5）Draw two one metal wire leads
（7）, it is connected respectively to two signal pins（2）On；Two signal pins（2）Difference Jing sensor bases（1）On two connect
Pass in string holes, and two signal pins（2）With sensor base（1）Between use non-conductive adhesive（8）Filling, it is ensured that sealing
Energy；Sensor base（1）Cover with sensor（6）Fixed by laser welding bonding pattern, it is ensured that weld sealing property；
Second step, integration packaging surface acoustic wave temperature, humidity, pressure sensor structure
By humidity sensor chip（9）And protective cover（10）Temperature, pressure sensor structure with integration packaging is collected
Into encapsulation；Wherein protective cover（10）Made using iron cobalt nickel alloy material, be loose structure；Humidity sensor chip（9）
Sensor base is fixed on pasting, by way of laser welding bonding（1）On, and humidity sensor chip（9）It is placed in sensing
Device base（1）Upper and temperature sensor chip（5）The relative side of mounting surface；Signal pins（2）L shapes are processed into, and with two
Wire leads（7）By humidity sensor chip（9）It is connected respectively to two signal pins（2）On；Protective cover（10）On
Two wiring holes are set, by two signal pins（2）Respectively from protective cover（10）On wiring hole in draw, two signals
Pin（2）With protective cover（10）Between use non-conductive adhesive（8）Filling；Protective cover（10）Using stickup, laser welding
The mode of bonding is fixed on sensor base（1）On, form final surface acoustic wave temperature, humidity, the integrated envelope of pressure sensor
Assembling structure；
3rd step, decoupling surface acoustic wave temperature, humidity, pressure sensor signal
The surface acoustic wave temperature of integration packaging, humidity, wherein pressure sensor integrated encapsulation structure, temperature sensor chip（5）、
Humidity sensor chip（9）Nevertheless suffer from testing pressureImpact；Pressure sensor chip（4）, humidity sensor chip（9）
Treated testing temperatureImpact；But pressure sensor chip（4）, temperature sensor chip（5）Measuring moisture will not be treated
Impact；If pressure sensor chip（4）It is output as, temperature sensor chip（5）It is output as, humidity sensor chip
（9）It is output as, then testing temperature is treated, treat measuring moisture, testing pressureRelational expression is：
（1）
（2）
（3）
Pressure coefficient, wherein, temperature coefficient, wherein, humidity coefficient, wherein, obtained by sensor calibration；Test obtains sensor output、、Afterwards, by simultaneous solution
Formula（1）, formula（2）, formula（3）Obtain now external environment treats testing temperature, treat measuring moisture, testing pressure's
Exact value；
So far, the integration packaging of surface acoustic wave multi-parameter sensor is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611219222.8A CN106643898B (en) | 2016-12-26 | 2016-12-26 | A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method |
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| CN201611219222.8A CN106643898B (en) | 2016-12-26 | 2016-12-26 | A kind of surface acoustic wave multi-parameter sensor integrated encapsulation method |
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| CN106643898A true CN106643898A (en) | 2017-05-10 |
| CN106643898B CN106643898B (en) | 2018-11-09 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107179099A (en) * | 2017-07-11 | 2017-09-19 | 安费诺(常州)连接系统有限公司 | Sensor construction and preparation method thereof |
| CN111384461A (en) * | 2018-12-29 | 2020-07-07 | 中信国安盟固利动力科技有限公司 | Multi-parameter integrated device of ion battery and preparation method thereof |
Citations (5)
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| US5757250A (en) * | 1995-03-06 | 1998-05-26 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave module with thin film for wave transmission velocity differentiation |
| US20060055531A1 (en) * | 2004-09-14 | 2006-03-16 | Honeywell International, Inc. | Combined RF tag and SAW sensor |
| CN101008586A (en) * | 2007-01-29 | 2007-08-01 | 北京交通大学 | Wireless accessed surface acoustic wave sensors |
| CN102798403A (en) * | 2012-08-21 | 2012-11-28 | 江苏物联网研究发展中心 | MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof |
| CN105577136A (en) * | 2014-11-05 | 2016-05-11 | 天津威盛电子有限公司 | Surface acoustic wave element and method of manufacturing the same |
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2016
- 2016-12-26 CN CN201611219222.8A patent/CN106643898B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5757250A (en) * | 1995-03-06 | 1998-05-26 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave module with thin film for wave transmission velocity differentiation |
| US20060055531A1 (en) * | 2004-09-14 | 2006-03-16 | Honeywell International, Inc. | Combined RF tag and SAW sensor |
| CN101008586A (en) * | 2007-01-29 | 2007-08-01 | 北京交通大学 | Wireless accessed surface acoustic wave sensors |
| CN102798403A (en) * | 2012-08-21 | 2012-11-28 | 江苏物联网研究发展中心 | MEMS (Micro Electro Mechanical System) film capacitive type multi-parameter sensor structure and integrated manufacturing method thereof |
| CN105577136A (en) * | 2014-11-05 | 2016-05-11 | 天津威盛电子有限公司 | Surface acoustic wave element and method of manufacturing the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107179099A (en) * | 2017-07-11 | 2017-09-19 | 安费诺(常州)连接系统有限公司 | Sensor construction and preparation method thereof |
| CN107179099B (en) * | 2017-07-11 | 2023-10-27 | 安费诺(常州)连接系统有限公司 | Sensor structure and manufacturing method thereof |
| CN111384461A (en) * | 2018-12-29 | 2020-07-07 | 中信国安盟固利动力科技有限公司 | Multi-parameter integrated device of ion battery and preparation method thereof |
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| CN106643898B (en) | 2018-11-09 |
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