CN207560279U - Earphone and electronic equipment - Google Patents
Earphone and electronic equipment Download PDFInfo
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- CN207560279U CN207560279U CN201721609709.7U CN201721609709U CN207560279U CN 207560279 U CN207560279 U CN 207560279U CN 201721609709 U CN201721609709 U CN 201721609709U CN 207560279 U CN207560279 U CN 207560279U
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Abstract
This application discloses a kind of earphone and electronic equipments.The earphone includes：Multiple pressure sensors, the multiple pressure sensor includes first pressure sensor set, the first pressure sensor set includes one or more pressure sensors, and what the pressure sensor in the first pressure sensor set was set to the earphone enters lug areas；Processing unit, for controlling the earphone according to the pressure signal of the multiple pressure sensor.The technical solution of the embodiment of the present application can promote user experience.
Description
Technical Field
The utility model relates to the field of information technology, and more specifically relates to an earphone and electronic equipment.
Background
When a person uses an earphone, such as listening to music, broadcasting or books, the playing is paused if the person needs to communicate with the earphone, and the playing is continued after the communication. In the existing headset configurations, this function is typically implemented with mechanical buttons.
However, the above-described mechanical button solution is less convenient in experience. In addition, after the earphone is pulled out, if the earphone is not detected, the mobile phone is continuously connected with the earphone; when an important telephone is accessed, the ring tone only sounds in the earphone, so that the user misses the important telephone, unnecessary troubles are caused to the user, and the user experience is influenced.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an earphone and an electronic device, which can improve user experience.
In a first aspect, a headset is provided, comprising:
a plurality of pressure sensors, the plurality of pressure sensors including a first set of pressure sensors including one or more pressure sensors, the pressure sensors of the first set of pressure sensors being disposed in an in-ear region of the earphone;
and the processing unit is used for controlling the earphone according to the pressure signals of the plurality of pressure sensors.
In the embodiment of the application, the earphone is controlled according to the pressure signal of the pressure sensor in the ear entering area of the earphone, so that manual control of a user is not needed, and user experience can be improved.
In some possible implementations, the plurality of pressure sensors are disposed in at least two different areas of the headset.
By arranging a plurality of pressure sensors in different areas, a multi-dimensional pressure signal can be obtained. Furthermore, various operations can be realized according to signals of a plurality of pressure sensors, and user experience is further improved.
In some possible implementations, the pressure sensors of the first set of pressure sensors are disposed at an ear bud, a stem, or a barrel of the headset in the ear region.
In some possible implementation manners, pressure sensors in the first pressure sensor set can be arranged on a deformation reinforcing structure of an ear entering region of the earphone, convex strips are arranged on grooves of the earphone column, and after the grooves and other structures are attached by the large-deformation adhesive such as foam cotton glue, the deformation can be amplified structurally to enable the pressure sensors to obtain larger signal quantity, so that the performance is optimized.
In some possible implementations, the plurality of pressure sensors further includes:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
In some possible implementations, the pressure sensors of the second set of pressure sensors are disposed at a headset sleeve of a handheld region of the headset.
The pressure sensors in the ear-entering area and the handheld area can respectively acquire a handheld pressure signal and an ear-entering pressure signal when the earphone is worn, namely, the pressure signals of two dimensions are acquired, and the wearing state of the earphone can be accurately determined.
In the embodiment of the application, the wearing state of the earphone can be accurately judged through the signals of the pressure sensors in the ear entering area and the hand-held area, so that corresponding operation can be executed corresponding to the wearing state of the earphone, manual control of a user is not needed, and the user experience can be improved. In addition, the earphone structure and the sensing system of the embodiment of the application are simpler, so that the cost is lower.
In some possible implementations, a touch convex structure, a touch concave structure, or a touch particle point is disposed on an outer side surface of an area of the earphone sleeve where the pressure sensor is disposed.
In some possible implementations, the plurality of pressure sensors are disposed at a plurality of locations: the earphone is characterized in that the earphone is arranged on the inner side surface of the shell structure of the earphone, on the outer side surface of the shell structure of the earphone or in the material of the shell structure of the earphone.
In some possible implementations, three pressure sensors of the same area may be arranged on the inner side of the housing structure of the headset, on the outer side of the housing structure of the headset and in the material of the housing structure of the headset, respectively. The three sensors form a multi-lamination sensing structure to form a triple pressure sensor, and a pressure signal with higher dimensionality can be acquired. In addition to the improvement of the accuracy of determining the wearing state of the headphone, operations such as tapping, pressing, shaking (shaking) and the like can be realized.
In some possible implementations, the triplex pressure sensors in multiple different locations may form a pressure sensing network system. The signals of the pressure sensing network system can be expanded and more abundant application can be realized after the signals are processed by the software algorithm of the processing unit.
In some possible implementations, the first set of pressure sensors includes resistive pressure sensors of a bridge structure, where resistances of two legs of the resistive pressure sensors of the bridge structure that are adjacent in a bridge are disposed on different sides of a housing structure of the headset.
In some possible implementations, the headset further includes an infrared sensor and/or a capacitive sensor.
The pressure sensor may be used in combination with other types of sensors, such as infrared sensors or capacitive sensors, to further improve the accuracy of determining the wearing state of the headset.
In a second aspect, an electronic device is provided, comprising: the headset of the first aspect or any possible implementation thereof.
Drawings
Fig. 1 is a schematic diagram of a capacitive pressure sensor according to an embodiment of the present application.
Fig. 2 is a schematic diagram of a resistive pressure sensor according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a bridge resistive pressure sensor according to an embodiment of the present application.
Fig. 4 is a schematic block diagram of a headset of an embodiment of the present application.
Fig. 5 a-8 b are schematic views of the arrangement area of the pressure sensor according to the embodiment of the present application.
Fig. 9 and 10 are schematic views of the arrangement positions of the pressure sensors according to the embodiment of the present application.
Fig. 11 and 12 are schematic views of an arrangement of a plurality of pressure sensors according to an embodiment of the present application.
Fig. 13 and 14 are schematic diagrams of a triple pressure sensor according to an embodiment of the present application.
FIG. 15 is a schematic diagram of a pressure sensing network system according to an embodiment of the present application.
Fig. 16 and 17 are schematic views showing the arrangement of the bridge type resistive pressure sensor according to the embodiment of the present application.
Fig. 18 to 20 are schematic diagrams of the headphone processing flow according to the embodiment of the present application.
Fig. 21 is a flowchart illustrating a process of inserting a headphone into an ear according to an embodiment of the present application.
Fig. 22 is a flowchart of a process of earphone-out of the ear according to an embodiment of the present application.
Fig. 23 is a schematic diagram of an outer side design of an earphone sleeve according to an embodiment of the present application.
Fig. 24 and 25 are schematic views of the arrangement of the pressure sensor and the infrared sensor or the capacitance sensor according to the embodiment of the present application.
FIG. 26 is a schematic diagram of a capacitive sensor according to an embodiment of the present application.
Fig. 27 is a schematic flowchart of a method of detecting a wearing state of a headset according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
The technical solution of the embodiment of the present application may be applied to earphones of various forms, for example, in-ear earphones or ear plugs, but the embodiment of the present application is not limited thereto.
The pressure sensor in the embodiment of the present application may be a capacitive pressure sensor or a resistive pressure sensor, but the embodiment of the present application is not limited thereto.
The capacitive pressure sensor, which may also be referred to as a pressure-capacitance sensor, has the principle as shown in fig. 1, that when pressure is applied to the plate 12, the pressure causes the distance between the capacitors 21 between the two plates 11 and 12 to change, thereby changing the value of the capacitance. The pressure of different sizes produces different capacitance value changes, converts the change volume of this capacitance value into the electrical signal, measures the change of this signal through detecting the chip and can detect the size of corresponding pressure.
The resistance-type pressure sensor can also be called a piezoresistive sensor, and the principle of the resistance-type pressure sensor is as shown in fig. 2, the resistance-type pressure sensor 22 is arranged on a certain to-be-detected stressed surface, and the stressed carrier 13 is stressed to deform, so as to press or stretch the resistance-type pressure sensor 22, and accordingly the resistance value of the resistance-type pressure sensor changes accordingly. Different pressure size produces different resistance changes, detects this resistance change through detecting the chip and can detect corresponding dynamics size.
As shown in fig. 3, combining four independent resistive pressure sensors into a bridge topology, i.e., forming a bridge resistive pressure sensor, can achieve temperature drift suppression at a hardware level.
Fig. 4 shows a schematic block diagram of a headset 400 of an embodiment of the application.
As shown in fig. 4, the headset 400 includes a plurality of pressure sensors 410 and a processing unit 420.
A plurality of pressure sensors 410 are used to acquire pressure signals.
The plurality of pressure sensors 410 may include:
a first set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the first set of pressure sensors being disposed in an in-ear region of the earpiece.
The pressure sensor 410 may be a capacitive pressure sensor or a resistive pressure sensor, which is not limited in this application.
The processing unit 420 is used for controlling the earphone according to the pressure signals of the plurality of pressure sensors.
For example, the processing unit 420 may determine the wearing state of the earphone according to the pressure signals of the plurality of pressure sensors, and implement a control function, such as play control, according to the wearing state of the earphone; alternatively, a control function, for example, a key function, is implemented directly according to the pressure signals of the plurality of pressure sensors, which is not limited in the embodiment of the present application.
Optionally, the wearing state of the headset may include that the headset is not worn, the headset is worn into the ear, the headset is taken out of the ear, whether the headset is worn well (for example, wearing level) when the headset is worn, and the like, but the embodiment of the present application is not limited thereto.
Alternatively, the processing unit 420 may be specifically a processor, a processing chip or a detection chip.
The pressure sensor arranged in the ear-entering area can be used for detecting the pressure signal in the process of the earphone entering or exiting the ear. Deformation generated when the earphone is worn into the ear is conducted to the pressure sensor in the ear entering area step by step through the earphone structure, the deformation generated by pressure can be maintained all the time after the earphone is worn into the ear, and the pressure sensor also keeps corresponding signal quantity to finish in-ear wearing detection; when the earphone is out of the ear, the deformation can be recovered, the pressure sensor in the ear area can correspondingly release the signal quantity, and the detection of out-of-the-ear is completed.
In the embodiment of the application, the wearing state of the earphone is determined according to the pressure signal of the pressure sensor in the ear entering area of the earphone, so that corresponding operation can be executed corresponding to the wearing state of the earphone, manual control of a user is not needed, and user experience can be improved.
Optionally, in one embodiment of the present application, the plurality of pressure sensors 410 may be disposed in at least two different areas of the earphone.
By arranging the plurality of pressure sensors in different areas, a multi-dimensional pressure signal can be obtained, so that the accuracy of determining the wearing state of the headset can be improved. Furthermore, various operations can be realized according to signals of a plurality of pressure sensors, and user experience is further improved.
Alternatively, in one embodiment of the present application, the pressure sensor 410 may be disposed at a plurality of locations in the in-ear region of the earphone. For example, the pressure sensor 410 may be provided at an ear plug, a headphone post, or a headphone barrel of the in-ear region of the headphone.
As shown in fig. 5a, 6a and 7a, for an in-ear headphone, the pressure sensor 410 may be provided at an ear plug 510, a headphone post 520 or a headphone barrel 530 at the in-ear region of the headphone.
Alternatively, the pressure sensor 410 may be arranged on a deformation enhancing structure of the in-ear region of the earphone. For example, as shown in fig. 6b and 6c, a convex strip 521 or a concave groove 522 may be disposed on the concave portion of the earphone post 520, and then the pressure sensor 410 is attached with an adhesive 610 having a large deformation, such as foam cotton, so that the deformation may be structurally amplified to enable the pressure sensor to obtain a larger signal amount, thereby optimizing performance.
As shown in fig. 8a, for an earbud headphone (which may also be referred to as an earbud), the pressure sensor 410 may be located at an earbud 810 of the in-ear region of the headphone.
Optionally, in an embodiment of the present application, the plurality of pressure sensors 410 further includes:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
Another area where the pressure sensor 410 is located may be a hand-held area of the headset. For example, the pressure sensor 410 may be disposed at a headset sleeve of a handheld region of a headset.
As shown in fig. 5b, 6d and 7b, for an in-ear headphone, the pressure sensor 410 may be provided at the headphone sleeve 540 of the handheld area of the headphone.
As shown in fig. 8b, for an ear bud headphone, the pressure sensor 410 may be located at the headphone sleeve 840 in the hand-held area of the headphone.
Alternatively, in one embodiment of the present application, the pressure sensor 410 may be disposed on an inner side of the housing structure of the headset, on an outer side of the housing structure of the headset, or in the material of the housing structure of the headset.
For example, for the hand-held area, as shown in fig. 9, the pressure sensor 410 may be attached to the inner side of the housing structure of the earphone sleeve by an adhesive 910 (e.g., foam), or the pressure sensor 410 may be disposed in the material of the housing structure of the earphone sleeve by injection molding or the like, or the pressure sensor 410 may be directly printed or attached to the outer side of the housing structure of the earphone sleeve by an adhesive.
Similarly, for the ear entry area, as shown in fig. 10, the pressure sensor 410 may be attached to the inner side of the shell structure of the earplug, the earpiece post or the earpiece barrel by means of an adhesive 910, or the pressure sensor 410 may be disposed in the material of the shell structure of the earplug, the earpiece post or the earpiece barrel by means of injection molding or the like, or the pressure sensor 410 may be printed directly or attached to the outer side of the shell structure of the earplug, the earpiece post or the earpiece barrel by means of an adhesive.
For the pressure sensor in the handheld area, when external handheld force is applied, pressure is transmitted to the pressure sensor, and a corresponding pressure signal can be obtained.
For the pressure sensor in the ear-entering area, when the earplug is inserted into the ear, pressure is generated and transmitted to the pressure sensor, and a corresponding pressure signal can be obtained.
It should be understood that the pressure sensor 410 may be disposed in other areas of the earphone besides the ear insertion area and the hand-held area, which is not limited by the embodiment of the present application.
Alternatively, in one embodiment of the present application, a plurality of pressure sensors 410 may be provided for one area. For example, as shown in fig. 11 and 12, a plurality of pressure sensors 410 may be provided in the hand-held region (fig. 11) and the ear-insertion region (fig. 12).
Alternatively, in one embodiment of the present application, three pressure sensors 410 of the same area may be disposed on the inner side of the housing structure of the earphone, on the outer side of the housing structure of the earphone and in the material of the housing structure of the earphone, respectively, as shown in fig. 13 (hand-held area) and fig. 14 (in-ear area). The three sensors form a multi-lamination sensing structure to form a triple pressure sensor, and a pressure signal with higher dimensionality can be acquired. In addition to the improvement of the accuracy of determining the wearing state of the headphone, operations such as tapping, pressing, shaking (shaking) and the like can be realized.
Alternatively, in one embodiment of the present application, a plurality of triplex pressure sensors in different locations may form a pressure sensing network system. For example, fig. 15 shows an eight-unit sensor network system composed of a plurality of triple pressure sensors, which is configured such that eight triple pressure sensors are respectively arranged at eight positions in an ear insertion region, multiple dimensional pressure information at different positions is obtained to form the pressure sensor network system, and signals of the pressure sensor network system are processed by a software algorithm of a processing unit, so that richer applications can be extended.
Optionally, in an embodiment of the present application, the first set of pressure sensors includes a resistive pressure sensor of a bridge structure, where resistances of two adjacent bridge arms in a bridge in the resistive pressure sensor of the bridge structure are disposed on different sides of a housing structure of the earphone.
For example, as shown in fig. 16, the pressure sensor 410 is a resistance type pressure sensor in a bridge structure, and is composed of resistors 41,42,43 and 44 of four bridge arms in the figure, wherein the resistor 41 is connected in series with the resistor 44, and the resistor 42 is connected in series with the resistor 43. When placed on the earpiece post of the headset, resistors 41 and 43 are on the outside and resistors 42 and 44 are on the inside. Fig. 16 is a schematic diagram of the pressure sensor after being unfolded around the earphone post. When the earphone silica gel is sleeved in the ear to squeeze the piezoresistive sensor wrapping the whole earphone post, the resistance 41 and the resistance 43 positioned on the outer side and the resistance 42 and the resistance 43 positioned on the inner side are deformed in opposite directions under stress, so that the change directions of the resistances are opposite. It can be seen from the circuit diagram IN fig. 16 that when the resistances of two different planes are changed oppositely, the voltages IN + and IN-can obtain the largest input differential signal, and the optimal performance is achieved.
In another example, as shown in fig. 17, the pressure sensor 410 disposed on the earphone barrel of the earphone has a circular arc-shaped profile. Resistors 41 and 43 are located on the outside and resistors 42 and 44 are located on the inside. Similarly, when the earphone silicone rubber is inserted into the ear, the resistance 41 and the resistance 43 located outside and the resistance 42 and the resistance 43 located inside are deformed in opposite directions by force, so the resistance change directions are also opposite. It can be seen from the circuit diagram IN fig. 17 that when the resistances of two different planes are changed oppositely, the voltages IN + and IN-can obtain the largest input differential signal, and the optimal performance is achieved.
Optionally, in an embodiment of the present application, if one or more pressure sensors in the first set of pressure sensors do not acquire a pressure signal, it is determined that the headset is not worn.
Optionally, in an embodiment of the present application, the processing unit 420 may determine the wearing state of the earphone according to the pressure signals acquired by one or more pressure sensors in the first pressure sensor set and the pressure signals acquired by one or more pressure sensors in the second pressure sensor set.
As shown in fig. 18, the pressure signals of the pressure sensor 410 in the handheld area and the pressure sensor 410 in the ear area are jointly transmitted to the processing unit 420, and the processing unit 420 can determine whether the earphone is worn or not through a software algorithm.
Alternatively, as shown in fig. 19, if the pressure sensors 410 are disposed in other regions, the pressure signals of the pressure sensors 410 in each region are jointly transmitted to the processing unit 420, so as to further improve the accuracy of the processing unit 420 in determining whether the earphone is worn or not.
Alternatively, as shown in fig. 20, if a plurality of pressure sensors 410 are provided for each area, and the pressure signals of the pressure sensors 410 of the respective areas are jointly transmitted to the processing unit 420, the processing unit 420 may determine whether the headset is worn or not through a software algorithm. In addition, the processing unit 420 may also implement other functions, such as heart rate monitoring, step counting, etc., according to signals of multiple pressure sensors 410 in the same area, thereby further improving user experience. Optionally, the processing unit 420 may also implement other functions, such as heart rate monitoring, etc., in combination with signals of other sensors in the system, such as an acceleration sensor, so as to further enhance the user experience.
The pressure sensors 410 in the ear-entering area and the hand-held area respectively acquire a hand-held pressure signal and an ear-entering pressure signal when the earphone is worn, that is, acquire two-dimensional pressure signals, so that the wearing state of the earphone can be accurately determined.
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the headset according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set, and it is determined that pressure exists in the ear entrance area of the headset according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the headset is worn into the ear.
Specifically, the pressure sensor of the handheld area detects a pressure signal indicating that the handheld area is touched (touch), and the pressure sensor of the in-ear area detects a pressure signal indicating that the in-ear area is touch, which in combination can determine that the headset is worn in the ear.
Optionally, in an embodiment of the present application, the processing unit 420 may further perform an operation associated with the headset being worn into the ear when it is determined that the headset is worn into the ear.
For example, when it is determined that the headset is worn in the ear, playing may be performed, or a device to which the headset is connected, such as a cell phone, may be notified so that the cell phone selects the headset to play, and so on.
Fig. 21 shows a flowchart of the process of inserting the earphone into the ear. It should be understood that fig. 21 is only an example and should not be taken as limiting the embodiments of the present application.
2110, pressure sensors of a plurality of areas detect pressure.
The plurality of pressure zones includes a hand-held zone and an in-ear zone.
2120, it is determined whether the handheld area is touched.
And determining whether the handheld area is touched or not through signals of the pressure sensors of the handheld area. If yes, 2130 is executed; if not, returning to the initial step.
2130, determining whether the in-ear area is touched.
After determining that the handheld area is touched, further determining whether the in-ear area is touched through a signal of the pressure sensor of the in-ear area. If yes, go to 2140; if not, returning to the initial step.
2140, the in-ear detection is completed, and the relevant operation is executed.
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set, and it is determined that pressure in the ear entrance area of the earphone disappears according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the earphone is taken out of the ear.
Specifically, the pressure sensor in the handheld area detects that the pressure signal indicates that the handheld area is touch, and then the pressure in the ear area disappears to determine that the earphone is taken out of the ear.
Optionally, in an embodiment of the present application, the processing unit 420 may further perform an operation associated with the earphone being taken out of the ear when it is determined that the earphone is taken out of the ear.
For example, when it is determined that the earphone is taken out of the ear, the playing may be paused, or a device to which the earphone is connected, such as a mobile phone, may be notified to pause the playing of the mobile phone or select the speaker of the mobile phone to play, etc.
Fig. 22 shows a process flow diagram for earphone-out-of-ear. It should be understood that fig. 22 is only an example and should not be taken as limiting the embodiments of the present application.
2210, pressure sensors of a plurality of areas detect pressure.
The plurality of pressure zones includes a hand-held zone and an in-ear zone.
2220, determining whether the hand-held area is touched.
And determining whether the handheld area is touched or not through signals of the pressure sensors of the handheld area. If yes, 2130 is executed; if not, returning to the initial step.
2230, determining if the pressure in the ear area has disappeared.
After the handheld area is determined to be touched, whether the pressure in the ear area disappears is further determined through signals of the pressure sensor in the ear area. If yes, go to 2140; if not, returning to the initial step.
2240, finishing the ear detection and executing the related operation.
The wearing state of the earphone is determined through the signals of the pressure sensors in the ear entering area and the handheld area, the wearing state of the earphone can be accurately judged, corresponding operation can be executed according to the wearing state of the earphone, manual control of a user is not needed, and user experience can be improved. In addition, the earphone structure and the sensing system of the embodiment of the application are simpler, so that the cost is lower.
Optionally, in an embodiment of the present application, a touch convex structure, a touch concave structure, or a touch particle point is disposed on an outer side surface of an area of the earphone sleeve where the pressure sensor is disposed.
For example, as shown in fig. 23, the pressure sensor 410 is attached to the inner side of the casing of the mobile phone casing in a fitting manner, and accordingly, for the outer side, a design of the outer side of the touch salient point, a design of the outer side of the touch concave point, or a design of the outer side of the touch particle point may be adopted. It is understood that the form of the outer side surface may be varied and is not limited to the examples.
Optionally, in an embodiment of the present application, the processing unit 420 may further implement a key function according to the pressure signal.
The detection signal of the pressure sensor can be used for realizing other functions besides determining whether the earphone is in the ear, for example, realizing a key function. For example, a finger may click or touch a handheld area, and a pressure sensor in the area may obtain data of pressure changes, or a finger may click or touch an arbitrary position of the headset, and a pressure sensor in an ear area may also obtain data of pressure changes, and the data may be used to implement other functions such as key pressing.
Optionally, in an embodiment of the present application, the headset further includes an infrared sensor and/or a capacitive sensor. Accordingly, the processing unit 420 may determine the wearing state of the headset according to the detection signal of the infrared sensor and/or the capacitance sensor and the pressure signal.
In particular, the pressure sensor may also be used in combination with other types of sensors, such as infrared sensors or capacitive sensors, to further improve the accuracy of determining the wearing state of the headset. For example, as shown in fig. 24, in addition to the plurality of pressure sensors 410, one or more infrared sensors or capacitive sensors 2410 may be provided on the headset.
The infrared sensor can judge whether the earphone is inserted into the ear or not through infrared detection. For a capacitive sensor, as shown in fig. 25, when the headset is at some close distance near ear skin 2520, parasitic capacitance 2530 is caused to increase significantly; at this time, the capacitive sensor 2510 will obtain a sensing signal to the processing unit, and the processing unit performs recognition through a software algorithm to complete the functions of wearing detection and the like.
Multiple sensing technologies may be used in combination, for example, one may be the primary sensing technology and the other may be the secondary sensing technology. That is to say, the piezoresistive sensing technology in the embodiment of the present application may be applied not only to an earphone for pressure detection as a main sensing technology, but also to an earphone for infrared sensing or an earphone for capacitance sensing as an auxiliary sensing technology.
Alternatively, in one embodiment of the present application, as shown in FIG. 25, multiple pressure sensors 2550 may be disposed on the back side of the headset (finger 2540 touch position in FIG. 25). In one aspect, when finger 2540 touches this area, capacitive sensor 2510 is brought closer to skin 2520, creating a new key operation. On the other hand, with the multi-dimensional pressure effect of the multi-pressure sensor 2550, operations such as tapping, double-tapping, light-pressing, heavy-pressing, sliding and the like can be received, multi-dimensional sensing signals are acquired through the multi-pressure sensor 2550, so that a processing unit at a later stage recognizes the multi-dimensional sensing signals through a software algorithm, and finally different key functions can be realized.
Optionally, in an embodiment of the present application, as shown in fig. 26, a silicone sleeve 2610 in the earphone is a conductive silicone, and the silicone can be arranged into a capacitive sensor, so that a capacitance value contacting with skin can be increased to correspondingly increase the sensitivity of the capacitive sensor.
It should be understood that the technical solutions of the embodiments of the present application are not limited to the earphone shape or form described in the above embodiments, but all earphone shapes or forms suitable for various sensor applications.
The embodiment of the present application further provides a chip, where the chip may be used to implement the processing unit in the earphone of the embodiment of the present application, and may have a function of the processing unit.
The embodiment of the application also provides an electronic device, and the electronic device can comprise the earphone of the various embodiments of the application.
Having described the headset, the chip, and the electronic device according to the embodiments of the present application, a method of detecting a wearing state of the headset according to the embodiments of the present application is described below. It should be understood that the method for detecting a wearing state of an earphone according to the embodiment of the present application may be implemented by the earphone according to the embodiment of the present application or the processing unit therein, where reference may be made to the foregoing embodiments for specific description, and for brevity, no further description is provided below.
Fig. 27 shows a schematic flow chart of a method 2700 of detecting a wearing state of a headset according to an embodiment of the present application. The method 2700 may be performed by the headset of the embodiments of the present application or a processing unit therein as previously described. As shown in fig. 27, the method 2700 may include:
2710, acquiring pressure signals of a plurality of pressure sensors, the plurality of pressure sensors including a first set of pressure sensors including one or more pressure sensors, the pressure sensors of the first set of pressure sensors being disposed in an in-ear region of the earphone;
2720, determining the wearing state of the earphone according to the pressure signal.
Optionally, in an embodiment of the present application, if one or more pressure sensors in the first set of pressure sensors do not acquire a pressure signal, it is determined that the headset is not worn.
Optionally, in an embodiment of the present application, the plurality of pressure sensors are disposed in at least two different areas of the earphone.
Optionally, in an embodiment of the present application, the plurality of pressure sensors further includes:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
Optionally, in an embodiment of the present application, the wearing state of the earphone may be determined according to pressure signals obtained by one or more pressure sensors in the first set of pressure sensors and pressure signals obtained by one or more pressure sensors in the second set of pressure sensors.
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set and it is determined that pressure exists in the ear entrance area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the earphone is worn into the ear
Optionally, in an embodiment of the present application, if it is determined that pressure exists in the handheld area of the earphone according to the pressure signals acquired by the one or more pressure sensors in the second pressure sensor set, and it is determined that pressure in the ear entrance area of the earphone disappears according to the pressure signals acquired by the one or more pressure sensors in the first pressure sensor set, it is determined that the earphone is taken out of the ear.
Optionally, in an embodiment of the present application, a key function may be implemented according to the pressure signal.
Optionally, in an embodiment of the present application, the headset further includes an infrared sensor and/or a capacitive sensor;
the wearing state of the headset can be determined according to the detection signals of the infrared sensor and/or the capacitance sensor and the pressure signal.
Optionally, in an embodiment of the present application, an operation associated with the headset being worn into the ear may be performed upon determining that the headset is worn into the ear; or,
performing an operation associated with the earphone-removed ear upon determining that the earphone is a removed ear.
It should be understood that the specific examples are provided herein only to assist those skilled in the art in better understanding the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.
Those of ordinary skill in the art will appreciate that the elements and algorithm steps of the examples described in connection with the embodiments disclosed herein can be embodied in touch-sensitive hardware, computer software, or combinations of both, and that the components and steps of the examples have been described in a functional general in the foregoing description for the purpose of illustrating clearly the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiments of the present application.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially or partially contributed by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (15)
1. An earphone, comprising:
a plurality of pressure sensors, the plurality of pressure sensors including a first set of pressure sensors including one or more pressure sensors, the pressure sensors of the first set of pressure sensors being disposed in an in-ear region of the earphone;
and the processing unit is used for controlling the earphone according to the pressure signals of the plurality of pressure sensors.
2. The headset of claim 1, wherein the pressure sensors of the first set of pressure sensors are disposed at an ear plug, ear post, or ear barrel of the in-ear region of the headset.
3. The headset of claim 1, wherein the plurality of pressure sensors are disposed in at least two different regions of the headset.
4. The headset of claim 1, wherein the plurality of pressure sensors further comprises:
a second set of pressure sensors comprising one or more pressure sensors, a pressure sensor of the second set of pressure sensors being disposed in a hand-held area of the headset.
5. The headset of claim 4, wherein the pressure sensors of the second set of pressure sensors are disposed at a headset sleeve of a hand-held area of the headset.
6. The earphone according to claim 5, wherein the outer side of the area of the earphone sleeve where the pressure sensor is arranged is provided with a touch convex structure, a touch concave structure or a touch particle point.
7. The headset of claim 1, wherein the plurality of pressure sensors are disposed in at least one of: the earphone is characterized in that the earphone is arranged on the inner side surface of the shell structure of the earphone, on the outer side surface of the shell structure of the earphone or in the material of the shell structure of the earphone.
8. The headset of claim 1, wherein the same area of the housing structure of the headset is provided with pressure sensors on the inner side, on the outer side and in the material.
9. The headset of claim 1, wherein the plurality of pressure sensors are disposed evenly along a circumference of the housing structure of the headset.
10. The headset of claim 1, wherein the plurality of pressure sensors are disposed on the inner or outer side of the housing structure of the headset by a glue, or disposed in the material of the housing structure of the headset by injection molding.
11. The headset of claim 1, wherein the plurality of pressure sensors are disposed on an inner or outer side of a housing structure of the headset by foam.
12. The headset of claim 1, wherein the first set of pressure sensors comprises a bridge configuration of resistive pressure sensors, wherein resistances of two adjacent legs of the bridge configuration of resistive pressure sensors are disposed on different sides of a housing structure of the headset.
13. The headset of claim 1, further comprising an infrared sensor and/or a capacitive sensor.
14. The headset of claim 1, wherein the headset is an in-ear headset or an ear bud headset.
15. An electronic device, characterized in that it comprises a headset according to any of claims 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721609709.7U CN207560279U (en) | 2017-11-27 | 2017-11-27 | Earphone and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721609709.7U CN207560279U (en) | 2017-11-27 | 2017-11-27 | Earphone and electronic equipment |
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| CN207560279U true CN207560279U (en) | 2018-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201721609709.7U Active CN207560279U (en) | 2017-11-27 | 2017-11-27 | Earphone and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108702567A (en) * | 2017-11-27 | 2018-10-23 | 深圳市汇顶科技股份有限公司 | Earphone, test earphone wearing state method and electronic equipment |
| CN110603815A (en) * | 2018-09-25 | 2019-12-20 | 深圳市汇顶科技股份有限公司 | Earphone and method for realizing wearing detection and touch operation |
| CN112188338A (en) * | 2019-07-04 | 2021-01-05 | 缤特力股份有限公司 | Small headset enhancement on ear detection with multiple capacitive sensing |
| AU2021101005B4 (en) * | 2018-09-21 | 2021-07-08 | Apple Inc. | Force-activated earphone |
| US11463796B2 (en) | 2018-09-21 | 2022-10-04 | Apple Inc. | Force-activated earphone |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108702567A (en) * | 2017-11-27 | 2018-10-23 | 深圳市汇顶科技股份有限公司 | Earphone, test earphone wearing state method and electronic equipment |
| WO2019100378A1 (en) * | 2017-11-27 | 2019-05-31 | 深圳市汇顶科技股份有限公司 | Earphones, method for detecting wearing state of earphones, and electronic device |
| US11463799B2 (en) | 2018-09-21 | 2022-10-04 | Apple Inc. | Force-activated earphone |
| US11463797B2 (en) | 2018-09-21 | 2022-10-04 | Apple Inc. | Force-activated earphone |
| US12133042B2 (en) | 2018-09-21 | 2024-10-29 | Apple Inc. | Force-activated stylus |
| AU2021101005B4 (en) * | 2018-09-21 | 2021-07-08 | Apple Inc. | Force-activated earphone |
| AU2021103858B4 (en) * | 2018-09-21 | 2021-09-23 | Apple Inc. | Force-activated earphone |
| AU2021107568B4 (en) * | 2018-09-21 | 2022-06-23 | Apple Inc. | Force-activated earphone |
| US12101590B2 (en) | 2018-09-21 | 2024-09-24 | Apple Inc. | Force-activated earphone |
| US11463796B2 (en) | 2018-09-21 | 2022-10-04 | Apple Inc. | Force-activated earphone |
| US12010477B2 (en) | 2018-09-21 | 2024-06-11 | Apple Inc. | Force-activated earphone |
| US11917355B2 (en) | 2018-09-21 | 2024-02-27 | Apple Inc. | Force-activated earphone |
| AU2022100096B4 (en) * | 2018-09-21 | 2022-12-15 | Apple Inc. | Force-activated earphone |
| AU2023100000B4 (en) * | 2018-09-21 | 2023-06-29 | Apple Inc. | Force-activated earphone |
| US11910149B2 (en) | 2018-09-21 | 2024-02-20 | Apple Inc. | Force-activated earphone |
| US11917354B2 (en) | 2018-09-21 | 2024-02-27 | Apple Inc. | Force-activated earphone |
| CN110603815A (en) * | 2018-09-25 | 2019-12-20 | 深圳市汇顶科技股份有限公司 | Earphone and method for realizing wearing detection and touch operation |
| US11412319B2 (en) | 2018-09-25 | 2022-08-09 | Shenzhen GOODIX Technology Co., Ltd. | Earbud and method for implementing wearing detection and touch operation |
| US10999667B2 (en) | 2018-09-25 | 2021-05-04 | Shenzhen GOODIX Technology Co., Ltd. | Earbud and method for implementing wearing detection and touch operation |
| CN112188338A (en) * | 2019-07-04 | 2021-01-05 | 缤特力股份有限公司 | Small headset enhancement on ear detection with multiple capacitive sensing |
| EP4203500A4 (en) * | 2021-04-08 | 2024-05-22 | Honor Device Co., Ltd. | Earphone |
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