CN201697746U - Glass encapsulation reticulate pattern type base for pressure sensor - Google Patents
Glass encapsulation reticulate pattern type base for pressure sensor Download PDFInfo
- Publication number
- CN201697746U CN201697746U CN2010201976259U CN201020197625U CN201697746U CN 201697746 U CN201697746 U CN 201697746U CN 2010201976259 U CN2010201976259 U CN 2010201976259U CN 201020197625 U CN201020197625 U CN 201020197625U CN 201697746 U CN201697746 U CN 201697746U
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- reticulate pattern
- mounting hole
- chip
- pattern type
- sensor
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- Expired - Fee Related
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Abstract
The utility model relates to a glass encapsulation reticulate pattern type base for a pressure sensor. The glass encapsulation reticulate pattern type base comprises a base casing (1), and a mounting hole (3) formed on the outer end surface of the base casing, wherein a set of lead wires (5) are uniformly distributed in the mounting hole along the circle center; all lead wires are connected with the base casing through a glass insulator (4); a fixing groove (2a) for allowing a sensor chip to be installed is formed in the center part of the mounting hole; and a reticulate pattern surface (2) matched with the sensor chip in a bonding manner is arranged on the bottom surface of the fixing groove. The texture of the reticulate pattern surface is about 0.15 mm in depth; the space between the reticulate pattern surface and the chip is filled with epoxy resin; the epoxy resin coating area and the usage are increased; the bonding force is greatly intensified; and the fixation of the chip is guaranteed. The utility model has the advantages that after the use of the reticulate pattern structure, the phenomenon of dropping off of the sensor chip is avoided, the reliability of the sensor is greatly improved, and the base is highly commended by customers.
Description
Technical field
The utility model relates to a kind of pressure transducer, particularly a kind of pressure transducer glass capsulation reticulate pattern type pedestal.
Background technology
Pressure transducer has precision height, reliable operation, frequency response height, sluggish little, in light weight, advantages of simple structure and simple, can work under harsh conditions, is convenient to realize instrument, instrument digitizing.Be widely used in fields such as biology, medical science, chemical industry, rock-soil mechanics, meteorology, petroleum prospecting, space flight and aviation, obtain swift and violent development.The structure of pressure transducer mainly is made up of two big parts, wherein the glass capsulation pedestal is one of its critical component, and the insulation resistance of sensor, proof voltage, sealing, bonding performance, compression resistance performance all support realization by pedestal.When making sensor, epoxy resin is coated at the back side of chip sticked on the enclosure interior pickup groove surface, through high-temperature baking, with epoxy resin cure.But since the pickup groove of enclosure interior during in machining because cutter centering is accurate inadequately, be easy to generate umbo after the processing, make the bottom surface injustice; Simultaneously also make the bottom surface too smooth easily, cause paster insecure by above reason.When sensor was given a shock and impact, chip came off easily, and the lead-in wire and the bonding wire of chip are ruptured, and make sensor cause ultimate failure, and this defective can't be repaired sensor.Extensively retrieve at the problems referred to above, do not find relevant solution as yet.
The utility model content
The purpose of this utility model is exactly to solve sensor chip and bonding not firm, the caducous shortcoming of pedestal that exists in the prior art, a kind of pressure transducer that provides glass capsulation reticulate pattern type pedestal.
To achieve these goals, the utility model has adopted following technical scheme:
A kind of pressure transducer glass capsulation reticulate pattern type pedestal, the outer face that comprises base shell, base shell is provided with mounting hole, uniform in the mounting hole one group of lead-in wire is set along the center of circle, each lead-in wire is connected with base shell by glass insulator respectively, it is characterized in that: the mounting hole centre be provided with one with the bonding reticulate pattern face that cooperates of sensor chip.
On the basis of above-mentioned basic technical scheme, following further technical scheme can be arranged:
Described mounting hole centre is provided with pickup groove, and the pickup groove bottom surface is provided with and the bonding reticulate pattern face that cooperates of sensor chip.
Reticulate pattern face in the utility model is the netted lines that processes by the machinery setting, and the shape of netted lines there is no specific (special) requirements, and the roughness of this reticulate pattern keeps certain requirement, and purpose is the bonding force of increase and sensor chip.
The utility model has the advantages that:
The utility model is after using reticulate structure, and obscission does not appear in sensor chip, has improved the reliability of sensor greatly, obtains user's favorable comment.
Description of drawings:
Fig. 1 is a structure cut-open view of the present utility model;
The vertical view of Fig. 2 view 1.
Embodiment:
A kind of pressure transducer that the utility model provides glass capsulation reticulate pattern type pedestal, the outer face that comprises base shell 1, base shell 1 is provided with mounting hole 3, in the mounting hole 3 along the center of circle uniform be provided with one group the lead-in wire 5, each lead-in wire 5 is connected with base shell 1 by glass insulator 4 respectively, mounting hole 3 centres are provided with the pickup groove 2a of placement sensor chip, and the pickup groove bottom surface is provided with and the bonding reticulate pattern face 2 that cooperates of sensor chip.
For example: the position processing diameter that pastes chip at pedestal is the pickup groove of 5mm, and the pickup groove degree of depth is determined according to chip.In the bottom land processing lines degree of depth is reticulate pattern face about 0.15mm, can satisfy the stickup of the chip of 3X3mm/3.5X3.5mm.Be somebody's turn to do between " reticulate pattern face " and the chip and filled epoxy resin, epoxy resin coated area and consumption increase, and bonding force is strengthened greatly, the guarantee that fixedly obtains of chip.
Claims (2)
1. a pressure transducer is with glass capsulation reticulate pattern type pedestal, the outer face that comprises base shell (1), base shell (1) is provided with mounting hole (3), in the mounting hole (3) along the center of circle the uniform one group of lead-in wire (5) that is provided with, each lead-in wire (5) is connected with base shell (1) by glass insulator (4) respectively, it is characterized in that: mounting hole (3) centre be provided with one with the bonding reticulate pattern face (2) that cooperates of sensor chip.
2. pressure transducer according to claim 1 is characterized in that with glass capsulation reticulate pattern type pedestal described mounting hole (3) centre is provided with pickup groove (2a), and the pickup groove bottom surface is provided with and the bonding reticulate pattern face (2a) that cooperates of sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201976259U CN201697746U (en) | 2010-05-14 | 2010-05-14 | Glass encapsulation reticulate pattern type base for pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201976259U CN201697746U (en) | 2010-05-14 | 2010-05-14 | Glass encapsulation reticulate pattern type base for pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201697746U true CN201697746U (en) | 2011-01-05 |
Family
ID=43398993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201976259U Expired - Fee Related CN201697746U (en) | 2010-05-14 | 2010-05-14 | Glass encapsulation reticulate pattern type base for pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201697746U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376182A (en) * | 2012-04-28 | 2013-10-30 | 浙江三花股份有限公司 | Heat exchange device and pressure sensor thereof |
| CN103672182A (en) * | 2012-09-05 | 2014-03-26 | 北京航天试验技术研究所 | Sealing method of sensor at low temperature and under high pressure |
-
2010
- 2010-05-14 CN CN2010201976259U patent/CN201697746U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376182A (en) * | 2012-04-28 | 2013-10-30 | 浙江三花股份有限公司 | Heat exchange device and pressure sensor thereof |
| CN103672182A (en) * | 2012-09-05 | 2014-03-26 | 北京航天试验技术研究所 | Sealing method of sensor at low temperature and under high pressure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ANHUI YIDA ELECTRONIC CO., LTD. Free format text: FORMER OWNER: BENGBU LIQUN ELECTRONIC CO., LTD. Effective date: 20121026 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20121026 Address after: 233010 No. 68 Liugong Road, hi tech Zone, Anhui, Bengbu Patentee after: Anhui Yida Electronic Co., Ltd. Address before: 233010 Friendship Road 1, hi tech Zone, Anhui, Bengbu Patentee before: Bengbu Liqun Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110105 Termination date: 20150514 |
|
| EXPY | Termination of patent right or utility model |