CN209927762U - Leadless single ceramic wafer type gas sensor - Google Patents
Leadless single ceramic wafer type gas sensor Download PDFInfo
- Publication number
- CN209927762U CN209927762U CN201920562404.8U CN201920562404U CN209927762U CN 209927762 U CN209927762 U CN 209927762U CN 201920562404 U CN201920562404 U CN 201920562404U CN 209927762 U CN209927762 U CN 209927762U
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- gas
- measuring electrode
- electrode
- heating
- heating electrode
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- 239000000919 ceramic Substances 0.000 title claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 63
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 17
- 238000002955 isolation Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 19
- 238000007650 screen-printing Methods 0.000 claims description 15
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000035939 shock Effects 0.000 abstract description 3
- 238000005259 measurement Methods 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model provides a leadless single ceramic sheet type gas sensor, which comprises a tube seat, a gas-sensitive support plate and a tube cap covered on the tube seat, wherein the gas-sensitive support plate is clamped on the tube pin of the tube seat; the gas-sensitive support plate comprises a substrate, a measuring electrode and a heating electrode which are arranged on the substrate, a gas-sensitive material layer arranged on the measuring electrode, and an insulating isolation layer arranged between the measuring electrode and the heating electrode; the gas-sensitive support plate is also provided with a heating electrode strip and a measuring electrode strip, the heating electrode is provided with a heating electrode connection point, and the heating electrode connection point is connected with a pin of the tube seat through the heating electrode strip; the measuring electrode is provided with a measuring electrode connecting point, and the measuring electrode connecting point is connected with the pin of the tube seat through the measuring electrode strip. The utility model has the advantages of low power consumption, strong shock resistance, high production efficiency and low production cost.
Description
Technical Field
The utility model relates to a piece formula gas sensor technical field, specific theory has related to a single potsherd formula gas sensor of leadless.
Background
At present, a planar ceramic chip type gas sensor is used as a semiconductor type gas sensor, becomes the most main product in the market of the semiconductor type gas sensor, and compared with the traditional ceramic tube type gas sensor and an MEMS gas sensor which is not developed yet, the planar ceramic chip type gas sensor has the advantages of smaller size, low power consumption and more excellent performance, thereby being widely applied to the field of the existing gas sensors.
However, the planar ceramic sheet type gas sensor has many disadvantages to be optimized and upgraded:
1. in the existing ceramic sheet type gas sensor (for example, CN 200410063690) in the market, the gas sensing chip needs to be soldered and bonded to the tube seat by other leads such as gold (Au) to transmit the gas sensing chip signal. The gas-sensitive chip suspension type gas-sensitive sensor needs to be bound and welded through manual operation, so that the sensor has inconsistent performance, greater discreteness, complex process and high production cost, and large-scale industrialization is influenced. Through the lead wire binding mode, the strength of the lead wire welding part is low, the conditions such as wire breakage and the like are easily caused, and the shock resistance of the sensor is poor;
2. in addition, the heating electrode and the measuring electrode of the gas-sensitive chip of the existing ceramic chip type gas sensor are not on the same surface, so that the production operation difficulty is high, the process is repeated, and the automatic production is difficult.
In order to solve the above problems, people are always seeking an ideal technical solution.
Disclosure of Invention
The utility model aims at the not enough of prior art to a no lead wire single potsherd formula gas sensor is provided.
In order to realize the purpose, the utility model discloses the technical scheme who adopts is: a leadless single ceramic chip type gas sensor comprises a tube seat, a gas-sensitive support plate and a tube cap which is covered on the tube seat, wherein the gas-sensitive support plate is clamped on a pin of the tube seat;
the gas-sensitive support plate comprises a substrate, a measuring electrode and a heating electrode which are arranged on the substrate, a gas-sensitive material layer arranged on the measuring electrode, and an insulating isolation layer arranged between the measuring electrode and the heating electrode;
the gas-sensitive support plate is also provided with a heating electrode strip and a measuring electrode strip, the heating electrode is provided with a heating electrode connection point, and the heating electrode connection point is connected with a pin of the tube seat through the heating electrode strip; the measuring electrode is provided with a measuring electrode connecting point, and the measuring electrode connecting point is connected with the pin of the tube seat through the measuring electrode strip.
Based on the above, the heating electrode, the insulating isolation layer, the measuring electrode and the gas sensitive material layer are sequentially printed on the upper side of the substrate through a thick film screen printing process;
and the upper side of the substrate is also printed with two heating electrode strips and two measuring electrode strips by a thick film screen printing process.
The utility model discloses relative prior art has substantive characteristics and progress, specific theory:
1) the utility model provides a leadless single ceramic chip type gas sensor, which encapsulates the gas-sensitive support plate inside the pipe cap; the gas-sensitive support plate comprises a substrate, a measuring electrode, an insulating isolation layer, a heating electrode and a gas-sensitive material layer; the gas-sensitive support plate is designed in an integrated structure, so that the function of detecting the concentration of the gas to be detected can be realized, and the gas-sensitive support plate has a support function, so that the stability of the gas sensor is greatly improved;
the gas-sensitive supporting plate is clamped on the tube seat, and compared with the existing gas-sensitive sensor bound by a lead wire, the gas-sensitive supporting plate is prepared in a leadless mode, so that the preparation process can be simplified to a great extent, the labor and material cost of the binding wire is saved, full-automatic printing, packaging and the like of a gas-sensitive material are facilitated, the consistency of the sensor is improved, and the productivity is improved;
2) the gas-sensitive supporting plate is provided with heat dissipation holes, so that the gas-sensitive supporting plate is in a hollow structure; the heat dissipation holes are arranged around the substrate; the utility model not only accelerates the heat dissipation of the gas-sensitive supporting plate, but also effectively reduces the power consumption of the gas-sensitive supporting plate and the weight of the sensor through the hollow structure;
to sum up, the utility model has the advantages of low power dissipation, strong, the high and low in production cost of shock resistance.
Drawings
Fig. 1 is a schematic diagram of the internal structure of the leadless sheet-type gas sensor of the present invention.
Fig. 2 is a schematic top view of the gas-sensitive support plate of the present invention.
Fig. 3 is a schematic structural diagram of the gas-sensitive support plate of the present invention.
In the figure: 1. a tube holder; 2. a gas-sensitive support plate; 11. a pin; 21. a through hole; 22. a measuring electrode; 23. heating the electrode strip; 24. heat dissipation holes; 25. the electrode strips are measured.
Detailed Description
The technical solution of the present invention will be described in further detail through the following embodiments.
Example 1
As shown in attached figures 1-3, a leadless single ceramic chip type gas sensor comprises a tube seat 1, a gas-sensitive support plate 2 and a tube cap covering the tube seat 1, wherein the gas-sensitive support plate 2 is clamped on the tube seat 1; the gas-sensitive support plate 2 comprises a substrate, a measuring electrode 22 and a heating electrode which are arranged on the substrate, a gas-sensitive material layer arranged on the measuring electrode 22, and an insulating isolation layer arranged between the measuring electrode 22 and the heating electrode; the gas-sensitive support plate 2 is also provided with a heating electrode strip 23 and a measuring electrode strip 25, the heating electrode is provided with a heating electrode connection point, and the heating electrode connection point is connected with the pin 11 of the tube seat 1 through the heating electrode strip 23; the measuring electrode 22 is provided with a measuring electrode connection point, and the measuring electrode connection point is connected with the pin 11 of the tube socket 1 through the measuring electrode strip 25.
In this embodiment, a specific implementation of the gas-sensitive support plate is given, the heating electrode, the insulating isolation layer, the measuring electrode 22 and the gas-sensitive material layer are sequentially printed on the upper side of the substrate by a thick-film screen printing process; the upper side of the substrate is also printed with two heating electrode strips 23 and two measuring electrode strips 25 by a thick film screen printing process. The tube seat 1 is connected with the tube cap, and the gas-sensitive support plate 2 is encapsulated inside the tube cap; whole gas-sensitive backup pad is integrated structural design, both can possess the support function simultaneously with the detection of the gas concentration that awaits measuring, has improved gas sensor's stability greatly.
In this embodiment, there are two measurement electrodes and two heating electrodes, the two measurement electrodes 22 are in a strip-shaped right-angle structure, the two measurement electrodes 22 in the strip-shaped right-angle structure are symmetrically disposed on the substrate, a measurement electrode connection point of the measurement electrode 22 is connected to one end of the measurement electrode strip 25, and the other end of the measurement electrode strip 25 is connected to the pin 11 of the stem 1, so as to transmit the detected gas-sensitive signal to the pin 11. The number of the heating electrodes is two, the two heating electrodes are printed on the substrate, a measuring electrode connecting point of the heating electrodes is connected with one end of the heating electrode strip 23, and the other end of the heating electrode strip 23 is connected with the pin 11 of the tube seat 1.
When the heating device works, a heating control signal is transmitted to the heating electrode through the pin 11, the heating electrode strip 23 and the heating electrode connecting point in sequence; the gas to be measured enters from the gas inlet hole on the pipe cap and contacts with the gas-sensitive material layer, the gas-sensitive material layer interacts with the gas to be measured, the type of the gas and the information related to the concentration of the gas are converted into electric signals, and the electric signals are transmitted to the pin 11 through the measuring electrode connecting point and the measuring electrode strip 25 in sequence, so that the transmission process of the signals is realized.
Further, the two heating electrode strips 23 and the two measuring electrode strips 25 are connected with the pins 11 of the tube seat 1 through conductive paste, the heating electrode strips 23 are connected with the heating electrodes through conductive paste, and the measuring electrode strips 25 are connected with the measuring electrodes 22 through conductive paste. Four through holes 21 matched with the pins 11 are formed in the periphery of the gas-sensitive supporting plate 2, the four pins 11 of the tube seat 1 are clamped in the through holes 21, and the joints of the pins 11 and the through holes 21 are connected through conductive paste to ensure conduction and fixation. In the embodiment, the gas-sensitive support plate 2 is directly fixed to the pins 11, so that the mechanical strength of the sensor is improved; and compared with a lead binding method, the lead binding method can resist severe working environments such as salt spray corrosion and the like, and the service life is prolonged.
Furthermore, the pipe cap is provided with an air hole to ensure that the gas to be measured enters and exits through the air hole.
Further, the substrate is not limited to a ceramic material, but may be other silicon wafers, composite material plates, and the like. The gas-sensitive support plate is not limited to a schematic shape, but also encompasses a circular or other shape.
Example 2
This example differs from example 1 in that: the gas-sensitive support plate 2 is provided with heat dissipation holes 24, so that the gas-sensitive support plate 2 is of a hollow structure. The heat dissipation holes 24 are triangular holes, rectangular holes, circular holes or other shapes, and the triangular holes are arranged around the substrate.
This embodiment has not only accelerated through fretwork column structure the heat dissipation of gas sensitive backup pad 2 has increased heat radiating area, has effectively reduced the consumption and the sensor weight of gas sensitive backup pad 2 moreover.
Example 3
This example differs from example 1 in that: the measuring electrode 22 and the two measuring electrode strips 25 are printed on one side of the substrate facing the tube seat 1 through a thick film screen printing process, the heating electrode and the two heating electrode strips 23 are printed on the other side of the substrate through a thick film screen printing process, and the gas sensitive material layer is printed on the measuring electrode 22 through a thick film screen printing process.
In this embodiment, the gas-sensitive backup pad is integrated structural design, both can realize the gas concentration that awaits measuring and detect the function, possesses the support function simultaneously, has improved gas sensor's stability greatly.
Especially, measuring electrode 22 with the gas sensitive material layer towards the base plate sets up, it is right to have avoided external environment the direct erosion of gas sensitive material layer can resist abominable operational environment such as salt spray corrosion, has prolonged the utility model discloses a life.
Example 4
This example differs from example 1 in that: the heating electrode and the two heating electrode strips 23 are printed on one side of the substrate facing the tube seat 1 through a thick film screen printing process, and the measuring electrode 22 and the two measuring electrode strips 25 are printed on the other side of the substrate through a thick film screen printing process.
In this embodiment, gas-sensitive backup pad 2 is integrated structural design, both can realize the gas concentration that awaits measuring and detect the function, possesses the support function simultaneously, has improved gas sensor's stability greatly.
Especially, the heating electrode face to the base plate sets up, measuring electrode 22 with the gas sensitive material layer face to the opposite side setting of base plate has shortened await measuring gas with gas sensitive material layer interact's time, and the during operation await measuring gas need not to be full of whole gas sensor, has improved the utility model discloses a sensitivity.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same; although the present invention has been described in detail with reference to preferred embodiments, it should be understood by those skilled in the art that: the invention can be modified or equivalent substituted for some technical features; without departing from the spirit of the present invention, it should be understood that the scope of the claims is intended to cover all such modifications and variations.
Claims (9)
1. The utility model provides a single ceramic piece formula gas sensor of leadless which characterized in that: the gas-sensitive tube comprises a tube seat, a gas-sensitive support plate and a tube cap, wherein the tube cap is covered on the tube seat;
the gas-sensitive support plate comprises a substrate, a measuring electrode and a heating electrode which are arranged on the substrate, a gas-sensitive material layer arranged on the measuring electrode, and an insulating isolation layer arranged between the measuring electrode and the heating electrode;
the gas-sensitive support plate is also provided with a heating electrode strip and a measuring electrode strip, the heating electrode is provided with a heating electrode connection point, and the heating electrode connection point is connected with a pin of the tube seat through the heating electrode strip; the measuring electrode is provided with a measuring electrode connecting point, and the measuring electrode connecting point is connected with the pin of the tube seat through the measuring electrode strip.
2. The leadless single ceramic wafer gas sensor of claim 1, wherein: the heating electrode, the insulating isolation layer, the measuring electrode and the gas-sensitive material layer are sequentially printed on the upper side of the substrate through a thick film screen printing process;
and the upper side of the substrate is also printed with two heating electrode strips and two measuring electrode strips by a thick film screen printing process.
3. The leadless single ceramic wafer gas sensor of claim 1, wherein: one side of the substrate, facing the tube seat, is printed with the measuring electrode and the two measuring electrode strips through a thick film screen printing process, and the other side of the substrate is printed with the heating electrode and the two heating electrode strips through a thick film screen printing process.
4. The leadless single ceramic wafer gas sensor of claim 1, wherein: one side of the substrate, facing the tube seat, is printed with the heating electrode and the two heating electrode strips through a thick film screen printing process, and the other side of the substrate is printed with the measuring electrode and the two measuring electrode strips through a thick film screen printing process.
5. The leadless single ceramic wafer gas sensor of any of claims 2-4, wherein: the gas-sensitive supporting plate is provided with heat dissipation holes.
6. The leadless single ceramic wafer gas sensor of claim 5, wherein: the louvre is triangle-shaped hole, rectangular hole or circular port, the louvre sets up around the base plate.
7. The leadless single ceramic wafer gas sensor of claim 6, wherein: and through holes matched with the pins of the tube seats are formed around the gas-sensitive supporting plate.
8. The leadless single ceramic wafer gas sensor of claim 1, wherein: the heating electrode strips and the measuring electrode strips are connected with the pins of the tube seat through conductive paste.
9. The leadless single ceramic wafer gas sensor of claim 1, wherein: the heating electrode strips are connected with the heating electrodes through conductive paste; the measuring electrode strip is connected with the measuring electrode through the conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920562404.8U CN209927762U (en) | 2019-04-24 | 2019-04-24 | Leadless single ceramic wafer type gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920562404.8U CN209927762U (en) | 2019-04-24 | 2019-04-24 | Leadless single ceramic wafer type gas sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209927762U true CN209927762U (en) | 2020-01-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920562404.8U Withdrawn - After Issue CN209927762U (en) | 2019-04-24 | 2019-04-24 | Leadless single ceramic wafer type gas sensor |
Country Status (1)
| Country | Link |
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| CN (1) | CN209927762U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109946350A (en) * | 2019-04-24 | 2019-06-28 | 郑州炜盛电子科技有限公司 | A kind of no lead single ceramic sheet-type gas sensor |
-
2019
- 2019-04-24 CN CN201920562404.8U patent/CN209927762U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109946350A (en) * | 2019-04-24 | 2019-06-28 | 郑州炜盛电子科技有限公司 | A kind of no lead single ceramic sheet-type gas sensor |
| CN109946350B (en) * | 2019-04-24 | 2023-11-03 | 郑州炜盛电子科技有限公司 | Leadless single ceramic chip gas sensor |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20231103 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20200110 Effective date of abandoning: 20231103 |