CN108534924A - Force sensing device - Google Patents
Force sensing device Download PDFInfo
- Publication number
- CN108534924A CN108534924A CN201710124490.XA CN201710124490A CN108534924A CN 108534924 A CN108534924 A CN 108534924A CN 201710124490 A CN201710124490 A CN 201710124490A CN 108534924 A CN108534924 A CN 108534924A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- sensing device
- force
- force sensing
- detecting part
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The present invention provides a kind of force sensing device, including sensing element and circuit board.For sensing element with opposite top surface and bottom surface and with detecting part, wherein detecting part is located at top surface.Circuit board arrangement is on top surface and being electrically connected at sensing element, and wherein detecting part is suitable for generating sensing signal by the external force transmitted from circuit board toward top surface.
Description
Technical field
The present invention relates to a kind of sensor more particularly to a kind of force sensing devices.
Background technology
MEMS (Micro-Electro-Mechanical System, MEMS) technology is one kind with microminiaturization machine
Electric integrated structure is the design of starting point.Micro-electromechanical technology common at present is mainly used in micro- sensor (Micro
Sensors), the three big fields such as micro- brake (Micro actuators) and micro-structure (Micro structures) element,
In micro- sensor external environment can be changed to (such as strength, pressure, sound, speed) be converted into electric signal (such as voltage or electricity
Stream etc.), and realize environment sensing function, such as force sensing, pressure-sensing, sound sensing, acceleration sensing.Due to micro- sensing
Device can utilize manufacture of semiconductor technology to manufacture and can be integrated with integrated circuit, therefore have preferable competitiveness.Therefore micro electronmechanical
The development trend of the sensing device further actually MEMS of sensor and the micro electronmechanical sensor of application.
For micro electronmechanical strength sensor, sensing element is to sense the pressing force that entity is applied, if sensing
Part is exposed and directly bears pressing force, then sensing element is easy consume.If adding to cover to solve the above-mentioned problems
Lid sensing element and the lid for bearing pressing force can then increase the integral thickness and manufacturing cost of sensor.Therefore, how not
In the case of the integral thickness and the manufacturing cost that increase sensor, the sensing element of force sensing device is protected and maintains it
Performance is sensed, is the important issue in micro electronmechanical force sensing field.
Invention content
The present invention provides a kind of force sensing device, can be in the feelings for the integral thickness and manufacturing cost for not increasing force sensing device
Under condition, the sensing element of force sensing device is protected and it is maintained to sense performance.
The force sensing device of the present invention includes sensing element and circuit board.Sensing element have opposite top surface and bottom surface and
With detecting part, wherein detecting part is located at top surface.Circuit board arrangement is on top surface and being electrically connected at sensing element, wherein sensing
Portion is suitable for generating sensing signal by the external force transmitted from circuit board toward top surface.
In one embodiment of this invention, above-mentioned circuit board includes peripheral part and central portion, and central portion is enclosed by peripheral part
Around and to be located at detecting part, sensing element supports peripheral part, detecting part to be suitable for by the external force transmitted from central portion toward top surface
Generate sensing signal.
In one embodiment of this invention, above-mentioned force sensing device further includes multiple conductive bumps, these conductive bumps
It is configured between top surface and circuit board, sensing element supports circuit board by these conductive bumps, and passes through these conductive bumps
And it is electrically connected circuit board.
In one embodiment of this invention, above-mentioned force sensing device further includes colloid, and wherein colloid covers at least partly
Sensing element.
In one embodiment of this invention, above-mentioned colloid is filled between top surface and circuit board, and external force is suitable for passing through glue
Body and be transferred to detecting part.
In one embodiment of this invention, above-mentioned colloid includes the first glue material and the second glue material, and the first glue material is to being located at
Detecting part, the second glue material surround the first glue material.
In one embodiment of this invention, above-mentioned colloid includes third glue material, and third glue material is prolonged from circuit board toward bottom surface
It stretches and coats sensing element.
In one embodiment of this invention, above-mentioned circuit board has opening, is open to being located at detecting part, at least partly glue
Body is located in opening and suitable for receiving external force.
In one embodiment of this invention, above-mentioned colloid is stretched out from opening.
In one embodiment of this invention, above-mentioned circuit board is suitable for receiving external force.
In one embodiment of this invention, above-mentioned force sensing device further includes pressing piece, and pressing piece is configured at circuit board
Above and to being located at detecting part, pressing piece is suitable for receiving external force.
In one embodiment of this invention, above-mentioned force sensing device further includes signal processing unit, signal processing unit
It is configured at circuit board and is electrically connected at circuit board.
In one embodiment of this invention, above-mentioned circuit board is hard circuit board or flexible circuit board.
Existing circuit board arrangement is made into sense on the top surface of sensing element based on above-mentioned, of the invention force sensing device
The detecting part for surveying element is covered by circuit board.To which circuit board is in addition to play its electrical functionality, also can be used as covering sensing
Element and the structure for bearing pressing force.Accordingly, be not required in order to protect sensing element and above sensing element additional lid
Body, in the case where not increasing the integral thickness and manufacturing cost of force sensing device, to the sensing element of force sensing device into
Row is protected and it is maintained to sense performance.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to coordinate attached drawing to make
Carefully it is described as follows.
Description of the drawings
Fig. 1 is the sectional view of the force sensing device of one embodiment of the invention；
Fig. 2 is the vertical view of the circuit board of Fig. 1；
Fig. 3 is the sensing element of Fig. 1 and the vertical view of conductive bump；
Fig. 4 is the sectional view of the force sensing device of another embodiment of the present invention；
Fig. 5 is the sectional view of the force sensing device of another embodiment of the present invention；
Fig. 6 is the sectional view of the force sensing device of another embodiment of the present invention；
Fig. 7 is the sectional view of the force sensing device of another embodiment of the present invention；
Fig. 8 is the sectional view of the force sensing device of another embodiment of the present invention；
Fig. 9 is the sectional view of the force sensing device of another embodiment of the present invention；
Figure 10 is the sectional view of the force sensing device of another embodiment of the present invention；
Figure 11 A to Figure 11 C are the manufacturing flow charts of the force sensing device of one embodiment of the invention.
Reference sign：
100、200、300、400、500、600、700、800：Force sensing device
110、210、310、410、510、610、710、810：Sensing element
110a、210a、310a、410a、510a、610a、710a、810a：Top surface
110b、210b、310b、410b、510b、610b、710b、810b：Bottom surface
112、212、312、412、512、612、712、812：Detecting part
120、220、320、420、520、620、720、820：Circuit board
122：Peripheral part
124：Central portion
130、230、330、430、530、630、730、830：Conductive bump
240、340、440、540、640、740、840：Colloid
342、442、742：First glue material
344、444、744：Second glue material
446、746：Third glue material
550：Pressing piece
620a、720a：Opening
860：Signal processing unit
Specific implementation mode
Fig. 1 is the sectional view of the force sensing device of one embodiment of the invention.Referring to FIG. 1, the force sensing of the present embodiment
Device 100 is, for example, micro electronmechanical strength sensor and includes sensing element 110 and circuit board 120.Sensing element 110 has opposite
Top surface 110a and bottom surface 110b and there is detecting part 112, detecting part 112 is located at top surface 110a.Sensing element 110 can be pressure resistance type
Sensing element (piezoresistive sensing element), capacitance type sensing element (capacitive sensing
Element) or the sensing element of other appropriate types, the present invention limit not to this.Circuit board 120 is configured at sensing element
On 110 top surface 110a and it is electrically connected at sensing element 110a.The detecting part 112 of sensing element 110 is suitable for by from circuit
Plate 120 generates sensing signal toward the external force of the top surface 110a transmission of sensing element 110.Force sensing device 100 can be applied to have
The device for having touch function, to judge the touch-control power of user by its force sensing function.So the present invention not as
Limit, force sensing device 100 can be applied to other kinds of device.In addition, circuit board 120 can be hard circuit board or flexible circuit
Plate, the present invention also limit not to this.
Under above-mentioned configuration mode, existing circuit board 120 is configured at sensing element 110 by force sensing device 100
On the 110a of top surface, the detecting part 112 of sensing element 110 is made to be covered by circuit board 120.To which, circuit board 120 is in addition to playing
Its electrical functionality also can be used as covering sensing element 110 and bear the structure of pressing force.Accordingly, it is not required to protect sensing
Element 110 and above sensing element 110 additional lid, in the integral thickness and system for not increasing force sensing device 100
In the case of causing this, the sensing element 110 of force sensing device 100 is protected and it is maintained to sense performance.
The concrete structure of the force sensing device 100 of following more detailed description the present embodiment.Fig. 2 is bowing for the circuit board of Fig. 1
View.Fig. 3 is the sensing element of Fig. 1 and the vertical view of conductive bump.The circuit board 120 of the present embodiment wraps as shown in Figures 1 and 2
Peripheral part 122 and central portion 124 are included, central portion 124 is surrounded by peripheral part 122 and to being located at Fig. 1 and detecting part shown in Fig. 3
112.Force sensing device 100 further includes multiple conductive bumps 130, these conductive bumps 130 are configured at the top surface of sensing element 110
Between 110a and circuit board 120.Sensing element 110 supports the peripheral part 122 of circuit board 120 by these conductive bumps 130, and
It is electrically connected circuit board 120 by these conductive bump 130, the sensing signal is enable to be transferred to from sensing element 110
Circuit board 120.The central portion 124 of circuit board 120 is suitable for receiving external force, and the detecting part 112 of sensing element 110 is suitable for by from electricity
The central portion 124 of road plate 120 generates the sensing signal toward the external force of the top surface 110a transmission of sensing element 110.
Fig. 4 is the sectional view of the force sensing device of another embodiment of the present invention.In force sensing device 200 shown in Fig. 4,
Sensing element 210, top surface 210a, bottom surface 210b, detecting part 212, circuit board 220, the configuration of conductive bump 230 and the mode of action
The configuration of the sensing element 110, top surface 110a, bottom surface 110b, detecting part 112, circuit board 120, conductive bump 130 of similar Fig. 1
With the mode of action, repeated no more in this.Force sensing device 200 and the difference of force sensing device 100 are in force sensing device
200 further include colloid 240,240 covering part sensing element 210 of colloid.Specifically, colloid 240 is filled in sensing element 210
Top surface 210a and circuit board 220 between, external force be suitable for sensing element is sequentially transferred to by circuit board 220 and colloid 240
210 detecting part 212.Colloid 240 can be that the glue material of heat-curable glue, optic-solidified adhesive or other appropriate types cures, this hair
It is bright to be limited not to this.
Fig. 5 is the sectional view of the force sensing device of another embodiment of the present invention.In force sensing device 300 shown in Fig. 5,
Sensing element 310, top surface 310a, bottom surface 310b, detecting part 312, circuit board 320, conductive bump 330, colloid 340 configuration with
The mode of action is similar to the sensing element 210 of Fig. 4, top surface 210a, bottom surface 210b, detecting part 212, circuit board 220, conductive bump
230, the configuration of colloid 240 and the mode of action, repeat no more in this.Force sensing device 300 does not exist together with force sensing device 200
It is, colloid 340 includes the first glue material 342 and the second glue material 344, and the first glue material 342 is to the detecting part positioned at sensing element 310
312, the second glue material 344 surrounds the first glue material 342.Wherein, the hardness of the second glue material 344 is greater than the hard of the first glue material 342
Degree has preferable elastic deformability, external force is effectively transferred to sensing to which the first glue material 342 is more soft
The detecting part 312 of part 310.In addition, the second glue material 344 with larger hardness can firmly coated with conductive convex block 330.At other
In embodiment, the hardness of the second glue material 344 can be not more than the hardness of the first glue material 342, and the present invention limits not to this.First
Glue material 342 and the second glue material 344 can be that the glue material of heat-curable glue, optic-solidified adhesive or other appropriate types cures, the present invention
It is limited not to this.
Fig. 6 is the sectional view of the force sensing device of another embodiment of the present invention.In force sensing device 400 shown in Fig. 6,
Sensing element 410, top surface 410a, bottom surface 410b, detecting part 412, circuit board 420, conductive bump 430, colloid 440, the first glue
Material 442, the sensing element 310 of configuration Fig. 5 similar with the mode of action of the second glue material 444, top surface 310a, bottom surface 310b, sensing
Portion 312, circuit board 320, conductive bump 330, colloid 340, the first glue material 342, the configuration of the second glue material 344 and the mode of action,
It is repeated no more in this.Force sensing device 400 and the difference of force sensing device 300 are in colloid 440 further includes third glue material
446, bottom surface 410b of the third glue material 446 from circuit board 440 toward sensing element 410 extends and coats sensing element 410, to reach
Protect the effect of sensing element 410.Third glue material 446 can be that the glue material of heat-curable glue, optic-solidified adhesive or other appropriate types is solid
Change, the present invention limits not to this.
Fig. 7 is the sectional view of the force sensing device of another embodiment of the present invention.In force sensing device 500 shown in Fig. 7,
Sensing element 510, top surface 510a, bottom surface 510b, detecting part 512, circuit board 520, conductive bump 530, colloid 540 configuration with
The mode of action is similar to the sensing element 210 of Fig. 4, top surface 210a, bottom surface 210b, detecting part 212, circuit board 220, conductive bump
230, the configuration of colloid 240 and the mode of action, repeat no more in this.Force sensing device 500 does not exist together with force sensing device 200
It is, force sensing device 100 further includes pressing piece 550, and pressing piece 550 is configured on circuit board 520 and to being located at sensing element
510 detecting part 512, pressing piece 550 are suitable for receiving external force and external force being transferred to sensing by circuit board 520 and colloid 540
The detecting part 512 of element 510.
Fig. 8 is the sectional view of the force sensing device of another embodiment of the present invention.In force sensing device 600 shown in Fig. 8,
Sensing element 610, top surface 610a, bottom surface 610b, detecting part 612, circuit board 620, conductive bump 630, colloid 640 configuration with
The mode of action is similar to the sensing element 210 of Fig. 4, top surface 210a, bottom surface 210b, detecting part 212, circuit board 220, conductive bump
230, the configuration of colloid 240 and the mode of action, repeat no more in this.Force sensing device 600 does not exist together with force sensing device 200
It is, circuit board 620 has opening 620a, and 620a is to the detecting part 612 positioned at sensing element 610,640, part colloid for opening
It is stretched out in the opening 620a of circuit board 620 and from opening 620a.The colloid 640 stretched out from opening 620a is suitable for receiving outer
Power makes this external force be transmitted toward the top surface 610a of sensing element 610 from the opening 620a of circuit board 620 and reach detecting part 612.
Fig. 9 is the sectional view of the force sensing device of another embodiment of the present invention.In force sensing device 700 shown in Fig. 9,
Sensing element 710, top surface 710a, bottom surface 710b, detecting part 712, circuit board 720, conductive bump 730, colloid 740, the first glue
Material 742, the sensing element 310 of configuration Fig. 5 similar with the mode of action of the second glue material 744, top surface 310a, bottom surface 310b, sensing
Portion 312, circuit board 320, conductive bump 330, colloid 340, the first glue material 342, the configuration of the second glue material 344 and the mode of action,
It is repeated no more in this.The difference of force sensing device 700 and force sensing device 300 be in, circuit board 720 has opening 720a,
720a be open to the detecting part 712 positioned at sensing element 710, part colloid 740 (being shown as the first glue material 742 of part) is located at electricity
It is stretched out in the opening 720a of road plate 720 and from opening 720a.The colloid 740 stretched out from opening 720a is suitable for receiving external force,
This external force is set to be transmitted toward the top surface 710a of sensing element 710 from the opening 720a of circuit board 720 and reach detecting part 712.
Figure 10 is the sectional view of the force sensing device of another embodiment of the present invention.In force sensing device 800 shown in Fig. 10
In, sensing element 810, top surface 810a, bottom surface 810b, detecting part 812, circuit board 820, conductive bump 830, colloid 840 are matched
Set the sensing element 210 of Fig. 4 similar with the mode of action, top surface 210a, bottom surface 210b, detecting part 212, circuit board 220, conductive stud
Block 230, the configuration of colloid 240 and the mode of action, repeat no more in this.The difference of force sensing device 800 and force sensing device 200
It is in force sensing device 800 further includes signal processing unit 860, and signal processing unit 860 is configured at circuit board 820 and electricity
Property is connected to circuit board 820.Wherein, partially electronically conductive convex block 830 be configured between circuit board 820 and signal processing unit 860 with
Signal processing unit 860 is set to be electrically connected at circuit board 820, part colloid 840 is also configured at circuit board 820 and signal processing list
To coat the conductive bump 830 between member 860.The sensing signal of detecting part 812 from sensing element 810 can be via circuit
Plate 820 is transferred to processing unit 860, and carries out the processing such as conversion or filtering noise in processing unit 860.
Below by taking the force sensing device 700 of Fig. 9 as an example, pass through the manufacture for the force sensing device that attached drawing illustrates the present invention
Flow.Figure 11 A to Figure 11 C are the manufacturing flow charts of the force sensing device of one embodiment of the invention.First, it carries as shown in Figure 11 A
Conductive bump 730 is formed for the circuit board 720 with opening 720a, and in the downside of circuit board 720.Then, as shown in Figure 11 B
Sensing element 710 with detecting part 712 is connected to conductive bump 730.Then, it will include the first glue material 742 and the second glue
The colloid 740 of material 744 is formed between circuit board 720 and sensing element 710, and becomes force sensing device shown in Fig. 9
700.In addition, can also form the third glue material 746 of cladding sensing element 710 as shown in Figure 11 C.
In conclusion the present invention force sensing device by existing circuit board arrangement on the top surface of sensing element, make sense
The detecting part for surveying element is covered by circuit board.To which circuit board is in addition to play its electrical functionality, also can be used as covering sensing
Element and the structure for bearing pressing force.Accordingly, be not required in order to protect sensing element and above sensing element additional lid
Body, in the case where not increasing the integral thickness and manufacturing cost of force sensing device, to the sensing element of force sensing device into
Row is protected and it is maintained to sense performance.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
Middle technical staff, without departing from the spirit and scope of the present invention, when can make a little change with retouching, therefore the present invention protection
Subject to range ought be defined depending on claim.
Claims (13)
1. a kind of force sensing device, which is characterized in that including：
Sensing element, with an opposite top surface and a bottom surface and with a detecting part, wherein the detecting part is located at the top
Face；And
Circuit board is configured on the top surface and is electrically connected at the sensing element, wherein the detecting part be suitable for by from
The circuit board generates sensing signal toward the external force that the top surface is transmitted.
2. force sensing device according to claim 1, which is characterized in that the circuit board includes a peripheral part and a center
Portion, the central portion are surrounded by the peripheral part and to being located at the detecting part, and the sensing element supports the peripheral part, institute
Detecting part is stated to be suitable for generating sensing signal by the external force transmitted from the central portion toward the top surface.
3. force sensing device according to claim 1, which is characterized in that further include multiple conductive bumps, it is the multiple to lead
Electric convex block is configured between the top surface and the circuit board, and the sensing element passes through described in the support of the multiple conductive bump
Circuit board, and the circuit board is electrically connected by the multiple conductive bump.
4. force sensing device according to claim 1, which is characterized in that further include colloid, wherein the colloid covers
At least partly described sensing element.
5. force sensing device according to claim 4, which is characterized in that the colloid is filled in the top surface and the electricity
Between the plate of road, the external force is suitable for being transferred to the detecting part by the colloid.
6. force sensing device according to claim 4, which is characterized in that the colloid includes one first glue material and one second
Glue material, first glue material surround first glue material to being located at the detecting part, second glue material.
7. force sensing device according to claim 4, which is characterized in that the colloid includes a third glue material, and described the
Three glue materials extend from the circuit board toward the bottom surface and coat the sensing element.
8. force sensing device according to claim 4, which is characterized in that the circuit board has an opening, the opening
To being located at the detecting part, at least partly described colloid is located in the opening and suitable for receiving the external force.
9. force sensing device according to claim 8, which is characterized in that the colloid is stretched out from the opening.
10. force sensing device according to claim 1, which is characterized in that the circuit board is suitable for receiving the external force.
11. force sensing device according to claim 1, which is characterized in that further include a pressing piece, the pressing piece configuration
In on the circuit board and to being located at the detecting part, the pressing piece is suitable for receiving the external force.
12. force sensing device according to claim 1, which is characterized in that further include a signal processing unit, the signal
Processing unit is configured at the circuit board and is electrically connected at the circuit board.
13. force sensing device according to claim 1, which is characterized in that the circuit board is hard circuit board or soft
Circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710124490.XA CN108534924A (en) | 2017-03-03 | 2017-03-03 | Force sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710124490.XA CN108534924A (en) | 2017-03-03 | 2017-03-03 | Force sensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108534924A true CN108534924A (en) | 2018-09-14 |
Family
ID=63488552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710124490.XA Pending CN108534924A (en) | 2017-03-03 | 2017-03-03 | Force sensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108534924A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111473894A (en) * | 2019-01-24 | 2020-07-31 | 中光电智能感测股份有限公司 | Force sensor |
| US11105692B2 (en) | 2019-01-24 | 2021-08-31 | Coretronic Mems Corporation | Force sensor having first and second circuit board arrangements |
| WO2021199755A1 (en) * | 2020-03-31 | 2021-10-07 | オムロン株式会社 | Tactile sensor sheet |
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| WO2021199755A1 (en) * | 2020-03-31 | 2021-10-07 | オムロン株式会社 | Tactile sensor sheet |
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Effective date of registration: 20191008 Address after: 6 / F, 10 / F, No.65, high speed rail No.7 Road, Zhubei City, Hsinchu County, Taiwan, China Applicant after: China optoelectronic intelligent sensing Co., Ltd. Address before: PO Box 2804 Grand Cayman ky1-1112 4f, Vero tower, quezit square Applicant before: British Cayman Islands Business Intelligence global Limited by Share Ltd |
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Application publication date: 20180914 |
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