CN209013920U - A kind of micro-foil resistance strain gauge for circular plate type sensor - Google Patents
A kind of micro-foil resistance strain gauge for circular plate type sensor Download PDFInfo
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- CN209013920U CN209013920U CN201822151268.1U CN201822151268U CN209013920U CN 209013920 U CN209013920 U CN 209013920U CN 201822151268 U CN201822151268 U CN 201822151268U CN 209013920 U CN209013920 U CN 209013920U
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- solder joint
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- strain gauge
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Abstract
The utility model is suitable for strain gauge technical field, provide a kind of micro-foil resistance strain gauge for circular plate type sensor, first solder joint, third solder joint and the 5th centrally disposed left side of solder joint, second solder joint, 4th solder joint and the 6th centrally disposed right side of solder joint, first solder joint and the arrangement of the 6th solder joint central symmetry, second solder joint and the arrangement of the 5th solder joint central symmetry, third solder joint and the arrangement of the 4th solder joint central symmetry, first solder joint is connected to the first outer wire grid, first outer wire grid is connected to the second solder joint, second solder joint is connected to wire grid in first, wire grid is connected to third solder joint in first, 4th solder joint is connected to wire grid in second, wire grid is connected to the 5th solder joint in second, 5th solder joint is connected to the second outer wire grid, second outer wire grid is connected to six solder joints, it is barricaded as Wheatstone bridge.
Description
Technical field
The utility model belongs to strain gauge technical field more particularly to a kind of micro-foil electricity for circular plate type sensor
Hinder strain gauge.
Background technique
Strain ga(u)ge is a kind of common stress, strain measurement element, it is pasted onto securely on the measuring point of matrix,
Since measuring point generates strain after matrix stress, foil gauge also deforms therewith, and the length and cross-sectional area of wire are also with base
Body one changes, and then resistance variations occur, then the resistance variations size of foil gauge is measured by special instrument, and be converted to measuring point
Strain value.Strain ga(u)ge is to measure the logarithmic strain of matrix using deforming together with tested matrix when working.Due to base
There is the mechanical characteristic of certain directionality and matrix and architectural characteristic to make matrix for body its deformation under the action of load-up condition
Local unit generate different deformations, i.e. strain regime has regionality.
The strain gauge of existing circular plate type sensor, since by the way of pasting multiple foil gauges, patch occupied space is big,
Accurate patch, patch trouble are needed, and it is self-complementary to be unable to temperature drift.
Utility model content
The utility model provides a kind of micro-foil resistance strain gauge for circular plate type sensor, it is intended to solve existing answer
It is complicated to become meter patch, using more monolithic patch modes, positioning operation is difficult, and area occupied is big, and sensor cannot achieve volume more
Small problem.
The utility model is realized in this way a kind of micro-foil resistance strain gauge for circular plate type sensor, including
Substrate, sensitive grid and sealant, sensitive grid include the first outer wire grid, wire grid in first, the second outer wire grid, wire grid in second, base
Bottom is provided with the first outer wire grid, wire grid in first, the second outer wire grid, wire grid, first in second by the rounded bonding of bonding agent
Solder joint, the second solder joint, third solder joint, the 4th solder joint, the 5th solder joint and the 6th solder joint, the first solder joint, third solder joint and the 5th weldering
Point is successively set on center left from top to bottom, during the second solder joint, the 4th solder joint and the 6th solder joint are successively set on from top to bottom
On the right side of the heart, the first solder joint and the arrangement of the 6th solder joint central symmetry, the second solder joint and the 5th solder joint central symmetry are arranged, third solder joint
It arranges with the 4th solder joint central symmetry, the first solder joint is connected to the first outer wire grid, and the first outer wire grid is connected to the second solder joint, and second
Solder joint is connected to wire grid in first, and wire grid is connected to third solder joint in first, and the 4th solder joint is connected to wire grid in second, in second
Wire grid is connected to the 5th solder joint, and the 5th solder joint is connected to the second outer wire grid, and the second outer wire grid is connected to six solder joints, is barricaded as favour stone
Electric bridge.
Further, the first outer wire grid, wire grid in first, wire grid is fan shape in the second outer wire grid and second.
Further, the first outer wire grid and the arrangement of the second outer wire grid central symmetry and area equation, in first wire grid and
Wire grid central symmetry is arranged between the first outer wire grid and the second outer wire grid and area equation in second.
Further, the first outer wire grid, wire grid in first, the second outer wire grid, wire grid, the first solder joint, second in second
Solder joint, third solder joint, the 4th solder joint, the 5th solder joint and the 6th solder joint are metal foil material.
Further, Basolateral is bonded with coating, and coating is placed on base upper portion, by the first outer wire grid, first
Wire grid covers in interior wire grid, the second outer wire grid and second.
Further, the substrate and the sealant are using polyimide resin or phenol-formaldehyde resin modified or polyethers ether
Ketone or epoxy resin or glass fiber reinforced resin are coated, rotate, are sprayed, and have superior isolation performance, certain heatproof, acidproof
Alkali, electrolyte resistance can make strain gauge for various environment.
Further, bonding agent is epoxy glue or phenol glue.
The utility model has the beneficial effects that the first outer wire grid, wire grid in first, the second outer wire grid, wire grid, first in second
Solder joint, the second solder joint, third solder joint, the 4th solder joint, the 5th solder joint and the 6th rounded arrangement of solder joint, the first outer wire grid and first
Interior wire grid be connected to by the first solder joint, the second solder joint with third solder joint, in the second outer wire grid and second wire grid pass through the 4th solder joint,
5th solder joint and the connection of the 6th solder joint, are barricaded as Wheatstone bridge, and this method using four single-chip integrations together effectively subtracts
The small patch space of sensor, can produce smaller sensor, keep the application range of sensor wider, and group bridge is simple,
Improve production efficiency；Without precise positioning, consistency that is low, while can guarantee transducer sensitivity is required operator；
The utility model full-bridge is processed/is made by vacuum annealing process at same plate (metal foil), and temperature drift is effectively ensured certainly
Mend, reduce because small size sensor heat dissipation performance it is poor, cause sensor temperature excessively high, and generate temperature drift, when float excessive ask
Topic.
Detailed description of the invention
Fig. 1 is that a kind of structure of micro-foil resistance strain gauge for circular plate type sensor provided by the utility model is shown
It is intended to.
In figure: 1- substrate；The outer wire grid of 2- first；Wire grid in 3- first；Wire grid in 4- second；The outer wire grid of 5- second；6-
One solder joint；The second solder joint of 7-；8- third solder joint；The 4th solder joint of 9-；The 5th solder joint of 10-；The 6th solder joint of 11-；12- coating.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
As shown in Figure 1, a kind of micro-foil resistance strain gauge for circular plate type sensor, including substrate 1, sensitive grid and
Sealant, sensitive grid include the first outer wire grid, wire grid in first, the second outer wire grid, wire grid in second, and substrate 1 passes through bonding agent
Rounded bonding be provided with wire grid 3 in the first outer wire grid 2, first, wire grid 4 in the second outer wire grid 5, second (the first outer wire grid 2,
Wire grid 3 in first, wire grid 4 is sensitive grid in the second outer wire grid 5, second), the first solder joint 6, the second solder joint 7, third solder joint 8,
4th solder joint 9, the 5th solder joint 10 and the 6th solder joint 11, the first solder joint 6, third solder joint 8 and the 5th solder joint 10 are from top to bottom successively
Centrally disposed left side, the second solder joint 7, the 4th solder joint 9 and the 6th solder joint 11 are successively set on central right from top to bottom, and first
Solder joint 6 and the arrangement of 11 central symmetry of the 6th solder joint, the second solder joint 7 and the arrangement of 10 central symmetry of the 5th solder joint, third solder joint 8 and the
The arrangement of four solder joints, 9 central symmetry, the first solder joint 6 are connected to the first outer wire grid 2, and the first outer wire grid 2 is connected to the second solder joint 7, the
Two solder joints 7 are connected to wire grid 3 in first, and wire grid 3 is connected to third solder joint 8 in first, and wire grid 4 connects in the 4th solder joint 9 and second
Logical, wire grid 4 is connected to the 5th solder joint 10 in second, and the 5th solder joint 10 is connected to the second outer wire grid 5, the second outer wire grid 5 and six welderings
11 connection of point, is barricaded as Wheatstone bridge.
This method using four single-chip integrations together, effectively reduces the patch space of sensor, can make
Smaller sensor out keeps the application range of sensor wider, and group bridge is simple, improves production efficiency；It is right without precise positioning
Operator requires consistency that is low, while can guarantee transducer sensitivity；The utility model full-bridge is in same plate (metal foil
Material) it processes/is made by vacuum annealing process, it is self-complementary to be effectively ensured temperature drift, reduces because of small size sensor thermal diffusivity
Can it is poor, cause sensor temperature excessively high, and lead to the problem of temperature drift, when float it is excessive.
Wire grid 3 in first outer wire grid 2, first, wire grid 4 is fan shape in the second outer wire grid 5 and second.
First outer wire grid 2 and the second outer 5 central symmetry of wire grid arrangement and area equation, wire grid 3 and the second internal thread in first
4 central symmetry of grid is arranged between the first outer wire grid 2 and the second outer wire grid 5 and area equation.
Wire grid 3 in first outer wire grid 2, first, wire grid 4 in the second outer wire grid 5, second, the first solder joint 6, the second solder joint 7,
Third solder joint 8, the 4th solder joint 9, the 5th solder joint 10 and the 6th solder joint 11 are metal foil material, facilitate integrated production.
Coating 12 is bonded on the outside of substrate 1, coating 12 is placed on 1 top of substrate, by the first outer wire grid 2, the first internal thread
Wire grid 4 covers in grid 3, the second outer wire grid 5 and second, can protect wire grid 3, the second outer wire grid 5 in the first outer wire grid 2, first
With second in wire grid 4.
The substrate and the sealant are using polyimide resin or phenol-formaldehyde resin modified or polyether-ether-ketone or asphalt mixtures modified by epoxy resin
Rouge or glass fiber reinforced resin are coated, rotate, are sprayed, and have superior isolation performance, certain heatproof, acid and alkali-resistance, resistance to electrolysis
Liquid can make strain gauge for various environment.
Bonding agent is epoxy glue or phenol glue.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (7)
1. a kind of micro-foil resistance strain gauge for circular plate type sensor, which is characterized in that including substrate, sensitive grid and close
Sealing, sensitive grid include the first outer wire grid, wire grid in first, the second outer wire grid, wire grid in second, and the substrate passes through bonding agent
Rounded bonding is provided with that the first outer wire grid, wire grid in first, the second outer wire grid, wire grid, the first solder joint, second are welded in second
Point, third solder joint, the 4th solder joint, the 5th solder joint and the 6th solder joint, first solder joint, third solder joint and the 5th solder joint on to
Under be successively set on center left, second solder joint, the 4th solder joint and the 6th solder joint are successively set on the center right side from top to bottom
Side, first solder joint and the arrangement of the 6th solder joint central symmetry, second solder joint and the arrangement of the 5th solder joint central symmetry, it is described
Third solder joint and the arrangement of the 4th solder joint central symmetry, first solder joint is connected to the first outer wire grid, the first outer wire grid and
The connection of second solder joint, second solder joint is connected to wire grid in first, and wire grid is connected to third solder joint in described first, and described the
Four solder joints are connected to wire grid in second, and wire grid is connected to the 5th solder joint in described second, the 5th solder joint and the second outer wire grid
Connection, the second outer wire grid are connected to six solder joints, are barricaded as Wheatstone bridge.
2. a kind of micro-foil resistance strain gauge for circular plate type sensor as described in claim 1, which is characterized in that institute
State that the first outer wire grid, wire grid in first, wire grid is fan shape in the second outer wire grid and second.
3. a kind of micro-foil resistance strain gauge for circular plate type sensor as described in claim 1, which is characterized in that institute
The first outer wire grid and the second outer wire grid central symmetry arrangement and area equation are stated, wire grid center in wire grid and second in described first
Symmetry arrangement is between the first outer wire grid and the second outer wire grid and area equation.
4. a kind of micro-foil resistance strain gauge for circular plate type sensor as described in claim 1, which is characterized in that institute
State the first outer wire grid, wire grid in first, the second outer wire grid, wire grid, the first solder joint, the second solder joint, third solder joint, the 4th in second
Solder joint, the 5th solder joint and the 6th solder joint are metal foil material.
5. a kind of micro-foil resistance strain gauge for circular plate type sensor as described in claim 1, which is characterized in that institute
It states Basolateral and is bonded with coating, the coating is placed on base upper portion, will be outside wire grid in the first outer wire grid, first, second
Wire grid covers in wire grid and second.
6. a kind of micro-foil resistance strain gauge for circular plate type sensor as described in claim 1, which is characterized in that institute
Substrate and the sealant are stated using polyimide resin or phenol-formaldehyde resin modified or polyether-ether-ketone or epoxy resin or glass fiber
Reinforced resin is coated, rotates, is sprayed.
7. a kind of micro-foil resistance strain gauge for circular plate type sensor as described in claim 1, which is characterized in that institute
Stating bonding agent is epoxy glue or phenol glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822151268.1U CN209013920U (en) | 2018-12-20 | 2018-12-20 | A kind of micro-foil resistance strain gauge for circular plate type sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822151268.1U CN209013920U (en) | 2018-12-20 | 2018-12-20 | A kind of micro-foil resistance strain gauge for circular plate type sensor |
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| CN209013920U true CN209013920U (en) | 2019-06-21 |
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| CN201822151268.1U Active CN209013920U (en) | 2018-12-20 | 2018-12-20 | A kind of micro-foil resistance strain gauge for circular plate type sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110895130A (en) * | 2019-12-28 | 2020-03-20 | 中航电测仪器股份有限公司 | Diaphragm type strain gauge and optimization method thereof |
| CN112833770A (en) * | 2021-02-26 | 2021-05-25 | 中航电测仪器股份有限公司 | Compound full-bridge strain gauge |
| CN114383763A (en) * | 2021-11-23 | 2022-04-22 | 林赛思尔(厦门)传感技术有限公司 | Full-bridge type resistance strain pressure sensor and preparation method thereof |
-
2018
- 2018-12-20 CN CN201822151268.1U patent/CN209013920U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110895130A (en) * | 2019-12-28 | 2020-03-20 | 中航电测仪器股份有限公司 | Diaphragm type strain gauge and optimization method thereof |
| CN110895130B (en) * | 2019-12-28 | 2021-07-20 | 中航电测仪器股份有限公司 | Diaphragm type strain gauge and optimization method thereof |
| CN112833770A (en) * | 2021-02-26 | 2021-05-25 | 中航电测仪器股份有限公司 | Compound full-bridge strain gauge |
| CN112833770B (en) * | 2021-02-26 | 2022-12-13 | 中航电测仪器股份有限公司 | Compound full-bridge strain gauge |
| CN114383763A (en) * | 2021-11-23 | 2022-04-22 | 林赛思尔(厦门)传感技术有限公司 | Full-bridge type resistance strain pressure sensor and preparation method thereof |
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