TWI493585B - Keyboard - Google Patents

Description

keyboard

The invention relates to a keyboard, in particular to a keyboard comprising a micro electromechanical pressure sensing module.

As the use of electronic products has become more widespread, the demand for various input devices has also increased. As an important input device, the keyboard is widely used in electric toys, electronic game machines, computers, pianos and other products. In order to achieve better human-computer interaction, the requirements for sensitivity and reliability of the keyboard are constantly increasing.

The pressure sensing module is a core component of the keyboard, and the information is input by sensing the magnitude and position of the pressure applied to the button by the outside world. Previous pressure sensing modules typically used a metal strain gauge pressure sensor to sense the magnitude and position of the pressure applied to the button. The change in the magnitude or position of the pressure causes the strain gauge of the metal to deform and change the capacitance or resistance of the pressure sensor. The processing circuit outputs the analog signal, and the subsequent differential amplifier circuit and the A/D conversion circuit output the digital signal to the subsequent one. Actuator or display unit. However, a capacitive or resistive strain sensor has poor sensitivity and reliability, and cannot accurately acquire the magnitude and exact position of the pressure applied to the button, and the response speed is slow.

In view of this, it is necessary to provide a keyboard with higher sensitivity and reliability and a faster response speed.

A keyboard will be described below in a specific embodiment.

A keyboard includes a button, an upper cover, a lower cover, and a MEMS pressure sensing module between the upper cover and the lower cover. The button has a first surface and a second surface opposite to each other, wherein the first surface is a surface to which external pressure is applied. The MEMS pressure sensing module includes a MEMS pressure sensor, a connecting pipe, and a pressure sensing capsule that abuts against the second surface of the button. The pressure sensing capsule has an opening that connects the opening to the MEMS pressure sensor to cause the MEMS pressure sensor to sense the pressure applied by the pressure sensing capsule and generate a corresponding pressure sensing signal. The MEMS pressure sensor includes a package housing and a circuit board, a pedestal, a diaphragm, and two electrodes encapsulated within the package housing. The package housing has an opening opposite to the diaphragm. The circuit board is connected to the two electrodes. The pedestal is disposed on the circuit board. The base is provided with a through hole. The via includes a first portion that is adjacent to the circuit board and has a constant diameter, and a second portion that is progressively larger in diameter from the circuit board. The diaphragm is disposed adjacent to the first portion of the through hole and the second portion. The diaphragm is used to sense the pressure from the pressure sensing bladder.

Compared with the prior art, the keyboard of the present technical solution uses the MEMS pressure sensor and the pressure sensing capsule to sense the pressure received by the button, thereby improving the sensitivity and reliability of the pressure sensing; and, due to the pressure sensing capsule Directly attached to the button, and the MEMS pressure sensor is directly connected to the opening of the pressure sensing capsule, so that the MEMS pressure sensor can quickly sense the change of the button pressure, thereby improving the keyboard Response speed.

100‧‧‧ keyboard

11‧‧‧ button

12‧‧‧Upper cover

13‧‧‧Under the cover

20‧‧‧Microelectromechanical pressure sensing module

101‧‧‧ first surface

102‧‧‧ second surface

103‧‧‧ Groove

22‧‧‧pressure sensing capsule

24‧‧‧Microelectromechanical pressure sensor

26‧‧‧Connecting pipes

201‧‧‧ first side

202‧‧‧ second side

203‧‧‧ side

222‧‧‧ openings

241‧‧‧Package

242‧‧‧Circuit board

243‧‧‧Base

244‧‧‧Vibration membrane

245‧‧‧Two electrodes

205‧‧‧through hole

2051‧‧‧Part 1

2052‧‧‧Part II

2441‧‧‧CNT film

2442‧‧‧Organic protective film

2412‧‧‧Opening

FIG. 1 is a schematic diagram of a combination of keyboards provided by embodiments of the present technical solution.

FIG. 2 is an exploded schematic view of a keyboard provided by an embodiment of the present technical solution.

FIG. 3 is a schematic diagram of a sensing principle of a keyboard provided by an embodiment of the present technical solution.

The keyboard of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.

Referring to FIG. 1-3 , the keyboard 100 provided by the embodiment of the present invention includes a button 11 , an upper cover 12 , a lower cover 13 , and a micro electromechanical pressure sensing module 20 .

The upper cover 12 and the lower cover 13 are provided with corresponding grooves 103. The groove 103 is configured to receive the MEMS pressure sensing module 20 .

The plurality of keys 11 are provided on the side of the upper cover 12. Each button 11 has a first surface 101 and a second surface 102 opposite thereto. The first surface 101 is a surface for applying pressure to the outside, and the second surface 102 abuts against the MEMS pressure sensing module 20 between the upper cover 12 and the lower cover 13. In this embodiment, the plurality of buttons 11 correspond to a MEMS pressure sensing module 20 . In other alternative embodiments, the number of the buttons 11 may be one or plural as needed. A microelectromechanical pressure sensing module 20 can also be separately provided for each button 11 .

The MEMS pressure sensing module 20 includes a pressure sensing capsule 22, a microelectromechanical pressure sensor 24, and a connecting conduit 26.

The pressure sensing capsule 22 is disposed on the second surface 102 of the button 11 . The pressure sensing bladder 22 has an opening 222. Specifically, the pressure sensing capsule 22 has a first surface 201 and a second surface 202 that are opposite to each other, and a side surface 203 that connects the first surface 201 and the second surface 202. The sum of the areas of the first surface 201 and all of the second surfaces 102 of the plurality of keys 11 is equal in magnitude. The first side 201 of the pressure sensing capsule 22 is in engagement with the second surface 102 of the button 11. The opening 222 is provided on the side 203 of the pressure sensing capsule 22. This implementation In the mode, the contour of the pressure sensing capsule 22 is approximately a flat rectangular parallelepiped. An opening 222 is defined in one side 203 of the pressure sensing capsule 22. Of course, an opening 222 may be formed on the four sides 203 of the pressure sensing capsule 22 for the purpose of pressure sensing. The pressure sensing bladder 22 is formed of an elastic material such as rubber.

The pressure sensing bladder 22 houses a gas or liquid of a predetermined capacity. When the pressure sensing capsule 22 is compressed and compressed, the corresponding position on the first surface 201 is deformed accordingly. In addition, according to the requirements of the specific keyboard 100, the type of the gas or liquid contained in the pressure sensing capsule 22 and the predetermined capacity may be different, so that the user may feel softer or harder when pressing the button 11, satisfying the user. Different needs for the touch of the button 11.

The microelectromechanical pressure sensor 24 is used to sense the pressure to which the pressure sensing capsule 22 is subjected. In the embodiment, the MEMS pressure sensor 24 includes a package housing 241 and a circuit board 242, a pedestal 243, a diaphragm 244 and two electrodes 245 encapsulated in the package housing 241. The package housing 241 defines an opening 2412 opposite to the diaphragm 244.

The circuit board 242 is connected to the two electrodes 245. The circuit board 242 has a processing unit (not shown) that converts the change of the diaphragm 244 into a corresponding electrical signal output.

The pedestal 243 is disposed on the circuit board 242. The base 243 is provided with a through hole 205. The via 205 includes a first portion 2051 that is adjacent to the circuit board 242 and has a constant diameter, and a second portion 2052 that is progressively larger in diameter from the circuit board 242.

The diaphragm 244 is disposed adjacent to the first portion 2051 and the second portion 2052 for sensing the pressure from the pressure sensing bladder. The diaphragm 244 is made of carbon nano The rice tube film 2441 and the organic protective film 2442 located on opposite sides of the carbon nanotube film 2441 are formed. The carbon nanotube film 2441 can be drawn from the super-aligned carbon nanotube array. Both ends of the carbon nanotube film 2441 are respectively connected to the two electrodes 245. The plurality of carbon nanotubes in the carbon nanotube film 2441 are arranged in parallel with each other, and the axial direction of the carbon nanotubes is parallel to the direction in which the two electrodes 245 are connected. The organic protective film 2442 is used to block the passage of liquid and gas. The pressure change on the diaphragm 244 causes the carbon nanotubes in the carbon nanotube film 2441 to be deformed in the axial direction, so that the resistance of the carbon nanotube film 2441 changes. The change in resistance corresponds to the corresponding pressure signal.

The connecting conduit 26 connects the opening 222 with the MEMS pressure sensor 24 to cause the MEMS pressure sensor 24 to sense the pressure to which the pressure sensing capsule 22 is subjected. Specifically, the opening 222 of the pressure sensing capsule 22 communicates with the opening 2412 of the package housing 241 via the connecting conduit 26, thereby making the pressure sensing capsule 22, the connecting conduit 26, and the through hole of the MEMS pressure sensor 24. The second portion 2052 of the second portion 205 forms a space for mutual communication to transmit the pressure received by the pressure sensing bladder 22 to the diaphragm 244.

When external pressure is applied to the button 11, the volume and surface shape of the pressure sensing bladder 22 are correspondingly changed and pressure is transmitted to the MEMS pressure sensor 24 through the connecting conduit 26. The MEMS pressure sensor 24 generates a corresponding pressure sensing signal, and the pressure sensing signal is a corresponding resistance change of the carbon nanotube film 2441. The circuit board 242 connected to the two electrodes 245 acquires a corresponding resistance change of the carbon nanotube film 2441, and converts the resistance change into an electrical signal output through the processing unit. Moreover, the circuit board 242 can output the electrical signal to a display unit (not shown) or an actuator (not shown) to obtain a corresponding display result or perform an action.

In addition, corresponding to a pressure sensing capsule 22, a plurality of microelectromechanical pressure sensors 24 connected thereto can be disposed to sense the pressure magnitude and position of a button 11 being depressed in multiple directions, and integrated by the circuit board 242. The processing unit comprehensively calculates and analyzes the corresponding pressure signal into an electrical signal output, thereby further improving the sensitivity and reliability of the sensing.

Compared with the prior art, the keyboard of the present technical solution uses the MEMS pressure sensor and the pressure sensing capsule to sense the pressure received by the button, thereby improving the sensitivity and reliability of the pressure sensing; and, due to the pressure sensing capsule Directly attached to the button, and the MEMS pressure sensor is directly connected to the opening of the pressure sensing capsule, so that the MEMS pressure sensor can quickly sense the change of the button pressure, thereby improving the keyboard Response speed.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧ keyboard

11‧‧‧ button

12‧‧‧Upper cover

13‧‧‧Under the cover

20‧‧‧Microelectromechanical pressure sensing module

103‧‧‧ Groove

22‧‧‧pressure sensing capsule

24‧‧‧Microelectromechanical pressure sensor

26‧‧‧Connecting pipes

201‧‧‧ first side

202‧‧‧ second side

203‧‧‧ side

Claims (9)

A keyboard includes a button, an upper cover, a lower cover, and a MEMS pressure sensing module between the upper cover and the lower cover, the button having a first surface and a second surface opposite to each other, wherein the first surface is applied by external pressure The MEMS pressure sensing module includes a MEMS pressure sensor, a connecting pipe, and a pressure sensing capsule abutting the second surface of the button, the pressure sensing bag having an opening, the connecting pipe connecting the opening and the a microelectromechanical pressure sensor to sense the pressure of the pressure sensing capsule and generate a corresponding pressure sensing signal, the microelectromechanical pressure sensor comprising a package housing and being packaged in the package a circuit board, a base, a diaphragm and two electrodes in the outer casing, the package housing is provided with an opening opposite to the diaphragm, the circuit board is connected to the two electrodes, and the base is disposed on the circuit board The base is provided with a through hole including a first portion adjacent to the circuit board and having a constant diameter, and a second portion away from the circuit board and gradually increasing in diameter, the diaphragm is disposed A first portion adjacent the second portion of the through hole, the diaphragm from the pressure sensor for sensing pressure of the balloon. The keyboard of claim 1, wherein the upper cover and the lower cover are provided with corresponding grooves for receiving the MEMS pressure sensing module. The keyboard of claim 1, wherein the pressure sensing capsule has parallel first and second faces, and a side connecting the first surface and the second surface, the first of the pressure sensing capsules The surface is adhered to the second surface of the button, and the second surface of the pressure sensing capsule is attached to the lower cover. The keyboard of claim 3, wherein the opening is open to the side of the pressure sensing capsule. The keyboard of claim 3, wherein the pressure sensing capsule has four sides, and an opening is formed on each of four sides of the pressure sensing capsule. The keyboard of claim 1, wherein the diaphragm is made of a carbon nanotube film and The organic protective film is disposed on opposite sides of the carbon nanotube film for blocking the passage of liquid and gas and protecting the carbon nanotube film. The keyboard of claim 6, wherein the two ends of the carbon nanotube film are respectively connected to the two electrodes, and the plurality of carbon nanotubes in the carbon nanotube film are arranged in parallel with each other, and the carbon nanotubes are arranged The axial direction is parallel to the line connecting the two electrodes. The keyboard of claim 7, wherein the circuit board has a processing unit, wherein the circuit board acquires a corresponding resistance change of the carbon nanotube film, and converts the resistance value into a telecommunication through the processing unit. Number output. The keyboard of claim 1, wherein the opening of the pressure sensing capsule communicates with the opening of the package housing via a connecting pipe, thereby making the pressure sensing capsule, the connecting pipe, and the MEMS pressure sensor The second part of the through hole forms a space for mutual communication, thereby transmitting the pressure of the pressure sensing capsule to the diaphragm.