CN105628874A - Gas sensor of co-firing structure and method for obtaining sensor - Google Patents
Gas sensor of co-firing structure and method for obtaining sensor Download PDFInfo
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- CN105628874A CN105628874A CN201511009349.2A CN201511009349A CN105628874A CN 105628874 A CN105628874 A CN 105628874A CN 201511009349 A CN201511009349 A CN 201511009349A CN 105628874 A CN105628874 A CN 105628874A
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Abstract
The invention relates to a gas sensor of a co-firing structure and a method for obtaining the senor and belongs to the technical field of sensors. The gas sensor of the co-firing structure and the method for obtaining the senor solve the problems that an existing catalytic combustion type gas sensor and an existing semiconductor gas sensor are poor in stability, large in power consumption and large in size. A first substrate, a second substrate and a third substrate have the same dimension and are arranged in sequence from top to bottom in a stacked mode. A rectangular through hole is carved in the first substrate and filled with a sensitive unit, first signal lines are printed at the right end of the first substrate, and a line passing connecting hole is formed in each signal line. A signal measurement unit is printed on the second substrate, the right end of the signal measurement unit extends rightwards and is provided with second signal lines in a printed mode, and a line passing connection hole is formed in each second signal line. A heating unit is printed on the upper surface of the third substrate, extends rightwards and is provided with third signal lines in a printed mode. The gas sensor of the co-firing structure is suitable for serving as gas sensors.
Description
Technical field
The invention belongs to sensor technical field.
Background technology
Gas sensor (comprising catalyticcombustion gas sensor and semiconductor gas body sensor) and co-sintering Technology are known in the art, catalyticcombustion gas sensor and semiconductor gas body sensor are used for the detection of inflammable gas, toxic and harmful, such as Domestic gas leakage warning, mine safety warning, atmospheric environment gas-monitoring etc., be the two class gas sensors being most widely used. Co-sintering technology is easy to realize scale operation and realize product miniatureization being widely used in semiconductor applications owing to having, and this technology includes the processing steps such as curtain coating, punching, silk screen printing, lamination, isostatic pressed, cutting, sintering.
After semiconductor gas body sensor utilizes sensitive material adsorbed gas, conductivity value changes realization to the detection of gas, comprises hot spots, non-sensitive part and detecting portion. Catalyticcombustion gas sensor utilizes under catalyst, and under certain temperature condition, comparison and detection temperature variation realizes the detection to gas, comprises hot spots, catalysed partial and detecting portion.
Traditional catalyticcombustion gas sensor and semiconductor gas body sensor are a kind of globositys, detecting portion are imbedded in spherical sensitive body, usually rely on outer well heater to realize heating. Fig. 1 is the catalyticcombustion gas sensor schematic diagram of tradition structure. Fig. 2 is the semiconductor gas body sensor schematic diagram of tradition structure.
In recent years, catalytic combustion type gas sensor and semiconductor gas body sensor is manufactured with the use of microelectronic process engineering, catalytic combustion type gas sensor and the semi-conductor gas size sensor of this kind of technology manufacture are little, be suitable for extensive manufacture, low cost of manufacture, but manufacturing technology is difficult, complex structure.
Summary of the invention
The present invention is to solve existing catalytic combustion type gas sensor and semi-conductor gas sensor stability is poor, power consumption is big, volume is big problem, it is proposed that the gas sensor of a kind of co-sintering structure and obtain the method for this sensor.
The gas sensor of co-sintering structure of the present invention, it comprises a substrate, No. two substrates and No. three substrates;
A substrate, No. two substrates are identical with the size of No. three substrates, and superposition of tiling successively from top to bottom is arranged;
Being carved with in the rectangular through-hole of a rectangular through-hole substrate on a substrate and be filled with sensing unit, the upper surface of a described substrate is printed with a signal wire, and signal wire is positioned at the right-hand member of a substrate, every root signal wire all had line and connects hole;
No. two upper surface of base plate are printed with signal measurement unit, and the right-hand member of signal measurement unit extends to the right and is printed with No. two signal wires, described No. two signal wires all had line and connects hole;
The upper surface of No. three substrates is printed with heating unit, and described heating unit extends to the right and is printed with No. three signal wires;
No. two substrates are arranged between a substrate and No. three substrates, the upper edge of the sensing unit of a substrate is corresponding with the upper edge of the signal measurement unit of No. two upper surface of base plate, and part signal wire connects hole by line and No. two signal wires connect one to one, by crossing, line connection Kong Yusan signal wire connects one to one another part signal wire; The position of the heating unit of the upper surface of No. three substrates is corresponding with the position of the signal measurement unit of No. two upper surface of base plate.
Obtaining the method for the gas sensor of above-mentioned co-sintering structure, the concrete steps of the method are:
Step one, employing laser or mechanical punching technology offer rectangular through-hole on a substrate, adopt the punching technology in co-sintering technology to print line and connect hole, utilize screen printing technique or thick-film technique to print a signal wire at the right-hand member of a substrate;
Step 2, utilize screen printing technique in co-sintering technology, thick-film technique technology or thin-film technique technology to print signal measurement unit and No. two signal wires on No. two substrates, adopt the punching technology in co-sintering technology to print and No. two signal wires were printed line connect hole;
Step 3, co-sintering Technology is utilized to print heating unit and No. three signal wires on No. three substrates;
Step 4, No. two substrates are arranged between a substrate and No. three substrates, and a substrate is printed with a signal line side, No. two substrates are printed with No. two signal line side and No. three substrates are printed with No. three signal line side all upwards, be full of sensitive material and form sensing unit in the rectangular through-hole of a substrate;
Step 5, the screen printing technique in co-sintering technology or filling perforation technology is utilized to connect in hole fill out conducting metal at the line of crossing of a substrate and No. two substrates, it is achieved the corresponding corresponding connection crossed line and connect hole; Obtain the gas sensor of co-sintering structure.
The present invention provides gas sensor and the making method of a kind of co-sintering structure, non-sensitive part realizes membrane structure, hot spots and detecting portion realize integrated, and can by the area of adjustment non-sensitive part and thickness, make the gas sensor with different accuracy, time of response, and being easy to realize integrated, manufacturing technology is simple, it is easy to realize batch production.
The advantage of the present invention: the gas sensor of the more traditional structure of the gas sensor of co-sintering structure more easily realizes mass production, volume-diminished, lower power consumption, resistance to mechanics environmental performance promotes, and stability is improved, easier and other sensor realizes Integration Design and making.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the catalyticcombustion gas sensor of tradition structure;
Fig. 2 is the semiconductor gas body sensor schematic diagram of tradition structure;
Fig. 3 is the vertical view of described in embodiment two a substrate;
Fig. 4 is the vertical view of described in embodiment three No. two substrate;
Fig. 5 is the vertical view of described in embodiment eight No. three substrate 3;
Fig. 6 is described in embodiment five substrate 1 vertical view;
Fig. 7 is the vertical view of described in embodiment six No. two substrate 2;
Fig. 8 is the structural representation of the gas sensor of the co-sintering structure described in embodiment four;
Fig. 9 is the structural representation of the gas sensor of the co-sintering structure described in embodiment seven.
Embodiment
The gas sensor of the co-sintering structure described in embodiment one, present embodiment, it comprises a substrate 1, No. two substrates 2 and No. three substrates 3;
A substrate 1, No. two substrates 2 are identical with the size of No. three substrates 3, and superposition of tiling successively from top to bottom is arranged;
A substrate 1 is carved with in the rectangular through-hole of a rectangular through-hole substrate 1 and is filled with sensing unit 4, the upper surface of a described substrate 1 is printed with a signal wire 5, and signal wire 5 is positioned at the right-hand member of a substrate 1, every root signal wire 5 all had line and connected hole;
No. two substrate 2 upper surfaces are printed with signal measurement unit 7, and the right-hand member of signal measurement unit 7 extends to the right and is printed with No. two signal wires, described No. two signal wires all had line and connects hole;
The upper surface of No. three substrates 3 is printed with heating unit 10, and described heating unit 10 extends to the right and is printed with No. three signal wires;
No. two substrates 2 are arranged between a substrate 1 and No. three substrates 3, the upper edge of the sensing unit 4 of a substrate 1 is corresponding with the upper edge of the signal measurement unit 7 of No. two substrate 2 upper surfaces, and part signal wire connects hole by line and No. two signal wires connect one to one, by crossing, line connection Kong Yusan signal wire connects one to one another part signal wire; The position of the heating unit 10 of the upper surface of No. three substrates 3 is corresponding with the position of the signal measurement unit 7 of No. two substrate 2 upper surfaces.
Embodiment two, present embodiment are the further explanations of the gas sensor to the co-sintering structure described in embodiment one, and a substrate 1 is printed with six signal wires 5.
Embodiment three, present embodiment are the further explanations of the gas sensor to the co-sintering structure described in embodiment two, and the signal measurement unit 7 that No. two substrates 2 are printed is divided into upper part and lower part;
Described upper part and lower part are the sinusoidal wave lines including a trough two crests, and the crest of described sinusoidal wave lines and trough place are semicircle camber line;
The sinusoidal wave rising of lines is the straight line parallel with No. two long limits of substrate 2 with the lines of decline, one end of No. two signal wires is connected with the lower end of the both sides down signal line of sinusoidal wave lines and extends downwards, and the rising line of distance between the sinusoidal wave lines of upper part and the sinusoidal wave lines of lower part and sine wave lines is equal with the distance that declines between line.
Embodiment four, present embodiment are the further explanations of the gas sensor to the co-sintering structure described in embodiment two or three, and the rectangular through-hole 4 on a substrate 1 is corresponding with signal measurement unit 7 upper part on No. two substrates 2.
Embodiment five, present embodiment are the further explanations of the gas sensor to the co-sintering structure described in embodiment one, and a substrate 1 is printed with four signal wires 5.
Embodiment six, present embodiment is the further explanation of the gas sensor to the co-sintering structure described in embodiment five, the signal measurement unit 7 printed on No. two substrates 2 is divided into upper part and lower part, described upper part and lower part include " E " type lines, Open Side Down for " E " type of upper part, the opening upwards of " E " of lower part, three arms of upper part " E " type and three arms intersections of lower part " E " type are arranged, three arms that one end of No. two signal wires is connected " E " type with the bottom of " E " type lines hang down rectilinear bottom, and extend to the right along described straight line.
Embodiment seven, present embodiment are the further explanations of the gas sensor to the co-sintering structure described in embodiment six, and the rectangular through-hole on a substrate 1 is corresponding with signal measurement unit 7.
The size of rectangular through-hole described in present embodiment is identical with the size of signal measurement unit.
Embodiment eight, present embodiment are the further explanations of the gas sensor to the co-sintering structure described in embodiment one, two, four or seven, the heating unit 10 on No. three substrate 3 surfaces is sinusoidal wave lines, described sinusoidal wave lines comprise n+1 crest and n trough, the crest of sinusoidal wave lines be the rising line of the sinusoidal wave lines of semicircular arc with trough and the line that declines all parallel with the long limit of No. three substrates 3, wherein n be more than or equal to 1 integer.
Embodiment nine, present embodiment are the methods of the gas sensor obtaining the co-sintering structure described in embodiment one, and the concrete steps of the method are:
Step one, employing laser or mechanical punching technology offer rectangular through-hole on a substrate 1, adopt the punching technology in co-sintering technology to print line and connect hole, utilize screen printing technique or thick-film technique to print a signal wire 5 at the right-hand member of a substrate 1;
Step 2, utilize screen printing technique in co-sintering technology, thick-film technique technology or thin-film technique technology to print signal measurement unit 7 and No. two signal wires on No. two substrates 2, adopt the punching technology in co-sintering technology to print and No. two signal wires were printed line connect hole;
Step 3, co-sintering Technology is utilized to print heating unit 10 and No. three signal wires on No. three substrates 3;
Step 4, No. two substrates 2 are arranged between a substrate 1 and No. three substrates 3, and a substrate 1 is printed with a signal line side, No. two substrates 2 are printed with No. two signal line side and No. three substrates 3 are printed with No. three signal line side all upwards, be full of sensitive material and form sensing unit 4 in the rectangular through-hole of a substrate 1;
Step 5, the screen printing technique in co-sintering technology or filling perforation technology is utilized to connect in hole fill out conducting metal at the line of crossing of a substrate 1 and No. two substrates 2, it is achieved the corresponding corresponding connection crossed line and connect hole; Obtain the gas sensor of co-sintering structure.
Individual layer or multi layer substrate on a substrate, No. two substrates and No. three substrates carry out contraposition lamination by high precision contraposition lamination techniques, the combination between substrate and sealing is realized by isostatic pressing technology, by pottery cutting technique by monomer separation, finally by SINTERING TECHNOLOGY sinter molding.
Gas sensor in the present invention can embed in suitable pedestal, and is connected with suitable signal processing device. Although reference example describes the present invention, but the change in form and details can be carried out when not departing from design philosophy and the scope of the present invention, comprise the layout etc. changing sensitive material kind, measurement partial amt shape, heater shape and each several part on substrate.
The present invention utilizes co-sintering Technology to be prepared, by non-sensitive part (sensing unit of a substrate), hot spots (heating units of No. three substrates), measure part (measuring units of No. two substrates), segment signal output (signal wire, No. two signal wires and No. three signal wires) membrane structure, it is produced on substrate by the co-sintering Technology such as silk screen printing, filling perforation, connect by crossing hole, utilize isostatic pressing technology to be pressed into together by multi layer substrate, finally sinter sensor into.
A substrate, No. two substrates and No. three substrates, it is possible to be individual layer or multilayer, it has the surface contacted with gas and noncontact surface.
Cross hole, on a substrate, No. two substrates and No. three substrates, for the electrical connection of measuring unit and output line and heating unit and output line;
The defeated line of signal, is arranged on a substrate, for the output of signal and the applying of heating unit voltage.
The substrate forming a substrate, No. two substrates and No. three substrates is formed by selecting in the group that forms of the material of casting film-forming from aluminum oxide, zirconium white, glass etc.
The material selected is formed by meeting in group that the platinum of co-sintering requirement, gold and silver etc. form for measuring unit and output line.
Embodiment ten, present embodiment are the further explanations of the method for the gas sensor to the co-sintering structure described in embodiment nine, and the sensitive material being full of in the rectangular through-hole of a substrate 1 in sensitive material formation sensing unit 4 described in step 4 is stannic oxide, zinc oxide, nickel oxide, Tungsten oxide 99.999, Indium sesquioxide, palladium, platinum, silicon-dioxide or metal composite.
Claims (10)
1. the gas sensor of co-sintering structure, it is characterised in that, it comprises a substrate (1), No. two substrates (2) and No. three substrates (3);
A substrate (1), No. two substrates (2) are identical with the size of No. three substrates (3), and superposition of tiling successively from top to bottom is arranged;
A substrate (1) is carved with in the rectangular through-hole of a rectangular through-hole substrate (1) and is filled with sensing unit (4), the upper surface of a described substrate (1) is printed with a signal wire (5), and signal wire (5) is positioned at the right-hand member of a substrate (1), every root signal wire (5) all had line and connected hole;
No. two substrate (2) upper surfaces are printed with signal measurement unit (7), and the right-hand member of signal measurement unit (7) extends to the right and is printed with No. two signal wires, described No. two signal wires all had line and connects hole;
The upper surface of No. three substrates (3) is printed with heating unit (10), and described heating unit (10) extends to the right and is printed with No. three signal wires;
No. two substrates (2) are arranged between a substrate (1) and No. three substrates (3), the upper edge of the sensing unit (4) of a substrate (1) is corresponding with the upper edge of the signal measurement unit (7) of No. two substrate (2) upper surfaces, and part signal wire connects hole by line and No. two signal wires connect one to one, by crossing, line connection Kong Yusan signal wire connects one to one another part signal wire; The position of the heating unit (10) of the upper surface of No. three substrates (3) is corresponding with the position of the signal measurement unit (7) of No. two substrate (2) upper surfaces.
2. the gas sensor of co-sintering structure according to claim 1, it is characterised in that, a substrate (1) is printed with six No. one signal wire (5).
3. the gas sensor of co-sintering structure according to claim 1 and 2, it is characterised in that, No. two upper signal measurement units (7) printed of substrate (2) are divided into upper part and lower part;
Described upper part and lower part are the sinusoidal wave lines including a trough two crests, and the crest of described sinusoidal wave lines and trough place are semicircle camber line;
The sinusoidal wave rising of lines is the straight line parallel with No. two long limits of substrate (2) with the lines of decline, one end of No. two signal wires is connected with the lower end of the both sides down signal line of sinusoidal wave lines and extends downwards, and the rising line of distance between the sinusoidal wave lines of upper part and the sinusoidal wave lines of lower part and sine wave lines is equal with the distance that declines between line.
4. the gas sensor of co-sintering structure according to claim 3, it is characterized in that, the position of signal measurement unit (7) upper part upper with No. two substrates (2) of the rectangular through-hole (4) on a substrate (1) is corresponding.
5. the gas sensor of co-sintering structure according to claim 1, it is characterised in that, a substrate (1) is printed with four No. one signal wire (5).
6. the gas sensor of co-sintering structure according to claim 1 or 5, it is characterized in that, No. two upper signal measurement units (7) printed of substrate (2) are divided into upper part and lower part, described upper part and lower part include " E " type lines, Open Side Down for " E " type of upper part, the opening upwards of " E " of lower part, three arms of upper part " E " type and three arms intersections of lower part " E " type are arranged, rectilinear bottom of hanging down with three arms, the bottom of one end of No. two signal wires and " E " type lines is connected, and extend to the right along described straight line.
7. the gas sensor of co-sintering structure according to claim 6, it is characterised in that, the rectangular through-hole on a substrate (1) is corresponding with signal measurement unit (7).
8. the gas sensor of co-sintering structure according to claim 1,2,4,5 or 7, it is characterized in that, the heating unit (10) on No. three substrate (3) surfaces is sinusoidal wave lines, described sinusoidal wave lines comprise n+1 crest and n trough, the crest of sinusoidal wave lines be the rising line of the sinusoidal wave lines of semicircular arc with trough and the line that declines all parallel with the long limit of No. three substrates (3), wherein n be more than or equal to 1 integer.
9. obtain the method for the gas sensor of co-sintering structure according to claim 1, it is characterised in that, the concrete steps of the method are:
Step one, employing laser or mechanical punching technology offer rectangular through-hole on a substrate (1), adopt the punching technology in co-sintering technology to print line and connect hole, utilize screen printing technique or thick-film technique to print a signal wire (5) at the right-hand member of a substrate (1);
Step 2, utilize screen printing technique in co-sintering technology, thick-film technique technology or thin-film technique technology to print signal measurement unit (7) and No. two signal wires on No. two substrates (2), adopt the punching technology in co-sintering technology to print and No. two signal wires were printed line connect hole;
Step 3, co-sintering Technology is utilized to print heating unit (10) and No. three signal wires on No. three substrates (3);
Step 4, No. two substrates (2) are arranged between a substrate (1) and No. three substrates (3), and a substrate (1) is printed with a signal line side, No. two substrates (2) are printed with No. two signal line side and No. three substrates (3) are printed with No. three signal line side all upwards, be full of sensitive material and form sensing unit (4) in the rectangular through-hole of a substrate (1);
Step 5, the screen printing technique in co-sintering technology or filling perforation technology is utilized to connect in hole fill out conducting metal at the line of crossing of a substrate (1) and No. two substrates (2), it is achieved the corresponding corresponding connection crossed line and connect hole; Obtain the gas sensor of co-sintering structure.
10. the method for the gas sensor of co-sintering structure according to claim 9, it is characterized in that, the sensitive material being full of in sensitive material formation sensing unit (4) in the rectangular through-hole to a substrate (1) described in step 4 is stannic oxide, zinc oxide, nickel oxide, Tungsten oxide 99.999, Indium sesquioxide, palladium, platinum, silicon-dioxide or metal composite.
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| CN201511009349.2A CN105628874B (en) | 2015-12-28 | 2015-12-28 | The gas sensor of co-sintering structure and the method for obtaining the sensor |
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| CN201511009349.2A CN105628874B (en) | 2015-12-28 | 2015-12-28 | The gas sensor of co-sintering structure and the method for obtaining the sensor |
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Cited By (4)
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| CN107764865A (en) * | 2017-10-19 | 2018-03-06 | 中国电子科技集团公司第四十九研究所 | A kind of array, the enhanced gas sensor of integrated light and preparation method thereof |
| CN110865100A (en) * | 2019-12-18 | 2020-03-06 | 中国电子科技集团公司第四十九研究所 | Sheet-type structure integrated catalytic combustion type combustible gas sensor and preparation method thereof |
| CN110988051A (en) * | 2019-12-10 | 2020-04-10 | 武汉微纳传感技术有限公司 | Dual-mode MEMS gas sensor and working method thereof |
| CN110988050A (en) * | 2019-12-10 | 2020-04-10 | 武汉微纳传感技术有限公司 | MEMS gas sensor with temperature sensing function and preparation method thereof |
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| Publication number | Publication date |
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| CN105628874B (en) | 2017-05-31 |
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