CN109655194A - Pressure sensor - Google Patents

Pressure sensor Download PDF

Info

Publication number
CN109655194A
CN109655194A CN201811603320.0A CN201811603320A CN109655194A CN 109655194 A CN109655194 A CN 109655194A CN 201811603320 A CN201811603320 A CN 201811603320A CN 109655194 A CN109655194 A CN 109655194A
Authority
CN
China
Prior art keywords
sensing element
chamber
pressure
sensing
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811603320.0A
Other languages
Chinese (zh)
Inventor
李希彬
高奇帅
黄凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Automotive Electronic Systems Co Ltd
Original Assignee
United Automotive Electronic Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Automotive Electronic Systems Co Ltd filed Critical United Automotive Electronic Systems Co Ltd
Priority to CN201811603320.0A priority Critical patent/CN109655194A/en
Publication of CN109655194A publication Critical patent/CN109655194A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627Protection against aggressive medium in general
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means

Abstract

The present invention relates to a kind of pressure sensors, including shell and it is set to the intracorporal pressure measurement cell of shell, the pressure measurement cell includes ceramic circuit board and the processing circuit that is set on ceramic circuit board, first, second sensing element, the side of ceramic circuit board is arranged in the processing circuit, described first, the ceramic circuit board other side opposite with the side is arranged in second sensing element, the processing circuit is respectively with first, the communication connection of second sensing element, described first, second sensing element is respectively used to the pressure of sensing measuring medium and feeds back to processing circuit, the processing circuit is used to carry out digitized processing to two pressure informations received.Pressure sensor of the invention can measure simultaneously and export two-way pressure signal, and have preferable medium resistance, can use in erosion environment steadily in the long term, and the cost of material is low, the precision of pressure measurement is high, while the structure of shell used is simple, and processing cost is low.

Description

Pressure sensor
Technical field
The present invention relates to pressure measurement technology field more particularly to a kind of pressure sensors.
Background technique
To meet increasingly harsh emission regulation, the granular material discharged of vehicle is reduced, particle trap (GPF) gradually starts The promotion and application on petrol engine.To guarantee the normal work of GPF and meeting the requirement of onboard diagnostic system (OBD), need Detect the absolute pressure of the pressure difference of GPF upstream and downstream and the downstream of GPF.Then, GPF pressure sensor gradually makes on vehicle With, and work in the environment of engine exhaust emission.
However, the exhaust temperature of engine emission is high, also containing corrosive medias such as nitrogen oxides, sulfide, therefore, pressure The working environment of force snesor is severe.And in conventional pressure sensor, it is difficult to ensure that electric part is so severe Working environment in steadily work for a long time.In addition, in order to detect the absolute pressure of the pressure difference of GPF and upstream, it is also necessary to Two sleeve pressure sensors and the auxiliary equipments such as corresponding connecting line and harness are configured, system cost is significantly increased.
Therefore, it is necessary to develop a kind of novel pressure sensor, its electric part can be effectively ensured that severe It is long-term and steadily work in working environment, and system cost is low, and the precision of pressure measurement is also high, particularly can also be simultaneously Measure two-way pressure.
Summary of the invention
The purpose of the present invention is to provide a kind of pressure sensors, can measure two-way pressure simultaneously, and have preferable Medium resistance, can be used in erosion environment steadily in the long term, not only the cost of material is low, and the precision of pressure measurement is high, And the structure of shell used is simple, and processing cost is low.
To achieve the above object, the present invention provides a kind of pressure sensors comprising shell and is set to the shell Intracorporal pressure measurement cell;The pressure measurement cell includes ceramic circuit board and is set on the ceramic circuit board Processing circuit, the first sensing element and the second sensing element;Wherein:
The side of the ceramic circuit board is arranged in the processing circuit, and first sensing element and described second pass The ceramic circuit board other side opposite with the side is arranged in sensing unit, and the processing circuit is passed with described first respectively Sensing unit and second sensing element communication connection;First sensing element and second sensing element are respectively used to It senses the pressure of a measuring medium and feeds back to the processing circuit;The processing circuit is used for two pressure informations received Carry out digitized processing.
Preferably, the ceramic circuit board is multilayered structure, and is internally provided with route, and the processing circuit passes through described Route is communicated to connect with first sensing element and second sensing element respectively.
Preferably, the ceramic circuit board is high-temperature co-fired ceramics circuit board or low-temperature co-fired ceramics circuit board.
Preferably, first sensing element and second sensing element are MEMS sensing element.
Preferably, the thermal expansion coefficient of the ceramic circuit board is not more than twice of MEMS sensing element.
Preferably, the thermal expansion coefficient of the ceramic circuit board is less than 10ppm/C.
Preferably, first sensing element and second sensing element are absolute pressure sensor element, respectively For sensing an absolute pressure of a measuring medium.
Preferably, when first sensing element and second sensing element are absolute pressure sensor element: Separated first chamber and second chamber are provided in the shell;
Second sensing element is placed in the first chamber so that a surface sensing of second sensing element into Enter the absolute pressure of the measuring medium of the first chamber;
First sensing element is placed in the second chamber so that a surface sensing of first sensing element into Enter the absolute pressure of the measuring medium of the second chamber;
It is additionally provided with the 4th chamber in the shell, is provided separately with the first chamber and the second chamber, and institute It states processing circuit and is placed in the 4th chamber, and be respectively used to carry out at digitlization the two absolute pressure information received Reason.
Preferably, first sensing element is absolute pressure sensor element, and one for sensing a measuring medium is absolute Pressure;Second sensing element is relative pressure sensing element, for sensing a pressure difference of a measuring medium.
Preferably, when first sensing element and second sensing element be respectively absolute pressure sensor element with And when relative pressure sensing element: being provided with separated first chamber and second chamber in the shell;
Second sensing element is placed in the first chamber so that a surface sensing of second sensing element into Enter the pressure of the measuring medium of the first chamber;
First sensing element is placed in the second chamber so that a surface sensing of second sensing element into Enter the pressure of the measuring medium of the second chamber;
Third chamber and the 4th chamber are additionally provided in the shell, the 4th chamber is separated with remaining chamber;
The third chamber is connected to by the intracorporal intermediate channel of the shell with the second chamber, and makes described second The sensing element another surface sensing opposite with a surface described in its enters the pressure of the measuring medium of the third chamber;It is described Second sensing element is used to obtain the first chamber and the third according to the pressure of the measuring medium of two surface sensing Pressure difference between chamber;
The processing circuit is placed in the 4th chamber, and be respectively used to the absolute pressure information received and One pressure difference information carries out digitized processing.
Preferably, the pressure measurement cell further includes peripheral circuit, in which:
The ceramic circuit board includes first part and second part, and the processing circuit and the peripheral circuit are whole It is set to the second part and is located at the same side of the ceramic circuit board, and the first part is located at the third chamber And it is provided with a via hole, second sensing element is located at the one end of the via hole far from the third chamber, so that described The measuring medium of three chambers loads on another surface of second sensing element by the via hole.
Preferably, first sensing element and second sensing element are relative pressure sensing element, respectively For sensing a pressure difference of a measuring medium.
Preferably, when first sensing element and second sensing element are relative pressure sensing element: Separated first chamber and second chamber are provided in the shell;
Second sensing element and first sensing element are placed in the first chamber, so that described second passes One surface of sensing unit and first sensing element senses the pressure into the measuring medium of the first chamber;
Third chamber and the 4th chamber are additionally provided in the shell, the 4th chamber is divided equally with remaining all chamber It opens;Wherein:
The third chamber is connected to by the intracorporal intermediate channel of the shell with the second chamber, and makes described second Sensing element and the corresponding opposite another surface in a surface of first sensing element sense described in entrance The pressure of the measuring medium of third chamber;First sensing element and second sensing element be respectively used to according to its two The pressure of the measuring medium of a surface sensing obtains the pressure difference between the first chamber and the third chamber;
The processing circuit is placed in the 4th chamber, and is respectively used to count the two pressure difference information received Wordization processing.
Preferably, the pressure measurement cell further includes peripheral circuit, in which:
The ceramic circuit board includes first part and second part, and the processing circuit and the peripheral circuit are whole It is set to the second part and is located at the same side of the ceramic circuit board, and the first part is located at the third chamber And two via holes are provided with, second sensing element is located in one of the one end of the via hole far from the third chamber, institute It states the first sensing element and is located at the one end of another described via hole far from the third chamber, so that the measurement of the third chamber Medium loads on another surface of first sensing element and second sensing element by a respective via hole.
Preferably, first sensing element and second sensing element pass through respectively corrosion resistant binding line with it is described Ceramic circuit board connection.
Preferably, the surface of first sensing element and second sensing element is provided with gel, the gel For silica containing fluorine.
Preferably, first sensing element and second sensing element are respectively provided in a glue peripheral frame, the glue Peripheral frame is for preventing the gel excessive.
Preferably, it is provided on the shell for the inserting terminal with external electrical contact;The ceramic circuit board passes through Electric resistance welding, binding line or contact pin soldering are connect with the inserting terminal.
Preferably, the Digital ASIC is also used to for two pressure informations after digitized processing being encoded to unilateral Nibble digital communication protocol, to pass through pressure information described in circuit output two all the way.
Compared with prior art, pressure sensor of the invention has preferable medium resistance, it is ensured that it is electrical Part can steadily use for a long time in severe working environment.Particularly, circuit used by the pressure measurement cell Plate is ceramic circuit board, and on ceramic circuit board be provided with two sensing elements, and make two sensing elements respectively with pottery The processing circuit communication connection of the other side, so as to measure two-way pressure simultaneously, and also achieves circuit on porcelain circuit board Plate and sensing element it is integrated.With the existing circuit board that is provided separately compared with sensing element, measuring unit is small in size, and the structure of shell is more Simply, and assembly is more convenient, and the cost of system is lower.
More particularly, the ceramic circuit board be high-temperature co-fired ceramics circuit board or low-temperature co-fired ceramics circuit board, The more excellent performance of corrosion resistance, thermal expansion coefficient, high temperature resistant, mechanical strength etc. can preferably guarantee pressure sensing Device steadily uses for a long time in severe working environment.In addition, the ceramic circuit board prepared by HTCC or LTCC, conveniently exists Multilayer wiring is realized in the inside of circuit board, in order to which the electric elements of ceramic circuit board two sides realize electric interconnection, consequently facilitating Two sensing elements are integrated on circuit boards.
More particularly, two sensing elements are respectively MEMS sensing element, with small in size, light weight and cost is low, power consumption Therefore low, high reliability can preferably complete the work of pressure measurement, improve the precision of pressure measurement, be also convenient for The volume for reducing pressure sensor apparatus, reduces the cost of pressure measurement.Also, in order to further increase the accurate of pressure measurement Property, the thermal expansion coefficient of the ceramic circuit board is not more than twice of MEMS sensing element, more preferably less than 10ppm/C, thus keeps away Exempting from heat reduces the accuracy of pressure measurement because the coefficient of expansion mismatches.
Detailed description of the invention
Attached drawing for a better understanding of the present invention, does not constitute an undue limitation on the present invention.Wherein:
Fig. 1 is the exploded view of pressure sensor provided by one embodiment of the present invention;
Fig. 2 is the front signal of pressure measurement cell provided by one embodiment of the present invention and plug flat piece connected to it Figure;
Fig. 3 is the reverse side schematic diagram of pressure measurement cell shown in Fig. 2 and plug flat piece connected to it;
Fig. 4 is the schematic diagram provided by one embodiment of the present invention that groove is formed in sensing element periphery setting peripheral frame;
Fig. 5 is top view of the pressure sensor provided by one embodiment of the present invention after removing case top lid;
Fig. 6 is the main view of pressure sensor provided by one embodiment of the present invention;
Fig. 7 is the axial sectional view of pressure sensor provided by one embodiment of the present invention, during wherein second chamber passes through Between channel and third chamber;
Fig. 8 is the axial sectional view of pressure sensor provided by one embodiment of the present invention, wherein the second sensing element point Not Gan Ce in first chamber and third chamber measuring medium pressure, measuring medium in the first sensing elements sense second chamber Pressure;
Fig. 9 is the partial enlarged view of pressure sensor shown in Fig. 8;
Figure 10 is the transverse sectional view of pressure sensor provided by one embodiment of the present invention;
Figure 11 is the schematic diagram of the housing bottom of shell provided by one embodiment of the present invention.
In figure:
Pressure sensor -10;
Shell -11;Housing bottom -111;Case top lid -112;Air inlet pipeline -113,114;First chamber -115;Second Chamber -116;Intermediate channel -117;Third chamber -118;4th chamber -119;
Pressure measurement cell -12;Ceramic circuit board -121;Processing circuit -122;First sensing element -123;Second sensing Element -124;Golden binding line -125;Peripheral circuit -126;Contact pin -127;Via hole -128;
Glue peripheral frame -13;
Inserting terminal -14;Outer cover -141;Plug flat piece -142;
Mounting flange -15.
Specific embodiment
Core of the invention thought is to provide a kind of pressure sensor comprising shell and is set in the shell Pressure measurement cell;The pressure measurement cell includes ceramic circuit board and the processing being set on ceramic circuit board electricity Road, the first sensing element and the second sensing element;Wherein: the side of the ceramic circuit board is arranged in the processing circuit, Another opposite with the side of the ceramic circuit board is arranged in first sensing element and second sensing element Side, the processing circuit are communicated to connect with first sensing element and second sensing element respectively;Described first passes Sensing unit and second sensing element are respectively used to the pressure of one measuring medium of sensing and feed back to the processing circuit;It is described Processing circuit is used to carry out digitized processing to two pressure informations received.Existing pressure sensor the operation is stable is solved with this Property is poor, pressure measurement accuracy is low, shell structure is complicated, system cost is high, cannot measure the problems such as two-way pressure simultaneously.
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from Various modifications or alterations are carried out under spirit of the invention.It should be noted that diagram provided in the present embodiment is only with signal Mode illustrates basic conception of the invention, then in schema only display with related component in the present invention rather than when according to actual implementation Component count, shape and size draw, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind Become, and its assembly layout kenel may also be increasingly complex.
The certain terms for indicating particular system components have been used throughout specification and appended book.Such as this field The skilled person will understand that, different company may indicate a component with different titles.Do not expect herein it is different in title but It is distinguished between the identical component of function.In specification and appended book, term " includes " and "comprising" are by opening The mode for putting formula uses, and therefore should be interpreted " including, but are not limited to ... ".Spatial relation term for example " ... under ", " ... below ", " below ", " ... under ", " ... on ", " above " etc., it can describe for convenience herein And used to describe the relationship of an elements or features and other elements or features shown in figure.It should be understood that in addition to Other than orientation shown in figure, spatial relation term intention further includes the different orientation of the device in using and operating.For example, such as Then device overturning in fruit attached drawing is described as " below other elements " or " under it " or " under it " element or spy Sign will be oriented in other elements or features "upper".Therefore, exemplary term " ... below " and " ... under " may include on It is orientated with lower two.Device can additionally be orientated (be rotated by 90 ° or other orientations) and spatial description language phase as used herein It is explained with answering.Term " first ", " second ", " third, " the 4th " are used for description purposes only, and should not be understood as instruction or dark Show relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second ", " are defined as a result, Three, feature the 4th " can explicitly or implicitly include one or more of the features.Such as the application and claims Shown in, unless context clearly prompts exceptional situation, " one ", "one", the words such as "an" and/or "the" not refer in particular to list Number, may also comprise plural number.Term, " transverse direction " refer to housing parallel in the direction of ceramic circuit board;" axial direction ", refers to shell Direction of the body perpendicular to ceramic circuit board.
In addition, each embodiment of following description is respectively provided with one or more technical characteristics, so this is not meant to It must implement all technical characteristics in any embodiment simultaneously using present inventor, or be only capable of being performed separately in different embodiments One or all technical characteristic.In other words, under the premise of being embodied as possible, those skilled in the art can be according to the present invention Disclosure, and regard design specification or implementation demand, it is special selectively to implement all or part of technology in any embodiment Sign, or selectively implement the combination of all or part of technical characteristic in multiple embodiments, increase the present invention whereby and implements When elasticity.
In addition, for brevity, assume that object measured by pressure sensor is particle trap in the following description, Those skilled in the art should can modify and be described below, make in detail it is suitably modified after by it is described description be used for other measurements Object on.
It is described below with reference to attached drawing.
<embodiment one>
Exploded view shown in FIG. 1 for pressure sensor 10 provided by one embodiment of the present invention, as shown in Figure 1, in vapour It, both can real-time monitoring using the pressure sensor 10 in the measurement environment of tail gas discharge (i.e. rodent measurement environment) Pressure difference between the upstream and downstream of particle trap, and the pressure in the downstream of particle trap can be monitored, in order to timely The regeneration opportunity of particle trap is grasped, triggering particle trap enters reproduced state.Simultaneously by under monitoring particle trap Pressure is swum, realizes OBD diagnosis.Here, particle trap is mounted on the gas exhaust piping of vehicle, can be gasoline engine particle capture Device (GPF) is also possible to diesel particulate trap (DPF).
Structurally, the pressure sensor 10 includes shell 11 and the pressure measurement list being set in shell 11 Member 12.The shell 11 includes housing bottom 111 and case top lid 112, and the case top lid 112 is optional with housing bottom 111 Side wall be connected, so as to form an accommodation space.The shell 11 is preferably by polyphenylene sulfide (PPS) or poly- terephthaldehyde The fiber glass reinforcements such as sour butanediol ester (PBT) are made, and the resistance of medium is good, and the case top lid 112 is preferably It is bonded by glue and housing bottom 111, realizes the sealing of 11 inner housing space of shell, and the preferred silica gel of glue.The receiving Space pressure measurement cell 12, the pressure measurement cell 12 are also preferably fixedly mounted on the accommodation space by glue In.
Core component of the pressure measurement cell 12 as pressure sensor 10, structure are as shown in Figures 2 and 3.Fig. 2 Shown in be pressure measurement cell provided by one embodiment of the present invention and plug flat piece connected to it front schematic view, Fig. 3 It is the reverse side schematic diagram of pressure measurement cell shown in Fig. 2 and plug flat piece connected to it.The pressure measurement cell 12 includes Ceramic circuit board 121, processing circuit 122, the first sensing element 123 and the second sensing element 124, and the processing circuit 122, the first sensing element 123 and the second sensing element 124 are arranged on ceramic circuit board 121.
The processing circuit 122 is mounted on the side (usually positive) of ceramic circuit board 121, first sensing element 123 and second sensing element 124 be mounted at the other side opposite on ceramic circuit board 121 (back side), it is therein first pass Sensing unit 123 is used to perceive the gas pressure P2 in the downstream of particle trap, and the second sensing element 124 is caught for perceiving particle Pressure difference △ P, the △ P=P1-P2, P1 caught between the upstream and downstream of device is the gas pressure of the upstream of particle trap.It is described First sensing element 123 and the second sensing element 124 are electrically connected with ceramic circuit board 121, and the processing circuit 122 is logical Cross the communication connection of ceramic circuit board 121 realization and two sensing elements.The processing circuit 122 is for receiving two sensing element senses The two-way pressure information that measures simultaneously carries out digitized processing to two-way pressure information, and later, pressure sensor 10 can be by two-way Pressure information is output to the outside by interface.Here, the present invention to the form of digitized processing performed by processing circuit 122 not Make special limitation, including but not limited to temperature-compensating, Nonlinear Processing etc..
And then the application of above-mentioned pressure sensor 10, two-way pressure can not only be measured simultaneously, and also improves pressure The medium resistance of sensor device can work in severe tail gas environment steadily in the long term, while also can be compared with The absolute pressure of pressure difference and downstream between the upstream and downstream of the particle trap of accurately measure vehicle.Here, due to pottery Porcelain circuit board 121 has many advantages, such as that high mechanical strength, thermal expansion coefficient are small, medium resistance is good, therefore, with existing circuit board It compares, the use of ceramic circuit board, the stability that can be effectively ensured that the service life of pressure sensor apparatus and use, Also can preferably pressure release measurement interference, guarantee the accuracy of pressure measurement.In addition, the upstream and downstream of particle trap it Between pressure difference directly pass through sensing elements sense, no longer need to be obtained according to the pressure between upstream and downstream by operation indirectly , in contrast, the error of pressure measurement is small, as a result more acurrate.Also, by the way that two biographies are arranged on ceramic circuit board 121 Sensing unit, and communicate to connect two sensing elements with the processing circuit of the other side on ceramic circuit board 121 respectively, in this way, The integrated of circuit board and sensing element is realized, with the existing circuit board that is provided separately compared with sensing element, measuring unit is small in size, shell The structure of body is simpler, and assembles and be more convenient, and the cost of system is lower.
It is preferred that obtaining the ceramic electrical by HTCC (high-temperature co-fired ceramics) or LTCC (low-temperature co-fired ceramics) preparation method Road plate 121, in this way, ceramic circuit board 121 corrosion resistance, thermal expansion coefficient, high temperature resistant and in terms of property Can be more excellent, its requirement can be better met.In addition, ceramic circuit board prepared by HTCC or LTCC technique is multilayer Structure, inside multilayer wiring (preferably four layers wiring) may be implemented, in order to which the electric elements of 121 two sides of ceramic circuit board are real Existing electric interconnection, consequently facilitating two sensing elements are integrated on circuit boards.Specifically, in traditional pressure measurement, sensing Element is usually provided separately with ceramic circuit board, this is because (such as thick film PCB, film splashes traditional ceramic circuit board Transmit-receive radio road plate) can only be in its front attachment electric elements, only the electric elements on front can be realized electric interconnection, still, The application for the ceramic circuit board that HTCC or LTCC are prepared, so that the electric elements of the front and back of ceramic circuit board are realized Electric interconnection, meets the integrated requirement of pressure measurement.
Inventors have found that if sensing element and ceramic circuit board are provided separately, it can a larger increase measuring unit Volume also can make the structure of shell more complicated, improve processing cost.For example, it needs to design special channel in shell The auxiliary equipments such as connecting line and harness are placed, the connection of sensing element and ceramic circuit board is realized by auxiliary equipment, but It is that sensing element directly realizes connection by the route being embedded in ceramic circuit board, can be to avoid these problems, therefore, this The use of the pressure sensor 10 of inventive embodiments can reduce the volume of measuring unit, simplify the structure of shell, reduce processing Cost.
It is preferred that first sensing element 123 and second sensing element 124 are MEMS sensing element (MEMS: microcomputer Electric system), have the characteristics that small in size, light weight and cost is low, low in energy consumption, high reliablity, therefore, can preferably complete The work of pressure measurement improves the precision of pressure measurement, is also convenient for reducing the volume of pressure sensor apparatus, reduces pressure measurement Cost.
Further, in order to guarantee sensing element steady operation in tail gas badness-media environment, in each sensing element Surface is provided with protection gel (not shown).The material for protecting gel is preferably fluorine silica gel, and one side fluorine silica gel is softer, Bu Huiying The normal transmitting of pressure is rung, on the other hand, fluorine silica gel also has preferable medium resistance, can protect the surface of sensing element Circuit and binding line etc. be not by the corrosion of measuring medium, moreover, the surface encapsulating protection gel in sensing element is prevented Shield, simple process are convenient to carry out.Further, protection gel is excessive in order to prevent, and two sensing elements are individually positioned in a glue In water peripheral frame 13, as shown in figure 4, it is provided with glue peripheral frame 13 at the encapsulating position where sensing element, the glue peripheral frame 13 packet Ceramic circuit board 121 is covered, and is arranged in the surrounding of sensing element.The glue peripheral frame 13 not only to prevent protection gel it is excessive, It is also used to fixed ceramic circuit board 121 and shell 11, and the opposite sides of ceramic circuit board 121 can also preferably be isolated, is prevented Measuring medium directly contacts the front of ceramic circuit board 121.However, it is without being limited thereto, it can also directly be formed in housing bottom 111 recessed Slot accommodates sensing element, prevents protection gel excessive.
As shown in figure 3, each sensing element is connect preferably by binding technique with ceramic circuit board 121, it is more preferably logical It crosses corrosion resistant binding line to connect with ceramic circuit board 121, particularly, be connected by golden binding line 125 with ceramic circuit board 121 It connects.The good corrosion resistance of golden binding line, it can be ensured that the reliability of connection.Further, the processing circuit 122 is dedicated collection At circuit (digit preference dedicated IC chip, ASIC), the front of ceramic circuit board 121 can be mounted on by Reflow Soldering, And the communication connection with two sensing elements is realized by the route inside ceramic circuit board 121.It is preferred that the digital private collection At circuit non-linear and temperature can also be carried out to two MEMS sensing element power supplies, and to the electric signal that MEMS sensing element is fed back to The processing such as drift compensation.Generally, MEMS sensing element includes strain diaphragm and the measuring circuit that is integrated on strain diaphragm, measurement Circuit is not limited to Wheatstone bridge, and the strain signal that strain diaphragm senses can be converted to electric signal by Wheatstone bridge here Export to Digital ASIC, Digital ASIC so that simultaneously to the electric signal of two Wheatstone bridges output into The processing such as the non-linear and temperature drift compensation of row, and the multi-channel electric signal after digitized processing is preferably encoded to unilateral nibble (SENT) digital communication protocol, in order to transmit a signal to outside by circuit all the way, being such as transferred to ECU, (electronic control is single Member).In addition to this, the front of the ceramic circuit board 121 is also pasted with peripheral circuit 126, such as resistance, capacitor, diode Passive components are also not necessarily limited to this citing certainly, and peripheral circuit is arranged mainly in combination with different circuit design requirements.
Several contact pins 127 (such as three) are additionally provided on the ceramic circuit board 121, for the inserted terminal on shell 11 Son 14 connects, and the inserting terminal 14 is used for and external electrical contact, realizes that pressure sensor 10 is in communication with each other with external.It can Choosing, several contact pins 127 can be connect by electric resistance welding with inserting terminal 14.Without being limited thereto, the ceramic circuit board 121 is also Inserting terminal 14 can be connected by soldering, binding line (such as aluminum steel), crimping (press fit) mode.
Further, the thermal expansion coefficient of the ceramic circuit board 121 is not more than the two of the thermal expansion coefficient of MEMS sensing element Times, it is furthermore preferred that the thermal expansion coefficient of the ceramic circuit board 121 is less than 10ppm/C, under this restriction, can avoid because of electricity The thermal expansion coefficient of road plate and MEMS sensing element is mismatched and is interfered to pressure measurement bring, ensures pressure measurements with this Accuracy.
In the embodiment of the present invention, the ceramic circuit board 121 is made after being blended by following material: Al2O3 (aluminium oxide), SiO2 (silica), CaO (calcium oxide), MgO (magnesia), Cr2O3 (chromium oxide), TiO2 (titanium dioxide).It is preferred that these The mass percent of material are as follows: 90.5% Al2O3,3.5% SiO2,0.6% CaO, 0.5% MgO, 3.9% The TiO2 of Cr2O3 and 1.0%.Under these components, the thermal expansion coefficient of obtained ceramic circuit board is passed no more than MEMS Twice for feeling the thermal expansion coefficient of member.
Subsequently in order to better understand the pressure sensor 10 of the present embodiment, the present embodiment is shown in Fig. 5 to Figure 11 Structure is described in further detail again.
As shown in figures 5 and 6, and Figure 11 is combined, air inlet pipeline 113,114 there are two settings on the housing bottom 111, One of air inlet pipeline 113 is used to introduce the gas (gas pressure is defined as P1) of the upstream of particle trap, another air inlet Pipeline 114 is used to introduce the gas (gas pressure is defined as P2) in the downstream of particle trap.
Then as shown in figure 8, the introduced gas of the air inlet pipeline 113 will enter the first chamber 115 in shell 11, The top of the first chamber 115 is fixedly installed the second sensing element 124, enables a surface of the second sensing element 124 The gas pressure P1 of the upstream of enough sensing particles catchers.In addition, the introduced gas of another air inlet pipeline 114 will enter shell Second chamber 116 in body 11, the top of the second chamber 116 are fixedly installed the first sensing element 123, so that first passes It is capable of the gas pressure P2 in the downstream of sensing particles catcher in one surface of sensing unit 123.
Later, as shown in Figure 10, and Fig. 2, Fig. 7, Fig. 8 and Fig. 9 are combined, the introduced particle of the air inlet pipeline 114 is caught Catch the downstream of device gas enter shell 11 after, two-way will be divided into: all the way will enter shell 11 in second chamber 116, it is another The third chamber 118 that road will be entered in shell 11 by an intermediate channel 117 in shell 11, and the third chamber 118 are connected to by a via hole 128 (through-hole) with first chamber 115, and the via hole 128 is set on ceramic circuit board 121, institute It states the second sensing element 124 and is set to exit (i.e. one end of gas outflow via hole) of the via hole 128 far from third chamber 118, Another surface of the second sensing element 124 is just enabled to perceive the gas pressure P2 in the downstream of particle trap in this way, finally The pressure for the gas that second sensing element 124 is arrived according to its two surface sensing obtains between first chamber 115 and third chamber 118 Pressure difference, which is the pressure difference △ P between the upstream and downstream of particle trap.
Here, since the gas in the downstream of particle trap enters third chamber 118, so that ceramic circuit board 121 is located at The part of third chamber 118 is directly exposed in vehicle exhaust, is easy to be corroded, it is thus preferable to, by ceramic circuit board 121 It is divided into first part and second part, electrified processing is not made on the surface of first part, and by processing circuit and peripheral circuit Or other interlock circuits are all set to the second part with electrical characteristic and are arranged in front, therefore, in first part The not set any electric elements in front, any exposed surface line is not arranged yet, so that the partial region is direct Positioned at third chamber 118 without ensuring that ceramic circuit board can normally and steadily work with this by corrosion impact.It is aobvious So, the via hole 128 is then arranged in the first part.
In addition, the electric elements on second part in order to protect ceramic circuit board 121, it is also provided in the shell 11 4th chamber 119, the 4th chamber 119 is separated with other chambers, and the electricity including peripheral circuit, processing circuit etc. Device element is arranged at the 4th chamber 119, prevents them from being corroded.As shown in figure 11, the first chamber 115, the second chamber Room 116 and intermediate channel 117 are both formed in housing bottom 111, and the third chamber 118 is both formed in the 4th chamber 119 Case top lid 112 (refering to Fig. 7 to Fig. 9), is provided with partition (not indicating) in the case top lid 112, third chamber is isolated Room 118 and the 4th chamber 119.
With continued reference to Fig. 1, aforementioned inserting terminal 14 is provided on the housing bottom 111, the inserting terminal 14 is specific Including outer cover 141 and several plug flat pieces 142 being set in the outer cover 141, several plug flat pieces 142 and ceramic circuit Plate 121 connects, and can specifically be connect by electric resistance welding with aforementioned several contact pins 127, Joining Technology is simple, high reliablity, and one Plug flat piece 142 is connect with a root cutting needle 127.The outer cover 141 is fixedly connected or is integrally formed with housing bottom 111.The shell It is additionally provided with a mounting flange 15 on body bottom 111, pressure sensor 10 can be fixed on vehicle.
Further, the assembling process of the pressure sensor 10 of the present embodiment preferably includes following steps:
Step 1: in the inside gum box midpoint glue of shell 11, glue selects silica gel resistant to high temperature, then will include sensing The pressure measurement cell 12 of element and processing circuit fits into shell 11;
Step 2: by electric resistance welding by multiple plug flat pieces 142 of more root cutting needles 127 of pressure measurement cell 12 and shell 11 Weld together;The peaceful inserted sheet 142 of contact pin 127 is both preferably copper-tin alloy material, surface flash gold;
Step 3: carrying out dispensing in the point glue groove of shell 11, and the glue that glue and pressure measurement cell 12 are bonded is excellent Phase selection is same, and installs case top lid 112;
Step 4: glue hot setting completes assembly.
Finally, carrying out air tightness test and functional test to pressure sensor 10, it is ensured that its reliability used.Cause This, the assembling technology procedure of pressure sensor 10 provided in this embodiment is simple, high production efficiency, lower production costs.
In the aforementioned embodiment, provided two sensing element is respectively that absolute pressure sensor element and relative pressure pass Sensing unit, such as the first sensing element 123 are absolute pressure sensor element, the gas pressure in the downstream for sensing particles catcher Power P2, the second sensing element 124 is relative pressure sensing element, for the pressure between the upstream and downstream of sensing particles catcher Difference, but such combination is schematic example, and invention is not limited thereto.
In some embodiments, one in two sensing elements can perceive the gas pressure of the upstream of particle trap P1, another can perceive the gas pressure P2 in the downstream of particle trap, that is, be absolute pressure sensor element, at this point, shell The design of body structure just relative simplicity, but total thinking is identical as previous embodiment, the difference is that, it can cancel above-mentioned Third chamber and intermediate channel, and ceramic circuit board can entirely do electrified processing, another case top lid can also cancel partition, shell The structure of body is relatively easy, and cost is lower, and another ceramic circuit board can be in entire positive flexible arrangement route and electric elements.Specifically For, the second sensing element 124 can be placed in first chamber 115, so that a surface sensing of the second sensing element 124 enters The gas pressure P1 of the upstream of the particle trap of first chamber 115;Meanwhile first sensing element 123 is placed in second Chamber 116 a, so that surface sensing of the first sensing element 123 enters the gas in the downstream of the particle trap of second chamber 116 Body pressure P2;Also, the ceramic circuit board 121 is entirely arranged in the 4th chamber (being different from the 4th chamber 119 above-mentioned);Into And the processing circuit 122 is used to carry out digitized processing to the two-way absolute pressure information received.
In some embodiments, two sensing elements can also all be relative pressure sensing element, to perceive particle Pressure difference between the upstream and downstream of catcher forms the redundancy check of pressure signal, at this point, the design of shell structure also phase It is identical as previous embodiment to simple but total thinking.For example: retain first chamber, second chamber, third chamber and The setting of 4th chamber, so that the second sensing element 124 and the first sensing element 123 are all set in first chamber so that this two A sensing element senses the gas pressure P1 into the upstream of the particle trap of first chamber simultaneously;At the same time, it second passes Another surface of sensing unit 124 and the first sensing element 123 senses the gas into the downstream of the particle trap of third chamber Body pressure P2;So that each sensing element can simultaneously sensing particles catcher upstream and downstream between pressure Difference, and two-way pressure difference information is transmitted to processing circuit 122 and makees further digitized processing.In the manner, described Processing circuit and the peripheral circuit are all set to the second part of ceramic circuit board and are located at the ceramic circuit board The same side, and the first part is located at the third chamber and is arranged there are two via hole, second sensing element 124 is located at Exit of one of them described via hole far from the third chamber, first sensing element 123 are located at another described mistake Exit of the hole far from the third chamber, so that the gas downstream of the third chamber is added by a respective via hole It is loaded in another surface of first sensing element 123 and second sensing element 124.
In addition, in other embodiments, one of sensing element can also be with the gas of the upstream of sensing particles catcher Pressure P1, another sensing element then perceive the pressure difference of the upstream and downstream of particle trap, specific implementation and aforementioned reality It is essentially identical to apply example, is no longer described in detail herein.
Therefore, the type of the unlimited pressing pressure of pressure sensor 10 measurement of the present embodiment, can be while measuring particle and catch The absolute pressure of the upstream and downstream of device is caught, the pressure difference of the upstream and downstream of particle trap can also be measured simultaneously, can be surveyed with one The upstream of particle trap or the pressure in downstream are measured, the pressure difference of the upstream and downstream of another measurement particle trap, with specific reference to Actual operation requirements select.Also, the present invention does not limit the relative position of chamber each in shell specifically, as long as can By each chamber isolation, meet corresponding require.
To sum up, pressure sensor provided in an embodiment of the present invention has preferable medium resistance, it is ensured that it is electrical Part can steadily use for a long time in severe working environment.Particularly, electricity used by pressure measurement cell therein Road plate is ceramic circuit board, and two sensing elements, preferably MEMS sensing element is provided on ceramic circuit board, and make this Two sensing elements are communicated to connect with the processing circuit of the other side on ceramic circuit board respectively, so as to measure two-way pressure simultaneously Power, and also achieve the integrated of circuit board and sensing element.It is of the invention with the existing circuit board that is provided separately compared with sensing element Pressure measurement cell is small in size, and the structure of shell is simpler, while assembly is also more convenient, and the cost of system is lower.
Obviously, those skilled in the art can carry out various modification and variations without departing from spirit of the invention to invention And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it Interior, then the present invention is also intended to include these modifications and variations.

Claims (19)

1. a kind of pressure sensor, which is characterized in that including shell and be set to the intracorporal pressure measurement cell of the shell;Institute Stating pressure measurement cell includes ceramic circuit board and the processing circuit being set on the ceramic circuit board, the first sensing element With the second sensing element;Wherein:
The side of the ceramic circuit board, first sensing element and second sensing element is arranged in the processing circuit Part is arranged in the ceramic circuit board other side opposite with the side, the processing circuit respectively with first sensing element Part and second sensing element communication connection;First sensing element and second sensing element are respectively used to sense The pressure of one measuring medium simultaneously feeds back to the processing circuit;The processing circuit is used to carry out two pressure informations received Digitized processing.
2. pressure sensor according to claim 1, which is characterized in that the ceramic circuit board is multilayered structure, and interior Portion is provided with route, the processing circuit by the route respectively with first sensing element and second sensing element Part communication connection.
3. pressure sensor according to claim 2, which is characterized in that the ceramic circuit board is high-temperature co-fired ceramics electricity Road plate or low-temperature co-fired ceramics circuit board.
4. pressure sensor according to claim 1 or 2, which is characterized in that first sensing element and described second Sensing element is MEMS sensing element.
5. pressure sensor according to claim 4, which is characterized in that the thermal expansion coefficient of the ceramic circuit board is little In twice of MEMS sensing element.
6. pressure sensor according to claim 5, which is characterized in that the thermal expansion coefficient of the ceramic circuit board is less than 10ppm/C。
7. pressure sensor according to claim 1 or 2, which is characterized in that first sensing element and described Two sensing elements are absolute pressure sensor element, are respectively used to an absolute pressure of one measuring medium of sensing.
8. pressure sensor according to claim 7, which is characterized in that be provided with separated first chamber in the shell And second chamber;
Second sensing element is placed in the first chamber, so that a surface sensing of second sensing element enters institute State the pressure of the measuring medium of first chamber;
First sensing element is placed in the second chamber, so that a surface sensing of first sensing element enters institute State the pressure of the measuring medium of second chamber;
It is additionally provided with the 4th chamber in the shell, is provided separately with the first chamber and the second chamber, and the place Reason circuit is placed in the 4th chamber, and is respectively used to carry out digitized processing to the two absolute pressure information received.
9. pressure sensor according to claim 1 or 2, which is characterized in that first sensing element is absolute pressure Sensing element, for sensing an absolute pressure of a measuring medium;Second sensing element is relative pressure sensing element, is used In the pressure difference for sensing a measuring medium.
10. pressure sensor according to claim 9, which is characterized in that be provided with the first separated chamber in the shell Room and second chamber;
Second sensing element is placed in the first chamber, so that a surface sensing of second sensing element enters institute State the pressure of the measuring medium of first chamber;
First sensing element is placed in the second chamber, so that a surface sensing of second sensing element enters institute State the pressure of the measuring medium of second chamber;
Third chamber and the 4th chamber are additionally provided in the shell, the 4th chamber is separated with remaining chamber;
The third chamber is connected to by the intracorporal intermediate channel of the shell with the second chamber, and makes second sensing The element another surface sensing opposite with a surface described in its enters the pressure of the measuring medium of the third chamber;Described second Sensing element is used to obtain the first chamber and the third chamber according to the pressure of the measuring medium of two surface sensing Between pressure difference;
The processing circuit is placed in the 4th chamber, and is respectively used to press the absolute pressure information received and one Power difference information carries out digitized processing.
11. pressure sensor according to claim 10, which is characterized in that the pressure measurement cell further includes peripheral electricity Road, in which:
The ceramic circuit board includes first part and second part, and the processing circuit and the peripheral circuit are all arranged In the second part and positioned at the same side of the ceramic circuit board, and the first part is located at the third chamber and sets It is equipped with a via hole, second sensing element is located at the one end of the via hole far from the third chamber, so that the third chamber The measuring medium of room loads on another surface of second sensing element by the via hole.
12. pressure sensor according to claim 1 or 2, which is characterized in that first sensing element and described Two sensing elements are relative pressure sensing element, are respectively used to a pressure difference of one measuring medium of sensing.
13. pressure sensor according to claim 12, which is characterized in that be provided with the first separated chamber in the shell Room and second chamber;
Second sensing element and first sensing element are placed in the first chamber, so that second sensing element One surface of part and first sensing element senses the pressure into the measuring medium of the first chamber;
Third chamber and the 4th chamber are additionally provided in the shell, the 4th chamber is separated with remaining all chamber;Its In:
The third chamber is connected to by the intracorporal intermediate channel of the shell with the second chamber, and makes second sensing Element and the corresponding opposite another surface in a surface of first sensing element are sensed into the third The pressure of the measuring medium of chamber;First sensing element and second sensing element are respectively used to according to two table The pressure of the measuring medium of face sensing obtains the pressure difference between the first chamber and the third chamber;
The processing circuit is placed in the 4th chamber, and is respectively used to digitize the two pressure difference information received Processing.
14. pressure sensor according to claim 13, which is characterized in that the pressure measurement cell further includes peripheral electricity Road, in which:
The ceramic circuit board includes first part and second part, and the processing circuit and the peripheral circuit are all arranged In the second part and positioned at the same side of the ceramic circuit board, and the first part is located at the third chamber and sets It is equipped with two via holes, second sensing element is located in one of the one end of the via hole far from the third chamber, and described One sensing element is located at the one end of another described via hole far from the third chamber, so that the measuring medium of the third chamber Another surface of first sensing element and second sensing element is loaded on by a respective via hole.
15. pressure sensor according to claim 1 or 2, which is characterized in that first sensing element and described second Sensing element passes through corrosion resistant binding line respectively and connect with the ceramic circuit board.
16. pressure sensor according to claim 1 or 2, which is characterized in that first sensing element and described second The surface of sensing element is provided with gel, and the gel is silica containing fluorine.
17. pressure sensor according to claim 16, which is characterized in that first sensing element and described second passes Sensing unit is respectively provided in a glue peripheral frame, and the glue peripheral frame is for preventing the gel excessive.
18. pressure sensor according to claim 1 or 2, which is characterized in that be provided on the shell for outside The inserting terminal of electrical contact;The ceramic circuit board is connect by electric resistance welding, binding line or contact pin soldering with the inserting terminal.
19. pressure sensor according to claim 1 or 2, which is characterized in that the Digital ASIC is also used to Two pressure informations after digitized processing are encoded to unilateral nibble digital communication protocol, to pass through two institute of circuit output all the way State pressure information.
CN201811603320.0A 2018-12-26 2018-12-26 Pressure sensor Pending CN109655194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811603320.0A CN109655194A (en) 2018-12-26 2018-12-26 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811603320.0A CN109655194A (en) 2018-12-26 2018-12-26 Pressure sensor

Publications (1)

Publication Number Publication Date
CN109655194A true CN109655194A (en) 2019-04-19

Family

ID=66116460

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811603320.0A Pending CN109655194A (en) 2018-12-26 2018-12-26 Pressure sensor

Country Status (1)

Country Link
CN (1) CN109655194A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021027847A1 (en) * 2019-08-12 2021-02-18 联合汽车电子有限公司 Pressure sensor
CN113624394A (en) * 2020-05-08 2021-11-09 精量电子(深圳)有限公司 Pressure sensor

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0334611A2 (en) * 1988-03-22 1989-09-27 Honeywell Inc. Pressure transmitter assembly
CN1716459A (en) * 2004-06-28 2006-01-04 Tdk株式会社 Low-temperature co-fired ceramics material and multilayer wiring board using the same
CN201126390Y (en) * 2007-12-06 2008-10-01 联创汽车电子有限公司 Car engine intake manifold absolute pressure transducer
CN102680159A (en) * 2012-05-24 2012-09-19 柯远珍 Sensor
CN203534756U (en) * 2013-11-15 2014-04-09 柯远珍 Pressure transducer structure
CN105024154A (en) * 2015-07-08 2015-11-04 东莞电子科技大学电子信息工程研究院 Multi-element low-temperature co-fired ceramic (LTCC) microwave radio-frequency circuit and method for using same
CN105067181A (en) * 2015-08-12 2015-11-18 凯龙高科技股份有限公司 Gas differential pressure sensor
CN106052944A (en) * 2015-04-02 2016-10-26 森萨塔科技公司 Combined temperature, absolute and differential pressure sensor assembly
WO2017003692A1 (en) * 2015-06-29 2017-01-05 Continental Automotive Systems, Inc. Pressure sensor device with a mems piezoresistive element attached to an in-circuit ceramic board
CN208223708U (en) * 2018-05-31 2018-12-11 联合汽车电子有限公司 Pressure sensor for vehicle

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0334611A2 (en) * 1988-03-22 1989-09-27 Honeywell Inc. Pressure transmitter assembly
CN1716459A (en) * 2004-06-28 2006-01-04 Tdk株式会社 Low-temperature co-fired ceramics material and multilayer wiring board using the same
CN201126390Y (en) * 2007-12-06 2008-10-01 联创汽车电子有限公司 Car engine intake manifold absolute pressure transducer
CN102680159A (en) * 2012-05-24 2012-09-19 柯远珍 Sensor
CN203534756U (en) * 2013-11-15 2014-04-09 柯远珍 Pressure transducer structure
CN106052944A (en) * 2015-04-02 2016-10-26 森萨塔科技公司 Combined temperature, absolute and differential pressure sensor assembly
WO2017003692A1 (en) * 2015-06-29 2017-01-05 Continental Automotive Systems, Inc. Pressure sensor device with a mems piezoresistive element attached to an in-circuit ceramic board
CN105024154A (en) * 2015-07-08 2015-11-04 东莞电子科技大学电子信息工程研究院 Multi-element low-temperature co-fired ceramic (LTCC) microwave radio-frequency circuit and method for using same
CN105067181A (en) * 2015-08-12 2015-11-18 凯龙高科技股份有限公司 Gas differential pressure sensor
CN208223708U (en) * 2018-05-31 2018-12-11 联合汽车电子有限公司 Pressure sensor for vehicle

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
程辉明: "《先进电子制造技术》", 31 July 2008 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021027847A1 (en) * 2019-08-12 2021-02-18 联合汽车电子有限公司 Pressure sensor
EP4016031A4 (en) * 2019-08-12 2022-10-05 United Automotive Electronic Systems Co., Ltd. Pressure sensor
JP2022544962A (en) * 2019-08-12 2022-10-24 聯合汽車電子有限公司 pressure sensor
JP7303374B2 (en) 2019-08-12 2023-07-04 聯合汽車電子有限公司 pressure sensor
CN113624394A (en) * 2020-05-08 2021-11-09 精量电子(深圳)有限公司 Pressure sensor

Similar Documents

Publication Publication Date Title
CN208223708U (en) Pressure sensor for vehicle
CN209400120U (en) Pressure sensor
WO2021027847A1 (en) Pressure sensor
US4841777A (en) Pressure transmitter assembly
CN109655194A (en) Pressure sensor
US20110088480A1 (en) Pressure sensor and use thereof in a fluid tank
JP2016075506A (en) Flow rate measurement device
US11619529B2 (en) Compact ultrasonic flowmeter
WO2010112030A1 (en) Flow meter with ultrasound transducer directly connected to and fixed to measurement circuit board
CN109696273B (en) Automobile brake boosting vacuum pressure sensor device
CN108918019B (en) Differential pressure sensor for DPF tail gas treatment system
CN105209877B (en) Pressure sensor
CN210625922U (en) Pressure sensor
WO2016035903A1 (en) Differential pressure sensor
US20090200164A1 (en) Gas sensor
KR20180066744A (en) Integrated sensor device for vehicle measuring temperature and pressure
TWM441751U (en) Sensing module applied to ball-screw mechanism
CN109489728A (en) A kind of sensor
US20050103110A1 (en) Integrated pressure and temperature sensor
CN109748234B (en) Pressure measurement module and packaging method thereof
CN207163634U (en) A kind of differential pressure pickup
CN111351530A (en) Sensor and preparation method thereof
CN110657913A (en) Catch pressure sensor device for detecting automobile exhaust particles
CN215492197U (en) Micro-differential pressure sensor
CN212585909U (en) Double-circuit sensor with clamping structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20190419

RJ01 Rejection of invention patent application after publication