CN202494482U - Micro electro mechanical system (MEMS) mass flow sensor - Google Patents
Micro electro mechanical system (MEMS) mass flow sensor Download PDFInfo
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- CN202494482U CN202494482U CN2012200239502U CN201220023950U CN202494482U CN 202494482 U CN202494482 U CN 202494482U CN 2012200239502 U CN2012200239502 U CN 2012200239502U CN 201220023950 U CN201220023950 U CN 201220023950U CN 202494482 U CN202494482 U CN 202494482U
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- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 6
- 230000004907 flux Effects 0.000 claims description 4
- 239000002103 nanocoating Substances 0.000 claims description 4
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
The utility model relates to a micro electro mechanical system (MEMS) mass flow sensor which is characterized in that the sensor is a MEMS flow sensor chip comprising a pair of pressure welding blocks, a pair of temperature sensing elements and a pair of heating resistors. The pressure welding blocks, the temperature sensing elements and the heating resistors are symmetrically arranged in a chip plane from the outside to the inside. A thermopile is respectively connected on to the tops of the pressure welding blocks, the temperature sensing elements and the heating resistors, and the tops are mutually connected. A non-bonding nanometer coating is covered at the spare position of the chip. The MEMS mass flow sensor is wide in measuring range, high in response speed, high in sensitivity and low in power consumption.
Description
Technical field
The utility model relates to a kind of mass flow sensor, particularly discloses a kind of MEMS mass flow sensor, comprises MEMS flow sensor chip, is applied to the measurement of gas mass flow.
Background technology
MEMS (Micro-Electro-Mechanical Systems) english abbreviation is MEMS; Be widening and extending of microelectric technique; It merges microelectric technique and precise machine machining each other, has realized microelectronics and the mechanical target that combines together.
In the field of flow metering, the thermal mass flow meter that uses to gasmetry, because its higher precision, directly mass flow measurement and reasonable prices and be widely used.But in some specific gas dosing occasions, higher requirement is arranged, need wide range ratio, outstanding low discharge sensitivity or the like for flow sensor.To this a series of condition, traditional thermal mass flow meter is compared the other types flowmeter has comparatively outstanding performance.But for itself, also need on the technical research of sensor further to improve, also can stablize accurate the measurement under the various harsh conditions to satisfy.
Summary of the invention
The purpose of the utility model is thoroughly to solve the low discharge dead band and the narrow problem of range of traditional handicraft flow sensor; A kind of MEMS mass flow sensor is disclosed; Improve precision, sensitivity and the reliability of the measurement of flowmeter; And, can reduce the manufacturing cost of sensor significantly along with the propelling of industrialization.
The utility model is achieved in that a kind of MEMS mass flow sensor; It is characterized in that: said sensor is a MEMS flow sensor chip; The composition of said MEMS flow sensor chip comprises a pair of press welding block, a pair of temperature-sensing element and a pair of heating resistor; Described press welding block, temperature-sensing element and heating resistor are arranged symmetrically in the chip plane from outside to inside; Their top all is connected with thermoelectric pile, interconnects between each thermoelectric pile, and the vacant place of chip all is covered with the Inadhesion nano coating.The chip material of said MEMS flow sensor adopts surfacing and pure pure thin-film membraneous material, and the size of chip is 7mm * 2.4mm, and thickness is 0.15mm.Described a pair of temperature-sensing element places the both sides of a pair of heating resistor respectively; Temperature-sensing element is located at the upper reaches of measured flux in the described a pair of temperature-sensing element, and another temperature-sensing element is located at the downstream of measured flux.
The MEMS mass flow sensor is through carrying out the second order difference computing to the upstream and downstream temperature difference, thereby under guaranteeing the less situation of low speed segment linearity influence, toward pusher, so that range ratio expansion is more than 10 times with the saturation point of the relation of flow velocity and output voltage.
The beneficial effect of the utility model is: after MEMS flow sensor Chip Packaging is good, can integrated completion flow measurement and electric signal output, have that range ability is wide, response speed is fast, highly sensitive, low in energy consumption, near excellent properties such as zero beginning are moving.
The MEMS mass flow sensor possesses following characteristics: volume is small, and the pressure distribution of stream field does not have influence, does not have pressure loss, need not temperature compensation, and sensor is directly exported electric signal.Thermal source is small, during no gas flow, can not cause the convection current of gas, has good zero stability.Adopt the mode of production manufacturing of large scale integrated circuit, have the consistance and the reliability of height, be convenient to calibration and maintenance.
Description of drawings
Fig. 1 is the utility model MEMS mass flow sensor fundamental diagram.
Fig. 2 is the chip structure figure of the utility model MEMS flow sensor.
Fig. 3 is the chip circuit figure of the utility model MEMS flow sensor.
Among the figure: 1, press welding block; 2, temperature-sensing element; 3, heating resistor; 4, thermoelectric pile; 5, Inadhesion nano coating; 6, sensor substrate; 7, pipeline.
Embodiment
According to attaching Fig. 1 and 2, a kind of MEMS mass flow sensor of the utility model comprises MEMS flow sensor chip.The composition of MEMS flow sensor chip comprises a pair of press welding block 1, a pair of temperature-sensing element 2 and a pair of heating resistor 3.Press welding block 1, temperature-sensing element 2 and heating resistor 3 are arranged symmetrically in the chip plane from outside to inside, and their top all is connected with thermoelectric pile 4, interconnect between each thermoelectric pile, and the vacant part of chip all is covered with Inadhesion nano coating 5.The chip material of MEMS flow sensor adopts surfacing and pure pure thin-film membraneous material, and the size of chip is 7mm * 2.4mm, and thickness is 0.15mm.A pair of temperature-sensing element 2 places the both sides of a pair of heating resistor 3 respectively.During measurement, temperature-sensing element is located at the upper reaches of tested gas flow in the pipeline 7 in a pair of temperature-sensing element, and another temperature-sensing element is located at the downstream of tested gas flow in the pipeline 7.
According to accompanying drawing 3; Temperature detecting resistance Rtemp, heating resistor RH and other resistance R 3, R4, R6 and R7 form a resistance bridge circuit; When the resistance of two platinum resistance thermometer sensor,s changes; Electric bridge two ends output different voltages with different signal amplifies faint voltage signal and filtering through amplification filtering circuit U 1A and U_Bs, finally exports one and sensor temperature and changes corresponding to electric signal.Added temperature-compensation circuit in the circuit equally, when the needs temperature compensation, the U_Br control circuit carries out corresponding temperature compensation.
Claims (3)
1. MEMS mass flow sensor; It is characterized in that: said sensor is a MEMS flow sensor chip; The composition of said MEMS flow sensor chip comprises a pair of press welding block, a pair of temperature-sensing element and a pair of heating resistor, and described press welding block, temperature-sensing element and heating resistor are arranged symmetrically in the chip plane from outside to inside, and their top all is connected with thermoelectric pile; Interconnect between each thermoelectric pile, the vacant place of chip all is covered with the Inadhesion nano coating.
2. according to the described MEMS mass flow sensor of claim 1, it is characterized in that: the chip material of said MEMS flow sensor adopts surfacing and pure material, and the size of chip is 7mm * 2.4mm, and thickness is 0.15mm.
3. according to the described MEMS mass flow sensor of claim 1, it is characterized in that: described a pair of temperature-sensing element places the both sides of a pair of heating resistor respectively; Temperature-sensing element is located at the upper reaches of measured flux in the described a pair of temperature-sensing element, and another temperature-sensing element is located at the downstream of measured flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200239502U CN202494482U (en) | 2012-01-19 | 2012-01-19 | Micro electro mechanical system (MEMS) mass flow sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200239502U CN202494482U (en) | 2012-01-19 | 2012-01-19 | Micro electro mechanical system (MEMS) mass flow sensor |
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| CN202494482U true CN202494482U (en) | 2012-10-17 |
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| CN2012200239502U Expired - Fee Related CN202494482U (en) | 2012-01-19 | 2012-01-19 | Micro electro mechanical system (MEMS) mass flow sensor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564507A (en) * | 2012-01-19 | 2012-07-11 | 上海华强浮罗仪表有限公司 | MEMS (micro-electro-mechanical system) quality and flow sensor |
| CN104736976A (en) * | 2012-10-23 | 2015-06-24 | 大陆汽车有限责任公司 | Air mass sensor |
| CN108982905A (en) * | 2018-07-27 | 2018-12-11 | 杭州电子科技大学 | Integrate the MEMS buffer structure for dropping gas flow rate of flow sensor |
| CN110274649A (en) * | 2019-06-13 | 2019-09-24 | 武汉大学 | A kind of hot temperature difference type flow sensor and preparation method thereof based on MEMS technology |
| CN113049053A (en) * | 2021-03-15 | 2021-06-29 | 青岛芯笙微纳电子科技有限公司 | High-performance MEMS flow sensor and preparation method thereof |
-
2012
- 2012-01-19 CN CN2012200239502U patent/CN202494482U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102564507A (en) * | 2012-01-19 | 2012-07-11 | 上海华强浮罗仪表有限公司 | MEMS (micro-electro-mechanical system) quality and flow sensor |
| CN104736976A (en) * | 2012-10-23 | 2015-06-24 | 大陆汽车有限责任公司 | Air mass sensor |
| US9664545B2 (en) | 2012-10-23 | 2017-05-30 | Continental Automotive Gmbh | Air mass sensor |
| CN104736976B (en) * | 2012-10-23 | 2017-10-10 | 大陆汽车有限责任公司 | air mass flow meter |
| CN108982905A (en) * | 2018-07-27 | 2018-12-11 | 杭州电子科技大学 | Integrate the MEMS buffer structure for dropping gas flow rate of flow sensor |
| CN110274649A (en) * | 2019-06-13 | 2019-09-24 | 武汉大学 | A kind of hot temperature difference type flow sensor and preparation method thereof based on MEMS technology |
| CN110274649B (en) * | 2019-06-13 | 2020-09-01 | 武汉大学 | A kind of thermal temperature difference flow sensor based on MEMS technology and preparation method thereof |
| CN113049053A (en) * | 2021-03-15 | 2021-06-29 | 青岛芯笙微纳电子科技有限公司 | High-performance MEMS flow sensor and preparation method thereof |
| CN113049053B (en) * | 2021-03-15 | 2022-12-30 | 青岛芯笙微纳电子科技有限公司 | High-performance MEMS flow sensor and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121017 Termination date: 20140119 |