CN204286668U - Pressure transducer - Google Patents
Pressure transducer Download PDFInfo
- Publication number
- CN204286668U CN204286668U CN201420218882.4U CN201420218882U CN204286668U CN 204286668 U CN204286668 U CN 204286668U CN 201420218882 U CN201420218882 U CN 201420218882U CN 204286668 U CN204286668 U CN 204286668U
- Authority
- CN
- China
- Prior art keywords
- pressure transducer
- bleeder vent
- outer enclosure
- substrate
- enclosure structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 64
- 238000000034 method Methods 0.000 abstract description 16
- 239000007795 chemical reaction product Substances 0.000 abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a kind of pressure transducer, comprise outer enclosure structure and be arranged at the sensor chip in described outer enclosure structure, in order to ensure that pressure transducer normally works, described outer enclosure structure is provided with the bleeder vent being communicated with described pressure transducer inside and outside, further, described bleeder vent is positioned at the anon-normal of described pressure transducer outer enclosure structure to the side of sensor chip.In pressure transducer assembling use procedure, end product need not at pressure transducer top design cavity, reduce end product thickness, increase pressure transducer and use flexibility ratio, meanwhile, in assembling use procedure, the bleeder vent being arranged at encapsulating structure side can avoid external air flow or light to directly act on pressure sensor chip, avoid the therefore pressure transducer errors produced, improve pressure transducer performance.Therefore, the utility model pressure sensing appliance has performance good, is conducive to the advantage of Miniaturization Design.
Description
Technical field
The utility model relates to sensor field, particularly relates to one and is conducive to Miniaturization Design, the pressure transducer that performance is good.
Background technology
Along with the development of miniaturization of electronic products microminiaturization, the requirement of electronic product to its internal component miniaturization is more and more higher.Pressure transducer, as common sensor, is applied in multiple electronic product, therefore the Miniaturization Design of pressure transducer also becomes focal point.In order to ensure the Miniaturization Design of pressure transducer, the pressure transducer based on MEMS (micro electro mechanical system) (Micro-Electro-Mechanical System, MEMS) is more and more subject to people and pays close attention to.
Based on the pressure transducer of MEMS technology, as shown in Figure 1, comprise substrate 1, be fixed on the shell 2 of described substrate, described substrate 1 forms described pressure transducer outer enclosure structure with described shell 2.In described outer enclosure structure, described substrate is fixedly installed pressure sensor chip 3 and integrated circuit (IC) chip 5, pressure sensor chip 3 is electrically connected with the mode of integrated circuit (IC) chip 5 by metal lead wire 4 routing, substrate 1 is provided with pad, pressure sensor inside chip is electrically connected with external electronic circuits by substrate pads, meanwhile, pressure transducer is fixed on outside mainboard by pad.In order to ensure that pressure transducer normally works, pressure transducer is provided with the bleeder vent 6 being communicated with pressure transducer inside and outside, and as shown in Figure 1, the pressure transducer of traditional structure, bleeder vent 6 is arranged on shell 2 end face parallel with substrate 1.Bleeder vent 6 is arranged at the end face of shell 2, in order to ensure that pressure transducer normally works, requiring to need a fixed gap above pressure transducer, adding end product thickness; Bleeder vent 6 is above shell 2 simultaneously, and when production and application, external air flow directly acts on pressure sensor chip 3, pressure sensor chip 3 is made to produce error, and extraneous light also easily acts on pressure sensor chip 3, make pressure sensor chip 3 produce error, affect properties of product.
Therefore, be necessary to propose a kind of improvement, to overcome traditional structure pressure transducer defect.
Utility model content
Technical problem to be solved in the utility model is to provide one and is conducive to Miniaturization Design, the pressure transducer that performance is good.
To achieve these goals, the utility model is by the following technical solutions:
A kind of pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure and integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, and: described outer enclosure structure comprises substrate, the end face just right with described substrate and is connected the side of described substrate and described end face, and described bleeder vent is arranged at the side of described pressure transducer outer enclosure structure.
As the preferred technical scheme of one, described side and described end face are wholely set, and described side is provided with cambered surface near described top side location, and described side is connected with described end face by described cambered surface; Described bleeder vent is arranged in described cambered surface.
As another kind of technical scheme: a kind of pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure and integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, and: described outer enclosure structure comprises substrate, the end face just right with described substrate and be connected the side of described substrate and described end face, described substrate and described lateral junction co-bit install the groove being equipped with and expecting to be formed, described groove is communicated with described pressure transducer inside and outside, described substrate recess and described side-fit form described bleeder vent.
As another technical scheme: a kind of pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure and integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, it is characterized in that: described outer enclosure structure comprises substrate, framework and top board, described substrate and described framework secure bond, described top board is fixedly installed on described framework away from described substrate one end; Described top board is provided with described framework binding site the ventilating groove expecting to be formed, and described ventilating groove is communicated with described pressure transducer inside and outside, and described top board ventilating groove coordinates with described framework and forms described bleeder vent.
The utility model pressure transducer, bleeder vent is arranged at pressure transducer outer enclosure texture edge, in pressure transducer assembling use procedure, end product need not at pressure transducer top design cavity, reduce end product thickness, increase pressure transducer and use flexibility ratio, simultaneously, in assembling use procedure, the bleeder vent being arranged at encapsulating structure side can avoid external air flow or light to directly act on pressure sensor chip, avoid the therefore pressure transducer errors produced, improve pressure transducer performance.Therefore, the utility model pressure sensing appliance has performance good, is conducive to the advantage of Miniaturization Design.
Accompanying drawing explanation
Fig. 1 is traditional structure pressure transducer cut-open view;
Fig. 2 is the utility model pressure transducer first embodiment cut-open view;
Fig. 3 is the utility model pressure transducer second embodiment cut-open view;
Fig. 4 is another structure cut-open view of the utility model pressure transducer second embodiment;
Fig. 5 is the utility model pressure transducer the 3rd embodiment cut-open view;
Fig. 6 is the utility model pressure transducer the 4th embodiment cut-open view.
Embodiment
Below in conjunction with accompanying drawing, describe the utility model pressure transducer concrete structure in detail.
Embodiment one:
As shown in Figure 2, the present embodiment pressure transducer, comprises substrate 1, the shell 2 be fixedly installed with substrate 1, and substrate 1 and shell 2 form pressure transducer outer enclosure structure.Be arranged in pressure transducer outer enclosure structure, the integrated circuit (IC) chip 5 that pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 are arranged, be electrically connected by the mode of metal lead wire 4 by routing between pressure sensor chip 3 and integrated circuit (IC) chip 5, substrate 1 is provided with pad, pressure sensor inside chip is electrically connected with external electronic circuits by pad, when pressure transducer works, pressure sensor chip 3 gathers external pressure to be changed and is converted into electric signal, the signal that pressure sensor chip 3 gathers by integrated circuit (IC) chip 5 carries out rough handling and is passed to external electronic circuits through described pad.
The present embodiment pressure transducer, shell 2 comprises the sidewall vertical with substrate, and shell 2 is fixed by described sidewall and substrate 1, and described shell 2 sidewall is provided with end face away from substrate 1 one end, and end face and sidewall are integrally connected by cambered surface.In order to ensure that pressure transducer normally works, pressure transducer is provided with the bleeder vent being communicated with pressure transducer inside and outside, and as shown in Figure 2, the present embodiment pressure transducer bleeder vent 6 is arranged in the cambered surface of described shell 2.The bleeder vent 6 being arranged at cambered surface is positioned at the side end face of pressure transducer outer enclosure structure, in the assembling of the present embodiment pressure transducer, use procedure, exterior terminal need not arrange cavity at pressure transducer top, reduce exterior terminal thickness, increase pressure transducer and use flexibility ratio, simultaneously, in assembling use procedure, the bleeder vent being arranged at side can avoid external air flow or light to directly act on pressure sensor chip, avoid the therefore pressure transducer errors produced, improve pressure transducer performance.
Embodiment two:
Similar with embodiment one, the present embodiment pressure transducer, as shown in Figure 3, the present embodiment pressure transducer, comprises substrate 1, the shell 2 be fixedly installed with substrate 1, and substrate 1 and shell 2 form pressure transducer outer enclosure structure.Be arranged in pressure transducer outer enclosure structure, the integrated circuit (IC) chip 5 that pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 are arranged, be electrically connected by the mode of metal lead wire 4 by routing between pressure sensor chip 3 and integrated circuit (IC) chip 5, substrate 1 is provided with pad, pressure sensor inside chip is electrically connected with external electronic circuits by pad, when pressure transducer works, pressure sensor chip 3 gathers external pressure to be changed and is converted into electric signal, the signal that pressure sensor chip 3 gathers by integrated circuit (IC) chip 5 carries out rough handling and is passed to external electronic circuits through described pad.
The present embodiment pressure transducer, shell 2 comprises the sidewall vertical with substrate, and shell 2 is fixed by described sidewall and substrate 1.As shown in Figure 3, the present embodiment pressure transducer bleeder vent 6 is arranged on the sidewall of described shell 2.The bleeder vent 6 being arranged at sidewall is positioned at the side end face of pressure transducer outer enclosure structure, in the assembling of the present embodiment pressure transducer, use procedure, exterior terminal need not arrange cavity at pressure transducer top, reduce exterior terminal thickness, increase pressure transducer and use flexibility ratio, simultaneously, in assembling use procedure, the bleeder vent being arranged at side can avoid external air flow or light to directly act on pressure sensor chip, avoid the therefore pressure transducer errors produced, improve pressure transducer performance.
In actual production encapsulation process; as shown in Figure 4; the bleeder vent that the present embodiment is arranged at shell 2 sidewall can be positioned at sidewall near substrate 1 one end, also can embody the utility model pressure transducer advantage, be subordinated to the utility model pressure transducer claims.
Embodiment three:
Similar with above two embodiments, as shown in Figure 5, the present embodiment pressure transducer, comprises substrate 1, the shell 2 be fixedly installed with substrate 1, and substrate 1 and shell 2 form pressure transducer outer enclosure structure.Be arranged in pressure transducer outer enclosure structure, the integrated circuit (IC) chip 5 that pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 are arranged, be electrically connected by the mode of metal lead wire 4 by routing between pressure sensor chip 3 and integrated circuit (IC) chip 5, substrate 1 is provided with pad, pressure sensor inside chip is electrically connected with external electronic circuits by pad, when pressure transducer works, pressure sensor chip 3 gathers external pressure to be changed and is converted into electric signal, the signal that pressure sensor chip 3 gathers by integrated circuit (IC) chip 5 carries out rough handling and is passed to external electronic circuits through described pad.
The present embodiment pressure transducer, shell 2 comprises the sidewall vertical with substrate, and shell 2 is fixed by described sidewall and substrate 1.As shown in Figure 5, the present embodiment pressure transducer bleeder vent 6 is arranged at substrate 1 and shell 2 sidewall binding site, and substrate 1 is provided with shell 2 binding site the groove expecting to be formed, and this groove is communicated with pressure transducer inside and outside, and this groove forms bleeder vent 6.Bleeder vent 6 is arranged at substrate 1 and shell 2 sidewall binding site, be positioned at the side end face of pressure transducer outer enclosure, in the assembling of the present embodiment pressure transducer, use procedure, exterior terminal need not arrange cavity at pressure transducer top, reduce exterior terminal thickness, increase pressure transducer and use flexibility ratio, simultaneously, in assembling use procedure, the bleeder vent being arranged at side can avoid external air flow or light to directly act on pressure sensor chip, avoid the therefore pressure transducer errors produced, improve pressure transducer performance.
Embodiment four:
Based on identical design concept, the utility model pressure transducer can adopt another kind of outer enclosure structure:
As shown in Figure 6, the present embodiment pressure transducer comprises substrate 1, and with the framework 2a that substrate 1 is fixing, be fixed on the top board 2b of framework 2a away from substrate 1 one end, substrate 1, framework 2a and top board 2b form the present embodiment pressure transducer outer enclosure structure.Be arranged in pressure transducer outer enclosure structure, the integrated circuit (IC) chip 5 that pressure sensor chip 3 on substrate 1 and corresponding pressure sensor chip 3 are arranged, be electrically connected by the mode of metal lead wire 4 by routing between pressure sensor chip 3 and integrated circuit (IC) chip 5, substrate 1 is provided with pad, pressure sensor inside chip is electrically connected with external electronic circuits by pad, when pressure transducer works, pressure sensor chip 3 gathers external pressure to be changed and is converted into electric signal, the signal that pressure sensor chip 3 gathers by integrated circuit (IC) chip 5 carries out rough handling and is passed to external electronic circuits through described pad.
In order to ensure that pressure transducer normally works, pressure transducer is provided with the bleeder vent being communicated with pressure transducer inside and outside.As shown in Figure 6, bleeder vent 6 is arranged on framework 2a, the bleeder vent 6 be arranged on framework 2a is positioned at the side end face of pressure transducer outer enclosure structure, assemble at the present embodiment pressure transducer, in use procedure, exterior terminal need not arrange cavity at pressure transducer top, reduce exterior terminal thickness, increase pressure transducer and use flexibility ratio, simultaneously, in assembling use procedure, the bleeder vent being arranged at side can avoid external air flow or light to directly act on pressure sensor chip, avoid the therefore pressure transducer errors produced, improve pressure transducer performance.
In actual production manufacture process, bleeder vent 6 also can be arranged on top board 2b or substrate 1: when bleeder vent 6 is arranged on top board 2b, top board 2b and framework 2a binding site are provided with the groove expecting to be formed, and described groove is communicated with pressure transducer inside and outside, and this groove forms bleeder vent; When bleeder vent 6 is arranged on substrate 1, substrate 1 and framework 2a binding site are provided with the groove expecting to be formed, and this groove is communicated with pressure transducer inside and outside, and this groove forms bleeder vent.The bleeder vent of these two kinds designs is all positioned at the side end of pressure transducer, is the imbody of the utility model pressure sensor design thinking, can realizes the utility model pressure transducer advantage, belong to the utility model pressure transducer claims.
The utility model pressure transducer, bleeder vent is arranged at pressure transducer outer enclosure structure side end face, in pressure transducer assembling use procedure, end product need not at pressure transducer top design cavity, reduce end product thickness, increase pressure transducer and use flexibility ratio, simultaneously, in assembling use procedure, the bleeder vent being arranged at encapsulating structure side can avoid external air flow or light to directly act on pressure sensor chip, avoid the therefore pressure transducer errors produced, improve pressure transducer performance.Therefore, the utility model pressure sensing appliance has performance good, is conducive to the advantage of Miniaturization Design.
These are only the utility model case study on implementation, be not limited to the utility model, as long as those of ordinary skill in the art modify or change according to the equivalence that the utility model institute disclosure is done, all should include in the protection domain recorded in claims.
Claims (4)
1. a pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure and integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, it is characterized in that: described outer enclosure structure comprises substrate, the end face just right with described substrate and is connected the side of described substrate and described end face, and described bleeder vent is arranged at the side of described pressure transducer outer enclosure structure.
2. pressure transducer according to claim 1, is characterized in that: described side and described end face are wholely set, and described side is provided with cambered surface near described top side location, and described side is connected with described end face by described cambered surface; Described bleeder vent is arranged in described cambered surface.
3. a pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure and integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, it is characterized in that: described outer enclosure structure comprises substrate, the end face just right with described substrate and be connected the side of described substrate and described end face, described substrate and described lateral junction co-bit install the groove being equipped with and expecting to be formed, described groove is communicated with described pressure transducer inside and outside, described substrate recess and described side-fit form described bleeder vent.
4. a pressure transducer, comprise outer enclosure structure, be arranged at the pressure sensor chip in described outer enclosure structure and integrated circuit (IC) chip, and bleeder vent, described bleeder vent is communicated with described pressure transducer inside and outside, it is characterized in that: described outer enclosure structure comprises substrate, framework and top board, described substrate and described framework secure bond, described top board is fixedly installed on described framework away from described substrate one end; Described top board is provided with described framework binding site the ventilating groove expecting to be formed, and described ventilating groove is communicated with described pressure transducer inside and outside, and described top board ventilating groove coordinates with described framework and forms described bleeder vent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420218882.4U CN204286668U (en) | 2014-04-30 | 2014-04-30 | Pressure transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420218882.4U CN204286668U (en) | 2014-04-30 | 2014-04-30 | Pressure transducer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204286668U true CN204286668U (en) | 2015-04-22 |
Family
ID=52869817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420218882.4U Expired - Lifetime CN204286668U (en) | 2014-04-30 | 2014-04-30 | Pressure transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204286668U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105203233A (en) * | 2015-10-16 | 2015-12-30 | 瑞声声学科技(深圳)有限公司 | Mems pressure sensor |
| CN110926688A (en) * | 2019-11-21 | 2020-03-27 | 歌尔股份有限公司 | Air pressure detection method and system |
| CN112366187A (en) * | 2020-11-19 | 2021-02-12 | 航天科工微电子系统研究院有限公司 | Millimeter wave chip cavity packaging structure and packaging method |
-
2014
- 2014-04-30 CN CN201420218882.4U patent/CN204286668U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105203233A (en) * | 2015-10-16 | 2015-12-30 | 瑞声声学科技(深圳)有限公司 | Mems pressure sensor |
| CN110926688A (en) * | 2019-11-21 | 2020-03-27 | 歌尔股份有限公司 | Air pressure detection method and system |
| CN112366187A (en) * | 2020-11-19 | 2021-02-12 | 航天科工微电子系统研究院有限公司 | Millimeter wave chip cavity packaging structure and packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9073747B2 (en) | MEMS microphone and electronic equipment having the MEMS microphone | |
| CN103968972A (en) | Pressure sensor | |
| CN204286668U (en) | Pressure transducer | |
| CN204007955U (en) | Pressure transducer | |
| CN204007944U (en) | Micro-electro-mechanical sensors | |
| CN103957498A (en) | Side-sound-input silicon microphone packaging structure | |
| CN203848956U (en) | Pressure sensor | |
| CN203845811U (en) | Multifunctional sensor | |
| CN209017323U (en) | Combination sensor | |
| CN203881481U (en) | Pressure sensor | |
| CN106716095A (en) | Pressure sensor module | |
| CN204115948U (en) | Pressure transducer | |
| CN209161474U (en) | Combination sensor | |
| CN204681598U (en) | A kind of encapsulating structure of MEMS microphone | |
| CN203933950U (en) | The one sound MEMS microphone that advances | |
| CN202799143U (en) | Micro-electromechanical systems (MEMS) microphone | |
| CN202651105U (en) | Surface-mount-type bridge-type lead frame | |
| CN203848973U (en) | Pressure sensor | |
| CN209017319U (en) | Combination sensor | |
| CN206313996U (en) | A kind of MEMS microphone package | |
| CN203840542U (en) | Silicon microphone packaging structure for realizing sound incoming laterally | |
| CN102833659A (en) | MEMS (micro electro mechanical systems) microphone and manufacturing method thereof | |
| CN206313998U (en) | The encapsulating structure of the MEMS microphone based on asic chip | |
| CN103118489B (en) | A kind of sunk type Rigid Flex and manufacture method thereof | |
| CN104952856A (en) | Integrated circuit capable of realizing double-sided assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150422 |