CN207675218U - A kind of pressure and temperature sensor based on PCB encapsulation - Google Patents
A kind of pressure and temperature sensor based on PCB encapsulation Download PDFInfo
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- CN207675218U CN207675218U CN201721670034.7U CN201721670034U CN207675218U CN 207675218 U CN207675218 U CN 207675218U CN 201721670034 U CN201721670034 U CN 201721670034U CN 207675218 U CN207675218 U CN 207675218U
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- pressure
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- temperature sensor
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Abstract
The utility model provides a kind of pressure and temperature sensor encapsulated based on PCB, including shell, the shell has hollow circular cavity, filling silicon oil in circular cavity, shell has the circular groove of front-end and back-end two, front end circular groove and rear end circular groove are communicated with circular cavity, it is welded with pressure ring and diaphragm in the circular groove of front end, it is fixed with pcb board in the circular groove of rear end, pcb board is provided with pressure chip and temperature sensor on one side towards front end, and pcb board is provided with conducting wire and sample resistance on one side towards rear end.The sensor solves pressure sensing and the integration problem of temperature sensing by simple structure and technique.
Description
Technical field
The utility model is related to measure measurement and control area more particularly to a kind of integrated sensor.
Background technology
With the development of science and technology automation flourishes with intelligentized, the extensive use market of sensor is brought.And
The miniaturization of sensor and high integration require to be current Some Questions To Be Researched, some external numerous and confused rows of company of chip giant
It is dynamic, set about in the integrated level of chip to realize the target, and achieve preliminary achievement.
China's chip technology relatively fall behind, high-end devices lack, on the limited chip of size integrated pressure and temperature
Sensing function is difficult.Although the pressure sensor in China obtained large development at nearest 10 years, by the shadow of processing quality
It rings, still has a certain distance in pressure measurement precision and stability energy etc. and external product, the pressure of current high-precision demand passes
Sensor is still mainly by import.It is if integrated temperature sensing function, i.e., enabled to realize under this background condition, and temperature
Sensing accuracy can be met the requirements, but since pressure precision is inadequate, and overall performance still cannot reach certain height.
The utility model ZL201620102863.4 that applicant has authorized discloses a kind of pressure sensor, in order to realize collection
Cheng Hua, on the basis of the utility model authorized, applicant has developed the sensor of integrated pressure sensing and temperature sensing.
Utility model content
In order to solve the problems, such as background technology, the utility model provide a kind of pressure encapsulated based on PCB and
Temperature sensor, the sensor solve pressure sensing and the integration problem of temperature sensing by simple structure and technique.
In order to achieve the above objectives, the utility model adopts the following technical solution：
A kind of pressure and temperature sensor based on PCB encapsulation, including shell, the shell have hollow circular cavity
Body, filling silicon oil in circular cavity, shell have the circular groove of front-end and back-end two, and front end circular groove and rear end circle are recessed
Slot is communicated with circular cavity, and pressure ring and diaphragm are welded in the circular groove of front end, pcb board, PCB are fixed in the circular groove of rear end
Plate is provided with pressure chip and temperature sensor on one side towards front end, and pcb board is provided with conducting wire and takes on one side towards rear end
Sample resistance.
Rear end circular groove bottom part ring is provided with seal groove around circular cavity, and sealing ring is provided in seal groove.
Pcb board is fixed on by riveting or slash mode in the circular groove of rear end.
Temperature sensor and sample resistance are connected on pcb board circuit.
Pressure chip is fixed on pcb board by pressure chip bonding on pcb board with glue, then use bonding line will
Effective node connection is conducting on the corresponding solder joint of pcb board on pressure chip.
Temperature sensor is welded on pcb board.
Conducting wire and sample resistance are welded on pcb board.
The utility model has the beneficial effects that：
1, insulation, conducting and the function of integrating a variety of prototype parts are realized as matrix using pcb board；Using sealing element and
Riveting process realizes encapsulation and sealing function；The Multifunctional centralized for efficiently solving sensor is problematic, simple for process feasible, performance
Secure, inexpensive high effect allows pressure sensing and temperature sensing to integrate and comes true, to greatest extent by simple technique
Reduce technical difficulty and R＆D and production cost；
2, by the free matched combined of different grades of original paper, needing for different selections of the market for Cost And Performance can be taken into account
It asks, high-end applications can select high-accuracy original paper to combine；Low-end applications can select cost-effective original paper to combine；There is master
Can strengthening for taking second place point is main loose secondary；Combination flexible and changeable in this way effectively prevents bringing by integrated chip technology
High cost and the narrow drawback of application range.
Description of the drawings
The utility model is further illustrated below in conjunction with the accompanying drawings
Fig. 1 is the cross-sectional view of pressure and temperature sensor described in the utility model；
Fig. 2 is the separate structure schematic diagram of pressure and temperature sensor described in the utility model；
Fig. 3 is the overall structure diagram of pressure and temperature sensor described in the utility model.
Fig. 4 is the circuit diagram of pressure and temperature sensor described in the utility model.
Specific implementation mode
Explanation and specific implementation mode are further described the utility model below in conjunction with the accompanying drawings：
Embodiment 1
As shown in Figs. 1-3, a kind of pressure sensor of PCB encapsulation, including pressure ring 1, diaphragm 2, shell 3, sealing ring 4, pressure
Power chip 5, temperature sensor 11, sample resistance 12, pcb board 9 and conducting wire 10, the shell 3 have hollow circular cavity 6,
The front-end and back-end of filling silicon oil in circular cavity 6, shell 3 have circular groove, front end circular groove and rear end circular groove
It is communicated respectively at circular cavity 6, pressure ring 1 and diaphragm 2 is welded on leading portion circular groove, PCB is fixed in the circular groove of rear end
Plate 9 is provided with pressure chip 5 and temperature sensor 11 on pcb board 9 on one side towards front end, and pressure chip 5 passes through bonding line 8
Bonding is on pcb board, and for temperature sensor 11 by being welded and fixed on pcb board, pcb board is welded with conducting wire 10 on one side towards rear end
With sample resistance 12.Rear end circular groove bottom part ring is provided with annular seal groove around circular cavity, and sealing is provided in seal groove
Circle 4.
As shown in figure 4, the left side is pressure sensing portion, on the basis of pressure sensing portion, temperature sensor 11 and take
Sample resistance 12 is connected on circuit, according to series resistance voltage divider principle, while the resistance value of temperature sensor is with temperature change,
The voltage at sample resistance both ends changes accordingly, and " the temperature-electricity of different range abilities just can be obtained in Proper Match sample resistance
Pressure " curve, achievees the purpose that temperature sensing.
The production process of the pressure and temperature sensor of above-mentioned PCB encapsulation is：
1) pressure ring 1 and diaphragm 2 are welded on to the front end of shell 3, cleaning, drying is for use；
2) described that chip is fixed on PCB with glue by 5 bonding of pressure chip on pcb board 9, then use gold thread
Or effective node connection on pressure chip is conducting on the corresponding solder joints of PCB by aluminum steel as bonding line 8；
3) temperature sensor 11 is welded on pcb board 9；
4) sealing ring is placed in the seal groove of shell tail end, is placed through on sealing ring and is integrated with 5 He of pressure chip
The pcb board 9 of temperature sensor 11, is then put into the mold of forcing press and is riveted；
5) silicone oil is filled after the shell 3 riveted being inhaled vacuum；
6) conducting wire 10 and sample resistance 12 are welded on PCB.
Other than fixing pcb board and shell by the way of riveting, other modes such as slash can also be used
Mode fixes pcb board and shell.
Using " change in resistance type " temperature sensor as example in the design, it is not limited to be passed using a certain temperature
It can also be metal fever resistance (such as platinum, nickel, copper composition that sensor, which can be semiconductor thermistor (such as NTC, PTC, CRT),
Pt50, Pt100, Pt1000, Cu50, Cu100 etc.).Heat production galvanic couple (such as platinum can also be used in equally appropriate change circuit theory
Rhodium, nickel chromium triangle, nisiloy etc.) or transistor type digital temperature sensor (such as AD590) be used as temperature sensitivity original paper, using same
Structural principle and production technology, you can achieve the purpose that temperature sensing.
The utility model accepts inside chip using pcb board and outer lead matrix realizes the function of insulation and conducting；It adopts
Encapsulation and sealing function are realized with sealing element and riveting process, so that pressure sensor is simple for process feasible, effect is high.
It will be recognized by those skilled in the art, can be to above-mentioned under the premise of without departing from protection scope of the present invention
Embodiment is carry out various modifications, changes and is combined, and thinks that this modification, variation and combination are the models in originality thought
Within enclosing.
Claims (7)
1. a kind of pressure and temperature sensor based on PCB encapsulation, including shell, which is characterized in that the shell has hollow
Circular cavity, filling silicon oil in circular cavity, shell has a circular groove of front-end and back-end two, front end circular groove and after
End circular groove is communicated with circular cavity, and pressure ring and diaphragm are welded in the circular groove of front end, is fixed in the circular groove of rear end
Pcb board, pcb board are provided with pressure chip and temperature sensor on one side towards front end, and pcb board is provided on one side towards rear end
Conducting wire and sample resistance.
2. a kind of pressure and temperature sensor based on PCB encapsulation as described in claim 1, which is characterized in that rear end is round
Bottom portion of groove is provided with seal groove around circular cavity, and sealing ring is provided in seal groove.
3. a kind of pressure and temperature sensor based on PCB encapsulation as described in claim 1, which is characterized in that pcb board passes through
Riveting or slash mode are fixed in the circular groove of rear end.
4. a kind of pressure and temperature sensor based on PCB encapsulation as described in claim 1, which is characterized in that temperature sensing
Device and sample resistance are connected on pcb board circuit.
5. a kind of pressure and temperature sensor based on PCB encapsulation as described in claim 1, which is characterized in that pressure chip
Pressure chip is fixed on pcb board by bonding on pcb board with glue, then will effectively be saved on pressure chip with bonding line
Point connection is conducting on the corresponding solder joint of pcb board.
6. a kind of pressure and temperature sensor based on PCB encapsulation as described in claim 1, which is characterized in that temperature sensing
Device is welded on pcb board.
7. a kind of pressure and temperature sensor based on PCB encapsulation as described in claim 1, which is characterized in that conducting wire and take
Sample resistance welding is on pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721670034.7U CN207675218U (en) | 2017-12-06 | 2017-12-06 | A kind of pressure and temperature sensor based on PCB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721670034.7U CN207675218U (en) | 2017-12-06 | 2017-12-06 | A kind of pressure and temperature sensor based on PCB encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207675218U true CN207675218U (en) | 2018-07-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721670034.7U Active CN207675218U (en) | 2017-12-06 | 2017-12-06 | A kind of pressure and temperature sensor based on PCB encapsulation |
Country Status (1)
| Country | Link |
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| CN (1) | CN207675218U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114770038A (en) * | 2022-04-12 | 2022-07-22 | 常州市惠昌传感器有限公司 | Method for mounting pressure and temperature sensor |
| US11592349B2 (en) | 2021-02-02 | 2023-02-28 | Honeywell International Inc. | Combined temperature and pressure sensing device with improved electronic protection |
-
2017
- 2017-12-06 CN CN201721670034.7U patent/CN207675218U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11592349B2 (en) | 2021-02-02 | 2023-02-28 | Honeywell International Inc. | Combined temperature and pressure sensing device with improved electronic protection |
| US11852550B2 (en) | 2021-02-02 | 2023-12-26 | Honeywell International Inc. | Combined temperature and pressure sensing device with improved eletronics protection |
| CN114770038A (en) * | 2022-04-12 | 2022-07-22 | 常州市惠昌传感器有限公司 | Method for mounting pressure and temperature sensor |
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