CN202661217U - Sensor - Google Patents
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- Publication number
- CN202661217U CN202661217U CN 201220246624 CN201220246624U CN202661217U CN 202661217 U CN202661217 U CN 202661217U CN 201220246624 CN201220246624 CN 201220246624 CN 201220246624 U CN201220246624 U CN 201220246624U CN 202661217 U CN202661217 U CN 202661217U
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- Prior art keywords
- core body
- circuit board
- pressure core
- ceramic
- sensor
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- Expired - Lifetime
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- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a sensor which comprises a circuit board, wherein a pressure core body is bound on the circuit board through an electric lead; the outer part of the pressure core body is connected with an electric conductor; and the circuit board is a ceramic circuit board taking ceramic as a substrate. The sensor adopts a ceramic circuit board taking ceramic as a substrate; and since the coefficient of thermal expansion of the ceramic is close to the coefficient of thermal expansion of the pressure core body, the difference between the two coefficients of thermal expansion is avoided, and the deformation of the circuit board influences the deformation of the pressure core body, thus the reliable high precision of the sensor in different temperature ranges is guaranteed. Meanwhile, the ceramic circuit board taking ceramic as a substrate is a conventional circuit board which has low cost and is favorable for large-scale production, and the product cost can be effectively lowered.
Description
Technical field
The utility model relates to the sensor of a kind of sensor, particularly a kind of gaging pressure.
Background technology
Application number is 201110334291.4, name is called the Chinese invention patent application of " compound type temperature pressure sensor ", a kind of sensor that utilizes electric principle to measure temperature and pressure is disclosed, comprise that the top establishes reeded pedestal, be fixed on the convoluted diaphragm at pedestal top by trim ring, be filled with silicone oil between the groove of pedestal and the convoluted diaphragm, be provided with pressure chip in the pedestal, pressure chip extremely links to each other with lead-in wire by spun gold, the lead-in wire utmost point passes pedestal and stretches out, also be fixed with thermistor in the pedestal, oil supply hole on the pedestal seals by pin, simultaneously gaging pressure and temperature, and by the isolation of stainless steel diaphragm realization to the pressure sensitive chip, enlarged usable range.Yet technique scheme is existent defect still.Owing to the employing filling silicon oil, take metal as technological means such as substrates, the thermal expansivity of its metal and the expansion coefficient of silicon have larger gap, have limited the usable range of this sensor.Require to work in the temperature range of+125 degree at-40 degree Celsius such as the sensor that uses at automobile, because these two thermal expansivity is different, interval in different temperatures, expansion of metal can have influence on the deformation of silicon, thereby causes measurement error value excessive.
The utility model content
The technical problems to be solved in the utility model provides a kind ofly all has high-precision sensor in different working temperature intervals.
In order to solve the problems of the technologies described above, a kind of sensor of the present utility model comprises circuit board, by the conductor wire binding pressure core body is arranged on the circuit board, and the pressure core body is externally connected to electric conductor, and described circuit board is the ceramic circuit board take pottery as substrate.
As improvement of the technical scheme, described pressure core body arranged outside has back-up ring, fills out the flexible glue of embedding in this back-up ring.
As improvement of the technical scheme, be connected with thermistor on the described ceramic circuit board, the position of this thermistor and back-up ring opening are close.
As improvement of the technical scheme, have the through hole that is communicated with upper and lower side on the described ceramic circuit board, this lead to the hole site is corresponding with the pressure core body.
Described pressure core body is the silicon core body; Perhaps, described pressure core body is the silicon capacitive pressure core body; Perhaps, the described pressure core body integral type MEMS pressure core body that is integrated pressure and signal conditioning circuit.
Described pressure core body is bundled on the pad of circuit board by gold thread; Perhaps, described pressure core body is bundled on the pad of circuit board by aluminum steel.
The beneficial effects of the utility model are: this sensor has adopted the ceramic circuit board take pottery as substrate, because the thermal expansivity of ceramic thermal expansivity and pressure core body approaches, avoided the two thermal expansivity different, circuit board deformation meeting has influence on the deformation of pressure core body, thereby guarantees all have reliable high precision at the interval sensor of different temperatures.Simultaneously, the ceramic circuit board take pottery as substrate is a kind of custom circuit plate, has low cost, is beneficial to large-scale production, can effectively reduce cost of products.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model.
Embodiment
With reference to Fig. 1, a kind of sensor of the present utility model comprises circuit board 1, by conductor wire 8 bindings pressure core body 2 is arranged on the circuit board 1, and pressure core body 2 is externally connected to electric conductor 3, and described circuit board 1 is the ceramic circuit board take pottery as substrate.This sensor has adopted the ceramic circuit board take pottery as substrate, because the thermal expansivity of ceramic thermal expansivity and pressure core body approaches, avoided the two thermal expansivity different, circuit board deformation meeting has influence on the deformation of pressure core body, thereby guarantees all have reliable high precision at the interval sensor of different temperatures.Simultaneously, the ceramic circuit board take pottery as substrate is a kind of custom circuit plate, has low cost, is beneficial to large-scale production, can effectively reduce cost of products.Circuit board take pottery as substrate have outstanding physical strength, low warped degree, thermal expansivity near Silicon Wafer, high rigidity, processability is good, dimensional accuracy is high; Applicable hot and humid environment, thermal conductivity is high, thermotolerance is good, corrosion-resistant with wear away; Unleaded, nontoxic, chemical stability is good; High insulation resistance, easy metallization, circuitous pattern be strong adhesion with it; Material is abundant, easy to manufacture, price is low.
In the present embodiment, described pressure core body 2 arranged outside have back-up ring 4, fill out the flexible glue 5 of embedding in this back-up ring 4.When elastic gum 5 was subjected to detected fluid pressure, elastic gum 5 was passed to pressure core body 2 to the pressure of fluid, and pressure core body 2 is just exported the electric signal that becomes strict proportionate relationship with measuring point pressure, thereby realized measuring point fluid pressure force measurement.Back-up ring 4 is fixing fittings of elastic gum 5, prevents the movement of elastic gum 5 or flows.This structure needing in the traditional structure have been avoided to complicated technologies such as core body filling silicon oil and metal sealings, has reduced the monomer production cost too high, and making this sensor be applicable to automobile, the product for civilian use etc. needs low-cost sensor field.
Be connected with thermistor 6 on the described ceramic circuit board, this thermistor 6 is positioned at described back-up ring 4 inside or outside, and the position of thermistor 6 and back-up ring 4 openings are close.In said structure, thermistor 6 directly and fluid contacts, and fluid is to be in the same temperature field, so thermistor 6 can be exported the resistance value corresponding with the measuring point fluid temperature (F.T.) (being temperature value), realized the Measurement accuracy to the measuring point temperature.The measurement of its resistance value is to be drawn out to the outside by meticulous enameled wire (or wire of other insulation parcels) and electric conductor 3.Simultaneously, this sensor on a substrate, consists of compound pressure-temperature sensor to pressure sensitive chip and thermal resistance temperature sensor unit combination.
Also have the through hole 7 that is communicated with upper and lower side on the described ceramic circuit board, these through hole 7 positions are corresponding with pressure core body 2.When measuring relative pressure, make pressure core body 2 keep being communicated with atmosphere or other corresponding objects of reference.
Described pressure core body 2 is the silicon core body; Perhaps, described pressure core body 2 is the silicon capacitive pressure core body; Perhaps, the described pressure core body 2 integral type MEMS pressure core body that is integrated pressure and signal conditioning circuit.
As the improvement of the present embodiment, described pressure core body 2 is bundled in by gold thread or aluminum steel on the pad of circuit board 1, and pressure core body 2 links to each other with electric conductor 3 by gold thread or aluminum steel, with output signal.
The above only is preferential embodiment of the present utility model, as long as realize that with basic identical means the technical scheme of the utility model purpose all belongs within the protection domain of the present utility model.
Claims (9)
1. sensor, comprise circuit board (1), circuit board (1) is upper to have pressure core body (2) by conductor wire (8) binding, pressure core body (2) is externally connected to electric conductor (3), it is characterized in that: described circuit board (1) is the ceramic circuit board take pottery as substrate.
2. sensor according to claim 1, it is characterized in that: described pressure core body (2) arranged outside has back-up ring (4), fills out the flexible glue of embedding (5) in this back-up ring (4).
3. sensor according to claim 2, it is characterized in that: be connected with thermistor (6) on the described ceramic circuit board, the position of this thermistor (6) and back-up ring (4) opening are close.
4. sensor according to claim 2 is characterized in that: have the through hole (7) that is communicated with upper and lower side on the described ceramic circuit board, this through hole (7) position is corresponding with pressure core body (2).
5. sensor according to claim 3, it is characterized in that: described pressure core body (2) is the silicon core body.
6. sensor according to claim 3, it is characterized in that: described pressure core body (2) is the silicon capacitive pressure core body.
7. sensor according to claim 3 is characterized in that: described pressure core body (2) is the integral type MEMS pressure core body of integrated pressure and signal conditioning circuit.
8. sensor according to claim 1, it is characterized in that: described pressure core body (2) is bundled on the pad of circuit board (1) by gold thread.
9. sensor according to claim 1, it is characterized in that: described pressure core body (2) is bundled on the pad of circuit board (1) by aluminum steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220246624 CN202661217U (en) | 2012-05-24 | 2012-05-24 | Sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220246624 CN202661217U (en) | 2012-05-24 | 2012-05-24 | Sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202661217U true CN202661217U (en) | 2013-01-09 |
Family
ID=47456117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220246624 Expired - Lifetime CN202661217U (en) | 2012-05-24 | 2012-05-24 | Sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202661217U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102680159A (en) * | 2012-05-24 | 2012-09-19 | 柯远珍 | Sensor |
| CN104501878A (en) * | 2015-01-26 | 2015-04-08 | 中国电子科技集团公司第四十九研究所 | Filling ceramic structure of complex sensor sensitive core and installation method |
| CN108534924A (en) * | 2017-03-03 | 2018-09-14 | 英属开曼群岛商智动全球股份有限公司 | Force sensing device |
-
2012
- 2012-05-24 CN CN 201220246624 patent/CN202661217U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102680159A (en) * | 2012-05-24 | 2012-09-19 | 柯远珍 | Sensor |
| CN102680159B (en) * | 2012-05-24 | 2013-12-04 | 柯远珍 | Sensor |
| CN104501878A (en) * | 2015-01-26 | 2015-04-08 | 中国电子科技集团公司第四十九研究所 | Filling ceramic structure of complex sensor sensitive core and installation method |
| CN104501878B (en) * | 2015-01-26 | 2017-01-25 | 中国电子科技集团公司第四十九研究所 | Filling ceramic structure of complex sensor sensitive core and installation method |
| CN108534924A (en) * | 2017-03-03 | 2018-09-14 | 英属开曼群岛商智动全球股份有限公司 | Force sensing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130109 Effective date of abandoning: 20131204 |
|
| RGAV | Abandon patent right to avoid regrant |