CN203534756U - Pressure transducer structure - Google Patents
Pressure transducer structure Download PDFInfo
- Publication number
- CN203534756U CN203534756U CN201320725838.8U CN201320725838U CN203534756U CN 203534756 U CN203534756 U CN 203534756U CN 201320725838 U CN201320725838 U CN 201320725838U CN 203534756 U CN203534756 U CN 203534756U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- core body
- pressure
- pressure core
- ceramic base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000012530 fluid Substances 0.000 description 4
- 238000011031 large-scale manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
Images
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- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Abstract
The utility model discloses a pressure transducer structure, comprising a circuit board. The circuit board is provided with a pressure core body. A ceramic base is provided, and is provided with a recessed cavity. The circuit board is embedded in the recessed cavity, the circuit board is provided with an installing hole, the pressure core body is fixed in the installing hole, and the upper surface of the circuit board is lower than the upper end surface of the ceramic base. Since the pressure transducer structure is used, in a production process, an electronic component can be installed on the circuit board via a mechanical production mode, and then the whole circuit board and the pressure core body are sequentially embedded in the recessed cavity, thereby facilitating scale production, and reducing production cost.
Description
Technical field
The utility model relates to a kind of sensor construction, particularly a kind of pressure sensor structure.
Background technology
The applicant in first to file application number be 201320404851.3, name is called the Chinese utility model of pressure transducer, its technical scheme adopting is: pressure transducer, comprise circuit board, on circuit board, by conductor wire, bound pressure core body, pressure core body is externally connected to electric conductor, circuit board is to take the ceramic circuit board that pottery is substrate, pressure core body (2) arranged outside has back-up ring, in this back-up ring, fill out the flexible glue of embedding, on ceramic circuit board, have in connection, the through hole of downside, this lead to the hole site is corresponding with pressure core body, its guide ring opening is communicated with atmosphere or other corresponding objects of reference, through hole is for being communicated with measured matter.This pressure transducer has adopted take the ceramic circuit board that pottery is substrate, because the thermal expansivity of ceramic thermal expansivity and pressure core body is approaching, avoided the two thermal expansivity different, circuit board deformation meeting has influence on the deformation of pressure core body, thereby guarantees all have reliable high precision at the interval sensor of different temperatures.Yet above-mentioned pressure sensor structure can be treated improved place in addition, when assembling, the electronic component on this sensor need to be installed on ceramic circuit board one by one, be difficult to form large-scale production, production cost is higher.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of pressure sensor structure, is convenient to large-scale production, reduces production costs.
In order to solve the problems of the technologies described above, a kind of pressure sensor structure of the present utility model, comprise circuit board, pressure core body is installed on circuit board, has a ceramic base, on this ceramic base, have cavity, described circuit board is flush-mounted in described cavity, on circuit board, have mounting hole, described pressure core body is fixed in this mounting hole, and circuit board upper surface is lower than ceramic base upper surface.
As the improvement of technique scheme, the flexible glue of embedding on described pressure core body.
As the improvement of technique scheme, described pressure core body is MEMS pressure core body.
The beneficial effects of the utility model are: owing to adopting this pressure sensor structure; electronic component can be arranged on circuit board the mode of production by mechanization in process of production; circuit board is whole and pressure core body priority setting-in is to cavity again; be convenient to large-scale production, reduce production costs.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is ceramic bottom board structural representation.
Embodiment
With reference to Fig. 1, Fig. 2, a kind of pressure sensor structure of the present utility model, comprise circuit board 1, pressure core body 4 is installed on circuit board 1, has a ceramic base 2, on this ceramic base 2, have cavity 3, described circuit board 1 is flush-mounted in described cavity 3, on circuit board 1, have mounting hole 5, described pressure core body 4 is fixed in this mounting hole 5, and circuit board upper surface is lower than ceramic base upper surface.Owing to adopting this pressure sensor structure, electronic component can be arranged on circuit board the mode of production by mechanization in process of production, then by circuit board, whole and pressure core body priority setting-in, to cavity, is convenient to large-scale production, reduces production costs.
Wherein, described pressure core body 4 is MEMS pressure core body, the flexible glue of embedding on pressure core body.Foregoing circuit plate upper surface, a little less than ceramic base upper surface, is beneficial to elastic gum and fills out filling.During forward pressurized, when elastic gum is subject to detected fluid pressure, elastic gum is passed to pressure core body the pressure of fluid, and pressure core body is just exported the electric signal that becomes strict proportionate relationship with measuring point pressure, thereby realizes measuring point fluid pressure force measurement; During reverse pressurized, pressure is directly delivered to pressure core body from aperture, and pressure core body is just exported the electric signal that becomes strict proportionate relationship with measuring point pressure, thereby realizes measuring point fluid pressure force measurement.
The foregoing is only preferential embodiment of the present utility model, as long as within the technical scheme that realizes the utility model object with basic identical means all belongs to protection domain of the present utility model.
Claims (3)
1. a pressure sensor structure, comprise circuit board (1), pressure core body (4) is installed on circuit board (1), it is characterized in that: have a ceramic base (2), on this ceramic base (2), have cavity (3), described circuit board (1) is flush-mounted in described cavity (3), has mounting hole (5) on circuit board (1), described pressure core body (4) is fixed in this mounting hole (5), and circuit board upper surface is lower than ceramic base upper surface.
2. pressure sensor structure according to claim 1, is characterized in that: the upper flexible glue of embedding of described pressure core body (4).
3. pressure sensor structure according to claim 2, is characterized in that: described pressure core body (4) is MEMS pressure core body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320725838.8U CN203534756U (en) | 2013-11-15 | 2013-11-15 | Pressure transducer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320725838.8U CN203534756U (en) | 2013-11-15 | 2013-11-15 | Pressure transducer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203534756U true CN203534756U (en) | 2014-04-09 |
Family
ID=50420951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320725838.8U Expired - Lifetime CN203534756U (en) | 2013-11-15 | 2013-11-15 | Pressure transducer structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203534756U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106802199A (en) * | 2016-12-27 | 2017-06-06 | 吴中区穹窿山德毅新材料技术研究所 | Novel sensor |
| CN108444618A (en) * | 2018-04-11 | 2018-08-24 | 中北大学 | A kind of novel high-frequency pressure sensor and its packaging method |
| CN109655194A (en) * | 2018-12-26 | 2019-04-19 | 联合汽车电子有限公司 | Pressure sensor |
-
2013
- 2013-11-15 CN CN201320725838.8U patent/CN203534756U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106802199A (en) * | 2016-12-27 | 2017-06-06 | 吴中区穹窿山德毅新材料技术研究所 | Novel sensor |
| CN108444618A (en) * | 2018-04-11 | 2018-08-24 | 中北大学 | A kind of novel high-frequency pressure sensor and its packaging method |
| CN109655194A (en) * | 2018-12-26 | 2019-04-19 | 联合汽车电子有限公司 | Pressure sensor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160111 Address after: Xinhui District, Guangdong city of Jiangmen province 529100 City River Road No. 13 Building No. 2 301 Patentee after: JIANGMEN HONGKE ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 529100, 15 East Qing Hua Garden, 13 Dong Qing Nan Road, Xinhui District, Guangdong, Jiangmen, 703 Patentee before: Ke Yuanzhen |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20190401 Address after: 529100 Building 301 No. 1, No. 13, Jianghui Road, Huicheng, Xinhui District, Jiangmen City, Guangdong Province Patentee after: JIANGMEN RUIQU ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 529100 Building 301, No. 13 Jianghui Road, Huicheng, Xinhui District, Jiangmen City, Guangdong Province Patentee before: JIANGMEN HONGKE ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140409 |
|
| CX01 | Expiry of patent term |